JP2002098487A - Manufacturing method of heat pipe - Google Patents

Abstract

PROBLEM TO BE SOLVED: To manufacture a small-tube heat pipe having flexibility with proper yield. SOLUTION: The manufacturing method of the small-tube heat pipe is constituted of a laminating and connecting process 60, laminating a partitioning sheet 70, flow passage forming plates 71, 72, a front side plate 74 and a rear-side plate 75 to connect them, the rolling process 61 of a laminated and connected structural body 75, into which a flow passage is incorporated, a front and rear surfaces wire electrical discharge machining process 62 and a width wire electrical discharge machining process 63 for forming a belt type section 51 like as a flexible cable through wire electrical discharge machining, and a boring process 64 and an electrical discharge machining process 65, forming a semi-conductor element module mounting section 52 and a heat sink mounting section 53. Low rolling rate is sufficient, and therefore, the small-tube heat pipe can be manufactured with a proper yield.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a method for manufacturing a heat pipe, and more particularly, to a method for manufacturing a heat pipe having flexibility.

[0002]

2. Description of the Related Art Information equipment, mobile communication equipment, broadcast equipment,
In electronic devices such as mobile communication satellites and radars, a large number of semiconductor elements are concentrated and mounted to reduce the size, and the generated heat is generally led to the outside using a heat pipe. It is configured to radiate heat from the heat sink into the air. Here, with the miniaturization of electronic equipment, it may be necessary to provide a heat pipe that is not linear but is bent appropriately in the middle according to the structure of the electronic equipment.

[0003] There are two types of heat pipes with regard to the way of transporting heat. One is a phase change type heat pipe utilizing the latent heat of the working fluid. The other is that the narrow flow path is formed so as to draw a closed loop, the hydraulic fluid is vibrated by the generation and disappearance of bubbles in the flow path, and the hydraulic fluid moves so as to circulate in the flow path This is a thin tube heat pipe that utilizes

FIG. 1 shows a method for manufacturing a flexible thin tube heat pipe devised earlier by the present inventors. FIG.
(D) and (E) show the manufactured flexible tubular heat pipe 1. The thin tube heat pipe 1 is manufactured through a laminating / joining step 20 and a rolling step 30.

In the laminating / joining step 20, as shown in FIG. 2, the flow path forming plates 3 and 4 are laminated on the upper and lower surfaces of the The front side plate 6 is laminated on the upper surface of the flow path forming plate 4 with the brazing material sheet 5 interposed therebetween, and the lower side plate 7 is laminated on the lower surface of the flow path forming plate 4 with the brazing material sheet 5 interposed therebetween. FIG. 1B shows a laminated joint structure 10, and FIG. 1C shows FIG. 1B.
The cross section along the line CC is shown in an enlarged manner. The flow passage 40 is formed inside the laminated joint structure 10. The partition plate 2, the flow path forming plates 3 and 4, the front side plate 6, and the back side plate 7 are all made of aluminum.

[0006] In the rolling step 30, the laminated joint structure 10 having the thickness t1 is rolled through rolling rolls to reduce the thickness to a predetermined thickness t2. By this rolling, the thin-tube heat pipe 1 shown in FIGS. 1D and 1E is manufactured. Reference numeral 41 denotes a flat channel.

[0007]

According to the manufacturing method described above, since the thickness is reduced to a predetermined thickness t1 only by rolling, it is necessary to increase the rolling ratio (t1 / t2). As a result, the degree of work hardening generated in the rolling process was large, and as a result, the flexibility of the thin tube heat pipe 1 was not good.

Further, as a result of increasing the rolling ratio (t1 / t2), the joining between the plates is affected, and in some cases, the front side plate 6 and the back side plate 7 are partially peeled off. .

As described above, according to the above-described manufacturing method, it is difficult to manufacture the thin-tube heat pipe 1 of good quality with a high yield.

Therefore, an object of the present invention is to provide a method for manufacturing a heat pipe that solves the above-mentioned problems.

[0011]

According to a first aspect of the present invention, there is provided a method of manufacturing a laminated joint structure in which a plurality of plates including a front plate and a back plate are laminated and joined to form a flow passage therein. And rolling the laminated joint structure, and after the rolling, removing the surface portions of the front plate and the back plate to make the front plate and the back plate thinner.

[0012] In order to reduce the thickness of the front and back plates by removing the surface portions of the front and back plates after rolling,
It is possible to set a small rolling ratio in the rolling process. When the rolling ratio is reduced, peeling of the front side plate and the back side plate hardly occurs.

According to a second aspect of the present invention, in the method for manufacturing a heat pipe of the first aspect, the thinning step is performed except for portions at both ends of the entire length of the heat pipe.

The entire length of the heat pipe at both ends remains thick, becomes a rigid plate, and is easy to handle when used as a heat receiving portion and a heat radiating portion. The heat receiving portion and the heat radiating portion that are easy to handle can be relatively formed by the process of thinning.

A third aspect of the present invention is a method of manufacturing a laminated joint structure having a flow path formed therein by laminating and joining a plurality of plates including a front plate and a back plate, and the laminated joint structure. Rolling, and after rolling, excluding the end portions of the entire length of the heat pipe, removing the surface portion of the front side plate and the back side plate to make the front side plate and the back side plate thin, And removing the both sides in the width direction of the set portion to reduce the width.

The step of reducing the thickness and the step of narrowing the width favorably form a thin and narrow band.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS First Embodiment FIGS. 3 to 5 show a method for manufacturing a flexible thin tube heat pipe according to a first embodiment of the present invention. FIGS. 5 (D) and 6 (A) to 6 (D) show the manufactured flexible heat pipe 50 having flexibility. The thin tube heat pipe 50 is manufactured through a laminating / joining step 60, a rolling step 61, a front and back wire electric discharge machining step 62, a width wire electric discharge machining step 63, a hole making step 64, and an electric discharge machining step 65.

As shown in FIGS. 5 (D) and 6 (A) to 6 (C), the thin tubular heat pipe 50 has a flexibility like a flexible cable having a thickness t51 and a width w51. A part 51, a semiconductor element module mounting part 52 whose thickness is t52 and is thicker than the band part 51 on one end side of the band part 51, and a semiconductor element module mounting part 52 on the other end side of the band part 51;
A heat sink mounting portion 53 having a thickness t53 and a thickness greater than the band portion 51, and a narrow flow path 54 formed therein so as to form a closed loop, and the working fluid is decompressed in the flow path 54 It is a configuration enclosed with. The thin tube heat pipe 50 has a rigid semiconductor device module mounting portion 52 having a rigidity as a heat receiving portion on one end side of a flexible band portion 51 and a rectangular shape having the same rigidity as a heat radiating portion on the other end side. This is a configuration having a heat sink mounting portion 53 having a shape.

Next, a method of manufacturing the thin tube heat pipe 50 having the above structure will be described for each step.

First, a laminating / joining step 60 is performed. In the laminating / joining step 60, as shown in FIG. 7, aluminum channel forming plates 71, 72 are laminated on the upper and lower surfaces of an aluminum partitioning plate 70 via a brazing material sheet 73. An aluminum front side plate 74 is laminated on the upper surface of the path forming plate 71 via a brazing material sheet 73, and an aluminum back side plate 75 is laminated on the lower surface of the flow path forming plate 72 via a brazing material sheet 73. , Pressurized and heated in a hot vacuum furnace or an inert gas furnace and joined by the brazing sheet 73,
The laminated joint structure 76 shown in FIG. 3B is manufactured. FIG.
FIG. 3A is an enlarged cross-sectional view taken along line AA in FIG. The laminated joint structure 76 has a thickness of t76, and has a closed-loop flow path 77 formed therein.

As shown in FIG. 6, the flow path forming plates 71, 72
Have zigzag slits 71a and 72a formed by wire electric discharge machining or the like, respectively.
Is further provided with a working fluid inlet 71b. The upper and lower sides of the slit 71a are covered with the partition plate 70 and the front side plate 74 to form an upper channel 77u.
The upper side and the lower side of b are covered with the partition plate 70 and the back side plate 75 to form a lower flow path 77l. Upper channel 7
7u and the lower flow path 77l are connected by upper and lower flow path conducting holes 70a and 70b of the partition plate 70, and a closed loop flow path 77 is formed.

The following dimensions are all examples. The thickness t70 of the partition plate 70 is 1 mm, the thicknesses t71 and t72 of the flow path forming plates 71 and 72 are 1 mm, and the thickness t74 of the front plate 74.
Is 3 mm, and the thickness t75 of the back side plate 75 is 3 mm. That is, the thickness t74 of the front plate 74 and the thickness t7 of the back plate 75
5 is the thickness t70 of the partition plate 70 and the flow path forming plate 7
Thicknesses t71 and t72 of 1,72 are thicker. Front side plate 74
The back plate 75 is thicker than the front plate 6 and the back plate 7 in FIG. The reason that the front plate 74 and the back plate 75 are thicker is that
This is because the surfaces of the front plate and the back plate are shaved to be thin. The thickness t76 of the laminated joint structure 76 is 9 mm.

The thicknesses t71, t7 of the flow path forming plates 71, 72
The reason why 2 is 1 mm, which is not thinner than that, is that if it is thinner, the brazing material sheet 73 may fill the slits 71a and 71b and the flow paths 77u and 77d may be partially clogged.

Here, the above-mentioned lamination is performed by forming a flow path forming plate 72, a partition plate 70, a flow path forming plate 71 on the upper surface of the back side plate 75.
This is performed by aligning the front side plates 74 and sequentially stacking them. Here, the rear side plate 75 which is thick enough not to be bent
A pair of corner portions are provided with a positioning contact portion 75a shown in FIG. 8A or a positioning pin portion 75b shown in FIG. 8B, and the flow path forming plate 72 and the partition plate 7 are formed.
0, the flow path forming plate 71 is positioned using this.

Next, a rolling step 61 is performed. This rolling process 6
1, the laminated joint structure 76 having the thickness t76
Is rolled through a rolling roll to a predetermined thickness t80.
To obtain a rolled structure 80 shown in FIG. 3 (C).

As shown in FIG. 4B, the partition plate 70 is thinned to have a thickness of t70A (= 0.3 mm) to become the partition plate 70A, and the flow path forming plates 71 and 72 are thinned and have a thickness of 70%. The flow path forming plates 71A and 72hA are set as t71A and t72A (= 0.3 mm), and the back plate 75 is thinned and has a thickness of t75A (= 1.5 mm) and the back plate 75A.
The front side plate 74 is thinned and has a thickness of t74A (= 1.
5 mm) to form the front side plate 74A. The thickness t80 of the rolled laminated structure 80 is 3.9 mm.

The upper flow path 77u and the lower flow path 77l have a flat cross section, and the upper flow path 77uA and the lower flow path 77l.
1A, and the flow path 77 becomes the final flow path 54.

Here, the rolling ratio (t) in the rolling process 61
80 / t76) is the rolling ratio (t1 / t2) in FIG.
It is smaller and the front plate 74A and the back plate 75A are sufficiently thick. Therefore, even after rolling, the front side plate 74
A and the back side plate 75A are maintained in a state of being stably joined to the flow path forming plates 71A and 72hA.

The reason why the rolling ratio could be reduced is that the thickness t74 of the front plate 74 and the thickness t75 of the back plate 75 are the thickness t70 of the partition plate 70 and the thickness t70 of the flow path forming plates 71 and 72. This is because it is thicker than t71 and t72.
In addition, the reason why the rolling ratio is small is sufficient because the wire electric discharge machining process 62 for front and back surfaces is to be performed next.

The rolling step 61 is performed in order to form a flow path 54 having a predetermined thickness and not filled with the brazing material.

Next, a front and back wire electric discharge machining step 62 is performed. In this front and back wire electric discharge machining process 62, FIG.
As shown in (D), the front side plate 74 of the rolled structure 80
A portion of the surface 74Aa of A excluding portions at both ends in the longitudinal direction of X1-X2 is melted by wire electric discharge machining to be about 1 mm.
The portion of the surface 75Aa of the back side plate 75A except for the portions on both ends in the longitudinal direction of X1-X2 is melted by wire electric discharge machining and removed by about 1 mm to reduce the thickness. As a result, the front plate 74A becomes the front plate 74B, the back plate 75A becomes the back plate 75B, and the front and back wire electric discharge machined structure 90 is obtained. Here, the reason why the wire electric discharge machining is employed is that the machining distortion is small.

As shown in FIG. 4C, the front side plate 74B
Is that the thickness t74B of the part excluding the parts on both ends is 0.4
mm. Similarly, the thickness t75B of the back side plate 75B except for the portions on both ends is 0.4 mm. The front and back wire electric discharge machined structure 90 has a thin thickness t90 of 1.7 mm. The thickness t90 is the thickness t51 in FIG.
Is equal to Here, the wire electric discharge machining is performed without causing any work hardening, and no work hardening has occurred on the front side plate 74B and the back side plate 75B. Therefore, the front plate 74B and the back plate 75B are maintained in a state of being stably joined to the flow path forming plates 71A and 72A.

The front and back wire electric discharge machined structure 90 is
Since the thickness t90 is as thin as 1.7 mm, and the front side plate 74
B and the back plate 75B have no work hardening,
It has good flexibility.

The front and back wire electric discharge machined structure 9
0 has a rectangular end portion 91 having a thickness of t80 (= 3.9 mm) on the X2 direction end side as shown in FIGS. 3D and 4D, and has an X1 direction end. On the side, there is an end portion 92 which is rectangular with a thickness of t80. The thickness t80 is equal to the thicknesses t52 and t53 in FIG. This end portion 91, 9
Numeral 2 is a rectangular hard plate-shaped body which is easy to handle and can be used for mounting components and attaching to a chassis or the like.
The thick end portions 91 and 92 are relatively formed by limiting the range in which wire electric discharge machining is performed.

Instead of the wire electric discharge machining, laser machining or chemical etching may be used. In addition, the process of thinning the front side plate and the back side plate is not limited to electric discharge machining, but may be performed by cutting such as milling depending on the degree of the influence of machining distortion.

Next, a width wire electric discharge machining process 63 is performed. In the width wire electric discharge machining step 63, as shown in FIG. 5B, both sides in the width direction of Y1-Y2 of the front and back surface wire electric discharge machined structure 90 except for both end portions are subjected to wire electric discharge machining. Several meters so that it does not melt in
m is removed, and the width is reduced from w90 to w100 to obtain the width wire electric discharge machining structure 100. The width w90 is shown in FIG.
(A) It is equal to the width w51 in the middle. Due to the reduced width, the flexibility is further improved. Instead of the wire electric discharge machining, laser machining or chemical etching may be used. In addition, depending on the degree of the influence of the processing distortion, it is also possible to perform the cutting by milling or the like.

Next, a hole making step 64 is performed. In the hole making step 64, as shown in FIG. 5C, as shown in FIG. 5C, through-holes 111 are formed in the respective corners of the rectangular portion 91 on the X2 direction end side of the structure 100 after the width wire electric discharge machining. , A rectangular portion 112 is formed, and a through-hole 113 is formed in each corner of the rectangular portion 92 on the end side in the X1 direction to form a heat sink mounting portion 53.
Get 10.

Finally, an electric discharge machining step 65 is performed. In the electric discharge machining step 65, the upper surface of the rectangular portion 112 of the perforated structure 110 is melted and dug to form a shallow recess 115, thereby forming the semiconductor element module mounting portion 52. This electric discharge machining is also formed without causing work hardening.

A working fluid inlet 116 is attached to the side surface of the heat sink mounting portion 53, the working fluid is injected into the flow passage 54, and the inside of the flow passage 54 is decompressed. I do.

As described above, the thin tube heat pipe 50 shown in FIGS. 5D and 6A to 6D is manufactured. The thin tube heat pipe 50 includes a front side plate 74B and a back side plate 7B.
In a state where 5B is stably joined to the flow path forming plates 71A and 72A, it is manufactured with high yield.

As shown in FIG. 9, a plurality of the thin tube heat pipes 50 are used, for example, in a final output stage of a phased array antenna device of a radar. The semiconductor element module 120 is mounted on the semiconductor element module mounting section 52, a plurality of semiconductor element module mounting sections 52 on which the semiconductor element module 120 is mounted are stacked, and the uppermost semiconductor element module mounting section 52 is shielded. A plurality of semiconductor element module mounting portions 52 covered with a cap 121 and stacked are fixed to a chassis 123 by screws 122. The strip-shaped portion 51 of each thin tube heat pipe 50 is appropriately bent,
The heat sink mounting portions 53 on the distal end side are arranged side by side, and a heat sink 125 is mounted on each heat sink mounting portion 53. The belt-shaped portion 51 is freely bent as appropriate, and the thin-tube heat pipe 50 has good mountability.

The heat generated in the semiconductor element module 120 causes the working fluid to vibrate due to the generation and disappearance of bubbles in the flow path in the belt portion 51, and moves so that the working liquid circulates in the flow path 54. As a result, the heat is transferred from the heat sink 125 to the air.

Second Embodiment FIGS. 10 to 12 show a method of manufacturing a flexible phase change heat pipe according to a second embodiment of the present invention. FIG. 12 (D), FIG.
(A) to (D) show the manufactured phase change heat pipe 150 having flexibility. The phase change type heat pipe 150 includes a laminating / joining step 160, a rolling step 161, a front and back wire electric discharge machining step 162, a width wire electric discharge machining step 163, a drilling step 164, a discharge It is manufactured through a processing step 165.

In each of the drawings, parts corresponding to the constituent parts shown in FIGS. 3 to 7 are denoted by reference numerals obtained by adding 100.

The phase change type heat pipe 50 is shown in FIG.
(D) As shown in FIGS. 13A to 13E, a flexible belt-like portion 151 such as a flexible cable having a thickness t151 and a width w151, and one end of the belt-like portion 151 are provided. A semiconductor element module mounting portion 152 having a thickness t152 and being thicker than the belt portion 151;
A heat sink mounting portion 153 having a thickness of t153 and a thickness greater than that of the band portion 151 is provided on the other end side of the band portion 151, and a flow path 300 is formed inside and extends in the longitudinal direction. In this configuration, the hydraulic fluid is sealed in the passage 300 in a reduced pressure state. The flow path 300 is located at the center flow path 3
02 and the wicks 301 on both sides along it. The phase conversion type heat pipe 50 has a configuration in which a semiconductor element module mounting portion 152 as a heat receiving portion is provided on one end side of a flexible strip portion 151 and a heat sink mounting portion 153 as a heat radiating portion is provided on the other end side. .

Next, a method of manufacturing the phase change type heat pipe 150 having the above structure will be described for each step.

First, a laminating / joining step 160 is performed. In the laminating / joining step 160, as shown in FIG. 14, aluminum channel forming plates 171 and 172 are laminated on the upper and lower surfaces of the aluminum channel forming plate 170 via the brazing material sheet 173. An aluminum front side plate 174 is laminated on the upper surface of the flow path forming plate 171 via the brazing material sheet 173, and an aluminum back side plate 175 is laminated on the lower surface of the flow path forming plate 172 via the brazing material sheet 173. The layers are laminated, pressurized and heated in a thermal vacuum furnace or an inert gas furnace, and joined by the brazing material sheet 173 to produce a laminated joint structure 176 shown in FIG. FIG. 11 (A) shows FIG.
0 (B) shows an enlarged cross section along the line AA. The laminated joint structure 176 has a thickness of t176, and includes therein:
The channel 310 is formed.

The following dimensions are all examples. The thickness t170 of the convex wick forming plate 170 is 1 mm, the thicknesses t171 and t172 of the flow passage forming plates 171 and 172 are 1 mm,
The thickness t174 of the front plate 174 is 3 mm, and the thickness t175 of the back plate 175 is 3 mm. That is, the thickness t174 of the front plate 174 and the thickness t175 of the back plate 175 are determined by the thickness t170 of the partition plate 170 and the flow path forming plates 171 and 17.
2 are thicker than the thicknesses t171 and t172. Front side plate 174
The back plate 175 is thicker than the front plate 6 and the back plate 7 in FIG. The front plate 174 and the back plate 175 are thicker.
This is because the surfaces of the front side plate and the back side plate are later shaved and thinned. The thickness t76 of the laminated joint structure 76 is 9 mm.

Next, a rolling step 161 is performed. In the rolling step 61, the laminated structure 17 having the thickness t176
6 is passed through a rolling roll and rolled to a predetermined thickness t1.
It is thinly extended to 80 to obtain a rolled structure 180 shown in FIG.

As shown in FIG. 11B, the flow path forming plate 1
70 is thinned to have a thickness of t170A (= 0.3 mm) to become the flow path forming plate 170A, and the flow path forming plates 171, 1
72 is thinned and has a thickness of t171A, t172A (= 0.
3 mm) to form the flow path forming plates 171A and 172hA. The back side plate 175 is thin and has a thickness of t175A (= 1.
5 mm) to form the back side plate 175A, and the front side plate 174.
Is thinned and the thickness is set to t174A (= 1.5 mm) to form the front side plate 174A. The thickness t180 of the rolled laminated structure 180 is 3.9 mm.

The flow channel 310 is flattened and becomes the final flow channel 300. That is, the flow path portion 301 through which the vaporized gas passes is formed in the center, and the wick 302 on which the liquefied hydraulic fluid moves by capillary action is formed on both sides along the flow path portion 301. The flow path forming plates 170, 171, and 172 are connected to the flow path portion 301.
To form As for the wick 302, the flow path forming plates 171 and 172 form the bottom of the groove, and the flow path forming plate 170
Form the crest of the groove.

Here, the rolling ratio (t180 / t176) in the rolling step 161 is the rolling ratio (t1 / t1) in FIG.
/ T2), the front side plate 174A and the back side plate 175
A is sufficiently thick and is kept in a state of being stably joined to the flow path forming plates 171A and 172hA. The reason why the rolling ratio is small is sufficient because the wire electric discharge machining process 162 for the front and back surfaces is to be performed next. Note that the rolling step 161 is mainly performed to form the channel 310.

Next, a front and back wire electric discharge machining process 162 is performed. In this front and back wire electric discharge machining process 162, FIG.
As shown in FIG. 11 (D) and FIG. 11 (C), X1-X of the surface 174Aa of the front side plate 174A of the rolled structure 180 is used.
2 was removed by wire electrical discharge machining except for the portions at both ends in the longitudinal direction to remove about 1 mm to make it thinner.
A portion of the surface 175Aa of the 75A excluding the portions on both ends in the longitudinal direction of X1-X2 is melted by wire electric discharge machining and removed by about 1 mm to reduce the thickness. Thereby, the front side plate 174
A is the front plate 174B, and the back plate 175A is the back plate 1
75B, the front and back wire electric discharge machined structure 190
Is obtained. Here, the reason why wire electric discharge machining was adopted
This is because the processing distortion is small.

As shown in FIGS. 11C and 11D, the front side plate 174B has a thickness t17 of a portion excluding both end portions.
4B is set to 0.4 mm. Similarly, back side plate 175B
Has a thickness t175B of 0.
4 mm. Front and back wire electric discharge machined structure 19
0 indicates that the thickness t190 is as thin as 1.7 mm. Thickness t190
Is equal to the thickness t151 in FIG. Here, the wire electric discharge machining is performed without causing the work hardening, and the front side plate 17 is formed.
No work hardening has occurred in 4B and the back side plate 175B.
Therefore, the front plate 174B and the back plate 175B are maintained in a state of being stably joined to the flow path forming plates 171A and 172A.

Front and Back Wire EDM Structure 190
Has good flexibility because the thickness t190 is as thin as 1.7 mm and no work hardening occurs on the front plate 174B and the back plate 175B.

The front and back wire electric discharge machined structure 1
As shown in FIGS. 11C and 11D, 90 has a rectangular end portion 191 having a thickness of t180 (= 3.9 mm) on the X2 direction end side, and has the X1 direction end side on the X1 direction end side. , The thickness is t18
It has an end portion 192 that is rectangular at zero. Thickness t180
Is equal to the thicknesses t152 and t153 in FIG. The end portions 191 and 192 are rectangular hard plate-like bodies,
It is easy to handle and can be used for mounting components and attaching to a chassis or the like. Also, the thick end portions 191 and 19
2 is relatively formed by limiting the range in which wire electric discharge machining is performed.

In place of the wire electric discharge machining, laser machining or chemical etching may be used. In addition, depending on the degree of the influence of the processing distortion, it is also possible to perform the cutting by milling or the like.

Next, a width wire electric discharge machining process 163 is performed.
In this width wire electric discharge machining step 163, as shown in FIG. 12B, both sides in the width direction Y1-Y2 of the front and back surface wire electric discharge machined structures 190 except for both end portions are subjected to wire electric discharge machining. Is removed by several mm so as not to cover the flow path 300, and the width is reduced from w190 to w200 to obtain the width wire electric discharge machining structure 200. Width w1
90 is equal to the width w151 in FIG. Due to the reduced width, the flexibility is further improved. Instead of the wire electric discharge machining, laser machining or chemical etching may be used. In addition, depending on the degree of the influence of the processing distortion, it is also possible to perform the cutting by milling or the like.

Next, a hole making step 164 is performed. In the hole making step 164, as shown in FIG.
A through hole 211 is formed at each corner of the rectangular portion 191 on the side of the direction.
Is formed to form a rectangular portion 212, and a through hole 213 is formed at each corner of the rectangular portion 192 on the end side in the X1 direction, a heat sink mounting portion 153 is formed, and the perforated structure 210 is formed. Get.

Finally, an electric discharge machining step 165 is performed. In this electric discharge machining process 165, the upper surface of the rectangular portion 212 of the perforated structure 210 is melted and dug to form the shallow concave portion 21.
5 is formed to form the semiconductor element module mounting portion 252. This electric discharge machining is also formed without causing work hardening.

Further, a working fluid introduction port is attached to the side surface of the heat sink mounting portion 153, the working fluid is injected into the flow path 300, and the inside of the flow path 300 is depressurized, and the working fluid introduction port is sealed.

As described above, FIG.
(A) to (D) are manufactured. In this phase change heat pipe 150, the front plate 174B and the back plate 175B are formed by the flow path forming plate 171A,
172A is manufactured with a good yield in a state of being stably bonded. In addition, this phase change type heat pipe 150
As shown in FIG. 8, the belt-like portion 151 is used by being appropriately bent and installed.

In each of the above embodiments, the last electric discharge machining steps 65 and 165 may not be required. In this case, the perforated structures 110 and 210 shown in FIG. 5C and FIG.
For example, semiconductor element modules are mounted and used on 12, 212.

[0064]

As described above, according to the first aspect of the present invention, a plurality of plates including a front plate and a back plate are laminated and joined to produce a laminated joint structure having a flow path formed therein. Step, the step of rolling the laminated joint structure, and, after rolling, a step of removing the surface portion of the front plate and the back plate to make the front plate and the back plate thinner, and after rolling, Since the method includes the step of removing the surface portions of the front side plate and the back side plate to reduce the thickness of the front side plate and the back side plate, it is possible to set a small rolling ratio in the rolling step. When the rolling ratio is reduced, peeling of the front side plate and the back side plate hardly occurs.
Therefore, a heat pipe having flexibility and high reliability can be stably manufactured with high yield. In order to reduce the rolling ratio, at least one of the front side plate and the back side plate is thicker than a plate sandwiched therebetween to form a flow path and the like. Further, the step of thinning the front side plate and the back side plate is not limited to electric discharge machining with small machining distortion, but can also be performed by cutting such as milling depending on the degree of the influence of machining distortion.

According to a second aspect of the present invention, in the method for manufacturing a heat pipe of the first aspect, the thinning step is performed except for portions at both ends of the entire length of the heat pipe. Portions at both ends of the entire length of the heat pipe remain thick, and a rigid plate-shaped heat-receiving portion and a heat-radiating portion which are easy to handle can be relatively formed by a process of thinning. That is, a heat pipe having flexibility and being easy to handle can be easily manufactured.

The invention according to claim 3 is a step of manufacturing a laminated joint structure having a flow path formed therein by laminating and joining a plurality of plates including a front plate and a back plate, and the laminated joint structure. Rolling, and after rolling, excluding the end portions of the entire length of the heat pipe, removing the surface portion of the front side plate and the back side plate to make the front side plate and the back side plate thin, And a step of narrowing the width by removing both sides in the width direction of the set portion, so that a thin and narrow band-shaped portion is favorably formed by the step of thinning and the step of narrowing the width. It is possible to manufacture a heat pipe having good flexibility and being easy to handle. In order to reduce the rolling ratio, at least one of the front side plate and the back side plate is thicker than a plate sandwiched therebetween to form a flow path and the like. Further, the step of thinning the front side plate and the back side plate is not limited to electric discharge machining with small machining distortion, but can also be performed by cutting such as milling depending on the degree of the influence of machining distortion.

[Brief description of the drawings]

FIG. 1 is a diagram for explaining a method of manufacturing a flexible heat pipe previously devised by the present inventors.

FIG. 2 is an exploded view of the laminated joint structure of FIG. 1 (B).

FIG. 3 is a diagram illustrating a method for manufacturing a thin tube heat pipe according to the first embodiment of the present invention.

FIG. 4 is an enlarged sectional view of the structure shown in FIGS. 3 (B), 3 (C) and 3 (D).

FIG. 5 is a diagram illustrating a manufacturing method following FIG. 3;

FIG. 6 is a view showing a thin tube heat pipe manufactured by the manufacturing method shown in FIGS. 3 to 5;

FIG. 7 is an exploded view of the laminated joint structure of FIG. 3 (B).

FIG. 8 is a view showing a corner portion of a back side plate.

FIG. 9 is a view showing an example of a usage mode of the thin tube heat pipe of FIG. 6;

FIG. 10 is a diagram illustrating a method of manufacturing a phase change heat pipe according to a second embodiment of the present invention.

FIG. 11 is an enlarged sectional view of the structure shown in FIGS. 10 (B), (C) and (D).

FIG. 12 is a diagram illustrating a manufacturing method following FIG. 10;

FIG. 13 is a view showing a phase change type heat pipe manufactured by the manufacturing method shown in FIGS. 10 to 12;

FIG. 14 is an exploded view of the laminated joint structure of FIG. 10 (B).

[Explanation of symbols]

 Reference Signs List 50 thin tube heat pipe 51, 151 strip-shaped portion 52, 152 semiconductor element module mounting portion 53, 153 heat sink mounting portion 54 closed loop-shaped thin flow channel 60, 160 lamination / joining process 61, 161 rolling process 62, 162 front and back surface wire electric discharge machining Step 63, 163 width wire electric discharge machining step 64, 164 hole drilling step 65, 165 electric discharge machining step 300 channel 301 wick 302 channel section

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Kenji Sekiya 2-149 Numame, Isehara-shi, Kanagawa Japan

Claims (3)

[Claims] A step of stacking and joining a plurality of plates including a front plate and a back plate to produce a laminated joint structure having a flow path formed therein; and rolling the laminate joint structure. And a step of removing the surface portions of the front side plate and the back side plate after the rolling to reduce the thickness of the front side plate and the back side plate. 2. The method of manufacturing a heat pipe according to claim 1, wherein the step of reducing the thickness of the heat pipe is performed excluding portions at both ends of the entire length of the heat pipe. . 3. A step of laminating and joining a plurality of plates including a front plate and a back plate to form a laminated joint structure having a flow path formed therein, and rolling the laminated joint structure. Removing the surface portions of the front side plate and the back side plate by thinning the front side plate and the back side plate except for both end portions of the entire length of the heat pipe after rolling, and thinning the front side plate and the back side plate; Removing both sides in the direction to reduce the width.