CN111935898A - Circuit board assembly and electronic device - Google Patents
Circuit board assembly and electronic device Download PDFInfo
- Publication number
- CN111935898A CN111935898A CN202010741214.XA CN202010741214A CN111935898A CN 111935898 A CN111935898 A CN 111935898A CN 202010741214 A CN202010741214 A CN 202010741214A CN 111935898 A CN111935898 A CN 111935898A
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- China
- Prior art keywords
- circuit board
- heat dissipation
- component
- heat
- contact portion
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention provides a circuit board assembly and an electronic network device using the same, wherein the circuit board assembly comprises: the circuit board is provided with a heat dissipation hole penetrating through the circuit board; the component is fixed on one side of the circuit board, the component is electrically connected with the circuit board, and at least part of the heat dissipation holes are positioned in the projection range of the component on the circuit board; the heat dissipation plate is arranged on one side, away from the component, of the circuit board and is arranged at an interval with the circuit board; the heat conducting piece penetrates through the heat dissipation holes and is respectively connected with the component and the heat dissipation plate so as to transfer heat of the component to the heat dissipation plate. The technical scheme of the invention aims to improve the heat dissipation efficiency of the components on the circuit board.
Description
Technical Field
The present invention relates to the field of circuit board technologies, and in particular, to a circuit board assembly and an electronic device using the same.
Background
In electronic equipment, a circuit board is mostly equipped, most components on the circuit board are located on the same side of the circuit board, and the components generate heat to enable the corresponding side of the circuit board to gather excessive heat, so that heat dissipation is slow.
Disclosure of Invention
The invention mainly aims to provide a circuit board assembly and aims to improve the heat dissipation efficiency of components on a circuit board.
To achieve the above object, the present invention provides a circuit board assembly, comprising:
the circuit board is provided with a heat dissipation hole penetrating through the circuit board;
the component is fixed on one side of the circuit board, the component is electrically connected with the circuit board, and at least part of the heat dissipation holes are positioned in the projection range of the component on the circuit board;
the heat dissipation plate is arranged on one side, away from the component, of the circuit board and is arranged at an interval with the circuit board;
the heat conducting piece penetrates through the heat dissipation holes and is respectively connected with the component and the heat dissipation plate so as to transfer heat of the component to the heat dissipation plate.
Optionally, the heat conducting member includes a first contact portion and a second contact portion that are connected, the second contact portion is inserted into the heat dissipation hole, the second contact portion faces towards one end of the component and is connected with the component, one end of the second contact portion that deviates from the component is connected with the first contact portion, and one end of the first contact portion that deviates from the second contact portion is connected with the heat dissipation plate.
Optionally, the cross-sectional area of the first contact portion is larger than that of the second contact portion, and a step surface is formed at a connection position of the first contact portion and the second contact portion, and abuts against a surface of the circuit board facing the heat dissipation plate.
Optionally, the heat dissipation holes are provided with a plurality of heat dissipation holes, the second contact portions are provided with a plurality of heat dissipation holes, the component covers the plurality of heat dissipation holes in the projection range of the circuit board, each second contact portion is inserted into one heat dissipation hole, and two ends of each second contact portion are respectively connected with the first contact portion and the component.
Optionally, the circuit board assembly further includes a first heat conduction layer disposed between the heat conduction member and the component, and the heat conduction member is connected to the component through the first heat conduction layer.
Optionally, the circuit board assembly further includes a second heat conduction layer disposed between the heat conduction member and the heat dissipation plate, and the heat conduction member is connected to the heat dissipation plate through the second heat conduction layer;
or, the heat conducting member and the heat dissipation plate are integrally formed.
Optionally, a bonding pad is arranged on one side surface of the component, which faces the circuit board, and faces the heat dissipation hole, and one end of the heat conduction member, which faces away from the heat dissipation plate, is connected with the bonding pad.
Optionally, the projection range of the pad on the circuit board covers the heat dissipation hole.
Optionally, a third heat conduction layer is arranged on the hole wall of the heat dissipation hole, and the third heat conduction layer is abutted to the outer side wall of the heat conduction piece.
The present invention also provides an electronic device comprising the circuit board assembly of any one of the preceding claims, the circuit board assembly comprising:
the circuit board is provided with a heat dissipation hole penetrating through the circuit board;
the component is fixed on one side of the circuit board, at least part of the component is positioned at the position of the heat dissipation hole, and the component is electrically connected with the circuit board;
the heat dissipation plate is arranged on one side, away from the component, of the circuit board and is arranged at an interval with the circuit board, and at least part of the heat dissipation plate is located at the position of the heat dissipation hole;
the heat conducting piece penetrates through the heat dissipation holes and is respectively connected with the component and the heat dissipation plate so as to transfer heat of the component to the heat dissipation plate.
According to the technical scheme, the heat dissipation plate is arranged on one side, away from the components, of the circuit board, and heat generated by the components is conducted to the heat dissipation plate through the heat conducting piece for heat dissipation, so that the utilization of a lower-temperature area on the side, away from the components, of the circuit board is realized, the heat is prevented from accumulating on the side, provided with the components, of the circuit board, and the heat dissipation efficiency of the components on the circuit board is improved; on the other hand, through the heat dissipation plate, the heat dissipation area of the component is increased, and the purpose of rapid heat dissipation is achieved. Meanwhile, according to the technical scheme, the circuit board with lower heat conduction performance is used for separating the heat dissipation plate from the components, mutual interference of heat dissipation processes on two sides of the circuit board is avoided, and the heat dissipation efficiency of the components on the circuit board is further improved.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic structural diagram of a circuit board assembly according to an embodiment of the present invention;
FIG. 2 is a schematic structural diagram of another embodiment of a circuit board assembly according to the present invention;
fig. 3 is a schematic structural diagram of a circuit board assembly according to another embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 10 | |
14 | |
| 11 | |
141 | |
| 111 | |
142 | |
| 12 | Component and |
15 | The first heat conducting |
| 13 | |
16 | The second heat conducting layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
The present invention provides a circuit board assembly 10 comprising:
the circuit board 11, the said circuit board 11 has heat dissipating holes 111 which link up the said circuit board 11;
the component 12 is fixed on one side of the circuit board 11, the component 12 is electrically connected with the circuit board 11, and at least part of the heat dissipation hole 111 is located in the projection range of the component 12 on the circuit board 11;
the heat dissipation plate 13 is arranged on one side, away from the component 12, of the circuit board 11, and the heat dissipation plate 13 is arranged at a distance from the circuit board 11;
and the heat conducting piece 14 is arranged through the heat dissipation hole 111, and is respectively connected with the component 12 and the heat dissipation plate 13 so as to transfer the heat of the component 12 to the heat dissipation plate 13.
The circuit board 11 is an important component in the electronic device, and is a support body of the component 12, and is also a carrier for electrical connection of the component 12, at least one component 12 is fixed on the circuit board 11, and in some embodiments, the components 12 of the circuit board 11 are arranged on the same side of the circuit board 11; however, since the area of the circuit board 11 is small, when more components 12 are disposed on one side of the circuit board 11, the components 12 generate heat to cause heat accumulation on the circuit board 11 and increase the temperature, thereby affecting the performance of the circuit board 11 and the components 12.
Referring to fig. 3, in some embodiments of the present invention, a first mounting surface is formed on one side of the circuit board 11, at least one component 12 is disposed on the first mounting surface, a through heat dissipation hole 111 is disposed at a position of the circuit board 11 corresponding to the component 12, and at least a portion of the heat dissipation hole 111 is located in a projection range of the component 12 on the circuit board 11, so that the circuit board 11 can dissipate heat to a side of the circuit board 11 away from the component 12 through the heat dissipation hole 111, thereby increasing heat dissipation efficiency of the component 12. Referring to fig. 2, the circuit board assembly 10 further includes a heat dissipation plate 13 and a heat conduction member 14, a second mounting surface is formed on a side of the circuit board 11 away from the first mounting surface, the heat dissipation plate 13 is disposed on the second mounting surface, the heat conduction member 14 is disposed through the heat dissipation hole 111, and the heat conduction member 14 is connected to the component 12 and the heat dissipation plate 13, respectively, so that heat generated by the component 12 is conducted to the heat dissipation plate 13 through the heat conduction member 14, and is dissipated through the heat dissipation plate 13; and the heat dissipation plate 13 enlarges the heat dissipation area of the component 12, and when the heat of the component 12 is transferred to the heat dissipation plate 13 through the heat conducting member 14, the heat is uniformly conducted and distributed on the heat dissipation surface of the heat dissipation plate 13, so as to accelerate the heat dissipation.
In the technical scheme of the invention, the component 12 and the heat dissipation plate 13 are respectively positioned at two sides of the circuit board 11 which are deviated from each other, and the heat dissipation plate 13 and the component 12 are separated by using the circuit board 11 with lower heat conductivity, so that mutual interference in the heat dissipation process at two sides of the circuit board 11 is avoided. Further, the heat dissipation plate 13 and the circuit board 11 are arranged at an interval, so that a heat dissipation space is formed between one side of the heat dissipation plate 13 facing the circuit board 11 and the circuit board 11, both side surfaces of the heat dissipation plate 13 can dissipate heat, and the heat dissipation efficiency is improved.
In some embodiments of the present invention, the heat dissipation plate 13 uses a metal material such as an aluminum alloy, copper, or the like, or a combination of metal materials, or uses a non-metal material such as graphene. In some embodiments, the heat dissipation plate 13 uses a material with good heat conductivity and good heat dissipation performance, for example, copper is used as a heat conductive material at a connection position where the heat dissipation plate 13 is connected to the heat conductive member 14, aluminum alloy is used as a heat dissipation material at other positions of the heat dissipation plate 13, heat is transferred to other positions of the heat dissipation plate by using the good heat conductivity of copper, and heat is dissipated by using the good heat dissipation performance of aluminum alloy, so that the heat dissipation plate 13 can dissipate heat quickly. Of course, the heat dissipation plate 13 may be made of a single material for heat dissipation.
According to the technical scheme, the heat dissipation plate 13 is arranged on one side, away from the component 12, of the circuit board 11, and heat generated by the component 12 is conducted to the heat dissipation plate 13 through the heat conducting piece 14 to dissipate heat, so that the utilization of a lower-temperature area on the side, away from the component 12, of the circuit board 11 is realized, heat accumulation on the side, provided with the component 12, of the circuit board 11 is also avoided, and the heat dissipation efficiency of the component 12 on the circuit board 11 is improved; on the other hand, the heat dissipation area of the component 12 is also increased by the heat dissipation plate 13, so that the purpose of rapid heat dissipation is achieved. Meanwhile, according to the technical scheme of the invention, the circuit board 11 with a lower heat conduction system is used for separating the heat dissipation plate 13 from the component 12, so that mutual interference in the heat dissipation process of two sides of the circuit board 11 is avoided, and the heat dissipation efficiency of the component 12 on the circuit board 11 is further improved.
Referring to fig. 2, in some embodiments of the invention, the heat conducting member 14 includes a first contact portion 141 and a second contact portion 142 connected to each other, the second contact portion 142 is inserted into the heat dissipation hole 111, the second contact portion 142 is connected to the component 12, the first contact portion 141 is located on a side of the circuit board 11 away from the component 12, a side of the second contact portion 142 away from the component 12 is connected to the first contact portion 141, and a side of the first contact portion 141 away from the second contact portion 142 is connected to the heat dissipation plate 13.
Referring to fig. 1, in some embodiments of the present invention, the heat dissipation plate 13 of the circuit board assembly 10 is disposed on a side of the circuit board 11 away from the component 12, and is spaced apart from the circuit board 11; the heat conducting member 14 is inserted into the heat dissipation hole 111 and connected to the component 12 and the heat dissipation plate 13 respectively; in the heat conducting member 14, the second contact portion 142 is convexly disposed on a side surface of the first contact portion 141 away from the heat dissipating plate 13, the second contact portion 142 is inserted into the heat dissipating hole 111, and a side of the second contact portion 142 away from the first contact portion 141 abuts against the component 12. Further, the cross-sectional area of the first contact portion 141 is larger than the cross-sectional area of the second contact portion 142, when the second contact portion 142 is connected to the first contact portion 141, a step surface is formed at a connection position of the first contact portion 141 and the second contact portion 142, and when the second contact portion 142 is inserted into the heat dissipation hole 111, the step surface abuts against a side surface of the circuit board 11 facing the heat dissipation plate 13. The first contact portion 141 provides a support for the heat dissipation plate 13 so that the heat dissipation plate 13 and the circuit board 11 are spaced apart; meanwhile, the step surface abuts against the surface of the circuit board 11 facing one side of the heat dissipation plate 13, so that the heat dissipation plate 13 is prevented from pressing the component 12 through the heat conduction member 14.
Referring to fig. 3, in some embodiments of the present invention, the circuit board 11 is provided with a plurality of heat dissipation holes 111, the heat conducting member 14 includes a plurality of second contact portions 142, a projection profile of the component 12 on the circuit board 11 covers the plurality of heat dissipation holes 111, the heat conducting member 14 is provided with a plurality of second contact portions 142, each second contact portion 142 is inserted into one heat dissipation hole 111, and two ends of each second contact portion 142 are respectively connected to the first contact portion 141 and the component 12; in this embodiment, a plurality of heat dissipation holes 111 and a plurality of second contact portions 142 are provided to improve the heat conduction efficiency between the component 12 and the heat dissipation plate 13.
Referring to fig. 1, in some embodiments of the invention, the circuit board assembly 10 further includes a first heat conducting layer 15 disposed between the heat conducting member 14 and the component 12, and the heat conducting member 14 is connected to the component 12 through the first heat conducting layer 15. In the technical scheme of the invention, the components 12 of the circuit board assembly 10 are communicated with a heat dissipation plate 13 through heat conducting pieces 14, and heat generated by the components 12 is transferred to the heat dissipation plate 13 through the heat conducting pieces 14 for heat dissipation; one end of the heat conducting piece 14, which is far away from the heat dissipation plate 13, is connected with the component 12, and due to the influence of surface roughness, the heat conducting piece 14 cannot be attached to the component 12 when being abutted, air is mixed in the heat conducting piece 14, and the heat conductivity coefficient of the air is very small, so that large thermal contact resistance is generated between the heat conducting piece 14 and the component 12; in order to avoid air inclusion between the heat conducting member 14 and the component 12, the first heat conducting layer 15 is used to connect the heat conducting member 14 and the component 12 to fill air gaps, reduce thermal contact resistance, and improve heat conducting performance. The first heat conduction layer 15 uses a thermal interface material to reduce the thermal contact resistance between the heat conduction member 14 and the component 12, thereby improving the heat conduction efficiency.
Referring to fig. 2, in some embodiments of the invention, the circuit board assembly 10 further includes a second heat conducting layer 16 disposed between the heat conducting member 14 and the heat dissipating plate 13, and the heat conducting member 14 is connected to the heat dissipating plate 13 through the second heat conducting layer 16. Specifically, the heat conducting member 14 and the heat dissipating plate 13 are provided with abutting surfaces which are arranged oppositely, and due to the influence of surface roughness, when the heat conducting member 14 abuts against the heat dissipating plate 13, the two abutting surfaces cannot be attached, air is trapped in the abutting surfaces, and the heat conductivity coefficient of the air is very small, so that large thermal contact resistance is generated between the heat conducting member 14 and the heat dissipating plate 13. In some embodiments, the second heat conduction layer 16 is used to connect the heat conduction member 14 and the heat dissipation plate 13, and the first heat conduction layer 15 is used to fill an air gap between an abutting surface of the heat conduction member 14 and an abutting surface of the heat dissipation plate 13, so as to reduce contact thermal resistance and improve heat conduction performance. The second heat conduction layer 16 uses a thermal interface material to reduce the contact thermal resistance between the heat conduction member 14 and the heat dissipation plate 13.
It should be noted that, referring to fig. 2, in some embodiments, the heat conducting member 14 and the heat dissipating plate 13 are of an integrated structure, so as to avoid an air gap between the heat conducting member 14 and the heat dissipating plate 13, which results in a large contact thermal resistance. The heat conducting member 14 and the heat dissipating plate 13 may be integrally formed by die casting, and of course, the heat conducting member 14 and the heat dissipating plate 13 may be connected by welding or the like.
In some embodiments of the present invention, a surface of the component 12 facing the circuit board 11 is provided with a pad, the pad is disposed facing the heat dissipation hole 111, and an end of the heat conducting element 14 facing away from the heat dissipation plate 13 is connected to the pad. The circuit board 11 is provided with heat dissipation holes 111 corresponding to the components 12, and at least a portion of the heat dissipation holes 111 are located in a projection range of the components 12 on the circuit board 11, so that the components 12 can transfer heat to the heat dissipation plate 13 through the heat dissipation holes 111. Specifically, the component 12 is provided with a pad, the pad is made of a material with good heat conductivity, such as copper or the like, and the component 12 is soldered on the circuit board 11 through the pad, so that the component 12 is electrically connected with the circuit board 11; furthermore, the heat dissipation holes 111 are disposed at the pad positions, the heat conducting member 14 passes through the heat dissipation holes 111 and abuts against the pad, and the heat generated by the component 12 is transferred from the pad to the heat conducting member 14 and then transferred to the heat dissipation plate 13 for heat dissipation.
Further, in some embodiments of the present invention, the projection range of the pad on the circuit board 11 covers the heat dissipation hole 111. Specifically, in the circuit board assembly 10, the heat conducting member 14 is disposed through the heat dissipation hole 111 and abuts against the pad, so as to conduct heat generated by the component 12 to the heat conducting member 14; the heat dissipation holes 111 are completely disposed in the projection area of the pad, so that the contact surface of the heat conducting member 14 completely abuts against the pad, thereby improving the heat conduction efficiency between the component 12 and the heat conducting member 14. Still further, in some embodiments, the heat dissipation hole 111 is disposed in the projection area of the pad, and the contour of the heat dissipation hole 111 is tangent to the projection contour of the pad, so as to maximize the contact area between the heat conducting member 14 and the pad and improve the heat conducting efficiency.
In some embodiments of the present invention, a third heat conduction layer is disposed on a hole wall of the heat dissipation hole 111, and when the heat conduction member 14 is inserted into the heat dissipation hole 111, an outer side wall of the heat conduction member 14 abuts against the third heat conduction layer. Specifically, in this embodiment, the heat conducting member 14 is inserted into the heat dissipating hole 111, and the outer sidewall of the heat conducting member 14 abuts against the hole wall of the heat dissipating hole 111; the hole wall of the heat dissipation hole 111 is provided with a third heat conduction layer, the third heat conduction layer uses metal materials such as copper and the like as the hole wall plating layer of the heat dissipation hole 111, the outer side wall of the heat conduction piece 14 is abutted to the third heat conduction layer, and the third heat conduction layer is used for assisting heat conduction so as to accelerate the heat conduction efficiency of the heat conduction piece 14.
The invention further provides an electronic device, wherein the circuit board assembly 10 in any one of the embodiments is applied to the electronic device, the electronic device further comprises a shell, the shell forms an accommodating space, the circuit board assembly 10 is accommodated in the accommodating space, and the heat dissipation plate 13 is arranged at intervals on the surface of one side, away from the circuit board 11, of the heat dissipation plate and the inner side wall of the shell to form a heat dissipation space.
Since the electronic device provided by the present application adopts all the technical solutions of all the embodiments in the circuit board assembly 10, at least all the beneficial effects brought by the technical solutions of the embodiments are achieved, and no further description is given here.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A circuit board assembly, comprising:
the circuit board is provided with a heat dissipation hole penetrating through the circuit board;
the component is fixed on one side of the circuit board, the component is electrically connected with the circuit board, and at least part of the heat dissipation holes are positioned in the projection range of the component on the circuit board;
the heat dissipation plate is arranged on one side, away from the component, of the circuit board and is arranged at an interval with the circuit board;
the heat conducting piece penetrates through the heat dissipation holes and is respectively connected with the component and the heat dissipation plate so as to transfer heat of the component to the heat dissipation plate.
2. The circuit board assembly according to claim 1, wherein the heat conducting member includes a first contact portion and a second contact portion connected to each other, the second contact portion is inserted into the heat dissipation hole, an end of the second contact portion facing the component is connected to the component, an end of the second contact portion facing away from the component is connected to the first contact portion, and an end of the first contact portion facing away from the second contact portion is connected to the heat dissipation plate.
3. The circuit board assembly according to claim 2, wherein a cross-sectional area of the first contact portion is larger than a cross-sectional area of the second contact portion, and a connection position of the first contact portion and the second contact portion forms a stepped surface abutting a surface of the circuit board facing the heat dissipation plate.
4. The circuit board assembly of claim 2, wherein the plurality of heat dissipation holes are formed, the plurality of second contact portions are formed, the component covers the plurality of heat dissipation holes in a projection range of the circuit board, each second contact portion is inserted into one heat dissipation hole, and two ends of each second contact portion are respectively connected to the first contact portion and the component.
5. The circuit board assembly of claim 1, further comprising a first thermally conductive layer disposed between the thermal conductive member and the component, the thermal conductive member being coupled to the component through the first thermally conductive layer.
6. The circuit board assembly of claim 1, further comprising a second thermally conductive layer disposed between the thermal conductive member and the heat sink, the thermal conductive member being connected to the heat sink through the second thermally conductive layer;
or, the heat conducting member and the heat dissipation plate are integrally formed.
7. The circuit board assembly according to claim 1, wherein a surface of the component facing the circuit board is provided with a pad facing the heat dissipation hole, and an end of the heat conducting member facing away from the heat dissipation plate is connected to the pad.
8. The circuit board assembly of claim 7, wherein a projection of the solder pad on the circuit board covers the thermal via.
9. The circuit board assembly of claim 1, wherein the hole wall of the heat dissipation hole is provided with a third heat conduction layer, and the third heat conduction layer is abutted against the outer side wall of the heat conduction member.
10. An electronic device comprising a circuit board assembly as claimed in any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010741214.XA CN111935898A (en) | 2020-07-27 | 2020-07-27 | Circuit board assembly and electronic device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010741214.XA CN111935898A (en) | 2020-07-27 | 2020-07-27 | Circuit board assembly and electronic device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN111935898A true CN111935898A (en) | 2020-11-13 |
Family
ID=73315525
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010741214.XA Pending CN111935898A (en) | 2020-07-27 | 2020-07-27 | Circuit board assembly and electronic device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111935898A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113301717A (en) * | 2021-05-21 | 2021-08-24 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| CN114688510A (en) * | 2022-03-30 | 2022-07-01 | 深圳市中孚能电气设备有限公司 | LED connection structure and lamp holder subassembly |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105939568A (en) * | 2016-06-26 | 2016-09-14 | 合肥仁德电子科技有限公司 | Method for improving heat conductive capacity of printed board of surface mounting device |
| CN108293293A (en) * | 2015-11-30 | 2018-07-17 | 日本精工株式会社 | Heat-radiating substrate and electric power-assisted steering apparatus |
| EP3358917A1 (en) * | 2017-02-07 | 2018-08-08 | Siemens Aktiengesellschaft | Printed circuit board with a cooling function |
| KR102093893B1 (en) * | 2017-06-08 | 2020-03-26 | 한온시스템 주식회사 | High current circuit board |
-
2020
- 2020-07-27 CN CN202010741214.XA patent/CN111935898A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108293293A (en) * | 2015-11-30 | 2018-07-17 | 日本精工株式会社 | Heat-radiating substrate and electric power-assisted steering apparatus |
| CN105939568A (en) * | 2016-06-26 | 2016-09-14 | 合肥仁德电子科技有限公司 | Method for improving heat conductive capacity of printed board of surface mounting device |
| EP3358917A1 (en) * | 2017-02-07 | 2018-08-08 | Siemens Aktiengesellschaft | Printed circuit board with a cooling function |
| KR102093893B1 (en) * | 2017-06-08 | 2020-03-26 | 한온시스템 주식회사 | High current circuit board |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113301717A (en) * | 2021-05-21 | 2021-08-24 | 维沃移动通信有限公司 | Circuit board structure and electronic equipment |
| WO2022242670A1 (en) * | 2021-05-21 | 2022-11-24 | 维沃移动通信有限公司 | Circuit board structure and electronic apparatus |
| CN114688510A (en) * | 2022-03-30 | 2022-07-01 | 深圳市中孚能电气设备有限公司 | LED connection structure and lamp holder subassembly |
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Application publication date: 20201113 |