CN106356346A - Ultra-thin phase change cooling fin and production method thereof - Google Patents
Ultra-thin phase change cooling fin and production method thereof Download PDFInfo
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- CN106356346A CN106356346A CN201611046870.8A CN201611046870A CN106356346A CN 106356346 A CN106356346 A CN 106356346A CN 201611046870 A CN201611046870 A CN 201611046870A CN 106356346 A CN106356346 A CN 106356346A
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- ultra
- thin
- cooling fin
- thin phase
- change heat
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses an ultra-thin phase change cooling fin and a production method thereof. The ultra-thin phase change cooling fin comprises an ultra-thin outer shell provided with a closed cavity, a liquid absorption core pasted on the inner layer of the ultra-thin outer shell and a solid-state normal temperature heat pipe working medium arranged in the closed cavity. The ultra-thin phase change cooling fin has the advantages that the ultra-thin outer shell is filled with the solid-state normal temperature heat pipe working medium, the working medium is increased in volume when phase change is produced and the cooling fin contacts a heat source, and internal pressure of the cooling fin is increased, so that the outer shell with lower rigidity is more tightly contacted with a heat source interface, contact thermal resistance between the heat source and the cooling fin is greatly reduced, heat can be more effectively transferred out from the heat source, and heat transfer power of the cooling fin is high. Overall thickness of the ultra-thin phase change cooling fin is only 0.1-0.4mm, the ultra-thin phase change cooling fin has the advantage of thin thickness, the requirement that electronic equipment is gradually light and thin can be met, and slice-like design is beneficial to uniformity of temperature of a heat transfer surface, so that heat transfer effect is better; meanwhile, a preparation technology is simple and easy to realize, and cost is low.
Description
Technical field
The invention belongs to ultra-thin radiating fin and flat hot pipe technical field, more particularly to a kind of ultra-thin phase-change heat piece and
Its preparation method.
Background technology
Developing rapidly with electronic technology, development of electronic devices trend is to the side of high frequency, high speed and small-sized light thinning
To development, the caloric value so resulting in unit volume appliance device sharply increases, and will have a strong impact on the stability of electronic chip
And the life-span, the heat dissipation problem of small light and thin electronic product becomes the fast-developing bottleneck of restriction electron trade.
Mostly metal fin, graphite heat radiation fin and flat hot pipe is adopted in existing technology, although metal fin
Heat conductivity itself is high, but interfacial property is very poor, can not fit well when contacting with thermal source, there is very big thermal resistance, no
Well heat can be delivered to metal conducting strip from thermal source, thus affecting overall heat dispersion.And graphite heat radiation fin is vertical
To heat conductivity very low, and its interfacial property is also very poor, nor passes heat from thermal source well.Flat heat
Although pipe has good heat conductivility, its preparation technology limits its thickness, and processes preparation cost height, leads to heat
Pipe nor the radiating requirements meeting increasingly lightening electronic product.
So it is good and little with thermal source thermal contact resistance to be badly in need of a kind of ultra-thin, heat conductivity of invention, low the dissipating of processing preparation cost
Backing is meeting the heat dissipation problem of lightening electronic product at present.
Content of the invention
Based on this, in order to overcome the defect of above-mentioned prior art, the invention provides a kind of ultra-thin phase-change heat piece and its
Preparation method, this fin thickness is thin, heat conductivility is excellent, pliability is good and thermal resistance is little.
In order to realize foregoing invention purpose, this invention takes technical scheme below:
A kind of ultra-thin phase-change heat piece, described fin includes having the ultra-thin shell of closed cavity, sticks in described surpassing
The wick of thin outer crust internal layer and be arranged at described closed cavity solid-state room temperature heat-pipe working medium.
Wherein in some embodiments, described there is closed cavity ultra-thin shell be by thickness for 0.01-0.1mm two
Piece metal forming or non-metal plate welding or bonding.
Wherein in some embodiments, described wick is to have the material of certain porosity, such as wire netting or non-woven fabrics etc.
Nonmetallic materials, thickness is 0.01-0.1mm.
Wherein in some embodiments, described room temperature heat-pipe working medium is good with described ultra-thin sheathing material compatibility；Institute
Stating room temperature heat-pipe working medium is ultra-pure water, ethanol or acetone.
Wherein in some embodiments, the thickness of described fin is 0.1-0.4mm.
Present invention also offers the preparation method of above-mentioned ultra-thin phase-change heat piece, comprise the following steps:
Step one, cleaning two panels metal forming or non-metal plate are to sheet surface no oil stain, stain；Then by sheet material dry or
Dry；
Step 2, the sheet material of wick and step one is closely pasted；
Step 3, one end step 2 being adhesive with two sheets of wick is welded or is bondd so that one end is closed
Close, the other end has opening；
Step 4, the room temperature heat-pipe working medium of solid-state is inserted in the opening of step 3；
Step 5, evacuation is processed；
Step 6, carries out welded seal to the other end of two sheets being adhesive with wick, obtains final product.
Wherein in some embodiments, described in step one, cleaning step is: ultrasound wave cleaning, and chemical reagent cleans, clearly
Water cleans, and deionized water cleaning four road matting cleaning is no less than 10 minutes through cold cleaning by degreasing again, and thermal debinding cleaning is many
In 10 minutes, abluent cleaning was no less than 2 minutes.
Wherein in some embodiments, evacuation process time described in step 5 is no less than 50 seconds.
Compared with prior art, the method have the advantages that
1st, the ultra-thin phase-change heat piece of the present invention ultra-thin inside the shell fill be solid-state room temperature heat-pipe working medium, work as radiating
When contacting thermal source, when working medium undergoes phase transition (phase transformation between liquid and gaseous state), volume increases piece, and fin internal pressure increases,
Make the relatively low shell of rigidity even closer with thermal source interracial contact, substantially reduce the thermal contact resistance of thermal source and fin, make
Obtain heat can more effectively spread out of from thermal source, fin heat power is high；
2nd, the ultra-thin phase-change heat piece of the present invention using thickness be only 0.01-0.1mm there is flexible sheathing material,
Prepare the laminar phase-change heat piece that integral thickness is only 0.1-0.4mm, there is thickness of thin, disclosure satisfy that electronics
The increasingly lightening requirement of equipment, flake design contribute to heat transfer surface temperature homogeneity so that heat-transfer effect more preferably；
3rd, the ultra-thin phase-change heat piece of the present invention, the phase-change working substance due to inserting in the preparation is solid-state, substitutes traditional
Liquid phase-change working medium, evacuation process is simple, greatly reduces the difficulty of technological operation, has process is simple and easily realize, and becomes
This low advantage.
Brief description
Fig. 1 is the transversary schematic diagram of a kind of ultra-thin phase-change heat piece of the embodiment of the present invention 1；
Fig. 2 is the operation principle schematic diagram of a kind of ultra-thin phase-change heat piece of the embodiment of the present invention 1；
Reference: 1 shell, 2 wick, 3 solid-state phase changes working medium, 4 ultra-thin phase-change heat pieces,
5 thermals source, 6 electronic equipment casings, 7 working medium circulation layouts.
Specific embodiment
It is further discussed below the present invention below in conjunction with the accompanying drawings with specific embodiment, the present invention does not address part and is applied to existing skill
Art.The specific embodiment of the present invention is given below, but embodiment, merely to being described in further detail this explanation, is not intended to limit this
The claim of invention.
The ultra-thin phase-change heat piece of embodiment 1
Refer to Fig. 1, be a kind of ultra-thin phase-change heat piece 4 of the present embodiment, the ultra-thin phase-change heat piece 4 of the present embodiment wraps
Include and there is the ultra-thin shell 1 of closed cavity, stick in the wick 2 of described ultra-thin shell internal layer and be arranged at described airtight
The room temperature heat-pipe working medium 3 of cavity.
In this embodiment, the material of ultra-thin shell 1 is the thick Copper Foil of 0.05mm, and ultra-thin shell 1 is welded by two panels Copper Foil
Form, wick 2 is the thick thin matter copper mesh with certain porosity of 0.05mm, room temperature heat-pipe working medium 3 is simultaneous with ultra-thin shell 1
The deionized water of the good curdled appearance of capacitive, the integral thickness of ultra-thin phase-change heat piece 4 is 0.3mm.
Refer to Fig. 2, be a kind of operation principle schematic diagram of ultra-thin phase-change heat piece, when thermal source 5 gives off heat, by heat
It is delivered to the ultra-thin shell 1 of ultra-thin phase-change heat piece, ultra-thin shell 1 heats up and melts the room temperature heat-pipe working medium 3 of solid-state, and temperature continues
Height of continuing rising, liquid evaporation becomes gas, after hot steam runs into temperature relatively low shell, is condensed into liquid, in wick 2
Middle liquid flows back to evaporation ends due to capillarity, so circulates, the heat of thermal source is continuously taken to electronic equipment casing
6, then dissipate.And the ultra-thin phase-change heat piece of the present embodiment is during solid melts and vaporizes, fin internal pressure
Increase so that the relatively low shell of rigidity contact with thermal source even closer, reduce the thermal contact resistance of thermal source and fin so that this
Ultra-thin phase-change heat piece has the characteristics that thickness of thin, heat power are high.
The preparation method of the ultra-thin phase-change heat piece of the present embodiment, comprises the steps:
Step one, by the wick material copper mesh cutting for 0.05mm for the sheathing material Copper Foil and thickness for 0.05mm for the thickness
Become necessarily corresponding size, then cleaned to sheet surface no oil stain, stain；Then sheet material is dried or dry；Wherein
Cleaning step is: ultrasound wave cleaning, and chemical reagent cleans, clean water, deionized water cleaning four road matting cleaning warp again
Cold cleaning by degreasing 10 minutes, thermal debinding cleans 10 minutes, and abluent cleans 2 minutes；
Step 2, wick and shell fine sheet is passed through pressurization and closely coheres；
Step 3, one end step 2 being adhesive with the two panels shell fine sheet of wick is welded, and the other end has
Opening；
Step 4, the deionized water of solid-state is inserted in the opening of step 3；
Step 5, evacuation is processed, and the pumpdown time is 50 seconds；
Step 6, carries out welded seal to the other end, that is, obtain ultra-thin phase-change heat piece.
The ultra-thin phase-change heat piece of embodiment 2
The ultra-thin phase-change heat piece of the present embodiment, the material of ultra-thin shell 1 is the thick Copper Foil of 0.1mm, and ultra-thin shell is by two
Piece Copper Foil is welded, and wick is the thick thin matter copper mesh with certain porosity of 0.1mm, room temperature heat-pipe working medium be with ultra-thin
The deionized water of the good curdled appearance of shell compatibility, the integral thickness of ultra-thin phase-change heat piece is 0.4mm.The present embodiment
The preparation method of ultra-thin phase-change heat piece is same as Example 1.
The ultra-thin phase-change heat piece of embodiment 3
The ultra-thin phase-change heat piece of the present embodiment, the material of ultra-thin shell 1 is the thick graphite non-metal plate of 0.1mm, ultra-thin
Shell is welded by two panels graphite non-metal plate, and wick is the thick non-woven fabrics with certain porosity of 0.1mm, room temperature heat
Plumber's matter is the acetone of the curdled appearance good with ultra-thin shell compatibility, and the integral thickness of ultra-thin phase-change heat piece is 0.4mm.
The preparation method of the ultra-thin phase-change heat piece of the present embodiment is same as Example 1.
The ultra-thin phase-change heat piece of embodiment 4
The ultra-thin phase-change heat piece of the present embodiment is the solidification good with ultra-thin shell compatibility except room temperature heat-pipe working medium
Outside the ethanol of state, other materials is all same as Example 1.The preparation method of ultra-thin phase-change heat piece of the present embodiment and enforcement
Example 1 is identical.
Test example 1 radiating effect contrasts
The ultra-thin phase-change heat piece of the common flat hot pipe to prior art and the embodiment of the present invention 1 carries out heat conduction simultaneously
Radiating test, when heat dissipation capacity is 5w, the radiating temperature difference at ordinary flat heat pipe two ends is substantially at 5 DEG C about, and embodiment 1 is ultra-thin
The phase-change heat piece radiating temperature difference can reach 3-4 DEG C, and heat-conducting effect increases, thus good heat dissipation effect.
Test example 2 processing characteristics contrasts
Although the common flat hot pipe radiating effect of prior art is preferably, processing technique is complicated, long processing time,
High cost.General flat hot pipe processing percent defective is up to 80%, and process time, flow process was up to 3 days.And the embodiment of the present invention 1
Ultra-thin phase-change heat machining process is simple, and general percent defective only has 20%-30%, a piece of ultra-thin radiating fin overall processing flow process
Time only has several hours.Work flow shortens, and yield rate improves, and cost substantially reduces.
Each technical characteristic of embodiment described above can arbitrarily be combined, for making description succinct, not to above-mentioned reality
The all possible combination of each technical characteristic applied in example is all described, as long as however, the combination of these technical characteristics is not deposited
In contradiction, all it is considered to be the scope of this specification record.
Embodiment described above only have expressed the several embodiments of the present invention, and its description is more concrete and detailed, but simultaneously
Can not therefore be construed as limiting the scope of the patent.It should be pointed out that coming for those of ordinary skill in the art
Say, without departing from the inventive concept of the premise, some deformation can also be made and improve, these broadly fall into the protection of the present invention
Scope.Therefore, the protection domain of patent of the present invention should be defined by claims.
Claims (8)
1. a kind of ultra-thin phase-change heat piece is it is characterised in that described fin includes having the ultra-thin shell of closed cavity, pastes
In described ultra-thin shell internal layer wick and be arranged at described closed cavity solid-state room temperature heat-pipe working medium.
2. ultra-thin phase-change heat piece according to claim 1 is it is characterised in that the described ultra-thin shell with closed cavity
It is by the two panels metal forming for 0.01-0.1mm for the thickness or non-metal plate welding or bonding.
3. ultra-thin phase-change heat piece according to claim 1 is it is characterised in that described wick is 0.01- for thickness
The wire netting of 0.1mm or non-woven fabrics.
4. ultra-thin phase-change heat piece according to claim 1 it is characterised in that described room temperature heat-pipe working medium be ultra-pure water,
Ethanol or acetone.
5. the ultra-thin phase-change heat piece according to any one of Claims 1 to 4 is it is characterised in that the thickness of described fin
For 0.1-0.4mm.
6. the preparation method of the ultra-thin phase-change heat piece described in any one of Claims 1 to 5 is it is characterised in that include following walking
Rapid:
Step one, is dried after two panels metal forming or non-metallic sheet cleaning；
Step 2, the sheet material of wick and step one is closely pasted；
Step 3, one end step 2 being adhesive with two sheets of wick is welded or is bondd, and so that the other end is had out
Mouthful；
Step 4, the room temperature heat-pipe working medium of solid-state is inserted in the opening of step 3；
Step 5, evacuation is processed；
Step 6, the other end is carried out welded seal, obtains final product.
7. the preparation method of ultra-thin phase-change heat piece according to claim 6 is it is characterised in that clean described in step one
Step is: ultrasound wave cleaning, and chemical reagent cleans, clean water, and deionized water cleaning four road matting cleaning is again through cold de-
Fat cleaning is no less than 10 minutes, and thermal debinding cleaning is no less than 10 minutes, and abluent cleaning is no less than 2 minutes.
8. the preparation method of ultra-thin phase-change heat piece according to claim 6 is it is characterised in that take out true described in step 5
Empty process time is no less than 50 seconds.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611046870.8A CN106356346A (en) | 2016-11-23 | 2016-11-23 | Ultra-thin phase change cooling fin and production method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201611046870.8A CN106356346A (en) | 2016-11-23 | 2016-11-23 | Ultra-thin phase change cooling fin and production method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106356346A true CN106356346A (en) | 2017-01-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201611046870.8A Pending CN106356346A (en) | 2016-11-23 | 2016-11-23 | Ultra-thin phase change cooling fin and production method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114562903A (en) * | 2022-03-02 | 2022-05-31 | 上海博创空间热能技术有限公司 | Method for manufacturing uniform temperature plate |
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| CN101232794A (en) * | 2007-01-24 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Soaking plate and heat radiating device |
| CN101581549A (en) * | 2009-06-09 | 2009-11-18 | 北京奇宏科技研发中心有限公司 | Flat heat pipe and manufacture method |
| CN101825412A (en) * | 2010-04-29 | 2010-09-08 | 中科恒达石墨股份有限公司 | Heat radiator with composite structure and preparation method thereof |
| CN201594969U (en) * | 2009-07-31 | 2010-09-29 | 江西蓝天学院 | Needle type phase-change electronic heat radiator |
| CN201708147U (en) * | 2010-04-29 | 2011-01-12 | 中科恒达石墨股份有限公司 | Composite graphite radiator |
| CN102840782A (en) * | 2011-06-23 | 2012-12-26 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
| CN206210777U (en) * | 2016-11-23 | 2017-05-31 | 广东合一新材料研究院有限公司 | Ultra-thin phase-change heat piece |
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2016
- 2016-11-23 CN CN201611046870.8A patent/CN106356346A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1815126A (en) * | 2005-01-31 | 2006-08-09 | 李国辉 | Heat pipe |
| CN101232794A (en) * | 2007-01-24 | 2008-07-30 | 富准精密工业(深圳)有限公司 | Soaking plate and heat radiating device |
| CN101581549A (en) * | 2009-06-09 | 2009-11-18 | 北京奇宏科技研发中心有限公司 | Flat heat pipe and manufacture method |
| CN201594969U (en) * | 2009-07-31 | 2010-09-29 | 江西蓝天学院 | Needle type phase-change electronic heat radiator |
| CN101825412A (en) * | 2010-04-29 | 2010-09-08 | 中科恒达石墨股份有限公司 | Heat radiator with composite structure and preparation method thereof |
| CN201708147U (en) * | 2010-04-29 | 2011-01-12 | 中科恒达石墨股份有限公司 | Composite graphite radiator |
| CN102840782A (en) * | 2011-06-23 | 2012-12-26 | 富瑞精密组件（昆山）有限公司 | Heat pipe |
| CN104053335A (en) * | 2013-03-13 | 2014-09-17 | 联想(北京)有限公司 | Heat radiation device of electronic equipment |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114562903A (en) * | 2022-03-02 | 2022-05-31 | 上海博创空间热能技术有限公司 | Method for manufacturing uniform temperature plate |
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Application publication date: 20170125 |