CN2706871Y - Radiating device for LED - Google Patents
Radiating device for LED Download PDFInfo
- Publication number
- CN2706871Y CN2706871Y CNU2004200275523U CN200420027552U CN2706871Y CN 2706871 Y CN2706871 Y CN 2706871Y CN U2004200275523 U CNU2004200275523 U CN U2004200275523U CN 200420027552 U CN200420027552 U CN 200420027552U CN 2706871 Y CN2706871 Y CN 2706871Y
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- CN
- China
- Prior art keywords
- emitting diode
- heat pipe
- light
- heat
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
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- Led Device Packages (AREA)
Abstract
The utility model discloses a radiating device for LED under the working condition with high current, which is designed for solving the problem of the large heat resistance in the existing radiating device which is radiated chiefly by the heat conduction. The utility model is provided with a heat pipe the condensation end of which is provided with a radiating fin. The utility model is characterized in that the evaporation end of the heat pipe is provided with a fixing support of the LED, making the conductive contact between the heat conductivity base of the light emitting diode and the end surface of the evaporation of the heat pipe reliable. The phase-change process of the evaporation and condensation of the heat pipe is used to quickly take away the heat of the LED through the heat pipe and the radiating fin thereon, and the radiation efficiency is improved to several hundred times. Therefore, the light efficiency of the light emitting diode, the light output power and the operating life are increased substantially.
Description
(1) technical field: the utility model relates to the heat abstractor of light emitting semiconductor device, is specially the heat abstractor of semiconductor light-emitting-diode.
(2) background technology: semiconductor light-emitting-diode (being called for short LED) is widely used in fields such as electronic display, traffic lights.The chip surface of light-emitting diode is encapsulated in the epoxide resin material of printing opacity usually.For the semiconductor light-emitting-diode of big current work state, because this packaged type has very high thermal resistance, make the die of light-emitting diode produce very high temperature rise, the luminous efficiency of die, optical output power and working life seriously descend.Be to improve heat radiation, the heat conducting base with the light-emitting diodes pipe shell in the prior art is connected on the metal heat sink, by the mode of heat conduction and thermal radiation, the heat of light-emitting diode chip for backlight unit is distributed in the air.This radiator structure, to the heat radiation that improves power type light-emitting diode and improve luminous efficiency, working life has obvious improvement.But because the size of die is little, thermal source is concentrated, and the thermal resistance of this metal Conduction heat-sink structure is still bigger, and the working temperature of die is still very high.
(3) summary of the invention: the purpose of this utility model is to design a kind of heat abstractor of light-emitting diode of better radiating effect, and it can make the luminous efficiency of light-emitting diode and working life be greatly improved.
The technical solution of the utility model is as follows: it comprises heat pipe, the condensation end device radiation fin of heat pipe, feature is the fixed mount that light-emitting diode is installed at described heat pipe evaporation ends: it is one to be connected in the cover body of heat pipe evaporation ends periphery, the reflection shield of device clamping light-emitting diode in the cover body; Perhaps it is one to be connected in the stake body of heat pipe evaporation ends end face, and stake body has the loam cake of clamping light-emitting diode; Perhaps it is one to be connected in the stake body of heat pipe evaporation ends end face, and stake body has the interior cover of clamping light-emitting diode.
The heat conducting base of light-emitting diode is contacted with heat pipe evaporation ends end face in the utility model, and the shell body of light-emitting diode is fixed in the fixed mount of the present utility model, make the heat conducting base of light-emitting diode contact more reliable with the end face heat conduction of heat pipe evaporation ends, utilize the phase transition process of heat pipe evaporation and condensation, heat on the light-emitting diode heat conducting base is taken away rapidly by heat pipe and radiating fin that its condensation end is installed, and radiating efficiency improves hundreds of times than former heat conduction and thermal radiation radiating mode.Thereby luminous efficiency, optical output power and the working life of the light-emitting diode under the big current work are increased substantially.The utility model can make the heat conducting base of light-emitting diode reliably be installed on the end face of heat pipe evaporation ends, and radiating effect is particularly remarkable.
(4) description of drawings:
Fig. 1 is the topology view of the utility model embodiment 1.
Fig. 2 is the topology view of the utility model embodiment 2.
Fig. 3 is the topology view of the utility model embodiment 3.
More than among each figure, the light-emitting diode shown in the dotted line is not included in the utility model structure.
(5) embodiment:
See Fig. 1, the utility model has heat pipe 8, the condensation end device red copper matter radiating fin 9 of heat pipe 8.The heat conducting base of light-emitting diode 6 contacts with the evaporation ends end face 7 of heat pipe 8, also can weld or with silver slurry sintering or conductive adhesive.At the evaporation ends of heat pipe 8 fixed mount of light-emitting diode is installed, so that the heat conducting base of light-emitting diode contacts reliably with the end face heat conduction of heat pipe evaporation ends.This fixed mount has multiple design: Figure 1 shows that a cover body, its by under cover 4 and go up cover 1 usefulness and be threaded and constitute, cover the periphery of 4 lock rings down in the heat pipe evaporation ends, fixture reflection shield 2 in the last cover 1, light-emitting diode 6 is held in the reflection shield 2, and 5 is the epoxy encapsulation district of light-emitting diode 6 among Fig. 1; Fixed mount shown in Figure 2 is a stake body, and the undercarriage 10 and the heat pipe evaporation ends end face 7 of stake body are fastenedly connected, and the center clamping light-emitting diode 6 of loam cake 11 is fastenedly connected by screw 12 and undercarriage 10, and other structures are identical with Fig. 1; Fixed mount shown in Figure 3 also is a stake body, and the overcoat 13 of stake body is fastenedly connected with heat pipe evaporation end face 7, the center clamping light-emitting diode 6 of interior cover 14, and interior cover 14 and overcoat 13 are fastenedly connected by the concavo-convex snap ring between wall, and other structures are identical with Fig. 1.
More than among each embodiment, the lead-in wire electrode of mutually insulated can be installed on the fixed mount of heat pipe evaporation ends end face or light-emitting diode, the outer lead of light-emitting diode and the welding of lead-in wire electrode, the lead-in wire electrode connects external circuit lead-in wire 3.The outer lead of light-emitting diode 6 directly is connected with external circuit lead-in wire 3 among Fig. 3.More than among each embodiment, also can be connected at the evaporation ends end face 7 of heat pipe with the heat conducting base of a plurality of light-emitting diodes.
More than among each embodiment, heat pipe 8 adopts copper body, the work medium adopts deionized water, the capillary wick adopts copper fibre bundle core or copper powder sintering core, adopts prior art to make heat pipe.
Claims (4)
1, the heat abstractor of light-emitting diode, it comprises heat pipe, the condensation end device radiation fin of heat pipe is characterized in that being equipped with at described heat pipe evaporation ends the fixed mount of light-emitting diode.
2, by the heat abstractor of the described light-emitting diode of claim 1, the fixed mount that it is characterized in that described light-emitting diode is one to be connected in the cover body of heat pipe evaporation ends periphery, the reflection shield of device clamping light-emitting diode in the cover body.
3, by the heat abstractor of the described light-emitting diode of claim 1, the fixed mount that it is characterized in that described light-emitting diode is one to be connected in the stake body of heat pipe evaporation ends end face, and stake body has the loam cake of clamping light-emitting diode.
4, by the heat abstractor of the described light-emitting diode of claim 1, the fixed mount that it is characterized in that described light-emitting diode is one to be connected in the stake body of heat pipe evaporation ends end face, and stake body has the interior cover of clamping light-emitting diode.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200275523U CN2706871Y (en) | 2004-05-29 | 2004-05-29 | Radiating device for LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2004200275523U CN2706871Y (en) | 2004-05-29 | 2004-05-29 | Radiating device for LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN2706871Y true CN2706871Y (en) | 2005-06-29 |
Family
ID=34849602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2004200275523U Expired - Fee Related CN2706871Y (en) | 2004-05-29 | 2004-05-29 | Radiating device for LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN2706871Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101922635A (en) * | 2010-08-17 | 2010-12-22 | 安徽莱德光电技术有限公司 | High-power LED lamp adopting heat pipe for heat dissipation |
| CN101349411B (en) * | 2007-07-18 | 2010-12-22 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN101312227B (en) * | 2007-05-25 | 2011-08-17 | 黄明智 | Heat dissipation method and apparatus for LED |
| CN112366269A (en) * | 2020-12-11 | 2021-02-12 | 江西众能光电科技有限公司 | High heat abstractor of LED |
-
2004
- 2004-05-29 CN CNU2004200275523U patent/CN2706871Y/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101312227B (en) * | 2007-05-25 | 2011-08-17 | 黄明智 | Heat dissipation method and apparatus for LED |
| CN101349411B (en) * | 2007-07-18 | 2010-12-22 | 富准精密工业(深圳)有限公司 | LED lamp |
| CN101922635A (en) * | 2010-08-17 | 2010-12-22 | 安徽莱德光电技术有限公司 | High-power LED lamp adopting heat pipe for heat dissipation |
| CN112366269A (en) * | 2020-12-11 | 2021-02-12 | 江西众能光电科技有限公司 | High heat abstractor of LED |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C17 | Cessation of patent right | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20050629 Termination date: 20120529 |