CN201594969U - Needle type phase-change electronic heat radiator - Google Patents
Needle type phase-change electronic heat radiator Download PDFInfo
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- CN201594969U CN201594969U CN2009201884235U CN200920188423U CN201594969U CN 201594969 U CN201594969 U CN 201594969U CN 2009201884235 U CN2009201884235 U CN 2009201884235U CN 200920188423 U CN200920188423 U CN 200920188423U CN 201594969 U CN201594969 U CN 201594969U
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Abstract
The utility model relates to a needle type phase-change electronic heat radiator which comprises a soaking cavity, syringes, foam metal and phase-change material. The heat radiator is characterized in that a soaking pipe is connected with a plurality of syringes to form an integral hollow cavity; the phase-change material is arranged in the hollow cavity; and a foam metal thin wall is filled in the syringe. The utility model has the advantage that by adopting the foam metal as the capillary structure of the evaporating cavity of the heat radiator, the cost is greatly decreased, the finished rate is high, the heat resistance is small, the heat radiation is strong, and the weight is low.
Description
Technical field
The utility model relates to a kind of radiator, relates in particular to a kind of needle-like phase transformation electronic radiation device.
Background technology
Along with the continuous development of electronic technology, electronic devices such as high performance chip, high-power light-emitting diode continue to bring out.These electronic devices can produce high hot-fluid in the course of the work, and electronic device temperature is raise rapidly, and at high temperature, electronic device can lose efficacy even burn, so the electronic radiation technology becomes the key that guarantees the electronic device operate as normal.With central processing unit (CPU) CPU is example, and its arithmetic speed is more and more faster, and quality is more and more lighter.These performances are to realize by the integrated level that improves constantly chip, and this makes that the power density of chip is more and more higher, and therefore developing advanced heat dissipation technology is the guarantee that improves chip integration, stability.Usually the metallic aluminium of usefulness high heat conductance and copper are as radiator material, and the radiator of making has fin, needle-like, heat pipe to cooperate structures such as fin, has brought into play important effect at different times.At present, have only heat pipe to cooperate the fin technology can satisfy technical need.The radiating mode of heat pipe is an one dimension, mode with line is conducted heat, the needs that under the less situation of chip size, can also adapt to product, when the size of chip big or chip assembling on the printed circuit board (PCB) under the situation than comparatively dense, the use of heat pipe has been subjected to limitation.Moreover these radiators all are that copper or aluminium block by a high heat conduction contacts with chip heat is passed to fin or heat pipe, because thermal conductivity is relatively low, are difficult to make the temperature distribution on the chip even, especially in the bigger occasion of chip power.In order to improve the uniformity of temperature on the chip, the scientific worker develops high thermal conductivity material energetically, and as diamond, graphite etc., but cost is very high, is not suitable for civil area.The flat radiating element of " soaking plate " (vapor chamber) by the use to soaking plate, can improve the temperature homogeneity of chip greatly.This technology type is like heat pipe principle, can conduct heat come out rapidly from chip, cooperate corresponding radiator portion that heat dissipation is fallen afterwards, change the one dimensional heat transfer mode of heat pipe greatly, the local overheating of the chip of avoiding can satisfy the needs that large size chip or chip group are dispelled the heat.Usually soaking plate places between chip (thermal source) and the radiator, the heat of thermal source passes through it excessively to radiator, in order to reduce cost, radiator still adopts copper or aluminium preparation, and the contact-making surface of radiator and soaking plate can produce very high thermal resistance, therefore, this electronic radiation technology is to have improved heat-sinking capability limitedly.In addition, many at present employing powder copper sintered porous structures are made the soaking plate inner surface, realize capillarity.This method complex process, rate of finished products is low, cost is high, therefore adopt the radiator price comparison costliness of soaking plate making, simultaneously because powder sintered capillary structure porosity is relatively low, the resistance that phase transformation is flowed therein is big, the interior phase change medium loading of unit volume is little, and heat-transfer capability is limited.In order further to improve the heat-sinking capability of radiator, excavate traditional material heat radiation potentiality, reduce cost, the present invention adopts a kind of new augmentation of heat transfer material-foam metal, in conjunction with the advantage of soaking plate and heat pipe, produce light weight, thermal resistance is little, heat radiation is strong, cost is low needle-like phase-change heat sink.
Summary of the invention
The purpose of this utility model is to provide a kind of needle-like phase transformation electronic radiation device, and this heatsink mass is light, thermal resistance is little, heat radiation is strong, cost is low.
The utility model is achieved like this, it comprises soaking chamber, needle tubing, foam metal and phase-change material, it is characterized in that Thiele tube is connected with several needle tubings and forms an integral cavity, and phase-change material is arranged in the cavity, needle tubing inside is filled with the foam metal thin-walled.
Foam metal described in the utility model is made the open celled foam attitude by copper product and is formed.
Phase-change material described in the utility model is liquid phase-change material or solid phase change material.
Liquid phase-change material described in the utility model is water, alcohol or acetone.
Technique effect of the present utility model is: adopts the capillary structure of foam metal, greatly reduces cost as the radiator evaporation cavity, and the rate of finished products height, thermal resistance is little, and heat radiation is strong, and weight is lower.
Description of drawings
Fig. 1 is a structural representation of the present utility model;
Fig. 2 is a partial sectional view of the present utility model;
Needle tubing 1a, needle tubing wall 1b, foam metal 2, soaking chamber 3, phase-change material in the drawings, 1,
Embodiment
As shown in Figure 1 and Figure 2, the utility model comprises needle tubing 1, soaking chamber 2 and phase-change material 3, the metal shell that it is characterized in that needle tubing 1 and soaking chamber 2 composition hollows, soaking chamber 2 is provided with a plurality of needle tubings, needle tubing 1 is communicated with integral cavity of formation with soaking chamber 2, the inside filled and process metal 1b thin-walled of needle tubing 1 is used for doing the capillary structure of needle tubing inner surface, is placed with phase-change material 3 in the cavity.Usually, foam metal 1b is attached on the needle tubing wall 1a can adopts sintering process, and the mode that needle tubing 1 is communicated with soaking chamber 2 can adopt soldering side's technology, certain vacuum is extracted in last certain phase-change material 3 backs of injecting in cavity.Phase-change material is generally the liquid phase-change material, in particular cases available solid phase change material.Under the situation of using the liquid phase-change material, cavity extracts certain vacuum according to the real work needs, guarantees phase-change material, evaporates in suitable temperature as water, alcohol, acetone etc.When using the utility model; needle-like phase transformation electronic radiation device is placed on the electronic device; 2 bottoms, soaking chamber contact with electronic device; after absorbing the heat that gives out from electronic device, phase-change material 3 undergoes phase transition heat absorption; and the heat of electronic device is taken out of to the whole cavity of needle tubing 1 from soaking chamber 2 rapidly by capillarity; the fan of forced convertion is equipped with on the side of needle tubing 1 or top; when crossing needle tubing wall 1a, wind can take away heat; get back to cavity bottom again by capillarity phase-change material 3; decalescence once more is heated; thereby work again and again, the heat of thermal source is constantly dissipated, protection chip operate as normal.Because the existence of foam metal capillary structure in this structure guarantees that not only heat scatters and disappears by metal shell rapidly, can overcome the effect of gravity simultaneously, guarantees the effective use of radiator on all directions.
Claims (4)
1. needle-like phase transformation electronic radiation device, it comprises soaking chamber, needle tubing, foam metal and phase-change material, it is characterized in that Thiele tube is connected with several needle tubings and forms an integral cavity, and phase-change material is arranged in the cavity, needle tubing inside is filled with the foam metal thin-walled.
2. needle-like phase transformation electronic radiation device according to claim 1 is characterized in that described foam metal makes the open celled foam attitude by copper product and form.
3. needle-like phase transformation electronic radiation device according to claim 1 is characterized in that described phase-change material is liquid phase-change material or solid phase change material.
4. needle-like phase transformation electronic radiation device according to claim 3 is characterized in that described liquid phase-change material is water, alcohol or acetone.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201884235U CN201594969U (en) | 2009-07-31 | 2009-07-31 | Needle type phase-change electronic heat radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2009201884235U CN201594969U (en) | 2009-07-31 | 2009-07-31 | Needle type phase-change electronic heat radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201594969U true CN201594969U (en) | 2010-09-29 |
Family
ID=42777036
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2009201884235U Expired - Lifetime CN201594969U (en) | 2009-07-31 | 2009-07-31 | Needle type phase-change electronic heat radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201594969U (en) |
Cited By (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102788334A (en) * | 2012-07-23 | 2012-11-21 | 贵州光浦森光电有限公司 | Heat pipe heat sink method and heat pipe type extrudedheat sink for LED (Light Emitting Diode) bulb |
| CN103178164A (en) * | 2011-12-20 | 2013-06-26 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Method for manufacturing phase-change sunflower heat-dissipating device |
| CN104348291A (en) * | 2013-07-26 | 2015-02-11 | 上海众汇泡沫铝材有限公司 | Foam aluminum heat radiator for motor |
| CN106255396A (en) * | 2016-10-18 | 2016-12-21 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
| CN106304805A (en) * | 2016-10-18 | 2017-01-04 | 中车大连机车研究所有限公司 | A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system |
| CN106332529A (en) * | 2016-10-18 | 2017-01-11 | 中车大连机车研究所有限公司 | Corrugated tube type micro-circulation radiator and micro-circulation heat exchange system |
| CN106356346A (en) * | 2016-11-23 | 2017-01-25 | 广东合新材料研究院有限公司 | Ultra-thin phase change cooling fin and production method thereof |
| CN107936777A (en) * | 2018-01-03 | 2018-04-20 | 梧州三和新材料科技有限公司 | A kind of three-dimensional network porous thermal conductive radiating element and preparation method thereof |
| CN108200749A (en) * | 2018-02-06 | 2018-06-22 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
| US11976885B2 (en) * | 2021-12-29 | 2024-05-07 | Industrial Technology Research Institute | Phase change thermal management device |
-
2009
- 2009-07-31 CN CN2009201884235U patent/CN201594969U/en not_active Expired - Lifetime
Cited By (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103178164A (en) * | 2011-12-20 | 2013-06-26 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Method for manufacturing phase-change sunflower heat-dissipating device |
| CN103178164B (en) * | 2011-12-20 | 2016-03-23 | 国研高能（北京）稳态传热传质技术研究院有限公司 | Manufacture the method for phase transformation heronsbill heat abstractor |
| CN102788334A (en) * | 2012-07-23 | 2012-11-21 | 贵州光浦森光电有限公司 | Heat pipe heat sink method and heat pipe type extrudedheat sink for LED (Light Emitting Diode) bulb |
| CN104348291A (en) * | 2013-07-26 | 2015-02-11 | 上海众汇泡沫铝材有限公司 | Foam aluminum heat radiator for motor |
| CN106255396A (en) * | 2016-10-18 | 2016-12-21 | 中车大连机车研究所有限公司 | A kind of pipe type microcirculation radiator and microcirculation heat-exchange system |
| CN106304805A (en) * | 2016-10-18 | 2017-01-04 | 中车大连机车研究所有限公司 | A kind of plate-fin microcirculation radiator and microcirculation heat-exchange system |
| CN106332529A (en) * | 2016-10-18 | 2017-01-11 | 中车大连机车研究所有限公司 | Corrugated tube type micro-circulation radiator and micro-circulation heat exchange system |
| CN106356346A (en) * | 2016-11-23 | 2017-01-25 | 广东合新材料研究院有限公司 | Ultra-thin phase change cooling fin and production method thereof |
| CN107936777A (en) * | 2018-01-03 | 2018-04-20 | 梧州三和新材料科技有限公司 | A kind of three-dimensional network porous thermal conductive radiating element and preparation method thereof |
| CN107936777B (en) * | 2018-01-03 | 2024-01-26 | 梧州三和新材料科技有限公司 | Three-dimensional network porous heat conduction and dissipation device and preparation method thereof |
| CN108200749A (en) * | 2018-02-06 | 2018-06-22 | 联想(北京)有限公司 | A kind of radiator and electronic equipment |
| US11976885B2 (en) * | 2021-12-29 | 2024-05-07 | Industrial Technology Research Institute | Phase change thermal management device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: CHANGSHA LIYUAN NEW MATERIAL CO., LTD. Free format text: FORMER OWNER: JIANGXI LANTIAN COLLEGE Effective date: 20120120 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| COR | Change of bibliographic data |
Free format text: CORRECT: ADDRESS; FROM: 330000 NANCHANG, JIANGXI PROVINCE TO: 410100 CHANGSHA, HUNAN PROVINCE |
|
| TR01 | Transfer of patent right |
Effective date of registration: 20120120 Address after: 410100 No. 16 Xingsha Avenue, Changsha economic and Technological Development Zone, Hunan Patentee after: Changsha Liyuan New Material Co., Ltd. Address before: 330000, Yao Lake University Park, Jiangxi, Nanchang Patentee before: Jiangxi University of Technology |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20160810 Address after: Lotus pond neighborhood 415000 Changde city in Hunan Province Economic and Technological Development Zone Changde Hill Street office fourteen groups Patentee after: Changde Liyuan New Material Co., Ltd. Address before: 410100 No. 16 Xingsha Avenue, Changsha economic and Technological Development Zone, Hunan Patentee before: Changsha Liyuan New Material Co., Ltd. |
|
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20100929 |