CN219644407U - Circuit board heat abstractor and computer server - Google Patents

Abstract

The embodiment of the utility model provides a circuit board heat dissipation device and a computer server, wherein the circuit board heat dissipation device comprises a liquid cooling pipe and at least two liquid cooling substrates, the liquid cooling substrates are used for being in contact with chips on a circuit board so as to absorb heat on the circuit board, the liquid cooling pipe is used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling pipe comprises at least two first pipe sections and a second pipe section connected between the two adjacent first pipe sections, each first pipe section is respectively fixed on one liquid cooling substrate, and the liquid cooling pipe is a flexible pipe. According to the circuit board heat dissipation device provided by the embodiment of the utility model, the liquid cooling pipes and the at least two liquid cooling substrates are arranged, the liquid cooling pipes are used for connecting the at least two liquid cooling substrates, are used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling substrates are cooled, and then each liquid cooling substrate is respectively covered on at least one chip on the circuit board, so that each liquid cooling substrate and the chip can be well attached, and the heat dissipation effect is improved.

Description

Circuit board heat abstractor and computer server

Technical Field

The utility model relates to the technical field of circuit board heat dissipation, in particular to a circuit board heat dissipation device and a computer server.

Background

The chip packaging technology gradually moves from small chips to large chip packaging, because when small chips are adopted, tens or even hundreds of chips are often required to be distributed on a circuit board in order to realize the powerful functions of an integrated circuit, so that the size of the circuit board needs to be increased, meanwhile, wires between the chips are longer so as to have large loss, and therefore, the size of a single chip is increased, and the functions are enhanced so as to reduce the number of chips on the circuit board.

In order to dissipate heat from the chips integrated in one circuit board, a heat dissipating device is required, which is required to dissipate heat from each chip. The prior art provides an integrated extrusion molding's aluminium alloy water-cooling board, specifically discloses this aluminium alloy water-cooling board be integrated into one piece, and a water-cooling board is all chips contact and dispel the heat on a circuit board simultaneously. However, this integral mounting method cannot guarantee the contact effect between the water cooling plate and each chip at all, because the chip is welded to the circuit board with high tolerance, and cannot guarantee the height uniformity of each chip at all; the integrated water cooling plate has uneven heat dissipation effect on each chip, so that the overall heat dissipation effect is not ideal.

Disclosure of Invention

The embodiment of the utility model provides a circuit board heat dissipation device and a computer server, which can solve the technical problem that the heat dissipation device cannot be well attached to each chip due to the fact that a plurality of chips are arranged on a circuit board and have height difference, so that heat dissipation is affected.

The embodiment of the utility model provides a circuit board heat dissipation device, which comprises a liquid cooling pipe and at least two liquid cooling substrates, wherein the liquid cooling substrates are used for being in contact with chips on a circuit board so as to absorb heat on the circuit board, the liquid cooling pipe is used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling pipe comprises at least two first pipe sections and a second pipe section connected between two adjacent first pipe sections, and each first pipe section is respectively fixed on one liquid cooling substrate, wherein the liquid cooling pipe is a flexible pipe.

In the circuit board heat dissipation device provided by the embodiment of the utility model, the liquid cooling substrate is provided with the heat conduction component, and the liquid cooling substrate is contacted with the chip on the circuit board through the heat conduction component.

In the circuit board heat dissipation device according to the embodiment of the utility model, the circuit board heat dissipation device further comprises a heat conduction liquid, and the liquid cooling substrate is in contact with the chip on the circuit board through the heat conduction liquid.

In the circuit board heat dissipating device according to the embodiment of the present utility model, the first pipe section is fixed on the liquid-cooled substrate by at least one of welding, screw connection, and bonding.

In the circuit board heat dissipation device provided by the embodiment of the utility model, the top of the liquid cooling substrate is provided with the groove, and the liquid cooling pipe is connected with the liquid cooling substrate through the groove.

In the circuit board heat dissipating device according to the embodiment of the utility model, each liquid cooling substrate is provided with at least two grooves which are arranged in parallel at intervals, and each groove is internally provided with one first pipe section.

The embodiment of the utility model also provides another circuit board heat dissipation device, which comprises a circuit board and a liquid cooling device, wherein the circuit board comprises a circuit substrate and at least two chips distributed on the circuit substrate; the liquid cooling device comprises a liquid cooling pipe and at least two liquid cooling substrates, wherein the liquid cooling substrates are used for being in contact with chips on the circuit substrates so as to absorb heat on the circuit substrates, the liquid cooling pipe is used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling pipe comprises at least two first pipe sections and second pipe sections connected between the adjacent two first pipe sections, and each first pipe section is respectively fixed on one liquid cooling substrate.

In the circuit board heat dissipation device according to the embodiment of the utility model, the liquid cooling substrate is provided with the heat conduction component, and the liquid cooling substrate is contacted with the chip on the circuit substrate through the heat conduction component.

In the circuit board heat dissipation device according to the embodiment of the utility model, the circuit board heat dissipation device further comprises a heat conduction liquid, and the liquid cooling substrate is in contact with the chip on the circuit substrate through the heat conduction liquid.

The embodiment of the utility model also provides a computer server, which comprises a machine body and the circuit board heat dissipation device according to any embodiment, wherein the circuit board heat dissipation device is arranged in the machine body.

According to the circuit board heat dissipation device provided by the embodiment of the utility model, the liquid cooling pipes and the at least two liquid cooling substrates are arranged, the liquid cooling pipes are used for connecting the at least two liquid cooling substrates, are used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling substrates are cooled, and then each liquid cooling substrate is respectively covered on at least one chip on the circuit board, so that each liquid cooling substrate can be well attached to the chip, and the heat dissipation effect cannot be influenced by the height difference generated by mounting a plurality of chips on the circuit board.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present utility model, the drawings that are required to be used in the description of the embodiments will be briefly described below. It is evident that the drawings in the following description are only some embodiments of the utility model and that other drawings may be obtained from these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a liquid-cooled substrate according to an embodiment of the present utility model.

Fig. 2 is a schematic structural diagram of a heat dissipating device for a circuit board according to an embodiment of the present utility model.

Fig. 3 is another schematic structural diagram of a heat dissipating device for a circuit board according to an embodiment of the present utility model.

Fig. 4 is another schematic structural diagram of a heat dissipating device for a circuit board according to an embodiment of the present utility model.

Fig. 5 is an assembly schematic diagram of a heat dissipating device for a circuit board according to an embodiment of the present utility model.

Detailed Description

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. It will be apparent that the described embodiments are only some, but not all, embodiments of the utility model. All other embodiments, which can be made by those skilled in the art based on the embodiments of the utility model without making any inventive effort, are intended to fall within the scope of the utility model.

In the description of the present utility model, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present utility model and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present utility model. Furthermore, the terms "first," "second," and the like, are used for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include one or more of the described features. In the description of the present utility model, the meaning of "a plurality" is two or more, unless explicitly defined otherwise.

In the description of the present utility model, it should be noted that, unless explicitly specified and limited otherwise, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be either fixedly connected, detachably connected, or integrally connected, for example; can be mechanically connected, electrically connected or can be communicated with each other; can be directly connected or indirectly connected through an intermediate medium, and can be communicated with the inside of two elements or the interaction relationship of the two elements. The specific meaning of the above terms in the present utility model can be understood by those of ordinary skill in the art according to the specific circumstances.

In the present utility model, unless expressly stated or limited otherwise, a first feature "above" or "below" a second feature may include both the first and second features being in direct contact, as well as the first and second features not being in direct contact but being in contact with each other through additional features therebetween. Moreover, a first feature being "above," "over" and "on" a second feature includes the first feature being directly above and obliquely above the second feature, or simply indicating that the first feature is higher in level than the second feature. The first feature being "under", "below" and "beneath" the second feature includes the first feature being directly under and obliquely below the second feature, or simply means that the first feature is less level than the second feature.

The following disclosure provides many different embodiments, or examples, for implementing different features of the utility model. In order to simplify the present disclosure, components and arrangements of specific examples are described below. They are, of course, merely examples and are not intended to limit the utility model. Furthermore, the present utility model may repeat reference numerals and/or letters in the various examples, which are for the purpose of brevity and clarity, and which do not themselves indicate the relationship between the various embodiments and/or arrangements discussed. In addition, the present utility model provides examples of various specific processes and materials, but one of ordinary skill in the art will recognize the application of other processes and/or the use of other materials.

The embodiment of the utility model provides a circuit board heat dissipation device. Referring to fig. 1 to 3, a circuit board heat dissipating device 1000 includes a liquid cooling tube 10 and at least two liquid cooling substrates 20, the liquid cooling substrates 20 are used for contacting with chips on a circuit board to absorb heat on the circuit board, the liquid cooling tube 10 is used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling tube 10 includes at least two first tube sections and a second tube section connected between two adjacent first tube sections, each first tube section is respectively fixed on one liquid cooling substrate 20, wherein the liquid cooling tube 10 is a flexible tube.

The liquid cooling tube 10 may be made of flexible heat-conducting nonmetallic material, or may be a copper tube, an aluminum tube, an iron tube, or the like. The liquid cooling substrate 20 is a metal plate, and may be made of aluminum, steel plate, copper, or the like.

When the liquid cooling substrates 20 are fixed on the circuit board, since the liquid cooling pipes 10 are flexible pipes, each liquid cooling substrate 20 can be fastened with different pressures, so that heat dissipation can be performed for chips with different numbers and different pressure requirements.

Because the liquid cooling tube 10 has flexibility, when the welding height of each chip on the circuit board has a certain tolerance, the height difference can be counteracted by micro-bending the liquid cooling tube 10, so that the liquid cooling substrate 20 can be better attached to the chip, and the heat dissipation effect of the chip cannot be affected due to the height difference generated by mounting a plurality of chips on the circuit board.

In some embodiments, the liquid cooling substrate 20 is provided with a heat conducting member 30, and the liquid cooling substrate 20 is in contact with the chip on the circuit board through the heat conducting member 30.

The heat conducting component 30 can be copper plates, iron plates, VC, silver and other materials, and the heat conducting component 30 can achieve the effect of rapid temperature equalization.

In some embodiments, the circuit board heat sink 1000 further includes a thermally conductive liquid through which the liquid-cooled substrate 20 contacts the chips on the circuit board.

The heat conducting liquid may be liquid metal, graphene heat conducting pad or other interface material with high heat conductivity. The heat conducting liquid is coated on the chip of the circuit board and then contacts with the liquid cooling substrate 20, so that when the chip generates heat, the heat can be rapidly transferred to the liquid cooling substrate 20 through the heat conducting liquid and is taken away through water flow in the liquid cooling pipe 10, and the heat dissipation of the chip is completed.

In addition, since the pressure of each liquid cooling substrate 20 to be fixed to the circuit board can be independently adjusted, the use requirement of the heat conductive liquid (liquid metal) can be satisfied.

In some embodiments, the first tube section is fixed to the liquid cooling substrate 20 by at least one of welding, screwing, and bonding.

In some embodiments, a groove 40 is formed on the top of the liquid cooling substrate 20, and the liquid cooling tube 10 is connected to the liquid cooling substrate 10 through the groove 40.

Wherein, the liquid cooling pipe 10 can be welded in the groove 40 in a welding mode, so that the connection between the liquid cooling pipe 10 and the liquid cooling substrate 20 is realized. Before the liquid-cooled tube 10 is welded to the groove 40 on the liquid-cooled substrate 20, the liquid-cooled tube 10 is bent into a shape corresponding to the groove 40, and then welded into the groove 40 on the liquid-cooled substrate 10, so that good contact between the liquid-cooled tube 10 and the liquid-cooled substrate 20 is ensured.

The heat conducting liquid can be added between the liquid cooling substrate 20 and the liquid cooling tube 10 to rapidly conduct the heat on the liquid cooling substrate 20 to the liquid cooling tube 10.

In some embodiments, at least two grooves 40 are disposed on each liquid cooling substrate 20 in parallel at intervals, and one first pipe section is disposed in each groove 40.

In some embodiments, screw holes 201 are provided in each liquid-cooled substrate 20, and the screw holes 201 are used for placing screws to fix the liquid-cooled substrate 20 to a circuit board.

In summary, in the circuit board heat dissipating device 1000 provided by the embodiment of the utility model, by arranging the liquid cooling tube 10 and at least two liquid cooling substrates 20, the liquid cooling tube 10 is used for connecting the at least two liquid cooling substrates 20, and is used for accommodating cooling liquid and guiding the cooling liquid to flow, cooling the liquid cooling substrates 20, and then each liquid cooling substrate 20 is respectively covered on at least one chip on the circuit board, so that each liquid cooling substrate 20 can be well attached to the chip, and the heat dissipating effect cannot be affected due to the height difference generated by mounting a plurality of chips on the circuit board.

The embodiment of the utility model also provides a circuit board heat dissipation device. Referring to fig. 4 and 5, the circuit board heat dissipating device 2000 includes a circuit board 50 and a liquid cooling device 60, the circuit board 50 includes a circuit substrate 501 and at least two chips 502 distributed on the circuit substrate 501; the liquid cooling device 60 includes a liquid cooling tube 601 and at least two liquid cooling substrates 602, the liquid cooling substrates 602 are used for contacting with the chips 502 on the circuit substrate 501 to absorb heat on the circuit board 50, the liquid cooling tube 601 is used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling tube 601 includes at least two first tube sections and a second tube section connected between two adjacent first tube sections, and each first tube section is respectively fixed on one liquid cooling substrate 602.

The liquid cooling pipe 601 may be made of flexible heat-conducting nonmetallic material, or may be a copper pipe, an aluminum pipe, an iron pipe, or the like. The liquid cooling substrate 602 is a metal plate, and may be made of aluminum, steel plate, copper, or the like.

When the liquid cooling substrates 602 are fixed on the circuit substrate 501 by screws, since the liquid cooling pipes 601 are flexible pipes, each liquid cooling substrate 602 can be fastened with different pressures, so that heat can be dissipated for chips 502 with different numbers and different pressure requirements.

Because the liquid cooling pipe 601 has flexibility, when the welding height of each chip 502 on the circuit substrate 501 has a certain tolerance, the height difference can be counteracted by slightly bending the liquid cooling pipe 601, so that the liquid cooling substrate 602 is better attached to the chips 502, and the heat dissipation effect of the chips 502 cannot be affected due to the height difference generated by mounting a plurality of chips 502 on the circuit substrate 501.

In some embodiments, the liquid cooling substrate 602 is provided with a heat conducting member 70, and the liquid cooling substrate 602 is in contact with the chip 502 on the circuit substrate 501 through the heat conducting member 70.

The heat conducting component 70 may be copper plate, iron plate, VC, silver or other material, and the heat conducting component 70 has the effect of fast temperature equalization.

In some embodiments, the circuit board heatsink 2000 further includes a thermally conductive liquid through which the liquid-cooled substrate 602 is in contact with the chips 502 on the circuit substrate 501.

The heat conducting liquid may be liquid metal, graphene heat conducting pad or other interface material with high heat conductivity. By coating the heat conducting liquid 80 on the chip 502 of the circuit board 50 and then contacting the liquid cooling substrate 602, when the chip 502 generates heat, the heat can be rapidly transferred to the liquid cooling substrate 602 through the heat conducting liquid, and the heat can be dissipated by the water flow in the liquid cooling pipe 601.

In addition, since the pressure of the liquid cooling substrates 602 fixed to the circuit board 50 can be independently adjusted, the use requirement of the heat conductive liquid (liquid metal) can be satisfied.

In some embodiments, the first tube section is secured to the liquid cooled base plate 602 by at least one of welding, screwing, or bonding.

In some embodiments, a groove 90 is provided on top of the liquid cooling substrate 602, and the liquid cooling tube 601 is connected to the liquid cooling substrate 602 through the groove 90.

Wherein, the liquid cooling pipe 601 can be welded in the groove 90 by adopting a welding mode, thereby realizing the connection between the liquid cooling pipe 601 and the liquid cooling substrate 602. Before the liquid-cooled tube 601 is welded to the groove 90 on the liquid-cooled substrate 602, the liquid-cooled tube 601 is bent into a shape corresponding to the groove 90, and then welded into the groove 90 on the liquid-cooled substrate 602, so that good contact between the liquid-cooled tube 601 and the liquid-cooled substrate 602 is ensured.

The heat conducting liquid can be added between the liquid cooling substrate 602 and the liquid cooling pipe 601, so that heat on the liquid cooling substrate 602 is quickly conducted to the liquid cooling pipe 601.

In some embodiments, at least two grooves 90 are disposed in parallel with each other on each liquid cooling substrate 602, and one first pipe section is disposed in each groove 90.

In some embodiments, the circuit board heat dissipating device 2000 further includes a spring screw 100, the liquid cooling substrate 602 is provided with a screw hole 110, the circuit substrate 501 is soldered with a surface mount nut, and the liquid cooling substrate 602 is fixed on the circuit substrate 501 by the spring screw 100.

In summary, in the circuit board heat dissipating device 2000 provided by the embodiment of the present utility model, by providing the liquid cooling device 60 including the liquid cooling pipe 601 and at least two liquid cooling substrates 602, the liquid cooling pipe 10 is used for connecting the at least two liquid cooling substrates 20, and for accommodating the cooling liquid and guiding the cooling liquid to flow, cooling the liquid cooling substrates 602, and then covering each liquid cooling substrate 602 on at least one chip 502 on the circuit substrate 501, so that good adhesion between each liquid cooling substrate 602 and the chip 502 can be ensured, and the heat dissipating effect cannot be affected by the height difference generated by mounting a plurality of chips 502 on the circuit substrate 501.

The embodiment of the utility model also provides a computer server. The computer server comprises a machine body and the circuit board heat dissipation device of any embodiment, wherein the circuit board heat dissipation device is installed in the machine body.

In the foregoing embodiments, the descriptions of the embodiments are emphasized, and for parts of one embodiment that are not described in detail, reference may be made to related descriptions of other embodiments.

The foregoing describes in detail a circuit board heat dissipation device and a computer server provided by the embodiments of the present utility model, and specific examples are applied to illustrate the principles and embodiments of the present utility model, where the foregoing description of the embodiments is only for helping to understand the technical solution and core ideas of the present utility model; those of ordinary skill in the art will appreciate that: the technical scheme described in the foregoing embodiments can be modified or some technical features thereof can be replaced by equivalents; such modifications and substitutions do not depart from the spirit of the utility model.

Claims (10)

1. The utility model provides a circuit board heat abstractor, its characterized in that includes liquid cooling pipe and two at least liquid cooling base plates, the liquid cooling base plate is used for with the chip contact on the circuit board, in order to absorb heat on the circuit board, the liquid cooling pipe is used for holding coolant liquid and guide coolant liquid flow, the liquid cooling pipe includes two at least first pipeline sections and connects in adjacent two second pipeline section between the first pipeline section, every first pipeline section is fixed in respectively on the liquid cooling base plate, wherein, the liquid cooling pipe is the flexible pipe.

2. The circuit board heat sink of claim 1, wherein the liquid-cooled substrate is provided with a heat conducting member, and the liquid-cooled substrate is in contact with a chip on the circuit board through the heat conducting member.

3. The circuit board heat sink of claim 2, further comprising a thermally conductive liquid through which the liquid-cooled substrate contacts a chip on the circuit board.

4. The circuit board heat sink of claim 1, wherein the first tube section is fixed to the liquid-cooled substrate by at least one of welding, screw connection, and adhesive connection.

5. The circuit board heat dissipating device of any one of claims 1 to 4, wherein a groove is provided on a top of the liquid-cooled substrate, and the liquid-cooled tube is connected to the liquid-cooled substrate through the groove.

6. The circuit board heat sink of claim 5 wherein each of said liquid cooled substrates has at least two spaced parallel grooves, each of said grooves having one of said first tube sections disposed therein.

7. The circuit board heat dissipation device is characterized by comprising a circuit board and a liquid cooling device, wherein the circuit board comprises a circuit substrate and at least two chips distributed on the circuit substrate; the liquid cooling device comprises a liquid cooling pipe and at least two liquid cooling substrates, wherein the liquid cooling substrates are used for being in contact with chips on the circuit substrates so as to absorb heat on the circuit substrates, the liquid cooling pipe is used for accommodating cooling liquid and guiding the cooling liquid to flow, the liquid cooling pipe comprises at least two first pipe sections and second pipe sections connected between the adjacent two first pipe sections, and each first pipe section is respectively fixed on one liquid cooling substrate.

8. The circuit board heat sink of claim 7, wherein the liquid-cooled substrate is provided with a heat conducting member, and the liquid-cooled substrate is in contact with a chip on the circuit substrate through the heat conducting member.

9. The circuit board heat sink of claim 7, further comprising a thermally conductive liquid through which the liquid-cooled substrate is in contact with a chip on the circuit substrate.

10. A computer server comprising a body and the circuit board heat sink according to any one of claims 1 to 9, the circuit board heat sink being mounted in the body.