CN111637772A - Ultra-thin vapor chamber with symmetrical structure - Google Patents
Ultra-thin vapor chamber with symmetrical structure Download PDFInfo
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- CN111637772A CN111637772A CN202010602350.0A CN202010602350A CN111637772A CN 111637772 A CN111637772 A CN 111637772A CN 202010602350 A CN202010602350 A CN 202010602350A CN 111637772 A CN111637772 A CN 111637772A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F21/00—Constructions of heat-exchange apparatus characterised by the selection of particular materials
- F28F21/08—Constructions of heat-exchange apparatus characterised by the selection of particular materials of metal
- F28F21/081—Heat exchange elements made from metals or metal alloys
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- General Engineering & Computer Science (AREA)
- Life Sciences & Earth Sciences (AREA)
- Sustainable Development (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention relates to a soaking plate, in particular to an ultrathin soaking plate with a symmetrical structure. The ultrathin soaking plate with the symmetrical structure comprises an upper cover plate and a lower cover plate, wherein the peripheries of the upper cover plate and the lower cover plate are connected in a sealing mode to form a sealing working medium cavity, the sealing working medium cavity is in a vacuum state and is filled with a liquid working medium, the upper cover plate and the lower cover plate are symmetrically arranged, the inner surfaces of the upper cover plate and the lower cover plate are both concave surfaces, the concave surfaces comprise a first area and a second area, the first area is provided with support columns which are regularly arranged, the second area is provided with a foamy copper liquid absorbing core, the upper surface of the foamy copper liquid absorbing core is tightly attached to the lower surface of the upper cover plate, and the. The vapor chamber has the thickness of 0.20-0.30mm and symmetrical structure, the upper cover plate and the lower cover plate can be used as a condensation surface or an evaporation surface, the peripheries of the upper cover plate and the lower cover plate and the support columns are welded into a whole, and the rigidity and the compressive (tensile) strength of the chamber of the vapor chamber can be effectively improved.
Description
Technical Field
The invention relates to a soaking plate, in particular to an ultrathin soaking plate with a symmetrical structure.
Background
The soaking plate is used as a high-efficiency phase change heat transfer element and is widely applied to various electronic devices needing heat dissipation. With the development of the soaking plate towards the trend of ultra-thinness, various design problems need to be comprehensively considered. For the design of the existing vapor chamber, the design guiding ideas of an upper cover plate and a lower cover plate are different, and usually, a plurality of support columns are arranged on the inner concave surface of the upper cover plate, so that a steam channel is formed while structural support is provided; the concave surface in the lower cover plate is used for placing a capillary core, storing liquid and providing a working medium return channel. In the use process, the lower cover plate is taken as an evaporation end to be attached to the chip, and the upper cover plate is taken as a condensation end. The structure for distinguishing the upper cover plate from the lower cover plate brings certain workload in the design, manufacture and use stages, and the thickness of the soaking plate is difficult to further reduce.
Disclosure of Invention
The invention aims to solve the technical problem of providing an ultrathin soaking plate with a symmetrical structure aiming at the defects of the prior art. The vapor chamber has symmetrical structure, the thickness is 0.20-0.30mm, the problem of local high heat flow heat dissipation of microelectronic devices in a limited space can be effectively solved, the vapor chamber has the same design as the upper and lower cover plates, namely the upper and lower cover plates can be used as condensation surfaces or evaporation surfaces, the peripheries of the upper and lower cover plates and the support columns are integrated through diffusion welding, the rigidity and the compression (pull) strength of the cavity of the vapor chamber can be effectively improved, the vapor chamber is symmetrical up and down, the structure is simple, and the integral structural stability of the vapor chamber is better.
In order to solve the technical problems, the invention adopts the following technical scheme: the utility model provides an ultra-thin soaking plate of structural symmetry, includes upper cover plate and lower apron, and the sealed working medium chamber of two peripheral sealing connection formation, sealed working medium chamber are in vacuum state, and its intussuseption is filled with liquid working medium, upper cover plate and lower apron symmetry set up, and the internal surface of upper cover plate and lower apron is the concave surface, includes first region and second region in the concave surface, first region is provided with the support column of regular arrangement, and the foamy copper imbibition core is placed to the second region, the upper surface of foamy copper imbibition core closely laminates with the lower surface of upper cover plate, and the upper surface of lower surface and lower apron closely laminates.
The wall thickness of the upper cover plate and the wall thickness of the lower cover plate are both 0.1-0.15mm, the wall materials are copper, stainless steel or titanium, and the inner surfaces of the upper cover plate and the lower cover plate are rough surfaces.
A plurality of regularly-arranged support columns are etched in the first areas of the upper cover plate and the lower cover plate, and each support column comprises a circular support column and an oblong support column.
The thickness of foamy copper wick is 0.1-0.2mm, is the sum of upper cover plate and lower cover plate second area thickness, and the shape of foamy copper wick sets up according to heat source position and the whole shape of soaking plate is nimble, under the prerequisite of guaranteeing that there is enough wick in heat source department, and foamy copper wick runs through in the soaking plate plane.
The periphery of the upper cover plate and the periphery of the lower cover plate are combined with the inner supporting columns into a whole in a diffusion welding mode.
The copper foam liquid absorption core is subjected to hydrophilic treatment by adopting a magnetron sputtering method, a thermal oxidation method or a plasma cleaning method.
The rough surfaces of the upper cover plate and the lower cover plate are continuous capillary structures with hairy shapes formed on the inner surfaces by adopting a physical method.
The rough surfaces of the upper cover plate and the lower cover plate are hydrophilic porous structures formed on the inner surfaces by a chemical or electrochemical method.
The rough surfaces of the upper cover plate and the lower cover plate are formed by a thermal oxidation method.
Compared with the prior art, the invention has the following advantages:
(1) the inner surface of the upper cover plate of the soaking plate is provided with a concave surface and comprises a first area and a second area, the first area is provided with a plurality of supporting columns in an array mode and comprises circular supporting columns and long circular supporting columns, the long circular supporting columns strengthen the supporting and simultaneously generate a certain flow guiding effect on steam, and the second area is not provided with the supporting columns and is used for placing a foam copper liquid absorption core.
(2) The lower cover plate and the upper cover plate of the soaking plate are consistent in design concept and thickness, an up-and-down symmetrical structure is formed in the layout, a concave surface is arranged on the inner surface of the lower cover plate, the lower cover plate comprises a first area and a second area, a plurality of supporting columns are arrayed in the first area, the supporting columns comprise circular supporting columns and long circular supporting columns, the long circular supporting columns strengthen the supporting and generate a certain flow guiding effect on steam, and the second area is not provided with the supporting columns and used for placing a foam copper liquid absorption core.
(3) The copper foam liquid absorbing core with a certain thickness is arranged in the second area in the concave surface of the upper cover plate and the lower cover plate, the upper surface of the copper foam liquid absorbing core is tightly attached to the lower surface of the upper cover plate, the lower surface of the copper foam liquid absorbing core is tightly attached to the upper surface of the lower cover plate, the thickness of the copper foam is the sum of the thicknesses of the upper cover plate and the second area of the lower cover plate, the copper foam has a larger thickness compared with the conventional design at the moment, the volume loss caused by the reduction of the radial area can be compensated, and the sufficient capillary force.
(4) The gaps between the support columns in the first area in the concave surfaces of the upper cover plate and the lower cover plate are steam channels, the foam copper liquid absorption cores in the second area are working medium channels, and the steam channels and the working medium channels are independent from each other, so that the gas-liquid flow resistance can be effectively reduced.
(5) The wall materials of the upper cover plate and the lower cover plate are copper, stainless steel or titanium. When the material is stainless steel or titanium, the inner wall adopts a copper plating treatment mode, the strength of the plate body can be ensured by the stainless steel or titanium, and the hydrophilicity of the wall surface is ensured by the copper plating on the inner side.
(6) And performing hydrophilic treatment on the foamy copper liquid absorbing core by adopting methods such as magnetron sputtering titanium dioxide plating, thermal oxidation method or plasma cleaning and the like, thereby enhancing the hydrophilicity of the foamy copper liquid absorbing core.
(7) The combination of the upper cover plate and the lower cover plate adopts diffusion welding: the peripheries of the upper cover plate and the lower cover plate and the supporting columns are integrated through diffusion welding, so that the rigidity and the compressive (tensile) strength of the cavity of the vapor chamber can be effectively improved.
Drawings
Fig. 1 is an exploded view of the vapor chamber in embodiment 1 of the present invention.
Figure 2 is a schematic diagram of the relative position of the copper foam wick and upper cover plate in example 1 of the present invention.
Fig. 3 is a schematic view of the solder bonding of the soaking plate in embodiment 1 of the present invention.
Figure 4 is a schematic diagram of the relative position of the copper foam wick and upper cover plate in example 3 of the present invention.
Description of reference numerals: 1-upper cover plate; 2-lower cover plate; 3-a copper foam wick; 10-a first region; 11-a second region; 101-a support column; 101A-circular support column; 101B-oblong support columns.
Detailed Description
The following detailed description of the invention refers to the accompanying drawings.
Example 1
As shown in fig. 1, an ultra-thin soaking plate of structure symmetry, including upper cover plate 1 and lower apron 2, the peripheral sealing connection of the two forms sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium, upper cover plate 1 and the symmetrical setting of lower apron 2, the internal surface of upper cover plate 1 and lower apron 2 is the concave surface, includes first region 10 and second region 11 in the concave surface, first region 10 sets up the support column 101 of regularly arranging, and second region 11 does not set up support column 101, is used for placing foamy copper wick 3, the upper surface of wick foamy copper wick 3 closely laminates with the lower surface of upper cover plate 1, and the upper surface of lower surface and lower apron 2 closely laminates.
The wall thickness of upper cover plate 1 and lower cover plate 2 is 0.1mm, and the wall material is titanium, and the inner wall copper facing to the internal surface of upper cover plate 1 and lower cover plate 2 is rough surface, and plate body intensity can be guaranteed to titanium, and the hydrophilicity of wall has been guaranteed to inboard copper facing.
The first areas 10 of the upper cover plate 1 and the lower cover plate 2 are etched with a plurality of regularly arranged support columns 101 in a chemical corrosion mode, each support column 101 comprises a circular support column 101A and an oblong support column 101B, and the oblong support columns 101B are arranged on the periphery of the upper cover plate 1 and the periphery of the lower cover plate 2 and play a certain role in guiding steam while strengthening support.
The thickness of the copper foam liquid absorption core 3 is 0.1mm, which is the sum of the thicknesses of the second areas 11 of the upper cover plate 1 and the lower cover plate 2, and the shape of the copper foam liquid absorption core 3 is S.
The peripheries of the upper cover plate 1 and the lower cover plate 2 are combined with the inner supporting columns 101 into a whole in a diffusion welding mode.
The foamy copper liquid absorbing core 3 is subjected to hydrophilic treatment by plating titanium dioxide by a magnetron sputtering method, is preliminarily fixed on the concave surface of the lower cover plate 2 in a spot welding mode, and is subsequently sintered with the lower cover plate into a whole.
The rough surfaces of the upper cover plate 1 and the lower cover plate 2 are continuous capillary structures with hairy shapes formed on the inner surfaces by adopting a physical method.
Example 2
The utility model provides an ultra-thin soaking plate of structural symmetry, includes upper cover plate 1 and lower apron 2, and the peripheral sealing connection of the two forms sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium, upper cover plate 1 sets up with 2 symmetries of lower apron, and the internal surface of upper cover plate 1 and lower apron 2 is the concave surface, includes first region 10 and second region 11 in the concave surface, first region 10 sets up the support column 101 of regularly arranging, and second region 11 does not set up support column 101, is used for placing foamy copper imbibition core 3, the upper surface of foamy copper imbibition core 3 closely laminates with the lower surface of upper cover plate 1, and the lower surface closely laminates with the upper surface of lower apron 2.
The thickness of upper cover plate 1 and lower cover plate 2 is 0.12mm, and the wall material is the stainless steel, and the inner wall copper-plating to the internal surface of upper cover plate 1 and lower cover plate 2 is rough surface, and the plate body intensity can be guaranteed to the stainless steel, and the hydrophilicity of wall has been guaranteed to inboard copper-plating.
The first areas 10 of the upper cover plate 1 and the lower cover plate 2 are etched with a plurality of regularly arranged support columns 101 in a chemical corrosion mode, each support column 101 comprises a circular support column 101A and an oblong support column 101B, and the oblong support columns 101B are arranged on the periphery of the upper cover plate 1 and the periphery of the lower cover plate 2 and play a certain role in guiding steam while strengthening support.
The thickness of the copper foam liquid absorbing core 3 is 0.14mm, which is the sum of the thicknesses of the second areas 11 of the upper cover plate 1 and the lower cover plate 2, and the shape of the copper foam liquid absorbing core 3 is S.
The peripheries of the upper cover plate 1 and the lower cover plate 2 are combined with the inner supporting columns 101 into a whole in a diffusion welding mode.
The foamy copper liquid absorbing core 3 is subjected to hydrophilic treatment by adopting a thermal oxidation method, is preliminarily fixed on the concave surface of the lower cover plate 2 in a spot welding mode, and is subsequently sintered with the lower cover plate into a whole.
The rough surfaces of the upper cover plate 1 and the lower cover plate 2 are hydrophilic porous structures formed on the inner surfaces by an electrochemical method.
Example 3
As shown in fig. 4, an ultra-thin soaking plate of structure symmetry, including upper cover plate 1 and lower apron 2, the peripheral sealing connection of the two forms sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium, upper cover plate 1 and the symmetrical setting of lower apron 2, the internal surface of upper cover plate 1 and lower apron 2 is the concave surface, includes first region 10 and second region 11 in the concave surface, first region 10 sets up the support column 101 of regularly arranging, and second region 11 does not set up support column 101, is used for placing foamy copper wick 3, the upper surface of wick foamy copper wick 3 closely laminates with the lower surface of upper cover plate 1, and the upper surface of lower surface and lower apron 2 closely laminates.
The wall thickness of the upper cover plate 1 and the wall thickness of the lower cover plate 2 are both 0.15mm, the wall materials are both copper, and the inner surfaces of the upper cover plate 1 and the lower cover plate 2 are rough surfaces.
The first areas 10 of the upper cover plate 1 and the lower cover plate 2 are etched with a plurality of regularly arranged support columns 101 in a chemical corrosion mode, each support column 101 comprises a circular support column 101A and an oblong support column 101B, and the oblong support columns 101B are arranged on the periphery of the upper cover plate 1 and the periphery of the lower cover plate 2 and play a certain role in guiding steam while strengthening support.
The thickness of the copper foam liquid absorption core 3 is 0.18mm, which is the sum of the thicknesses of the second areas 11 of the upper cover plate 1 and the lower cover plate 2, and the shape of the copper foam liquid absorption core 3 is E-shaped.
The peripheries of the upper cover plate 1 and the lower cover plate 2 are combined with the supporting columns 101 into a whole in a diffusion welding mode.
The foamy copper liquid absorbing core 3 is subjected to hydrophilic treatment by adopting a plasma cleaning method, is preliminarily fixed on the concave surface of the lower cover plate 2 in a spot welding mode, and is subsequently sintered with the lower cover plate into a whole.
The upper cover plate 1 and the lower cover plate 2 form rough surfaces by adopting a thermal oxidation method, the upper cover plate 1 and the lower cover plate 2 are immersed into the roughening treatment liquid for 2-10 min, impurities such as residual oxides and oil stains on the copper surface are removed after oxidation is completed, and the copper surface is placed in an oven to be dried to obtain the roughened surfaces.
To further enhance the capillary force, microchannels may be etched in the second regions 11 of the upper and lower cover plates 1, 2, which microchannels form with the copper foam wick 3 a composite wick structure that enhances capillary force.
And aligning and buckling the upper shell plate and the lower shell plate of the sintered liquid absorption core structure, putting the upper shell plate and the lower shell plate into a diffusion welding fixture for locking, and putting the upper shell plate and the lower shell plate into a high-temperature reducing atmosphere furnace for welding and forming. At the moment, the peripheries of the upper cover plate and the lower cover plate are tightly connected with the support columns through diffusion welding, so that the rigidity and the compressive (tensile) strength of the cavity of the vapor chamber can be effectively improved.
Inside the soaking plate, liquid working medium exists in the foam copper or the micro-channel, when the soaking plate starts to work, the liquid working medium is heated and evaporated to form steam, the steam flows along the channel between the supporting columns, and heat is diffused to the far end of the heat source. The liquid working medium formed after the steam condensation flows back to the position of the heat source through the capillary action of the liquid absorption core, and the liquid working medium circulates continuously in this way.
It will be understood by those skilled in the art that the foregoing is merely a preferred embodiment of the present invention, and is not intended to limit the invention, and that any modification, equivalent replacement, or improvement made within the spirit and principle of the present invention should be included within the scope of the present invention.
Claims (9)
1. The utility model provides an ultra-thin soaking plate of structural symmetry, includes upper cover plate (1) and lower apron (2), and the peripheral sealing connection of the two forms sealed working medium chamber, and sealed working medium chamber is in vacuum state, and its intussuseption is filled with liquid working medium, a serial communication port, upper cover plate (1) and lower apron (2) symmetry set up, and the internal surface of upper cover plate (1) and lower apron (2) is the concave surface, includes first region (10) and second region (11) in the concave surface, first region (10) are provided with support column (101) of regularly arranging, and foam liquid absorption core copper (3) are placed in second region (11), the upper surface of foam liquid absorption core copper (3) closely laminates with the lower surface of upper cover plate (1), and the upper surface of lower apron (2) closely laminates.
2. The ultra-thin soaking plate with symmetrical structure according to claim 1, characterized in that the wall thickness of the upper cover plate (1) and the lower cover plate (2) is 0.1-0.15mm, the wall materials are copper, stainless steel or titanium, and the inner surfaces of the upper cover plate (1) and the lower cover plate (2) are rough surfaces.
3. The structurally symmetric ultrathin vapor chamber according to claim 1, characterized in that the first areas (10) of the upper cover plate (1) and the lower cover plate (2) are etched with a plurality of regularly arranged support columns (101), and the support columns (101) comprise circular support columns (101A) and oblong support columns (101B).
4. The ultra-thin soaking plate with the symmetrical structure according to claim 1, wherein the thickness of the foamy copper liquid absorbing core (3) is 0.1-0.2mm, which is the sum of the thicknesses of the upper cover plate (1) and the second area (11) of the lower cover plate (2), the shape of the foamy copper liquid absorbing core (3) is flexibly arranged according to the position of a heat source and the overall shape of the soaking plate, and the foamy copper liquid absorbing core (3) penetrates through the plane of the soaking plate on the premise that enough liquid absorbing cores are arranged at the position of the heat source.
5. The ultra-thin soaking plate with symmetrical structure according to claim 1, characterized in that the peripheries of the upper cover plate (1) and the lower cover plate (2) and the inner supporting columns (101) are integrated by means of diffusion welding.
6. Ultra-thin soaking plate with symmetrical structure according to claim 1, characterized in that the copper foam wick (3) is hydrophilically treated by magnetron sputtering, thermal oxidation or plasma cleaning.
7. Ultra-thin soaking plate with symmetrical structure according to claim 2, characterized in that the rough surface of the upper cover plate (1) and the lower cover plate (2) is a continuous capillary structure with hairy morphology formed on the inner surface by physical method.
8. The ultra-thin vapor chamber for gas-liquid channel separation according to claim 2, wherein the roughened surfaces of the upper and lower cover plates (1, 2) are hydrophilic porous structures formed on the inner surfaces by a chemical or electrochemical method.
9. The ultra-thin vapor chamber for gas-liquid channel separation according to claim 2, wherein the roughened surfaces of the upper cover plate (1) and the lower cover plate (2) are formed by a thermal oxidation method.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202010602350.0A CN111637772A (en) | 2020-06-29 | 2020-06-29 | Ultra-thin vapor chamber with symmetrical structure |
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| CN202010602350.0A CN111637772A (en) | 2020-06-29 | 2020-06-29 | Ultra-thin vapor chamber with symmetrical structure |
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| CN111637772A true CN111637772A (en) | 2020-09-08 |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112257316A (en) * | 2020-10-22 | 2021-01-22 | 华中科技大学 | Method for predicting sealing life of fuel cell |
| CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
| CN113873858A (en) * | 2021-11-30 | 2021-12-31 | 荣耀终端有限公司 | Housing and electronic device |
-
2020
- 2020-06-29 CN CN202010602350.0A patent/CN111637772A/en active Pending
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112257316A (en) * | 2020-10-22 | 2021-01-22 | 华中科技大学 | Method for predicting sealing life of fuel cell |
| CN112257316B (en) * | 2020-10-22 | 2024-02-02 | 华中科技大学 | Method for predicting sealing life of fuel cell |
| CN112888267A (en) * | 2021-02-05 | 2021-06-01 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method |
| CN112888267B (en) * | 2021-02-05 | 2022-09-20 | 华南理工大学 | Ultrathin flexible vapor chamber and manufacturing method thereof |
| CN113873858A (en) * | 2021-11-30 | 2021-12-31 | 荣耀终端有限公司 | Housing and electronic device |
| CN113873858B (en) * | 2021-11-30 | 2022-04-22 | 荣耀终端有限公司 | Housing and electronic device |
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