CN213479866U - SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure - Google Patents

SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure Download PDF

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CN213479866U
CN213479866U CN202022933179.XU CN202022933179U CN213479866U CN 213479866 U CN213479866 U CN 213479866U CN 202022933179 U CN202022933179 U CN 202022933179U CN 213479866 U CN213479866 U CN 213479866U
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wall
led lamp
layer
smd
recess
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吴浩
赖春生
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Foshan Leixin Photoelectric Technology Co ltd
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Foshan Leixin Photoelectric Technology Co ltd
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Abstract

The utility model discloses a structure of SMD LED lamp, which comprises a substrate, the top outer wall of base plate bonds there is the main part, the top outer wall of main part is opened flutedly, the top outer wall of base plate is provided with the lamp pearl, the lamp pearl is located inside the recess, the inside of recess is provided with the encapsulation and glues, the top outer wall of main part is provided with the inoxidizing coating, the inoxidizing coating includes the fluorescent layer, the top of fluorescent layer is provided with the wearing layer, the bottom outer wall of base plate is opened there is the mounting hole, the top of fluorescent layer is provided with the waterproof layer, and the waterproof layer is located the bottom of wearing layer, the inner wall of recess is provided with the reflector layer, and. The utility model discloses a main part and the recess that set up install the lamp pearl inside the frustum of cone type structure recess of main part to the encapsulation of filling electrically conductive silver glue and phosphor powder constitution to recess inside is glued, avoids the people to touch LED lamp surface for the maloperation, leads to the emergence of the LED lamp condition of scrapping.

Description

SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure
Technical Field
The utility model relates to a LED lamp technical field especially relates to the structure of SMD LED lamp.
Background
An LED lamp, also known as a light emitting diode, is a solid state semiconductor device capable of converting electrical energy into visible light, which can directly convert electricity into light. The heart of the LED is a semiconductor wafer, one end of the wafer is attached to a support, the other end of the wafer is a cathode, and the other end of the wafer is connected with an anode of a power supply, so that the whole wafer is packaged by epoxy resin.
The LED bulb in the prior art is designed to be exposed or protrude outwards, so that the LED lamp is easily damaged due to the fact that the surface of the LED lamp is touched by human misoperation in the using process, the heat dissipation effect of the LED lamp is poor, the LED lamp is damaged due to overheating, the waterproof effect of the LED lamp is poor, and the service life of the LED lamp is shortened due to the fact that the LED lamp is affected with damp. Therefore, it is desirable to design a structure of an SMD chip LED lamp to solve the above problems.
SUMMERY OF THE UTILITY MODEL
The utility model aims at solving the easy mistake that exists among the prior art and bumping damage, the radiating effect is poor, the poor shortcoming of water-proof effects, and the structure of the SMD LED lamp that proposes.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
the structure of SMD LED lamp comprises a substrate, the top outer wall of base plate bonds and has the main part, the top outer wall of main part is opened flutedly, the top outer wall of base plate is provided with the lamp pearl, the lamp pearl is located inside the recess, the inside of recess is provided with the encapsulation and glues, the top outer wall of main part is provided with the inoxidizing coating, the inoxidizing coating includes the fluorescent layer, the top of fluorescent layer is provided with the wearing layer, the bottom outer wall of base plate is opened there is the mounting hole.
Furthermore, a waterproof layer is arranged on the top of the fluorescent layer and is located at the bottom of the wear-resistant layer.
Furthermore, the inner wall of the groove is provided with a reflecting layer, and the structure of the groove is in a cone shape.
Furthermore, the outer wall of one side of main part integrated into one piece has evenly distributed's left fin, the outer wall of one side of main part integrated into one piece has evenly distributed's right fin.
Further, the bottom outer wall of main part is provided with the seal groove, seal glue is provided with in the seal groove.
Furthermore, the bottom of the lamp bead is provided with a pin, and the pin is welded with the substrate.
Further, a gap is reserved between every two adjacent left radiating fins, and a gap is reserved between every two adjacent right radiating fins.
The utility model has the advantages that:
1. through the main part and the recess that set up, install the lamp pearl inside the frustum of cone structure recess of main part to the inside encapsulation that fills conductive silver glue and phosphor powder and constitute of recess is glued, avoids the artificial maloperation to touch LED lamp surface, leads to the emergence of LED lamp disability condition.
2. Through the left radiating fin and the right radiating fin, the contact area between the main body and the air is increased by utilizing the left radiating fin and the right radiating fin, so that the heat generated by the LED lamp is effectively dissipated, the good heat dissipation effect of the LED lamp is realized, and the LED lamp is prevented from being damaged due to overheating.
3. Through the seal groove and the seal glue that set up, utilize sealed glue to seal between main part and the base plate for the phenomenon of intaking can not take place in the gap between main part and the base plate, consequently the waterproof performance of LED lamp that improves.
4. Through the inoxidizing coating that sets up, the inoxidizing coating comprises transparent fluorescent layer, waterproof layer and wearing layer for the LED lamp can send gorgeous light, and can also play holistic waterproof and wear-resisting effect, and then prolong the life of LED lamp.
5. Through the reflector layer that sets up, the reflector layer is the aluminium coating film layer, can reflect the outside of recess with the light that the LED lamp sent, reduces the light that the LED lamp sent and in the inside loss of recess for the luminance of LED lamp obtains increasing.
Drawings
Fig. 1 is a schematic view of an overall structure of a SMD surface mount LED lamp according to the present invention;
fig. 2 is a schematic sectional structure view of a structure of an SMD surface mount LED lamp according to the present invention;
fig. 3 is the utility model provides a A department of SMD LED lamp's structure enlarges the schematic diagram.
In the figure: the LED lamp comprises a substrate 1, a mounting hole 2, a main body 3, a groove 4, a lamp bead 5, a right radiating fin 6, a left radiating fin 7, a reflective layer 8, a sealing groove 9, a sealant 10, pins 11, a protective layer 12, a fluorescent layer 13, a waterproof layer 14, a wear-resistant layer 15 and a packaging adhesive 16.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When a component is referred to as being "connected" to another component, it can be directly connected to the other component or intervening components may also be present. When a component is referred to as being "disposed on" another component, it can be directly on the other component or intervening components may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
Referring to fig. 1-3, the structure of the SMD chip LED lamp includes a substrate 1, the substrate 1 is a PCD circuit board, a main body 3 is bonded to the top outer wall of the substrate 1, a groove 4 is formed on the top outer wall of the main body 3, the groove 4 is in an inverted frustum shape, a lamp bead 5 is disposed on the top outer wall of the substrate 1, the lamp bead 5 is a chip LED lamp, the lamp bead 5 is located inside the groove 4, an encapsulation adhesive 16 is disposed inside the groove 4, the encapsulation adhesive 16 is composed of conductive silver adhesive and fluorescent powder, a protection layer 12 is disposed on the top outer wall of the main body 3, the protection layer 12 is bonded to the main body 3 by using UV adhesive, the protection layer 12 has a light transmission effect, the protection layer 12 includes a fluorescent layer 13, the fluorescent layer 13 can add color to light emitted from the LED lamp, a wear-resistant layer 15 is disposed on the top of the fluorescent layer 13, the wear-resistant layer, the substrate 1 is conveniently fixed through the mounting hole 2.
Further, the top of fluorescent layer 13 is provided with waterproof layer 14, and waterproof layer 14 is located the bottom of wearing layer 15, utilizes waterproof layer 14 to improve the water-proof effects of lamp pearl 5 for lamp pearl 5 can not wet.
Further, the inner wall of the groove 4 is provided with a reflecting layer 8, the structure of the groove 4 is in a cone shape, the reflecting layer 8 is an aluminum coating layer, and the loss of light emitted by the LED lamp in the groove 4 is reduced.
Furthermore, the outer wall of one side of the main body 3 is integrally formed with a left radiating fin 7 which is uniformly distributed, the outer wall of one side of the main body 3 is integrally formed with a right radiating fin 6 which is uniformly distributed, and the contact area between the main body 3 and the air is increased by the left radiating fin 7 and the right radiating fin 6, so that heat generated by the LED lamp is effectively dissipated.
Further, the bottom outer wall of main part 3 is provided with seal groove 9, and seal groove 9 is inside to be provided with sealed glue 10, seals between main part 3 and the base plate 1 through sealed glue 10 for the gap between main part 3 and the base plate 1 can not intake water or air.
Further, the bottom of the lamp bead 5 is provided with a pin 11, and the pin 11 is welded with the substrate 1, so that the lamp bead 5 is electrically connected with the substrate 1.
Further, a gap is reserved between every two adjacent left radiating fins 7, a gap is reserved between every two adjacent right radiating fins 6, the thickness of each left radiating fin 7 and each right radiating fin 6 is 1mm, and the height of each gap is 2 mm.
The working principle is as follows: when in use, when the LED lamp needs to be assembled, the pins 11 of the lamp beads 5 are welded with the substrate 1, the main body 3 is bonded with the substrate 1, so that the lamp bead 5 is positioned at the center of the groove 4 on the main body 3, the sealing groove 9 at the periphery of the bottom of the main body 3 is encapsulated with the sealing glue 10, the groove 4 of the main body 3 is filled with the encapsulating glue 16 consisting of conductive silver glue and fluorescent powder, the protective layer 12 is bonded with the main body 3 through UV glue, the assembly of the LED lamp can be completed, and the packaging adhesive 16 consisting of the conductive silver adhesive and the fluorescent powder is filled in the groove 4, so that the lamp beads 5 are packaged in the grooves 4 to prevent the LED lamp from being damaged due to accidental collision, the contact area between the main body 1 and the air is increased by using the left radiating fin 7 and the right radiating fin 6, the heat generated by the LED lamp is effectively dissipated, and therefore the effect of good heat dissipation performance of the LED lamp is achieved.
The above, only be the concrete implementation of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art is in the technical scope of the present invention, according to the technical solution of the present invention and the utility model, the concept of which is equivalent to replace or change, should be covered within the protection scope of the present invention.

Claims (7)

  1. The structure of SMD paster type LED lamp comprises a substrate (1) and is characterized in that a main body (3) is bonded on the outer wall of the top of the substrate (1), a groove (4) is formed in the outer wall of the top of the main body (3), a lamp bead (5) is arranged on the outer wall of the top of the substrate (1), the lamp bead (5) is located inside the groove (4), an encapsulation adhesive (16) is arranged inside the groove (4), an protective layer (12) is arranged on the outer wall of the top of the main body (3), the protective layer (12) comprises a fluorescent layer (13), a wear-resistant layer (15) is arranged at the top of the fluorescent layer (13), and a mounting hole (2) is formed in the outer wall of the bottom of the substrate (1.
  2. 2. The structure of the SMD patch type LED lamp according to claim 1, characterized in that the top of said fluorescent layer (13) is provided with a waterproof layer (14), and the waterproof layer (14) is located at the bottom of the wear layer (15).
  3. 3. The structure of the SMD chip LED lamp as set forth in claim 1, wherein the inner wall of the recess (4) is provided with a reflective layer (8), and the structure of the recess (4) is a truncated cone shape.
  4. 4. The structure of the SMD patch type LED lamp according to claim 1, characterized in that said main body (3) has a uniformly distributed left heat dissipating fin (7) integrally formed on one side of the outer wall thereof, and said main body (3) has a uniformly distributed right heat dissipating fin (6) integrally formed on one side of the outer wall thereof.
  5. 5. The structure of the SMD LED lamp according to claim 1, characterized in that the bottom outer wall of said main body (3) is provided with a sealing groove (9), and a sealant (10) is arranged inside said sealing groove (9).
  6. 6. The structure of the SMD LED lamp according to claim 1, characterized in that the bottom of said lamp bead (5) is provided with a pin (11), and the pin (11) is welded with the substrate (1).
  7. 7. The structure of the SMD chip LED lamp as set forth in claim 4, wherein a gap is left between adjacent two of the left heat radiating fins (7), and a gap is left between adjacent two of the right heat radiating fins (6).
CN202022933179.XU 2020-12-09 2020-12-09 SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure Active CN213479866U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202022933179.XU CN213479866U (en) 2020-12-09 2020-12-09 SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202022933179.XU CN213479866U (en) 2020-12-09 2020-12-09 SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure

Publications (1)

Publication Number Publication Date
CN213479866U true CN213479866U (en) 2021-06-18

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Family Applications (1)

Application Number Title Priority Date Filing Date
CN202022933179.XU Active CN213479866U (en) 2020-12-09 2020-12-09 SMD (surface mounted device) patch type LED (light-emitting diode) lamp structure

Country Status (1)

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CN (1) CN213479866U (en)

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