CN105352352A - Ultra-thin even-temperature plate device and manufacturing method thereof - Google Patents
Ultra-thin even-temperature plate device and manufacturing method thereof Download PDFInfo
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Abstract
The invention provides an ultra-thin even-temperature plate device and a manufacturing method thereof. The device comprises a bottom plate, a capillary core, an upper cover plate and a working medium. A gas-liquid channel integrated design is adopted in the capillary core, a steam circulation space and a liquid backflow channel are arranged on the capillary core in the plane direction, and a solid part of the capillary core is provided with holes for supporting columns to penetrate, the supporting columns are arranged on the bottom plate, the bottom plate is of a groove structure, and the supporting columns are evenly arranged in the bottom plate. The supporting columns penetrate the holes to make contact with the inner surface of the upper cover plate, and welding forming is finished. A liquid filling port is reserved in the bottom plate, and after filling of the working medium, sealing welding is carried out. The manufacturing method of the device comprises the steps of machining of the bottom plate and the upper cover plate, punching forming of the capillary core, vacuum pressurizing diffusion welding, machining margin removing, vacuumizing liquid injecting and the sealing welding process. An even-temperature plate can be manufactured to be of an ultra-thin structure, and the ultra-thin even-temperature plate device and the manufacturing method are particularly suitable for heat dissipation occasions with the strict requirement for the installing thickness space.
Description
Technical field
The invention belongs to spacecraft thermal control field, relate to a kind of temperature-uniforming plate, particularly relate to a kind of ultra-thin temperature-uniforming plate device and processing and fabricating method thereof.
Background technology
In spacecraft thermal control field, sharply increasing and the reduction day by day in efficiently radiates heat space of all kinds of unit electronic chip heat flow density, make extra-thin heat pipe class heat radiation elements become under this type of application background desirable heat conducting element.Such as, in the heat dissipation problem of phased-array radar, need the rapid samming of heater element of the T/R assembly sorted by array and conduct heat, array pitch along with the continuous lifting of radar power more and more less, how common at present inter-module apart from about 2mm, utilizes limited thickness space to be taken away by the rapid samming of heating of phased-array radar T/R assembly to be a difficult problem for thermal control design always.The and for example lithium battery group of star power source use, in order to obtain as far as possible large battery capacity in limited bulk, often battery pack permutation and combination is used, its aligned gaps is caused to be generally less than 2mm, in this confined space, how to ensure that the heating of battery pack can samming diffusion also be the difficult problem that restriction large-capacity power lithium battery uses rapidly.
Temperature-uniforming plate (or claiming flat-plate heat pipe, VaporChamber etc.) is the ideal scheme solving this type of heat dissipation problem.The temperature-uniforming plate of current main flow, its structure mainly comprises base plate, bottom capillary wick, support column, upper strata capillary wick and upper cover plate.Base plate and upper cover plate, by after die sinking punch forming, by capillary wick sintering surface within it, are realizing the connection of base plate and upper cover plate by welding.The temperature-uniforming plate of this version forms liquid reflux channel and steam free air space respectively primarily of the cavity area in the middle of upper and lower capillary wick and capillary wick, owing to depositing steam channel in a thickness direction, is difficult to reduce its cavity height space.Be limited to this version and processing method, the temperature-uniforming plate general thickness of this type of predominate architecture, at more than 3-6mm, is difficult to accomplish 1-2mm thickness level.
Summary of the invention
For the technical problem existed in above-mentioned prior art, the invention provides a kind of ultra-thin temperature-uniforming plate device and processing and fabricating method thereof.By the structural design of monolithic capillary wick, steam free air space and liquid reflux channel can be provided on limited thickness direction, utilize middle cavity as the version of steam flow channel compared to the capillary wick of two panels up and down of traditional temperature-uniforming plate, substantially reduce the spatial altitude of temperature-uniforming plate inside, simplify the structure of temperature-uniforming plate, thus temperature-uniforming plate making can be become superthin structure form, thickness, at below 1mm, is particularly useful for the temperature uniforming heat radiation demand in ultra-thin space.
For achieving the above object, the technical solution adopted in the present invention is as follows:
A kind of ultra-thin temperature-uniforming plate device, comprises base plate, capillary wick, upper cover plate and working medium.Capillary wick have employed gas-liquid channel integrated design mode, capillary wick is made to there is steam free air space and liquid reflux channel in the in-plane direction, solve the temperature-uniforming plate steam inside flowing on limited thickness direction and the problem of liquid backflow, thus in monolithic capillary wick, possessed the ability that working medium heat absorption evaporation, steam circulation, steam-condensation and condensed fluid reflux.In addition, process the hole that support column passes, base arrangement is designed with support column in the entity part of capillary wick, support column through the reserved hole of capillary wick, then contacts with upper cover plate inner surface, completes welding fabrication, makes it meet structural strength user demand.Shaping rear temperature-uniforming plate is filled with working medium and seal welding by reserved implementation of port, forms ultra-thin temperature-uniforming plate device.
Described base plate is groove structure, and inner homogeneous arranges support column.
Described capillary wick is " # " font structure, and its thickness is no more than 0.5mm, and the perforate length of side of steam free air space is 2 ~ 5mm, and liquid reflux channel diameter is 2 ~ 5mm, and hole diameter is no more than 2mm.
Large 0.1 ~ the 0.15mm of Thickness Ratio internal cavities total height of described capillary wick.
Described capillary wick material is copper or nickel, and version is powder sintered form or porous foam metal, and porosity is 50 ~ 90%, and average pore size is at 10 μm of orders of magnitude.
The material of described base plate, upper cover plate is copper or aluminium alloy.
The material of described base plate, upper cover plate is TU1 copper and 6063 aluminium alloys, and described working medium is water or acetone.
The present invention proposes a kind of processing and fabricating method of ultra-thin temperature-uniforming plate device simultaneously, mainly comprises following steps:
A, use Cutter Body Processing with Machining Center go out base plate and upper cover plate, and thickness is at about 3 ~ 5mm; Base plate is groove structure, and inner homogeneous arranges support column arrangement, and upper cover plate is a flat board, and two-sided planar degree is within 0.05mm;
B, use impact style process capillary wick, and wick structure form is " # " font, and the " # " font frock that punching press uses tool steel or mould steel to process is directly one time punching molded by capillary wick;
C, capillary wick b step machined are placed in the base plate of the band groove that a step processes, and after being mounted with by upper cover plate correspondence position, use vacuum pressed diffusion welding (DW) equipment to complete welding to assembly;
Use machining center and Linear cut mode after d, welding, remove the surplus of two layers of material, obtain the housing of ultra-thin temperature-uniforming plate device;
E, use special vacuum pumping liquid injection equipment to be vacuumized by the ultra-thin temperature-uniforming plate device of Step d, be then filled with appropriate working medium;
F, the ultra-thin temperature-uniforming plate device completed by topping up use counterpart pressure clamp seal and weld, and finally by its shaping, meet user demand.
Preferably, capillary wick uses porous foam copper or nickel, and " # " font structure designs, and porosity is 80%, and average pore size is at below 10um, and thickness 0.5mm, the rectangle opening length of side of " # " font is 5mm.
Preferably, the material of base plate, upper cover plate is TU1 copper or 6063 aluminium alloys.
Preferably, the vacuum level requirements of vacuum pressed diffusion welding (DW) reaches 10
-4pa, pressurization scope is at 0 ~ 20Mpa, and pressure controllable in welding process, after welding, air-tightness requires to reach 10
-10pam
3/ s leak rate level.
Preferably, integral thickness is within 1mm at about 0.3mm the both sides shell thick end after Linear cut.
Preferably, vacuum vacuum reaches 10
-4be filled with working medium again after pa, working medium selects acetone or water, and liquid filled ratio is 50 ~ 55%.
Compared with prior art, apparatus of the present invention have following beneficial effect:
The ultra-thin temperature-uniforming plate device that the present invention proposes, by the structural design of monolithic capillary wick, steam free air space and liquid reflux channel can be provided on limited thickness direction, utilize middle cavity as the version of steam flow channel compared to the capillary wick of two panels up and down of traditional temperature-uniforming plate, substantially reduce the spatial altitude of temperature-uniforming plate inside, simplify the structure of temperature-uniforming plate, thus temperature-uniforming plate making can be become superthin structure form, thickness, at below 1mm, is particularly useful for the temperature uniforming heat radiation demand in ultra-thin space.Relative to the temperature-uniforming plate of other versions, the ultra-slim features of apparatus of the present invention can meet the radiating requirements of the confined space as phased-array radar T/R assembly or dynamic lithium battery group, directly using apparatus of the present invention as plug-in unit directly and thermal source fit, rapidly heat point source samming can be expanded heat, ensure the integral heat sink performance of unit or device, apply the present invention simultaneously, the spacing that unit is arranged can also be reduced further, improve the unit quantity of the confined space, bring the further expansion of the lifting of phased-array radar detection performance or battery capacity, thus bring the upgrading of overall performance.
The processing and fabricating method of apparatus of the present invention reduces temperature-uniforming plate thickness mainly through following measures:
1) employing thickness is that the monolithic porous foam metal of about 0.5mm is as capillary wick, the mode of punching press is used to process the version of " # " font on this basis, the hole length of side of " # " font and entity width are all about 3 ~ 5mm, as the wick structure of ultra-thin temperature-uniforming plate device, ensure that vital qi free air space and liquid reflux channel, relatively traditional two panels sintered copper powder structure, thickness is reduced to about 0.5mm.
2) base plate and upper cover plate thickness Redundancy Design is used to reprocess the mode of going surplus, both processing convenience, the operability of base plate and upper cover plate had been ensure that, also ensure that welding quality, achieve high-air-tightness, high-intensity welding, gone the mode of surplus by the Linear cut after welding simultaneously, obtain both sides wall thickness and be only 0.3mm, integral thickness is the ultra-thin temperature-uniforming plate device of below 1mm.
Accompanying drawing explanation
By reading the detailed description done non-limiting example with reference to the following drawings, other features, objects and advantages of the present invention will become more obvious:
Fig. 1 is the three-dimensional structure schematic diagram of the embodiment of the present invention;
Fig. 2 is the exploded view of Fig. 1;
Fig. 3 is the top view of capillary wick;
Fig. 4 is the top view of base plate;
Fig. 5 is the flow chart of processing and fabricating method.
In figure: 1. base plate, 2. capillary wick, 3. upper cover plate, 101. implementation of port, 102. support columns, 201. steam free air spaces, 202 liquid reflux channels, 203. holes.
Detailed description of the invention
Below in conjunction with specific embodiment, the present invention is described in detail.Following examples will contribute to those skilled in the art and understand the present invention further, but not limit the present invention in any form.It should be pointed out that to those skilled in the art, without departing from the inventive concept of the premise, some distortion and improvement can also be made.These all belong to protection scope of the present invention.
Shown in Fig. 1 ~ Fig. 4, individual layer capillary wick samming thin plate of the present invention, comprise base plate 1, capillary wick 2, upper cover plate 3, working medium, capillary wick 2 have employed gas-liquid channel integrated design mode, capillary wick is made to there is steam free air space 201 and liquid reflux channel 202 in the in-plane direction, solve the temperature-uniforming plate steam inside flowing on limited thickness direction and the problem of liquid backflow, thus in monolithic capillary wick, possessed the ability that working medium heat absorption evaporation, steam circulation, steam-condensation and condensed fluid reflux.In addition, the hole 203 that support column passes is processed in the entity part of capillary wick, base arrangement is designed with support column 102, base plate is groove structure, inner homogeneous arranges support column, the hole that support column is reserved through capillary wick, then contacts with upper cover plate inner surface, complete welding fabrication, make it meet structural strength user demand.Shaping rear temperature-uniforming plate is filled with working medium and seal welding by reserved implementation of port 101, forms ultra-thin temperature-uniforming plate device.
Figure 5 shows that the preparation method of individual layer capillary wick samming thin plate of the present invention, comprise the machined of base plate and upper cover plate, the punch forming of capillary wick, vacuum pressed diffusion welding (DW), machined go surplus, vacuum pumping liquid injection, seal welding process.With specific embodiment, it process step comprised is described below.
Embodiment 1
(1) use 6063 aluminium alloys of 5mm thickness to process base plate and upper cover plate structure, bottom plate groove degree of depth 0.4mm, planarity requirements is within 0.05mm;
(2) use 0.5mm porous foam nickel material as capillary wick, use the frock of tool steel processing to stamp out the " # " font structure of rule, wherein the intermediate rectangular hole length of side is 5mm, and capillary wick entity portion width is also 5mm;
(3) capillary wick is assemblied in the groove of base plate, the assembling of upper cover plate correspondence is placed fixing;
(4) use the mode of vacuum pressed diffusion welding (DW) to realize being welded to connect of base plate and upper cover plate, during welding, vacuum level requirements reaches 10
-4pa, the maximum pressure that pressurizes instantaneously reaches 20Mpa;
(5) use machined to be flown to put down in both sides the temperature-uniforming plate housing after being welded to connect, require that flatness is within 0.02mm, the depth of parallelism is within 0.05mm; Re-use the thickness surplus that low-speed WEDM removes both sides, the one-sided thickness of final reservation is 0.3mm, and general thickness is the ultra-thin temperature-uniforming plate device case of 1mm;
(6) the temperature-uniforming plate housing of machine-shaping is accessed special vacuum pumping liquid injection equipment, vacuum is evacuated to 10
-4after pa magnitude, be filled with the acetone analyzing more than purity, liquid filled ratio is 55%;
(7) topping up complete after use brank cut off fill the seal of tube, and use argon arc welding to seal.Crator flattens to temperature-uniforming plate thickness of shell the most at last, forms the ultra-thin temperature-uniforming plate device of aluminium material that general thickness is 1mm.
Embodiment 2
(1) use the TU1 copper product of 5mm thickness to process base plate and upper cover plate structure, bottom plate groove degree of depth 0.4mm, planarity requirements is within 0.05mm;
(2) use 0.5mm porous foam copper product as capillary wick, use the frock of tool steel processing to stamp out the " # " font structure of rule, wherein the intermediate rectangular hole length of side is 5mm, and capillary wick entity portion width is also 5mm;
(3) capillary wick is assemblied in the groove of base plate, the assembling of upper cover plate correspondence is placed fixing;
(4) use the mode of vacuum pressed diffusion welding (DW) to realize being welded to connect of base plate and upper cover plate, during welding, vacuum level requirements reaches 10
-4pa, moulding pressure is within 2Mpa;
(5) use machined both sides to fly to put down the temperature-uniforming plate housing after being welded to connect, require that flatness is within 0.02mm, the depth of parallelism is within 0.05mm; Re-use the thickness surplus that low-speed WEDM removes both sides, the one-sided thickness of final reservation is 0.3mm, and general thickness is the ultra-thin temperature-uniforming plate device case of 1mm;
(6) the temperature-uniforming plate housing of machine-shaping is accessed special vacuum pumping liquid injection equipment, vacuum is evacuated to 10
-4after pa magnitude, be filled with deionized water, liquid filled ratio is 55%;
(7) topping up complete after use brank cut off fill the seal of tube, and use argon arc welding to seal.Crator flattens to temperature-uniforming plate thickness of shell the most at last, forms the ultra-thin temperature-uniforming plate device of copper material that general thickness is 1mm.
Above specific embodiments of the invention are described.It is to be appreciated that the present invention is not limited to above-mentioned particular implementation, those skilled in the art can make various distortion or amendment within the scope of the claims, and this does not affect flesh and blood of the present invention.
Claims (10)
1. a ultra-thin temperature-uniforming plate device, comprise base plate, capillary wick, upper cover plate and working medium, described capillary wick adopts gas-liquid channel integrated design, it is provided with steam free air space and liquid reflux channel in the in-plane direction, and body divides the hole being provided with support column and passing in fact, and described support column is arranged on base plate, described support column contacts with upper cover plate inner surface through hole, complete welding fabrication, after working medium is filled with by implementation of port reserved on base plate, implementation of port seal welding.
2. ultra-thin temperature-uniforming plate device according to claim 1, is characterized in that, described capillary wick is " # " font structure, its thickness is no more than 0.5mm, the perforate length of side of steam free air space is 2 ~ 5mm, and liquid reflux channel diameter is 2 ~ 5mm, and hole diameter is no more than 2mm.
3. ultra-thin temperature-uniforming plate device according to claim 1, is characterized in that, the large 0.1 ~ 0.15mm of Thickness Ratio internal cavities total height of described capillary wick.
4. ultra-thin temperature-uniforming plate device according to claim 1, is characterized in that, described capillary wick material is copper or nickel, and version is powder sintered form or porous foam metal, and porosity is 50 ~ 90%, and average pore size is at 10 μm of orders of magnitude.
5. ultra-thin temperature-uniforming plate device according to claim 1, is characterized in that, the material of described base plate, upper cover plate is copper or aluminium alloy.
6. ultra-thin temperature-uniforming plate device according to claim 1, is characterized in that, the material of described base plate, upper cover plate is TU1 copper and 6063 aluminium alloys, and described working medium is water or acetone.
7. a preparation method for ultra-thin temperature-uniforming plate device, is characterized in that, for making the ultra-thin temperature-uniforming plate device described in claim 1 to 6, comprises the following steps:
A, use Cutter Body Processing with Machining Center go out base plate and upper cover plate, and thickness is at about 3 ~ 5mm; Base plate is groove structure, and inner homogeneous arranges support column arrangement, and upper cover plate is a flat board, and two-sided planar degree is within 0.05mm;
B, use impact style process capillary wick, and wick structure form is " # " font, uses the " # " font frock that tool steel or mould steel process, directly that capillary wick is one time punching molded;
C, capillary wick b step machined are placed in the base plate of the band groove that a step processes, and after being mounted with by upper cover plate correspondence position, use vacuum pressed diffusion welding (DW) equipment to complete welding to assembly;
Use machining center and Linear cut mode after d, welding, remove the surplus of two layers of material, obtain the housing of ultra-thin temperature-uniforming plate device;
The ultra-thin temperature-uniforming plate device of Step d vacuumizes by e, use vacuum pumping liquid injection equipment, is then filled with appropriate working medium;
F, the ultra-thin temperature-uniforming plate device completed by topping up use counterpart pressure clamp seal and weld.
8. the preparation method of ultra-thin temperature-uniforming plate device according to claim 7, is characterized in that, the vacuum level requirements of the vacuum pressed diffusion welding (DW) of described step c reaches 10
-4pa, pressurization scope is at 0 ~ 20Mpa, and pressure controllable in welding process, after welding, air-tightness requires to reach 10
-10pam
3/ s leak rate level.
9. the preparation method of ultra-thin temperature-uniforming plate device according to claim 7, is characterized in that, the both sides shell thick end in described steps d after Linear cut, integral thickness was within 1mm at about 0.3mm.
10. the preparation method of ultra-thin temperature-uniforming plate device according to claim 7, it is characterized in that, in described step e, vacuum vacuum reaches 10
-4be filled with working medium again after pa, working medium selects acetone or water, and liquid filled ratio is 50 ~ 55%.
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| CN112996338A (en) * | 2019-12-12 | 2021-06-18 | 秦文隆 | Ultra-thin type temperature equalizing plate and manufacturing method thereof |
| CN111660025A (en) * | 2019-12-27 | 2020-09-15 | 东莞市万维热传导技术有限公司 | Sealing welding method for multi-cavity type temperature-equalizing plate |
| CN111174616A (en) * | 2020-03-12 | 2020-05-19 | 深圳威铂驰热技术有限公司 | Ultrathin uniform temperature plate structure and manufacturing process thereof |
| CN111174617A (en) * | 2020-03-13 | 2020-05-19 | 深圳威铂驰热技术有限公司 | High-efficiency uniform temperature plate and manufacturing process thereof |
| CN111928706A (en) * | 2020-08-05 | 2020-11-13 | 上海卫星工程研究所 | Flat heat pipe based on composite structure liquid absorption core, assembly method and electronic component |
| CN112857109A (en) * | 2021-03-13 | 2021-05-28 | 南通锐莱新能源技术有限公司 | Ultra-thin copper temperature-uniforming plate |
| CN113670100A (en) * | 2021-07-22 | 2021-11-19 | 中南大学 | Temperature-uniforming plate and preparation method thereof |
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