CN111536817A - Ultra-thin vapor chamber of gas-liquid channel separation - Google Patents
Ultra-thin vapor chamber of gas-liquid channel separation Download PDFInfo
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- CN111536817A CN111536817A CN202010502495.3A CN202010502495A CN111536817A CN 111536817 A CN111536817 A CN 111536817A CN 202010502495 A CN202010502495 A CN 202010502495A CN 111536817 A CN111536817 A CN 111536817A
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- 239000007788 liquid Substances 0.000 title claims abstract description 65
- 238000000926 separation method Methods 0.000 title claims description 15
- 229910052802 copper Inorganic materials 0.000 claims abstract description 61
- 239000010949 copper Substances 0.000 claims abstract description 61
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 59
- 238000002791 soaking Methods 0.000 claims abstract description 36
- 239000006260 foam Substances 0.000 claims abstract description 25
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 claims description 10
- 229910001220 stainless steel Inorganic materials 0.000 claims description 10
- 239000010935 stainless steel Substances 0.000 claims description 10
- 239000010936 titanium Substances 0.000 claims description 10
- 229910052719 titanium Inorganic materials 0.000 claims description 10
- 238000003466 welding Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 9
- 230000002093 peripheral effect Effects 0.000 claims description 9
- 238000007789 sealing Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 238000009792 diffusion process Methods 0.000 claims description 7
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 claims description 6
- 238000005219 brazing Methods 0.000 claims description 6
- 230000003647 oxidation Effects 0.000 claims description 5
- 238000007254 oxidation reaction Methods 0.000 claims description 5
- 238000003486 chemical etching Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 3
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 3
- 238000000053 physical method Methods 0.000 claims description 3
- 239000000126 substance Substances 0.000 claims description 3
- 239000004408 titanium dioxide Substances 0.000 claims description 3
- 238000002848 electrochemical method Methods 0.000 claims description 2
- 230000017525 heat dissipation Effects 0.000 abstract description 3
- 238000004377 microelectronic Methods 0.000 abstract description 2
- 238000005213 imbibition Methods 0.000 description 14
- 238000012546 transfer Methods 0.000 description 7
- 238000010521 absorption reaction Methods 0.000 description 6
- 238000000034 method Methods 0.000 description 6
- 229910000679 solder Inorganic materials 0.000 description 5
- 238000013461 design Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 230000008859 change Effects 0.000 description 2
- 150000001879 copper Chemical class 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000009826 distribution Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000013011 mating Effects 0.000 description 2
- 238000007788 roughening Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 238000010276 construction Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000007246 mechanism Effects 0.000 description 1
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- -1 residual oxides Substances 0.000 description 1
- 230000007704 transition Effects 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/089—Coatings, claddings or bonding layers made from metals or metal alloys
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Sustainable Development (AREA)
- Life Sciences & Earth Sciences (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a soaking plate, in particular to an ultrathin soaking plate with a gas-liquid channel separated. The invention discloses an ultrathin soaking plate with separated gas-liquid channels, which comprises a cover plate and a bottom plate, wherein the peripheries of the cover plate and the bottom plate are hermetically connected to form a sealed working medium cavity, the sealed working medium cavity is in a vacuum state and is filled with a liquid working medium, the inner surface of the cover plate is a concave surface and comprises a first area and a second area, the first area is provided with regularly-arranged support columns, the second area is not provided with support columns and is used for placing a foamy copper liquid absorbing core, the upper surface of the foamy copper liquid absorbing core is tightly attached to the lower surface of the cover plate, and the lower surface of the foamy copper liquid absorbing core is. The thickness of the ultrathin soaking plate is 0.20-0.30 mm, a gap between supporting columns on the inner side of the cover plate is a steam channel, the foam copper liquid absorbing core is a working medium channel, and the two channels are independent from each other, so that the gas-liquid flow resistance can be effectively reduced, and the problem of local high heat flow heat dissipation of a microelectronic device in a limited space is solved.
Description
Technical Field
The invention relates to a soaking plate, in particular to an ultrathin soaking plate with a gas-liquid channel separated.
Background
With the advance of 5G network construction, the functions of 5G terminal equipment are more diversified, the chip needs to cope with complex environmental conditions, and high-temperature problems can be caused by high-speed operation of the chip. When the requirements of high integration, light weight and maximized space utilization of the terminal equipment are simultaneously met, the ultra-thin soaking plate must be considered. Because the internal structure of the soaking plate is fine and variable, and the phase change heat transfer mechanism is very complex, the factors influencing the heat transfer performance are numerous. With the development of the soaking plate towards the trend of ultra-thinness, various design problems need to be comprehensively considered.
Research shows that when the thickness is lower than the critical thickness by 0.3mm, the heat transfer resistance of the steam cavity can be rapidly increased along with the further reduction of the thickness, so that the integral heat transfer performance of the soaking plate is reduced. For the existing ultrathin soaking plate with the thickness of less than 0.3mm, the space is extremely limited, the problem of insufficient thickness of a steam cavity exists, the space distribution of the capillary core and the steam cavity is divided into an upper layer and a lower layer, if the upper layer space of the soaking plate is a steam channel, the lower layer space of the soaking plate is a working medium channel, the thickness of the steam cavity is further reduced by the way of dividing the upper layer and the lower layer, a steam-liquid interface is equivalent to the radial area of the whole soaking plate, the contact area is large, and the gas-liquid flow resistance is large.
Disclosure of Invention
The invention aims to solve the technical problem of providing an ultrathin soaking plate with a gas-liquid channel separated from each other in order to overcome the defects of the prior art. The invention flexibly combines the integral structure design of the soaking plate with the welding technology, provides an ultrathin soaking plate with the thickness of 0.20-0.30 mm, the foamy copper liquid absorbing core is a liquid working medium channel, the gaps between the support columns at the periphery of the foamy copper liquid absorbing core are steam channels which are mutually independent, the gas-liquid flow resistance can be effectively reduced by the left-right separation of the gas-liquid channels, and the steam channels penetrating through the upper cover plate and the lower cover plate can ensure enough thickness in the vertical direction, so that the heat transfer resistance of the steam cavity is obviously reduced, the integral heat resistance of the soaking plate is improved to a certain extent, and the problem of local high heat flow heat dissipation of a microelectronic device in a limited space can be.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides an ultra-thin soaking plate of gas-liquid channel separation, includes apron and bottom plate, apron and the peripheral sealing connection of bottom plate form sealed working medium chamber, and sealed working medium chamber is in the vacuum state, and its intussuseption is filled with liquid working medium, the apron internal surface is the concave surface, and including first region and second region, wherein the first region is provided with the support column that the rule was arranged, and the second region does not set up the support column, is used for placing foamy copper imbibition core, the upper surface of foamy copper imbibition core and the lower surface of apron closely laminate, and the lower surface of foamy copper imbibition core and the upper surface of bottom plate closely laminate.
The wall thickness of the cover plate is 0.13-0.20mm, the wall surface material is made of stainless steel or titanium, and the inner wall is plated with copper.
The wall thickness of the bottom plate is 0.07-0.12mm, the wall surface material is made of stainless steel or titanium, the inner wall is plated with copper, and the inner surface of the bottom plate is roughened.
The concave surface and the supporting columns of the inner surface of the cover plate are formed by a chemical corrosion mode, and the supporting columns comprise small columns and long columns.
The thickness of the copper foam liquid absorbing core is 0.07-0.15mm, the shape of the copper foam liquid absorbing core is matched with that of the second area, and the copper foam liquid absorbing core penetrates through the plane of the soaking plate on the premise that the heat source is ensured to have enough liquid absorbing core.
And performing hydrophilic treatment on the foamy copper liquid absorbing core by adopting a magnetron sputtering titanium dioxide plating method, a thermal oxidation method or a plasma cleaning method.
When the inner surface of the bottom plate is roughened, a continuous capillary structure with a hairy shape is formed on the inner surface of the bottom plate by adopting a physical method.
When the inner surface of the bottom plate is roughened, a hydrophilic porous structure is formed on the inner surface of the bottom plate by adopting a chemical or electrochemical method.
The cover plate and the bottom plate are in peripheral sealing connection in a brazing mode, and the inner surface of the bottom plate is of a structure with a high center and a low periphery.
The cover plate and the bottom plate are connected in a peripheral sealing mode through diffusion welding, the inner surface of the bottom plate is provided with a micro channel, and the inner side surface of the bottom plate and the support columns are combined into a whole through the diffusion welding mode.
Compared with the prior art, the invention has the following advantages:
(1) the inner surface of the cover plate is provided with a plurality of support columns in an array manner, each support column comprises a plurality of small cylinders and a long column, and the long column strengthens the support and simultaneously generates a certain flow guide effect on flowing steam. Wherein, the apron medial part regional support column-free arranges for placing the copper foam imbibition core, and the copper foam imbibition core of certain thickness sets up in the space that the inboard support column-free of apron arranged, for guaranteeing sufficient capillary force, the imbibition core can increase axial thickness when reducing radial area, and the shape of copper foam imbibition core carries out the flexible design according to heat source position and the whole shape of soaking plate.
(2) The gaps between the supporting columns on the inner side of the cover plate are steam channels, the foam copper liquid absorption cores are working medium channels, and the steam channels and the working medium channels are mutually independent, so that the gas-liquid flow resistance can be effectively reduced.
(3) The distribution difference of the thickness of the cover plate and the bottom plate is more obvious, the cover plate is thickened, the thickness of the steam cavity is increased, and the heat transfer resistance of the steam cavity can be effectively reduced; the wall materials of the cover plate and the bottom plate are copper or stainless steel or titanium, the inner wall adopts a copper plating treatment mode, the strength of the plate body can be ensured by the stainless steel or the titanium, and the hydrophilicity of the wall surface can be ensured by the copper plating on the inner side.
(4) According to the invention, hydrophilic treatment is carried out on the foamy copper liquid absorbing core, titanium dioxide is plated by magnetron sputtering, a thermal oxidation method or plasma cleaning is adopted, and the hydrophilicity of the foamy copper is enhanced; and micro-channel etching is carried out on the inner surface of the bottom plate, and the copper foam is matched to form a composite liquid absorption core structure, so that the capillary force is effectively enhanced.
(5) According to the invention, the skirt edge etching is carried out on the bottom plate, a solder paste space is reserved, the thickness required by the solder paste can be effectively saved, the skirt edge etching bottom plate and the cover plate are combined into a whole in a brazing mode, and when the bottom plate is etched without the skirt edge, a diffusion welding mode is adopted, so that the method is efficient and simple, and the integral strength is more ensured.
Drawings
FIG. 1 is an exploded view of the structure of an ultra-thin vapor chamber with separated liquid channels according to example 1 of the present invention.
Figure 2 is a schematic diagram of the mating structure of a copper foam wick and cover plate according to example 1 of the present invention.
FIG. 3 is a schematic view of a brazing structure of a cap plate and a base plate according to example 1 of the present invention.
FIG. 4 is an exploded view of the structure of the ultra-thin soaking plate with separated liquid channels in example 2 of the present invention.
Figure 5 is a schematic diagram of the mating structure of a copper foam wick and cover plate according to example 2 of the present invention.
FIG. 6 is a schematic view of a brazing structure of a cap plate and a base plate according to example 2 of the present invention.
In the figure: 1-cover plate; 2-a bottom plate; 3-a copper foam wick; 4-solder paste; 10-a first region; 11-a second region; 101-a support column; 1011-small cylinder; 1012-Long bars.
Detailed Description
The following detailed description of the invention refers to the accompanying drawings.
Example 1
As shown in fig. 1-2, an ultra-thin soaking plate of gas-liquid channel separation, including apron 1 and bottom plate 2, apron 1 and the peripheral sealing connection of bottom plate 2 form sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium water, 1 internal surface of apron is the concave surface, including first region 10 and second region 11, and wherein first region 10 sets up the support column 101 of regularly arranging, and second region 11 does not set up support column 101 for place foamy copper imbibition core 3, the upper surface of foamy copper imbibition core 3 and the lower surface of apron 1 closely laminate, and the lower surface of foamy copper imbibition core 3 and the upper surface of bottom plate 2 closely laminate.
The wall thickness of the cover plate 1 is 0.18mm, the wall surface material is made of stainless steel, copper plating is carried out on the inner wall, the strength of the plate body can be guaranteed by the stainless steel or titanium, and the hydrophilicity of the wall surface is guaranteed by copper plating on the inner side.
The wall thickness of the bottom plate 2 is 0.07mm, the wall surface material is made of stainless steel, the inner wall is plated with copper, and the inner surface of the bottom plate 2 is roughened.
The concave surface of the inner surface of the cover plate 1 and the support columns 101 are formed by chemical etching, the concave surface is used as a steam cavity, the support columns are used for providing support strength, the support columns 101 comprise small columns 1011 and long columns 1012, and the long columns 1012 are located on the periphery.
The thickness of the foam copper liquid absorption core 3 is 0.12mm, the shape of the foam copper liquid absorption core 3 is F-shaped and is matched with the shape of the second area 11, and the foam copper liquid absorption core 3 penetrates through the plane of the soaking plate on the premise that the heat source is ensured to have enough liquid absorption cores. The foamy copper liquid absorbing core 3 is preliminarily fixed on the concave surface of the cover plate in a spot welding mode, and is subsequently sintered with the base plate into a whole.
When the inner surface of the bottom plate 2 is roughened, a continuous capillary structure with a hairy shape is formed on the inner surface of the bottom plate 2 by adopting a physical method.
As shown in fig. 3, the cover plate 1 and the base plate 2 are connected in a peripheral sealing manner by brazing, the inner surface of the base plate 2 is of a structure with a high center and a low periphery, a circle of the periphery of the base plate is etched to leave a solder paste space, and a circle of solder paste 4 is dotted on the etched periphery of the base plate and is fired with the upper cover plate into a whole.
Example 2
As shown in fig. 4-5, an ultra-thin soaking plate of gas-liquid channel separation, including apron 1 and bottom plate 2, apron 1 and the peripheral sealing connection of bottom plate 2 form sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium water, 1 internal surface of apron is the concave surface, including first region 10 and second region 11, and wherein first region 10 sets up the support column 101 of regularly arranging, and second region 11 does not set up support column 101 for place foamy copper imbibition core 3, the upper surface of foamy copper imbibition core 3 and the lower surface of apron 1 closely laminate, and the lower surface of foamy copper imbibition core 3 and the upper surface of bottom plate 2 closely laminate.
The wall thickness of the cover plate 1 is 0.15mm, the wall surface material is made of titanium, copper plating treatment is carried out on the inner wall, the strength of the plate body can be guaranteed through stainless steel or titanium, and the hydrophilicity of the wall surface is guaranteed through copper plating on the inner side.
The wall thickness of the bottom plate 2 is 0.08mm, the wall surface material is made of titanium, the inner wall is plated with copper, and the inner surface of the bottom plate 2 is roughened.
The concave surface of the inner surface of the cover plate 1 and the support columns 101 are formed by chemical etching, the concave surface is used as a steam cavity, the support columns are used for providing support strength, the support columns 101 comprise small circular columns 1011 and long circular columns 1012, and the long circular columns 1012 are located on the periphery.
The thickness of copper foam liquid absorbing core 3 is 0.10mm, and the shape of copper foam liquid absorbing core 3 is F shape, and is suitable for with the shape in second region 11, under the prerequisite that guarantees that there is enough liquid absorbing core in heat source department, copper foam liquid absorbing core 3 runs through in the soaking plate plane. The foamy copper liquid absorbing core 3 is preliminarily fixed on the concave surface of the cover plate in a spot welding mode, and is subsequently sintered with the base plate into a whole.
When the inner surface of the base plate 2 is roughened, a hydrophilic porous structure is formed on the inner surface of the base plate 2 by a thermal oxidation method: and immersing the copper sheet into a roughening treatment liquid for roughening treatment, removing impurities such as residual oxides, oil stains and the like on the surface of the copper sheet after oxidation is completed, and placing the copper sheet in an oven for drying to obtain a roughened surface.
As shown in fig. 6, when the cover plate 1 and the bottom plate 2 are connected by diffusion welding to achieve peripheral sealing, microchannels are etched on the inner surface of the bottom plate 2, the inner side surface of the bottom plate 2 and the support columns 101 are integrated by diffusion welding, and the microchannels are used for enhancing the capillary force in the soaking plate.
Inside the soaking plate, liquid working medium exists in foamy copper or microchannel, and when the start work, liquid working medium is heated and evaporates and forms steam, and steam flows along the space between the support column, and the heat spreads the heat source distal end, and the liquid working medium of formation after the steam condensation flows back to the heat source position through the capillary effect of imbibition core, and the continuous circulation of so, this ultra-thin soaking plate utilizes the phase transition heat transfer principle can effectively solve narrow and small space high heat flux density electronic component's heat dissipation problem.
The above description is only for the preferred embodiment of the present invention, and is not intended to limit the present invention in any way. Any simple modification, change and equivalent changes of the above embodiments according to the principles of the present invention are still within the protection scope of the technical solution of the present invention.
Claims (10)
1. The utility model provides an ultra-thin soaking plate of gas-liquid channel separation, includes apron (1) and bottom plate (2), its characterized in that, apron (1) and bottom plate (2) peripheral sealing connection form sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium, apron (1) internal surface is the concave surface, including first region (10) and second region (11), wherein first region (10) set up support column (101) of regularly arranging, and second region (11) do not set up support column (101), are used for placing foam copper wick (3), the upper surface of foam copper wick (3) closely laminates with the lower surface of apron (1), and the lower surface of foam copper wick (3) closely laminates with the upper surface of bottom plate (2).
2. The ultra-thin soaking plate for gas-liquid channel separation according to claim 1, wherein the wall thickness of the cover plate (1) is 0.13-0.20mm, the wall material is made of stainless steel or titanium, and the inner wall is plated with copper.
3. The ultra-thin soaking plate for gas-liquid channel separation according to claim 1, wherein the wall thickness of the bottom plate (2) is 0.07-0.12mm, the wall material is made of stainless steel or titanium, the inner wall is plated with copper, and the inner surface of the bottom plate (2) is roughened.
4. The ultra-thin vapor chamber for gas-liquid channel separation according to claim 1, wherein the concave surface of the inner surface of the cover plate (1) and the supporting columns (101) are formed by means of chemical etching, and the supporting columns (101) comprise small columns (1011) and long columns (1012).
5. The ultrathin vapor chamber for separating gas-liquid channels according to claim 1, wherein the thickness of the copper foam liquid absorbing core (3) is 0.07-0.15mm, the shape of the copper foam liquid absorbing core (3) is matched with that of the second region (11), and the copper foam liquid absorbing core (3) penetrates through the plane of the vapor chamber on the premise of ensuring that enough liquid absorbing core exists at the heat source.
6. The ultra-thin soaking plate for gas-liquid channel separation according to claim 1, characterized in that the copper foam wick (3) is subjected to hydrophilic treatment by magnetron sputtering titanium dioxide plating, thermal oxidation or plasma cleaning.
7. The ultra-thin soaking plate for gas-liquid channel separation according to claim 3, characterized in that the inner surface of the bottom plate (2) is roughened by a physical method to form a continuous capillary structure having a hairy morphology on the inner surface of the bottom plate (2).
8. The ultra-thin vapor chamber for gas-liquid channel separation according to claim 3, wherein the inner surface of the base plate (2) is roughened to form a hydrophilic porous structure on the inner surface of the base plate (2) by a chemical or electrochemical method.
9. The ultra-thin soaking plate for gas-liquid channel separation according to claim 1, wherein the cover plate (1) and the bottom plate (2) are connected in a peripheral sealing manner by brazing, and the inner surface of the bottom plate (2) is of a structure with a high center and a low periphery.
10. The ultra-thin soaking plate for gas-liquid channel separation according to claim 1, wherein the cover plate (1) and the bottom plate (2) are peripherally and hermetically connected by means of diffusion welding, the inner surface of the bottom plate (2) is provided with the micro-channel (20), and the inner side surface of the bottom plate (2) and the support column (101) are integrated by means of diffusion welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010502495.3A CN111536817A (en) | 2020-06-04 | 2020-06-04 | Ultra-thin vapor chamber of gas-liquid channel separation |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010502495.3A CN111536817A (en) | 2020-06-04 | 2020-06-04 | Ultra-thin vapor chamber of gas-liquid channel separation |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113606970A (en) * | 2021-07-27 | 2021-11-05 | 华南理工大学 | Ultrathin soaking plate and preparation method thereof |
| CN113873858A (en) * | 2021-11-30 | 2021-12-31 | 荣耀终端有限公司 | Housing and electronic device |
| WO2022067980A1 (en) * | 2020-09-30 | 2022-04-07 | 瑞声声学科技(深圳)有限公司 | Vapor chamber |
| CN116406140A (en) * | 2023-04-27 | 2023-07-07 | 华南理工大学 | Inflation type phase change device, heat dissipation system and electronic equipment |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040015886A (en) * | 2002-08-14 | 2004-02-21 | 엘지전선 주식회사 | Heat Diffuser With Simple Wick Structure |
| CN105307452A (en) * | 2014-07-01 | 2016-02-03 | 江苏格业新材料科技有限公司 | Manufacturing method of ultra-thin soaking plate employing heat sink materials as bottom plate |
| TW201837414A (en) * | 2017-04-10 | 2018-10-16 | 華碩電腦股份有限公司 | Heat Spreader and Heat Dissipation Assembly Using the Heat Spreader |
| CN212658106U (en) * | 2020-06-04 | 2021-03-05 | 北京中石伟业科技无锡有限公司 | Ultra-thin vapor chamber of gas-liquid channel separation |
-
2020
- 2020-06-04 CN CN202010502495.3A patent/CN111536817A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR20040015886A (en) * | 2002-08-14 | 2004-02-21 | 엘지전선 주식회사 | Heat Diffuser With Simple Wick Structure |
| CN105307452A (en) * | 2014-07-01 | 2016-02-03 | 江苏格业新材料科技有限公司 | Manufacturing method of ultra-thin soaking plate employing heat sink materials as bottom plate |
| TW201837414A (en) * | 2017-04-10 | 2018-10-16 | 華碩電腦股份有限公司 | Heat Spreader and Heat Dissipation Assembly Using the Heat Spreader |
| CN212658106U (en) * | 2020-06-04 | 2021-03-05 | 北京中石伟业科技无锡有限公司 | Ultra-thin vapor chamber of gas-liquid channel separation |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022067980A1 (en) * | 2020-09-30 | 2022-04-07 | 瑞声声学科技(深圳)有限公司 | Vapor chamber |
| CN113606970A (en) * | 2021-07-27 | 2021-11-05 | 华南理工大学 | Ultrathin soaking plate and preparation method thereof |
| CN113873858A (en) * | 2021-11-30 | 2021-12-31 | 荣耀终端有限公司 | Housing and electronic device |
| CN113873858B (en) * | 2021-11-30 | 2022-04-22 | 荣耀终端有限公司 | Housing and electronic device |
| CN116406140A (en) * | 2023-04-27 | 2023-07-07 | 华南理工大学 | Inflation type phase change device, heat dissipation system and electronic equipment |
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