TWM622344U - Heat dissipation part - Google Patents

Abstract

A heat sink is used to solve the bottleneck of capillary phenomenon and the problem that the conventional heat sink is difficult to simplify the manufacturing process because the support column is arranged in the cavity. The system includes: a casing with a chamber filled with a working fluid; and a capillary structure located in the chamber, the capillary structure having at least one support portion connected to a substrate, the substrate and the support The parts are respectively abutted against two opposite inner surfaces of the casing.

Description

heat sink

This creation relates to a heat sink, especially a heat sink for dissipating heat for electronic components.

With the advancement of electronic technology and the continuous development of semiconductor industry technology in the direction of high performance, high power, light, thin and short, the heat generated by the operation of IC components and the concentration have increased. Therefore, improving the heat dissipation efficiency is an important part of electronic related products. problems to be avoided. At present, there are a variety of heat sinks on the market that can be used in electronic products. Compared with traditional heat sink fins, using working fluid and capillary structure of the temperature chamber and heat pipe, the gas and liquid phases of the working fluid can Changes to dissipate heat can improve the phenomenon of hot spot concentration, and has the advantages of fast response time, good temperature uniformity, light weight and good efficiency; currently the more common capillary structure types are groove, mesh and sintering.

In the above-mentioned conventional heat sink with working fluid and capillary structure, since the working fluid and capillary structure are arranged in the cavity inside the heat sink, in order to avoid the surface collapse of the cavity due to the positive pressure on the surface or the negative pressure of the internal vacuum Or deformed, in addition to the above-mentioned working fluid and capillary structure, several supporting columns need to be set up in the cavity. In the manufacturing process, the support column and the capillary structure are processed separately, such as the support column placement operation, the support column welding operation, or the support column directly formed by etching the metal plate. Therefore, the complicated manufacturing process increases the difficulty of manufacturing, resulting in Manufacturing costs are difficult to reduce and production efficiency is difficult to improve. In addition, the capillary effect cannot be generated by using the etching to form the support column, which also becomes an important factor that is difficult to improve the heat dissipation performance in a limited space.

In view of this, it is still necessary to improve the conventional heat sink.

In order to solve the above problems, the purpose of the present invention is to provide a heat sink, the support portion of which has the dual functions of supporting and generating capillary action, which can improve the heat dissipation performance and reduce the volume, so as to further greatly reduce the manufacturing cost.

The second objective of the present invention is to provide a heat dissipation member, which can greatly reduce the diameter of the capillary pores of the capillary structure and increase the number of the capillary pores, thereby achieving better heat dissipation performance.

Another object of the present invention is to provide a heat sink, which can simplify the manufacturing process.

The directionality described in the full text of this creation or its similar terms, such as "front", "back", "left", "right", "up (top)", "down (bottom)", "inside", "outside" , "sideways", etc., mainly refer to the directions of the attached drawings, and each directional or similar terms are only used to assist the description and understanding of the various embodiments of the present creation, and are not intended to limit the present creation.

The use of the quantifier "a" or "an" for the elements and components described in the full text of this creation is only for the convenience of use and to provide the general meaning of the scope of this creation; in this creation, it should be construed as including one or at least one, and a single The concept of also includes the plural case unless it is obvious that it means otherwise.

Similar terms such as "combination" or "combination" mentioned in the whole text of this work mainly include the components that can be separated without destroying the components after being connected, or the components cannot be separated after being connected. The material of the connected components or the assembly requirements are selected.

The heat sink of the present invention includes: a casing having a chamber, the chamber is filled with a working fluid; and a capillary structure located in the chamber, the capillary structure has at least one supporting portion connected to a substrate, The base plate and the support portion are respectively abutted against two opposite inner surfaces of the casing.

Accordingly, in the heat sink of the present invention, the support portion is formed by the capillary structure, therefore, The steps of placing the supporting columns, welding or etching the supporting columns are reduced, so that the manufacturing procedure of the heat sink is simplified and the cost is greatly reduced. Since the support part has the dual functions of supporting and generating capillary action, it can improve the heat dissipation performance and help the heat dissipation member to further reduce the volume, which is very helpful for the development of miniaturization or thinning of the heat dissipation member .

Wherein, the capillary structure may have capillary pores with a diameter of less than 0.2 mm. In this way, it has the effect of generating capillary phenomenon.

Wherein, the capillary structure can be punched or rolled to form the substrate and the supporting portion which are integrally connected. In this way, it has the effect of reducing the pore size of the capillary pores and increasing the number of the capillary pores.

Wherein, the average pore diameter of the capillary pores of the substrate may be smaller than the average pore diameter of the capillary pores of the support portion. In this way, it has the effect of generating compound capillary force.

Wherein, the diameter of the capillary pores of the support portion may be greater than 0.2 mm. In this way, it has the effect of increasing the vapor space.

Wherein, the capillary structure can be shaped by at least one metal mesh. In this way, it has the effect of providing the adsorption force of the backflow of the working fluid.

Wherein, the capillary structure can be formed by overlapping and reshaping several metal meshes. In this way, it has the effect of increasing the number of the capillary pores.

Wherein, the meshes and thicknesses of the several metal meshes can be different. In this way, a metal mesh with a thick wire diameter can be used to superimpose a metal mesh with a fine wire diameter, which has the effect of saving materials.

Wherein, the plurality of metal meshes can be overlapped with each other according to the set rotation angle. In this way, the mesh shape of the capillary structure is no longer the square or rhombus lattice of the traditional plain weave, and has the effect of producing high-density capillary pores in a composite shape.

Wherein, when the two metal meshes are stacked, the metal wires of one of the metal meshes can be located in the capillary holes of the other metal mesh, and the two metal meshes can be fitted with each other after shaping. Thus, there is an increase in Efficacy of the capillary number of the capillary structure.

Wherein, after shaping, the capillary structure can be in the shape of only partial fitting of adjacent metal meshes. In this way, the capillary structure has the effect of making the adjacent metal meshes N have different meshes in the opposite direction.

Wherein, the capillary structure can be formed by sintering several powder particles and then shaping. In this way, it has the effect of further enhancing the adsorption force of the backflow of the working fluid.

Wherein, the substrate has a first plate body and a second plate body with different thicknesses. In this way, the first plate body and the second plate body can have different capillary pore diameters, which has the effect of increasing the flow rate of the working fluid.

Wherein, the housing may have at least one concave portion concave toward the cavity. In this way, the concave portion can be used for accommodating a heating body or an electronic component to avoid position, which has the effect of reducing the occupied space.

Wherein, the concave portion can be in contact with the support portion. In this way, the heat dissipation area is increased and the supporting force is improved.

Wherein, the concave portion and the support portion may not be in contact with each other. In this way, it has the effect of cooperating with the avoidance of the mechanism to facilitate the installation of the heat sink in a narrow space.

Wherein, the concave portion can make the inner surface protrude in the cavity, and the capillary structure can form the support portion along the undulation of the inner surface. In this way, the supporting portion can be formed together with the concave portion, which has the effect of simplifying the processing procedure.

Wherein, the shell system may have a first sheet body, the first sheet body may have a receiving groove, and the casing may further have a second sheet body combined with the first sheet body to form the cavity. In this way, it has the effect of forming a vapor chamber type.

Wherein, the second sheet body has an accommodating groove communicating with the accommodating groove of the first sheet body. In this way, a larger chamber can be formed, which has the effect of improving the heat dissipation performance.

[This creation]

1: Shell

1a: The first body

1b: Second body

11: Container

12: Ring edge

13: Hole

14: Joint

15: Hole cover

16: Container

17: Depressed part

18: Endothermic surface

19: Depressed part

2: capillary structure

21: Substrate

21a: The first board body

21b: Second plate body

22: Support part

23: capillary

D1, D2: Thickness

E: heating element

F1: Lower inner surface

F2: Upper inner surface

H: heat pipe

J: Vapor chamber

L: working fluid

N: Metal mesh

N1: metal wire

P: powder particles

S: Chamber

T: Liquid injection channel

[Figure 1] An exploded perspective view of the first embodiment of the present invention.

[Fig. 2] A combined cross-sectional view of the first embodiment of the present invention.

[Picture 3] A three-dimensional view of the capillary structure of the metal mesh of this creation.

[Picture 4] The state diagram of the metal mesh capillary structure of this creation after shaping.

[Picture 5] A perspective view of the capillary structure of the woven mesh of this creation.

[Picture 6] An exploded perspective view of the superimposed two-layer metal mesh capillary structure in this creation.

[Picture 7] The state diagram of the superimposed two-layer metal mesh capillary structure after shaping.

[Picture 8] This is a diagram of the state where the two-layer metal mesh capillary structure is only partially fitted on the opposite surface.

[Picture 9] An exploded perspective view of the capillary structure of the three-layer metal mesh superimposed in this creation.

[Picture 10] The structure of the sintered powder in this creation.

[Fig. 11] The state diagram of the sintered powder structure of this creation after shaping.

[Fig. 12] A combined cross-sectional view of the second embodiment of the present invention.

[Fig. 13] A combined cross-sectional view of the third embodiment of the present invention.

[Fig. 14] A combined cross-sectional view of the fourth embodiment of the present invention.

[Fig. 15] A combined cross-sectional view of the fifth embodiment of the present invention.

[Fig. 16] A combined cross-sectional view of the sixth embodiment of the present invention.

[Fig. 17] A combined cross-sectional view of the seventh embodiment of the present invention.

[Fig. 18] A combined cross-sectional view of the eighth embodiment of the present invention.

[Fig. 19] A combined cross-sectional view of the ninth embodiment of the present invention.

In order to make the above and other purposes, features and advantages of this creation more obvious and easy to understand, the following Went cites the preferred embodiment of this creation, and cooperates with the accompanying drawings, and makes a detailed description as follows:

Please refer to FIGS. 1 and 2 , which are the first embodiment of the heat sink of the present invention, which includes a casing 1 and a capillary structure 2 , and the capillary structure 2 is located in the casing 1 .

The casing 1 can be made of materials with thermal conductivity such as copper, aluminum, titanium, or stainless steel, so that the casing 1 can be directly or indirectly connected to a heating element to dissipate heat from the heating element. The heating element can be a central processing unit of a mobile phone or other electronic products, or an electronic component such as a chip on a circuit board that generates heat due to operation. The casing 1 has a chamber S, and the chamber S can be used to fill a working fluid L, and the working fluid L can be water, alcohol or other liquids. Preferably, the working fluid L can be a non-conductive liquid, so that the working fluid L can easily absorb heat from a liquid state and evaporate into a gaseous state, and then utilize the gas-liquid phase change mechanism of the working fluid L to achieve thermal energy transfer. The chamber S is in a vacuum closed state, which can prevent the working fluid L from escaping after forming a gaseous state, and prevent the interior from being occupied by air and compressed into the space after the working fluid L forms a gaseous state, thereby affecting the heat dissipation efficiency.

The shape of the casing 1 is not limited in the present invention, and the shape of the casing 1 can be adjusted according to factors such as the type of the heat sink, usage conditions or installation conditions. For example, the heat sink of this embodiment may be a temperature chamber J, and the housing 1 may include a first sheet 1a, a second sheet 1b, the first sheet 1a and the second sheet 1b. After the sheets 1b are combined, the aforementioned chamber S can be formed in the interior thereof for accommodating the aforementioned capillary structure 2 .

The first sheet body 1a may have a receiving groove 11, and the receiving groove 11 can be formed by processing methods such as stamping, die casting, bending or etching, which are not limited in this invention. A peripheral edge 12 of the accommodating groove 11 may be formed, and a hole 13 penetrates the annular rim 12 and communicates with the accommodating groove 11 . The second sheet body 1b can be made of the same or different material as the first sheet body 1a, which is not limited in this creation. The circumference of the second sheet body 1b may have a joint portion 14, and the joint portion 14 may be combined with the peripheral edge 12 of the first sheet body 1a, so that the second sheet body 1b and the first sheet body 1a share the same The chamber S is formed for containing The capillary structure 2 is assumed. The second body 1b further has a hole cover 15 connected to the joint portion 14 , and the hole cover 15 can be aligned with the hole 13 of the first body 1a to form a liquid injection channel T together. The liquid injection channel T communicates the chamber S with the outside world, and the liquid injection channel T can be used to extract the air in the chamber S and fill the chamber S with the working fluid L used by the uniform temperature plate J The liquid injection channel T can be sealed after the filling of the working fluid L is completed, so as to prevent the working fluid L from being lost in a gaseous state.

Based on the above, the combination of the second sheet 1b and the first sheet 1a is not limited in this creation. For example, the second sheet 1b can be pasted, inserted, locked, clipped or welded. way to be combined with the first sheet body 1a. In this embodiment, the ring edge 12 of the first sheet 1a can be brazed or laser welded to the joint 14 of the second sheet 1b, and the liquid injection channel T can be filled with solder It is sealed so that the first sheet body 1a and the second sheet body 1b can be surely combined without creating a gap, so as to improve the structural strength.

The capillary structure 2 is located in the chamber S, and the capillary structure 2 can be a porous structure to promote the flow of the working fluid L by capillary phenomenon. The capillary structure 2 can be a porous mesh or a sintered powder structure. The aforementioned sintered powder structure can be made of copper powder or other suitable powders through a powder sintering process, which is not limited in the present invention.

Based on the above, the capillary structure 2 can be shaped to form at least one substrate 21 and at least one support portion 22 after preliminary shaping. The shaping method can be punching or rolling, which is not limited in the present invention. In this embodiment, the support portion 22 is located above the substrate 21 , and the average diameter of the capillary pores of the support portion 22 and the substrate 21 may be different, so that the support portion 22 has the function of generating a composite capillary force. In addition, the diameter of the capillary pores of the support portion 22 may be larger than 0.2 mm, which has the effect of increasing the vapor space. The capillary structure 2 can be abutted against the lower inner surface F1 of the casing 1 (the surface of the first sheet 1a facing the second sheet 1b) by the base plate 21 , and can be abutted against the support portion 22 . The upper inner surface F2 of the housing 1 (the surface of the second sheet body 1b facing the first sheet body 1a). Thus, the cavity The chamber S can be supported by the support portion 22 and the substrate 21 to prevent the surface from being collapsed or deformed by the positive surface pressure or the negative pressure of the internal vacuum; in particular, the heat sink of the present invention does not require prior knowledge The steps of welding the support column of the heat sink, opening the support column hole in the capillary structure, or using etching to form the support column, simplifies the manufacturing process of the heat sink, thereby effectively reducing the manufacturing cost. In addition, through the shaping action, the capillary structure 2 can reduce the diameter of the capillary pores and increase the number of capillary pores per unit area, thereby improving the ability to adsorb the working fluid L, that is, it can increase the flow rate of the working fluid L, In order to achieve better cooling performance.

In addition, the present invention does not limit the forming method of the capillary structure 2 . For example, please refer to FIG. 3 , the capillary structure 2 may be a metal mesh N having several capillary holes 23 , and the metal mesh N may have several metal lines N1 interlaced with each other. As shown in FIG. 4, after the metal mesh N is shaped, the diameter of the capillary hole 23 can be reduced due to the extension of the metal wire N1, so that the reduced capillary hole 23 can increase the adsorption force of capillary phenomenon . On the other hand, as shown in FIG. 5, the metal mesh N can also be a woven mesh formed by overlapping and knitting several metal wires N1, and the capillary holes 23 between the several metal wires N1 can also be due to The extension of the metal line N1 reduces the aperture and generates the support column at the same time.

In addition, the capillary structure 2 can also be formed by stacking several metal meshes N and then shaping. The meshes of the several metal meshes N can be different, for example, the metal meshes N of 50 meshes and 200 meshes are used. The metal mesh N with fewer meshes can have thicker metal wires N1, that is, the thickness is thicker; the metal mesh N with more meshes can have thinner metal wires N1, that is, the thickness is thinner. The thick wire diameter metal mesh is superimposed on the thin wire diameter metal mesh so that the supporting portion 22 reaches the supporting height, which has the effect of saving material. As shown in Figs. 6 and 7, the capillary structure 2 may be superimposed by two metal meshes N; more specifically, when the two metal meshes N are superimposed, the metal wire of one of the metal meshes N may be superimposed. N1 pairs the capillary holes 23 located on the other metal mesh N, and then reshapes them so that the two metal meshes N fit into each other on opposite surfaces. In this way, not only the capillary 23 with a larger diameter can be Divided into several capillary holes 23 with smaller apertures, at the same time, the capillary structure 2 can also have capillary holes 23 with a variety of different apertures, and increase the number of capillary holes 23 per unit area to improve the adsorption force of capillary phenomenon, the capillary structure 2 Multiple layers of the metal mesh N can be stacked according to product requirements, so that the pore size of the divided capillary holes 23 can be further divided. The above-mentioned fitting includes complete fitting of the two metal meshes N, or only partial fitting as shown in FIG. 8 . Partial fitting can make the capillary structure 2 form more and smaller capillary holes 23 only in the part where the metal mesh N is fitted with each other, that is, the capillary structure 2 can be formed on the adjacent metal mesh N. There are different numbers and diameters of the capillary pores 23 in the opposite directions, so that the adsorption force of the capillary phenomenon can also be improved, and the content of the working fluid L per unit area can be increased at the same time. As mentioned above, the capillary structure 2 can be formed by stacking several metal meshes N and then shaping. Please refer to FIG. 9. In this embodiment, the capillary structure 2 can also be formed by three metal meshes N. Superimposed according to the set rotation angle, in addition to further increasing the number of the capillary holes 23, the mesh shape of the capillary structure 2 is no longer the square or diamond grid of the traditional plain weave, and has a high-density composite that cannot be achieved by the traditional process. The function of the capillary 23 in the form of the shape.

Referring to FIG. 10, when the capillary structure 2 is a sintered powder structure, the capillary pores 23 of the capillary structure 2 can be formed between adjacent several powder particles P. After the several powder particles P are shaped, As shown in FIG. 10 , the powder particles P can be deformed and extended, so the diameter of the capillary pores 23 can be reduced, so as to improve the adsorption force of capillary phenomenon and simultaneously generate the function of supporting columns.

To sum up, by shaping the capillary structure 2, the diameter of the capillary pores 23 can be made smaller than 0.2 mm, so as to generate the adsorption force of capillary phenomenon. Further, this capillary structure 2 can be a copper mesh, and after shaping, the aperture of this capillary hole 23 can be made to be less than 0.042mm; this capillary structure 2 can also be a stainless steel mesh, and after shaping, the aperture of this capillary hole 23 can be made. Less than 0.03mm, both have the function of improving the adsorption force of capillary phenomenon and generating support columns at the same time.

Referring to FIG. 2 again, when using the vapor chamber J of this embodiment, for example, the first sheet 1a of the casing 1 can be thermally connected to a heating element, so that the first sheet 1a transmits the heat The heat energy of the heating element reaches the lower inner surface F1 and is absorbed by the working fluid L in the chamber S. The working fluid L in the chamber S can be evaporated from a liquid state to a gas state after absorbing the heat energy, and after contacting the relatively low temperature second sheet 1b, the working fluid L can be condensed into a liquid state again, and through the capillary structure 2. Re-aggregate, so that the working fluid L can absorb heat energy from the heating body again; such repeated circulation can achieve the effect of providing good heat dissipation efficiency. Wherein, the capillary structure 2 can be abutted against the inner wall of the casing 1 by the substrate 21 and the support portion 22 , and the chamber S can be supported by the substrate 21 and the support portion 22 to prevent the surface Pressure or the negative pressure of the internal vacuum causes the surface to collapse or deform. At the same time, since the support portion 22 has the dual functions of supporting and generating capillary action, it can improve the heat dissipation performance and help the heat sink to further replace the process of generating the support column by etching, which greatly reduces the manufacturing cost. The development of miniaturization or thinning of the heat sink is very helpful.

Please refer to FIG. 12, which is the second embodiment of the heat sink of the present invention. In this embodiment, the second sheet body 1b may also have a receiving groove 16, whereby the second sheet body 1b is combined with In the case of the first sheet 1a, the cavity 16 can communicate with the cavity 11 to form the larger chamber S together, which is beneficial to the development of gas-liquid phase conversion to increase the heat dissipation efficiency.

Please refer to FIG. 13, which is the third embodiment of the heat sink of the present invention. The substrate 21 after the capillary structure 2 is shaped can form at least one first plate body 21a and at least one second plate body 21b. The thickness D1 of the first plate body 21a and the thickness D2 of the second plate body 21b may be different. In this embodiment, the thickness D1 of the first plate body 21a may be greater than the thickness D2 of the second plate body 21b, that is, the compression degree of the first plate body 21a may be smaller, so that the first plate body 21a is relatively The second plate body 21b may have capillary holes 23 with larger diameters, and the flow rate of the working fluid L can be increased by the interaction between the capillary holes 23 with different diameters to achieve better heat dissipation performance.

Please refer to Figures 14-18, the first sheet 1a and/or the second sheet 1b may be recessed toward the chamber S, which may have the effect of reducing the occupied space or increasing the heat dissipation area. Please refer to FIG. 14, which is the fourth embodiment of the heat sink of the present invention. In this embodiment, the second body 1b may have a concave portion 17 concave toward the cavity S. Thus, the The concave portion can be used for accommodating a heating body or an electronic component to avoid position, and has the effect of reducing the occupied space.

Please refer to FIG. 15, which is the fifth embodiment of the heat sink of the present invention. Compared with the fourth embodiment, the second body 1b may have a plurality of the concave portions 17, and each of the concave portions 17 can Connected to each of the supporting portions 22, thereby, the heat dissipation area of the second sheet body 1b can be increased, so as to achieve better heat dissipation performance and increase the supporting force.

Please refer to FIG. 16, which is the sixth embodiment of the heat sink of the present invention. Compared with the fifth embodiment, the outer surface of the first sheet 1a may have a heat absorbing surface 18, and the heat absorbing surface 18 can heat A heating element E is connected, and the portion of the first sheet 1a other than the heat absorbing surface 18 may also have several concave portions 19 recessed toward the chamber S, and each of the concave portions 19 can abut against the substrate 21. Thereby, the heat dissipation area of the first sheet body 1a and the second sheet body 1b can be increased at the same time, so as to achieve better heat dissipation performance.

Please refer to FIG. 17 , which is the seventh embodiment of the heat sink of the present invention. In this embodiment, the concave portion 17 and the support portion 22 may not be in contact with each other. It is convenient to install in a small space.

Please refer to FIG. 18, which is the eighth embodiment of the heat sink of the present invention. Compared with the seventh embodiment, the concave portion 19 of the first sheet 1a can make the lower inner surface F1 protrude in the cavity In the chamber S, when the capillary structure 2 is arranged in the chamber S, the support portion 22 can be formed along the undulation of the lower inner surface F1, that is, the support portion 22 can be shaped together with the recessed portion 19. , so the system can simplify the processing program.

Please refer to FIG. 19, which is the ninth embodiment of the heat dissipation element of the present invention. The heat dissipation element of this embodiment can be a heat pipe H, and the casing 1 also has a cavity S for accommodating hair The fine structure 2 and the working fluid L. The casing 1 and the capillary structure 2 of the heat pipe H in this embodiment can also be set to the shapes of the foregoing embodiments according to the needs of use, and will not be described in detail here.

To sum up, in the heat sink of the present invention, the capillary structure is shaped to form the support portion. Therefore, the steps of placing the support column, welding the support column, or directly etching and forming the support column on the metal plate are reduced. The manufacturing procedure of the heat sink is simplified, especially instead of using the metal plate to etch and form the support column, it is more helpful to greatly reduce the manufacturing cost. The capillary structure can be shaped by shaping, which can greatly reduce the pore size of the capillary hole and increase the number of the capillary hole, thereby effectively optimizing the flow rate of the working fluid and increasing the heat dissipation efficiency. Since the supporting portion has dual functions of supporting and generating capillary action, it can improve the heat dissipation performance, which is very helpful for the development of miniaturization or thinning of the heat dissipation member. In addition, the casing can be provided with the concave portion, which can increase the heat dissipation area and further increase the heat dissipation efficiency.

Although the present creation has been disclosed by the above-mentioned preferred embodiments, it is not intended to limit the present creation. Any person skilled in the art can make various changes and modifications relative to the above-mentioned embodiments without departing from the spirit and scope of the present creation. The technical scope protected by the creation, so the protection scope of this creation should be determined by the scope of the patent application attached hereto.

1: Shell

1a: The first body

1b: Second body

11: Container

12: Ring edge

14: Joint

2: capillary structure

21: Substrate

22: Support part

F1: Lower inner surface

F2: Upper inner surface

J: Vapor chamber

L: working fluid

S: Chamber

Claims (17)

A heat sink comprising: a housing having a chamber filled with a working fluid; and A capillary structure is located in the chamber, and the capillary structure has at least one support portion connected to a base plate, and the base plate and the support portion are respectively abutted against two opposite inner surfaces of the casing. The heat sink of claim 1, wherein the capillary structure has capillary pores with a diameter of less than 0.2 mm. The heat sink of claim 1, wherein the capillary structure is punched or rolled to form the base plate and the support portion that are integrally connected. The heat sink of claim 3, wherein the average pore diameter of the capillary pores of the substrate is smaller than the average pore diameter of the capillary pores of the support portion. The heat sink of claim 1, wherein the capillary hole diameter of the support portion is greater than 0.2 mm. The heat sink of claim 1, wherein the capillary structure is shaped by at least one metal mesh. The heat sink of claim 1, wherein the capillary structure is formed by overlapping and reshaping several metal meshes. The heat sink of claim 7, wherein the meshes and thicknesses of the plurality of metal meshes are different. The heat sink of claim 7, wherein the plurality of metal meshes overlap each other according to a set rotation angle. The heat sink of claim 7, wherein when the two metal meshes are stacked, the metal wires of one of the metal meshes are located in the capillary holes of the other metal mesh, and the two metal meshes are fitted with each other after shaping. The heat sink according to claim 7, wherein the capillary structure is only partially fitted with adjacent metal meshes after shaping. The heat sink of claim 1, wherein the capillary structure is formed by sintering a plurality of powder particles and then shaping. The heat sink of claim 1, wherein the substrate has a first plate body and a second plate body with different thicknesses. The heat sink of claim 1, wherein the housing has at least one recessed portion recessed toward the cavity. The heat sink of claim 14, wherein the recessed portion abuts against the supporting portion. The heat sink of claim 14, wherein the recessed portion and the supporting portion are not in contact with each other. The heat sink of claim 14, wherein the concave portion makes the inner surface protrude in the cavity, and the capillary structure forms the support portion along the undulations of the inner surface.

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