CN211860889U - Ultra-thin asymmetric soaking plate based on foamy copper - Google Patents
Ultra-thin asymmetric soaking plate based on foamy copper Download PDFInfo
- Publication number
- CN211860889U CN211860889U CN202020202487.2U CN202020202487U CN211860889U CN 211860889 U CN211860889 U CN 211860889U CN 202020202487 U CN202020202487 U CN 202020202487U CN 211860889 U CN211860889 U CN 211860889U
- Authority
- CN
- China
- Prior art keywords
- shell plate
- plate
- ultra
- copper
- soaking
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a soaking plate, concretely relates to ultra-thin asymmetric soaking plate based on foamy copper. The utility model discloses an ultra-thin asymmetric soaking plate includes shell plate and lower shell plate, shell plate and the peripheral sealing connection of shell plate down go up the shell plate, and inside formation seals working medium chamber, go up the shell plate internal surface and be provided with the support column, and the foam copper that upper and lower surface closely laminated upper shell plate and lower shell plate is provided with on the seal working medium intracavity, is provided with the slot that uses the heat source center as the outside extension of starting point on the foam copper, and the slot sets up the clearance department between the support column to avoid the support column. The utility model discloses an ultra-thin asymmetric soaking pit utilizes the clearance position between the upper casing board support column to design the slot trend, and slot on the foamy copper forms corresponding relation with the clearance between the upper casing board support column this moment to avoid supporting the deformation problem that is not enough and brings, can effectively solve the radiating problem of the electronic component that irregular shape and the narrow and small heat flux density in space are high.
Description
Technical Field
The utility model relates to a soaking plate, concretely relates to ultra-thin asymmetric soaking plate based on foamy copper.
Background
With the overall spread of the 5G industry, the heat flux density of intelligent portable electronic devices is higher and higher. The existing portable electronic products generally use a vapor chamber with the thickness of 0.4mm or more. In order to meet the heat dissipation requirements of electronic products with smaller and smaller sizes and thinner thicknesses, the development of an ultrathin soaking plate with the thickness of 0.25-0.35mm is urgently needed to solve the problem of local high heat flow heat dissipation of microelectronic devices in a limited space.
In the prior art, based on soaking plates made of foam copper, channels which are mostly punched into petal-shaped, meter-shaped and other structures are only suitable for soaking plates in regular shapes, and the heat source is in the symmetric center. For the use situation that the heat source is not in the center of the structure and is in an irregular shape, a particularly applicable structural scheme is not provided; and for the ultrathin soaking plate with the thickness of less than 0.35mm, the thickness of the liquid absorption core is extremely limited, and only the groove is formed on the liquid absorption core to be used as a steam channel, so that the enough steam space in the soaking plate cannot be ensured. In addition, insufficient volume of the steam cavity can cause poor performance of the soaking plate, and meanwhile, in order to enable the condensed working medium to rapidly flow back, the capillary driving force is to be further enhanced.
Disclosure of Invention
The utility model aims to solve the technical problem that to the not enough of above-mentioned prior art, provide an ultra-thin asymmetric soaking plate based on foamy copper. The utility model discloses an ultra-thin asymmetric soaking plate can effectively solve the heat dissipation problem of the electronic component that irregular shape and narrow and small heat flux density in space are high, and this structure is particularly useful for making the ultra-thin soaking plate of 0.25-0.35mm thickness.
In order to solve the technical problem, the utility model discloses a technical scheme is: an ultra-thin asymmetric soaking plate based on foam copper is characterized by comprising the following characteristics:
the utility model provides an ultra-thin asymmetric soaking plate based on foamy copper, includes cope match-plate shell and lower shell, go up the shell and the peripheral sealing connection of lower shell, inside forms sealed working medium chamber, it is provided with the support column to go up the shell internal surface, the foamy copper that is provided with upper and lower surface in the sealed working medium chamber and closely laminates upper match-plate shell and lower shell, be provided with the slot that uses the heat source center as the outside extension of starting point on the foamy copper, the slot sets up the clearance department between the support column to avoid the support column.
The wall thickness of the upper shell plate is 0.10-0.20mm, and the inner surface of the upper shell plate is etched with concave surfaces with support columns regularly arranged.
The wall thickness of the lower shell plate is 0.10-0.22mm, and concave surfaces corresponding to the upper shell plate are etched on the inner surface of the lower shell plate.
The foamy copper is arranged in the concave surface of the lower shell plate, is fixed with the concave surface of the lower shell plate in a spot welding mode and is sintered with the lower shell plate into a whole, and the thickness of the foamy copper is 0.06-0.1 mm.
The sealed working medium cavity is in a vacuum state, and liquid working medium is filled in the cavity.
The grooves far away from the peripheral area of the heat source extend and branch to realize that the grooves are distributed on the whole foam copper, the groove width is gradually increased to 1.2mm from 0.5mm or is fixed, the width is 0.8-1.2mm, and the width of the tail end of the groove channel from the outer edge of the foam copper is 2-4 mm.
The upper shell plate is etched once or twice: when etching is carried out once, the edges of the upper shell plate and the lower shell plate are integrally connected, and the support columns etched on the upper shell plate are combined with 3-5 large columns etched on the lower shell plate in a brazing mode; and when the etching is carried out twice, the edge of the upper shell plate is subjected to secondary etching, and the upper shell plate and the lower shell plate form a whole with a sealed working medium cavity through the soldering paste in a reserved space at the secondary etching position.
The center of the heat source is the center of the heat source attached to the lower case plate.
And the foam copper is subjected to hydrophilic treatment by adopting a magnetron sputtering plating titanium dioxide or a thermal oxidation method.
The concave surface of the lower shell plate is roughened by a physical method, a chemical method, an electrochemical method or a thermal oxidation method, wherein the roughened concave surface treated by the physical method, namely a nanosecond laser processing device or a plasma machine has a continuous capillary structure with a hairy shape; the roughened concave surface treated by a chemical or electrochemical method has a hydrophilic porous structure.
Compared with the prior art, the utility model has the advantages of it is following:
(1) the inner surface of the lower shell plate of the utility model is roughened, which can solve the problem of insufficient capillary force, save materials and further realize the ultra-thinness of the soaking plate; the outer edge of the upper shell plate is etched for the second time, a solder paste space is reserved, and the thickness of the soaking plate is effectively reduced; the upper and lower shell plates are connected with the large column through the small support columns in a brazing mode, and the strength of the overall structure is improved.
(2) The utility model discloses carry out hydrophilicity to the foamy copper and handle, like magnetron sputtering plating titanium dioxide or thermal oxidation method etc. make the foamy copper have super hydrophilicity, the water-absorbing capacity is stronger.
(3) The utility model discloses utilize the clearance position between the upper casing board support column to design the slot trend, slot and the clearance between the upper casing board support column on the foam copper form corresponding relation this moment. So, the support column can avoid the slot, and has direct contact surface with the copper foam to avoid supporting not enough and the deformation problem that brings.
(4) The utility model discloses can solve the difficult problem of asymmetric shape soaking board steam channel overall arrangement, the design of branch type steam channel helps steam in time to reach and keeps away from the heat source end, dispels the heat rapidly.
Drawings
Fig. 1 is an exploded view of a vapor chamber according to embodiment 1 of the present invention.
Fig. 2 is a schematic structural diagram of a copper foam groove in embodiment 1 of the present invention.
Fig. 3 is a schematic structural view of the matching between the groove and the supporting pillar in embodiment 1 of the present invention.
Fig. 4 is a schematic structural view of conventional etching in embodiment 1 of the present invention.
Fig. 5 is an exploded view of the vapor chamber according to embodiment 2 of the present invention.
Fig. 6 is a schematic structural view of a copper foam groove in embodiment 2 of the present invention.
Fig. 7 is a schematic structural view of the matching between the groove and the supporting pillar in embodiment 2 of the present invention.
Fig. 8 is a schematic structural view of the second etching in embodiment 2 of the present invention.
Description of reference numerals: 1-upper shell plate; 2-lower shell plate; 3-a support column; 4-copper foam; 5-a groove; 6-sealing the working medium cavity; 7-large column; 8-a heat source; 9-solder paste.
Detailed Description
The technical solution of the present invention will be described in detail below with reference to the following detailed description and accompanying drawings.
Example 1
As shown in fig. 1-4, an ultra-thin asymmetric soaking plate based on foamy copper, includes shell plate 1 and shell plate 2 down, shell plate 1 and the peripheral sealing connection of shell plate 2 down, inside formation seal working medium chamber 6, 1 internal surface of shell plate is provided with support column 3 on, be provided with the foamy copper 4 of upper and lower surface close fitting shell plate 1 and shell plate 2 down in the seal working medium chamber 6, be provided with on the foamy copper 4 and use the 8 centers of heat source as the outside slot 5 that extends of starting point, slot 5 sets up the clearance department between support column 3 to avoid support column 3.
The wall thickness of the upper shell plate 1 is 0.17mm, and the inner surface of the upper shell plate 1 is etched with concave surfaces with regularly arranged support columns 3.
The wall thickness of the lower shell plate 2 is 0.13mm, and concave surfaces corresponding to the upper shell plate 1 are etched on the inner surface of the lower shell plate 2.
The foam copper 4 is arranged in the concave surface of the lower shell plate 2, is fixed with the concave surface of the lower shell plate 2 in a spot welding mode, and is sintered with the lower shell plate 2 into a whole, and the thickness of the foam copper 4 is 0.08 mm.
The sealed working medium cavity 6 is in a vacuum state, and liquid working medium is filled in the cavity.
The grooves 5 far away from the peripheral area of the heat source 8 are branched and extended, so that the grooves 5 are distributed on the whole foam copper 4, the groove width is 1.0mm, a steam channel is provided, and the volume of a steam cavity is further increased. The width of the tail end of the channel of the groove 5 from the outer edge of the foam copper 4 is 2mm, so that the condensation working medium is prevented from being gathered at the tail end of the channel due to the action of no capillary force, and the deformation degree of the foam copper in the grooving processing process is ensured. Utilize the clearance position between upper casing plate 1 and the support column 3 to design the slot trend, the slot 5 on the foam copper 4 forms corresponding relation with the clearance between upper casing plate support column 3 this moment, so, support column 3 can avoid slot 5, and has direct contact surface with foam copper 4, can avoid supporting not enough and the deformation problem that brings like this.
The upper shell plate 1 is etched once, and conventional brazing is adopted between the upper shell plate 1 and the lower shell plate 2: scribble round soldering paste 9 at lower shell plate edge point, burn as an organic wholely with the upper shell plate, support column 3 of 1 etching of upper shell plate combines through the mode of brazing with 5 big posts 7 of 2 etching of lower shell plate, strengthen structural strength, die out the hole site of size unanimity on the spatial position that the foamy copper corresponds simultaneously, make big post can pass the hole site, avoid producing the space and interfere, increase between the upper and lower shell plate that the post is connected and can reduce the risk that the soaking plate appears in the course of the work to a certain extent and swell.
The center of the heat source is the center of the heat source 8 located in the lower shell plate 1.
And the foamy copper 4 is subjected to hydrophilic treatment by adopting magnetron sputtering titanium dioxide plating.
The concave surface of the lower shell plate 2 is chemically constructed into a hydrophilic porous structure; the treatment process of surface coarsening is simple, the cost is low, the problem of insufficient capillary force is solved, meanwhile, materials can be saved, and the soaking plate is lighter and thinner as a whole.
Example 2
As shown in fig. 5-8, an ultra-thin asymmetric soaking plate based on foamy copper, includes shell plate 1 and shell plate 2 down, shell plate 1 and the peripheral sealing connection of shell plate 2 down, inside formation seal working medium chamber 6, 1 internal surface of shell plate is provided with support column 3 on, be provided with the foamy copper 4 of upper and lower surface close fitting shell plate 1 and shell plate 2 down in the seal working medium chamber 6, be provided with on the foamy copper 4 and use the heat source 8 center as the outside slot 5 that extends of starting point, slot 5 sets up the clearance department between support column 3 to avoid support column 3.
The wall thickness of the upper shell plate 1 is 0.13mm, and the inner surface of the upper shell plate 1 is etched with concave surfaces with regularly arranged support columns 3.
The wall thickness of the lower shell plate 2 is 0.12mm, and concave surfaces corresponding to the upper shell plate 1 are etched on the inner surface of the lower shell plate 2.
The foam copper 4 is arranged in the concave surface of the lower shell plate 2, is fixed with the concave surface of the lower shell plate 2 in a spot welding mode, and is sintered with the lower shell plate 2 into a whole, and the thickness of the foam copper 4 is 0.07 mm.
The sealed working medium cavity 6 is in a vacuum state, and liquid working medium is filled in the cavity.
The grooves 5 far away from the peripheral area of the heat source 8 are branched and extended, so that the grooves 5 are distributed on the whole foam copper 4, the groove width is 1.2mm, a steam channel is provided, and the volume of a steam cavity is further increased. The width of the tail end of the channel of the groove 5 from the outer edge of the foam copper 4 is 3mm, so that the condensation working medium is prevented from being gathered at the tail end of the channel due to the action of no capillary force, and the deformation degree of the foam copper in the grooving processing process is ensured. Utilize the clearance position between upper casing plate 1 and the support column 3 to design the slot trend, the slot 5 on the foam copper 4 forms corresponding relation with the clearance between upper casing plate support column 3 this moment, so, support column 3 can avoid slot 5, and has direct contact surface with foam copper 4, can avoid supporting not enough and the deformation problem that brings like this.
The upper shell plate 1 is etched twice, the edge of the upper shell plate 1 is etched for the second time, and the upper shell plate 1 and the lower shell plate 2 form a whole with a sealed working medium cavity 6 through solder paste 9 in a reserved space at the secondary etching position.
The center of the heat source is the center of the heat source 8 located in the lower shell plate 2.
And the foamy copper 4 is subjected to hydrophilic treatment by adopting a thermal oxidation method.
The concave surface of the lower shell plate 2 is roughened by adopting a physical method nanosecond laser processing device to form a continuous capillary structure with a hairy appearance; the treatment process of surface coarsening is simple, the cost is low, the problem of insufficient capillary force is solved, meanwhile, materials can be saved, and the soaking plate is lighter and thinner as a whole.
The utility model discloses a soaking board during operation, working medium evaporation back along each channel to the four sides diffusion, the heat that the working medium of evaporation carried the heat source spreads whole soaking board, and can make the capillary effect of working medium after the condensation through the imbibition core flow back to the continuous circulation of heat source position. The ultrathin soaking plate can effectively solve the heat dissipation problem of the high heat flux density electronic element in a narrow space by utilizing the phase change heat transfer principle, and is particularly suitable for manufacturing the ultrathin soaking plate with the thickness of 0.25-0.35 mm.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention and not for limiting, and although the present invention has been described in detail with reference to the examples, those skilled in the art should understand that the technical solutions of the present invention can be modified or replaced by equivalents without departing from the spirit and scope of the technical solutions of the present invention, which should be covered by the scope of the claims of the present invention.
Claims (10)
1. The utility model provides an ultra-thin asymmetric soaking plate based on foamy copper, includes cope match-plate pattern (1) and lower casing board (2), its characterized in that, go up shell match-plate pattern (1) and lower casing board (2) peripheral sealing connection, inside forms sealed working medium chamber (6), it is provided with support column (3) to go up shell match-plate pattern (1) internal surface, be provided with foamy copper (4) of upper and lower surface hugging closely upper match-plate pattern (1) and lower casing board (2) in sealed working medium chamber (6), be provided with on foamy copper (4) and use heat source (8) center outwards to extend's slot (5) as the starting point, slot (5) set up clearance department between support column (3) to avoid support column (3).
2. The ultra-thin asymmetric soaking plate based on copper foam according to claim 1, characterized in that the wall thickness of the upper shell plate (1) is 0.10-0.20mm, and the inner surface of the upper shell plate (1) is etched with concave surfaces with regularly arranged support columns (3).
3. The ultra-thin asymmetric soaking plate based on copper foam according to claim 1, characterized in that the wall thickness of the lower shell plate (2) is 0.10-0.22mm, and the inner surface of the lower shell plate (2) is etched with a concave surface corresponding to the upper shell plate (1).
4. The ultra-thin asymmetric soaking plate based on the copper foam is characterized in that the copper foam (4) is placed in the concave surface of the lower shell plate (2), is fixed with the concave surface of the lower shell plate (2) in a spot welding mode, and is sintered with the lower shell plate (2) into a whole, and the thickness of the copper foam (4) is 0.06-0.1 mm.
5. The ultra-thin asymmetric soaking plate based on the foamy copper as claimed in claim 1, wherein the sealed working medium cavity (6) is in a vacuum state, and liquid working medium is filled in the cavity.
6. The ultra-thin asymmetric soaking plate based on copper foam is characterized in that the grooves (5) in the peripheral area of the heat source (8) are extended in a branching way, so that the grooves (5) are distributed on the whole copper foam (4), the groove width is gradually increased from 0.5mm to 1.2mm or is fixed, the width is 0.8-1.2mm, and the width of the tail end of each groove (5) from the outer edge of the copper foam (4) is 2-4 mm.
7. Ultra-thin asymmetric soaking plate based on copper foam according to claim 1, characterized in that the upper shell plate (1) is etched once or twice: when the etching is carried out once, the edges of the upper shell plate (1) and the lower shell plate (2) are integrally connected, and the support columns (3) etched on the upper shell plate (1) are combined with the 3-5 large columns (7) etched on the lower shell plate (2) in a brazing mode; when the etching is carried out twice, the edge of the upper shell plate (1) is subjected to secondary etching, and the upper shell plate (1) and the lower shell plate (2) form a whole with a sealed working medium cavity (6) through the soldering paste (9) in a reserved space at the secondary etching position.
8. Ultra-thin asymmetric soaking plate based on copper foam according to claim 1, characterized in that the heat source center is the center of the heat source (8) attached to the lower shell (2).
9. The ultra-thin asymmetric soaking plate based on copper foam according to claim 1, characterized in that the copper foam (4) is hydrophilically treated by magnetron sputtering titanium dioxide or thermal oxidation.
10. The ultra-thin asymmetric soaking plate based on the copper foam according to the claim 3, characterized in that the concave surface of the lower shell plate (2) is subjected to surface roughening treatment by a physical method, a chemical method, an electrochemical method or a thermal oxidation method, wherein the roughened concave surface treated by a physical method nanosecond laser processing device or a plasma machine has a continuous capillary structure with a hairy morphology; the roughened concave surface treated by a chemical or electrochemical method has a hydrophilic porous structure.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020202487.2U CN211860889U (en) | 2020-02-24 | 2020-02-24 | Ultra-thin asymmetric soaking plate based on foamy copper |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202020202487.2U CN211860889U (en) | 2020-02-24 | 2020-02-24 | Ultra-thin asymmetric soaking plate based on foamy copper |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211860889U true CN211860889U (en) | 2020-11-03 |
Family
ID=73248875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202020202487.2U Active CN211860889U (en) | 2020-02-24 | 2020-02-24 | Ultra-thin asymmetric soaking plate based on foamy copper |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211860889U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111194160A (en) * | 2020-02-24 | 2020-05-22 | 北京中石伟业科技无锡有限公司 | Ultra-thin asymmetric soaking plate based on foamy copper |
-
2020
- 2020-02-24 CN CN202020202487.2U patent/CN211860889U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111194160A (en) * | 2020-02-24 | 2020-05-22 | 北京中石伟业科技无锡有限公司 | Ultra-thin asymmetric soaking plate based on foamy copper |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111194160A (en) | Ultra-thin asymmetric soaking plate based on foamy copper | |
| CN215261347U (en) | Temperature equalizing plate | |
| WO2021109175A1 (en) | Thin temperature-equalizing plate | |
| US10876799B2 (en) | Loop heat pipe | |
| CN111536817A (en) | Ultra-thin vapor chamber of gas-liquid channel separation | |
| CN110763061A (en) | Vapor chamber and processing method thereof | |
| CN211860889U (en) | Ultra-thin asymmetric soaking plate based on foamy copper | |
| CN112118711A (en) | Vapor chamber, manufacturing method thereof and electronic equipment | |
| CN209643232U (en) | Center radiator structure | |
| CN110972456A (en) | Ultrathin vapor chamber with composite liquid absorption core structure and manufacturing method thereof | |
| CN111637772A (en) | Ultra-thin vapor chamber with symmetrical structure | |
| CN213244730U (en) | Vapor chamber and electronic apparatus | |
| CN114705071A (en) | Mobile terminal, temperature-uniforming plate and manufacturing method of temperature-uniforming plate | |
| CN215832540U (en) | Ultra-light high-performance copper-aluminum composite soaking plate | |
| CN211297499U (en) | Ultrathin vapor chamber with composite liquid absorption core structure | |
| CN213343091U (en) | Temperature equalization plate and electronic equipment | |
| CN110785054B (en) | Punch forming method for vapor chamber | |
| CN210004837U (en) | heat pipe with improved strength | |
| CN213657611U (en) | Temperature equalizing plate | |
| CN112254558B (en) | Three-dimensional laminated heat pipe and preparation method thereof | |
| CN213028996U (en) | Stainless steel copper plating soaking plate | |
| CN215261346U (en) | Temperature equalizing plate | |
| CN214322184U (en) | Heat radiator with easy welding structure | |
| CN211953819U (en) | Temperature equalizing plate | |
| CN114857967A (en) | Ultrathin soaking plate, preparation method thereof and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |