TWI563238B - Manufacturing method of phase change type heat sink - Google Patents

Manufacturing method of phase change type heat sink

Info

Publication number
TWI563238B
TWI563238B TW104112289A TW104112289A TWI563238B TW I563238 B TWI563238 B TW I563238B TW 104112289 A TW104112289 A TW 104112289A TW 104112289 A TW104112289 A TW 104112289A TW I563238 B TWI563238 B TW I563238B
Authority
TW
Taiwan
Prior art keywords
manufacturing
heat sink
phase change
type heat
change type
Prior art date
Application number
TW104112289A
Other languages
Chinese (zh)
Other versions
TW201638547A (en
Inventor
Anthony Meyer George Iv
Hsin Hua Wen
Ming Kuei Hsieh
Chieh Ping Chen
Original Assignee
Celsia Technologies Taiwan Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Celsia Technologies Taiwan Inc filed Critical Celsia Technologies Taiwan Inc
Priority to TW104112289A priority Critical patent/TWI563238B/en
Publication of TW201638547A publication Critical patent/TW201638547A/en
Application granted granted Critical
Publication of TWI563238B publication Critical patent/TWI563238B/en

Links

TW104112289A 2015-04-16 2015-04-16 Manufacturing method of phase change type heat sink TWI563238B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW104112289A TWI563238B (en) 2015-04-16 2015-04-16 Manufacturing method of phase change type heat sink

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW104112289A TWI563238B (en) 2015-04-16 2015-04-16 Manufacturing method of phase change type heat sink

Publications (2)

Publication Number Publication Date
TW201638547A TW201638547A (en) 2016-11-01
TWI563238B true TWI563238B (en) 2016-12-21

Family

ID=57850287

Family Applications (1)

Application Number Title Priority Date Filing Date
TW104112289A TWI563238B (en) 2015-04-16 2015-04-16 Manufacturing method of phase change type heat sink

Country Status (1)

Country Link
TW (1) TWI563238B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638128B (en) * 2017-10-24 2018-10-11 行政院原子能委員會核能研究所 Method of highly efficient heat dissipation for plasma torch electrode by using integrated heat pipes
TWI697650B (en) * 2017-12-13 2020-07-01 奇鋐科技股份有限公司 Heat dissipation device manufacturing method

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN112378283B (en) * 2020-10-16 2022-02-11 桂林电子科技大学 Cylindrical high-temperature quartz heat pipe wire mesh capillary core fixing device and method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200741168A (en) * 2006-04-28 2007-11-01 Foxconn Tech Co Ltd Heat pipe
TW200928270A (en) * 2007-12-31 2009-07-01 Foxconn Tech Co Ltd Heat pipe
TWM367324U (en) * 2009-05-19 2009-10-21 Tai Sol Electronics Co Ltd Heat pipe
CN101782342A (en) * 2009-01-16 2010-07-21 富瑞精密组件（昆山）有限公司 Heat pipe and method for manufacturing capillary structure thereof
CN102653003A (en) * 2012-05-09 2012-09-05 安泰科技股份有限公司 Method for forming porous metal layer on pipe wall of heat exchange pipe
TW201243263A (en) * 2011-04-25 2012-11-01 Wen-Jin Chen Manufacturing method of heat spreader

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW200741168A (en) * 2006-04-28 2007-11-01 Foxconn Tech Co Ltd Heat pipe
TW200928270A (en) * 2007-12-31 2009-07-01 Foxconn Tech Co Ltd Heat pipe
CN101782342A (en) * 2009-01-16 2010-07-21 富瑞精密组件（昆山）有限公司 Heat pipe and method for manufacturing capillary structure thereof
TWM367324U (en) * 2009-05-19 2009-10-21 Tai Sol Electronics Co Ltd Heat pipe
TW201243263A (en) * 2011-04-25 2012-11-01 Wen-Jin Chen Manufacturing method of heat spreader
CN102653003A (en) * 2012-05-09 2012-09-05 安泰科技股份有限公司 Method for forming porous metal layer on pipe wall of heat exchange pipe

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI638128B (en) * 2017-10-24 2018-10-11 行政院原子能委員會核能研究所 Method of highly efficient heat dissipation for plasma torch electrode by using integrated heat pipes
TWI697650B (en) * 2017-12-13 2020-07-01 奇鋐科技股份有限公司 Heat dissipation device manufacturing method
TWI697651B (en) * 2017-12-13 2020-07-01 奇鋐科技股份有限公司 Heat dissipation device manufacturing method

Also Published As

Publication number Publication date
TW201638547A (en) 2016-11-01

Similar Documents

Publication Publication Date Title
TWI563547B (en) Method of forming semiconductor structure
SG10201603903QA (en) Wafer producing method
SG10201603714RA (en) Wafer producing method
SG10201605092PA (en) Wafer producing method
SG10201604080XA (en) Wafer producing method
SG10201600557XA (en) Wafer producing method
SG10201600555UA (en) Wafer producing method
SG10201602619YA (en) Method of dividing wafer
SG10201510273SA (en) Wafer producing method
SG10201600552YA (en) Wafer producing method
SG10201510271QA (en) Wafer producing method
SG10201601981YA (en) Wafer producing method
SG10201601975SA (en) Wafer producing method
GB201608523D0 (en) Heat sink
GB201517879D0 (en) Method of deposition
EP3457828A4 (en) Heat sink
SI3380554T1 (en) Crystalline forms of per-chloro-gamma-cyclodextrines
SG10201602315RA (en) Method of dividing wafer
GB201508297D0 (en) Method of manufacturing self-pierce rivets
HK1244274A1 (en) Crystalline forms of c21h22ci2n4o2
SG11201706481RA (en) Heat generation element and method for producing same
SG11201701656XA (en) Heat sink assembly and method of utilizing a heat sink assembly
IL253479A0 (en) Crystalline forms of efinaconazole
SG11201610966WA (en) A method for low temperature bonding of wafers
TWI563238B (en) Manufacturing method of phase change type heat sink