201243263 六、發明說明： 【發明所屬之技術領域】 [0001] 本發明係有關於一種均熱板製造技術，尤指一種應 用於具散熱效果之金屬板材製造方法。 【先前技術】201243263 VI. Description of the Invention: [Technical Field of the Invention] [0001] The present invention relates to a technique for manufacturing a soaked plate, and more particularly to a method for manufacturing a metal plate having a heat dissipation effect. [Prior Art]
[0005] 按’近年來伴隨著半導體產業的蓬勃發展，消費性 電子產品漸趨輕薄短小、功能亦趨多元，如何適時的將 其内部產生之集中的高熱迅速且有效排除，儼然已成為 現今電子產品之壽命、可靠性及穩定性的關鍵課題。 傳統以散熱鰭片配合風扇散逸於空氣的散熱方式， 已不能滿足現今電子元件的需求，因此散熱效率已經成 為決定電子產品之壽命、可靠度及穩定性的重要因素。 而熱管（Heat Pipe)，是藉由工作流體液氣相間的 相變化（phase change)吸收熱量，並以氣體分子傳輸熱 量的方式’因而可得到極高的熱傳導係數，具有相當好 的傳熱效果’現今已被廣泛應用於電子熱傳導領域，如 電腦内部中央處理器或發光二極體之散熱等，但由於熱 管之毛細結構（wick structure)必須貼附於整根熱管 内部管壁’雖然其提供了工作介質液體回流之毛細力， 但在其毛細結構内部之流動阻力也成為流動壓降的主要 來源’因此造成其性能在某些操作情形下會有大幅度遞 減的情形。 參照我國專利證書號第M345222號，其係為一種「均 溫板及其支撑結構」’其係主要將一殼體内部鋪設毛細 100114255 組織與波浪片 表單编號A0101 ，並填充工作流體於腔體内部，該波浪片 第 3 頁/共 21 頁 1002023911-0 201243263 [0006] [0007] [0008] [0009] [0010] [0011] 波峰波谷間隙分別開設有穿孔，工作流體係流經間隔通 道及穿孔，以提升均溫板之熱傳導效率；然而，綜觀該 項創作其熱傳導效率仍不甚理想，且鋪設多層結構，如 上層毛細組織、下層毛細組織、波浪片等，相對增加生 產成本及組裝時間，亦不甚理想。 有鑑於此，本發明係針對上述之問題，提出一種均 熱板製造方法，以克服習知之缺點。 【發明内容】 本發明之目的在於提供一種「均熱板製造方法」， 係將二金屬板材形成具有密閉腔體之均熱板，其係在腔 體内部注入工作流體與複數銅粉柱體，利用工作流體與 銅粉柱體形成二相流循環，藉以提升均熱板之熱傳性及 散熱性。 本發明所運用的目的及解決其技術問題是採用以下 的技術方案來實現的。依據本發明提出一種均熱板製造 方法，提供兩金屬板材，將兩金屬板材形成第一板片與 第二板片，並沖壓第二板片使其具有一容置空間，容置 / 空間一側邊設有一填充孔； 將第一與第二板片進行第一次清洗，去除第一與第 二板片表面之油脂汙垢，接續在第一與第二板片表面進 行喷砂處理，以去除鏽痕及毛頭等殘留物； 將第一與第二板片之表面進行第二次清洗並保持乾 燥、清潔； 將金屬銅粉末透過一喷塗設備喷灑至第一板面之表 100114255 表單編號A0101 第4頁/共21頁 1002023911-0 201243263 [0012] 面與一具有容置空間之第二板片，使第一板片之一表面 與第二板片之容置空間内壁形成一金屬粉末薄膜層； 將金屬銅粉末透過粉末冶金與沖壓設備擠壓形成複 數支撐用的銅粉柱體，並將銅粉柱體進行燒結動作，進 而置於容置空間内；將第一與第二板片進行高溫燒結， 使第一板片之一表面與第二板片之容置空間内壁形成毛 細結構，接續以油壓方式將第一與第二板片之表面調整 撫平，再將第一板片具有毛細結構之表面與第二板片之 Ο 容置空間上緣固定並進行燒結，使第一與第二板片相互 緊密結合； [0013] 在第一與第二板片相互接觸邊緣以焊接方式，使第 一板片與第二板片之容置空間形成一密閉之腔體； [0014] 將一注料管設於填充孔内並在填充孔周緣套設一金 屬圈，並用焊接方式將金屬圈融置於填充孔與注料管接 合處，使注料管與填充孔穩固、緊密結合； q [0015] 利用注料管對腔體進行抽真空，以檢視第一與第二 板片結合是否殘有缝隙； [0016] 將流體透過注料管灌進腔體内，並利用注料管對腔 體進行抽真空’使腔體成為負壓真空狀態，接續將注料 管夾扁截斷並焊接密封填充孔’使均熱板成型； [0017] 以-資料記縣檢測均熱板之_溫度變化，將數 據整理並紀錄，其中，資料記錄器句扭 窃包括有一溫度資料記 錄器、一加熱器及一散熱器；β及 100114255 表單編號A0101 第5頁/共21頁 1002023911-0 201243263 [0018] 抛光研磨均熱板之表面，並整平與檢視均熱板外觀 〇 [0019] 综以上所述，本發明具有以下的優點： [0020] 1.本發明藉由工作流體於容置空間内流動，配合銅粉 柱體形成二相流循環，能大幅提升均熱板之熱傳性及散 熱性。 [0021] 2.本發明金屬板材之毛細結構係將金屬銅粉末透過乾 性喷塗與燒結而成，金屬銅粉末屬固體原料，在作業過 程中可回收循環再利用，且乾性噴塗不須使用溶劑調和 ，無大氣污染及廢水、汙水問題，有效減低環境污染。 [0022] 3.本發明均熱板製造構造簡單且過程簡易，適合大量 生產及符合經濟效益之優點。 【實施方式】 [0023] 以下藉由具體實施例配合所附的圖式詳加說明，當 更容易瞭解本發明之目的、技術内容、特點及其所達成 之功效。 [0024] 請參閱第1圖所示，本發明均熱板製造方法，包含以 下步驟： [0025] 首先，步驟S1金屬板材沖壓製程，提供二金屬板材 10，金屬板材10進一步為高導熱銅材質，金屬板材10分 別為第一板片11與第二板片12，其中將第二板片12進行 沖壓使其具有一容置空間121，且容置空間121 —側邊設 有一填充孔122 ; 100114255 表單編號A0101 第6頁/共21頁 1002023911-0 201243263 [0026] 步驟S2第一次清洗與噴砂處理，將第一與第二板片 11、12進行第一次清洗，利用有機溶劑去除第一與第二 板片11、12表面之油脂汙垢；接續將第一與第二板片u 1 2之表面進行喷砂處理’係以砂材衝削去除第一與第 二板片11、12之表面鏽痕及毛頭等殘留物； [ 步驟S3第二次清洗’將第一與第二板片η、12之表 面進行第二次清洗，並使第一與第二板片Η、12保持乾 燥、清潔，其中，第二次清洗係利用超音波清洗，清洗 程序包括有： [0028] (a)將第一與第二板片11、12利用超音波藥劑脫脂粗洗； [0029] (b)將第一與第二板片11、12利用超音波一次水洗； [0030] (C)將第一與第二板片U、12利用超音波二次水洗； [〇〇31] (d)將第一與第二板片11 ' 12利用超音波熱水清洗；以及 [0032] (e)將第一與第二板片π、12利甩熱風循環乾燥， Q [0033] 步驟S4金屬銅粉末喷塗製程，將金屬銅粉末20透過 一喷塗設備30連接高壓空氣分別噴灑至第一板片u之一 表面與容置空間121内壁，使第一板片^一表面與容置空 間121内壁各形成一金屬粉末薄膜層4〇 ; 步驟S5銅粉柱體成型與設置，提供複數個銅粉柱體 50，並置於容置空間121内，其中，銅粉柱體5〇係以金 屬銅粉末20為材料，利用粉末冶金與機械設備擠壓成型 ，並將銅粉柱體50進行燒結動作，進而將銅粉柱體置 入喷塗有金屬粉末薄膜層4〇的容置空間121内使銅粉柱體 1002023911-0 100114255 表單編號A0101 第7頁/共21頁 201243263 50形成第一板片11與第二板片12之間的支撐柱；銅粉柱 體50在經過燒結後會形成具有多孔隙之支撐柱體，因多 孔隙（稱砂孔）如毛細般，以利給水分子來達到二相流功 能（液態、氣態），液態接觸面積最大 '氣態流動最快之 效果，致使能達到均熱板内極佳的傳導功能。 [0035] [0036] [0037] 步驟S6金屬板材燒結結合製程，以高溫將第一與第 二板片11、12與銅粉柱體5 0進行第一次燒結，使第一板 片11之一表面與容置空間121内壁之金屬粉末薄膜層40各 別形成毛細結構，接續以油壓方式將第一與第二板片11 、12之表面調整撫平，接續再將第一板片11具有毛細結 構之表面向第二板片12之容置空間121上緣固定並進行第 二次燒結，步驟S6所提及之第一次與第二次燒結皆係以 600〜850°C高溫燒結5〜60分鐘，使第一與第二板片11、 12相互緊密結合； 步驟S7金屬板材焊接接合製程，在第一與第二板片 11、12相互接觸邊緣以氬焊進行焊接接合，使容置空間 121因與第一板片11結合進而形成一密閉之腔體12 3(如 第4圖所示）； 步驟S8設置一注料管，將一注料管60穿設填充孔122 内並在填充孔122與注料管60周緣套設一為銀圈或銅圈之 金屬圈61，並用高週波進行焊接將金屬圈61融置於填充 孔122與注料管60接合處，使注料管60與填充孔122穩固 接合與填補接合處的縫隙，以確保腔體123的密閉性，避 免流體於缝隙流出； 100114255 表單編號A0101 第8頁/共21頁 1002023911-0 201243263 [0038] 步驟S9測漏檢視裎序，利用注料管6〇對腔體123進行 抽真空，以檢視第一與第二板片u、12焊接結合處是否 殘有縫隙； [0039] Ο [0040] 步驟S10均熱板成型製裎，利用注料管60將_為純水 或超純水之工作流體b(如第5圖所示）注入腔體123内，並 利用皮料管60將腔體123進行抽真空，使腔體123成為負 壓真空狀態，接續將注料管6〇夾扁戴斷並焊接密封填充 孔122，使第一板片Η與第二板片12形成一均熱板7〇(如 第4圖所示）； 步驟S11檢測均熱板熱源變化，利用一資料記錄器（ 圖中未示）與均熱板70接觸以擷取均熱板7〇溫度，用以檢 測均熱板70之熱源變化，再將數據整理並紀錄，其中， 資料記錄器包括有一溫度資料記錄器、一加熱器及一散 熱器； [0041] [0042] 最後，步驟S12整平與檢視均熱板外觀，拋光研磨均 熱板70之表面，並整平與檢視第一板片u與第二板片12 結合位置，以確保均熱板70完整性。 接續，請再參閱第2圖與第3圖所示，為本發明均熱 板結構之分解圖，第一板片11之一表面與容置空間121内 壁喷麗金屬銅粉末20使其形成一金屬粉末薄膜層，其 中，喷塗設備30更可具有一靜電產生器（圖中未示），使 金屬銅粉末20經過靜電產生器後帶有正電荷’又，金屬 板材10可與一接地裝置（圖中未示）接觸使金屬板材1〇帶 負電荷，帶負電荷之金屬板材10吸引帶正電荷之金屬銅 100114255 表單煸號A0101 第9頁/共21頁 1002023911-0 201243263 粉末20，確保金屬粉末薄膜層4〇更穩固附著在金屬板材 10上，令金屬薄粉末膜層40不易在運作過程中隨作動震 盪而至金屬板材10掉落或滚動，且，噴塗設備3〇係採用 微電腦控制系統，係採用可編程序控制器（pr〇gram〜 mable Logic Controller ’ PLC)全自動控制，操作 者可依需求自行設定金屬銅粉末20的噴塗量與噴塗速声 ’用以對應所需膜厚之變化的各種需求性，具有精確控 制膜厚之效果； [0043] [0044] 而第二板片12之容置空間121内排列有數個銅粉栓體 50，容置空間121 —側邊之填充孔122連接有一注料管6〇 ，並在填充孔122周緣套設一金屬圈61，並用高週波焊接 方式將金屬圈61融置於填充孔122與注料管60接合處，使 注料管60與填充孔122穩固接合，用以流體的導通；如第 4圖所示，將第一板片11與容置空間121氬焊焊接結合使 其形成一腔體123，利用注料管60抽真空並注入工作流體 b，接續將注料管60夾扁裁斷並焊接密封填充孔122，使 均熱板70成型。 再參閱第5圖’為均熱板之剖視圖，藉此可清楚觀察 均熱板70之腔體123内部結構作動，均熱板7〇接觸熱源的 —端為蒸發端7〇a，另一相對端為冷凝端7〇b，假如熱源 位於均熱板70下方，工作流體b因蒸發端7〇a吸熱而蒸發 成汽態，使飽和蒸汽a上升，並迅速擴散至整個冷凝端 70b ;冷凝端7〇b在使用上係與一散熱器（圖中未示）接觸 同時吸收冷凝端70b之熱能，冷凝端熱能被吸收後 會使飽和蒸汽a再度液化成工作流體b，工作流體1)會沿第 100114255 λ單蝙珑A0101 第10頁/共21頁 1002023911-0 201243263 一板片Π具有毛細結構之表面至容置空間121内壁，使其 與銅粉柱體50形成二相流循環，達到不斷吸收熱能及散 熱之效果。 [0045] 综上所述，僅為本發明之較佳實施例而已，在不離 本發明精神之範圍，熟習此項技藝者憑之而作之各種變 化、修飾與應用，皆應涵蓋於本發明中，因此本發明的 保護範圍當視後附的申請專利範圍所界定者為準。 【圖式簡單說明】 q [0046] 第1圖：係本發明步驟之流程圖。 [0047] 第2圖：係本發明均熱板結構之立體分解圖。 [0048] 第3圖：係本發明均熱板結構之另一方向立體分解圖。 [0049] 第4圖：係本發明均熱板結構之組合立體圖。 [0050] 第5圖：係本發明均熱板結構之剖視示意圖。 【主要元件符號說明】 [0051] S1.金屬板材沖壓製程 ❹ [0052] S2.第一次清洗與喷砂處理 [0053] S3.第二次清洗 [0054] S4.金屬銅粉末噴塗製程 [0055] S5.銅粉柱體成型與設置 [0056] S6.金屬板材燒結結合製程 [0057] S7.金屬板材焊接接合製程 100114255 表單編號Α0101 第11頁/共21頁 1002023911-0 201243263 [0058] S8.設置一注料管 [0059] S9.測漏檢視程序； [0060] S10.均熱板成型製程 [0061] S11.檢測均熱板熱源變化 [0062] S12.整平與檢視均熱板外觀 [0063] 10.金屬板材 [0064] 11.第一板片 [0065] 12.第二板片 [0066] 121.容置空間 [0067] 122·填充孔 [0068] 1 2 3.腔體 [0069] 20.金屬銅粉末 [0070] 30.喷塗設備 [0071] 40.金屬粉末薄膜層 [0072] 50.銅粉柱體 [0073] 6 0 ·注料管 [0074] 61.金屬圈 [0075] 70.均熱板 [0076] 70a.蒸發端 100114255 表單編號· A0101 第12頁/共21頁 1002023911-0 201243263 [0077] 70b.冷凝端 [0078] a.蒸汽 [0079] b.工作流體 Ο Ο 100114255 表單編號Α0101 第13頁/共21頁 1002023911-0[0005] According to the recent boom in the semiconductor industry, consumer electronics products are becoming lighter, thinner, and more diversified. How to quickly and effectively eliminate the concentrated heat generated inside them has become an electronic nowadays. The key issue of product life, reliability and stability. Traditionally, heat dissipation fins and fans dissipate air to dissipate heat, which cannot meet the needs of today's electronic components. Therefore, heat dissipation efficiency has become an important factor in determining the life, reliability and stability of electronic products. The Heat Pipe absorbs heat by the phase change between the working fluid and the gas phase, and transmits heat by the gas molecules. Thus, a very high heat transfer coefficient can be obtained, and the heat transfer effect is quite good. 'Today has been widely used in the field of electronic heat conduction, such as the internal processor of the computer or the heat dissipation of the light-emitting diode, but because the wick structure of the heat pipe must be attached to the inner wall of the whole heat pipe' although it provides The capillary force of the working medium liquid recirculation, but the flow resistance inside the capillary structure also becomes the main source of the flow pressure drop', thus causing the performance to be greatly degraded under certain operating conditions. Refer to China Patent Certificate No. M345222, which is a "soaked plate and its supporting structure". It mainly lays a capillary inside the shell 100114255 and the wave sheet form number A0101, and fills the working fluid in the cavity. Internally, the wave plate is 3rd/page 211002023911-0 201243263 [0006] [0010] [0011] [0011] Wavelet trough gaps are respectively provided with perforations, and the workflow system flows through the interval channels and Perforation to improve the heat transfer efficiency of the uniform temperature plate; however, it is still not ideal for the heat transfer efficiency of the creation, and the multi-layer structure, the above-mentioned capillary structure, the underlying capillary structure, the wave sheet, etc., relatively increase the production cost and assembly time. It is also not ideal. In view of the above, the present invention has been made in view of the above problems, and a method of manufacturing a soaking plate has been proposed to overcome the disadvantages of the prior art. SUMMARY OF THE INVENTION An object of the present invention is to provide a method for manufacturing a soaking plate, which comprises forming a soaking plate having a closed cavity by injecting a working fluid and a plurality of copper powder cylinders into a cavity. The working fluid and the copper powder cylinder form a two-phase flow cycle, thereby improving the heat transfer and heat dissipation of the heat equalizing plate. The object of the present invention and the technical problems thereof are solved by the following technical solutions. According to the present invention, a method for manufacturing a soaking plate is provided. Two metal plates are provided, and two metal plates are formed into a first plate and a second plate, and the second plate is punched to have a receiving space, and the space is occupied. a filling hole is arranged on the side; the first and second sheets are cleaned for the first time to remove grease dirt on the surfaces of the first and second sheets, and then sandblasted on the surfaces of the first and second sheets, Remove the residue such as rust and hair; clean the surface of the first and second sheets and keep them dry and clean; spray the metal copper powder through a spraying device to the surface of the first board 100114255 Form No. A0101 Page 4 / 21 pages 1002023911-0 201243263 [0012] The surface and a second plate having an accommodating space form a surface of one of the first plate and an inner wall of the accommodating space of the second plate a metal powder film layer; the metal copper powder is extruded through a powder metallurgy and a stamping apparatus to form a copper powder column for a plurality of supports, and the copper powder column is sintered, and then placed in the accommodating space; Two plates for high temperature burning And forming a capillary structure on the surface of one of the first plate and the inner wall of the accommodating space of the second plate, and subsequently adjusting the surface of the first and second plates by oil pressure, and then the first plate has The surface of the capillary structure is fixed to the upper edge of the accommodating space of the second plate and sintered, so that the first and second plates are tightly coupled to each other; [0013] the first and second plates are in contact with each other by welding Forming a sealed cavity in the accommodating space of the first plate and the second plate; [0014] placing a injection tube in the filling hole and arranging a metal ring around the periphery of the filling hole, and welding The metal ring is melted at the joint between the filling hole and the injection tube, so that the injection tube and the filling hole are firmly and tightly combined; q [0015] The cavity is evacuated by the injection tube to view the first and second plates Whether there is a gap in the joint; [0016] The fluid is poured into the cavity through the injection pipe, and the cavity is vacuumed by the injection pipe to make the cavity into a vacuum state, and then the injection pipe is flattened and cut off. And welding the sealing filling hole to shape the soaking plate; [0017] - The data is recorded in the county to detect the temperature change of the hot plate, and the data is sorted and recorded. Among them, the data logger thief includes a temperature data recorder, a heater and a heat sink; β and 100114255 Form No. A0101 No. 5 Page / Total 21 pages 1002023911-0 201243263 [0018] Polishing and polishing the surface of the heat equalizing plate, and leveling and viewing the appearance of the heat equalizing plate [0019] In summary, the present invention has the following advantages: [0020] The invention flows through the working space in the working space, and forms a two-phase flow cycle with the copper powder cylinder, which can greatly improve the heat transfer property and heat dissipation of the heat equalizing plate. [0021] 2. The capillary structure of the metal sheet of the present invention is obtained by dry spraying and sintering metal copper powder, and the metal copper powder is a solid raw material, which can be recycled and recycled during operation, and the solvent is not required for dry spraying. Reconciliation, no air pollution, wastewater and sewage problems, effectively reducing environmental pollution. [0022] 3. The soaking plate of the invention has simple manufacturing structure and simple process, and is suitable for mass production and economical advantages. [Embodiment] [0023] The purpose, technical contents, features, and effects achieved by the present invention will become more apparent from the detailed description of the accompanying drawings. [0024] Please refer to FIG. 1 , a method for manufacturing a soaked plate according to the present invention, comprising the following steps: [0025] First, the step S1 is a metal plate stamping process, and a metal sheet 10 is provided. The metal sheet 10 is further made of a high thermal conductive copper material. The metal sheet 10 is a first sheet 11 and a second sheet 12, respectively, wherein the second sheet 12 is stamped to have a receiving space 121, and the receiving space 121 is provided with a filling hole 122 at the side; 100114255 Form No. A0101 Page 6 of 21 1002023911-0 201243263 [0026] Step S2 is first cleaned and sandblasted, and the first and second sheets 11, 12 are first cleaned, and the organic solvent is used to remove the first Grease dirt on the surfaces of the first and second sheets 11, 12; subsequently sandblasting the surfaces of the first and second sheets u 1 2 'to remove the first and second sheets 11 and 12 by sand Residues such as surface rust marks and hairs; [Step S3 second cleaning] second cleaning the surfaces of the first and second sheets η, 12, and maintaining the first and second sheets Η, 12 Dry and clean, wherein the second cleaning uses ultrasonic cleaning The cleaning program includes: [0028] (a) degreasing the first and second sheets 11, 12 with an ultrasonic agent; [0029] (b) utilizing the first and second sheets 11, 12 The sound wave is washed once; [0030] (C) the first and second sheets U, 12 are washed twice by ultrasonic waves; [〇〇31] (d) the first and second sheets 11' 12 are ultrasonically used. Hot water cleaning; and [0032] (e) circulating the first and second sheets π, 12, hot air circulating, Q [0033] step S4 metal copper powder spraying process, passing the metal copper powder 20 through a spraying The device 30 is connected to one surface of the first plate u and the inner wall of the accommodating space 121, so that a surface of the first plate and a wall of the accommodating space 121 each form a metal powder film layer 4; Step S5 copper The powder cylinder is formed and arranged to provide a plurality of copper powder cylinders 50 and placed in the accommodating space 121. wherein the copper powder cylinders 5 are made of metal copper powder 20, and are extruded by powder metallurgy and mechanical equipment. And the copper powder cylinder 50 is subjected to a sintering operation, and the copper powder cylinder is placed in the accommodating space 121 coated with the metal powder film layer 4〇. The internal copper powder cylinder 1002023911-0 100114255 Form No. A0101 Page 7 / 21 pages 201243263 50 forms a support column between the first plate 11 and the second plate 12; the copper powder cylinder 50 will be sintered after sintering Forming a support column with multiple pores, because the pores (called sand holes) are capillary-like, in order to facilitate the water supply molecules to achieve the two-phase flow function (liquid, gas state), the liquid contact area is the largest 'gaseous flow fastest effect, resulting in It can achieve excellent conduction function in the soaking plate. [0037] [0037] Step S6 metal sheet sintering combined with the process, the first and second sheets 11, 12 and the copper powder cylinder 50 are first sintered at a high temperature, so that the first sheet 11 A metal powder film layer 40 having a surface and an inner wall of the accommodating space 121 respectively form a capillary structure, and then the surface of the first and second plates 11 and 12 is adjusted and smoothed by hydraulic pressure, and then the first plate 11 is successively connected. The surface having the capillary structure is fixed to the upper edge of the accommodating space 121 of the second plate 12 and subjected to the second sintering, and the first and second sinterings mentioned in the step S6 are sintered at a high temperature of 600 to 850 ° C. 5 to 60 minutes, the first and second plates 11, 12 are tightly coupled to each other; step S7, the metal plate welding and joining process, the first and second plates 11, 12 are in contact with each other by argon welding, so that The accommodating space 121 is combined with the first plate 11 to form a closed cavity 12 3 (as shown in FIG. 4); Step S8 is provided with a injection tube, and a injection tube 60 is inserted into the filling hole 122. And a metal ring 61 of a silver ring or a copper ring is disposed on the periphery of the filling hole 122 and the injection tube 60, and the high frequency is used. Welding is performed to melt the metal ring 61 at the joint of the filling hole 122 and the injection tube 60, so that the injection tube 60 and the filling hole 122 are firmly joined to fill the gap of the joint to ensure the tightness of the cavity 123 and avoid fluids. Slot outflow; 100114255 Form No. A0101 Page 8/Total 21 Page 1002023911-0 201243263 [0038] Step S9 measures the leak detection sequence, and uses the injection tube 6〇 to evacuate the cavity 123 to view the first and second Whether there is a gap in the welded joint of the sheets u and 12; [0040] Step S10 is a hot plate forming process, and the working fluid b of pure water or ultrapure water is used by the injection pipe 60 (such as 5 is injected into the cavity 123, and the cavity 123 is evacuated by the leather tube 60, so that the cavity 123 is in a vacuum state, and then the injection tube 6 is flattened and welded and sealed. The hole 122 is such that the first plate Η and the second plate 12 form a heat equalizing plate 7 (as shown in FIG. 4); Step S11 detects the heat source change of the heat equalizing plate, using a data logger (not shown) ) contacting the heat equalizing plate 70 to extract the temperature of the soaking plate 7 , to detect the heat source change of the heat equalizing plate 70 The data is further organized and recorded, wherein the data logger includes a temperature data logger, a heater and a heat sink; [0042] Finally, step S12 aligns and views the appearance of the heat slab, and the polishing is hot. The surface of the plate 70 is leveled and examined to determine the position of the first plate u and the second plate 12 to ensure the integrity of the heat equalizing plate 70. For the continuation, please refer to FIG. 2 and FIG. 3 again, which is an exploded view of the structure of the soaking plate of the present invention. One surface of the first plate 11 and the inner wall of the accommodating space 121 are sprayed with the metallic copper powder 20 to form a The metal powder film layer, wherein the spraying device 30 further has an electrostatic generator (not shown), and the metal copper powder 20 is positively charged after passing through the static electricity generator, and the metal plate 10 can be connected to a grounding device. The contact (not shown) causes the metal plate 1 to be negatively charged, and the negatively charged metal plate 10 attracts the positively charged metal copper 100114255. Form No. A0101 Page 9 / Total 21 pages 1002023911-0 201243263 Powder 20, ensuring The metal powder film layer 4 〇 is more firmly adhered to the metal plate 10, so that the metal thin powder film layer 40 is not easily oscillated during operation to the metal plate 10 to fall or roll, and the spraying device 3 is a microcomputer. The control system is fully automatic controlled by the programmable controller (pr〇gram~mable Logic Controller 'PLC). The operator can set the spraying amount of the metal copper powder 20 and the spraying speed sound to meet the requirements. The various requirements for the change of the required film thickness have the effect of accurately controlling the film thickness; [0044] The plurality of copper powder plugs 50 are arranged in the accommodating space 121 of the second plate 12, and the accommodating space 121 - a filling tube 122 is connected to the side of the filling hole 122, and a metal ring 61 is sleeved around the filling hole 122, and the metal ring 61 is melted at the joint of the filling hole 122 and the injection tube 60 by high-frequency welding. The injection tube 60 and the filling hole 122 are firmly engaged for the conduction of the fluid; as shown in FIG. 4, the first plate 11 and the accommodating space 121 are argon-welded and combined to form a cavity 123, which is utilized. The injection tube 60 is evacuated and injected into the working fluid b, and then the injection tube 60 is flattened and welded to seal the filling hole 122 to shape the heat equalizing plate 70. Referring again to FIG. 5, a cross-sectional view of the heat equalizing plate, whereby the internal structure of the cavity 123 of the heat equalizing plate 70 can be clearly observed, and the end of the heat equalizing plate 7 contacting the heat source is the evaporation end 7〇a, and the other is opposite. The end is the condensation end 7〇b. If the heat source is located below the heat equalizing plate 70, the working fluid b evaporates into a vapor state due to the endothermic heat of the evaporation end 7〇a, so that the saturated steam a rises and rapidly diffuses to the entire condensation end 70b; the condensation end 7〇b is in contact with a heat sink (not shown) while absorbing the heat energy of the condensation end 70b, and the heat energy of the condensation end is absorbed to re-liquefy the saturated steam a into the working fluid b, and the working fluid 1) 100114255 λ单 珑 A0101 Page 10 / Total 21 page 1002023911-0 201243263 A sheet has a capillary structure surface to the inner wall of the accommodating space 121, so that it forms a two-phase flow cycle with the copper powder cylinder 50, reaching a constant Absorbs heat and heat. In view of the above, it is only the preferred embodiments of the present invention, and various changes, modifications, and applications made by those skilled in the art should be included in the present invention without departing from the spirit and scope of the invention. Therefore, the scope of the present invention is defined by the scope of the appended claims. BRIEF DESCRIPTION OF THE DRAWINGS [0046] Fig. 1 is a flow chart showing the steps of the present invention. 2 is an exploded perspective view showing the structure of the soaking plate of the present invention. [0048] FIG. 3 is an exploded perspective view showing another direction of the soaking plate structure of the present invention. 4 is a perspective view showing the combination of the soaking plate structure of the present invention. [0050] FIG. 5 is a cross-sectional view showing the structure of the soaking plate of the present invention. [Main component symbol description] [0051] S1. Sheet metal stamping process ❹ [0052] S2. First cleaning and sand blasting [0053] S3. Second cleaning [0054] S4. Metal copper powder spraying process [0055] S5. Copper powder cylinder forming and setting [0056] S6. Metal sheet sintering bonding process [0057] S7. Sheet metal welding and bonding process 100114255 Form No. 1010101 Page 11 of 211002023911-0 201243263 [0058] S8. Set a filling tube [0059] S9. Detecting inspection procedure; [0060] S10. Soaking plate forming process [0061] S11. Detecting heat source change of soaking plate [0062] S12. Leveling and viewing the appearance of the hot plate [ 0063] 10. Sheet metal [0064] 11. First sheet [0065] 12. Second sheet [0066] 121. Housing space [0067] 122· Filling hole [0068] 1 2 3. Cavity [0069 20. Metallic copper powder [0070] 30. Spraying equipment [0071] 40. Metal powder film layer [0072] 50. Copper powder cylinder [0073] 6 0 · Injection tube [0074] 61. Metal circle [0075] 70. Heated plate [0076] 70a. Evaporation end 100114255 Form number · A0101 Page 12 / Total 21 page 1002023911-0 201243263 [0077] 70b. Condensation end [0078] a. Steam [0079] b. Working fluid Ο100 114 255 sheet number Α0101 Page 13 / Total 21 1002023911-0