CN218548475U

CN218548475U - Light-emitting diode packaging structure

Info

Publication number: CN218548475U
Application number: CN202222607038.8U
Authority: CN
Inventors: 沈发高
Original assignee: Dongguan Hongding Photoelectric Technology Co ltd
Current assignee: Dongguan Hongding Photoelectric Technology Co ltd
Priority date: 2022-09-30
Filing date: 2022-09-30
Publication date: 2023-02-28
Anticipated expiration: 2032-09-30

Abstract

The utility model discloses a light emitting diode packaging structure, including base plate, packaging cover and cooling ring, surface package has the packaging cover on the base plate, and a plurality of evenly distributed's louvre is seted up to the base plate lower surface, and the base plate is inside to be equipped with a plurality of evenly distributed's heat conduction copper post along fixed mounting outward, and base plate surface cover is equipped with the cooling ring, and fixed mounting has the heat conduction contact with heat conduction copper post looks adaptation on the cooling ring is inside, and the heat conduction contact adopts copper metal to make, the utility model discloses a good heat conductivility of copper metal can effectively improve the conduction speed and the conduction effect of heat energy, compares simple structure touch, the utility model discloses heat energy conduction effect is faster to can effectively improve the radiating effect after the heat conduction, through the use of cooperation louvre 5, thereby can improve the radiating effect after the diode encapsulation greatly, prevent that the diode from overheated damage under high power luminescent state, effectively improve life.

Description

Light-emitting diode packaging structure

Technical Field

The utility model relates to a LED technical field specifically is a light emitting diode packaging structure.

Background

LED encapsulation is the encapsulation that sends out light chip, compares that integrated circuit encapsulates and has great difference, LED's encapsulation not only requires can protect the chip, but also can the printing opacity, along with packaging technology's development, the fixed of chip also more and more perfect with the printing opacity, but current LED packaging structure is when using, its leakproofness is strong to can lead to the radiating effect behind the emitting diode encapsulation not good, cause overheated damage easily, influence life, for example patent application number: CN201921703003.6, the patent discloses: a light-emitting diode packaging structure comprises a substrate, a heat dissipation unit, a packaging cover body, a fluorescent layer and a light-emitting module, and effectively solves the problem that a packaged diode is poor in heat dissipation effect and easy to damage.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a light emitting diode packaging structure to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a light emitting diode packaging structure, includes base plate, encapsulation cover and cooling ring, the encapsulation cover has been gone up to the base plate upper surface, a plurality of evenly distributed's louvre has been seted up to the base plate lower surface, there are a plurality of evenly distributed's heat conduction copper post inside the base plate along fixed mounting outward, the surface cover of base plate is equipped with the cooling ring, fixed mounting has the heat conduction contact with heat conduction copper post looks adaptation on the cooling ring inside, the heat conduction contact adopts copper metal to make.

Preferably, the upper surface of the substrate is printed with a printed circuit, and the upper surface of the printed circuit is electrically provided with an LED chip.

Preferably, both sides of the printed circuit are electrically provided with conductive pins.

Preferably, the packaging cover is a lens, the lens is a convex lens, and an epoxy resin layer is coated on the inner wall of the packaging cover.

Preferably, a plurality of uniformly distributed heat dissipation fins are fixedly mounted on the outer wall of the heat dissipation ring, and the heat dissipation fins are designed to be of a conical structure.

Compared with the prior art, the beneficial effects of the utility model are that:

the utility model discloses a be provided with a plurality of louvres below the base plate, louvre through setting up can carry out preliminary radiating work to this emitting diode during operation, simultaneously through being provided with the heat conduction copper post in the base plate is inside, when the diode carries out the luminous during operation of high power, the condition of generating heat can appear in the base plate, the heat conduction copper post in the base plate can pass through heat conduction contact conduction to radiating ring this moment, thereby heat radiation fins through radiating ring carries out the second grade heat dissipation, this kind of structural design, good heat conductivility through the metal, can effectively improve the conduction effect and the conduction efficiency of heat energy, improve the radiating effect after the heat conduction, use through the cooperation louvre, thereby can improve the radiating effect after the diode encapsulation greatly, prevent that the diode from overheated damage under the high power luminescent state, effectively prolong service life.

Drawings

Fig. 1 is a schematic view of the split structure of the present invention;

FIG. 2 is a schematic view of the overall structure of the present invention;

FIG. 3 is a schematic view of the bottom structure of the substrate of the present invention;

fig. 4 is a schematic view of the heat dissipating ring of the present invention.

In the figure: 1. a substrate; 2. a printed circuit; 3. an LED chip; 4. a package cover; 5. heat dissipation holes; 6. a thermally conductive copper pillar; 7. a conductive pin; 8. a heat dissipating ring; 9. a heat dissipating fin; 10. a heat conducting contact.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts all belong to the protection scope of the present invention.

Referring to fig. 1-4, the present invention provides a technical solution: a light emitting diode packaging structure comprises a substrate 1, a packaging cover 4 and a heat dissipation ring 8, wherein the packaging cover 4 is packaged on the upper surface of the substrate 1, a plurality of heat dissipation holes 5 which are uniformly distributed are formed in the lower surface of the substrate 1, a plurality of heat conduction copper columns 6 which are uniformly distributed are fixedly mounted on the outer edge of the inner portion of the substrate 1, the heat dissipation ring 8 is sleeved on the outer surface of the substrate 1, the heat dissipation ring 8 is made of a heat dissipation sheet material commonly used in the field, a heat conduction contact piece 10 matched with the heat conduction copper columns 6 is fixedly mounted on the inner portion of the heat dissipation ring 8, the heat conduction contact piece 10 is made of copper metal, the copper metal has excellent heat conduction performance, and meanwhile, the use cost is low;

through the structural design, the substrate 1 can conduct self heat to the radiating ring 8 through the heat conducting copper columns 6 and the heat conducting contact pieces 10, so that the high-efficiency heat conducting effect can be achieved, and the radiating speed after heat conduction is improved.

Furthermore, a printed circuit 2 is printed on the upper surface of the substrate 1, and an LED chip 3 is electrically mounted on the upper surface of the printed circuit 2.

Furthermore, the conductive pins 7 are electrically mounted on both sides of the printed circuit 2, so that the external circuit board can be connected by soldering tin through the conductive pins 7, and the normal use of the diode is ensured.

In this embodiment, the package cover 4 is a lens, the lens is a convex lens, and an epoxy resin layer is coated on an inner wall of the package cover 4, so that the light transmittance of the package cover 4 can be ensured.

In this embodiment, a plurality of uniformly distributed heat dissipation fins 9 are fixedly installed on the outer wall of the heat dissipation ring 8, and the heat dissipation fins 9 adopt a conical structure design, thereby achieving a better heat dissipation effect.

When in use, a person skilled in the art welds the diode assembly on a circuit board through the conductive pin 7 to ensure normal use;

the utility model discloses a be provided with a plurality of louvres 5 in base plate 1 below, louvre 5 through setting up can carry out preliminary heat dissipation work to this emitting diode during operation, simultaneously through being provided with heat conduction copper post 6 in base plate 1 inside, when the diode carries out the luminous during operation of high power, the condition of generating heat can appear in base plate 1, heat conduction copper post in the base plate 1 can be with heat conduction to radiating ring 8 through heat conduction contact 10 this moment, thereby heat radiation 9 through radiating ring 8 carries out the second grade heat dissipation, this kind of structural design, good heat conductivility through the copper metal, can effectively improve the conduction speed and the conduction effect of heat energy, compare simple structure and touch, the utility model discloses heat conduction effect is faster, thereby can effectively improve the radiating effect after the heat conduction, through cooperation louvre 5's use, thereby can improve the radiating effect after the diode encapsulation greatly, prevent that the diode from overheated damage under the high power luminous state, effectively improve life.

In the description of the present invention, it is to be understood that the terms "coaxial", "bottom", "one end", "top", "middle", "other end", "upper", "one side", "top", "inner", "front", "center", "both ends", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore, should not be construed as limiting the present invention.

Furthermore, the terms "first", "second", "third", "fourth" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or as implying any number of indicated technical features, whereby the features defined as "first", "second", "third", "fourth" may explicitly or implicitly include at least one such feature.

In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "disposed," "connected," "fixed," "screwed" and the like are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally formed; can be mechanically or electrically connected; they may be directly connected or indirectly connected through an intermediate medium, and may be connected through the inside of two elements or in an interaction relationship between two elements, unless otherwise specifically defined, and the specific meaning of the above terms in the present invention will be understood by those skilled in the art according to specific situations.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a light emitting diode packaging structure, its characterized in that, includes base plate (1), encapsulation cover (4) and radiating ring (8), base plate (1) upper surface packaging has encapsulation cover (4), a plurality of evenly distributed's louvre (5) have been seted up to base plate (1) lower surface, base plate (1) is inside outer along fixed mounting have a plurality of evenly distributed's heat conduction copper post (6), base plate (1) surface cover is equipped with radiating ring (8), fixed mounting has heat conduction contact (10) with heat conduction copper post (6) looks adaptation on radiating ring (8) inside, heat conduction contact (10) adopt copper metal to make.

2. The led package structure of claim 1, wherein: the LED packaging structure is characterized in that a printed circuit (2) is printed on the upper surface of the substrate (1), and an LED chip (3) is electrically mounted on the upper surface of the printed circuit (2).

3. The led package structure of claim 2, wherein: and conductive pins (7) are electrically mounted on both sides of the printed circuit (2).

4. The led package structure of claim 1, wherein: the packaging cover (4) is a lens which is a convex lens, and the inner wall of the packaging cover (4) is coated with an epoxy resin layer.

5. The led package structure of claim 1, wherein: a plurality of radiating fins (9) which are uniformly distributed are fixedly arranged on the outer wall of the radiating ring (8), and the radiating fins (9) adopt a conical structural design.