CN114688510A

CN114688510A - LED connection structure and lamp holder subassembly

Info

Publication number: CN114688510A
Application number: CN202210326649.7A
Authority: CN
Inventors: 丁柏平; 杨锋; 黄阳彪; 宋林静; 殷佩璇; 贾自燕; 田敏
Original assignee: Shenzhen Zhongfuneng Electric Equipment Co Ltd
Current assignee: Shenzhen Zhongfuneng Electric Equipment Co Ltd
Priority date: 2022-03-30
Filing date: 2022-03-30
Publication date: 2022-07-01

Abstract

The invention belongs to the field of lighting technical equipment, and particularly relates to an LED (light emitting diode) connecting structure and a lamp cap assembly. The LED connection structure includes: the heat dissipation plate and the circuit board are arranged in a stacked mode and completely cover an orifice at one end of the heat conduction hole; the lamp pearl is located the other end of heat conduction hole and with the heating panel butt, and can conduct heat towards the heating panel. The invention can improve the heat dissipation efficiency and is beneficial to prolonging the service life of the LED connecting structure.

Description

LED connection structure and lamp holder subassembly

Technical Field

The invention belongs to the field of lighting technical equipment, and particularly relates to an LED (light emitting diode) connecting structure and a lamp cap assembly.

Background

An led (light Emitting diode), which is a solid semiconductor device capable of converting electrical energy into visible light, can directly convert electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin. The semiconductor wafer is composed of two parts, one of which is a P-type semiconductor in which holes are dominant and the other of which is an N-type semiconductor. When the two semiconductors are connected, a P-N junction is formed between them. When current is applied to the wafer through the wire, electrons are pushed to the P region where they recombine with holes and then emit energy in the form of photons, which is the principle of LED lamp illumination. The wavelength of the light, i.e., the color of the light, is determined by the material forming the P-N junction.

At present, in an assembly with an LED lamp, when the LED lamp emits light, a plurality of LED chips therein generate extremely high heat, and the heat is accumulated near the LED lamp, if the heat cannot be effectively conducted out, the LED chips will be damaged or the life will be reduced, which affects the normal light emitting operation, and the circuit board may be burned down to cause a fire accident.

Therefore, it is desirable to provide a new LED connection structure solution to solve the above problems.

Disclosure of Invention

An object of the embodiment of the application is to provide an LED connection structure, which aims to solve the problem of how to improve the heat dissipation efficiency and prolong the service life of the LED connection structure.

In order to achieve the purpose, the technical scheme adopted by the application is as follows:

in a first aspect, an LED connection structure is provided, which includes: the LED lamp comprises a circuit board, lamp beads electrically connected with the circuit board and a heat dissipation plate made of heat conduction materials, wherein heat conduction holes are formed in positions, connected with the lamp beads, of the circuit board, two ends of each heat conduction hole are respectively communicated to the plate surfaces on two sides of the circuit board, and the heat dissipation plate and the circuit board are arranged in a stacked mode and completely cover an orifice at one end of each heat conduction hole; the lamp bead is located the other end of heat conduction hole and with the heating panel butt, and can towards the heating panel heat conduction heat.

In some embodiments, the shape of the heat conduction hole is matched with the shape of the lamp bead, and the lamp bead is at least partially accommodated in the heat conduction hole.

In some embodiments, the LED connection structure further includes a heat conduction block partially accommodated in the heat conduction hole, one end of the heat conduction block is connected to the heat dissipation plate, the other end of the heat conduction block abuts against the lamp bead, and the heat conduction block can conduct heat of the lamp bead to the heat dissipation plate.

In some embodiments, the heat conducting block is provided with a heat conducting surface abutted against the lamp bead, the lamp bead is provided with a heat radiating surface abutted against the heat conducting surface, and the projection of the heat conducting surface on the heat radiating surface is located in the range determined by the heat radiating surface or is coincided with the range determined by the heat radiating surface.

In some embodiments, the end surface of the heat conduction block abutted to the lamp bead is flush with the surface of the circuit board facing the lamp bead.

In some embodiments, the peripheral side surface of the heat conduction block abuts against the hole wall of the heat conduction hole, or the peripheral side surface of the heat conduction block is spaced from the hole wall of the heat conduction hole.

In some embodiments, the circuit board further defines a through hole, and the through hole is spaced apart from the heat conduction hole.

In some embodiments, the LED connecting structure further includes a heat dissipating protrusion, one end of the heat dissipating protrusion is connected to the heat dissipating plate, and the other end of the heat dissipating protrusion is received in the through hole.

In some embodiments, the LED connection structure further comprises a first insulating coating located between the heat conducting block and the lamp bead; and/or the LED connecting structure further comprises a second insulating coating, and the second insulating coating is positioned between the circuit board and the heat dissipation plate.

In a second aspect, another object of the present application is to provide a lamp holder assembly, which includes the LED connection structure, the lamp holder assembly further includes a lamp holder shell having a light-emitting cavity, a light-reflecting cup disposed in the light-emitting cavity, and a lamp cap cover connected to the lamp holder shell, the light-emitting cavity has a light-emitting opening, the lamp cap cover is disposed in the light-emitting opening, the LED connection structure is received in the light-emitting cavity, and at least part of the lamp bead is received in the light-reflecting cup.

The beneficial effect of this application lies in: through seting up the heat conduction hole on the circuit board, the one end of lamp pearl is through heat conduction hole and butt heating panel to the heat that the lamp pearl produced can direct conduction to heating panel, and be face-to-face contact between circuit board and the heating panel, has improved heat radiating area, thereby can improve the radiating efficiency, is favorable to prolonging LED connection structure's life.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.

Fig. 1 is a schematic structural diagram of an LED connection structure according to an embodiment of the present application;

FIG. 2 is an exploded schematic view of the LED connection structure of FIG. 1;

FIG. 3 is a schematic structural diagram of an LED connection structure according to still another embodiment of the present application;

FIG. 4 is a schematic structural diagram of an LED connection structure according to another embodiment of the present application;

FIG. 5 is a schematic structural diagram of an LED connection structure according to another embodiment of the present application;

FIG. 6 is a schematic structural diagram of an LED connection structure according to another embodiment of the present application;

fig. 7 is a schematic structural diagram of a lamp head assembly according to an embodiment of the present application.

Wherein, in the figures, the respective reference numerals:

100. an LED connection structure; 10. a lamp bead; 11. a first insulating coating; 20. a circuit board; 30. a heat dissipation plate; 12. a second insulating coating; 111. a heat dissipating surface; 21. a heat conduction hole; 311. a heat conducting surface; 31. a heat conducting block; 112. a pin; 22. a through hole; 33. a heat dissipation projection; 200. a lamp head assembly; 41. a lamp cap cover; 42. a light reflecting cup; 43. a heat sink; 44. a lamp cap shell; 45. a light emitting cavity.

Detailed Description

In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the present application and are not intended to limit the present application.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.

Referring to fig. 1 to 3, an embodiment of the present application provides an LED connection structure 100, which includes: the lamp comprises a circuit board 20, a lamp bead 10 electrically connected with the circuit board 20 and a heat dissipation plate 30 made of heat conduction materials. Optionally, the Circuit Board 20 is a PCB Board, Printed Circuit Board. The PCB is a circuit board 20 manufactured by electronic printing, is an important electronic component, is a support for electronic components, and is a carrier for electrical interconnection of electronic components. The circuit board 20 is used for bearing the lamp bead 10 and providing a cloth space for other electronic elements, so that the complete function of the lamp bead 10 is ensured; the lamp bead 10 is electrically connected to the circuit board 20, and after the circuit board 20 is connected to the power supply, the circuit board 20 can supply power to the lamp bead 10. Optionally, the lamp bead 10 is an LED lamp bead 10, and the LED lamp bead 10 has the characteristics of good stability, low energy consumption, high cost performance, and the like. The LED lamp bead 10 includes a plurality of chips that can generate light in a conductive state, and the chips generate a large amount of heat while emitting light. Optionally, the heat dissipation plate 30 is used to assist heat dissipation of the lamp bead 10, and the heat dissipation plate 30 may be made of a material with excellent heat conduction and heat dissipation performance, such as metal copper or metal aluminum. In this embodiment, the heat dissipation plate 30 is a copper foil, which has excellent heat conductivity and heat dissipation, and is resistant to high temperature and corrosion. It is understood that the heat sink 30 dissipates the received heat to the outside to lower the overall temperature of the LED connecting structure 100.

Referring to fig. 1 to 3, optionally, a heat conduction hole 21 is formed at a position where the circuit board 20 is connected to the lamp bead 10, two ends of the heat conduction hole 21 respectively penetrate through two side plate surfaces of the circuit board 20, and a cross section of the heat conduction hole 21 is circular, elliptical or polygonal. The heat dissipation plate 30 is stacked on the circuit board 20 and completely covers the aperture of one end of the heat conduction hole 21; the lamp beads 10 are located at the other end of the heat conduction holes 21, abut against the heat dissipation plate 30, and can conduct heat toward the heat dissipation plate 30. It can be understood that, the base pin 112 of the lamp bead 10 is electrically connected to the circuit board 20, and one end of the lamp bead 10 is directly abutted to the heat dissipation plate 30 through the heat conduction hole 21, so that the heat dissipation plate 30 is in surface-to-surface contact with the circuit board 20, and heat transfer on the circuit board 20 to the heat dissipation plate 30 is facilitated.

Referring to fig. 1 to 3, the heat conducting hole 21 is formed in the circuit board 20, and one end of the lamp bead 10 abuts against the heat dissipation plate 30 through the heat conducting hole 21, so that heat generated by the lamp bead 10 can be directly conducted to the heat dissipation plate 30, and the circuit board 20 and the heat dissipation plate 30 are in surface-to-surface contact, so that the heat dissipation area is increased, the heat dissipation efficiency can be improved, and the service life of the LED connection structure 100 can be prolonged.

Referring to fig. 3, in some embodiments, the shape of the heat conducting hole 21 is adapted to the shape of the lamp bead 10, and the lamp bead 10 is at least partially accommodated in the heat conducting hole 21. Optionally, heat conduction hole 21 is the circular port, the aperture of heat conduction hole 21 and the external diameter size adaptation of lamp pearl 10, and the one end of lamp pearl 10 sinks to inlay in circuit board 20, accepts promptly in heat conduction hole 21, and the terminal surface of lamp pearl 10 one end butt and the face of laminating heating panel 30 completely, has improved heating panel 30 and lamp pearl 10's area of contact, and it is more high-efficient to transfer heat, improves the radiating efficiency. The light-emitting surface of the lamp bead 10 is exposed out of the heat-conducting hole 21. The pins 112 of the lamp bead 10 are disposed on the side of the lamp bead 10 and electrically connected to the circuit board 20.

Referring to fig. 1, in some embodiments, the LED connection structure 100 further includes a heat conduction block 31 partially accommodated in the heat conduction hole 21, one end of the heat conduction block 31 is connected to the heat dissipation plate 30, the other end of the heat conduction block 31 abuts against the lamp bead 10, and the heat conduction block 31 can conduct heat of the lamp bead 10 to the heat dissipation plate 30. Alternatively, the heat conduction block 31 is made of a heat conduction material, which may be metallic copper or metallic aluminum. LED lamp pearl 10 is connected the positive negative pole at bottom both ends through the paster mode and is fixed on circuit board 20, circuit board 20 is opened in the position that corresponds lamp pearl 10 has slightly less than the heat conduction hole 21 of LED lamp pearl 10 bottom area size, the protruding surface of locating heating panel 30 towards circuit board 20 of heat conduction piece 31, and heat conduction piece 31 passes heat conduction hole 21 and the bottom of direct butt LED lamp pearl 10, make the direct butt LED lamp pearl 10 of heating panel 30, realize thermal direct conduction to heating panel 30, give off of thermal with higher speed.

It is understood that the heat conductive block 31 may be integrally formed with the heat dissipation plate 30, thereby facilitating mass production and assembly of the LED connection structure 100.

Referring to fig. 2, in some embodiments, the heat conducting block 31 has a heat conducting surface 311 abutting against the lamp bead 10, the lamp bead 10 has a heat dissipating surface 111 abutting against the heat conducting surface 311, and a projection of the heat conducting surface 311 on the heat dissipating surface 111 is located within a range determined by the heat dissipating surface 111 or coincides with a range determined by the heat dissipating surface 111. It can be understood that the area of the heat dissipating surface 111 is not smaller than the area of the heat conducting surface 311, and the projection of the heat conducting surface 311 on the heat dissipating surface 111 is not larger than the range determined by the heat dissipating surface 111, so that the heat conducting surface 311 and the heat dissipating surface 111 are in complete contact, and the heat conducting efficiency is improved.

Referring to fig. 1, optionally, the projection of the heat conducting surface 311 on the heat dissipating surface 111 is completely located in the heat dissipating surface 111.

Referring to fig. 4, optionally, the size and shape of the heat conducting surface 311 are matched with the size and shape of the heat dissipating surface 111, that is, the projection of the heat conducting surface 311 on the heat dissipating surface 111 coincides with the heat dissipating surface 111.

Referring to fig. 4, in some embodiments, the end surface of the heat conduction block 31 abutting against the lamp bead 10 is flush with the surface of the circuit board 20 facing the lamp bead 10. Optionally, the heat conducting surface 311 is flush with the surface of the circuit board 20 facing the lamp bead 10, and the heat radiating surface 111 of the lamp bead 10 completely abuts against the heat conducting surface 311, so that the heat radiating area is larger, and the heat radiating efficiency is higher; and lamp pearl 10 protrusion is on circuit board 20, does not influence the light of lamp pearl 10 to launching all around, simultaneously, through heat conduction piece 31 on the heating panel 30, has improved the radiating efficiency of lamp pearl 10.

Alternatively, the cross-sectional shape of the heat conduction hole 21 is adapted to the shape of the heat dissipation surface 111, and the heat conduction surface 311 coincides with the heat dissipation surface 111.

Referring to fig. 4, in some embodiments, the sidewall of the heat conduction block 31 abuts against the hole wall of the heat conduction hole 21, or the sidewall of the heat conduction block 31 and the hole wall of the heat conduction hole 21 are spaced apart from each other. Alternatively, in this embodiment, the heat conducting block 31 is disposed in a cylindrical shape, the heat conducting hole 21 is a circular hole, and the peripheral side surface of the heat conducting block 31 completely fits the hole wall of the heat conducting hole 21 to increase the contact area, or the peripheral side surface of the heat conducting block 31 and the hole wall of the heat conducting hole 21 are disposed at an interval, so that the circuit board 20 radiates heat by using the gap.

Referring to fig. 5, in some embodiments, the circuit board 20 further has a through hole 22, and the through hole 22 and the heat conduction hole 21 are disposed at an interval. Optionally, the through holes 22 are formed in multiple numbers, the through holes 22 are arranged at intervals, and the multiple through holes 22 are used for increasing the heat dissipation area of the circuit board 20 and improving the heat dissipation efficiency.

Alternatively, the cross-sectional shape of the through-hole 22 is circular, oval, or polygonal.

Referring to fig. 6, in some embodiments, the LED connecting structure 100 further includes a heat dissipating protrusion 33, one end of the heat dissipating protrusion 33 is connected to the heat dissipating plate 30, and the other end of the heat dissipating protrusion 33 is received in the through hole 22. Alternatively, the heat dissipating protrusions 33 may be formed by filling the through-holes 22 with a thermally conductive material having excellent thermal conductivity, which may be aluminum oxide, magnesium oxide, zinc oxide, aluminum nitride, boron nitride, or silicon carbide. Alternatively, the heat dissipating protrusions 33 may be made of copper metal and formed integrally with the heat dissipating plate 30.

Referring to fig. 6, the cross-sectional shape of the through-hole 22 is circular, the heat dissipating protrusion 33 is disposed in a cylindrical shape, the outer diameter of the heat dissipating protrusion 33 is equal to the aperture of the through-hole 22, and the peripheral side surface of the heat dissipating protrusion 33 abuts against the hole wall of the through-hole 22, thereby increasing the contact area. After the upper surface of the heat dissipation plate 30 and the lower surface of the circuit board 20 are laminated, one end of the heat dissipation protrusion 33 is connected to the heat dissipation plate 30, and the end surface of the other end of the heat dissipation protrusion 33 is flush with the upper surface of the circuit board 20. The through holes 22 on the circuit board 20 are filled with a material having a higher thermal conductivity, which assists in faster heat conduction from the lamp beads 10 and the circuit board 20 to the heat dissipation plate 30, thereby improving heat dissipation efficiency.

Referring to fig. 6, optionally, a heat dissipation protrusion 33 is disposed in each through hole 22.

Referring to fig. 1 to 3, in some embodiments, the LED connection structure 100 further includes a first insulating layer 11, where the first insulating layer 11 is located between the heat conduction block 31 and the lamp bead 10; optionally, the first insulating layer 11 is a solder paste layer, and the first insulating layer 11 can prevent the lamp bead 10 from directly abutting against the heat conduction block 31 to cause a short circuit, and it can be understood that the heat of the lamp bead 10 can be conducted to the heat conduction block 31 through the first insulating layer 11.

Referring to fig. 1 to 3, in some embodiments, the LED connecting structure 100 further includes a second insulating coating 12, and the second insulating coating 12 is located between the circuit board 20 and the heat dissipation plate 30. Alternatively, the second insulating layer 12 is also a solder paste layer, and the second insulating layer 12 can prevent the circuit board 20 from directly abutting against the heat dissipation plate 30 to cause a short circuit, and it can be understood that the heat of the circuit board 20 can be conducted to the heat dissipation plate 30 through the second insulating layer 12.

Optionally, when the LED connection structure 100 is assembled, a solder paste may be coated on the through holes 22 of the circuit board 20 by using a screen plate, and the solder paste may flow down between the heat dissipation plate 30 and the circuit board 20 after being heated and melted, so as to fixedly connect the PCB board and the heat dissipation plate 30; alternatively, a layer of solder paste may be applied to the heat dissipation plate 30, and after the solder paste is melted by heating, a portion of the solder paste is pressed into the through hole 22 by pressing, so that the PCB is fixedly connected to the heat dissipation plate 30. The solder paste can assist heat conduction from the heat dissipation plate 30, thereby effectively dissipating heat.

Referring to fig. 7, the present invention further provides a lamp cap assembly 200, where the lamp cap assembly 200 includes an LED connection structure 100, and the specific structure of the LED connection structure 100 refers to the above embodiments, and since the lamp cap assembly 200 adopts all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are also achieved, and details are not repeated here.

Lamp holder subassembly 200 is through seting up heat conduction hole 21 on circuit board 20, the one end of lamp pearl 10 is through heat conduction hole 21 and butt heating panel 30 to the heat that lamp pearl 10 produced can direct conduction to heating panel 30, and be face and face contact between circuit board 20 and the heating panel 30, heat radiating area has been improved, thereby can improve the radiating efficiency, be favorable to prolonging LED connection structure 100's life, lamp holder subassembly 200's life has been prolonged promptly.

Referring to fig. 7, in some embodiments, the lamp holder assembly 200 further includes a lamp holder shell 44 having a light-emitting cavity 45, a reflective cup 42 disposed in the light-emitting cavity 45, and a lamp holder cover 41 connected to the lamp holder shell 44, the light-emitting cavity 45 has a light outlet, the lamp holder cover 41 is disposed at the light outlet, the LED connecting structure 100 is received in the light-emitting cavity 45, and the lamp bead 10 is at least partially received in the reflective cup 42.

Referring to fig. 7, optionally, the lamp head assembly 200 further includes a heat sink 43, and the circuit board 20 is located between the heat sink 43 and the heat dissipation plate 30.

The above are merely alternative embodiments of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.

Claims

1. An LED connection structure (100), comprising: the LED lamp comprises a circuit board (20), lamp beads (10) electrically connected with the circuit board (20) and a heat dissipation plate (30) made of heat conduction materials, wherein heat conduction holes (21) are formed in positions, connected with the lamp beads (10), of the circuit board (20), two ends of each heat conduction hole (21) are respectively communicated with two side plate surfaces of the circuit board (20), and the heat dissipation plate (30) and the circuit board (20) are arranged in a stacked mode and completely cover an orifice at one end of each heat conduction hole (21); the lamp beads (10) are located at the other end of the heat conducting holes (21), abut against the heat dissipation plate (30), and can conduct heat towards the heat dissipation plate (30).

2. The LED connection structure (100) of claim 1, wherein: the shape of the heat conduction hole (21) is matched with that of the lamp bead (10), and at least part of the lamp bead (10) is contained in the heat conduction hole (21).

3. The LED connection structure (100) of claim 1, wherein: the LED connecting structure (100) further comprises a heat conducting block (31) which is partially contained in the heat conducting hole (21), one end of the heat conducting block (31) is connected with the heat radiating plate (30), the other end of the heat conducting block (31) is abutted to the lamp bead (10), and the heat conducting block (31) can conduct heat of the lamp bead (10) to the heat radiating plate (30).

4. The LED connection structure (100) of claim 3, wherein: the heat conducting block (31) is provided with a heat conducting surface (311) abutted to the lamp bead (10), the lamp bead (10) is provided with a heat radiating surface (111) abutted to the heat conducting surface (311), and the projection of the heat conducting surface (311) on the heat radiating surface (111) is located in the range determined by the heat radiating surface (111) or coincided with the range determined by the heat radiating surface (111).

5. The LED connection structure (100) of claim 3, wherein: the heat conduction block (31) is abutted against the end face of the lamp bead (10) and the circuit board (20) faces the board face of the lamp bead (10) and is arranged in a flush mode.

6. The LED connection structure (100) of claim 3, wherein: the peripheral side surface of the heat-conducting block (31) is abutted against the hole wall of the heat-conducting hole (21), or the peripheral side surface of the heat-conducting block (31) and the hole wall of the heat-conducting hole (21) are arranged at intervals.

7. The LED connection structure (100) according to any of claims 1-6, wherein: the circuit board (20) is further provided with a through hole (22), and the through hole (22) and the heat conduction hole (21) are arranged at intervals.

8. The LED connection structure (100) of claim 7, wherein: the LED connecting structure (100) further comprises heat dissipation protrusions (33), one ends of the heat dissipation protrusions (33) are connected with the heat dissipation plate (30), and the other ends of the heat dissipation protrusions (33) are contained in the through holes (22).

9. The LED connection structure (100) according to any of claims 3-6, wherein: the LED connecting structure (100) further comprises a first insulating coating (11), and the first insulating coating (11) is located between the heat conducting block (31) and the lamp bead (10); and/or the LED connection structure (100) further comprises a second insulating coating (12), wherein the second insulating coating (12) is positioned between the circuit board (20) and the heat dissipation plate (30).

10. A lamp cap assembly (200) comprising the LED connection structure (100) according to any one of claims 1 to 9, wherein the lamp cap assembly (200) further comprises a lamp cap housing (44) having a light-emitting cavity (45), a light-reflecting cup (42) disposed in the light-emitting cavity (45), and a lamp cap cover (41) connected to the lamp cap housing (44), the light-emitting cavity (45) has a light-emitting opening, the lamp cap cover (41) is disposed at the light-emitting opening, the LED connection structure (100) is received in the light-emitting cavity (45), and the lamp bead (10) is at least partially received in the light-reflecting cup (42).