CN209169131U - Radiating fin mould group - Google Patents
Radiating fin mould group Download PDFInfo
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- CN209169131U CN209169131U CN201920042789.5U CN201920042789U CN209169131U CN 209169131 U CN209169131 U CN 209169131U CN 201920042789 U CN201920042789 U CN 201920042789U CN 209169131 U CN209169131 U CN 209169131U
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- hollow cavity
- radiating fin
- mould group
- shell
- structure layer
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Abstract
The utility model discloses a kind of radiating fin mould group, it includes matrix and the fin module that is arranged on matrix, there are multiple hot spots, the fin module includes that the shell with hollow cavity, the first capillary structure layer in the cavity wall for being attached to the hollow cavity and one end pass through the pipeline that the shell is connected to the hollow cavity in described matrix；Fin module is arranged on matrix, cover multiple hot spots, each hot spot passes through fin module Homogeneouslly-radiating, it is formed with closed hollow cavity in shell, and fills phase change medium in hollow cavity, is rapidly passed the heat of hot source point by the vaporization heat absorption of phase change medium and the process of liquidation exothermic reaction, transmission efficiency is much higher than solid-state heat carrier or other radiator structures, radiating fin modules can be made the structure of thinner thickness, can substantially reduce fin module, be suitble to the heat dissipation of high integration product.
Description
Technical field
The utility model relates to technical field of heat dissipation more particularly to a kind of radiating fin mould groups.
Background technique
With the development of modern times electronic industry, electronic product now with high-performance, high integration, frivolous, short and small be
Developing direction, what is be accompanied is the continuous improvement of heat flux caused by unit of the product area, and on the circuit board of unit area
Multiple hot source points (such as: one piece of circuit board integrates multiple processors) is integrated, as shown in Figure 1, early stage is in the prior art, respectively
Corresponding fin module is equipped with for each hot spot；It is compact-sized since current circuit board integrated level is high, with the development of technology
Because a radiating fin can not be separately configured to each hot source point (single processor) in space limitation, so shown in Fig. 2, existing skill
In art, multiple fin design groups are combined into an entirety, i.e., multiple heat sources share a large-sized fin, in view of each heat source
Power is different, and calorific value has very big difference, and simple solid fin (copper or aluminium) is limited by thermal conductivity and heat-conducting section product, no
Can being transmitted to even heat that all hot source points generate on fin well, what the point for causing power of heat source big was in contact with it
Fin position temperature is high, and the fin temperature of the small corresponding contact of point of opposite power of heat source is relatively low, and uneven heating is even.
Utility model content
The main purpose of the utility model is to provide the heat transfer that a kind of radiating fin mould group is intended to improve fin heating surface
Efficiency and make heating surface thermally equivalent, while also optimizing radiating fin modules overall structure, overcomes the problems, such as limited space.
To achieve the above object, the utility model provides a kind of radiating fin mould group and includes matrix and be arranged in described matrix
On fin module, there are multiple hot spots, the fin module includes the shell with hollow cavity, is attached to institute in described matrix
It states the first capillary structure layer and one end in the cavity wall of hollow cavity and passes through the pipeline that the shell is connected to the hollow cavity, institute
It states hollow cavity and sheet body is set for filling phase change medium, the top surface of the shell of the hollow cavity.
Wherein, the shell includes the side of the roof being oppositely arranged and bottom wall and the connection roof and the bottom wall
Wall, the roof, the bottom wall and the side wall enclose jointly to be set to form the hollow cavity.
Wherein, the radiating fin mould group further includes the supporter being set in the hollow cavity, the supporter connection
The roof and the bottom wall.
Wherein, the supporter is support column, and the support column and the roof are integrally formed.
Wherein, the second capillary structure layer is attached on the support column.
Wherein, first capillary structure layer and the second capillary structure layer are integrally full of the hollow cavity.
Wherein, the distance of the bottom of the sheet body to the outer surface of the bottom wall is 0.2~11mm.
Wherein, the quantity of the support column is more.
Wherein, the material of the shell is copper.
Wherein, the phase change medium is water；First capillary structure layer and the second capillary structure layer are logical for metallic particles
Oversintering, pressing process are made, and the porosity of first capillary structure layer and the second capillary structure layer is 40%-80%
In the above-mentioned technical solutions, fin module is arranged on matrix, covers multiple hot spots, each hot spot passes through fin module
Homogeneouslly-radiating, in application process, without deliberately by heat source point design fin heating surface geometric center；Wherein, shell
It is inside formed with closed hollow cavity, and fills phase change medium in hollow cavity, relatively thin fin module can be formed, it will not be because of
The sectional dimension of fin module entirety and the equal thermal effect for influencing radiating surface.The biggish working media of a latent heat of vaporization is selected to make
For phase change medium, the heat of hot source point is rapidly passed out by the vaporization heat absorption of phase change medium and the process of liquidation exothermic reaction
It goes, working media phase transition process transmits heat, and transmission efficiency is much higher than solid-state heat carrier or other radiator structures, such heat radiating fin
Piece module can be made the structure of small volume or thinner thickness, on the one hand can be improved the heat conduction efficiency of heat source (point), with
Maximum rate farthest reduces heat source temperature, makes heating surface thermally equivalent, on the other hand, can substantially reduce fin mould
Block, to be suitble to the heat dissipation of high integration product.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, the structure that can also be shown according to these attached drawings obtains other attached drawings.
Fig. 1 is a kind of structural schematic diagram of fin in the prior art；
Fig. 2 is another structural schematic diagram of fin in the prior art；
Fig. 3 is the schematic cross-sectional view of the radiating fin mould group of the utility model；
Fig. 4 is the assembling structure schematic diagram of the radiating fin mould group of the utility model.
Drawing reference numeral explanation:
10, shell；11, hollow cavity；12, roof；13, bottom wall；14, side wall 14；21, the first capillary structure layer；22, second
Capillary structure layer；40, support column；50, fin module；60, matrix；70, hot spot；80, sheet body.
The embodiments will be further described with reference to the accompanying drawings for the realization, functional characteristics and advantage of the utility model aim.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describing, it is clear that described embodiment is only a part of the embodiment of the utility model, rather than all
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are not making creative work premise
Under every other embodiment obtained, fall within the protection scope of the utility model.
It is to be appreciated that the directional instruction (such as up, down, left, right, before and after ...) of institute in the utility model embodiment
It is only used for explaining in relative positional relationship, the motion conditions etc. under a certain particular pose (as shown in the picture) between each component, such as
When the fruit particular pose changes, then directionality instruction also correspondingly changes correspondingly.
In addition, the description for being such as related to " first ", " second " in the present invention is used for description purposes only, and cannot manage
Solution is its relative importance of indication or suggestion or the quantity for implicitly indicating indicated technical characteristic.Define as a result, " the
One ", the feature of " second " can explicitly or implicitly include at least one of the features.It is " more in the description of the present invention,
It is a " it is meant that at least two, such as two, three etc., unless otherwise specifically defined.
In the present invention unless specifically defined or limited otherwise, term " connection ", " fixation " etc. should do broad sense reason
Solution, for example, " fixation " may be a fixed connection, may be a detachable connection, or integral；It can be mechanical connection, it can also
To be electrical connection；It can be directly connected, the connection inside two elements can also be can be indirectly connected through an intermediary
Or the interaction relationship of two elements, unless otherwise restricted clearly.It for the ordinary skill in the art, can be with
The concrete meaning of above-mentioned term in the present invention is understood as the case may be.
It in addition, the technical solution between each embodiment of the utility model can be combined with each other, but must be with ability
Based on domain those of ordinary skill can be realized, it will be understood that when the combination of technical solution appearance is conflicting or cannot achieve
The combination of this technical solution is not present, also not within the protection scope of the requires of the utility model.
As shown in Figure 3 and Figure 4, the radiating fin mould group of the utility model includes matrix 60 and is arranged in described matrix 60
Fin module 50, there are multiple hot spots 70, the fin module 50 includes the shell with hollow cavity 11 in described matrix 60
10, the first capillary structure layer 21 being attached in the cavity wall of the hollow cavity 11 and one end pass through the shell 10 with it is described in
The pipeline that cavity 11 is connected to, the hollow cavity 11 is for filling phase change medium, the top surface setting of the shell 10 of the hollow cavity 11
Sheet body 80.
In the technical scheme, fin module 50 is arranged on matrix 60, covers multiple hot spots 70, each hot spot 70 passes through fin
Piece module 50 Homogeneouslly-radiating, in application process, without deliberately by heat source point design fin heating surface geometric center；Its
In, it is formed with closed hollow cavity 11 in shell 10, and fill phase change medium in hollow cavity 11, relatively thin fin can be formed
Module 50 will not influence the equal thermal effect of radiating surface because of the whole sectional dimension of fin module 50.Select a vaporization latent
The biggish working media of heat is used as phase change medium, is absorbed heat by the vaporization of phase change medium and the process of liquidation exothermic reaction is by hot source point
Heat rapidly passes, and working media phase transition process transmits heat, and transmission efficiency is much higher than solid-state heat carrier or other are dissipated
Heat structure.
Specifically, it is attached with the first capillary structure layer 21, in the cavity wall of hollow cavity 11 convenient for cryosurface in hollow cavity 11
Liquefied working media be back in the cavity wall close to heat affected zone, to form the structure of gas-liquid phase transition circulation, capillary structure layer
Metallic particles by diameter between 50~300 μm is made up of techniques such as sintering, compactings, and porosity is 40~80%, average
Aperture diameter is 0.2-3mm, it is thus possible to sufficient reflux capillary force is provided for condensed working media.It can be improved in this way
The heat conduction efficiency of 50 heating surface of fin module guarantees all heat that multiple heat sources (point) generate on entire matrix 60 (circuit board)
Amount is evenly distributed on fin, is made full use of the heat dissipation area of fin, is optimized 50 overall structure of radiating fin modules and ruler
Very little, above-mentioned radiating fin modules 50 can be made the structure of small volume or thinner thickness, on the one hand can be improved heat source (point)
Heat conduction efficiency, with maximum rate, farthest reduce heat source temperature, on the other hand, can substantially reduce fin module
50, to be suitble to the heat dissipation of high integration product.
In addition, one end of pipeline is connected in hollow cavity 11 and the other end can block, pipeline has certain length, can
It is convenient to fill working media to hollow cavity 11 to facilitate the leakproofness of detection hollow cavity 11, it can also advantageously give hollow cavity 11
The incoagulable gas in hollow cavity 11 is vacuumized and excluded, also provides receiving on-condensible gas for the secondary degasification of hollow cavity 11
Space.
Wherein, referring to Fig. 3, shell 10 includes the roof 12 being oppositely arranged and bottom wall 13 and connection roof 12 and bottom wall 13
Side wall 14, roof 12, bottom wall 13 and side wall 14 enclose jointly to be set to form hollow cavity 11.Shell 10 can be formed as flat pattern,
When specifically used, the outer surface of roof 12 and bottom wall 13 can be contacted as radiating surface with heat source, so as to rise well
To the effect of Homogeneouslly-radiating.Interval between roof 12 and bottom wall 13 can be set smaller, so as to so that radiating fin mould
The integral thickness of group is smaller, to adapt to the radiating requirements of the electronic product of small volume.Wherein, shell 10 can be formed as flat
Cylinder or the shapes such as cuboid, specifically, distance (the i.e. shell of the bottom of the sheet body 80 to the outer surface of the bottom wall 13
10 height) it is 0.2~6mm, the height of sheet body 80 is 1~12mm, and the height lower limit of entire fin module 50 can be accomplished not
To 2mm.In a preferred embodiment, shell 10 can accomplish that 1mm or so is even more thin in a thickness direction, will not be because of section
Size and the equal thermal effect for influencing radiating surface.
Referring again to Fig. 3 and Fig. 4, in a preferred embodiment, radiating fin mould group can also include being set to hollow cavity
Supporter in 11, specially support column 40, support column 40 connect roof 12 and bottom wall 13.Support column 40 can increase entire shell
The quantity setting of the intensity of body 10, support column 40 should be reasonable, while guaranteeing that lumen type is stablized, hinders boiling work as few as possible
Make the evaporation of medium；Specifically, reducing the quantity of support column 40 as far as possible, favorably under the premise of guaranteeing that lumen type is stablized
The volatilization space of working media after guaranteeing vaporization, thus the evaporation as small as possible for hindering boiling working media.
Preferably, the support column 40 is integrally formed with the roof 12, can be convenient processing, assembling and positioning in this way,
Also it can enhance the intensity of whole fin module 50.
Wherein, the second capillary structure layer 22 can be attached on support column 40, wherein the property of the second capillary structure layer 22
It is consistent with the first capillary structure layer 21 with acting on, it is preferable that first capillary structure layer 21 and the second capillary structure layer 22 1
Body is full of the hollow cavity 11.Second capillary structure layer 22 and the first capillary structure layer 21 are integrally formed more gas-liquid phase transitions and follow
Loop back path, capillary structure layer have good wetability, so as to provide sufficient reflux hair for condensed working media
Thin power.
In a preferred embodiment, more support columns 40 are evenly spaced on, to play the effect for stablizing support.In figure
Shown in embodiment, the support column 40 provided with three array distributions.
In the present embodiment, the material of shell 10 is copper, the good heat conductivity of copper.
In addition, in a preferred embodiment, the quantity of pipeline may be one or more.Embodiment shown in the figure
In, radiating fin modules 50 are only provided with a root canal road, can be carried out with the free end of opening conduits to hollow cavity 11 before use
It vacuumizes, the working media of liquid is then filled into hollow cavity 11, after working media has been filled, then the freedom of blocking pipe
End, to guarantee that radiating fin mould group has stable heat dissipation performance during the work time.Wherein, working media is filled in cavity
Afterwards, reheating degassing procedure, pipeline can also advantageously exclude the incoagulable gas in hollow cavity 11, also be hollow cavity 11
Secondary degasification provides the space for accommodating on-condensible gas.
It should be noted that in the above-described embodiments, phase change medium can be water, and water vapor latent heat is larger, passes through phase transformation
The process of medium vaporization heat absorption and liquidation exothermic reaction, the heat of heat source can quickly be passed, and be passed with reaching higher heat
Efficiency is led, the radiating requirements of the electronic product of high integration are met.
The above is only the preferred embodiments of the utility model, and therefore it does not limit the scope of the patent of the utility model, all
Under the utility model design of the utility model, equivalent structure made based on the specification and figures of the utility model becomes
It changes, or directly/be used in other related technical areas indirectly and be included in the scope of patent protection of the utility model.
Claims (10)
1. a kind of radiating fin mould group, which is characterized in that including the fin module of matrix and setting on the matrix, the base
There are multiple hot spots, the fin module includes the shell with hollow cavity, is attached in the cavity wall of the hollow cavity on body
First capillary structure layer and one end pass through the pipeline that the shell is connected to the hollow cavity, and the hollow cavity is for filling phase
Become medium, sheet body is arranged in the top surface of the shell of the hollow cavity.
2. radiating fin mould group as described in claim 1, which is characterized in that the shell includes the roof being oppositely arranged and bottom
The side wall of wall and the connection roof and the bottom wall, the roof, the bottom wall and the side wall enclose jointly to be set to form institute
State hollow cavity.
3. radiating fin mould group as claimed in claim 2, which is characterized in that the radiating fin mould group further includes being set to institute
The supporter in hollow cavity is stated, the supporter connects the roof and the bottom wall.
4. radiating fin mould group as claimed in claim 3, which is characterized in that the supporter is support column, the support column
It is integrally formed with the roof.
5. radiating fin mould group as claimed in claim 4, which is characterized in that be attached with the second capillary structure on the support column
Layer.
6. radiating fin mould group as claimed in claim 4, which is characterized in that first capillary structure layer and the second capillary knot
Structure layer is integrally full of the hollow cavity.
7. radiating fin mould group as claimed in claim 2, which is characterized in that appearance of the bottom of the sheet body to the bottom wall
The distance in face is 0.2~11mm.
8. radiating fin mould group as claimed in claim 4, which is characterized in that the quantity of the support column is more.
9. such as radiating fin mould group of any of claims 1-7, which is characterized in that the material of the shell is copper.
10. such as radiating fin mould group of any of claims 1-7, which is characterized in that
The phase change medium is water；First capillary structure layer and the second capillary structure layer are that metallic particles passes through sintering, pressure
Technique processed is made, and the porosity of first capillary structure layer and the second capillary structure layer is 40%-80%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920042789.5U CN209169131U (en) | 2019-01-14 | 2019-01-14 | Radiating fin mould group |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920042789.5U CN209169131U (en) | 2019-01-14 | 2019-01-14 | Radiating fin mould group |
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| Publication Number | Publication Date |
|---|---|
| CN209169131U true CN209169131U (en) | 2019-07-26 |
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ID=67328359
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920042789.5U Active CN209169131U (en) | 2019-01-14 | 2019-01-14 | Radiating fin mould group |
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| Country | Link |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678037A (en) * | 2019-09-06 | 2020-01-10 | 苏州启热传热科技有限公司 | Three-dimensional superconducting radiator for high-power electronic component and working method thereof |
| CN112859953A (en) * | 2021-01-08 | 2021-05-28 | 鲲鹏基因（北京）科技有限责任公司 | Temperature control module in biological reaction instrument |
| CN113784571A (en) * | 2020-06-10 | 2021-12-10 | 尼得科超众科技股份有限公司 | Heat conduction member and cooling device having the same |
-
2019
- 2019-01-14 CN CN201920042789.5U patent/CN209169131U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110678037A (en) * | 2019-09-06 | 2020-01-10 | 苏州启热传热科技有限公司 | Three-dimensional superconducting radiator for high-power electronic component and working method thereof |
| CN113784571A (en) * | 2020-06-10 | 2021-12-10 | 尼得科超众科技股份有限公司 | Heat conduction member and cooling device having the same |
| CN112859953A (en) * | 2021-01-08 | 2021-05-28 | 鲲鹏基因（北京）科技有限责任公司 | Temperature control module in biological reaction instrument |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CB03 | Change of inventor or designer information |
Inventor after: Ren Siyu Inventor before: Ren Yiheng Inventor before: Ren Siyu |
|
| CB03 | Change of inventor or designer information | ||
| CP02 | Change in the address of a patent holder |
Address after: 063000 Tangshan hi tech Development Zone, Hebei Province Patentee after: Tangshan Dachuang Conduction Technology Co.,Ltd. Address before: 063000 Tangshan Hi-tech Development Zone, Hebei Province, No. 1698, No. 12, Floor 1207, Weiguo North Road Patentee before: Tangshan Dachuang Conduction Technology Co.,Ltd. |
|
| CP02 | Change in the address of a patent holder |