CN112804385A - Mobile phone, manufacturing method thereof and heat dissipation device for electronic equipment - Google Patents
Mobile phone, manufacturing method thereof and heat dissipation device for electronic equipment Download PDFInfo
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- CN112804385A CN112804385A CN202110179997.1A CN202110179997A CN112804385A CN 112804385 A CN112804385 A CN 112804385A CN 202110179997 A CN202110179997 A CN 202110179997A CN 112804385 A CN112804385 A CN 112804385A
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/0249—Details of the mechanical connection between the housing parts or relating to the method of assembly
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- H—ELECTRICITY
- H04—ELECTRIC COMMUNICATION TECHNIQUE
- H04M—TELEPHONIC COMMUNICATION
- H04M1/00—Substation equipment, e.g. for use by subscribers
- H04M1/02—Constructional features of telephone sets
- H04M1/0202—Portable telephone sets, e.g. cordless phones, mobile phones or bar type handsets
- H04M1/026—Details of the structure or mounting of specific components
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20436—Inner thermal coupling elements in heat dissipating housings, e.g. protrusions or depressions integrally formed in the housing
Abstract
The application discloses a mobile phone, a manufacturing method thereof and a heat dissipation device for electronic equipment; the mobile phone comprises a mainboard heating area and a heat dissipation device; the heat dissipation device comprises a metal middle frame layer which is in contact with the heating area of the mainboard; one side of the metal middle frame layer, which is back to the mainboard heating area, is covered with a heat dissipation layer, and the heat dissipation layer is at least two layers and comprises a metal heat conduction layer which is in contact with the metal middle frame layer for heat conduction and an external metal strength layer which is arranged outside the metal heat conduction layer; the heat dissipation layer further comprises an inner metal strength layer, and the metal heat conduction layer is clamped and fixed between the outer metal strength layer and the inner metal strength layer; the inner metal strength layer is in contact with the metal middle frame layer. The structural design of the heat dissipation device can greatly improve the heat conductivity coefficient and the heat dissipation performance on one hand; on the other hand, sufficient strength can be ensured.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a mobile phone. In addition, the application also relates to a heat dissipation device for the electronic equipment. Moreover, the application also relates to a manufacturing method of the mobile phone.
Background
In order to balance the thickness and the strength of a product, a die-cast alloy support is adopted on a middle frame shell of the shell to be used as an embedded middle plate, common materials comprise magnesium alloy, aluminum alloy and the like, and the heat conductivity coefficient of the magnesium alloy is 72W/m.k. The heat conductivity coefficient of the aluminum alloy is between 100W/m.k and 150W/m.k; if the heat conductivity coefficient of the aluminum alloy is adjusted to be increased, the influence on the strength of the alloy is large, and the yield strength is greatly reduced. Only one balance point of heat conduction and strength can be selected to be used as better comprehensive performance.
In the prior art, the following methods are generally employed:
firstly, high-heat-conductivity aluminum alloy is adopted, but the strength of the middle frame of the shell is sacrificed;
secondly, the double-layer radiating membrane is added to provide radiating performance, but the thickness of the middle frame of the shell is increased by 0.1 mm;
thirdly, the copper pipe is added for heat conduction, but holes are needed in the middle of the middle frame of the machine shell, the cost is increased, and the alloy strength is reduced.
Disclosure of Invention
The first technical problem to be solved by the application is to provide a mobile phone, which has a structural design that on one hand, the heat conductivity coefficient can be greatly improved, and the heat dissipation performance is improved; on the other hand, sufficient strength can be ensured. In addition, a second technical problem to be solved by the present application is to provide a heat dissipation device for an electronic apparatus. Furthermore, a third technical problem to be solved by the present application is to provide a method for manufacturing a mobile phone.
In order to solve the first technical problem, the present application provides a mobile phone, including a motherboard heating area and a heat dissipation device for dissipating heat from the motherboard heating area; the heat dissipation device comprises a metal middle frame layer which is in contact with the heating area of the mainboard; the metal middle frame layer is back to one side of the mainboard heating area is covered with a heat dissipation layer, the heat dissipation layer is at least two-layer, and the heat dissipation layer comprises a metal heat conduction layer and an external metal strength layer, wherein the metal heat conduction layer is in contact with the metal middle frame layer, and the external metal strength layer is arranged outside the metal heat conduction layer.
In one embodiment, the heat dissipation layer further comprises an inner metal strength layer, and the metal heat conduction layer is clamped and fixed between the outer metal strength layer and the inner metal strength layer; the inner metal strength layer is in contact with the metal middle frame layer.
In a specific embodiment, the inner metal strength layer is provided with a plurality of heat conducting through holes, so that the metal heat conducting layer is in contact with the metal middle frame layer for heat conduction through each heat conducting through hole.
In a specific embodiment, one side of the metal middle frame layer facing the inner metal strength layer is protruded with heat conduction protruding parts extending into the heat conduction through holes, and the metal heat conduction layer is in contact with the heat conduction protruding parts for heat conduction.
In a specific embodiment, the heat dissipation layer is provided with a positioning through hole penetrating through the external metal strength layer, the metal heat conduction layer and the internal metal strength layer, and the heat dissipation layer is positioned with the metal middle frame layer through the positioning through hole.
In a specific implementation mode, the metal middle frame layer faces the one side on heat dissipation layer and is provided with a middle frame depressed part, the whole heat dissipation layer is arranged in the middle frame depressed part, and the depth of the middle frame depressed part is equal to the thickness of the heat dissipation layer.
In a specific embodiment, a plurality of dovetail notches are formed in the peripheral edge of the heat dissipation layer, and a dovetail filling portion matched and connected with the dovetail notches is arranged on the inner wall of the edge of the middle frame recess.
In addition, to solve the second technical problem, the present application further provides a heat dissipation apparatus for an electronic device, where the electronic device includes a motherboard heating area; the heat dissipation device comprises a metal middle frame layer which is in contact with the heating area of the mainboard; the metal middle frame layer is back to one side of the mainboard heating area is covered with a heat dissipation layer, the heat dissipation layer is at least two-layer, and the heat dissipation layer comprises a metal heat conduction layer and an external metal strength layer, wherein the metal heat conduction layer is in contact with the metal middle frame layer, and the external metal strength layer is arranged outside the metal heat conduction layer.
Furthermore, in order to solve the third technical problem, the present application further provides a method for manufacturing a mobile phone, where the mobile phone includes a motherboard heating area and a heat dissipation device for dissipating heat from the motherboard heating area, and the heat dissipation device includes a metal middle frame layer in contact with the motherboard heating area; one side of the metal middle frame layer, which is back to the mainboard heating area, is covered with a heat dissipation layer, and the heat dissipation layer is at least two layers and comprises a metal heat conduction layer which is in contact with the metal middle frame layer for heat conduction and an external metal strength layer which is arranged outside the metal heat conduction layer; the manufacturing method comprises the following steps:
when the metal middle frame layer is formed in a die-casting mode through a liquid metal material, the heat dissipation layer is placed in the die in a pre-positioned mode, the metal heat conduction layer faces towards the liquid metal material, and therefore the metal heat conduction layer is in contact with the metal middle frame layer to be formed in an integrated die-casting mode.
In one embodiment, the heat dissipation layer further comprises an inner metal strength layer, and the metal heat conduction layer is clamped and fixed between the outer metal strength layer and the inner metal strength layer; the inner metal strength layer is in contact with the metal middle frame layer; the inner metal strength layer is provided with a plurality of heat conduction through holes, so that the metal heat conduction layer is in contact with the metal middle frame layer for heat conduction through each heat conduction through hole;
the inner metal strength layer faces the liquid metal material, so that the liquid metal material is in contact with the metal heat conduction layer through the heat conduction through holes, and the metal heat conduction layer is in contact with the metal middle frame layer to be integrally formed through die casting.
The technical effects of the embodiments of the present application are described below:
in an embodiment, a mobile phone provided by the present application includes a motherboard heating area and a heat dissipation device for dissipating heat from the motherboard heating area; the heat dissipation device comprises a metal middle frame layer which is in contact with the heating area of the mainboard, wherein the metal middle frame layer is a shell middle frame and is used for providing heat dissipation and strength support effects for the mainboard and other components. Generally, the metal middle frame layer adopts a die-cast alloy bracket as an embedded middle plate, commonly used materials include magnesium alloy, aluminum alloy and the like, and the thermal conductivity coefficient of the magnesium alloy is 72W/m.k. The heat conductivity coefficient of the aluminum alloy is between 100W/m.k and 150W/m.k.
The design of the metal middle frame layer is that the heat conduction and the strength are a pair of balance factors, and if the heat conduction coefficient of the aluminum alloy is continuously adjusted to be improved, the influence on the strength of the alloy is large, and the yield strength can be greatly reduced. Only one balance point of heat conduction and strength can be selected to be used as better comprehensive performance.
In this application, the metal center layer is back to one side in mainboard heating area has covered the heat dissipation layer. The heat conductivity coefficient is continued through the heat dissipation layer, thereby ensuring the heat dissipation capability. The heat dissipation layer is at least two-layer, including with the metal heat-conducting layer of metal center frame layer contact heat conduction and locate the outside metal strength layer of metal heat-conducting layer outside.
It should be noted that, as an example, the heat dissipation layer may include only two layers, i.e., the metal heat conduction layer and the outer metal strength layer outside the metal heat conduction layer. In the embodiment, the metal heat conduction layer can be a copper layer, so that the heat dissipation coefficient is ensured, and the heat dissipation capacity is obviously improved. The outer metal strength layer may be stainless steel, which may be made very thin and may be guaranteed to provide sufficient strength. Therefore, the heat dissipation device is combined with the heat dissipation device, and the structural design of the heat dissipation device can greatly improve the heat conductivity coefficient and improve the heat dissipation performance on one hand; on the other hand, sufficient strength can be ensured.
In summary, the structural design of the heat dissipation device provided by the application can greatly improve the heat conductivity coefficient and improve the heat dissipation performance on one hand; on the other hand, sufficient strength can be ensured.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and those skilled in the art can also obtain other drawings according to the drawings without creative efforts.
FIG. 1 is a front view of a handset shown in an exemplary embodiment of the present application;
FIG. 2 is a rear view of the handset of FIG. 1;
FIG. 3 is a schematic structural diagram of a metal middle frame layer of the mobile phone of FIG. 1;
FIG. 4 is a schematic view of a heat dissipation layer of the mobile phone of FIG. 1;
FIG. 5 is a front view of the heat spreading layer of FIG. 4;
FIG. 6 is a rear view of the heat spreading layer of FIG. 4;
fig. 7 is a schematic view of the heat dissipation layer of fig. 4 after the outer metal strength layer, the metal heat conduction layer and the inner metal strength layer are spread.
Wherein, the corresponding relationship between the component names and the reference numbers in fig. 1 to 7 is:
the metal middle frame layer 100, the heat conduction convex part 110, the middle frame concave part 120 and the dovetail filling part 130;
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention.
In some of the flows described in the present specification and claims and in the above figures, a number of operations are included that occur in a particular order, but it should be clearly understood that these operations may be performed out of order or in parallel as they occur herein, with the order of the operations being indicated as 101, 102, etc. merely to distinguish between the various operations, and the order of the operations by themselves does not represent any order of performance. Additionally, the flows may include more or fewer operations, and the operations may be performed sequentially or in parallel. It should be noted that, the descriptions of "first", "second", etc. in this document are used for distinguishing different messages, devices, modules, etc., and do not represent a sequential order, nor limit the types of "first" and "second" to be different.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1 to 7, fig. 1 is a front view of a mobile phone according to an exemplary embodiment of the present application; FIG. 2 is a rear view of the handset of FIG. 1; FIG. 3 is a schematic structural diagram of a metal middle frame layer of the mobile phone of FIG. 1; FIG. 4 is a schematic view of a heat dissipation layer of the mobile phone of FIG. 1; FIG. 5 is a front view of the heat spreading layer of FIG. 4; FIG. 6 is a rear view of the heat spreading layer of FIG. 4; fig. 7 is a schematic view of the heat dissipation layer of fig. 4 after the outer metal strength layer, the metal heat conduction layer and the inner metal strength layer are spread.
In an embodiment, a mobile phone provided by the present application includes a motherboard heating area and a heat dissipation device for dissipating heat from the motherboard heating area; as shown in fig. 2, the area corresponding to the area a is a heat dissipation area of the motherboard. As shown in fig. 1 and fig. 2, the heat dissipation device includes a metal middle frame layer 100 contacting with the heat generating area of the motherboard, where the metal middle frame layer 100 is a chassis middle frame and is used to provide heat dissipation and strength support for the motherboard and other components. In general, the metal middle frame layer 100 uses a die-cast alloy bracket as an embedded middle plate, and commonly used materials include magnesium alloy and aluminum alloy, and the thermal conductivity of the magnesium alloy is 72W/m.k. The heat conductivity coefficient of the aluminum alloy is between 100W/m.k and 150W/m.k.
In the design of the metal middle frame layer 100, the heat conduction and the strength are a pair of balance factors, and if the heat conduction coefficient of the aluminum alloy is continuously adjusted to be improved, the influence on the strength of the alloy is large, and the yield strength is greatly reduced. Only one balance point of heat conduction and strength can be selected to be used as better comprehensive performance.
In the present application, as shown in fig. 1, a side of the metal middle frame layer 100 facing away from the heat generating area of the motherboard is covered with a heat dissipation layer 200. The heat conductivity is continued by the heat dissipation layer 200, thereby securing the heat dissipation capability. As shown in fig. 6 and 7, the heat dissipation layer 200 has at least two layers, including a metal heat conduction layer 220 in contact with the metal middle frame layer 100 for heat conduction and an outer metal strength layer 210 disposed outside the metal heat conduction layer 220.
It should be noted that, as an example, the heat dissipation layer 200 may include only two layers, namely the metal heat conduction layer 220 and the outer metal strength layer 210 outside the metal heat conduction layer 220. In such an embodiment, the metal heat conduction layer 220 may be a copper layer, so as to ensure a heat dissipation coefficient and significantly improve the heat dissipation capability. The outer metal strength layer 210 may be stainless steel, which may be made thin and may be guaranteed to provide sufficient strength. Therefore, the heat dissipation device is combined with the heat dissipation device, and the structural design of the heat dissipation device can greatly improve the heat conductivity coefficient and improve the heat dissipation performance on one hand; on the other hand, sufficient strength can be ensured.
Based on the above technical solution, as another example, as shown in fig. 7, the heat dissipation layer 200 may include three layers, i.e., a copper layer in the middle and stainless steel layers on two sides. Specifically, as shown in fig. 7, the heat dissipation layer 200 further includes an inner metal strength layer 230, and the metal heat conduction layer 220 is sandwiched and fixed between the outer metal strength layer 210 and the inner metal strength layer 230; the inner metal strength layer 230 is in contact with the metal middle frame layer 100. In such an embodiment, the metallic heat conductive layer 220 may be a copper layer and the inner and outer metallic strength layers 230, 210 may be stainless steel layers. The stainless steel layer can be made thin due to its sufficient strength, and thus the overall thickness of the three-layer heat dissipation layer 200 can also meet the thickness requirement.
In the above embodiment, as shown in fig. 7, the inner metal strength layer 230 is opened with a plurality of heat conducting through holes 231, so that the metal heat conducting layer 220 contacts and conducts heat with the metal middle frame layer 100 through each of the heat conducting through holes 231.
In fig. 7, the leftmost side is the outer metal strength layer 210, the middle is the metal heat conduction layer 220, and the rightmost side is the inner metal strength layer 230. As shown in fig. 7, a plurality of heat conducting through holes 231 are formed on the inner metal strength layer 230, and the heat conducting through holes 231 are uniformly distributed.
As shown in fig. 1, when the heat spreading layer 200 is die cast with the metal bezel layer 100, facing us in fig. 1 is the outer metal strength layer 210, while the inner metal thermal conduction layer 220 and the inner metal strength layer 230 are not visible. Actually, the outer metal strength layer 210, the metal heat conduction layer 220, the inner metal strength layer 230, and the metal middle frame layer 100 are arranged in sequence from outside to inside. As illustrated in fig. 5, which faces our side is the outer metal strength layer 210, and as illustrated in fig. 6, which faces our side is the inner metal strength layer 230.
In the present embodiment, since the inner metal strength layer 230 is in contact with the metal middle frame layer 100, and the inner metal strength layer 230 is provided with the heat conduction through holes 231, the metal heat conduction layer 220 can be directly in contact with the metal middle frame layer 100 through the heat conduction through holes 231. In this kind of structure, the heat that the mainboard heating area produced transmits the metal center layer 100 first, then transmits to metal heat-conducting layer 220 through heat conduction through-hole 231 by metal center layer 100, because metal heat-conducting layer 220 can be the good copper layer of heat conduction, therefore can show and promote thermal conductivity.
In some embodiments, the following design may also be made:
for example, a heat conduction protrusion 110 protruding into each of the heat conduction through holes 231 protrudes from a surface of the metal middle frame layer 100 facing the inner metal strength layer 230, and the metal heat conduction layer 220 contacts with the heat conduction protrusion 110 to conduct heat.
In this structure, since the inner metal strength layer 230 has a certain thickness although it is thin, the metal middle frame layer 100 is provided with a plurality of heat conduction protrusions 110, and the heat conduction protrusions 110 are in light-tight fit with the heat conduction holes and are in contact with the metal heat conduction layer 220 through the heat conduction through holes 231, so that the structural design can be more beneficial to the contact between the metal middle frame layer 100 and the metal heat conduction layer 220, thereby ensuring the exertion of heat conduction performance.
As shown in fig. 1, 4, 5, 6 and 7, the heat dissipation layer 200 is provided with a positioning through hole 240 penetrating through the outer metal strength layer 210, the metal heat conduction layer 220 and the inner metal strength layer 230, and the heat dissipation layer 200 is positioned with the metal middle frame layer 100 through the positioning through hole 240.
In this structure, due to the positioning through hole 240, the metal middle frame layer 100 and the heat dissipation layer 200 can be positioned in advance. Specifically, when die casting is performed through a die, the heat dissipation layer 200 is placed in the die, and is pre-positioned through the positioning through hole 240 and the positioning column in the die, and then die casting is performed on the metal middle frame layer 100. The positioning through hole 240 is designed to achieve the pre-positioning of the heat dissipation layer 200.
Referring to fig. 3, fig. 3 is a schematic view of the metal middle frame layer 100 when the heat dissipation layer 200 is not disposed in the heat dissipation device, as shown in fig. 3, a middle frame recess 120 is disposed on a surface of the metal middle frame layer 100 facing the heat dissipation layer 200, the heat dissipation layer 200 is integrally disposed in the middle frame recess 120, and a depth of the middle frame recess 120 is equal to a thickness of the heat dissipation layer 200.
In this embodiment, the metal bezel layer 100 is recessed and the depth of the recess is equal to the overall thickness of the heat dissipation layer 200, and thus the heat dissipation layer 200 does not increase the overall thickness of the metal bezel layer 100. The structural strength of the metal middle frame layer 100 can also be ensured by including two stainless steel layers in the inner and outer layers of the heat dissipation layer 200. In addition, the heat conduction performance is improved by the metal heat conduction layer 220 between the inner and outer layers. It should be noted that the metal middle frame layer 100 is formed by press-casting in a mold in a structure in which the frame recess 120 is formed to fit the heat dissipation layer 200.
Further, in the above-described embodiment, further design may be made.
For example, as shown in fig. 1 to 7, a plurality of dovetail notches 250 are formed at the peripheral edge of the heat dissipation layer 200, and a dovetail filling portion 130 that is engaged with the dovetail notches 250 is formed on the inner wall of the edge of the center frame recess 120. In this kind of technical scheme, dovetail notch portion 250 has all been seted up around heat dissipation layer 200, including inside metal strength layer, middle metal heat-conducting layer 220 and outside metal strength layer. When the metal middle frame layer 100 is injection-molded, a liquid metal material enters the dovetail groove 250 to form the dovetail filler 130, and the heat dissipation layer 200 and the metal middle frame layer 100 are fixed by the matching design of the dovetail groove 250 and the dovetail filler 130.
It should be further noted that in the present application, the metal heat conduction layer 220 may be a SCS three-layer composite metal material, and the composition thereof includes:
the total thickness is 0.2mm, and the steel wire is respectively composed of stainless steel (0.04mm) + copper (0.12mm) + stainless steel (0.04 mm);
the stainless steel material provides excellent rigidity and strength, and ensures the strength under an extremely thin thickness;
the copper material is arranged between the two stainless steel sheets, so that excellent heat conducting performance is provided, and the heat conducting coefficient of the material is improved.
In the present application, the aluminum alloy has an overall thickness of 0.6mm, wherein the thickness of the embedded SCS material portion (i.e., the heat dissipation layer 200 in the present embodiment) is 0.2mm (meeting the process flow requirements of aluminum alloy die-casting); the liquid aluminum water is formed and fixed by utilizing the intermolecular binding force, and meanwhile, the adhesive pulling structure is additionally arranged on the periphery of the SCS material for auxiliary fixation.
In addition, in the present application, the stainless steel is perforated near the aluminum alloy sides, exposing the copper in the middle to directly contact the aluminum alloy; that is, as described in the above embodiment, the inner metal strength layer 230 adjacent to the metal middle frame layer 100 is provided with the heat conducting through holes 231, so that the metal heat conducting layer 220 is in direct contact with the metal middle frame layer 100.
The dovetail groove design is added around the three layers of SCS materials, and the glue pulling design with aluminum alloy is added, namely in the embodiment, the dovetail notch part 250 design is made on the heat dissipation layer 200, the dovetail filling part 130 design is made on the metal middle frame layer 100, and the fixation is realized through the glue pulling matching design between the dovetail notch part 250 and the dovetail filling part 130.
And the upper left corner is provided with a through hole design when the front side is seen, and the through hole design is used for positioning the SCS plate in the die. That is, in the above embodiment, the positioning through hole 240 is opened in the heat dissipation layer 200.
In addition, in the present application, the area a in fig. 2 is a heat dissipation area of the motherboard, which is a main source of heat, so that the lower stainless steel of the heat dissipation layer 200 is uniformly perforated (heat conduction through hole 231) in this area, and the copper plate of the middle layer is exposed to directly contact with the aluminum alloy. On the heat directly conducted the copper through the aluminum alloy, utilized the heat conductivity of copper to be greater than the characteristic of aluminum alloy far away, spread the fast quick downward transmission of heat. Is passed off downwards. And the quick heat dissipation is realized.
In summary, the main improvements of the present application are:
1. the middle frame of the mobile phone product is formed by embedding a high-strength three-layer composite metal material (SCS for short) into a die-casting aluminum alloy material.
2. The middle frame is formed by die-casting aluminum alloy and SCS through the cold die-casting machine and the automatic manipulator for pressing and injection molding.
3. The middle frame breaks through the traditional forming mode, creatively utilizes the characteristics of the SCS material, fixes the SCS material in a die with different characteristics and die-casting aluminum alloy, and directly presses and molds the copper with the best heat dissipation performance in the SCS with the aluminum alloy to reduce the interface heat conduction loss of two media.
4. SCS material in the invention, namely stainless steel (0.04mm) + copper (0.12mm) + stainless steel (0.04 mm); the total thickness is accumulated to be 0.2 mm;
the stainless steel adopts SUS304, and the double-sided structure ensures the rigidity and the strength of the overall material and the fixation in a die;
the copper adopts a pure copper sheet and is used for improving the heat conductivity coefficient;
in summary, the main technical effects of the present application are as follows:
1. the embedded molding design of the novel material SCS is adopted, so that the heat conductivity coefficient is greatly increased;
2. the copper material with high heat conductivity is directly contacted with the aluminum alloy material by skillfully designing the SCS three-layer structure, so that the heat conductivity coefficient is greatly improved;
3. through the embedded design of SCS, the thickness of the alloy middle frame can not be increased.
In addition, the application also provides a heat dissipation device for electronic equipment, wherein the electronic equipment comprises a mainboard heating area; the heat dissipation device comprises a metal middle frame layer 100 which is in contact with a heating area of the mainboard; one side of the metal middle frame layer 100 back to the mainboard heating area is covered with a heat dissipation layer 200, and the heat dissipation layer 200 is at least two-layer and comprises a metal heat conduction layer 220 which is in contact with the metal middle frame layer 100 for heat conduction and an external metal strength layer 210 which is arranged outside the metal heat conduction layer. It should be noted that the electronic device may be a mobile phone, a watch, a pad, or other mobile or non-mobile terminal, which is not limited in this application. The technical effect is the same as that of the mobile phone in the above embodiment, and is not described herein again.
Moreover, the application also provides a manufacturing method of the mobile phone, the mobile phone comprises a mainboard heating area, and the heat dissipation device comprises a metal middle frame layer 100 which is in contact with the mainboard heating area; one side of the metal middle frame layer 100, which is back to the mainboard heating area, is covered with a heat dissipation layer 200, and the heat dissipation layer 200 is at least two layers and comprises a metal heat conduction layer 220 which is in contact with the metal middle frame layer 100 for heat conduction and an external metal strength layer 210 which is arranged outside the metal heat conduction layer 220; the manufacturing method comprises the following steps:
when the metal middle frame layer 100 is die-cast in a mold through a liquid metal material, the heat dissipation layer 200 is pre-positioned in the mold, and the metal heat conduction layer 220 faces the liquid metal material, so that the metal heat conduction layer 220 contacts the metal middle frame layer 100 to be integrally die-cast.
Further, the heat dissipation layer 200 further includes an inner metal strength layer 230, and the metal heat conduction layer 220 is sandwiched and fixed between the outer metal strength layer 210 and the inner metal strength layer 230; the inner metal strength layer 230 is in contact with the metal middle frame layer 100; the inner metal strength layer 230 is provided with a plurality of heat conduction through holes 231, so that the metal heat conduction layer 220 contacts with the metal middle frame layer 100 through each heat conduction through hole 231 to conduct heat;
the inner metal strength layer 230 is oriented towards the liquid metal material, so that the liquid metal material is in contact with the metal heat conduction layer 220 through the heat conduction through holes 231, and the metal heat conduction layer 220 is in contact with the metal middle frame layer 100 and is integrally die-cast.
It should be noted that, in the above embodiments of the mobile phone and the method, the working process and the technical effect are the same as those of the above heat dissipation device, and are not described herein again.
The above-described embodiments of the apparatus are merely illustrative, and the units described as separate parts may or may not be physically separate, and parts displayed as units may or may not be physical units, may be located in one place, or may be distributed on a plurality of network units. Some or all of the modules may be selected according to actual needs to achieve the purpose of the solution of the present embodiment. One of ordinary skill in the art can understand and implement it without inventive effort.
Reference throughout this specification to "embodiments," "some embodiments," "one embodiment," or "an embodiment," etc., means that a particular feature, component, or characteristic described in connection with the embodiment is included in at least one embodiment. Thus, appearances of the phrases "in various embodiments," "in some embodiments," "in at least one other embodiment," or "in an embodiment," or the like, throughout this specification are not necessarily all referring to the same embodiment. Furthermore, the particular features, components, or characteristics may be combined in any suitable manner in one or more embodiments. Thus, without limitation, a particular feature, component, or characteristic illustrated or described in connection with one embodiment may be combined, in whole or in part, with a feature, component, or characteristic of one or more other embodiments. Such modifications and variations are intended to be included within the scope of the present application.
Moreover, those skilled in the art will appreciate that aspects of the present application may be illustrated and described in terms of several patentable species or situations, including any new and useful combination of processes, machines, manufacture, or materials, or any new and useful improvement thereon. Accordingly, various aspects of the present application may be embodied entirely in hardware, entirely in software (including firmware, resident software, micro-code, etc.) or in a combination of hardware and software. The above hardware or software may be referred to as "data block," module, "" engine, "" terminal, "" component, "or" system. Furthermore, aspects of the present application may be represented as a computer product, including computer readable program code, embodied in one or more computer readable media.
It is to be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that an article or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above description is merely exemplary of the present application and is presented to enable those skilled in the art to understand and practice the present application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the application. Thus, the present application is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (10)
1. A mobile phone comprises a mainboard heating area and a heat dissipation device for dissipating heat of the mainboard heating area; the heat dissipation device is characterized by comprising a metal middle frame layer which is in contact with the heating area of the mainboard; the metal middle frame layer is back to one side of the mainboard heating area is covered with a heat dissipation layer, the heat dissipation layer is at least two-layer, and the heat dissipation layer comprises a metal heat conduction layer and an external metal strength layer, wherein the metal heat conduction layer is in contact with the metal middle frame layer, and the external metal strength layer is arranged outside the metal heat conduction layer.
2. The phone of claim 1 wherein said heat sink layer further comprises an inner metal strength layer, said metal heat conductive layer being sandwiched between said outer metal strength layer and said inner metal strength layer; the inner metal strength layer is in contact with the metal middle frame layer.
3. The mobile phone of claim 2, wherein the inner metal strength layer is formed with a plurality of heat conducting through holes, so that the metal heat conducting layer is in contact with the metal middle frame layer through each of the heat conducting through holes for heat conduction.
4. The mobile phone of claim 3, wherein a surface of the metal middle frame layer facing the inner metal strength layer is protruded with heat conduction protrusions extending into the heat conduction through holes, and the metal heat conduction layer is in contact with the heat conduction protrusions for heat conduction.
5. The mobile phone according to any one of claims 2 to 4, wherein the heat dissipation layer is provided with a positioning through hole penetrating through the outer metal strength layer, the metal heat conduction layer and the inner metal strength layer, and the heat dissipation layer is positioned with the metal middle frame layer through the positioning through hole.
6. The mobile phone of any one of claims 2-4, wherein a surface of the metal middle frame layer facing the heat dissipation layer is formed with a middle frame recess, the heat dissipation layer is integrally formed in the middle frame recess, and the depth of the middle frame recess is equal to the thickness of the heat dissipation layer.
7. The mobile phone of claim 6, wherein a plurality of dovetail notches are formed on the periphery of the heat dissipation layer, and a dovetail filling portion is formed on the inner wall of the edge of the middle frame recess and is in fit connection with the dovetail notches.
8. A heat sink for an electronic device, the electronic device comprising a motherboard heating area; the heat dissipation device is characterized by comprising a metal middle frame layer which is in contact with the heating area of the mainboard; the metal middle frame layer is back to one side of the mainboard heating area is covered with a heat dissipation layer, the heat dissipation layer is at least two-layer, and the heat dissipation layer comprises a metal heat conduction layer and an external metal strength layer, wherein the metal heat conduction layer is in contact with the metal middle frame layer, and the external metal strength layer is arranged outside the metal heat conduction layer.
9. A manufacturing method of a mobile phone comprises a mainboard heating area and a heat dissipation device for dissipating heat of the mainboard heating area, wherein the heat dissipation device comprises a metal middle frame layer which is in contact with the mainboard heating area; one side of the metal middle frame layer, which is back to the mainboard heating area, is covered with a heat dissipation layer, and the heat dissipation layer is at least two layers and comprises a metal heat conduction layer which is in contact with the metal middle frame layer for heat conduction and an external metal strength layer which is arranged outside the metal heat conduction layer; characterized in that the manufacturing method comprises:
when the metal middle frame layer is formed in a die-casting mode through a liquid metal material, the heat dissipation layer is placed in the die in a pre-positioned mode, the metal heat conduction layer faces towards the liquid metal material, and therefore the metal heat conduction layer is in contact with the metal middle frame layer to be formed in an integrated die-casting mode.
10. The method of claim 9, wherein the heat dissipation layer further comprises an inner metal strength layer, the metal heat conduction layer being sandwiched and fixed between the outer metal strength layer and the inner metal strength layer; the inner metal strength layer is in contact with the metal middle frame layer; the inner metal strength layer is provided with a plurality of heat conduction through holes, so that the metal heat conduction layer is in contact with the metal middle frame layer for heat conduction through each heat conduction through hole;
the inner metal strength layer faces the liquid metal material, so that the liquid metal material is in contact with the metal heat conduction layer through the heat conduction through holes, and the metal heat conduction layer is in contact with the metal middle frame layer to be integrally formed through die casting.
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| CN202110179997.1A CN112804385A (en) | 2021-02-09 | 2021-02-09 | Mobile phone, manufacturing method thereof and heat dissipation device for electronic equipment |
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Application publication date: 20210514 |