CN104896983B - Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core - Google Patents
Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core Download PDFInfo
- Publication number
- CN104896983B CN104896983B CN201410081954.XA CN201410081954A CN104896983B CN 104896983 B CN104896983 B CN 104896983B CN 201410081954 A CN201410081954 A CN 201410081954A CN 104896983 B CN104896983 B CN 104896983B
- Authority
- CN
- China
- Prior art keywords
- foam silver
- silver
- copper
- ultra
- support column
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing method of a soaking plate with ultrathin foam silver as a liquid absorbing core. Foam silver with different thicknesses and porosities and constructed in a classification manner is sintered on an upper cover plate and a lower baseplate made of corresponding pure copper plates (copper foils) with different thicknesses to manufacture the soaking plate by such processes as welding, vacuumizing, liquid injection and packaging. A middle steam cavity adopts cylindrical or block-shaped classified foam silver or copper with the thickness not smaller than 0.8 mm as a support column to guarantee quick flowing of a medium (working medium) after the gasification and quick reflowing after the phase change of accelerating the conversion from gas to liquid so as to accelerate the working medium phase change circulation. The ultrathin foam silver has excellent capillary suction, uniform hole structure distribution, high porosity and higher heat conductivity. The soaking plate with the ultrathin foam silver as the liquid absorbing core has the characteristics of high cooling efficiency, light weight and good reliability, is suitable for manufacturing an ultrathin structure, can satisfy the requirements of high heat conductivity and miniaturization needed by high-heat-flux electronic equipment, and is suitable for the heat management application of high-end equipment due to the price factor.
Description
Technical field
The present invention relates to two dimension in a kind of Electron Heat management equipment（Plane）The device of structure quick heat radiating, i.e. soaking plate
And its preparation method, particularly a kind of manufacture method for adopting ultra-thin Foam silver for the soaking plate of liquid-sucking core.
Background technology
With the fast development of information technology, dissipation from electronic devices requires to improve constantly, and promotes Electron Heat management device
Research and development.As radar, laser, satellite, manned spacecraft are contour especially in national defence and Aero-Space Grand Equipments application
Radiating is put forward higher requirement on technology equipment, traditional radiating mode is to metal heat sink using fan forced convection
Cooled down, this mode far can not meet the high heat flux of current control system such as chip and electronic equipment microminaturization
Requirement.The application of hot pipe technique solves the difficult problem for quickly deriving high heat flux using one-dimentional structure feature and radiating.
And soaking plate（vapor chamber）Operation principle it is similar to heat pipe, difference be adopting heat pipes for heat transfer be it is one-dimensional, soaking plate heat transfer
It is two dimension, for heat pipe, the heat from heat source of concentration can be delivered to bigger area by soaking plate, therefore soaking plate
Heat-transfer character is more preferable.Heat pipe of the soaking plate as two-dimension plane structure（So also referred to as plane heat pipe）, inside is in vacuum state
And inject a certain amount of liquid working media.Inwall has wick structure, and when soaking plate is heated, the work of its evaporating surface is situated between
Matter rapid evaporation becomes steam, and steam quickly passes to cryosurface heat release and condenses into liquid by gaseous state by vapor chamber, and liquid exists
Under capillarity by wick structure again quick backflow to the evaporating surface being heated, quickly flowing and phase transformation being followed to form phase
Ring, realizes the effect that heat is quickly spread out of from heating surface and radiated.
Its preparation process and heat pipe also basic simlarity, difference only be on soaking plate production typically first take out it is true
Sky reinjects liquid phase medium, so that liquid phase medium can fill up all micro-structurals of liquid-sucking core.The working medium of filling except methyl alcohol,
Alcohol, acetone etc. are outer, and most at a temperature of normal use are to utilize deionized water, because the specific heat capacity of water is big, and environmental protection,
And can further lift the efficiency and service life of soaking plate.The micro-structural of the liquid-sucking core commonly used in soaking plate at present mainly has two
Plant kenel：Copper powder sintering structure and braiding copper mesh structure.
The development trend of soaking plate is to need heat radiation power higher, and size is thinner, and at present either copper powder sintering is still compiled
Copper mesh sintering structure is knitted, still needs to improve constantly in product quality stability and the aspect of heat radiation power two.Intentionally get higher dissipating
Thermal power Qmax and further reduce thermal resistance, this be accomplished by finding a kind of material being more suitable for meet products application and market will
Ask.The ultra-thin foam ag material of Jiangsu Ge Ye new materials Science and Technology Ltd. exploitation is thermal conductivity highest metal due to silver, is led to
Cross and be prepared into ultra-thin Foam silver, be a kind of liquid-sucking core material of superior, above-mentioned performance and the requirement for preparing can be met.
The content of the invention
According to the soaking plate structure feature of current copper liquid-sucking core material, soaking plate liquid-sucking core can be expanded using Foam silver
Material and kind, and further improve soaking plate heat transfer efficiency and performance.The present invention proposes one kind
The preparation method of the soaking plate of liquid-sucking core, ultra-thin Foam silver itself has excellent heat conductivility, and it has as liquid-sucking core
Excellent capillarity and structure, can realize liquid medium rapid phase transition and circulation, and heat radiation power is high and product prepares temperature
Spend relatively low and consistency of performance good.Ultra-thin Foam silver proposed by the present invention for liquid-sucking core soaking plate manufacture, the ultra-thin foam
The hierarchy construction Foam silver that silver is produced for Jiangsu Ge Ye new materials Science and Technology Ltd., pore size scope is at 300 nanometers to 1 milli
Between rice, porosity can be selected according to design requirement in the range of 40%-95%, and material thickness can be according to soaking plate design requirement
Choose between 0.1-2 millimeters.
The present invention a kind of ultra-thin Foam silver for liquid-sucking core soaking plate manufacture, micro-structural such as Fig. 1 of its ultra-thin Foam silver
Shown, its aperture is hierarchy construction, and aperture varies, from more than 300 nanometers to even 1 millimeter of hundreds of microns；Ultra-thin bubble
The structural representation of the silver-colored soaking plate for liquid-sucking core of foam is as shown in Fig. 2 middle support column formwork structure such as Fig. 3 institutes of its vapor chamber
Show, support column can adopt the Foam silver or foam copper of desired thickness, the key step of concrete ultra-thin Foam silver soaking plate manufacture
It is as follows：
（1）Template is processed and cleaning：According to design requirement, material is adopted for red copper（Fine copper）The copper coin or copper of desired thickness
Paper tinsel, according to design requirement upper cover plate and lower shoe, and and drying and processing cleaned after processing to its surface are processed into；
（2）The processing of ultra-thin Foam silver and Foam silver or copper support column：By ultra-thin Foam silver according to upper cover plate and lower shoe
Inner-cavity structure Punching Technology, and the Foam silver or foam copper cylinder or block structure of Punching Technology desired thickness is used as intermediate supports
Post（Thickness requires to be at least greater than or equal to 0.8 millimeter according to usual vapor chamber）, the quantity of the Foam silver or foam copper support column
According to soaking plate inner-cavity structure layout, the diameter of support column may be selected to be the bubble of 2-8 millimeters or a width of 2-8 millimeters of block structure length
Foam silver or copper；
（3）Assembling between ultra-thin Foam silver and template：Ultra-thin Foam silver is inserted in corresponding upper cover plate and lower shoe；Will
Support column is placed in above base plate and ultra-thin Foam silver according to the Stainless Molding Board of location layout, and Foam silver or foam copper are supported
Post inserts the corresponding position of template；Stainless Molding Board also functions to certain pressure effect to the ultra-thin Foam silver of lower shoe, it is ensured that
Sinter bonded effect；
（4）High temperature reduction sintering processes：The maximum temperature that high temperature reduction is arranged is chosen between 700 DEG C -900 DEG C, burns
Knot temperature retention time was chosen in 30 minutes to 2 hours, it is therefore an objective to realize between ultra-thin Foam silver and upper cover plate and lower shoe and
Sintering diffusion bond between ultra-thin Foam silver and Foam silver or copper support column.The selection principle of actual temp and time can be with root
Determine according to bond strength required between ultra-thin Foam silver and cover plate and base plate, if needing bond strength big, select temperature phase
It is relatively long to high and temperature retention time；
（5）Welding assembly：Upper cover plate and lower shoe according to design requirement, by surrounding jointing edge in addition to vacuum pumping liquid injection mouth
Carry out the welding of vacuum or the copper silver solder under protective atmosphere；
（6）Encapsulation：According to vacuum level requirements, vacuumized, fluid injection and encapsulation；
（7）Performance test and inspection：The test and inspection of the hot propertys such as heat radiation power Qmax and thermal resistance are carried out after encapsulation, really
The performance and quality for protecting soaking plate meets requirement；
The soaking plate primary structure composition of the present invention includes three parts, as shown in Figure 2：
1. hollow shell：It includes material for purple（It is pure）Upper cover plate and lower shoe that the copper coin or Copper Foil of copper is processed into, lead to
Cross the sealed chamber that copper silver brazing solder bond is formed；
2. imbibition core segment：By the ultra-thin Foam silver of levels and support column Foam silver or copper constitute it is special with good capillary
Property structure, its ultra-thin Foam silver and pillar Foam silver and copper be hierarchy construction, is expanded by sintering under high temperature reducing atmospheres
Dissipating bind is combined, wherein being well combined between ultra-thin Foam silver liquid-sucking core and upper cover plate and lower shoe；
3. liquid medium：Generally adopt deionized water, ether, ethanol（Alcohol）With ammoniacal liquor etc., its addition is being filled in
The amount of the hole in capillary structure and support column arrangement is theoretical recommendation.
Therefore be the combination between the Foam silver or copper by three layers of hierarchy construction inside the soaking plate of the present invention, upper cover plate and
Combination between lower shoe inner surface and Foam silver is good diffusion bond.Because support column also uses capillary structure
Foam silver or copper, the reflowing result of liquid phase substantially, improves radiating effect after the conversion of medium vapour-liquid.
Support column adopts the cylinder of a diameter of 2-8 millimeters, and it is 2-8 millimeter block structures that size may also be employed, according to appropriate
Interval 8-15 millimeters, it is therefore an objective to play support and flow back resultant effect.
Description of the drawings
The micro-structural stereoscan photograph of the ultra-thin Foam silver of Fig. 1 hierarchy constructions
The ultra-thin Foam silvers of Fig. 2 are the soaking plate internal structure schematic diagram of liquid-sucking core
The formwork structure schematic diagram of the middle support column of Fig. 3 soaking plates
Fig. 4 column Foam silver support columns, 0.8 millimeter of support column thickness, soaking plate thickness is the structural representation of 2.4mm
Fig. 5 block structures Foam silver is support column, and soaking plate thickness is the structural representation of 3.6 mm
The Foam silver middle support column formwork structure schematic diagram of Fig. 6 examples 2
Specific embodiment：
Example 1, thickness is the manufacture of the soaking plate of 2.4mm：Upper cover plate and lower shoe adopt thickness for the red copper of 0.6mm
Plate, Jing compression moldings are as shown in figure 4, the chamber height for being formed is 1.2mm, and welds upper red copper fluid injection capillary, from river
After the thickness of Su Geye new materials Science and Technology Ltd. production is for the ultra-thin foam galactic longitude Punching Technology of 0.2mm, respectively at Shang Gai
The surface of plate and lower shoe passes through diffusion way sinter bonded, then from the thickness of Jiangsu Ge Ye new materials Science and Technology Ltd. production
Spend the silver-colored cylinder that Φ 4mm are made by punching press of hierarchy construction porous for 0.8mm（As shown in Figure 4）, by mode as shown in Figure 4
It is placed between upper cover plate and lower shoe, in the way of vacuum copper silver brazing, upper cover plate and lower shoe is compressed using heat-resisting steel mold,
So that the good face contact of edge juncture point, is combined together upper cover plate and lower shoe in vacuum brazing furnace, and formed
One height is the steam inner chamber of 0.8mm.Soldering combine temperature select be 750 DEG C, pressure is 5MPa, and keep the temperature and
Pressure is lower 1.5 hours.
Example 2, thickness is the manufacture of the soaking plate of 3.6 mm：Adopt the copper plate for going to the bottom plate thickness for 1 mm, upper cover plate
Thickness is as shown in figure 5, the steam chambers for being formed highly are on 2.0 mm, and welding for the copper plate Jing compression moldings of 0.6mm
Red copper liquid injection pipe, from Jiangsu Ge Ye new materials Science and Technology Ltd. production thickness be 0.4 mm Foam silver respectively at it is upper,
Lower cover inner surface is sintered by diffusion way, then the thickness produced from Jiangsu Ge Ye new materials Science and Technology Ltd. is 1.2
The porous silver of mm makes 3 x, 5 strips of 3x8mm by shearing, as shown in fig. 6, being placed in by mode as shown in Figure 6 upper and lower
Between cover plate, in the way of vacuum copper silver brazing, mould is done using graphite and compresses upper and lower cover plates, should in vacuum brazing furnace
Upper and lower cover is combined together, and forms a height for 1.2 mm chambers.The temperature that soldering is combined selects to be 800 DEG C that pressure is
5MPa, and keep the temperature and pressure lower 1 hour.
After the completion of above-mentioned two example, resistance to pressure and air tightness test are carried out by liquid injection pipe, reach and weld completely
The Eligibility requirements of sealing, then carry out next step vacuumize, fluid injection encapsulation, the evacuated vacuum in soaking plate inside（10-4Extremely
10-5torr）.According to calculate and by weigh appropriate deionized water is filled in soaking plate inner chamber by liquid injection pipe, then seal, it is complete
Into whole encapsulation preparation process, and carry out corresponding soaking plate hot property quality testing.
Claims (4)
1. a kind of ultra-thin Foam silver as liquid-sucking core soaking board fabrication method, using hierarchy construction different-thickness and porosity
The support column of ultra-thin Foam silver and Foam silver or foam copper is sintered in the red copper copper coin or Copper Foil of the different-thickness of Jing design processing
Made by upper cover plate and lower shoe, then assembly welding, after evacuated, fluid injection, encapsulation soaking plate is made；Its preparation process
Including：
(1) template processing and cleaning：According to design requirement, after the upper cover plate of red copper and lower shoe processing cleaned and dry place is needed
Reason；
(2) the support column processing of ultra-thin Foam silver and Foam silver or copper：By hierarchy construction Foam silver according to upper cover plate and lower shoe
Inner-cavity structure Punching Technology, and hierarchy construction Foam silver or foam copper cylinder or the block structure conduct of Punching Technology desired thickness
Middle support column, its thickness requires to be at least greater than or equal to 0.8 millimeter according to usual vapor chamber, the Foam silver or copper support column
Quantity may be selected to be the Foam silver or copper of 2-8 millimeters according to soaking plate inner-cavity structure layout, the diameter of support column, it is also possible to select
Size is the block structure of 2-8 millimeters as middle support column；
(3) assembling between ultra-thin Foam silver and template：Ultra-thin Foam silver is placed in corresponding upper cover plate and lower shoe；And while
Support column is placed in above base plate and Foam silver according to the Stainless Molding Board of its topology layout, by Foam silver or the support column of copper
The corresponding position of template is inserted, wherein Stainless Molding Board also functions to certain pressure effect to the ultra-thin Foam silver of lower shoe, protects
Card sinter bonded effect；
(4) high temperature reduction sintering processes：The maximum temperature that high temperature reduction is arranged is chosen between 700 DEG C -900 DEG C, sintered heat insulating
Time was chosen in 30 minutes to 2 hours, it is therefore an objective to realize between ultra-thin Foam silver and upper cover plate and lower shoe and ultra-thin bubble
Foam silver and the selection principle of the combination between Foam silver or copper support column, actual temp and time can be according to required bond strengths
To determine, required bond strength is big, then temperature may be selected high relatively long with the time；
(5) welding assembly：Upper cover plate and lower shoe are carried out surrounding bound fraction in addition to vacuum pumping liquid injection mouth according to design requirement
The welding of the copper silver solder under vacuum or protective atmosphere；
(6) encapsulate：According to vacuum level requirements, vacuumized, fluid injection and encapsulation；
(7) performance test and inspection：The test and inspection of the hot propertys such as heat radiation power Qmax and thermal resistance are carried out after encapsulation, it is ensured that
Reliability and quality requirement prepared by hot plate.
2. a kind of manufacture method of the soaking plate as liquid-sucking core of ultra-thin Foam silver as claimed in claim 1, the liquid-sucking core
Ultra-thin Foam silver used is the ultra-thin Foam silver of hierarchy construction, and using Foam silver or copper, pore size scope is from 300 for its support column
Nanometer is to 1000 microns；Porosity may be selected according to the design requirement of soaking plate between 40-95%；Foam silver liquid-sucking core material
Thickness can need to be selected between 0.1 millimeter to 2 millimeters according to soaking plate design.
3. manufacture method of a kind of ultra-thin Foam silver as claimed in claim 1 as the soaking plate of liquid-sucking core, it is characterised in that
The vapor chamber between upper cover plate and lower shoe after ultra-thin Foam silver sintering typically using the columned of thickness >=0.8 millimeter or
, used as support column, the quantity and size dimension of support column depend on size, generally for square block hierarchy construction Foam silver or copper
Interval between support column is substantially：8-15mm.
4. a kind of ultra-thin Foam silver as claimed in claim 1 is the soaking board fabrication method of liquid-sucking core, it is characterised in that described
The step of (4) high temperature reduction sintering processes, its reduction adopts hydrogen-nitrogen mixture gas, hydrogen：Nitrogen ratio is (75%-10%)：
(25%-90%), the ratio of hydrogen is reduced is adjusted using nitrogen, reduction is satisfied by the range of above-mentioned hydrogen-nitrogen mixture gas and is burnt
The quality requirement of knot.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410081954.XA CN104896983B (en) | 2014-03-07 | 2014-03-07 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410081954.XA CN104896983B (en) | 2014-03-07 | 2014-03-07 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104896983A CN104896983A (en) | 2015-09-09 |
| CN104896983B true CN104896983B (en) | 2017-04-26 |
Family
ID=54029800
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410081954.XA Active CN104896983B (en) | 2014-03-07 | 2014-03-07 | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104896983B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111442674A (en) * | 2020-03-17 | 2020-07-24 | 广州视源电子科技股份有限公司 | Method for processing heat dissipation plate |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107068846A (en) * | 2017-03-29 | 2017-08-18 | 华南理工大学 | A kind of LED phase-change heats substrate and preparation method thereof |
| CN107052612A (en) * | 2017-04-25 | 2017-08-18 | 哈尔滨工业大学深圳研究生院 | High-temp solder based on metallic tin filled and process silver and preparation method thereof |
| CN110267493B (en) * | 2019-06-12 | 2023-12-01 | 华南理工大学 | Flexible ultrathin liquid absorption core with hierarchical porous structure and manufacturing method thereof |
| CN112105219B (en) * | 2019-06-18 | 2023-06-09 | 讯凯国际股份有限公司 | Temperature equalizing plate and manufacturing method thereof |
| CN110763061A (en) * | 2019-10-31 | 2020-02-07 | 东莞市合众导热科技有限公司 | Vapor chamber and processing method thereof |
| CN111174616A (en) * | 2020-03-12 | 2020-05-19 | 深圳威铂驰热技术有限公司 | Ultrathin uniform temperature plate structure and manufacturing process thereof |
| CN111683501B (en) * | 2020-06-10 | 2022-11-01 | Oppo广东移动通信有限公司 | Heat dissipation device, preparation method of heat dissipation device and electronic equipment |
| WO2022025257A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conducting member |
| WO2022025255A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
| WO2022025256A1 (en) * | 2020-07-31 | 2022-02-03 | 日本電産株式会社 | Heat conduction member |
| CN114061347A (en) * | 2021-10-18 | 2022-02-18 | 中天超容科技有限公司 | Foam metal liquid absorption core, preparation method thereof and vapor chamber |
| CN113991215B (en) * | 2021-10-28 | 2024-06-25 | 深圳市顺熵科技有限公司 | Power battery module, power battery pack and thermal management method thereof |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20060196640A1 (en) * | 2004-12-01 | 2006-09-07 | Convergence Technologies Limited | Vapor chamber with boiling-enhanced multi-wick structure |
| CN200966197Y (en) * | 2006-05-12 | 2007-10-24 | 迈萪科技股份有限公司 | A soaking plate with the composite miniature structure |
-
2014
- 2014-03-07 CN CN201410081954.XA patent/CN104896983B/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111442674A (en) * | 2020-03-17 | 2020-07-24 | 广州视源电子科技股份有限公司 | Method for processing heat dissipation plate |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104896983A (en) | 2015-09-09 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN104896983B (en) | Manufacturing method of soaking plate with ultrathin foam silver as liquid absorbing core | |
| CN104764350B (en) | Method for manufacturing uniform-heating plate with foam copper as liquid absorption core | |
| CN105973045B (en) | A kind of flat-plate heat pipe and its manufacture method with multi-channel sintering supporting construction | |
| CN206556484U (en) | A kind of new type superthin soaking plate | |
| CN101848629B (en) | Soaking plate of foam metal and copper powder compounded capillary structure | |
| CN104792205B (en) | Manufacturing method of hierarchical-structured foamy copper soaking plate with combinational design | |
| CN105658032A (en) | Ultrathin soaking plate and manufacturing method thereof | |
| CN101354220B (en) | Imbibition core and plate type integrated hot pipe | |
| CN106091765A (en) | A kind of flat-plate heat pipe and preparation method thereof | |
| CN100535574C (en) | Method for manufacturing cylindrical heat pipe | |
| CN113465430B (en) | Ultrathin thermal diode based on gas-liquid coplanar structure and preparation method thereof | |
| CN110108139A (en) | A kind of soaking plate with support column and groove composite construction | |
| CN105202956A (en) | Manufacturing method of composite vapor chamber with base plate made of molybdenum-copper or tungsten-copper alloy and other heat sink materials | |
| TWI542850B (en) | Flat plate heat pipe structure and manufacturing method thereof | |
| CN113606972A (en) | Flexible ultrathin soaking plate and preparation method thereof | |
| CN108120333A (en) | A kind of flat-plate heat pipe microchannel composite heating radiator and its manufacturing method | |
| CN105307452B (en) | A kind of heat sink material is the manufacturing method of the ultra-thin soaking plate of bottom plate | |
| CN109612316A (en) | Thin-walled temperature-uniforming plate and its manufacturing method | |
| CN107588672A (en) | A kind of equalizing plate structure and its manufacture method | |
| CN106594691A (en) | Heat dissipation and waste heat recovery system for high-heat-flux device | |
| CN211012603U (en) | Ultrathin flexible flat heat pipe | |
| CN215832540U (en) | Ultra-light high-performance copper-aluminum composite soaking plate | |
| CN205897914U (en) | Flat plate heat pipe with multislot way sintering bearing structure | |
| JP5112374B2 (en) | Heat dissipating device for electronic equipment and manufacturing method thereof | |
| KR101329886B1 (en) | Evaporator for phase change heat transfer system |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20220617 Address after: 311231 No. 389, Hongxing Road, Xiaoshan robot Town, economic and Technological Development Zone, Xiaoshan District, Hangzhou City, Zhejiang Province Patentee after: Hangzhou Liangge Material Co.,Ltd. Address before: 212300 Shuangyi road entrepreneurship Park, Danyang Development Zone, Zhenjiang City, Jiangsu Province Patentee before: JIANGSU GREEN NEW MATERIAL SCIENCE & TECHNOLOGY CO.,LTD. |
|
| TR01 | Transfer of patent right |