CN215261347U - Temperature equalizing plate - Google Patents
Temperature equalizing plate Download PDFInfo
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- CN215261347U CN215261347U CN202121582384.4U CN202121582384U CN215261347U CN 215261347 U CN215261347 U CN 215261347U CN 202121582384 U CN202121582384 U CN 202121582384U CN 215261347 U CN215261347 U CN 215261347U
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Abstract
The utility model belongs to the technical field of the heat dissipation, a temperature-uniforming plate is disclosed. The temperature-uniforming plate comprises a bottom plate, a cover plate, a capillary layer and supporting columns, wherein the bottom plate and/or the cover plate comprises a copper layer and a steel layer located on the outer side of the copper layer, the bottom plate and the cover plate are buckled with each other to form a cavity, the capillary layer is attached to the bottom plate and/or the cover plate, the supporting columns are supported between the bottom plate and the cover plate, the cavity between the bottom plate and the cover plate forms a steam channel, and the heat dissipation process of the temperature-uniforming plate is circularly carried out in the cavity. With steel layer and copper layer punching press formation bottom plate and/or apron, can avoid steel electro-coppering to cause the pollution to the environment, regard the copper layer as the inlayer of temperature-uniforming plate, can avoid the material in pure water and the steel to react and generate non-condensable gas, simultaneously, the steel is lighter and intensity is good than copper, the bottom plate and/or the apron that steel layer and copper layer punching press formed have higher intensity and lightweight more, can reduce the thickness of temperature-uniforming plate bottom plate and/or apron simultaneously, satisfy the user and miniaturize the temperature-uniforming plate, lightweight demand.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a temperature-uniforming plate.
Background
In electronic products such as notebook computers, tablet terminals, smart phones, and the like, the temperature-uniforming plate attracts attention as a part for dissipating heat generated by a CPU and the like. The temperature equalizing plate can transfer heat through evaporation and condensation circulation of working fluid sealed in the cavity. In the prior art, the upper cover and the bottom plate of the temperature-uniforming plate are made of copper plates or copper alloy plates, but with the development of miniaturization and light weight of mobile equipment, the requirement for light weight of the temperature-uniforming plate is higher and higher, but if the thickness of the upper cover and the bottom plate of the temperature-uniforming plate is reduced, the strength of the temperature-uniforming plate is reduced, and the copper alloy are softened at high temperature, so that the technical problem to be solved is how to improve the strength of the temperature-uniforming plate and reduce the thickness of the upper cover and the bottom plate of the temperature-uniforming plate.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a temperature-uniforming plate can effectively improve the intensity of temperature-uniforming plate and reduce its thickness.
To achieve the purpose, the utility model adopts the following technical proposal:
a temperature-uniforming plate, which comprises a bottom plate, a cover plate, a capillary layer and supporting columns,
at least one of the cover plate and the bottom plate comprises a copper layer and a steel layer positioned on the outer side of the copper layer, the bottom plate and the cover plate are buckled to form a cavity, the capillary layer is attached to the bottom plate and/or the cover plate, and the supporting column is supported between the bottom plate and the cover plate.
Preferably, the copper layer and the steel layer are integrally formed by stamping.
Preferably, the base plate and/or the cover plate are stamped to form a recess, the recess being part of the chamber.
Preferably, the bottom plate or the cover plate is provided with a liquid injection port, and the liquid injection port is communicated with the chamber.
Preferably, the bottom plate and the cover plate are both provided with grooves with semicircular cross sections, the two grooves are buckled to form a liquid injection port, and the liquid injection port is communicated with the chamber.
Preferably, the thickness of the base plate and/or the cover plate is greater than or equal to 0.15mm, and the thickness of the copper layer is greater than 0.02 mm.
Preferably, the capillary layer is arranged on the inner side of the cover plate, one end of the supporting column penetrates through the capillary layer to be connected with the cover plate, and the other end of the supporting column is connected with the bottom plate;
or the capillary layer is arranged on the inner side of the cover plate, one end of the supporting column is connected with the capillary layer, and the other end of the supporting column is connected with the bottom plate;
or the capillary layer is arranged on the inner side of the bottom plate, one end of the supporting column penetrates through the capillary layer to be connected with the bottom plate, and the other end of the supporting column is connected with the cover plate;
or the capillary layer is arranged on the inner side of the bottom plate, one end of the supporting column is connected with the capillary layer, and the other end of the supporting column is connected with the cover plate;
or the inner sides of the bottom plate and the cover plate are both provided with the capillary layer, and two ends of the supporting column are connected with the capillary layer;
or the inner sides of the bottom plate and the cover plate are both provided with the capillary layer, one end of the supporting column penetrates through the capillary layer on the inner side of the cover plate to be connected with the cover plate, and the other end of the supporting column is connected with the capillary layer on the inner side of the bottom plate;
or the inner sides of the bottom plate and the cover plate are both provided with the capillary layer, one end of the supporting column penetrates through the capillary layer on the inner side of the bottom plate to be connected with the bottom plate, and the other end of the supporting column is connected with the capillary layer on the inner side of the cover plate;
or the bottom plate and the inner side of the cover plate are both provided with the capillary layer, and the supporting column simultaneously penetrates through the capillary layer on the inner side of the cover plate and the capillary layer on the inner side of the bottom plate to be connected with the bottom plate and the cover plate.
Preferably, the connection mode between the supporting columns and the bottom plate, between the supporting columns and the cover plate or between the supporting columns and the capillary layer is gluing, brazing, resistance welding, diffusion welding, ultrasonic welding, high-frequency welding or laser welding.
Preferably, the capillary layer is formed by adhering a copper net, copper fibers or foam copper on the copper layer in a spot welding or diffusion welding mode;
or the capillary layer is formed by sintering copper powder or copper paste into a porous layer;
or the capillary layer is formed by sintering a porous layer through copper paste and a copper net.
Preferably, a copper layer, a nickel layer or a zinc layer is further arranged outside the steel layer.
The utility model has the advantages that:
on one hand, the pure water reacts with the substances in the steel layer to generate non-condensable gas, and the copper layer does not react with the pure water, so that the copper layer and the steel layer are punched into a whole, and the copper layer is used as an inner layer, so that the generation of the non-condensable gas can be avoided; on the other hand, steel is lighter in weight and higher in strength than copper, and copper or copper alloy is softened after heat treatment, but steel is not easily softened, so that the base plate and the cover plate formed by the steel layer and the copper layer can effectively improve the strength of the vapor chamber plate and make the vapor chamber plate lighter than the base plate and the cover plate made of copper or copper alloy materials.
Drawings
FIG. 1 is a schematic structural view of the vapor chamber of the present invention;
FIG. 2 is a cross-sectional view of a first vapor chamber of the present invention;
FIG. 3 is a cross-sectional view of a second vapor chamber of the present invention;
FIG. 4 is a cross-sectional view of a third vapor chamber of the present invention;
fig. 5 is a sectional view of a fourth temperature equalization plate according to the present invention;
fig. 6 is a cross-sectional view of a fifth temperature equalization plate of the present invention.
In the figure:
1. a cover plate; 2. a base plate; 3. a capillary layer; 4. a support pillar; 5. a liquid injection port; 6. a steam channel; 7. a copper layer; 8. a steel layer.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings and examples. It is to be understood that the specific embodiments described herein are merely illustrative of the invention and are not limiting of the invention. It should be further noted that, for the convenience of description, only some of the structures related to the present invention are shown in the drawings, not all of the structures.
In the description of the present invention, unless expressly stated or limited otherwise, the terms "connected," "connected," and "fixed" are to be construed broadly, e.g., as meaning permanently connected, detachably connected, or integral to one another; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meaning of the above terms in the present invention can be understood in specific cases to those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description of the present embodiment, the terms "upper", "lower", "left", "right", and the like are used in the orientation or positional relationship shown in the drawings only for convenience of description and simplicity of operation, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the present invention. Furthermore, the terms "first" and "second" are used only for descriptive purposes and are not intended to have a special meaning.
In the prior art, the cover plate and the bottom plate of the uniform temperature plate are mostly made of copper plates and copper alloy plates, the copper plates are low in hardness, the uniform temperature plate made of copper alloy plates is more in order to improve the strength of the uniform temperature plate, but the copper plates and the copper alloy plates are softened at high temperature, the hardness is reduced, and the thickness of the uniform temperature plate is increased in order to improve the strength of the uniform temperature plate. The utility model discloses an embodiment provides an in the temperature equalization board, with integrated into one piece as the bottom plate and/or the apron of temperature equalization board after steel layer and the copper layer punching press, because steel material hardness is high, light in weight, ordinary temperature equalization board bottom plate and apron thickness are more than 0.2mm, the temperature equalization board of the same model, through regarding steel layer and copper layer stamping forming as bottom plate and/or apron, thickness can reduce more than half. The thickness of the steel layer and the copper layer is more than or equal to 0.15mm, for example, 0.15mm, 0.17mm, 0.19mm and the like, wherein the thickness of the copper layer is more than 0.02mm, for example, the thickness of the copper layer is 0.03mm, 0.04mm and the like, and the steel is lighter than the copper, so the weight of the temperature equalization plate can be effectively reduced while the thickness of the temperature equalization plate is reduced, the strength of the steel is high, the steel is not easy to soften after heat treatment, and the strength of the temperature equalization plate can be improved.
As shown in fig. 1, the temperature-uniforming plate comprises a bottom plate 2, a cover plate 1, a capillary layer 3 and support columns 4, wherein the bottom plate 2 and the cover plate 1 are buckled to form a cavity, the heat dissipation process of the temperature-uniforming plate is performed in the cavity, the capillary layer 3 can be attached to the bottom plate 2 and can also be attached to the cover plate 1, and can also be attached to the bottom plate 2 and the cover plate 1 simultaneously, the capillary layer 3 can enable cooling liquid condensed in the cavity of the temperature-uniforming plate to flow back to an evaporation heat source, and the support columns 4 are supported between the bottom plate 2 and the cover plate 1, so that the temperature-uniforming plate can be prevented from flattening during vacuum pumping and can be prevented from bulging due to evaporation expansion of the cooling liquid in the temperature-uniforming plate. When heat is conducted to a heat source contact area of the temperature equalizing plate from a heat source, the cooling liquid in the cavity starts to generate a gasification phenomenon of the cooling liquid after being heated in a low-vacuum-degree environment, at the moment, heat energy is absorbed, the gas-phase cooling medium quickly fills the whole cavity, when the gas-phase cooling medium contacts a relatively cold area, a condensation phenomenon is generated, heat absorbed during evaporation is released, the condensed cooling liquid returns to an evaporation heat source through the capillary layer 3, and the process is performed in the cavity in a circulating mode. Further, in one embodiment, a pouring port 5 may be provided on the bottom plate 2 or a pouring port 5 may be provided on the lid plate 1; in another embodiment, a semicircular groove may be formed in the bottom plate 2, a semicircular groove may be formed in the opposite position of the cover plate 1, the two semicircular grooves are engaged to form the liquid injection port 5, the liquid injection port 5 is communicated with the chamber, the coolant is injected into the chamber from the liquid injection port 5, and the chamber is evacuated from the liquid injection port 5. In one embodiment, the pouring outlet 5 can be integrally formed by punching.
Further, referring to fig. 2, the base plate 2 is composed of a copper layer 7 and a steel layer 8 located outside the copper layer 7, the cover plate 1 is composed of the copper layer 7 and the steel layer 8 located outside the copper layer 7, the steel is lighter and harder than the copper, the base plate 2 and the cover plate 1 composed of the copper layer 7 and the steel layer 8 are harder and thinner than the base plate 2 and the cover plate 1 of the copper or copper alloy material, and in one embodiment, the base plate 2 may also be composed of the copper layer 7 and the steel layer 8 located outside the copper layer 7, and the cover plate 1 is made of the common copper or copper alloy material; in other embodiments, it is also possible that the base plate 2 is of a common copper or copper alloy material and the cover plate 1 consists of a copper layer 7 and a steel layer 8 on the outside of the copper layer 7. Further, the copper layer 7 and the steel layer 8 are integrally formed by stamping, and the method can avoid environmental pollution caused by electroplating the copper layer on the steel layer.
Preferably, as shown in fig. 2, 5 and 6, the cover plate 1 is punched to form the recess to better form the cavity, and in one embodiment, referring to fig. 5, a boss may be punched to facilitate connection with a device with a small heat source, the boss being a heat source contact area; in other embodiments, referring to fig. 6, when the cover plate 1 is punched to form the recess, an avoiding hole may be simultaneously punched, so as to facilitate the passage of a circuit when being connected to other devices. Of course, it is also conceivable to stamp the cover plate 1 and the base plate 2 simultaneously to form the depressions, as shown in fig. 3, the cover plate 1 and the base plate 2 may be stamped simultaneously to form the same depressions; in other embodiments, referring to fig. 4, different shapes of depressions may also be stamped into the cover plate 1 and the base plate 2 simultaneously. Of course, the depression may be formed only by pressing the bottom plate 2. And filling a cooling liquid in a cavity formed by the cover plate 1 and the bottom plate 2, vacuumizing, and circulating the heat dissipation process of the temperature equalization plate in the cavity, wherein the cooling liquid can be pure water or other liquid.
As a preferable technical scheme, a copper layer, a nickel layer or a zinc layer can be superposed on the outer side of the steel layer 8 and is stamped together with the copper layer 7 and the steel layer 8 to form the base plate 2 and/or the cover plate 1, or a metal layer such as a copper layer, a nickel layer, a tin layer, a chromium layer and the like is electroplated on the outer side of the steel layer 8, because the steel layer 8 is not suitable for welding, the welding of the temperature-uniforming plate and fins or other accessories is facilitated by superposing the metal layer or the electroplated metal layer, and corrosion resistance can be realized, so that the appearance of the temperature-uniforming plate is more attractive.
Further, the capillary layer 3 can make the condensed cooling liquid flow back to the evaporation heat source. In one embodiment, the capillary layer 3 can be formed by spot or diffusion welding a copper mesh, copper fibers or copper foam on the copper layer 7; in other embodiments, the wicking layer 3 can also be formed by sintering copper powder or paste into a porous layer on the copper layer 7 or by sintering copper paste and mesh into a porous layer on the copper layer 7.
Further, the supporting columns 4 can be directly connected with the cover plate 1 and the bottom plate 2, and can also be directly connected with the capillary layer 3, specifically, the following connection modes can be adopted:
in one embodiment, the capillary layer 3 is disposed on the inner side of the cover plate 1, one end of the supporting column 4 penetrates through the capillary layer 3 to be connected with the cover plate 1, and the other end of the supporting column 4 is connected with the base plate 2, although it is also possible that one end of the supporting column 4 is connected with the capillary layer 3, and the other end of the supporting column is connected with the base plate 2;
in another embodiment, the capillary layer 3 is disposed on the inner side of the base plate 2, one end of the supporting column 4 penetrates through the capillary layer 3 to be connected with the base plate 2, and the other end of the supporting column 4 is connected with the cover plate 1, although it is also possible that one end of the supporting column 4 is connected with the capillary layer 3, and the other end of the supporting column is connected with the cover plate 1;
in other embodiments, the capillary layer 3 is arranged on the inner sides of the base plate 2 and the cover plate 1 at the same time, and two ends of the support column 4 are connected with the capillary layer 3; or one end of the supporting column 4 penetrates through the capillary layer 3 on the inner side of the cover plate 1 to be connected with the cover plate 1, and the other end of the supporting column is connected with the capillary layer 3 on the inner side of the bottom plate 2; one end of the supporting column 4 can penetrate through the capillary layer 3 on the inner side of the bottom plate 2 to be connected with the bottom plate 2, and the other end of the supporting column 4 is connected with the capillary layer 3 on the inner side of the cover plate 1; or the supporting columns 4 penetrate through the capillary layer 3 on the inner side of the cover plate 1 and the capillary layer 3 on the inner side of the bottom plate 2 at the same time to be connected with the bottom plate 2 and the cover plate 1.
Alternatively, the supporting pillars 4 and the bottom plate 2 may be connected by gluing, brazing, resistance welding, diffusion welding, ultrasonic welding, high-frequency welding, laser welding, or the like, and the supporting pillars 4 and the cover plate 1 may also be connected by gluing, brazing, resistance welding, diffusion welding, ultrasonic welding, high-frequency welding, laser welding, or the like, but it is understood that the supporting pillars 4 and the capillary layer 3 may also be connected by gluing, brazing, resistance welding, diffusion welding, ultrasonic welding, high-frequency welding, laser welding, or the like. The pressure in the cavity can be reduced when the temperature-uniforming plate is vacuumized, the temperature-uniforming plate can be prevented from being flattened due to vacuumizing by supporting the temperature-uniforming plate between the bottom plate 2 and the cover plate 1 through the supporting columns 4, meanwhile, the cavity is expanded after cooling liquid in the temperature-uniforming plate is gasified by heat, and the temperature-uniforming plate can be prevented from being bulged through the supporting columns 4. Alternatively, in one embodiment, the support column 4 may be a powder column; in other embodiments, the support column 4 may also be a solid column or a powder-coated solid column. The material of the solid pillars may be copper or a copper alloy.
Further, the temperature equalization plate of the present invention can be manufactured by the following method, specifically as follows:
s1: stamping the steel layer and the copper layer to form a bottom plate 2 and/or a cover plate 1;
s2: stamping at least one of the bottom plate 2 and the cover plate 1 to form a recess, wherein a liquid injection port 5 is arranged on the recess;
s3: one of a copper net, copper fibers and foam copper is adhered to the copper layer 7 through spot welding or diffusion welding, or copper powder or copper paste is sintered into a porous layer, or copper paste and the copper net are sintered into the porous layer, so that a capillary layer 3 is formed;
s4: the supporting columns 4 are supported between the bottom plate 2 and the cover plate 1 and are connected by one of the methods of gluing, brazing, resistance welding, diffusion welding, ultrasonic welding, high-frequency welding and laser welding, so that a stable steam channel is formed in the cavity;
s5: buckling the bottom plate 2 and the cover plate 1 together to form a cavity, and sealing edges by using any one of the processes mentioned in S4, wherein the inner surface of the cavity is a copper layer 7;
s6: injecting the working fluid from the injection port 5 and vacuumizing;
s7: the passage of the liquid pouring port 5 is closed by any one of the processes mentioned in S4.
The utility model discloses a with steel layer and copper layer punching press formation bottom plate 2 and/or apron 1, can avoid at steel layer copper electroplating layer and cause the pollution to the environment, regard the inlayer of temperature equalization board with the copper layer, can avoid the material in pure water and the steel layer to react and generate non-condensable gas, and simultaneously, the steel has better ground intensity and light in weight, bottom plate 2 and/or apron 1 that steel layer and copper layer punching press formed have higher intensity and lightweight more, can reduce the thickness of temperature equalization board bottom plate 2 and/or apron 1 simultaneously, satisfy the user to the temperature equalization board miniaturization, lightweight demand.
It is obvious that the above embodiments of the present invention are only examples for clearly illustrating the present invention, and are not intended to limit the embodiments of the present invention. Numerous obvious variations, rearrangements and substitutions will now occur to those skilled in the art without departing from the scope of the invention. And are neither required nor exhaustive of all embodiments. Any modification, equivalent replacement, and improvement made within the spirit and principle of the present invention should be included in the protection scope of the claims of the present invention.
Claims (10)
1. A temperature-uniforming plate, which comprises a bottom plate (2), a cover plate (1), a capillary layer (3) and supporting columns (4), and is characterized in that,
at least one of the cover plate (1) and the base plate (2) comprises a copper layer (7) and a steel layer (8) located on the outer side of the copper layer (7), the base plate (2) and the cover plate (1) are buckled to form a cavity, the capillary layer (3) is attached to the base plate (2) and/or the cover plate (1), and the supporting columns (4) are supported between the base plate (2) and the cover plate (1).
2. Temperature-uniforming plate according to claim 1, characterized in that the copper layer (7) and the steel layer (8) are integrally formed therebetween by stamping.
3. Temperature equalization plate according to claim 2, characterized in that the bottom plate (2) and/or the cover plate (1) is/are formed with a depression by stamping, which depression is part of the cavity.
4. The temperature equalization plate according to claim 1, wherein a liquid injection port (5) is formed on the bottom plate (2) or the cover plate (1), and the liquid injection port (5) is communicated with the chamber.
5. The temperature equalizing plate according to claim 1, wherein grooves with semicircular cross sections are formed in the bottom plate (2) and the cover plate (1) respectively, the grooves are buckled to form a liquid injection port (5), and the liquid injection port (5) is communicated with the chamber.
6. Temperature-uniforming plate according to any one of claims 1-5, characterized in that the thickness of the base plate (2) and/or the cover plate (1) is equal to or greater than 0.15mm and the thickness of the copper layer (7) is greater than 0.02 mm.
7. The vapor-temperature plate according to claim 1, characterized in that the capillary layer (3) is arranged inside the cover plate (1), and the supporting columns (4) are connected with the cover plate (1) through the capillary layer (3) at one end and with the bottom plate (2) at the other end;
or the capillary layer (3) is arranged on the inner side of the cover plate (1), one end of the supporting column (4) is connected with the capillary layer (3), and the other end of the supporting column is connected with the bottom plate (2);
or the capillary layer (3) is arranged on the inner side of the bottom plate (2), one end of the supporting column (4) penetrates through the capillary layer (3) to be connected with the bottom plate (2), and the other end of the supporting column is connected with the cover plate (1);
or the capillary layer (3) is arranged on the inner side of the bottom plate (2), one end of the supporting column (4) is connected with the capillary layer (3), and the other end of the supporting column is connected with the cover plate (1);
or the inner sides of the bottom plate (2) and the cover plate (1) are both provided with the capillary layer (3), and the two ends of the supporting columns (4) are connected with the capillary layer (3);
or the inner sides of the bottom plate (2) and the cover plate (1) are both provided with the capillary layer (3), one end of the supporting column (4) penetrates through the capillary layer (3) on the inner side of the cover plate (1) to be connected with the cover plate (1), and the other end of the supporting column is connected with the capillary layer (3) on the inner side of the bottom plate (2);
or the inner sides of the bottom plate (2) and the cover plate (1) are both provided with the capillary layer (3), one end of the supporting column (4) penetrates through the capillary layer (3) on the inner side of the bottom plate (2) to be connected with the bottom plate (2), and the other end of the supporting column is connected with the capillary layer (3) on the inner side of the cover plate (1);
or the bottom plate (2) and the inner side of the cover plate (1) are both provided with the capillary layer (3), and the supporting columns (4) simultaneously penetrate through the capillary layer (3) on the inner side of the cover plate (1) and the capillary layer (3) on the inner side of the bottom plate (2) and are connected with the bottom plate (2) and the cover plate (1).
8. A temperature-uniforming plate according to claim 7, wherein the connection between the supporting columns (4) and the base plate (2), between the supporting columns (4) and the cover plate (1) or between the supporting columns (4) and the capillary layer (3) is by gluing, soldering, resistance welding, diffusion welding, ultrasonic welding, high-frequency welding or laser welding.
9. The vapor-temperature plate according to claim 1, wherein the capillary layer (3) is formed by adhering copper mesh, copper fiber or foam copper on the copper layer (7) by spot welding or diffusion welding;
or the capillary layer (3) is formed by sintering copper powder or copper paste into a porous layer;
or the capillary layer (3) is formed by sintering copper paste and a copper net into a porous layer.
10. Temperature-uniforming plate according to claim 1, characterized in that the steel layer (8) is provided with a copper layer, a nickel layer or a zinc layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121582384.4U CN215261347U (en) | 2021-07-13 | 2021-07-13 | Temperature equalizing plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121582384.4U CN215261347U (en) | 2021-07-13 | 2021-07-13 | Temperature equalizing plate |
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| Publication Number | Publication Date |
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| CN215261347U true CN215261347U (en) | 2021-12-21 |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114608366A (en) * | 2022-03-18 | 2022-06-10 | 联德电子科技(常熟)有限公司 | Temperature-equalizing plate suitable for pressure resistance welding and processing method thereof |
| CN114705071A (en) * | 2022-05-13 | 2022-07-05 | 华为技术有限公司 | Mobile terminal, temperature-uniforming plate and manufacturing method of temperature-uniforming plate |
| CN114739218A (en) * | 2022-03-18 | 2022-07-12 | 联德电子科技(常熟)有限公司 | Temperature-equalizing plate suitable for laser welding and processing method thereof |
| WO2023284315A1 (en) * | 2021-07-14 | 2023-01-19 | 中兴通讯股份有限公司 | Vapor chamber, manufacturing method for vapor chamber, and electronic device |
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2021
- 2021-07-13 CN CN202121582384.4U patent/CN215261347U/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023284315A1 (en) * | 2021-07-14 | 2023-01-19 | 中兴通讯股份有限公司 | Vapor chamber, manufacturing method for vapor chamber, and electronic device |
| CN114608366A (en) * | 2022-03-18 | 2022-06-10 | 联德电子科技(常熟)有限公司 | Temperature-equalizing plate suitable for pressure resistance welding and processing method thereof |
| CN114739218A (en) * | 2022-03-18 | 2022-07-12 | 联德电子科技(常熟)有限公司 | Temperature-equalizing plate suitable for laser welding and processing method thereof |
| CN114705071A (en) * | 2022-05-13 | 2022-07-05 | 华为技术有限公司 | Mobile terminal, temperature-uniforming plate and manufacturing method of temperature-uniforming plate |
| CN114705071B (en) * | 2022-05-13 | 2022-09-09 | 华为技术有限公司 | Mobile terminal, temperature-uniforming plate and manufacturing method of temperature-uniforming plate |
| WO2023216482A1 (en) * | 2022-05-13 | 2023-11-16 | 华为技术有限公司 | Mobile terminal, vapor chamber, and method for manufacturing vapor chamber |
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Address after: 510623 floors 1-4 of building a and 1-4 of building B in aimeda hi tech Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee after: Baode South China (Shenzhen) thermal energy system Co.,Ltd. Address before: 510623 floors 1-4 of building a and 1-4 of building B in aimeda hi tech Industrial Park, Xinshi community, Dalang street, Longhua District, Shenzhen City, Guangdong Province Patentee before: Aavid Shenzen Thermal Energy System Co.,Ltd. |