CN209546220U - Ultra-thin heat-transfer device - Google Patents
Ultra-thin heat-transfer device Download PDFInfo
- Publication number
- CN209546220U CN209546220U CN201920051151.8U CN201920051151U CN209546220U CN 209546220 U CN209546220 U CN 209546220U CN 201920051151 U CN201920051151 U CN 201920051151U CN 209546220 U CN209546220 U CN 209546220U
- Authority
- CN
- China
- Prior art keywords
- heat
- ultra
- transfer device
- support column
- rice
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to technical field of heat dissipation more particularly to a kind of ultra-thin heat-transfer device, ultra-thin heat-transfer device includes upper housing, lower case, filling liquid pipe；Upper housing is connected with the peripheral sealing of lower case, microchannel structural design is in the good upper-lower casing of pre-production, form ultra-thin ultra-thin heat-transfer device, pass through the setting of fluid channel, capillary structure is formed as a structure convenient for gas-liquid phase transition circulation, it is vaporized and is absorbed heat by working media, the process of liquidation exothermic reaction quickly, uniformly passes the heat of hot source point；In the present solution, passing through the setting in " rice " font support column area, " rice " font support column area and hot source point are corresponding, heat radiates in " rice " font support column area first, and heat dissipation area is big, passes through the setting for peripheral region of radiating, sink zones can be formed to capillary force, more conducively flash heat transfer；While conducive to gaseous working medium volatilization, it is conducive to the reflux of liquid refrigerant to greatest extent.
Description
Technical field
The utility model relates to technical field of heat dissipation more particularly to a kind of ultra-thin heat-transfer devices.
Background technique
Electronic chip packaging space is smaller and smaller, and microelectronic field chip cooling area is caused to reduce, and heat flow density increases.
The reliability of electronic component sharply declines with the rising of temperature, and the hot spot that high heat flux density generates seriously affects its performance and longevity
Life.The finned aluminium of tradition, copper radiator have been unable to satisfy the cooling requirements of high heat flux density device.Conventional soaking plate is by upper
The structure compositions such as shell, liquid-sucking core, support column, lower case, filling liquid pipe, component is more, and structural thickness is (usually in 3~4mm) bigger than normal,
As the size of portable electronic product is smaller and smaller, it is desirable that the thickness of soaking plate is lower than 1mm, even lower than 0.4mm.
Utility model content
The main purpose of the utility model is to provide a kind of ultra-thin heat-transfer device, it is intended to effectively solve the high hot-fluid of small space
Density of electronic element how quickly, Homogeneouslly-radiating problem.
To achieve the above object, the utility model proposes a kind of ultra-thin heat-transfer device, including upper housing, lower case, fill
Liquid pipe, the upper housing are connected with the peripheral sealing of lower case, and the inner wall of the upper housing and/or the lower case passes through etching
Capillary structure is formed, the capillary structure has fluid channel, and one end of the filling liquid pipe is penetrated in the upper housing under
Between shell, and it is connected to the fluid channel；The capillary structure includes uniformly distributed " rice " font support column area and difference position
In multiple heat dissipation peripheral regions on " rice " font support column area periphery, " rice " the font support column area and hot source point are opposite
It answers.
Wherein, multiple support columns in described " rice " font support column area are in rectangular distribution, and the support column is square column.
Wherein, the heat dissipation peripheral region is distributed square column, and the heat dissipation peripheral region is stretched with " rice " the font support column area
Outlet connection, the heat dissipation peripheral region are flaring type.
Wherein, the capillary structure is center symmetrical structure, and the prop density in " rice " font support column area is greater than
The prop density of the heat dissipation peripheral region.
Wherein, the cross section of the fluid channel is inverted trapezoidal.
Wherein, welded together by the way of Diffusion Welding between the upper housing and lower case.
Wherein, a setting groove structure in the upper housing and the lower case, the interior etching of the groove form hair
Fine structure；The upper housing with a thickness of 0.1~2.5mm, the lower case with a thickness of 0.1~2.5mm.
Wherein, the shell is metal material；The quantity of the filling liquid pipe is one or more.
Wherein, there is deionized water in the fluid channel.
In the above-mentioned technical solutions, upper housing is connected with the peripheral sealing of lower case, upper housing and/or the lower case
The capillary structure of inner wall is in confined space, and microchannel structural design is formed ultra-thin in the good upper-lower casing of pre-production
Ultra-thin heat-transfer device, with " gas-liquid phase transition principle " for foundation, by the setting of fluid channel, capillary structure is formed as one and is convenient for
The structure of gas-liquid phase transition circulation, selects the biggish working media of a latent heat of vaporization, is vaporized and is absorbed heat by working media, and liquefaction is put
The process of heat quickly, uniformly passes the heat of one or more hot source points；In the present solution, being supported by " rice " font
The setting in column area, " rice " font support column area and hot source point are corresponding, and heat radiates in " rice " font support column area first,
Heat dissipation area is big, rapid heat dissipation, then passes through the setting of the heat dissipation peripheral region on periphery, sink zones can be formed to capillary force, more sharp
In flash heat transfer, above structure setting, heat dissipation heat-transfer rate is fast, and even thermal effect is good；It is maximum while conducive to gaseous working medium volatilization
The reflux conducive to liquid refrigerant of limit, specifically, the heat dissipation peripheral region on periphery, between each block, by wider no support
Channel separates, this channel barrier is few, convenient for the diffusion of steam state working medium, facilitates the farther of the working medium transmitting after vaporizing, indirectly may be used
It, can efficiently will be liquefied to do this big heat-transfer device, " rice " font support column and perimeter support subregion (heat dissipation peripheral region)
Working medium is back to heating zone, and such structure design is mainly used in the heat source of relatively high power, matches the thermally conductive dress of larger area
It sets.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is the structural schematic diagram of the ultra-thin heat-transfer device of the utility model.
Drawing reference numeral explanation:
1, lower case；2, upper housing；3, capillary structure；4, filling liquid pipe；301, " rice " font support column area；302, it radiates
Peripheral region.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.In retouching for the utility model
In stating, the meaning of " plurality " is at least two, such as two, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
It in addition, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability
Based on domain those of ordinary skill can be realized, it will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of this technical solution is not present, also not within the protection scope of the requires of the utility model.
As shown in Figure 1, the ultra-thin heat-transfer device of the utility model includes upper housing 2, lower case 1, filling liquid pipe 4, it is described on
Shell is connected with the peripheral sealing of lower case, and it is micro- that the inner wall of the upper housing and/or the lower case by etching forms capillary
Structure 3, the capillary structure have fluid channel, and one end of the filling liquid pipe penetrates between the upper housing and lower case,
And it is connected to the fluid channel；The capillary structure includes uniformly distributed " rice " font support column area 302 and is located at described
Multiple heat dissipation peripheral regions 301 on " rice " font support column area periphery, " rice " the font support column area and hot source point are corresponding.
In the technical scheme, upper housing is connected with the peripheral sealing of lower case, upper housing and/or the lower case it is interior
The capillary structure of wall is in confined space, and microchannel structural design forms ultra-thin surpass in the good upper-lower casing of pre-production
Thin heat-transfer device, with " gas-liquid phase transition principle " for foundation, by the setting of fluid channel, capillary structure is formed as one convenient for gas
Liquid phase becomes the structure of circulation, selects the biggish working media of a latent heat of vaporization, is vaporized and is absorbed heat by working media, liquidation exothermic reaction
Process by the heat of one or more hot source points quickly, uniformly pass；In the present solution, passing through " rice " font support column
The setting in area, " rice " font support column area and hot source point are corresponding, and heat radiates in " rice " font support column area first, dissipate
Heat area is big, rapid heat dissipation, then passes through the setting of the heat dissipation peripheral region on periphery, sink zones can be formed to capillary force, more conducively
Flash heat transfer and the reflux of liquefied working medium, above structure setting, heat dissipation heat-transfer rate is fast, and even thermal effect is good, is conducive to gaseous working medium
While volatilization, it is conducive to the reflux of liquid refrigerant to greatest extent, specifically, the heat dissipation peripheral region on periphery, between each block,
It being separated by wider without support channel, this channel barrier is few, convenient for the diffusion of steam state working medium, what the working medium after facilitating vaporization was transmitted
It is farther, it can indirectly be this big heat-transfer device, " rice " font support column and perimeter support subregion (heat dissipation peripheral region), Ke Yigao
Liquefied working medium is back to heating zone by effect, and such structure design is mainly used in the heat source of relatively high power, matches larger
The heat-transfer device of area.
In addition, the return flow line (fluid channel) of inner walls capillary structure liquid working media, runner has certain hair
Thin power, capillary structure and shell integral production, such process structure can substantially reduce the thickness of heat carrier, can be effective
The heat dissipation problem for solving small space high heat flux density electronic component, it is big to overcome size existing for split type flow passage structure, dissipates
The bad problem of heat；Transmission efficiency is much higher than solid-state heat carrier or other radiator structures, and size is small meets electronic product
The small problem of size.
Wherein, multiple support columns in described " rice " font support column area are in rectangular distribution, and the support column is square column.
Wherein, the heat dissipation peripheral region is distributed square column, and the heat dissipation peripheral region is stretched with " rice " the font support column area
Outlet connection, the heat dissipation peripheral region are flaring type.
Preferably, the capillary structure is center symmetrical structure, and even thermal effect is good, " rice " font support column area
Prop density is greater than the prop density of the heat dissipation peripheral region, and central area (" rice " font support column area) is heated evaporating area,
Opposite return flow line area is smaller, to guarantee that the working medium after liquefaction is timely back to heat affected zone, supports column density using increasing,
Capillary force is improved, the design of the regurgitant volume of the liquid refrigerant in the unit time is increased.
Specifically, the channel that the setting of filling liquid pipe is convenient for test chamber leakproofness, fills working media, degasification；By filling
One end of liquid pipe penetrates between the upper housing and lower case, and effect is the leakproofness of test chamber, convenient to filling out in runner
Working media is filled, facilitates vacuumizing for upper-lower casing inner flow passage space, and exclude upper-lower casing inner flow passage space not
Solidifying property gas.
Preferably, the support column and the upper housing and/or lower casing body by integral forming.Support construction is integrated with shell
Design, stabilized structure are easy to assembly.
Specifically, a setting groove structure in the upper housing and the lower case, the interior etching of the groove are formed
Capillary structure, structure setting more compact and reasonable；Return flow line and shell integral production, such process structure can drop significantly
The thickness of low heat carrier.
Preferably, the upper housing with a thickness of 0.1~2.5mm, the lower case with a thickness of 0.1~2.5mm；Meet
The small requirement of electronic product size.
Specifically, the shell is metal material, good heat conductivity.
In a preferred embodiment, the quantity of filling liquid pipe may be one or more.In the embodiments illustrated in the figures,
Ultra-thin heat-transfer device is only provided with a root canal road, and the free end that filling liquid pipe can be opened before use take out very to fluid channel
Then sky fills the working media of liquid into fluid channel, after working media has been filled, then blocks the free end of filling liquid pipe,
There is stable heat dissipation performance to guarantee ultra-thin heat-transfer device during the work time.
Specifically, there is deionized water, the capillary structure of fluid channel has good wetability, with this in the fluid channel
Sufficient reflux capillary force is provided for condensed working media.
It should be noted that in the above-described embodiments, phase change medium can be water, and preferably deionized water, deionization
Water refers to the pure water eliminated in after ionic species impurity.The latent heat of vaporization of water is larger, vaporizes heat absorption and liquid by phase change medium
Change exothermic process, the heat of heat source can quickly be passed, to reach higher heat conduction efficiency, is met highly integrated
The radiating requirements of the electronic product of degree.
The above is only the preferred embodiments of the utility model, and therefore it does not limit the scope of the patent of the utility model, all
Under the utility model design of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (8)
1. a kind of ultra-thin heat-transfer device, which is characterized in that the ultra-thin heat-transfer device includes upper housing, lower case, filling liquid pipe, institute
It states upper housing to connect with the peripheral sealing of lower case, the inner wall of the upper housing and/or the lower case forms hair by etching
Fine structure, the capillary structure have a fluid channel, one end of the filling liquid pipe penetrate the upper housing and lower case it
Between, and be connected to the fluid channel；The capillary structure includes uniformly distributed " rice " font support column area and is located at described
Multiple heat dissipation peripheral regions on " rice " font support column area periphery, " rice " the font support column area and hot source point are corresponding.
2. ultra-thin heat-transfer device as described in claim 1, which is characterized in that multiple supports in " rice " font support column area
Column is in rectangular distribution, and the support column is square column.
3. ultra-thin heat-transfer device as claimed in claim 2, which is characterized in that the heat dissipation peripheral region is distributed square column, described to dissipate
Hot peripheral region is connect with the extension end in " rice " font support column area, and the heat dissipation peripheral region is flaring type.
4. ultra-thin heat-transfer device as claimed in claim 2, which is characterized in that the capillary structure is center symmetrical structure,
The prop density in " rice " font support column area is greater than the prop density of the heat dissipation peripheral region.
5. ultra-thin heat-transfer device as described in claim 1, which is characterized in that using diffusion between the upper housing and lower case
The mode of welding welds together.
6. ultra-thin heat-transfer device as described in claim 1, which is characterized in that one in the upper housing and the lower case
Groove structure is set, and etching forms capillary structure in the groove；The upper housing with a thickness of 0.1~2.5mm, under described
Shell with a thickness of 0.1~2.5mm.
7. such as ultra-thin heat-transfer device of any of claims 1-6, which is characterized in that the shell is metal material；
The quantity of the filling liquid pipe is one or more.
8. such as ultra-thin heat-transfer device of any of claims 1-6, which is characterized in that have in the fluid channel go from
Sub- water.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920051151.8U CN209546220U (en) | 2019-01-14 | 2019-01-14 | Ultra-thin heat-transfer device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920051151.8U CN209546220U (en) | 2019-01-14 | 2019-01-14 | Ultra-thin heat-transfer device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209546220U true CN209546220U (en) | 2019-10-25 |
Family
ID=68269263
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920051151.8U Active CN209546220U (en) | 2019-01-14 | 2019-01-14 | Ultra-thin heat-transfer device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN209546220U (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113316355A (en) * | 2021-04-20 | 2021-08-27 | 江西展耀微电子有限公司 | Soaking structure and electronic equipment |
| TWI827944B (en) * | 2020-06-19 | 2024-01-01 | 日商村田製作所股份有限公司 | Steam chamber and electronic equipment |
| CN117500244A (en) * | 2023-11-25 | 2024-02-02 | 深圳威铂驰热技术有限公司 | Heat transfer structure for strengthening activation of porous capillary structure, radiator and server |
-
2019
- 2019-01-14 CN CN201920051151.8U patent/CN209546220U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI827944B (en) * | 2020-06-19 | 2024-01-01 | 日商村田製作所股份有限公司 | Steam chamber and electronic equipment |
| CN113316355A (en) * | 2021-04-20 | 2021-08-27 | 江西展耀微电子有限公司 | Soaking structure and electronic equipment |
| CN117500244A (en) * | 2023-11-25 | 2024-02-02 | 深圳威铂驰热技术有限公司 | Heat transfer structure for strengthening activation of porous capillary structure, radiator and server |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN209546220U (en) | Ultra-thin heat-transfer device | |
| CN107167008B (en) | A kind of ultra-thin panel heat pipe and its manufacturing method | |
| TWI818134B (en) | Phase change heat sink | |
| TWI459889B (en) | Vapor chamber | |
| CN106033749B (en) | Parallel parallel microchannels multicore sheet heat radiator | |
| CN106793685A (en) | A kind of composite heat dissipation device | |
| CN100445685C (en) | Compound heat-exchanger | |
| CN100334931C (en) | Plane capillary core evaporimeter with fin for CPL | |
| CN104676545A (en) | Heat absorbing device, heat radiating device and LED (light-emitting diode) mining lamp radiating system | |
| CN101762196A (en) | Multi-channel wick-embedded flat plate heat pipe | |
| CN105841532A (en) | Method for manufacturing heat-pipe-parallel-structure-like foamy copper vapor plate | |
| WO2023197733A1 (en) | Electronic product | |
| CN104089509A (en) | Capillary pumped loop | |
| CN202026558U (en) | Heat pipe type flat panel heat sink | |
| CN202514230U (en) | Vapor chamber with inner-sintered structured support columns | |
| CN101995183A (en) | Flat heat pipe | |
| CN209546215U (en) | Ultra-thin heat-transfer device | |
| CN209546219U (en) | Radiator | |
| CN117950471B (en) | Air-cooled radiator | |
| CN209169131U (en) | Radiating fin mould group | |
| CN204513305U (en) | Heat sink, heat abstractor and LED bay light cooling system | |
| CN101924321A (en) | Micro-scale phase change cooling integrated system for side pump high-average power round-bar laser crystal | |
| CN112696961B (en) | Three-stage phase change heat exchanger | |
| CN2329925Y (en) | Plane-type heat pipe radiator | |
| CN111076577A (en) | Novel samming formula liquid cooling board |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ren Siyu Inventor before: Ren Yiheng Inventor before: Ren Siyu |
|
| CB03 | Change of inventor or designer information | ||
| CP02 | Change in the address of a patent holder |
Address after: 063000 north of Qinghua Road, west of Torch Road, high tech Development Zone, Tangshan City, Hebei Province Patentee after: Tangshan Dachuang Conduction Technology Co.,Ltd. Address before: 063000 Tangshan Hi-tech Development Zone, Hebei Province, No. 1698, No. 12, Floor 1207, Weiguo North Road Patentee before: Tangshan Dachuang Conduction Technology Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |