CN104792205B - Manufacturing method of hierarchical-structured foamy copper soaking plate with combinational design - Google Patents
Manufacturing method of hierarchical-structured foamy copper soaking plate with combinational design Download PDFInfo
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- CN104792205B CN104792205B CN201410022375.8A CN201410022375A CN104792205B CN 104792205 B CN104792205 B CN 104792205B CN 201410022375 A CN201410022375 A CN 201410022375A CN 104792205 B CN104792205 B CN 104792205B
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- foam copper
- soaking plate
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- support column
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- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 title claims abstract description 93
- 229910052802 copper Inorganic materials 0.000 title claims abstract description 86
- 239000010949 copper Substances 0.000 title claims abstract description 86
- 238000002791 soaking Methods 0.000 title claims abstract description 52
- 238000013461 design Methods 0.000 title claims abstract description 31
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 15
- 238000002347 injection Methods 0.000 claims abstract description 11
- 239000007924 injection Substances 0.000 claims abstract description 11
- 239000007788 liquid Substances 0.000 claims abstract description 11
- 238000005245 sintering Methods 0.000 claims abstract description 7
- 238000003466 welding Methods 0.000 claims abstract description 7
- 239000006260 foam Substances 0.000 claims description 70
- 238000010276 construction Methods 0.000 claims description 38
- 238000000034 method Methods 0.000 claims description 17
- 238000001704 evaporation Methods 0.000 claims description 12
- 230000008020 evaporation Effects 0.000 claims description 11
- 238000005516 engineering process Methods 0.000 claims description 9
- 238000009792 diffusion process Methods 0.000 claims description 8
- 230000000694 effects Effects 0.000 claims description 8
- 238000005538 encapsulation Methods 0.000 claims description 8
- 238000012545 processing Methods 0.000 claims description 8
- 230000008569 process Effects 0.000 claims description 7
- 230000005855 radiation Effects 0.000 claims description 6
- 230000009467 reduction Effects 0.000 claims description 6
- 239000012530 fluid Substances 0.000 claims description 5
- 238000004080 punching Methods 0.000 claims description 5
- 238000007689 inspection Methods 0.000 claims description 4
- 238000000465 moulding Methods 0.000 claims description 4
- 239000011148 porous material Substances 0.000 claims description 4
- 238000002360 preparation method Methods 0.000 claims description 3
- 238000005086 pumping Methods 0.000 claims description 3
- 238000004140 cleaning Methods 0.000 claims description 2
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 2
- 238000011056 performance test Methods 0.000 claims description 2
- 230000001681 protective effect Effects 0.000 claims description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N nitrogen Substances N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims 6
- 229910052757 nitrogen Inorganic materials 0.000 claims 4
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims 2
- 239000007789 gas Substances 0.000 claims 2
- 239000001257 hydrogen Substances 0.000 claims 2
- 229910052739 hydrogen Inorganic materials 0.000 claims 2
- 239000000203 mixture Substances 0.000 claims 2
- 239000000470 constituent Substances 0.000 claims 1
- ALKZAGKDWUSJED-UHFFFAOYSA-N dinuclear copper ion Chemical compound [Cu].[Cu] ALKZAGKDWUSJED-UHFFFAOYSA-N 0.000 claims 1
- 238000005259 measurement Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000002207 thermal evaporation Methods 0.000 claims 1
- 239000007791 liquid phase Substances 0.000 abstract description 5
- 239000012071 phase Substances 0.000 abstract description 4
- 239000004065 semiconductor Substances 0.000 abstract description 4
- 230000008859 change Effects 0.000 abstract description 3
- 241001124569 Lycaenidae Species 0.000 abstract 1
- 235000014987 copper Nutrition 0.000 abstract 1
- 238000009776 industrial production Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- 230000002829 reductive effect Effects 0.000 abstract 1
- 239000000463 material Substances 0.000 description 10
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 238000009954 braiding Methods 0.000 description 3
- 239000011889 copper foil Substances 0.000 description 3
- 238000011161 development Methods 0.000 description 3
- 239000004616 structural foam Substances 0.000 description 3
- 239000008367 deionised water Substances 0.000 description 2
- 229910021641 deionized water Inorganic materials 0.000 description 2
- 238000009415 formwork Methods 0.000 description 2
- 238000012360 testing method Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Chemical compound O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 238000004891 communication Methods 0.000 description 1
- 230000006835 compression Effects 0.000 description 1
- 238000007906 compression Methods 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 150000002170 ethers Chemical class 0.000 description 1
- 238000011049 filling Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
- 238000005213 imbibition Methods 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000014759 maintenance of location Effects 0.000 description 1
- 238000012372 quality testing Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 230000009466 transformation Effects 0.000 description 1
- 238000009834 vaporization Methods 0.000 description 1
- 230000008016 vaporization Effects 0.000 description 1
- 238000005303 weighing Methods 0.000 description 1
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- Powder Metallurgy (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a manufacturing method of a hierarchical-structured foamy copper soaking plate with a combinational design. According to working principles of a soaking plate, a liquid absorbing core is combined by hierarchical-structured foamy coppers with different porosities according to design requirements; and then, the soaking plate is manufactured by high-temperature sintering under a reductive atmosphere, welding, vacuumizing, liquid injection and packing. A middle steam cavity also adopts a cylindrical hierarchical-structured foamy copper with a needed thickness as a support column, so that the quick flowing of a gas/liquid-phase medium is guaranteed, the phase change circulating speed is quickened, and the radiating efficiency is improved. The hierarchical-structured foamy copper soaking plate with the combinational design is high in radiating efficiency, suitable for manufacturing an ultrathin structure, light in weight, high in manufacturing precision and suitable for industrial production. The manufacturing method satisfies the requirements of high heat conductivity and miniaturization of such semiconductor electronic devices and equipment as high-heat current density computer chips, high-energy electronic chips, photoelectric chips or radio frequency chips.
Description
Technical field
The present invention relates to a kind of manufacture method of soaking plate, belong to semiconductor electronic component field, be by adopting
The modular design of the hierarchy construction foam copper of different porosities is as the soaking plate of wick and its preparation method.
Background technology
The high frequency of semi-conductor electronic device, high speed and the high density of integrated circuit and volume tend to microminiaturization and make unit
The energy consumption of the electronic component caloric value of volume and one single chip increases, and the design of facility compact structure makes radiating more tired again
The device that difficulty, therefore people constantly seek high efficiency and heat radiation always is required with the quasiconductor and electronic radiation meeting continuous development.Heat
The design of management device and the fast development researching and developing restriction quasiconductor and electronic device always, this problem is to high speed development just
Take the electronics unit device on electronics and communication apparatus, electronic component, high-tension high-power electronic device and military project and Aero-Space
The Grand Equipments such as part are most important.Nearly ten years the research and development of heat radiation module are built by heat pipe and soaking plate and application makes quasiconductor
Electronic device is rapidly developed.
Semi-conductor electronic device soaking plate (Vapor Chamber) is the vacuum cavity that an inwall has micro structure, works as heat
During by heat source to evaporating area, the liquid phase medium inside cavity can start liquid-phase vaporization in the environment of rough vacuum,
Absorb heat energy and rapid spatial expansion, and be progressively full of whole vapor chamber, the medium of gas phase, quickly through vapor chamber, is transmitted to
Just occur during one colder region to condense phenomenon, change by solution-air and discharge the liquid phase medium after latent heat of phase change, condensation
Can by micro structure on inwall capillarity again quick backflow to the evaporation ends of thermal source, this process will be gone round and begun again in cavity
Ground circulation is carried out, here it is the work process of soaking plate.Due to medium, in evaporation, the micro structure of wick has very strong hair
Thin power, so the work of soaking plate is not affected by gravity, is also referred to as non-directional in its bob-weight force characteristic and application process.
Soaking plate has the advantages that extension thermal resistance is low, uniform heat flux, heat quickly spread, lightweight and noiselessness, obtains
Among paying attention to and continually developing.
Common soaking plate is microchannel configuration, braiding copper mesh structure or the sintered copper powder structure processed by deformation at present
To be manufactured into the capillary structure of soaking plate respectively as wick.Then in copper sheet panel, processing has the miniature of capillarity
Groove difficulty is big, and its capillarity of copper mesh structure of braiding does not comply with one's wishes again, and sintered copper powder structure is difficult to control to finally to sinter again
Quality, thus the fraction defective of product and manufacturing expense is higher and effect is as one wishes not to the utmost.And the limited public affairs of Jiangsu lattice industry new material science and technology
The hierarchy construction foam copper that department produces all can overcome the shortcoming of above-mentioned three kinds of capillary structures, has the spy meeting soaking plate wick
Seek peace various performance requirements.Therefore, the present invention is the hierarchy construction bubble being produced using Jiangsu Ge Ye new material Science and Technology Ltd.
, as the soaking plate of wick, in conjunction with the characteristics of heat transfer of soaking plate, the hierarchy construction foam copper proposing can be combined design is equal for foam copper
The manufacture method of hot plate.
Content of the invention
The problem existing for the soaking plate of current groove structure, braiding copper mesh structure and sintered copper powder structure, the present invention
Propose one kind according to soaking plate application characteristic and architectural feature, that is, the flowing of evaporation end regions and other parts liquid medium is poor
Different, by the use of the hierarchy construction foam copper manufacture method that is combined the soaking plate as wick of different porosities, this classification
Structural foam copper has good capillary attraction, is capable of liquid medium phase transformation and Rapid Circulation, and heat radiation power higher and
Properties of product concordance is good.The foam copper of this hierarchy construction is produced by Jiangsu Ge Ye new material Science and Technology Ltd., pore size
Scope is controlled between 300 nanometers to 1 millimeter, and porosity can select in the range of 40%-95% according to design requirement.Specifically set
Meter method：The wick of soaking plate inner chamber is all using hierarchy construction foam copper and foam copper post, the portion of the evaporation ends that are wherein heated
Point, using the hierarchy construction foam copper of low porosity, its porosity may be selected in 40-75%；Other parts adopt high porosity
Hierarchy construction foam copper, porosity is 60-95%；Pore size scope is from 300 nanometers to 1 millimeter；Its thickness is typically chosen identical
Thickness, between 0.1 millimeter to 3 millimeters according to design requirement select but it is also possible to according to design requirement be heated evaporation ends and its
He partly selects thickness that is close but differing.
The hierarchy construction foam copper of a kind of combined design of the present invention is the manufacture method of wick soaking plate, its classification
The micro structure of structural foam copper as shown in Figure 1 it can be seen that the structure in its hole and pore size are different, that is, tie by hierarchy construction
Structure feature.The foam copper of different porosities is the feelings according to thermal source for the internal structure schematic diagram of the soaking plate of wick modular design
, respectively as shown in Fig. 2,3 and 4, the middle support column formwork structure of its vapor chamber is as shown in figure 5, specifically can be combined dividing of design for condition
The key step that level structural foam copper soaking plate manufactures is as follows：
（1）Template processing and cleaning：According to design requirement, it is red copper using material（Fine copper）Copper coin or Copper Foil according to setting
Upper cover plate and lower shoe are processed in meter requirement, and and drying and processing cleaned after processing to its surface；
（2）Foam copper and the processing of support column：Different porosities hierarchy construction foam copper is special according to soaking plate conduction of heat
Point carries out modular design, is punched out adding with reference to the position in upper cover plate and lower shoe inner-cavity structure and size requirements using mould
Work, and the hierarchy construction foam copper cylinder of Punching Technology design thickness is as middle support column（Thickness is generally according to steam
Chamber requires typically greater than or equal to 0.8 millimeter）, the quantity of this support copper post according to soaking plate inner-cavity structure and size layout, lead to
Often every support column is spaced apart 10-12 millimeter, and the diameter of support column may be selected to be the foam copper of 3 to 8 mm in sizes；
（3）Assembling between foam copper and template：Hierarchy construction foam copper same or like for different porosities thickness is pressed
Require to insert in designed upper cover plate and lower shoe according to combinative structure；And the Stainless Molding Board of support column layout structure will be controlled
It is placed in above base plate and foam copper, foam copper support column is inserted the corresponding position of template, Stainless Molding Board is to lower shoe
Foam copper also functions to certain pressure effect it is ensured that sinter bonded effect；
（4）High temperature reduction sintering processes：The maximum temperature of generally high temperature reduction setting can be 850oC-1050oSelect between C
Take, the sintered heat insulating time chose in 30 minutes to 2 hours it is therefore an objective to realize the hierarchy construction foam copper of different porosities with
Effective sinter bonded between cover plate and lower shoe and between foam copper and foam copper support column.Actual temp and time
Selection principle can determine according to bond strength between foam copper and upper cover plate and lower shoe, if needing bond strength big, selects
Select temperature high relatively long with temperature retention time；
（5）Welding assembly：By the upper cover plate of the hierarchy construction foam copper sintering of different porosities and lower shoe according to weldering
The mould connecing or fixture require, by surrounding jointing edge（In addition to vacuum pumping liquid injection mouth）Carry out the copper silver under vacuum or protective atmosphere
Welding or Diffusion Welding；
（6）Encapsulation：According to vacuum level requirements, evacuation, fluid injection and encapsulation；
（7）Performance test and inspection：Carry out test and the inspection of the hot propertys such as heat radiation power Qmax and thermal resistance, really after encapsulation
Protect the quality of soaking plate；
The primary structure of the hierarchy construction foam copper soaking plate of the combined design of the present invention forms as shown in Fig. 2,3 and 4：
1. shell structure, it comprises upper cover plate and the lower shoe that material is the copper coin of fine copper or Copper Foil is processed into, and then will
The foam copper product of different porosities and support column are sintered in corresponding position and pass through solder bond, and form one and have steam
The chamber structure of the sealing in chamber；
2. the capillary structure of imbibition core segment and supporting construction, is by the hierarchy construction foam copper of different porosities, and leads to
Cross diffusion bond under high temperature reducing atmospheres together, be well combined, the foam copper of different porosities and upper and lower mould in wick
Being well combined between plate；
3. liquid medium, such as deionized water, ethanol, ethanol and ethers, its addition is to be filled in capillary structure and to prop up
The amount of the hole in hinge structure is theoretical recommendation.
Inside the soaking plate of the present invention be therefore by the foam copper of the hierarchy construction of different porosities between combination formed,
Combination between upper cover plate and lower shoe inner surface and foam copper is good diffusion bond.Because support column also uses hair
The foam copper of fine texture, plays good backflow effect, after the conversion of medium vapour-liquid, the reflowing result of liquid phase substantially, improves radiating
Effect.
The structure of support column adopts the cylindrical arrangement of a diameter of 3-8 millimeter, other templates such as square structure may also be employed and make
For supporting it is therefore an objective to reach the resultant effect supporting and flowing back.
Brief description
Fig. 1 is the micro structure stereoscan photograph of hierarchy construction foam copper
Fig. 2 is the soaking plate internal structure modular design schematic diagram that single heat source foam copper is wick
Fig. 3 is multi-heat source（Such as 4 thermals source, but thermal source is closely located）The soaking plate internal junction being wick with foam copper
Structure modular design
Fig. 4 is multi-heat source（Such as 4 thermals source, but thermal source distance is relatively remote）It is inside the soaking plate of wick with foam copper
Structure Combination Design
Fig. 5 is the formwork structure schematic diagram of middle support column in soaking plate
A kind of soaking plate with foam copper of the modular design of a size of 100x100 millimeter as wick for the Fig. 6, its gross thickness
Single heat source soaking plate internal structure schematic diagram for 3 millimeters
Instantiation：A kind of size is the soaking plate for wick for the foam copper of 100x100 millimeter, and gross thickness is 3
Millimeter, the thermal source that is heated is the soaking plate internal combination structure of single heat source, and thermal source is evaporation ends size is 30x30 millimeter.Upper cover plate
It is respectively adopted, with lower shoe, the fine copper plate that thickness is 0.6mm and 1.0mm, be as shown in fig. 6, punching press or machining through compression molding
One-tenth chamber height is 1.4mm, and the position of reserved vacuum pumping liquid injection is used for follow-up fluid injection encapsulation.The foam copper material of different porosities
The hierarchy construction foam copper that material is 0.2mm from the thickness that Jiangsu Ge Ye new material Science and Technology Ltd. produces, but porosity is divided
Wei not 85% and 60% combined structure design.Wherein thermal source evaporation ends area size is 30x30mm, so the material of upper cover plate adopts
Porosity is 85%, and the foam copper that the position of the thermal source evaporation ends part of lower shoe is 60% using porosity, except thermal source steams
Make a start outside region partly equally adopt 85% foam copper.Middle support column is also adopted by the limited public affairs of Jiangsu lattice industry new material science and technology
The thickness that department produces is the hierarchy construction Porous Cu of 1.0mm, and makes the cylinder of Φ 5mm by punching press（As shown in Figure 6）Upper lid
Plate, lower shoe and middle support column by High temperature diffusion mode sinter bonded, as shown in Figure 6.Between upper cover plate and lower shoe, with
High temperature diffusion mode combines, using graphite jig compression upper cover plate with lower shoe so that edge juncture divides good face to contact,
Upper cover plate, lower shoe and support column is realized in diffusion in vacuum stove（Foam copper）It is combined together, forming a height is 1.0mm
Steam inner chamber.The temperature of diffusion bond is chosen as 980 DEG C, and pressure is 5MPa, and keeps this temperature and pressure lower 1 hour.
After the completion of examples detailed above, resistance to pressure and air tightness test are carried out by liquid injection pipe, all reaches complete welded seal
Eligibility requirements, then carry out evacuation, the fluid injection encapsulation of next step, the internal evacuation of soaking plate, its vacuum is evacuated to 10 again-4-
10-5torr.Then, according to calculating weighing by the appropriate deionized water of liquid injection pipe filling, in soaking plate inner chamber, then seal, complete
Become whole and encapsulate preparation process, and carry out the hot property quality testing of corresponding soaking plate.
Claims (4)
1. a kind of manufacture method of the hierarchy construction foam copper soaking plate of combined design, according to soaking plate application operating mode, is being subject to
Thermal evaporation end or claim thermal source part, the hierarchy construction foam copper using low porosity is sintered on base plate, the inner chamber of upper cover plate and
The other parts that lower shoe is heated outside the region of evaporation ends using the hierarchy construction foam copper of high porosity and are sintered in upper cover plate
On lower shoe, support column is also adopted by the foam copper of hierarchy construction, and according to corresponding dimensional requirement layout and combination, then group
Welding equipment connects, and makes soaking plate after evacuated, fluid injection, encapsulation；
Its preparation process includes：
(1) template processing and cleaning：According to soaking plate application requirement, according to mould structure punch process fine copper upper cover plate and under
Base plate, needs cleaned and dried after processing；
(2) processing of foam copper and support column：The requirement that the hierarchy construction foam copper of different porosities is applied according to soaking plate,
Press mould structure Punching Technology, and the hierarchy construction foam copper cylinder conduct of Punching Technology desired thickness in conjunction with inner-cavity structure feature
Middle support column；
(3) assembling between foam copper and template：By the hierarchy construction foam copper of different porosities insert corresponding upper cover plate and under
In base plate；And the Stainless Molding Board controlling support column layout structure is placed in above lower shoe and foam copper, foam copper is propped up
The corresponding position of template inserted by dagger, and wherein this Stainless Molding Board also functions to certain pressure effect to the foam copper of lower shoe,
Ensure sinter bonded effect；
(4) high temperature reduction sintering processes：The maximum temperature of high temperature reduction setting is chosen between 850 DEG C -1050 DEG C, sintered heat insulating
Time was chosen it is therefore an objective to realize between foam copper and upper cover plate and lower shoe and foam copper and bubble in 30 minutes to 2 hours
Sinter bonded between foam copper support column, the selection principle of actual temp and time can determine according to required bond strength,
Required bond strength is big, then temperature may be selected high relatively long with the time；
(5) welding assembly：Upper cover plate and lower shoe, according to design requirement, surrounding jointing edge are carried out in addition to vacuum pumping liquid injection mouth
Copper silver soldering under vacuum or protective atmosphere connects or Diffusion Welding；
(6) encapsulate：According to vacuum level requirements, carry out evacuation, fluid injection and encapsulation；
(7) performance test and inspection：Carry out heat radiation power Qmax and thermo-resistance measurement and inspection it is ensured that the matter of soaking plate after encapsulation
Amount.
2. the manufacture method of the hierarchy construction foam copper soaking plate of a kind of combined design as claimed in claim 1, this soaking
The wick of plate inner chamber is all using different porosities hierarchy construction foam copper and foam copper support column, the portion of the evaporation ends that are wherein heated
Point, using the hierarchy construction foam copper of low porosity, its porosity may be selected in 40-75%；Other parts adopt high porosity
Hierarchy construction foam copper, porosity be 60-95%；Pore size scope is at 300 nanometers to 1000 microns；It is typically chosen identical
Thickness, between 0.1 millimeter to 3 millimeters by design requirement select but it is also possible to according to design requirement be heated evaporation ends and other
Part selects thickness that is close but differing.
3. the manufacture method of the hierarchy construction foam copper soaking plate of a kind of combined design as claimed in claim 1, its feature
It is that the vapor chamber between the upper cover plate after foam copper sintering and lower shoe typically adopts the circle that thickness is more than or equal to 0.8 millimeter
Column or square hierarchy construction foam copper support column, the quantity of this support column is every according to soaking plate inner-cavity structure layout
Every 10-12 millimeter one support column, the diameter of support column may be selected to be the foam copper copper post of 3 to 8 mm in sizes it is also possible to select it
His block structure is as middle support column.
4. the manufacture method of the hierarchy construction foam copper soaking plate of a kind of combined design as claimed in claim 1, its high temperature
In reduction sintering processes, reduction adopts hydrogen-nitrogen mixture gas, and H-N ratio example is (75%-10%)：(25%-90%), wherein hydrogen
The ratio of nitrogen is 75%：It is the ratio of constituents when 25%, the ratio adjustment of hydrogen can utilize nitrogen, in above-mentioned hydrogen-nitrogen mixture gas
In the range of be satisfied by reduce sintering prescription.
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105385568B (en) * | 2015-12-24 | 2018-01-16 | 中国人民解放军军事医学科学院卫生装备研究所 | A kind of miniature nucleic acid amplifier of gas bath capillary type |
| CN106225537A (en) * | 2016-07-28 | 2016-12-14 | 苏州聚力电机有限公司 | The capillary structure configuration structure of soaking plate and collocation method thereof |
| CN106152847A (en) * | 2016-07-28 | 2016-11-23 | 苏州聚力电机有限公司 | The capillary structure configuration structure of a kind of soaking plate and collocation method thereof |
| CN108457132A (en) * | 2018-04-10 | 2018-08-28 | 浙江舒康科技有限公司 | Aluminium ammonia heat pipe paper mould hot-pressing drying mold and drying means |
| CN110035642A (en) * | 2019-05-21 | 2019-07-19 | 广东工业大学 | A kind of liquid-cooled heat-conducting block and water-cooling type radiator |
| CN111194160A (en) * | 2020-02-24 | 2020-05-22 | 北京中石伟业科技无锡有限公司 | Ultra-thin asymmetric soaking plate based on foamy copper |
| CN112693636A (en) * | 2020-12-28 | 2021-04-23 | 上海卫星工程研究所 | Light-weight thermal control device for satellite and manufacturing method thereof |
| CN113758327B (en) * | 2021-08-13 | 2022-06-17 | 中南大学 | Composite VC radiator containing copper/diamond sintered liquid absorption cores and preparation method thereof |
| CN114083841A (en) * | 2021-12-16 | 2022-02-25 | 成都四威高科技产业园有限公司 | High-thermal-conductivity graphite film temperature-equalizing plate and preparation method thereof |
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| CN101040162A (en) * | 2004-12-01 | 2007-09-19 | 嘉合科技有限公司 | Vapor chamber with boiling-enhanced multi-wick structure |
| CN200966197Y (en) * | 2006-05-12 | 2007-10-24 | 迈萪科技股份有限公司 | A soaking plate with the composite miniature structure |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI434018B (en) * | 2011-06-17 | 2014-04-11 | Forcecon Technology Co Ltd | High efficiency long heat pipe structure and manufacturing method thereof |
| CN102595861B (en) * | 2012-03-12 | 2014-12-31 | 华南理工大学 | Vapor chamber having support posts with inner-sintering structure |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101040162A (en) * | 2004-12-01 | 2007-09-19 | 嘉合科技有限公司 | Vapor chamber with boiling-enhanced multi-wick structure |
| CN200966197Y (en) * | 2006-05-12 | 2007-10-24 | 迈萪科技股份有限公司 | A soaking plate with the composite miniature structure |
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