CN104053335A - Heat radiation device of electronic equipment - Google Patents
Heat radiation device of electronic equipment Download PDFInfo
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- CN104053335A CN104053335A CN201310080229.6A CN201310080229A CN104053335A CN 104053335 A CN104053335 A CN 104053335A CN 201310080229 A CN201310080229 A CN 201310080229A CN 104053335 A CN104053335 A CN 104053335A
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Abstract
The invention disclose a heat radiation device of electronic equipment. The heat radiation device comprises a heat conduction layer, an installation layer and a filling layer. The edges of the heat conduction layer and the installation layer are sealed to form a sealed cavity; the space in the sealed cavity is filled with the filling layer. The heat conduction layer made of a high-heat conduction metal material is used for absorbing the heat generated by the electronic equipment; the installation layer made of a high-strength metal material is used for realizing fixed connection with the electronic equipment, wherein one surface, contacted with the filling layer, of the installation layer is plated with a metal plating layer made of the identical material with that of the heat conduction layer; and the filling layer includes a liquid heat conduction medium. According to the invention, the high-heat conduction metal material is used for forming the heat conduction layer and the filling layer includes the liquid heat conduction medium, thereby absorbing the heat generated by the electronic equipment rapidly and improving the heat radiation efficiency of the electronic equipment; the installation layer is made of the high-strength metal material, thereby realizing fixing of the heat radiation device conveniently and avoiding the phenomenon of integrated device thickness increasing caused by bending deformation of the heat radiation device. Therefore, problems existing in the prior art are solved.
Description
Technical field
The present invention relates to electronic communication field, relate in particular to a kind of heat abstractor of electronic equipment.
Background technology
Light and thin type product generally dispels the heat by the heat conduction of product shell or thermal diffusion material at present.Along with the development trend of miniaturization of electronic products, multifunction, the heat producing in product unit volume is more and more, and efficiently radiates heat area reduces gradually, and the requirement of heat dispersion is more and more higher.But the capacity of heat transmission of housing or thermal diffusion material is limited, radiating efficiency is low, causes the raising of the chip powers such as the CPU of product to be restricted.
Summary of the invention
In view of this, the invention provides a kind of heat abstractor of electronic equipment, object is to solve the inefficient problem of existing electronic equipment dissipating heat.
A heat abstractor for electronic equipment, comprising: heat-conducting layer, mounting layer and packed layer;
The edge seal of described heat-conducting layer and mounting layer forms closed cavity, and described packed layer is filled in described closed cavity;
Described heat-conducting layer is high-thermal conductive metal material, the heat producing for absorbing described electronic equipment;
Described mounting layer is high-strength metal material, for being fixedly connected with described electronic equipment; The one side that described mounting layer contacts with described packed layer is coated with and the coat of metal of described heat-conducting layer with material;
Described packed layer comprises liquid thermal conductivity media.
Preferably, described high-thermal conductive metal material is specially copper.
Preferably, described high-strength metal material is specially stainless steel or magnadure or aluminium alloy.
Preferably, described mounting layer is specially housing or the metal center of described electronic equipment.
Preferably, described mounting layer is provided with projection with the one side that described packed layer contacts, for supporting described heat-conducting layer.
Preferably, described packed layer also comprises capillary structure layer, and described liquid thermal conductivity media is filled in the space of described capillary structure layer.
Preferably, the edge seal mode of described heat-conducting layer and mounting layer comprises traditional welding, gummed, ultrasonic waves welding and vapour deposition process welding.
As shown from the above technical solution, the heat abstractor of electronic equipment provided by the invention is made up of heat-conducting layer, mounting layer and packed layer, wherein, heat-conducting layer is high-thermal conductive metal material, packed layer comprises liquid thermal conductivity media, can absorb fast the heat that electronic equipment produces, improve the radiating efficiency of electronic equipment.Simultaneously, mounting layer is high-strength metal material, both be convenient to being fixedly connected with between this heat abstractor and electronic equipment, and avoided again this heat abstractor because of the phenomenon that flexural deformation causes device integral thickness to increase, and can well adapt to the little present situation in electronic equipment internal space.
Brief description of the drawings
In order to be illustrated more clearly in the embodiment of the present invention or technical scheme of the prior art, to the accompanying drawing of required use in embodiment or description of the Prior Art be briefly described below, apparently, accompanying drawing in the following describes is only some embodiments of the present invention, for those of ordinary skill in the art, do not paying under the prerequisite of creative work, can also obtain according to these accompanying drawings other accompanying drawing.
The heat abstractor sectional structure chart of the electronic equipment that Fig. 1 provides for the embodiment of the present invention one;
The heat abstractor sectional structure chart of the electronic equipment that Fig. 2 provides for the embodiment of the present invention two;
The heat abstractor sectional structure chart of the electronic equipment that Fig. 3 provides for the embodiment of the present invention three;
The schematic cross-section that is arranged at the rectangular build projection on mounting layer that Fig. 4 provides for the embodiment of the present invention;
The schematic cross-section that is arranged at the column type projection on mounting layer that Fig. 5 provides for the embodiment of the present invention.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is clearly and completely described, obviously, described embodiment is only the present invention's part embodiment, instead of whole embodiment.Based on the embodiment in the present invention, those of ordinary skill in the art, not making the every other embodiment obtaining under creative work prerequisite, belong to the scope of protection of the invention.
The object of the present invention is to provide a kind of heat abstractor of electronic equipment, solved the low problem of existing electronic equipment dissipating heat mode radiating efficiency.
Flat plate heat tube is general at present adopts upper and lower two-layer copper layer to form space structure, between fill the structures such as wire netting tube core, foaming metal material, powder sintered tube core, groove tube core and form inner capillary structure layer, to have in the space of capillary layer structure, fill the liquids such as water, methyl alcohol, and this space is kept to higher vacuum degree.Two-layer copper structure adopts the methods such as welding or gummed to engage and keeps air-tightness in outside edge.But this traditional flat plate heat tube is owing to adopting two-layer copper layer and this sandwich structure of intermediate course, and Thickness Ratio is thicker, general >0.8mm is difficult to larger space such heat pipe is installed in ultrathin products.In addition, because the hardness of copper own is less, add hollow structure, cause conventional heat pipe entirety very soft, be difficult to its installation and fixing, and be easy to bending distortion and cause hydraulic performance decline even to lose efficacy.
With reference to Fig. 1, the heat abstractor of the electronic equipment that the embodiment of the present invention one provides, is made up of heat-conducting layer 101, mounting layer 102 and packed layer 103; Wherein, mounting layer 102 can be circle, rectangle and any regular or irregularly shaped, can select according to practical application request; The shape of heat-conducting layer 101 is adapted to mounting layer 102, make the edge seal of heat-conducting layer 101 and mounting layer 102, keep the air-tightness between the two, space between the two forms closed cavity, packed layer 103 is filled in this closed cavity, and the one side that mounting layer 102 contacts with packed layer 103 is coated with and the coat of metal 104 of heat-conducting layer 101 with material.
Concrete, heat-conducting layer 101 is high-thermal conductive metal material, directly contacts with the heat producing components of electronic equipment, utilizes the characteristic that high-thermal conductive metal heat transfer efficiency is high, can absorb fast the heat that electronic equipment produces; Packed layer 3 is liquid thermal conductivity media, utilizes equally the characteristic that liquid thermal conductivity efficiency is high, and the heat that heat-conducting layer is absorbed absorbs fast, makes heat-conducting layer can continue to absorb the heat that electronic equipment produces.
Mounting layer 102 is high-strength metal material, is fixedly connected with electronic equipment, utilizes the characteristic that high duty metal intensity is high, can easily this heat abstractor be fixed on electronic equipment; Because high-intensity mounting layer 102 is not flexible, therefore the integral thickness of this heat abstractor is difficult for changing.It is multiple that mounting layer 102 and the connected mode of electronic equipment have, for example, on mounting layer 102, projection is set, and in the relevant position of electronic equipment, groove is set simultaneously, realizes being connected of this heat abstractor and electronic equipment by projection is embedded in this groove; And for example also can directly mounting layer 102 be welded on electronic equipment by methods such as traditional welding, gummed, ultrasonic waves welding and vapour deposition process welding, realize being fixedly connected with of this heat abstractor and electronic equipment.
The one side setting contacting with packed layer 103 at mounting layer 102 and heat-conducting layer 101 are with the coat of metal 104 of material, can avoid forming between two kinds of different metals of heat-conducting layer 101 and mounting layer 102 and produce electrical potential difference under the conducting medium impact of packed layer 103, thereby reduce the consume to this heat abstractor, ensured the performance of this heat abstractor.
In addition, heat-conducting layer 101 and mounting layer 102 are the metallic plate of respective material, make this heat abstractor entirety be flat, test data proves, the integral thickness of the heat abstractor of said structure only, in 0.4mm left and right, has improved the applicability of this heat abstractor in the little light and thin type electronic equipment in inner space.
From said apparatus structure, the heat abstractor of electronic equipment provided by the present invention is made up of heat-conducting layer, mounting layer and packed layer, wherein, heat-conducting layer is high-thermal conductive metal material, packed layer comprises liquid thermal conductivity media, can absorb fast the heat that electronic equipment produces, improve the radiating efficiency of electronic equipment, more be conducive to the chip performance such as CPU of electronic equipment and the raising of power.Meanwhile, mounting layer is high-strength metal material, has both been convenient to being fixedly connected with between this heat abstractor and electronic equipment, has avoided again the flexural deformation of this heat abstractor, can well adapt to the little present situation in electronic equipment internal space.In addition, this heat abstractor integral thickness remains on 0.4mm left and right, has further improved the applicability of this heat abstractor in the little light and thin type electronic equipment in inner space.
Concrete, the high-thermal conductive metal material of preparing heat-conducting layer in above-described embodiment can be copper.Accordingly, the coat of metal is copper coating.And the high-strength metal material of preparing mounting layer can be alloy, as stainless steel, magnadure, aluminium alloy etc.
With reference to Fig. 2, the heat abstractor of the electronic equipment that the embodiment of the present invention two provides, formed by heat-conducting layer 201, mounting layer 202 and packed layer 203, entirety is flat, wherein, the edge seal of heat-conducting layer 201 and mounting layer 202 forms closed cavity, and packed layer 203 is positioned at this closed cavity, and the one side that mounting layer 202 contacts with packed layer 203 is coated with and the coat of metal 204 of heat-conducting layer 201 with material.
Wherein, heat-conducting layer 201 is high-thermal conductive metal plate, directly contacts with the heat producing components of electronic equipment; Packed layer 203 comprises liquid thermal conductivity media, and heat-conducting layer 201 and packed layer 203 all have the characteristic that heat transfer efficiency is high, can absorb fast the heat that electronic equipment produces, and improves its radiating efficiency.
In the present embodiment, mounting layer 202 is directly selected one of intrinsic parts such as metal center, housing of electronic equipment, in the time that the heat abstractor of described electronic equipment need to be installed, only the intrinsic parts such as metal center, shell as mounting layer 202 need be arranged on the relevant position of electronic equipment.And the heat abstractor of the disclosed electronic equipment of the present embodiment, only serves as mounting layer with the intrinsic parts of electronic equipment, can reduce the space hold amount of this device.
Again and, the coat of metal 204 and the same material of heat-conducting layer 201, can avoid producing electrical potential difference between heat-conducting layer 201 and mounting layer 202, and then reduce the consume to this heat abstractor, ensured the performance of this heat abstractor.
From said structure, the heat abstractor that the embodiment of the present invention provides directly selects the intrinsic parts of electronic equipment as mounting layer, has greatly reduced the space hold amount of this heat abstractor, has well adapted to the little present situation in electronic equipment internal space.
With reference to Fig. 3, the heat abstractor of the electronic equipment that the invention process three provides, is made up of heat-conducting layer 301, mounting layer 302 and packed layer 303, and entirety is flat; Wherein, the edge seal of heat-conducting layer 301 and mounting layer 302 forms closed cavity, and packed layer 303 is positioned at this closed cavity, and the one side that mounting layer 302 contacts with packed layer 303 is coated with and the coat of metal 304 of heat-conducting layer 301 with material, and is provided with projection 305.
Wherein, heat-conducting layer 301 adopts high-thermal conductive metal plate, for example copper; Packed layer 303 is mainly liquid medium; Utilize high-thermal conductive metal material and the high characteristic of liquid medium heat transfer efficiency, can greatly improve the radiating efficiency of electronic equipment.Mounting layer 302 is fixedly connected with electronic equipment, specifically can adopt the high-intensity metallic plates such as alloy sheets, such as corrosion resistant plate, magnesium-aluminum alloy plate, aluminium alloy plate etc.; Mounting layer 302 also can directly be selected one of intrinsic parts such as metal center, housing of electronic equipment, further to reduce the space hold amount of this device.The coat of metal 304 and the same material of heat-conducting layer 301, can avoid producing electrical potential difference between heat-conducting layer 301 and mounting layer 302, and then reduce the consume to this heat abstractor, ensured the performance of this heat abstractor.
The one side contacting with packed layer 303 at mounting layer 302 arranges projection 305, one end of projection 305 is fixedly connected with mounting layer 302, the other end contacts with heat-conducting layer 301, can play a supportive role to heat-conducting layer 301, avoid heat-conducting layer 301 flexural deformations that intensity is lower, and then avoid heat abstractor integral thickness to increase.
Concrete, projection 305 can be set to the shape such as cylinder, cuboid, the schematic cross-section of rectangular build projection as shown in Figure 4, and the schematic cross-section of the column type projection shown in Fig. 5.
From said structure, the heat abstractor that the embodiment of the present invention provides, the one side contacting with packed layer on mounting layer arranges projection, the heat-conducting layer flexural deformation of having avoided the factors such as external force to cause, both avoided heat abstractor integral thickness to increase, reduce again the damage of flexural deformation to this heat abstractor, extended the useful life of this heat abstractor.
Further, the packed layer in above-mentioned all embodiment all also comprises capillary structure layer, and liquid thermal conductivity media is filled in the space of this capillary structure layer.This capillary structure layer specifically can adopt foaming metal, the wire netting tube core etc. in the closed cavity that is directly filled in heat-conducting layer and mounting layer formation, powder sintered tube core, the groove tube core etc. that also can adopt the one side contacting with packed layer at heat-conducting layer to arrange.In the above-mentioned space that liquid thermal conductivity media is filled in to capillary structure layer, form packed layer, liquid thermal conductivity media is uniformly distributed in packed layer, be equivalent to the surface area of the packed layer increasing; Thereby further improve the radiating efficiency of this heat abstractor, overcome the poor defect of mounting layer heat conductivility, further improved the radiating efficiency of heat abstractor of the present invention.
The structure such as metal center, housing of heat abstractor provided by the invention and product combines, and has solved classic flat-plate formula heat pipe and has installed and fix difficult problem, and actual taking up room saved to approximately 50% left and right.Due to the increase greatly of mounting layer structural strength, solve the problem of flat hot plate bending distortion, avoid its performance to reduce the phenomenon even losing efficacy, make the application of this heat abstractor in ultra-thin class of electronic devices become possibility.
Concrete, the heat-conducting layer in above-mentioned all embodiment and the edge seal mode of mounting layer comprise traditional welding, gummed, ultrasonic waves welding and vapour deposition process welding.
In this specification, each embodiment adopts the mode of going forward one by one to describe, and what each embodiment stressed is and the difference of other embodiment, between each embodiment same or similar part mutually referring to.
To the above-mentioned explanation of the disclosed embodiments, make professional and technical personnel in the field can realize or use the present invention.To be apparent for those skilled in the art to the multiple amendment of these embodiment, General Principle as defined herein can, in the situation that not departing from the spirit or scope of the present invention, realize in other embodiments.Therefore, the present invention will can not be restricted to these embodiment shown in this article, but will meet the widest scope consistent with principle disclosed herein and features of novelty.
Claims (7)
1. a heat abstractor for electronic equipment, is characterized in that, comprising: heat-conducting layer, mounting layer and packed layer;
The edge seal of described heat-conducting layer and mounting layer forms closed cavity, and described packed layer is filled in described closed cavity;
Described heat-conducting layer is high-thermal conductive metal material, the heat producing for absorbing described electronic equipment;
Described mounting layer is high-strength metal material, for being fixedly connected with described electronic equipment; The one side that described mounting layer contacts with described packed layer is coated with and the coat of metal of described heat-conducting layer with material;
Described packed layer comprises liquid thermal conductivity media.
2. heat abstractor according to claim 1, is characterized in that, described high-thermal conductive metal material is specially copper.
3. heat abstractor according to claim 1, is characterized in that, described high-strength metal material is specially stainless steel or magnadure or aluminium alloy.
4. heat abstractor according to claim 1, is characterized in that, described mounting layer is specially housing or the metal center of described electronic equipment.
5. heat abstractor according to claim 1, is characterized in that, described mounting layer is provided with projection with the one side that described packed layer contacts, for supporting described heat-conducting layer.
6. heat abstractor according to claim 1, is characterized in that, described packed layer also comprises capillary structure layer, and described liquid thermal conductivity media is filled in the space of described capillary structure layer.
7. heat abstractor according to claim 1, is characterized in that, the edge seal mode of described heat-conducting layer and mounting layer comprises traditional welding, gummed, ultrasonic waves welding and vapour deposition process welding.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310080229.6A CN104053335B (en) | 2013-03-13 | 2013-03-13 | Heat radiator for electronic equipment |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310080229.6A CN104053335B (en) | 2013-03-13 | 2013-03-13 | Heat radiator for electronic equipment |
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| CN104053335A true CN104053335A (en) | 2014-09-17 |
| CN104053335B CN104053335B (en) | 2020-08-25 |
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| CN103702549A (en) * | 2013-12-26 | 2014-04-02 | 苏州天脉导热科技有限公司 | Heat tube for ultrathin electronic product |
| CN106356346A (en) * | 2016-11-23 | 2017-01-25 | 广东合新材料研究院有限公司 | Ultra-thin phase change cooling fin and production method thereof |
| CN106941769A (en) * | 2016-11-16 | 2017-07-11 | 林进东 | A kind of good radiator structure part of combination property and its preparation technology |
| CN107407531A (en) * | 2015-03-26 | 2017-11-28 | 株式会社村田制作所 | Piece type heat pipe |
| CN108471692A (en) * | 2018-03-12 | 2018-08-31 | 上海利正卫星应用技术有限公司 | A kind of lightweight heat sink |
| CN109413929A (en) * | 2017-08-16 | 2019-03-01 | 鹏鼎控股(深圳)股份有限公司 | Heat sink and its manufacturing method |
| CN109548379A (en) * | 2018-12-14 | 2019-03-29 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of graphite heat conduction plate of mechanical connection |
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| CN106941769A (en) * | 2016-11-16 | 2017-07-11 | 林进东 | A kind of good radiator structure part of combination property and its preparation technology |
| CN106941769B (en) * | 2016-11-16 | 2019-12-27 | 林进东 | Heat dissipation structural part with good comprehensive performance and preparation process thereof |
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| CN108471692A (en) * | 2018-03-12 | 2018-08-31 | 上海利正卫星应用技术有限公司 | A kind of lightweight heat sink |
| CN111050523A (en) * | 2018-10-12 | 2020-04-21 | 宏达国际电子股份有限公司 | Thermal transfer module and method of manufacturing the same |
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| CN109890174A (en) * | 2018-12-14 | 2019-06-14 | 奇鋐科技股份有限公司 | Center radiator structure |
| CN109548379A (en) * | 2018-12-14 | 2019-03-29 | 中国航空工业集团公司西安航空计算技术研究所 | A kind of graphite heat conduction plate of mechanical connection |
| US11516940B2 (en) | 2018-12-25 | 2022-11-29 | Asia Vital Components Co., Ltd. | Middle bezel frame with heat dissipation structure |
| CN110012643A (en) * | 2019-04-04 | 2019-07-12 | Oppo广东移动通信有限公司 | Radiating subassembly, preparation method and electronic equipment |
| CN110035643A (en) * | 2019-05-23 | 2019-07-19 | Oppo广东移动通信有限公司 | Radiating subassembly and electronic equipment |
| CN110149784A (en) * | 2019-06-03 | 2019-08-20 | Oppo广东移动通信有限公司 | Radiating subassembly and electronic equipment |
| CN110191626A (en) * | 2019-06-28 | 2019-08-30 | Oppo广东移动通信有限公司 | Housing unit, preparation method and electronic equipment |
| CN110267499B (en) * | 2019-06-28 | 2020-12-15 | Oppo广东移动通信有限公司 | Shell assembly, preparation method thereof and electronic equipment |
| CN110336902A (en) * | 2019-06-28 | 2019-10-15 | Oppo广东移动通信有限公司 | Rear shell, preparation method, housing unit and the electronic equipment of electronic equipment |
| CN110191625A (en) * | 2019-06-28 | 2019-08-30 | Oppo广东移动通信有限公司 | Radiating subassembly, preparation method and electronic equipment |
| CN110267499A (en) * | 2019-06-28 | 2019-09-20 | Oppo广东移动通信有限公司 | Housing unit and preparation method thereof and electronic equipment |
| CN113453455A (en) * | 2020-03-25 | 2021-09-28 | 建准电机工业股份有限公司 | Electronic device with heat radiation structure |
| CN112804385A (en) * | 2021-02-09 | 2021-05-14 | 青岛海信移动通信技术股份有限公司 | Mobile phone, manufacturing method thereof and heat dissipation device for electronic equipment |
| CN114245639A (en) * | 2021-12-16 | 2022-03-25 | Oppo广东移动通信有限公司 | Casing, shell subassembly and electronic equipment |
| CN114245639B (en) * | 2021-12-16 | 2024-02-23 | Oppo广东移动通信有限公司 | Shell, shell assembly and electronic equipment |
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