CN111935898A - Circuit Board Assemblies and Electronics - Google Patents

Abstract

The invention provides a circuit board assembly and an electronic network device using the circuit board assembly. The circuit board assembly includes: a circuit board, the circuit board is provided with a heat dissipation hole penetrating the circuit board; components, the The components are fixed on one side of the circuit board, the components are electrically connected to the circuit board, and the heat dissipation holes are at least partially located within the projection range of the components on the circuit board; The heat dissipation plate is arranged on the side of the circuit board away from the components, and is spaced apart from the circuit board; the heat-conducting member, the heat-conducting member passes through the heat-dissipating holes, and is respectively connected with the components and the circuit board. The heat dissipation plate is connected to transfer the heat of the component to the heat dissipation plate. The technical scheme of the present invention aims to improve the heat dissipation efficiency of the components on the circuit board.

Description

Circuit Board Assemblies and Electronics

technical field

The present invention relates to the technical field of circuit boards, in particular to a circuit board assembly and an electronic device using the circuit board assembly.

Background technique

In electronic equipment, most of the components are equipped with circuit boards, and most of the components on the circuit board are located on the same side of the circuit board.

SUMMARY OF THE INVENTION

The main purpose of the present invention is to provide a circuit board assembly, which aims to improve the heat dissipation efficiency of the components on the circuit board.

In order to achieve the above purpose, a circuit board assembly proposed by the present invention includes:

a circuit board, wherein the circuit board is provided with a heat dissipation hole penetrating the circuit board;

a component, the component is fixed on one side of the circuit board, the component is electrically connected to the circuit board, and the heat dissipation hole is at least partially located within the projection range of the component on the circuit board ;

a heat-dissipating plate, the heat-dissipating plate is arranged on the side of the circuit board away from the component, and is arranged spaced apart from the circuit board;

and a heat-conducting member, which penetrates through the heat-dissipating hole and is respectively connected with the component and the heat-dissipating plate, so as to transfer the heat of the component to the heat-dissipating plate.

Optionally, the thermally conductive member includes a first contact portion and a second contact portion that are connected to each other, the second contact portion is inserted into the heat dissipation hole, and the second contact portion faces one end of the component connected to the component, the end of the second contact portion facing away from the component is connected to the first contact portion, and the end of the first contact portion facing away from the second contact portion is connected to the heat sink .

Optionally, the cross-sectional area of the first contact portion is larger than the cross-sectional area of the second contact portion, the connection position of the first contact portion and the second contact portion forms a stepped surface, and the stepped surface abutting against the surface of the circuit board facing the heat dissipation plate.

Optionally, a plurality of the heat dissipation holes are provided, a plurality of the second contact portions are provided, and the projection range of the components on the circuit board covers a plurality of the heat dissipation holes, and each of the second contact portions is inserted into the plurality of heat dissipation holes. Set in one of the heat dissipation holes, two ends of each of the second contact portions are respectively connected with the first contact portion and the component.

Optionally, the circuit board assembly further includes a first heat conducting layer disposed between the heat conducting member and the component, and the heat conducting member is connected to the component through the first heat conducting layer.

Optionally, the circuit board assembly further includes a second heat conduction layer disposed between the heat conduction member and the heat dissipation plate, and the heat conduction member is connected to the heat dissipation plate through the second heat conduction layer;

Or, the heat conducting member and the heat dissipation plate are integrally formed.

Optionally, a side surface of the component facing the circuit board is provided with a pad, the pad is arranged towards the heat dissipation hole, and the end of the heat conducting member facing away from the heat dissipation plate is connected to the pad .

Optionally, the projection range of the pad on the circuit board covers the heat dissipation hole.

Optionally, the hole wall of the heat dissipation hole is provided with a third heat-conducting layer, and the third heat-conducting layer abuts the outer side wall of the heat-conducting member.

The present invention also provides an electronic device, comprising the circuit board assembly described in any one of the foregoing, the circuit board assembly comprising:

a circuit board, wherein the circuit board is provided with a heat dissipation hole penetrating the circuit board;

a component, the component is fixed on one side of the circuit board, and at least part of the component is located at the position of the heat dissipation hole, and the component is electrically connected to the circuit board;

a heat-dissipating plate, the heat-dissipating plate is arranged on the side of the circuit board away from the component, and is spaced from the circuit board, and at least part of the heat-dissipating plate is located at the position of the heat-dissipating hole;

and a heat-conducting member, which penetrates through the heat-dissipating hole and is respectively connected with the component and the heat-dissipating plate, so as to transfer the heat of the component to the heat-dissipating plate.

In the technical scheme of the present invention, the heat dissipation plate is placed on the side of the circuit board away from the components, and the heat generated by the components is conducted to the heat dissipation plate through the heat-conducting member for heat dissipation, so as to realize the comparison of the side of the circuit board away from the components. The use of the low temperature area also avoids the accumulation of heat on the side of the circuit board where the components are installed, thereby improving the heat dissipation efficiency of the components on the circuit board; The heat dissipation area of the components achieves the purpose of rapid heat dissipation. At the same time, the technical solution of the present invention uses a circuit board with low thermal conductivity to separate the heat dissipation plate from the components, and also avoids the mutual interference of the heat dissipation process on both sides of the circuit board, and further improves the components on the circuit board. heat dissipation efficiency of the device.

Description of drawings

In order to explain the embodiments of the present invention or the technical solutions in the prior art more clearly, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only These are some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained according to the structures shown in these drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of a circuit board assembly of the present invention;

FIG. 2 is a schematic structural diagram of another embodiment of the circuit board assembly of the present invention;

FIG. 3 is a schematic structural diagram of another embodiment of the circuit board assembly of the present invention.

Description of reference numbers:

label name label name 10 circuit board assembly 14 Thermal parts 11 circuit board 141 first contact 111 Vents 142 second contact 12 Components 15 first thermally conductive layer 13 Radiating plate 16 second thermally conductive layer

The realization, functional characteristics and advantages of the present invention will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

It should be noted that all directional indications (such as up, down, left, right, front, back, etc.) in the embodiments of the present invention are only used to explain the relationship between various components under a certain posture (as shown in the accompanying drawings). The relative positional relationship, the movement situation, etc., if the specific posture changes, the directional indication also changes accordingly.

In the present invention, unless otherwise expressly specified and limited, the terms "connected", "fixed" and the like should be understood in a broad sense, for example, "fixed" may be a fixed connection, a detachable connection, or an integrated; It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be an internal communication between two elements or an interaction relationship between the two elements, unless otherwise explicitly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In addition, descriptions such as "first", "second", etc. in the present invention are only for descriptive purposes, and should not be construed as indicating or implying their relative importance or implicitly indicating the number of indicated technical features. Thus, a feature delimited with "first", "second" may expressly or implicitly include at least one of that feature. In addition, the technical solutions between the various embodiments can be combined with each other, but must be based on the realization by those of ordinary skill in the art. When the combination of technical solutions is contradictory or cannot be realized, it should be considered that the combination of such technical solutions does not exist. , is not within the scope of protection required by the present invention.

The present invention provides a circuit board assembly 10, comprising:

a circuit board 11, the circuit board 11 is provided with a heat dissipation hole 111 penetrating the circuit board 11;

Component 12, the component 12 is fixed on one side of the circuit board 11, the component 12 is electrically connected to the circuit board 11, and the heat dissipation hole 111 is at least partially located where the component 12 is located within the projection range of the circuit board 11;

a heat dissipation plate 13, the heat dissipation plate 13 is disposed on the side of the circuit board 11 away from the components 12, and is spaced from the circuit board 11;

The heat-conducting member 14 is inserted through the heat-dissipating hole 111 and connected to the component 12 and the heat-dissipating plate 13 respectively, so as to transfer the heat of the component 12 to the heat-dissipating plate 13 .

The circuit board 11 is an important part in the electronic device, it is the support body of the component 12, and it is also the carrier for the electrical connection of the component 12. At least one component 12 is fixed on the circuit board 11. In some embodiments, the circuit The components 12 of the board 11 are arranged on the same side of the circuit board 11; however, due to the small area of the circuit board 11, when there are many components 12 on one side of the circuit board 11, many components 12 heat up, resulting in the heat of the circuit board 11 Accumulation, the temperature rises, thereby affecting the performance of the circuit board 11 and the components 12 .

Referring to FIG. 3, in some embodiments of the present invention, a first mounting surface is formed on the upper side of the circuit board 11, at least one component 12 is disposed on the first mounting surface, and the circuit board 11 corresponds to the component The device 12 is provided with a heat dissipation hole 111 penetrating through it, and the heat dissipation hole 111 is at least partially located within the projection range of the component 12 on the circuit board 11 , so that the circuit board 11 can pass through the heat dissipation hole 111 . The heat is dissipated to the side of the circuit board 11 away from the component 12 , so as to speed up the heat dissipation efficiency of the component 12 . Referring further to FIG. 2 , the circuit board assembly 10 further includes a heat dissipation plate 13 and a heat conducting member 14 , the side of the circuit board 11 facing away from the first mounting surface forms a second mounting surface, and the heat dissipation plate 13 is provided on the On the second mounting surface, the heat-conducting member 14 passes through the heat-dissipating hole 111 , and the heat-conducting member 14 is connected to the component 12 and the heat-dissipating plate 13 respectively, so that the component 12 generates The heat is conducted by the heat-conducting member 14 to the heat-dissipating plate 13 and dissipated through the heat-dissipating plate 13; and the heat-dissipating plate 13 increases the heat-dissipating area of the components 12, when the heat of the components 12 is dissipated When transferred to the heat dissipation plate 13 through the heat conducting member 14 , the heat is uniformly conducted and distributed on the heat dissipation surface of the heat dissipation plate 13 to accelerate heat dissipation.

In the technical solution of the present invention, the components 12 and the heat dissipation plate 13 are respectively located on two sides of the circuit board 11 away from each other, and the heat dissipation plate 13 and the components 12 are separated by the circuit board 11 with low thermal conductivity. , thereby avoiding mutual interference in the heat dissipation process on both sides of the circuit board 11 . Further, the heat dissipation plate 13 is spaced apart from the circuit board 11, so that a heat dissipation space is formed between the side of the heat dissipation plate 13 facing the circuit board 11 and the circuit board 11, so that the heat dissipation plate Both sides of the 13 can dissipate heat to speed up the heat dissipation efficiency.

In some embodiments of the present invention, the heat dissipation plate 13 uses metal materials such as aluminum alloy, copper, etc., or a combination of various metal materials, or uses non-metal materials such as graphene. In some embodiments, the heat dissipation plate 13 uses materials with good thermal conductivity and heat dissipation performance at the same time. For example, copper is used as the heat conductive material at the connection position where the heat dissipation plate 13 is connected to the heat conducting member 14, and the heat dissipation Other parts of the plate 13 use aluminum alloy as the heat dissipation material, use the excellent thermal conductivity of copper to transfer heat to other positions of the heat sink, and use the excellent heat dissipation performance of aluminum alloy to dissipate the heat, so that the heat dissipation plate 13 can quickly dissipate heat. Of course, the heat dissipation plate 13 can also achieve the purpose of heat dissipation by using only one material.

In the technical solution of the present invention, the heat dissipation plate 13 is placed on the side of the circuit board 11 away from the components 12 , and the heat generated by the components 12 is conducted to the heat dissipation plate 13 through the heat conducting member 14 for heat dissipation, so that the circuit board 11 is dissipated. The utilization of the lower temperature area on the side away from the components 12 also avoids the accumulation of heat on the side of the circuit board 11 where the components 12 are installed, thereby improving the heat dissipation efficiency of the components 12 on the circuit board 11; On the one hand, the heat dissipation plate 13 also increases the heat dissipation area of the component 12 and achieves the purpose of rapid heat dissipation. At the same time, the technical solution of the present invention uses the circuit board 11 with a lower heat conduction system to separate the heat dissipation plate 13 and the components 12, and also avoids the mutual interference of the heat dissipation process on both sides of the circuit board 11, and further improves the circuit The heat dissipation efficiency of the components 12 on the board 11 .

Referring to FIG. 2 , in some embodiments of the present invention, the thermally conductive member 14 includes a first contact portion 141 and a second contact portion 142 connected to each other, and the second contact portion 142 is inserted into the heat dissipation hole 111 , the second contact portion 142 is connected to the component 12, the first contact portion 141 is located on the side of the circuit board 11 away from the component 12, and the second contact portion 142 is away from the component One side of the device 12 is connected to the first contact portion 141 , and a side of the first contact portion 141 away from the second contact portion 142 is connected to the heat dissipation plate 13 .

Referring to FIG. 1 , in some embodiments of the present invention, the heat sink 13 of the circuit board assembly 10 is disposed on the side of the circuit board 11 away from the component 12 and is spaced from the circuit board 11 ; The components 14 are penetrated through the heat dissipation holes 111 and are respectively connected to the components 12 and the heat dissipation plate 13 ; in the thermal conductive components 14 , the second contact portion 142 is protruded from the first contact portion 141 away from On one side surface of the heat dissipation plate 13, the second contact portion 142 is inserted into the heat dissipation hole 111, and the side of the second contact portion 142 away from the first contact portion 141 abuts against the element device 12 . Further, the cross-sectional area of the first contact portion 141 is larger than the cross-sectional area of the second contact portion 142 . When the second contact portion 142 is connected to the first contact portion 141 , the first contact portion The connecting position of the second contact portion 141 and the second contact portion 142 forms a stepped surface. When the second contact portion 142 is inserted into the heat dissipation hole 111 , the stepped surface abuts the circuit board 11 and faces the heat dissipation plate 13 . side surface. The first contact portion 141 provides support for the heat dissipation plate 13 so that the heat dissipation plate 13 and the circuit board 11 are spaced apart; at the same time, the stepped surface abuts on the circuit board 11 toward the heat dissipation The surface of one side of the plate 13 prevents the heat dissipation plate 13 from pressing the component 12 through the heat conducting member 14 .

Referring to FIG. 3 , in some embodiments of the present invention, the circuit board 11 is provided with a plurality of the heat dissipation holes 111 , the thermally conductive member 14 includes a plurality of the second contact portions 142 , and the component 12 is located in the The projected contour on the circuit board 11 covers a plurality of the heat dissipation holes 111 , and the thermally conductive member 14 is provided with a plurality of second contact portions 142 , and each of the second contact portions 142 is inserted into one of the heat dissipation holes 111 . , and the two ends of each second contact portion 142 are respectively connected with the first contact portion 141 and the component 12; The thermal conductivity between the components 12 and the heat dissipation plate 13 is improved.

Referring to FIG. 1 , in some embodiments of the present invention, the circuit board assembly 10 further includes a first thermally conductive layer 15 disposed between the thermally conductive member 14 and the component 12 , and the thermally conductive member 14 passes through the first thermally conductive layer 15 . The first thermal conductive layer 15 is connected to the component 12 . In the technical solution of the present invention, the components 12 of the circuit board assembly 10 are communicated with the heat dissipation plate 13 through the heat-conducting member 14 , and the heat generated by the components 12 is transferred to the heat-dissipating plate 13 through the heat-conducting member 14 for heat dissipation. ; The end of the heat-conducting member 14 away from the heat-dissipating plate 13 is connected with the component 12. Due to the influence of surface roughness, the heat-conducting member 14 cannot be attached when it is in contact with the component 12, and there will be air Inclusion in it, and the thermal conductivity of air is very small, resulting in a large contact thermal resistance between the thermally conductive member 14 and the component 12; in order to avoid inclusion between the thermally conductive member 14 and the component 12 Air, using the first heat-conducting layer 15 to connect the heat-conducting member 14 and the component 12 to fill the air gap, reduce the contact thermal resistance, and improve the heat-conducting performance. The first thermal conductive layer 15 uses a thermal interface material to reduce the contact thermal resistance between the thermal conductive member 14 and the component 12 and improve thermal conductivity.

Referring to FIG. 2 , in some embodiments of the present invention, the circuit board assembly 10 further includes a second thermally conductive layer 16 disposed between the thermally conductive member 14 and the heat dissipation plate 13 , the thermally conductive member 14 It is connected to the heat dissipation plate 13 through the second heat conducting layer 16 . Specifically, the heat-conducting member 14 and the heat-dissipating plate 13 are provided with opposing abutting surfaces. Due to the influence of surface roughness, when the heat-conducting member 14 abuts the heat-dissipating plate 13, the two abutting surfaces If it cannot be fitted, air will be mixed in it, and the thermal conductivity of air is very small, resulting in a large contact thermal resistance between the thermally conductive member 14 and the heat dissipation plate 13 . In some embodiments, the second thermal conductive layer 16 is used to connect the thermal conductive member 14 and the heat dissipation plate 13 , and the first thermal conductive layer 15 is used to fill the contact surface of the thermal conductive member 14 and the heat dissipation plate 13 . The air gap between the abutting surfaces of the heat dissipation plate 13 can reduce the contact thermal resistance and improve the thermal conductivity. The second thermal conductive layer 16 uses a thermal interface material to reduce the contact thermal resistance between the thermal conductive member 14 and the heat dissipation plate 13 .

It should be noted that, referring to FIG. 2 , in some embodiments, the thermally conductive member 14 and the heat dissipation plate 13 are integrally formed to avoid an air gap between the thermally conductive member 14 and the heat dissipation plate 13 , resulting in a larger contact thermal resistance. The heat-conducting member 14 may be integrally die-cast with the heat-dissipating plate 13 . Of course, the heat-conducting member 14 and the heat-dissipating plate 13 may also be connected by welding or the like.

In some embodiments of the present invention, a side surface of the component 12 facing the circuit board 11 is provided with pads, the pads are arranged towards the heat dissipation holes 111 , and the heat conducting member 14 is away from the heat dissipation One end of the board 13 is connected to the pad. The circuit board 11 is provided with heat dissipation holes 111 corresponding to the positions of the components 12 , and at least part of the heat dissipation holes 111 are located within the projection range of the components 12 on the circuit board 11 , so that the components 12 can pass through. The heat dissipation holes 111 transfer heat to the heat dissipation plate 13 . Specifically, the components 12 are provided with pads, and the pads are made of materials with good thermal conductivity such as copper or the like, and the components 12 are welded to the circuit board 11 through the pads. , so that the components 12 and the circuit board 11 are electrically connected; furthermore, the heat dissipation holes 111 are arranged at the positions of the pads, and the heat conducting members 14 pass through the heat dissipation holes 111 and are connected to the soldering pads. When the disks are in contact with each other, the heat generated by the components 12 is transferred from the pads to the heat-conducting member 14 , and then transferred to the heat-dissipating plate 13 for heat dissipation.

Further, in some embodiments of the present invention, the projection range of the pad on the circuit board 11 covers the heat dissipation hole 111 . Specifically, in the circuit board assembly 10 , the heat-conducting member 14 passes through the heat dissipation hole 111 and abuts with the pad, so as to conduct the heat generated by the component 12 to the heat-conducting member 14; The heat dissipation hole 111 is completely placed in the projection area of the pad, so that the contact surface of the thermally conductive member 14 completely abuts on the pad, thereby increasing the distance between the component 12 and the thermally conductive member 14. thermal conductivity between. Still further, in some embodiments, the heat dissipation hole 111 is placed in the projection area of the pad, and the outline of the heat dissipation hole 111 is tangent to the projection outline of the pad, so as to maximize the size of the heat dissipation hole 111 . The contact area between the heat-conducting member 14 and the pad can improve the heat-conducting efficiency.

In some embodiments of the present invention, the hole wall of the heat dissipation hole 111 is provided with a third heat conduction layer, and when the heat conduction member 14 is inserted into the heat dissipation hole 111 , the outer wall of the heat conduction member 14 and the The third thermally conductive layer abuts. Specifically, in this embodiment, the heat-conducting member 14 is inserted into the heat-dissipating hole 111 , and the outer side wall of the heat-conducting member 14 is in contact with the hole wall of the heat-dissipating hole 111 ; The hole wall is provided with a third heat-conducting layer. The third heat-conducting layer mostly uses metal materials such as copper as the hole-wall plating layer of the heat-dissipating hole 111. The outer side wall of the heat-conducting member 14 is in contact with the third heat-conducting layer. The third heat-conducting layer is used to assist heat-conducting, so as to speed up the heat-conducting efficiency of the heat-conducting member 14 .

The present invention also provides an electronic device to which the circuit board assembly 10 in any of the foregoing embodiments is applied, and the electronic device further includes a housing, the housing forms an accommodating space, and the circuit The board assembly 10 is accommodated in the accommodating space, and the surface of the heat dissipation plate 13 facing away from the circuit board 11 and the inner sidewall of the casing are spaced apart to form a heat dissipation space.

Since the electronic device proposed in the present application adopts all the technical solutions of all the embodiments of the circuit board assembly 10, it has at least all the beneficial effects brought by the technical solutions of the above-mentioned embodiments, which will not be repeated here.

The above descriptions are only the preferred embodiments of the present invention, and are not intended to limit the scope of the present invention. Under the inventive concept of the present invention, the equivalent structural transformations made by the contents of the description and drawings of the present invention, or the direct/indirect application Other related technical fields are included in the scope of patent protection of the present invention.

Claims (10)

1. A circuit board assembly, comprising:

the circuit board is provided with a heat dissipation hole penetrating through the circuit board;

the component is fixed on one side of the circuit board, the component is electrically connected with the circuit board, and at least part of the heat dissipation holes are positioned in the projection range of the component on the circuit board;

the heat dissipation plate is arranged on one side, away from the component, of the circuit board and is arranged at an interval with the circuit board;

the heat conducting piece penetrates through the heat dissipation holes and is respectively connected with the component and the heat dissipation plate so as to transfer heat of the component to the heat dissipation plate.

2. The circuit board assembly according to claim 1, wherein the heat conducting member includes a first contact portion and a second contact portion connected to each other, the second contact portion is inserted into the heat dissipation hole, an end of the second contact portion facing the component is connected to the component, an end of the second contact portion facing away from the component is connected to the first contact portion, and an end of the first contact portion facing away from the second contact portion is connected to the heat dissipation plate.

3. The circuit board assembly according to claim 2, wherein a cross-sectional area of the first contact portion is larger than a cross-sectional area of the second contact portion, and a connection position of the first contact portion and the second contact portion forms a stepped surface abutting a surface of the circuit board facing the heat dissipation plate.

4. The circuit board assembly of claim 2, wherein the plurality of heat dissipation holes are formed, the plurality of second contact portions are formed, the component covers the plurality of heat dissipation holes in a projection range of the circuit board, each second contact portion is inserted into one heat dissipation hole, and two ends of each second contact portion are respectively connected to the first contact portion and the component.

5. The circuit board assembly of claim 1, further comprising a first thermally conductive layer disposed between the thermal conductive member and the component, the thermal conductive member being coupled to the component through the first thermally conductive layer.

6. The circuit board assembly of claim 1, further comprising a second thermally conductive layer disposed between the thermal conductive member and the heat sink, the thermal conductive member being connected to the heat sink through the second thermally conductive layer;

or, the heat conducting member and the heat dissipation plate are integrally formed.

7. The circuit board assembly according to claim 1, wherein a surface of the component facing the circuit board is provided with a pad facing the heat dissipation hole, and an end of the heat conducting member facing away from the heat dissipation plate is connected to the pad.

8. The circuit board assembly of claim 7, wherein a projection of the solder pad on the circuit board covers the thermal via.

9. The circuit board assembly of claim 1, wherein the hole wall of the heat dissipation hole is provided with a third heat conduction layer, and the third heat conduction layer is abutted against the outer side wall of the heat conduction member.

10. An electronic device comprising a circuit board assembly as claimed in any one of claims 1 to 9.

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