CN105841532A - Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate - Google Patents
Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate Download PDFInfo
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- CN105841532A CN105841532A CN201510014597.XA CN201510014597A CN105841532A CN 105841532 A CN105841532 A CN 105841532A CN 201510014597 A CN201510014597 A CN 201510014597A CN 105841532 A CN105841532 A CN 105841532A
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Abstract
The invention discloses a method for manufacturing a heat-pipe-parallel-structure-like vapor plate by using stepped foamy copper as wicks. The vapor plate is characterized in that an upper copper covering plate, a lower copper covering plate and a stepped or flat foamy copper are sintered, a heat-pipe-structure-like vapor chambers are formed according a geometrical shape, and a liquid phase working medium is injected to the heat-pipe-structure-like vapor chambers; foamy copper steps are rectangle-shaped or trapezoid-shaped, and the foamy copper steps and the flat or stepped foamy copper are sintered on the upper copper covering plate and the lower copper covering plate according to a geometrical structure; a boss portion of the stepped foamy copper has a support effect; after the upper copper covering plate and the lower copper covering plate are combined through copper silver brazing or diffusion welding, vacuum pumping and liquid phase working medium injection are performed. The stepped foamy copper has high porosity and a good capillary character, the vapor chambers mutually communicates, rapid and high-efficient liquid-vapor conversion and gas phase rapid diffusion of in the liquid phase working medium in the vapor end can be ensured, and rapid backflow resistance of a condensation end can be reduced after the liquid-vapor conversion. The manufactured heat-pipe-parallel-structure-like vapor plate can meet the demands of semiconductor electronic devices for rapid and high-efficient heat conduction and heat dissipation.
Description
Technical field
The present invention is about a kind of quick conductive and the manufacture method of the Thermal Conduction Equipment of heat radiation, it is related specifically to a kind of by by the ledge structure foam copper of rectangular and trapezoidal shapes shape, according to Structural Design Requirement, the manufacture method of the class heat pipe parallel organization soaking plate of formation, belong to electronic device class.
Background technology
Along with communication information and the development of equipment, people are more and more higher to the requirement of electronic integration system and product, mainly towards the aspect development such as thin, light, little, efficient, attractive in appearance.But improve in electronic integration system and function, bulk limited in the case of, the power and thermal of chip and system will significantly rise.CPU or the GPU caloric value of such as some computers is more than 100W/cm2, such thing followed is that the rate of heat dispation of product is the slowest, causes whole product temperature rise too fast too high, and too high temperature rise can greatly affect performance and the life-span of electronic system, even can burn out chip and mainboard.Thus how making the heat on chip quickly derive and distribute, the heat management effectively realizing integrated circuit (IC) system has become electron trade problem demanding prompt solution.
Wherein application liquid phase-change can quickly transmit phase-change heat element such as the heat pipe and soaking plate that amount of heat principle makes and is continuously available research and development and applies.Soaking plate is identical with the principle of heat pipe, and the only mode of conduction of heat is different, and the heat exchange pattern of heat pipe is one-dimensional, is linear heat exchange pattern, can reduce its heat transfer property because of less area of dissipation and bigger thermal resistance in some specific occasion；And the heat exchange pattern of soaking plate is two-dimentional, it it is the heat exchange pattern on direction, face, compared with heat pipe, test finds the radiating efficiency Qmax heat pipe to be much higher than of typically each hot plate, and its thermal resistance is the most much smaller, because soaking plate can being evenly distributed to quick and intimate for the high heat flux of one or more thermals source isothermal in a big plane rapidly, thus derive rapidly the heat that the electronic equipment that even sheds produces.Therefore, soaking plate is by Electron Heat management domain rapidly and efficiently needed for being progressively applied to.
The dimensional structure of soaking plate generally need to determine according to the size of selected chip and integrated situation, mostly therefore is nonstandard or customized product, cooling requirements rapidly and efficiently needed for meeting.Determine soaking plate hot property it is crucial that its internal structure i.e. wick material and structure, current screen knitting structure, capillary properties is poor, and the porosity of copper powder sintering structure is only 38-45%, during application generation thermal cycle backflow thermal resistance relatively large.In order to overcome above-mentioned deficiency and guarantee the hot property of soaking plate, propose the step foam copper the using high porosity wick as soaking plate, form the manufacture method with class heat pipe parallel organization soaking plate.
Summary of the invention
The invention discloses the soaking plate manufacture method of a kind heat pipe parallel organization, wick is to use rectangle or trapezoidal shape ledge structure foam copper, its porosity requires to select between 40-95% according to design, rectangle or trapezoidal shape foam copper are except being sintered in upper and lower cover plates, correspondence is sintered together or it is sintered together with planar structure foam copper up and down, step will play good support column effect, and form compartment vapor chamber, ensure that the quick diffusion after medium gasification, the vapor chamber of ledge structure and edge surrounding are whole UNICOMs, fluid injection encapsulation after guarantee its homogeneous temperature and rapidly and efficiently heat conduction and heat dispersion.
The present invention prepares class heat pipe parallel organization foam copper soaking plate by techniques below approach:
Step foam copper is that the composition of the soaking plate of the class heat pipe parallel organization of wick includes: upper cover copper coin, lower cover copper coin, pure foam copper wick and liquid phase working fluid.Wherein the step foam copper as wick is sintered in upper and lower cover plates respectively, then rectangle or trapezoidal shape correspondence according to its geometry are sintered together or are sintered together with planar structure sintered copper, simultaneously by copper silver brazing or direct diffusion welding between upper and lower cover plates, its structure forms as shown in Figure 1.The Bao district thickness of step foam copper is 0.1mm, and the height of step is 0.3-1.5 millimeter.
As liquid sucting core structure as shown in Figure 2 (a) and (b), wherein Fig. 2 (a) is to be the combinative structure that step foam copper is corresponding up and down to described step foam copper；Fig. 2 (b) is planar structure foam copper and the combinative structure of step foam copper.
Described upper and lower cover plates is no-oxygen copper plate.
Described liquid phase working fluid is the other materials such as deionized water, ethanol (ethanol), acetone, ether.
By high-temperature vacuum or reduction sinter bonded between described upper and lower copper cover plate and foam copper, also it is to realize good combination by the welding of the copper silver solder under vacuum or reducing atmosphere or High temperature diffusion between copper cover plate up and down, it is specifically intended that the surrounding of the capillary brass pipe for noting liquid phase working fluid is necessary to ensure that solder bond is good.
Wherein liquid sucting core structure plays vital effect in soaking plate designs, the present invention uses has step or planar structure foam copper as wick, have the advantage that (1) can select the foam copper of high porosity as required, its porosity can be chosen between 40-95%, foam copper can select the material of same porosity up and down, it is also possible to selects the material of different porosities.When selecting the foam copper of high porosity, the resistance refluxed from cold end is just greatly reduced；(2) the foam copper support column that ledge structure foam copper is formed has good support and reflowing result, it is ensured that the flatness of soaking plate manufacture process and the phase transformation circulation of liquid phase working fluid can quickly be carried out；(3) use the ledge structure foam copper material of high porosity, can preferably simplify the preparation technology of soaking plate and the concordance of hot property, it is also possible to the thickness of relative reduction soaking plate and the weight alleviating soaking plate.
Detailed description of the invention:
Two examples are enumerated to further describe the manufacture method of the present invention below in conjunction with specific embodiments.
Example 1, the thickness using manufacture of the present invention is 2.4 millimeters, and overall dimensions is the soaking plate of 100 × 100mm, as it is shown on figure 3, concrete grammar is as follows:
(1) the oxygen-free copper thin plate that two pieces of thickness is 0.6 mm is chosen, lower cover contour structure size specification is 100mm × 100mm, size after upper cover plate machining or punching press is 100mm × 100mm, wherein being about 4 millimeters in upper and lower cover plates for the size encapsulating edge, therefore the effective dimensions of soaking plate is about 96mm × 96mm.
(2) upper cover plate is the slab construction being made the band edge that depth of inner cavity is 1.2 millimeters by machining or punch forming, and wherein the width at edge is 4 millimeters, overall dimensions be 100mm × 100mm as shown in Figure 3.The step foam copper used and the combinative structure of planar structure foam copper are as shown in the sectional view of Fig. 3, wherein the thickness of step foam copper is 0.2 mm, thickness at step be 1.0 mm, i.e. shoulder height be 0.8 mm, the thickness of planar structure foam copper is 0.2 mm.The width of step is 3 mm, and the width of conduit is 8 mm, in periodic structure.The vapor chamber height so formed after combination is 0.8 mm, and width is 8 mm, as shown in Figure 3.
(3) step foam copper chooses porosity is 80%, and planar structure foam copper also selects identical porosity.Wherein according to the structure of upper and lower cover plates, machine or be die-cut into a size of 96mm × 96mm, follow-up respectively under the reducing atmosphere of hydrogen nitrogen mixing, 950oC insulation is sintered in upper and lower cover plates for 30 minutes.
(4) then corresponding with the upper and lower cover plates of planar foam copper, at clock hood type furnace 980 containing step foam copper by sinteroC is incubated under the hydrogen reduction atmosphere of 1 hour the sinter bonded of the step contact position realized between upper and lower cover plates diffusion-sintering combination and foam copper, wherein notes guaranteeing that the solder bond of the capillary brass pipe of vacuum pumping liquid injection as shown in Figure 3 is good.
(5) evacuation of soaking plate is with perfusion working medium: utilize vacuum pumping liquid injection equipment that soaking plate is carried out vacuum pumping liquid injection operation after having welded.After vacuum meets corresponding vacuum level requirements, porosity according to wick is calculated, inject appropriate working medium, such as according to distilled water, being computed addition can be in the range of 4.4-4.5g, after injecting and encapsulating and carry out secondary degasification, removes Incompressible gas as far as possible, improve the uniform temperature of soaking plate, then the capillary brass pipe of vacuum pumping liquid injection is carried out argon arc.
(6), after soaking plate is made, its thermal characteristics need to be tested, soaking plate be carried out aging and reliability testing simultaneously.
Example 2, the thickness using manufacture of the present invention is 3 millimeters, the soaking plate of a diameter of f100 mm, and as shown in Figure 4, concrete grammar is as follows for its structure:
(1) the oxygen-free copper thin plate that two pieces of thickness is 0.6 mm is chosen, lower cover format diameter is f100mm, wherein upper cover plate is after stamped shaping or machining, overall diameter is identical with lower cover diameter, it is f100mm, after such upper and lower cover plates combines, forms the soaking plate of a diameter of f100mm, wherein upper and lower cover plates is about 4mm, as shown in Figure 4 for the edge size of encapsulation.
(2) upper cover plate is made the Circular plate structure of the band edge that depth of inner cavity is 1.8mm by punch forming or machining, and wherein the width at edge is about 4mm, as shown in Figure 4.As shown in the sectional view of figure 4, wherein the thickness of foam copper is 0.3mm to step foam copper structure used, and the thickness at step is 0.9mm, and the height of step is then 0.6mm, and the width of step is 4mm, and the width of conduit is 8mm, in periodic structure.So after up/down steps convex place correspondence, the vapor chamber height of formation is 1.2mm, as shown in Figure 4.
(3) step foam copper is chosen porosity and is respectively 60% and 80%, and wherein upper cover plate uses porosity to be the foam copper of 60%, and lower cover uses porosity to be the foam copper of 80%, guarantees that upper and lower foam copper can be completely combined according to the structure of upper and lower cover plates.Then according to the correspondence of geometry, respectively under the reducing atmosphere of hydrogen nitrogen mixing, through 950oC insulation is sintered in upper and lower cover plates for 30 minutes.
(4) then by corresponding, 980 under clock hood type furnace hydrogen reduction atmosphere for the upper and lower cover plates of the step foam copper sintered oCIt is incubated 1 hour, it is achieved the sinter bonded between diffusion-sintering combination and the foam copper step of upper and lower cover plates, including the good welds between the capillary brass pipe of vacuum pumping liquid injection and upper and lower cover plates.
(5) evacuation of soaking plate is with perfusion working medium: utilize vacuum pumping liquid injection equipment that soaking plate is carried out vacuum pumping liquid injection process after having welded.Utilize after having welded and first soaking plate is carried out evacuation process, after vacuum meets requirement, the reservoir quantity of computational theory will be carried out according to foam copper porosity, inject appropriate working medium, such as according to distilled water, being computed addition is 4.0-4.1g, fluid injection encapsulation after and carry out secondary degasification, remove Incompressible gas as far as possible, improve the uniform temperature of soaking plate.
(6) after soaking plate is made, its thermal characteristics need to be tested, soaking plate be carried out aging and reliability detection simultaneously, then carries out required surface and process, complete the preparation process of whole soaking plate.
Accompanying drawing illustrates:
Fig. 1 is the soaking plate structure schematic diagram that step foam copper is wick of the present invention.Bleed and liquid injection pipe, installing hole etc. including upper and lower cover plates, foam copper wick, copper
Fig. 2 is to be combined as the structural representation of wick between step foam copper or with planar structure foam copper
Fig. 3 be a size of 100*100mm, thickness be soaking plate structure and the sectional view of 2.4mm
Fig. 4 be a diameter of f100mm, thickness be soaking plate structure and the sectional view of 3mm
Claims (5)
1. a step foam copper manufacture method as the class heat pipe parallel organization soaking plate of wick with good capillarity, it is characterized in that: the contour structures rectangular and trapezoidal shapes shape ledge structure of described foam copper, according to up and down corresponding or its combine with planar structure foam copper, forming the vapor chamber of parallel interval, wherein step is as the support column of soaking plate.
The soaking plate being formed class heat pipe parallel organization by step foam copper the most according to claim 1, it is characterized in that described foam copper rectangular and trapezoidal shapes shape ledge structure, wherein the thickness difference of foam copper i.e. shoulder height is 0.3～1.5mm, if the most corresponding vapor chamber height formed as support column is 0.6 ~ 3.0 millimeter；As it is combined with planar structure foam copper, the vapor chamber height formed is 0.3-1.5 millimeter, and the size of concrete required vapor chamber will carry out selection according to Structural Design Requirement numerical value and determine.
The class heat pipe parallel organization soaking plate formed by step foam copper the most according to claim 1, it is characterised in that described upper and lower copper cover plate and corresponding foam copper material are fine copper i.e. oxygen-free copper.
The class heat pipe parallel organization soaking plate formed by step foam copper the most according to claim 1, it is characterized in that the porosity of foam copper can require to select according to design and performance at 40-95%, foam copper can use same porosity up and down, it would however also be possible to employ different porosities.
The class heat pipe parallel organization soaking plate formed by step foam copper the most according to claim 1, its architectural feature is that all of vapor chamber forms the parallel and class heat pipe structure at interval, and vapor chamber passes through the through connection in surrounding, it is ensured that the uniform temperature of soaking plate.
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| CN201510014597.XA CN105841532A (en) | 2015-01-12 | 2015-01-12 | Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate |
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| CN201510014597.XA CN105841532A (en) | 2015-01-12 | 2015-01-12 | Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate |
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Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106979712A (en) * | 2017-04-01 | 2017-07-25 | 华南理工大学 | A kind of preparation method of flexible soft state copper/aluminium strip heat pipe of oldered array distribution multiple fibre |
| CN107116279A (en) * | 2017-06-01 | 2017-09-01 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Integration system for foam metal phase change temperature control component method |
| CN107702342A (en) * | 2017-09-25 | 2018-02-16 | 珠海格力电器股份有限公司 | Water tank top cover foam, water tank, water heater and water tank crimping method |
| WO2018198350A1 (en) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | Vapor chamber |
| CN111194160A (en) * | 2020-02-24 | 2020-05-22 | 北京中石伟业科技无锡有限公司 | Ultra-thin asymmetric soaking plate based on foamy copper |
| CN111712682A (en) * | 2018-07-31 | 2020-09-25 | 株式会社村田制作所 | Vapor chamber |
| WO2021043309A1 (en) * | 2019-09-06 | 2021-03-11 | 华为技术有限公司 | Vapor chamber and terminal device |
| CN113601113A (en) * | 2021-08-05 | 2021-11-05 | 冷联科技(南京)有限公司 | Preparation method and preparation device of energy storage plate |
-
2015
- 2015-01-12 CN CN201510014597.XA patent/CN105841532A/en active Pending
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106979712A (en) * | 2017-04-01 | 2017-07-25 | 华南理工大学 | A kind of preparation method of flexible soft state copper/aluminium strip heat pipe of oldered array distribution multiple fibre |
| WO2018198350A1 (en) * | 2017-04-28 | 2018-11-01 | 株式会社村田製作所 | Vapor chamber |
| CN107116279A (en) * | 2017-06-01 | 2017-09-01 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Integration system for foam metal phase change temperature control component method |
| CN107702342A (en) * | 2017-09-25 | 2018-02-16 | 珠海格力电器股份有限公司 | Water tank top cover foam, water tank, water heater and water tank crimping method |
| CN107702342B (en) * | 2017-09-25 | 2023-08-18 | 珠海格力电器股份有限公司 | Water tank top cover foam, water tank, water heater and water tank curling method |
| CN111712682A (en) * | 2018-07-31 | 2020-09-25 | 株式会社村田制作所 | Vapor chamber |
| CN111712682B (en) * | 2018-07-31 | 2021-11-19 | 株式会社村田制作所 | Vapor chamber |
| WO2021043309A1 (en) * | 2019-09-06 | 2021-03-11 | 华为技术有限公司 | Vapor chamber and terminal device |
| CN111194160A (en) * | 2020-02-24 | 2020-05-22 | 北京中石伟业科技无锡有限公司 | Ultra-thin asymmetric soaking plate based on foamy copper |
| CN113601113A (en) * | 2021-08-05 | 2021-11-05 | 冷联科技(南京)有限公司 | Preparation method and preparation device of energy storage plate |
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Application publication date: 20160810 |