CN211475532U - Module type point light source with heat processor packaging structure - Google Patents
Module type point light source with heat processor packaging structure Download PDFInfo
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- CN211475532U CN211475532U CN201922413447.2U CN201922413447U CN211475532U CN 211475532 U CN211475532 U CN 211475532U CN 201922413447 U CN201922413447 U CN 201922413447U CN 211475532 U CN211475532 U CN 211475532U
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- heat dissipation
- cabin body
- point light
- light source
- housing
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Abstract
The utility model discloses a module type point light source with heat treatment device packaging structure, which belongs to the technical field of module type point light sources, and comprises a cabin body, a heat dissipation device, a lamp bead, a packaging layer and a housing, wherein the cabin body is a hollow structure, a power supply and a circuit board are arranged inside the cabin body, the lamp bead is arranged at the center of the upper surface of the cabin body, the packaging layer is arranged on the lamp bead, the housing is arranged outside the packaging layer, the housing is spherical, the bottom end surface is fixed on the upper surface of the cabin body, and the heat dissipation device is fixed on the lower surface of the cabin body; the heat dissipation device comprises a heat dissipation base, heat dissipation grooves and heat dissipation fins, wherein the heat dissipation grooves and the heat dissipation fins are arranged on the heat dissipation base, and the heat dissipation grooves are formed between every two heat dissipation fins, so that the heat dissipation efficiency is improved, the performance of the device is more stable, and the service life is prolonged.
Description
Technical Field
The utility model belongs to the technical field of module type pointolite, concretely relates to module type pointolite with thermal processor packaging structure.
Background
The module type point light source is a solid semiconductor device capable of converting electric energy into visible light, can directly convert electricity into light, is used as an indicating light source of instruments and meters at first, and is widely applied to traffic signal lamps and large-area display screens later, so that good economic benefits and social benefits are generated.
SUMMERY OF THE UTILITY MODEL
An object of the utility model is to provide a module type pointolite with thermal processor packaging structure to solve the not good problem of module type pointolite heat dissipation.
In order to achieve the above object, the utility model provides a following technical scheme: a module type point light source with a heat treatment device packaging structure comprises a cabin body, a heat dissipation device, lamp beads, a packaging layer and a housing, wherein the cabin body is of a hollow structure, a power supply and a circuit board card are arranged inside the cabin body, the lamp beads are arranged at the center of the upper surface of the cabin body, the packaging layer is arranged on the lamp beads, the housing is arranged outside the packaging layer, the housing is of a spherical shape, the bottom end surface of the housing is fixed on the upper surface of the cabin body, and the heat dissipation device is fixed on the lower surface of the;
the heat dissipation device comprises a heat dissipation base, heat dissipation grooves and heat dissipation fins, wherein the heat dissipation grooves and the heat dissipation fins are arranged on the heat dissipation base, the heat dissipation grooves are formed between every two heat dissipation fins, the cross section of each heat dissipation groove is U-shaped, the width of the bottom surface of each heat dissipation groove is smaller than that of the top surface of each heat dissipation groove, the width of the top surface of each heat dissipation groove is the same as that of each heat dissipation fin, and the thickness of the heat dissipation base is 1/5 of the height.
Preferably, the heat dissipation base is provided with a mounting hole, and the heat dissipation base is equally divided into a plurality of counter bores.
Preferably, the power supply, the circuit board card and the lamp beads are electrically connected.
Preferably, the encapsulation layer is a resin encapsulation layer.
Preferably, a reflecting cup is arranged inside the housing.
Preferably, the heat sink is made of any one of aluminum alloy and copper.
The utility model discloses a technological effect and advantage: according to the module type point light source with the heat processor packaging structure, the heat dissipation device comprises the heat dissipation base, the heat dissipation groove and the heat dissipation fins, the heat dissipation efficiency is improved, the performance of the device is more stable, and the service life is prolonged.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the heat dissipation device of the present invention.
In the figure: 1-cabin body, 2-heat dissipation device, 3-lamp bead, 4-packaging layer, 5-housing, 21-heat dissipation base, 22-heat dissipation groove and 23-heat dissipation sheet.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
The utility model provides a module type pointolite with heat treatment device packaging structure as shown in the figure, including cabin body 1, heat abstractor 2, lamp pearl 3, encapsulated layer 4 and housing 5, cabin body 1 is hollow structure, inside is equipped with power and circuit board, the power, circuit board and lamp pearl 3 all electric connection, cabin body 1 upper surface center is equipped with lamp pearl 3, lamp pearl 3 top is equipped with encapsulated layer 4, encapsulated layer 4 is the epoxy encapsulated layer, protection lamp pearl 3 does not corrode by the external world, prevent that moisture etc. from invading by the outside, the outside of encapsulated layer 4 is equipped with housing 5, housing 5 inside is equipped with the reflector cup, the astigmatic, dazzle light is reduced, the effect of illumination has been prolonged, housing 5 is the ball-type, the bottom end surface is fixed in the upper surface of cabin body 1, the lower surface of cabin body 1 is fixed with heat abstractor 2; the material of heat abstractor 2 is any one in aluminum alloy or copper, heat abstractor 2 includes heat dissipation base 21, radiating groove 22 and fin 23, be equipped with radiating groove 22 and fin 23 on the heat dissipation base 21, constitute radiating groove 22 between per two fin 23, the cross section of radiating groove 22 is the U-shaped, and the width of radiating groove 22 bottom surface is less than the width of radiating groove 22 top surface, the width of radiating groove 22 top surface is the same with the width of fin 23, the thickness of heat dissipation base 21 is the 1/5 of fin 23 height, be equipped with the mounting hole on the heat dissipation base 21, and heat dissipation base 21 equally divides and has had a plurality of counter bores, the radiating effect has been increased.
The working principle is as follows: this module type pointolite with heat treatment device packaging structure, 3 electric connection of lamp pearl, circuit board electric connection is to the power, 3 encapsulation layers of encapsulation epoxy of lamp pearl, and promote the spotlight effect with reflection of light cup, the circular telegram back, the heat that the light source produced transmits fin 23 and radiating groove 22 through heat dissipation base 21 on, the heat radiation goes to the air on every side, give off the heat through natural convection, the security and the reliability of device have been improved.
Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications and variations can be made in the embodiments or in part of the technical features of the embodiments without departing from the spirit and the scope of the invention.
Claims (6)
1. A module type point light source with a heat processor packaging structure is characterized in that: the novel multifunctional cabin comprises a cabin body (1), a heat dissipation device (2), lamp beads (3), an encapsulation layer (4) and a housing (5), wherein the cabin body (1) is of a hollow structure, a power supply and a circuit board card are arranged inside the cabin body (1), the lamp beads (3) are arranged at the center of the upper surface of the cabin body (1), the encapsulation layer (4) is arranged on the lamp beads (3), the housing (5) is arranged outside the encapsulation layer (4), the housing (5) is of a spherical shape, the bottom end surface of the housing is fixed on the upper surface of the cabin body (1), and the heat dissipation device (2) is fixed on the lower surface;
heat abstractor (2) is including heat dissipation base (21), radiating groove (22) and fin (23), be equipped with radiating groove (22) and fin (23) on heat dissipation base (21), constitute radiating groove (22) between per two fin (23), the cross section of radiating groove (22) is the U-shaped, and the width of radiating groove (22) bottom surface is less than the width of radiating groove (22) top surface, the width of radiating groove (22) top surface is the same with the width of fin (23), the thickness of heat dissipation base (21) is 1/5 of fin (23) height.
2. The modular point light source with a thermal processor package structure of claim 1, wherein: the heat dissipation base (21) is provided with a mounting hole, and the heat dissipation base (21) is equally divided into a plurality of counter bores.
3. The modular point light source with a thermal processor package structure of claim 1, wherein: the power supply, the circuit board card and the lamp beads (3) are electrically connected.
4. The modular point light source with a thermal processor package structure of claim 1, wherein: the packaging layer (4) is a resin packaging layer.
5. The modular point light source with a thermal processor package structure of claim 1, wherein: a reflecting cup is arranged in the housing (5).
6. The modular point light source with a thermal processor package structure of claim 1, wherein: the heat dissipation device (2) is made of any one of aluminum alloy or copper.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922413447.2U CN211475532U (en) | 2019-12-27 | 2019-12-27 | Module type point light source with heat processor packaging structure |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201922413447.2U CN211475532U (en) | 2019-12-27 | 2019-12-27 | Module type point light source with heat processor packaging structure |
Publications (1)
Publication Number | Publication Date |
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CN211475532U true CN211475532U (en) | 2020-09-11 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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CN201922413447.2U Active CN211475532U (en) | 2019-12-27 | 2019-12-27 | Module type point light source with heat processor packaging structure |
Country Status (1)
Country | Link |
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CN (1) | CN211475532U (en) |
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2019
- 2019-12-27 CN CN201922413447.2U patent/CN211475532U/en active Active
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