CN110779362B - Semi-shearing forming method for vapor chamber - Google Patents
Semi-shearing forming method for vapor chamber Download PDFInfo
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- CN110779362B CN110779362B CN201910981993.8A CN201910981993A CN110779362B CN 110779362 B CN110779362 B CN 110779362B CN 201910981993 A CN201910981993 A CN 201910981993A CN 110779362 B CN110779362 B CN 110779362B
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- 238000000034 method Methods 0.000 title claims abstract description 42
- 238000010008 shearing Methods 0.000 title claims abstract description 31
- 238000002791 soaking Methods 0.000 claims abstract description 35
- 238000003466 welding Methods 0.000 claims abstract description 28
- 239000012530 fluid Substances 0.000 claims abstract description 13
- 238000007789 sealing Methods 0.000 claims abstract description 6
- 238000012545 processing Methods 0.000 claims description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 6
- 238000009792 diffusion process Methods 0.000 claims description 5
- 239000000463 material Substances 0.000 claims description 5
- 229910021642 ultra pure water Inorganic materials 0.000 claims description 5
- 239000012498 ultrapure water Substances 0.000 claims description 5
- 238000005452 bending Methods 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims description 2
- 238000004519 manufacturing process Methods 0.000 abstract description 11
- 238000012797 qualification Methods 0.000 abstract description 3
- 230000007613 environmental effect Effects 0.000 abstract 1
- 238000004080 punching Methods 0.000 description 7
- 238000005245 sintering Methods 0.000 description 6
- 229910052751 metal Inorganic materials 0.000 description 5
- 239000002184 metal Substances 0.000 description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 238000010521 absorption reaction Methods 0.000 description 3
- 239000002253 acid Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 239000007800 oxidant agent Substances 0.000 description 3
- 230000001590 oxidative effect Effects 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003153 chemical reaction reagent Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000003912 environmental pollution Methods 0.000 description 2
- 150000002739 metals Chemical class 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229910000881 Cu alloy Inorganic materials 0.000 description 1
- 230000001133 acceleration Effects 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- IUYOGGFTLHZHEG-UHFFFAOYSA-N copper titanium Chemical compound [Ti].[Cu] IUYOGGFTLHZHEG-UHFFFAOYSA-N 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 238000002347 injection Methods 0.000 description 1
- 239000007924 injection Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 230000000135 prohibitive effect Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Images
Classifications
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0283—Means for filling or sealing heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/48—Manufacture or treatment of parts, e.g. containers, prior to assembly of the devices, using processes not provided for in a single one of the subgroups H01L21/06 - H01L21/326
- H01L21/4814—Conductive parts
- H01L21/4871—Bases, plates or heatsinks
- H01L21/4878—Mechanical treatment, e.g. deforming
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Sustainable Development (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Life Sciences & Earth Sciences (AREA)
- General Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Chemical & Material Sciences (AREA)
- Materials Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a semi-shearing forming method of a soaking plate, which comprises the following steps: providing a first cover plate and a second cover plate, forming a plurality of support columns in the middle of the first cover plate in a semi-shearing and stamping mode, and semi-shearing the edges into welding flange edges and reserving air outlets; attaching a heat absorbing core body in the first cover plate or the second cover plate, buckling the second cover plate on the first cover plate, and sealing along the welding flange edge to form a cavity; injecting working fluid into the cavity through the air outlet, and vacuumizing the interior of the cavity to form negative pressure; finally, the air outlet is sealed to form a soaking plate. The soaking plate cover plate is manufactured in a semi-shearing and stamping mode, so that the production cost is reduced, and the environmental protection is facilitated; the positioning block is arranged, so that the positioning precision is ensured, and the qualification rate of products is improved; by means of welding, the production period of the whole process is greatly shortened, and efficient production is achieved.
Description
Technical Field
The invention relates to the technical field of manufacturing of vapor chambers, in particular to a half-shearing forming method of a vapor chamber.
Background
With the rapid development in the fields of 5G wireless communication, radar, unmanned aerial vehicles, satellites and the like, the application prospect of the high-power radio frequency chip is wider and wider. The operation speed of the chip is dramatically increased, and the generated heat is increased, so that the stable operation of the chip is important, the requirement and the challenge for the soaking plate are met, and the acceleration of the industrial layout is inevitable.
The upper cover plate and the lower cover plate of the traditional soaking plate are manufactured in a wet etching mode, a large amount of oxidant and strong acid are used in the method, the produced waste water causes great pollution to the environment, meanwhile, the process also uses photoetching, masking and other processes, the process is complex, and the manufacturing cost is high. In addition, the assembly forming process is complex, the upper cover plate and the lower cover plate of the vapor chamber are combined together in the traditional assembly process in a mode of copper paste dispensing, manual assembly of the upper cover plate and the lower cover plate and brazing, the manufacturing time is too long, the yield of products is limited, and the quality of the products cannot be guaranteed.
The need for low cost, high efficiency manufacturing processes has become prohibitive. The stamping mode is used as a mature metal plate processing technology and is expected to become a new production technology of the upper cover plate and the lower cover plate of the soaking plate. Patent 201610223708.2 discloses a method for manufacturing an ultra-thin vapor chamber, which uses a stamping and bending method to manufacture the upper and lower covers of the vapor chamber. The internal structure obtained in this way has smooth surface and weak supporting function, and has negative influence on the strength of the soaking plate.
Disclosure of Invention
The invention provides a semi-shearing forming method of a soaking plate, which can solve one or more of the problems in the prior art.
According to one aspect of the invention, a soaking plate half-shearing forming method is provided, and comprises the following steps:
(1) two plates are provided and are divided into a first cover plate and a second cover plate.
(2) And carrying out half-shearing stamping on the middle part of the first cover plate by using a punch press to form a plurality of supporting columns. The support column plays the supporting role to the spatial structure of whole soaking plate, can keep the integrality of soaking plate inner structure, avoids the soaking plate to take place unfavorable phenomena such as deformation under external pressure's effect.
(3) And performing half-shearing stamping on the edge of the first cover plate by using a punch press to form a welding flange edge, and reserving an air outlet. The air outlet can facilitate the further processing of the internal structure of the soaking plate.
(4) A wick is attached to the inside of the first cover plate obtained in step (3) or the second cover plate prepared in step (1), and the wick is fixed to the inner wall of the first cover plate or the second cover plate, typically by sintering. After the first cover plate is processed in the step (2) and the step (3), a groove is formed in the welded flange edge, and the shape and the size of the liquid absorption core are generally matched with those of the groove processed by the first cover plate, so that the liquid absorption core can be just embedded into the groove. Then, the second cover plate is buckled on the first cover plate; connecting the first cover plate and the second cover plate together along the welding flange edge to form a cavity with an air outlet; generally, sintering or welding can be adopted in the connection process of the first cover plate and the second cover plate. And in the inside of cavity, one side of imbibition core can be connected with the support cylinder contact or the point contact on the first apron, and the opposite side can be connected with the second apron, and the support column plays the supporting role to whole structure, can prevent to warp.
(5) And filling a proper amount of working fluid into the cavity through the air outlet.
(6) The air outlet is connected with a negative pressure device to extract air in the cavity, so that the interior of the cavity is in a vacuum state.
(7) And (5) plugging the air outlet and welding and sealing to prepare a soaking plate.
Therefore, the forming mode of the soaking plate is changed by adopting the stamping and half-shearing process, so that a large amount of chemical reagents such as oxidant, strong acid and the like are avoided, the environmental pollution is small, the process steps are simplified, the processing time can be shortened, and the processing cost is greatly reduced. The first cover plate is stamped by adopting a semi-shearing process to form structures such as a welding edge, an internal groove and a support column, the first cover plate and the second cover plate are connected to form a cavity structure, working fluid can flow in the cavity, and the support column can play a supporting role. The first cover plate is processed by adopting a half-shearing process, so that the edge angle of the inner wall of the first cover plate is clear, and in the half-shearing process, the thickness of the plate is not changed greatly after the plate is processed by half-shearing, so that the plate has good bearing performance. In addition, the first cover plate is processed and formed by adopting a half-shearing process, so that a large amount of chemical reagents such as an oxidant, strong acid and the like can be avoided, the environmental pollution is small, the process steps are simplified, the processing time can be shortened, and the processing cost is greatly reduced.
In some embodiments, the sheet material is a metal material. Metals have excellent thermal conductivity and are widely used in the processing of vapor chambers. Stamping technology is mature, and different process parameters are formed for metals with different strengths, plasticity and ductility. In general, copper materials, aluminum materials, stainless materials, titanium-copper alloys, and the like are preferably used for processing the soaking plate.
In some embodiments, the connection thickness of the dislocation part on the first cover plate is kept after the half-shearing punching in the step (2) and the step (3). Therefore, the plate can be prevented from being broken in the semi-shearing process, and the product quality and the service life are ensured.
In some embodiments, in the step (2), the plurality of support columns are uniformly arranged, and gaps are left between the plurality of support columns, and the gaps between the plurality of support columns are communicated with each other. The supporting columns are uniformly arranged, so that all parts of the soaking plate are uniformly stressed and prevented from deforming. Gaps are arranged among the supporting columns, and the working fluid can flow among the supporting columns after being gasified, so that the heat transfer speed is improved.
In some embodiments, the support columns in step (2) may be distributed in other manners, for example, several support columns are close to each other to form local support units, and the support columns in each local support unit have a gap therebetween; the local support units are distributed in an array.
In some embodiments, the support post is cylindrical or square in shape. Therefore, soaking spaces with different shapes can be processed according to requirements, and the device is suitable for different application scenes.
In some embodiments, a positioning block may be formed on an edge of the second cover plate by a bending press or a semi-shearing press, and the positioning block may be engaged with an edge of the first cover plate. So, when lapping first apron and second apron each other and sealing connection, the locating piece provides the location benchmark for the block of first apron with the second apron, has guaranteed the precision of location, improves the qualification rate of product.
In some embodiments, the positioning block may be a block, a bar, or other shape, and the positioning block may be one or more, so as to meet different processing requirements. The positioning block is simple in machining process, the number of stamping times of the plate is small, and a positioning reference is provided for the attachment of the first cover plate and the second cover plate through one-side positioning. The positioning reference can be provided from a plurality of sides to a plurality of locating pieces, the precision is improved, and the qualification rate of products is guaranteed.
In some embodiments, in the step (4), the first cover plate and the second cover plate are integrally connected by laser welding or diffusion welding. The laser welding or diffusion welding can simplify the process flow of connecting the first cover plate and the second cover plate, and avoids complex procedures such as copper paste dispensing, sintering and the like, thereby saving the processing time and improving the working efficiency. In step (7), the injection port may be sealed by laser welding or diffusion welding.
In some embodiments, the working fluid is pure water or ultrapure water. In a vacuum state, water is heated and is easy to vaporize, so that the temperature can be quickly reduced; after the temperature is reduced, the water vapor is condensed to release certain heat, so that the temperature can be quickly adjusted to achieve the function of soaking. The pure water or the ultrapure water has extremely weak corrosion to the metal plate, and the service life of the soaking plate can be ensured.
In some embodiments, the first cover plate and the second cover plate have shapes including, but not limited to, circular, oval, and square. Therefore, soaking plates with different shapes can be processed according to requirements, so that the method is suitable for different application scenes, and the practicability is enhanced.
Drawings
FIG. 1 is a schematic sectional view of example 1 of the present invention;
fig. 2 is a drawing of a first cover plate of embodiment 1 of the present invention;
FIG. 3 is a schematic sectional view of example 2 of the present invention;
fig. 4 is a plan view of the first cover plate of embodiment 2 of the present invention;
FIG. 5 is a schematic cross-sectional view of example 3 of the present invention;
fig. 6 is a plan view of the first cover plate according to embodiment 3 of the present invention.
Detailed Description
The present invention will be described in further detail with reference to the accompanying drawings.
Example 1
Fig. 1 and 2 schematically show a soaking plate according to the method of the present invention, which provides a soaking plate press forming method comprising the steps of:
(1) two sheets are provided, divided into a first cover plate 100 and a second cover plate 200. The first and second cover plates 100 and 200 are square copper plates having the same size.
(2) The middle portion of the first cover plate 100 is half-cut and punched from the bottom surface upward by a punch press to form a plurality of support columns 101. The supporting columns 101 have spaces 102 therebetween, and the spaces 102 between the supporting columns 101 communicate with each other. After the semi-shearing punching, a certain connecting thickness is reserved between the supporting column 101 and the initial plate surface. Thus, the first cover plate 100 may be prevented from being broken due to the half-shearing process. The vapor chamber support columns 101 are cylindrical as shown in fig. 2, and a plurality of the support columns 101 are arranged uniformly.
(3) The edge of the first cover plate 100 is half-cut and stamped by a punch press to form a welding flange 103, and an air outlet 104 is reserved. Half-shearing punching is carried out on the edge of the first cover plate 100 from the bottom surface upwards, so that four sides of the first cover plate 100 are slightly higher than the initial plate surface to form a welding flange edge 103, one corner which is not subjected to half-shearing punching is left on the welding flange edge 103, namely the gas outlet 104, half-shearing punching is not carried out on the position of the gas outlet 104, and the height of the gas outlet 104 is the height of the initial plate surface because half-shearing punching is not carried out on the position of the gas outlet 104. After the semi-shearing punching, a certain connecting thickness is left between the welding flange edge 103 and the initial plate surface to prevent the first cover plate 100 from being broken.
(4) And (4) attaching a wick 300 to the half-cut inner wall of the first cover plate 100 obtained in the step (3) in a sintering manner, so as to ensure the fluidity of the working fluid during working. The second cover plate 200 is buckled on the obtained first cover plate 100; first cover plate 100 and second cover plate 200 are joined together along weld flange 103 to form a cavity having gas outlet 104. The welded flange 103 of the first cover plate 100 is in contact with the second cover plate 200, and furthermore the wick 300 is in point contact on one side with the support pillars 101 by sintering and on the other side with the second cover plate 200, the support pillars 101 being in contact with the second cover plate 200 through the wick 101. The first cover plate 100 and the second cover plate 200 are welded along the welding flange 103 by laser welding. In this way, the range within the welding flange 103 of the first cover plate 100 and the second cover plate 200 form a cavity with the air outlet 104. Inside the chamber, the first cover plate 100 and the second cover plate 200 are connected by the supporting columns 101, and the plurality of supporting columns 101 have mutually communicated gaps 102. The air outlet 104 can be connected with a negative pressure device to vacuumize the interior of the cavity.
(5) The chamber is filled with a suitable amount of working fluid through the gas outlet 104. The working fluid is pure water or ultrapure water.
(6) Air inside the chamber is extracted from the air outlet 104 to make the inside of the chamber in a vacuum state.
(7) And sealing the gas outlet 104, and sealing the gas outlet 104 again by adopting a laser welding mode to manufacture the soaking plate.
When the soaking plate works, one end, receiving external heat, of the soaking plate is the hot end, the hot end absorbs heat under the influence of an external heat source, so that working fluid inside the soaking plate is heated, the working fluid is rapidly evaporated to form gaseous working media in a vacuum state, the gaseous working media are spread in the inner space of the cavity and are transmitted to other parts of the soaking plate, and the heat carried by the gaseous working media is diffused to the outside through the pipe wall of the soaking plate. The working medium after heat release is liquefied again, and the liquefied ultrapure water flows back to the hot end of the soaking plate through the capillary action of the liquid absorption core 300. The liquefied working fluid is vaporized again in the cavity of the soaking plate, and the heat is radiated to the outside through the pipe wall and then liquefied again, so that the circulation is realized, and the effects of continuously absorbing the heat and dissipating the heat are achieved.
Example 2
Fig. 3 and 4 schematically show another soaking plate according to the method of the present invention, which is different from embodiment 1 in that: the first cover plate 100 and the second cover plate 200 are both made of metal aluminum plates, and the supporting columns 101 formed by half-shearing on the first cover plate 100 are square cylinders, and the supporting columns 101 are in contact with one side surface of the wick 300.
In addition, in the processing process, the wick 300 is fixed to the middle position of the second cover plate 200 by means of sintering, and when the first cover plate 100 and the second cover plate 200 are attached to each other, the wick 300 is just embedded inside the welded flange 103. In addition, the second cover plate 200 is welded by diffusion welding.
Example 3
Fig. 5 and 6 schematically show the structure of a first cover plate 100 of a soaking plate according to still another embodiment of the present invention, which is different from embodiment 1 in that: the arrangement of the plurality of support pillars 101 formed by half-cutting on the first cover plate 100 is different, in this embodiment, the 4 support pillars 101 are close to each other to form a local support unit, the plurality of local support units are distributed in an array, a gap 102 is reserved inside the local support unit, and a gap 102 is also reserved between the plurality of local support units. Support columns 101 contact one side of wick 300. In addition, the edge of the second cover plate 200 is processed into a positioning block 201 by a bending process, and the positioning block 201 can be engaged with the welding flange 103 on the edge of the first cover plate 100.
What has been described above are merely some embodiments of the present invention. It will be apparent to those skilled in the art that various changes and modifications can be made without departing from the inventive concept thereof, and these changes and modifications can be made without departing from the spirit and scope of the invention.
Claims (7)
1. A semi-shearing forming method of a soaking plate is characterized by comprising the following steps:
(1) providing two plates, wherein the plates are divided into a first cover plate (100) and a second cover plate (200);
(2) the middle part of the first cover plate (100) is subjected to half-shearing stamping by using a punch press to form a plurality of supporting columns (101);
(3) performing half-shearing stamping on the edge of the first cover plate (100) by using a punch press to form a welding flange (103), and reserving an air outlet (104);
(4) processing a positioning block (201) at the edge of the second cover plate (200) by adopting a bending process, wherein the positioning block (201) can be clamped with the edge of the first cover plate (100);
(5) attaching a wick (300) to the inside of the first cover plate (100) or the second cover plate (200) obtained in the step (4), and then fastening the second cover plate (200) to the first cover plate (100); connecting the first cover plate (100) and the second cover plate (200) together along the welding flange edge (103) to form a cavity with an air outlet (104);
(6) filling the cavity with a working fluid through the gas outlet (104);
(7) air in the cavity is extracted through the air outlet (104), so that the interior of the cavity is in a vacuum state;
(8) and (5) plugging the air outlet (104) and sealing to prepare a soaking plate.
2. The method of claim 1, wherein the sheet material is a metallic material.
3. The method of claim 1, wherein in step (2), the plurality of support columns (101) are uniformly arranged, and gaps (102) are left between the plurality of support columns (101).
4. The method of claim 1, wherein the support column (101) in step (2) is in the shape of a cylinder or square cylinder.
5. The method according to claim 1, wherein the positioning block (201) is one or more.
6. The method of claim 1, wherein the step (5) is performed by laser welding or diffusion welding to integrally connect the first cover plate (100) and the second cover plate (200).
7. The method of claim 1, wherein the working fluid is pure water or ultrapure water.
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| CN112626511A (en) * | 2020-11-27 | 2021-04-09 | 瑞声科技（南京）有限公司 | Steel sheet passivation process, passivated steel sheet and temperature-equalizing plate |
| CN113446884B (en) * | 2021-06-28 | 2023-05-09 | 东莞领益精密制造科技有限公司 | Method for manufacturing vapor chamber |
| CN113927119A (en) * | 2021-11-05 | 2022-01-14 | 贵州贵航汽车零部件股份有限公司 | Method and clamp for improving welding rate of cold plate radiator |
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