CN211399397U - LED lamp diode packaging structure - Google Patents
LED lamp diode packaging structure Download PDFInfo
- Publication number
- CN211399397U CN211399397U CN201922470192.3U CN201922470192U CN211399397U CN 211399397 U CN211399397 U CN 211399397U CN 201922470192 U CN201922470192 U CN 201922470192U CN 211399397 U CN211399397 U CN 211399397U
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- Prior art keywords
- fixed
- lower shell
- shell
- led lamp
- packaging structure
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- 238000004806 packaging method and process Methods 0.000 title claims abstract description 17
- 239000000758 substrate Substances 0.000 claims abstract description 20
- 238000007789 sealing Methods 0.000 claims abstract description 17
- 230000017525 heat dissipation Effects 0.000 claims abstract description 7
- 239000011521 glass Substances 0.000 claims abstract description 4
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 230000008018 melting Effects 0.000 claims description 3
- 238000002844 melting Methods 0.000 claims description 3
- 239000004033 plastic Substances 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 4
- 239000000463 material Substances 0.000 description 4
- 230000005855 radiation Effects 0.000 description 4
- 230000009286 beneficial effect Effects 0.000 description 3
- 238000005538 encapsulation Methods 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- 208000033999 Device damage Diseases 0.000 description 1
- BUGBHKTXTAQXES-UHFFFAOYSA-N Selenium Chemical compound [Se] BUGBHKTXTAQXES-UHFFFAOYSA-N 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004075 alteration Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 229910052732 germanium Inorganic materials 0.000 description 1
- GNPVGFCGXDBREM-UHFFFAOYSA-N germanium atom Chemical compound [Ge] GNPVGFCGXDBREM-UHFFFAOYSA-N 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 239000011669 selenium Substances 0.000 description 1
- 229910052711 selenium Inorganic materials 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
Images
Landscapes
- Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)
Abstract
The utility model relates to the technical field of diode packaging, and discloses a LED lamp diode packaging structure, which comprises a transparent substrate, a lower shell is fixed at the outer side of the transparent substrate, fixing holes are all arranged at four end corners of the upper surface of the lower shell, waterproof grooves are all arranged at the upper surface of the lower shell, a waterproof ring is fixed at the inner side of the lower shell, an upper shell is fixed at the top end of the lower shell, inserting limit posts are all fixed at the four end corners of the bottom end of the lower shell, sealing strips are fixed at the lower surface of the periphery of the lower shell, a transparent glass sheet is fixed at the inner side of the upper surface of the upper shell, the lower shell and the upper shell are matched and fixed with the fixing holes through the inserting limit posts, when the lower shell and the upper shell are fixed, the lower surface of the sealing strip is tightly attached to the inner side of the waterproof groove, the lower surface of the transparent substrate is fixed with a heat conducting sheet, the lower surface of the heat conducting sheet is fixed with a heat dissipation module, and the upper surface of the transparent substrate is fixed with an LED diode. The utility model discloses a series of structural design make the water-proof effects of device better.
Description
Technical Field
The utility model belongs to the technical field of the diode encapsulation, concretely relates to LED lamp diode packaging structure.
Background
The diode is an electronic device made of semiconductor material (silicon, selenium, germanium, etc.), and it has one-way conductivity, i.e. when a forward voltage is applied to the anode and cathode of the diode, the diode is conducted, and when a reverse voltage is applied to the anode and cathode, the diode is cut off, so that the conduction and cut-off of the diode is equivalent to the on and off of the switch, and the diode needs to be packaged before use.
For example, the LED package structure disclosed in the publication No. CN203250779U realizes a good heat dissipation effect, and is beneficial to prolonging the service life of the LED chip, thereby being beneficial to prolonging the service life of the product.
However, the problem that the existing LED lamp diode packaging structure does not have high waterproof performance is not solved, and therefore an LED lamp diode packaging structure is provided.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a LED lamp diode packaging structure to solve the problem that proposes among the above-mentioned background art.
In order to achieve the above object, the utility model provides a following technical scheme: the waterproof structure comprises a transparent substrate, wherein a lower shell is fixed on the outer side of the transparent substrate, four end corners of the upper surface of the lower shell are provided with fixing holes, waterproof grooves are formed in the upper surface of the periphery of the lower shell, a waterproof ring is fixed on the inner side of the lower shell, and an upper shell is fixed at the top end of the lower shell;
the lower shell and the upper shell are matched and fixed with the fixing hole through the inserting limiting columns, and when the lower shell and the upper shell are fixed, the lower surface of the sealing strip is tightly attached to the inner side of the waterproof groove;
the LED lamp comprises a transparent substrate, and is characterized in that a heat conducting fin is fixed on the lower surface of the transparent substrate, a heat radiating module is fixed on the lower surface of the heat conducting fin, an LED diode is fixed on the upper surface of the transparent substrate, a positive wire is fixed on one side of the LED diode, and a negative wire is fixed on the other side of the LED diode.
Preferably, the lower surface of the sealing strip is provided with two projections.
Preferably, the bump is made of rubber.
Preferably, the waterproof ring is made of rubber.
Preferably, the lower shell is made of plastic.
Preferably, the lower shell and the waterproof ring are connected through hot melting.
Preferably, the heat conducting fin is connected with the heat dissipation module through welding.
Preferably, the heat dissipation module is made of copper.
Compared with the prior art, the beneficial effects of the utility model are that:
(1) the utility model discloses when the encapsulation, the fixed orifices that the grafting spacing post of going up casing lower surface mounting was seted up with casing upper surface down is aligned, later downwards press down the casing, make the spacing post of pegging graft insert in the inside of fixed orifices, and go up the upper surface of casing lower surface mounting's sealing strip and lower casing and hug closely, and the lug that the sealing strip lower surface set up and the waterproof groove laminating of casing upper surface down are seted up, and inside the inboard fixed waterproof circle of casing can effectively prevent water access device under the cooperation, and pass through fixed conducting strip and the radiating module in transparent substrate bottom when the device uses, can dispel the heat to the device, the device makes the device have better water-proof effects through sealing strip and waterproof circle mutually support.
Drawings
Fig. 1 is a schematic overall structure diagram of the present invention;
fig. 2 is an overall bottom view of the present invention;
FIG. 3 is an overall exploded view of the present invention;
fig. 4 is a top view of the interior of the present invention;
fig. 5 is a schematic view of a connection structure between the lower case and the upper case of the present invention;
in the figure: 1 a lower shell; 2. an upper housing; 3. inserting a limit column; 4. a sealing strip; 5. a waterproof ring; 6. a heat conductive sheet; 7. a heat dissipation module; 8. a transparent substrate; 9. a positive electrode lead; 10. a negative electrode lead; 11. an LED diode; 12. a waterproof groove; 13. a fixing hole; 14. a transparent glass sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
Referring to fig. 1-5, the utility model provides a diode packaging structure of a LED lamp, including a transparent substrate 8, a lower casing 1 is fixed on the outer side of the transparent substrate 8, the material of the lower casing 1 is plastic, four end corners of the upper surface of the lower casing 1 are all provided with fixing holes 13, the upper surface around the lower casing 1 is all provided with waterproof grooves 12, a waterproof ring 5 is fixed on the inner side of the lower casing 1, the material of the waterproof ring 5 is rubber, the lower casing 1 is connected with the waterproof ring 5 through hot melting, water can be effectively prevented from entering the device through the waterproof ring 5 to cause the device damage, and an upper casing 2 is fixed on the top end of the lower casing 1;
four end corners at the bottom end of the lower shell 1 are fixed with inserting limiting columns 3, the lower surface of the periphery of the lower shell 1 is fixed with sealing strips 4, the lower surface of each sealing strip 4 is provided with two convex blocks, the convex blocks are made of rubber, the inner side of the upper surface of the upper shell 2 is fixed with a transparent glass sheet 14, the lower shell 1 and the upper shell 2 are matched and fixed with fixing holes 13 through the inserting limiting columns 3, and the lower surface of each sealing strip 4 is tightly attached to the inner side of the waterproof groove 12 when the lower shell 1 and the upper shell 2 are fixed;
the lower surface of transparent substrate 8 is fixed with conducting strip 6, the lower surface of conducting strip 6 is fixed with heat radiation module 7, heat radiation module 7's material is copper, conducting strip 6 passes through welded connection with heat radiation module 7, can be with the heat effluvium that the device produced through conducting strip 6 and heat radiation module 7, the upper surface of transparent substrate 8 is fixed with LED diode 11, one side of LED diode 11 is fixed with anodal wire 9, the opposite side of LED diode 11 is fixed with negative pole wire 10.
The utility model discloses a theory of operation and use flow: the device is when the encapsulation, the spacing post 3 of grafting of 2 lower surface fixings of casing will go up aligns with the fixed orifices 13 that casing 1 upper surface was seted up down, later press down casing 2, make the spacing post 3 of grafting insert in the inside of fixed orifices 13, and go up casing 2 lower surface fixings's sealing strip 4 and the upper surface of casing 1 is hugged closely down, and the lug that sealing strip 4 lower surface set up laminates with the buckler 12 that casing 1 upper surface was seted up down, and inside the inboard fixed buckler 5 of casing can effectively prevent water entering device under the cooperation, and when the device used through the fixed conducting strip 6 and the thermal module 7 in transparent substrate 8 bottom, can dispel the heat to the device, the device makes the device have better water-proof effects through sealing strip 4 and the mutual cooperation of buckler 5.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.
Claims (8)
1. The utility model provides a LED lamp diode packaging structure, includes transparent substrate (8), its characterized in that: a lower shell (1) is fixed on the outer side of the transparent substrate (8), four end corners of the upper surface of the lower shell (1) are provided with fixing holes (13), the upper surface of the periphery of the lower shell (1) is provided with waterproof grooves (12), a waterproof ring (5) is fixed on the inner side of the lower shell (1), and an upper shell (2) is fixed on the top end of the lower shell (1);
four end corners of the bottom end of the lower shell (1) are fixed with inserting limiting columns (3), sealing strips (4) are fixed on the lower surface of the periphery of the lower shell (1), a transparent glass sheet (14) is fixed on the inner side of the upper surface of the upper shell (2), the lower shell (1) and the upper shell (2) are matched and fixed with fixing holes (13) through the inserting limiting columns (3), and when the lower shell (1) and the upper shell (2) are fixed, the lower surface of the sealing strips (4) is tightly attached to the inner side of the waterproof groove (12);
the LED lamp is characterized in that a heat conducting sheet (6) is fixed on the lower surface of the transparent substrate (8), a heat radiating module (7) is fixed on the lower surface of the heat conducting sheet (6), an LED diode (11) is fixed on the upper surface of the transparent substrate (8), an anode lead (9) is fixed on one side of the LED diode (11), and a cathode lead (10) is fixed on the other side of the LED diode (11).
2. The LED lamp diode packaging structure of claim 1, wherein: the lower surface of the sealing strip (4) is provided with two convex blocks.
3. The LED lamp diode packaging structure of claim 2, wherein: the lug is made of rubber.
4. The LED lamp diode packaging structure of claim 1, wherein: the waterproof ring (5) is made of rubber.
5. The LED lamp diode packaging structure of claim 1, wherein: the lower shell (1) is made of plastic.
6. The LED lamp diode packaging structure of claim 1, wherein: the lower shell (1) is connected with the waterproof ring (5) through hot melting.
7. The LED lamp diode packaging structure of claim 1, wherein: the heat conducting fins (6) are connected with the heat dissipation module (7) through welding.
8. The LED lamp diode packaging structure of claim 1, wherein: the heat dissipation module (7) is made of copper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922470192.3U CN211399397U (en) | 2019-12-31 | 2019-12-31 | LED lamp diode packaging structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922470192.3U CN211399397U (en) | 2019-12-31 | 2019-12-31 | LED lamp diode packaging structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211399397U true CN211399397U (en) | 2020-09-01 |
Family
ID=72209124
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922470192.3U Active CN211399397U (en) | 2019-12-31 | 2019-12-31 | LED lamp diode packaging structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211399397U (en) |
-
2019
- 2019-12-31 CN CN201922470192.3U patent/CN211399397U/en active Active
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