CN210489650U

CN210489650U - Embedded LED diode

Info

Publication number: CN210489650U
Application number: CN201921702767.3U
Authority: CN
Inventors: 陈明裕
Original assignee: Shenzhen Yibangyu Photoelectric Co Ltd
Current assignee: Shenzhen Yibangyu Photoelectric Co Ltd
Priority date: 2019-10-12
Filing date: 2019-10-12
Publication date: 2020-05-08
Anticipated expiration: 2029-10-12

Abstract

The utility model discloses an embedded LED diode, which comprises a bottom plate, insulating ceramics and a heat dissipation unit, wherein the bottom plate is of a circular plate structure, a groove is arranged on the outer edge of the upper end of the bottom plate, the lower surface of the insulating ceramics is arranged on a first heat conduction silica gel layer, the heat dissipation unit comprises a heat dissipation plate, heat dissipation fins and liquid nitrogen, the heat dissipation plate is fixedly connected with the lower surface of the first heat conduction silica gel layer, a cavity is arranged in the middle of the heat dissipation plate, the liquid nitrogen is filled in the cavity of the heat dissipation plate, the heat dissipation fins are uniformly distributed on the upper surface of the heat dissipation plate, the embedded LED diode also comprises a light transmission cover, a second heat conduction silica gel layer, a chip and convex strips, the lower end of the light transmission cover is provided with the convex strips, the convex strips are spliced with the grooves of the bottom plate, the, the brightness is high, and resource waste is avoided.

Description

Embedded LED diode

Technical Field

The utility model relates to a diode technical field specifically is an embedded LED diode.

Background

The LED is a commonly used light-emitting device, releases energy through electron and hole recombination to emit light, is widely applied in the field of illumination, can efficiently convert electric energy into light energy, has wide application in modern society, such as illumination, flat panel display, medical devices and the like, is an LED lamp, adopts a solid semiconductor chip as a light-emitting material, has the advantages of energy conservation, environmental protection, good color rendering and response speed compared with the traditional lamp, belongs to a new generation of energy-saving illumination light source, belongs to a solid-state light-emitting body, has poor heat dissipation effect of the traditional embedded LED diode, is easy to influence the service life, has no light condensation structure, has low light utilization rate and poor brightness, and causes resource waste, so the embedded LED diode provided by the inventor solves the defects.

SUMMERY OF THE UTILITY MODEL

The to-be-solved technical problem of the utility model is to overcome current defect, provide an embedded LED diode, the radiating effect is good, improves life, is provided with spotlight structure, and light utilization rate is high, and luminance is high, avoids causing the wasting of resources, can effectively solve the problem in the background art.

In order to achieve the above object, the utility model provides a following technical scheme: an embedded LED comprises a bottom plate, insulating ceramics and a heat dissipation unit;

a bottom plate: the bottom plate is of a circular plate-shaped structure, and a groove is formed in the outer edge of the upper end of the bottom plate;

insulating ceramic: the lower surface of the insulating ceramic is arranged on the first heat-conducting silica gel layer;

a heat dissipation unit: the heat dissipation unit is arranged on the lower surface of the first heat conduction silica gel layer;

wherein: the LED lamp also comprises a light-transmitting cover, a second heat-conducting silica gel layer, a chip and convex strips, wherein the convex strips are arranged at the lower end of the light-transmitting cover and are inserted into the grooves of the base plate, the second heat-conducting silica gel layer is arranged on the upper surface of the insulating ceramic, the chip is arranged on the upper surface of the second heat-conducting silica gel layer, the input end of the chip is electrically connected with an external power supply, the insulating ceramic isolates the chip from the heat dissipation plate to prevent the heat dissipation plate from being electrified, the heat dissipation fins assist the heat dissipation of the heat dissipation plate to be diffused outwards to improve the heat dissipation effect, liquid nitrogen absorbs the temperature on the surface of the heat dissipation plate to further enhance the heat dissipation speed and prolong the service life of the embedded LED diode, the light rays at the lower end of the chip are gathered and reflected by the reflecting bowl to improve the light gathering, increase the radiating effect, sealed glue sets up in the lower extreme inboard of printing opacity cover, plays sealed effect to printing opacity cover and bottom plate, the sand grip is pegged graft with the recess of bottom plate, increases the fastness of encapsulation.

Further, the radiating unit includes heating panel, radiating fin and liquid nitrogen, heating panel fixed connection is in the lower surface on first heat conduction silica gel layer, the middle part of heating panel is provided with the cavity, and liquid nitrogen is filled in the cavity of heating panel, radiating fin evenly distributed is in the upper surface of heating panel, improves the radiating effect, prolongs embedded LED diode's life.

Furthermore, the LED lamp further comprises a light reflecting bowl which is of a frustum-shaped annular structure, the light reflecting bowl is fixedly connected with the upper surface of the heat dissipation plate, and the chip is located at a focus point of the light reflecting bowl, so that the light condensing performance is improved, and the brightness is increased.

Further, still include epoxy, epoxy sets up in the intrados of printing opacity cover, epoxy is honeycomb structure, increases the radiating effect.

Furthermore, the light-transmitting cover further comprises a sealant, wherein the sealant is arranged on the inner side of the lower end of the light-transmitting cover and is bonded with the upper surface of the bottom plate to play a sealing role.

Compared with the prior art, the beneficial effects of the utility model are that: the embedded LED diode has the following advantages:

1. insulating ceramic, keep apart chip and heating panel, prevent that the heating panel from being electrified, the heat of radiating fin auxiliary heat dissipation board is to external diffusion, improves the radiating effect, and liquid nitrogen absorbs the temperature on heating panel surface, further reinforcing radiating rate, the life of extension embedded LED diode, reflection bowl gathers together the reflection with the light of chip lower extreme, improves the spotlight nature, increases luminance, and epoxy is cellular structure, plays the supporting role to the printing opacity cover, gives the printing opacity cover external diffusion with the heat transfer simultaneously, increases the radiating effect, sealed glue sets up in the lower extreme inboard of printing opacity cover, plays sealed effect to printing opacity cover and bottom plate, the sand grip is pegged graft with the recess of bottom plate, increases the fastness of encapsulation.

Drawings

Fig. 1 is a schematic view of the sectional plane structure of the present invention.

In the figure: the LED lamp comprises a base plate 1, a light-transmitting cover 2, epoxy resin 3, a heat dissipation unit 4, a heat dissipation plate 41, a heat dissipation fin 42, liquid nitrogen 43, a first heat conduction silica gel layer 5, insulating ceramic 6, a second heat conduction silica gel layer 7, a chip 8, a light reflection bowl 9, convex strips 10 and sealant 11.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1, the present invention provides a technical solution: an embedded LED comprises a bottom plate 1, an insulating ceramic 6 and a heat dissipation unit 4;

bottom plate 1: the bottom plate 1 is a circular plate-shaped structure, and a groove is formed in the outer edge of the upper end of the bottom plate 1.

Insulating ceramic 6: the lower surface of the insulating ceramic 6 is arranged on the first heat conducting silica gel layer 5, and the insulating ceramic 6 plays an insulating role, so that the chip 8 is isolated from the heat dissipation plate 41, and the heat dissipation plate 41 is prevented from being electrified.

The heat dissipation unit 4: the heat dissipation unit 4 comprises a heat dissipation plate 41, heat dissipation fins 42 and liquid nitrogen 43, the heat dissipation plate 41 is fixedly connected to the lower surface of the first heat conduction silica gel layer 5, a cavity is formed in the middle of the heat dissipation plate 41, the liquid nitrogen 43 is filled in the cavity of the heat dissipation plate 41, the heat dissipation fins 42 are uniformly distributed on the upper surface of the heat dissipation plate 41, the heat of the heat dissipation plate 41 is assisted by the heat dissipation fins 42 to be diffused to the outside, the heat dissipation effect is improved, the liquid nitrogen 43 absorbs the temperature on the surface of the heat dissipation plate 41, the heat dissipation speed is further improved, and the.

Wherein: still include reflector 9, epoxy 3 and sealed glue 11, reflector 9 is the cyclic annular structure of frustum type, reflector 9 is connected with the upper surface fixed of heating panel 41, chip 8 is located reflector 9's focus point, reflector 9 gathers together the reflection with the light of chip 8 lower extreme, improve the spotlight nature, increase luminance, epoxy 3 sets up in the interior cambered surface of printing opacity cover 2, epoxy 3 is cellular structure, play the supporting role to printing opacity cover 2, transmit the heat for printing opacity cover 2 to outside diffusion simultaneously, increase the radiating effect, sealed glue 11 sets up in the lower extreme of printing opacity cover 2 inboard, sealed glue 11 bonds with the upper surface of bottom plate 1, play sealed effect.

Wherein: still include printing opacity cover 2, second heat conduction silica gel layer 7, chip 8 and sand grip 10, the lower extreme of printing opacity cover 2 is provided with sand grip 10, and sand grip 10 is pegged graft with the recess of bottom plate 1, increases the fastness of encapsulation, and second heat conduction silica gel layer 7 sets up in insulating ceramic 6's upper surface, and chip 8 sets up in the upper surface of second heat conduction silica gel layer 7, and external power source is connected to chip 8's input electricity.

When in use: insulating ceramic 6 keeps apart chip 8 and heating panel 41, prevent that heating panel 41 from being electrified, radiating fin 42 assists the heat of heating panel 41 to spread to the outside, the radiating effect is improved, liquid nitrogen 43 absorbs the heat on heating panel 41 surface, further strengthen the radiating rate, prolong the life of embedded LED diode, reflection bowl 9 gathers together the reflection with the light of chip 8 lower extreme, improve the light concentration, increase luminance, epoxy 3 is honeycomb structure, play the supporting role to printing opacity cover 2, transmit the heat for printing opacity cover 2 to spread to the outside simultaneously, increase the radiating effect, sealed glue 11 sets up in the lower extreme inboard of printing opacity cover 2, play sealed effect to printing opacity cover 2 and bottom plate 1, sand grip 10 pegs graft with the recess of bottom plate 1, increase the fastness of encapsulation.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. An embedded LED diode, characterized by: comprises a bottom plate (1), insulating ceramics (6) and a heat dissipation unit (4); base plate (1): the bottom plate (1) is of a circular plate-shaped structure, and a groove is formed in the outer edge of the upper end of the bottom plate (1);

insulating ceramic (6): the lower surface of the insulating ceramic (6) is arranged on the first heat-conducting silica gel layer (5); heat dissipation unit (4): the heat dissipation unit (4) is arranged on the lower surface of the first heat conduction silica gel layer (5); wherein: still include printing opacity cover (2), second heat conduction silica gel layer (7), chip (8) and sand grip (10), the lower extreme of printing opacity cover (2) is provided with sand grip (10), sand grip (10) are pegged graft with the recess of bottom plate (1), second heat conduction silica gel layer (7) set up in the upper surface of insulating ceramics (6), chip (8) set up in the upper surface of second heat conduction silica gel layer (7), external power source is connected to the input electricity of chip (8).

2. An embedded LED diode according to claim 1, wherein: radiating unit (4) include heating panel (41), radiating fin (42) and liquid nitrogen (43), heating panel (41) fixed connection is in the lower surface of first heat conduction silica gel layer (5), the middle part of heating panel (41) is provided with the cavity, and liquid nitrogen (43) are filled in the cavity of heating panel (41), radiating fin (42) evenly distributed is in the upper surface of heating panel (41).

3. An embedded LED diode according to claim 2, wherein: still include reflector (9), reflector (9) are the annular structure of frustum type, reflector (9) are connected with the upper surface fixed of heating panel (41), chip (8) are located the focus of reflector (9).

4. An embedded LED diode according to claim 1, wherein: still include epoxy (3), epoxy (3) set up in the intrados of printing opacity cover (2), epoxy (3) are honeycomb structure.

5. An embedded LED diode according to claim 1, wherein: the light-transmitting cover is characterized by further comprising a sealant (11), wherein the sealant (11) is arranged on the inner side of the lower end of the light-transmitting cover (2), and the sealant (11) is bonded with the upper surface of the bottom plate (1).