WO2009049526A1 - White light emitting diode - Google Patents

White light emitting diode Download PDF

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Publication number
WO2009049526A1
WO2009049526A1 PCT/CN2008/072591 CN2008072591W WO2009049526A1 WO 2009049526 A1 WO2009049526 A1 WO 2009049526A1 CN 2008072591 W CN2008072591 W CN 2008072591W WO 2009049526 A1 WO2009049526 A1 WO 2009049526A1
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WO
WIPO (PCT)
Prior art keywords
transparent
blue
emitting diode
light
violet
Prior art date
Application number
PCT/CN2008/072591
Other languages
French (fr)
Chinese (zh)
Inventor
Ze Chen
Original Assignee
Ze Chen
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Publication date
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Publication of WO2009049526A1 publication Critical patent/WO2009049526A1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
    • H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/50—Wavelength conversion elements
    • H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
    • H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
    • H01L33/483—Containers

Definitions

  • the present invention relates to a light emitting diode (LED), and more particularly to a white light emitting diode.
  • LED light emitting diode
  • the existing white light emitting diode (LED) which converts blue light or violet light into white light is an electrode holder, a chip and a bracket made of a solid epoxy resin shell, an LED blue light or a violet light chip, a light emitting diode chip supporting the two electrodes and an epoxy resin insulator.
  • the connecting wire is composed of a fluorescent color powder coating coated on the light emitting end of the blue or violet chip and covering the chip.
  • the transparent transparent light-transmissive shell and the LED bracket and other devices are subjected to gapless potting, because the fluorescent color-changing powder coating is applied on the light-emitting end of the chip to cover the chip without gaps, and the blue or purple light and the fluorescent color-changing powder emitted by the chip are used.
  • the emitted light complements to form white light.
  • the existing white LEDs due to the continuous improvement of the power of the chip, the luminous intensity is continuously enhanced, and the heat conduction and heat dissipation problem of the chip itself has been prominent, and the chip is covered in the fluorescent color powder coating by the gapless cover.
  • the outer heat dissipation channel is blocked to deteriorate the heat conduction and heat conduction condition of the chip, and the transparent outer casing is encapsulated with epoxy resin.
  • UV ultraviolet irradiation
  • the luminescence intensity is continuously weakened due to the generation of light decay. (There is data showing that the white LED has a light decay of 35% when used in 4000 hours due to UV action), so it is necessary to make further improvements to the above white LED.
  • the object of the present invention is to adopt a new white light forming technical scheme for a white light emitting diode which is mainly used for converting blue light or violet light into white light, and provide a production process which is basically the same as the production process of the existing miniature light bulb, and is more sure.
  • New manufacturing technology for improving the thermal conductivity of the chip, eliminating the defect that the current product is susceptible to aging under the action of UV, and converting the blue or violet light into a white light-emitting diode, while reducing the manufacturing process.
  • the white light emitting diode which the blue light or the violet light which I invented is converted into white light has a hollow transparent transparent shell, and the LED electrode holder adopts a physical composite material, and the reflective anode of the LED negative electrode is provided with a reflective coating, and the chip is connected with the bracket electrode. Line and phosphor powder coating.
  • the blue-emitting or violet-emitting LED chip is completely contained in the concave surface of the transparent light-transmitting outer casing, and the LED chip emitting light blue or violet light is mounted in the negative electrode boss of the electrode holder, and the chip and the bracket electrode connecting line will be
  • the positive and negative electrodes of the LED chip emitting blue or violet light in the light emitting diode are connected to the positive and negative electrodes of the physical composite material support, and the phosphor color changing coating is uniformly applied to the concave surface of the transparent light transmissive outer casing.
  • the transparent light-transmissive outer casing is made of glass, and may be made of other transparent and transparent chemical materials.
  • the invention is produced by the following method: firstly placing the LED physical composite material electrode holder on the solid crystal dispensing machine, uniformly applying the silver glue to the boss pit of the bracket, and then using the clamp to emit blue or violet light. After the LED chip is expanded and the crystal grains are opened, the crystal grains are placed on the surface of the silver paste of the pit pits, and the wire bonding connection between the two electrodes on the chip and the external electrode of the bracket is realized on the wire bonding machine (ultrasonic bonding) , then the hollow insulation is transparent
  • the light-transmissive outer casing is placed on a coating machine, and the concave or convex portion of the hollow transparent transparent outer casing is uniformly coated with the blue-light or violet light-emitting portion of the blue or violet light-emitting portion, and the fluorescent color-changing powder is evenly coated and dried.
  • the light-emitting diode electrode holder for realizing the solid-crystal wire bonding and the transparent transparent transparent light-transmitting outer casing are automatically assembled and sealed by a glue injection machine or a sealing machine to complete the production of the white light-emitting diode of the present invention.
  • the hollow transparent light-transmissive outer casing may be glass, but may also be made of other transparent light-transmissive chemical materials.
  • the use of a glass casing is preferred because the glass's UV resistance is much superior to other transparent light-transmissive materials.
  • the invention has the beneficial effects that: the fluorescent color change powder coating is the concave surface of the transparent insulating shell to be coated, so that the LED chip which no longer contains the blue or violet light without gaps is improved.
  • the heat dissipation condition of the chip and the high heat transfer material of the physical composite material support, the heat generated by the chip light is quickly transmitted to the outside of the casing, so that the LED chip emitting blue or violet light is prolonged under the premise of the same power, and the light is emitted.
  • the strength is improved.
  • the transparent light-transmissive casing is made of glass, and the reflective separator surface is provided with a reflective layer to make the inner cavity into a vacuum state, the blue-emitting or violet-emitting LED chip works better, and the phosphor is less likely to be oxidized and aged. Therefore, its life will increase and the luminous intensity will increase.
  • FIG. 1 is a structural view of a white light emitting diode in an embodiment.
  • the white light emitting diode in this embodiment is an LED electrode holder 1 made of a physical composite material, an insulating separator bead with a reflective coating, a transparent transparent shell 3, a fluorescent color changing powder 4, a chip and a support electrode connection line 5, a blue or violet LED chip 6, a reflective and thermal conductive coating 7, a silver paste 8, the blue or violet LED chip 6 is placed on the surface of the silver paste 8, that is, blue or violet light
  • the LED chip 6 is placed at the center of the lens of the transparent light transmissive housing 3.
  • the chip and the bracket electrode connection line 5 are respectively ultrasonically connected to the positive and negative columns of the LED physical composite electrode holder 1 and the positive and negative electrodes of the chip, and the insulating separation beads 2 with the reflective coating are insulated to separate the two external lead leads.
  • the light emitted from the LED chip 6 emitting blue or violet light is reflected to the light emitting end.
  • the concave surface of the scattered light portion of the transparent light-transmissive casing 3 is completely contained by the fluorescent color powder 4, that is, the blue or purple light emitted by the blue-emitting or violet-emitting LED chip 6 must be complemented by the fluorescent color-changing powder 3 coating. White light then scatters outward.
  • the hollow transparent transparent shell 3 coated with the fluorescent color changing powder on the concave surface is covered on the white LED semi-finished product prepared by the physical composite material electrode holder and equipped with the LED chip 6 emitting blue or violet light and performing electrode connection. After the fixing is carried out, the manufacture of the white LED product of the present invention is achieved.
  • the surface of the land recess is provided with a reflective and thermally conductive coating 7.
  • the transparent transparent outer casing 3 may be an epoxy resin outer casing, and the insulating separation beads with the reflective coating are glass beads. If the transparent light-transmissive casing 3 is made of glass, and the insulating separator bead 2 is coated with a reflective coating, the defect of aging and blackening of the casing under the action of UV and the output efficiency of the light emitted by the chip are further improved. It is more conducive to the use of the product outdoors to form a new embodiment.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Power Engineering (AREA)
  • Led Device Packages (AREA)

Abstract

A white light emitting diode, which comprises: an electrode bracket (1) made of physical composite material, a insulate spacer ball (2), a transparent cap (3), a LED die (6) for emitting blue or violet light, Ag glue (8) for adhering the LED die (6) in the cup on the upper portion of the electrode bracket (1) and a connecting wire (5) for connection of the LED die (6) and the electrode bracket (1). The white light emitting diode is characterized in that: the fluorescent powder layer (4) is coated on the inner surface of the transparent cap (3), the fluorescent powder layer (4) makes the blue or violet light emitted from the LED die (6) complemented with the light emitted by the fluorescent powder to form the white light. Furthermore, the transparent cap (3) is made of glass and the surface of insulate spacer ball (2) is coated with a reflective layer (7).

Description

白光发光二极管 技术领域：  White light emitting diodes
本发明涉及一种发光二极管 （LED), 尤其是一种发白光的发光 二极管。  The present invention relates to a light emitting diode (LED), and more particularly to a white light emitting diode.
背景技术： Background technique:
现有的蓝光或紫光转变成白光的白光发光二极管（LED)是由实 体环氧树脂外壳， LED 蓝光或紫光芯片、 支承发光二极管芯片并由 环氧树脂绝缘体连接两电极的电极支架、芯片与支架连接线和涂敷在 蓝色或紫光芯片光线射出端并罩住芯片的荧光变色粉涂层组成。实体 透明透光外壳与 LED支架及其他器件实行无间隙灌封， 由于荧光变 色粉涂层涂敷在芯片光线射出端无间隙罩住芯片、使芯片发出的蓝色 或紫色光与荧光变色粉所发出的光互补形成白光。 就现有白光 LED 来说、 由于芯片功率的不断提高， 发光强度不断增强， 芯片本身的导 热散热问题已经十分突出，再加上芯片被无间隙罩在荧光变色粉涂层 中、 由壳头向外的散热通道被阻隔使芯片的散热导热条件变坏， 并且 透明外壳采用环氧树脂灌封后， 在绝大多数的户外使用条件下， 受紫 外线照射（UV)作用易老化发黑使白光 LED由于产生光衰， 发光强 度不断减弱。 （有资料显示白光 LED 由于 UV作用， 在使用在 4000 小时时光衰达到 35%) ， 因此， 有待于对上述白光 LED作更进一歩 的改进。  The existing white light emitting diode (LED) which converts blue light or violet light into white light is an electrode holder, a chip and a bracket made of a solid epoxy resin shell, an LED blue light or a violet light chip, a light emitting diode chip supporting the two electrodes and an epoxy resin insulator. The connecting wire is composed of a fluorescent color powder coating coated on the light emitting end of the blue or violet chip and covering the chip. The transparent transparent light-transmissive shell and the LED bracket and other devices are subjected to gapless potting, because the fluorescent color-changing powder coating is applied on the light-emitting end of the chip to cover the chip without gaps, and the blue or purple light and the fluorescent color-changing powder emitted by the chip are used. The emitted light complements to form white light. As for the existing white LEDs, due to the continuous improvement of the power of the chip, the luminous intensity is continuously enhanced, and the heat conduction and heat dissipation problem of the chip itself has been prominent, and the chip is covered in the fluorescent color powder coating by the gapless cover. The outer heat dissipation channel is blocked to deteriorate the heat conduction and heat conduction condition of the chip, and the transparent outer casing is encapsulated with epoxy resin. Under most outdoor use conditions, it is easily aging and blackened by ultraviolet irradiation (UV) to make white LED The luminescence intensity is continuously weakened due to the generation of light decay. (There is data showing that the white LED has a light decay of 35% when used in 4000 hours due to UV action), so it is necessary to make further improvements to the above white LED.
发明内容： 本发明的目地， 是对目前主要采用的蓝光或紫光转变成白光的白 光发光二极管采用全新的白光形成技术方案，提供与现有微型灯泡的 生产流程基本相同的一种生产工艺成熟， 更能确保产品质量， 改善芯 片导热条件、消除目前产品在 UV作用下环氧树脂壳体易老化的缺陷 的新的蓝光或紫光转变成白光的白光发光二极管的新的制造技术，同 时通过制造流程的简化降低产品制作成本。 Summary of the invention: The object of the present invention is to adopt a new white light forming technical scheme for a white light emitting diode which is mainly used for converting blue light or violet light into white light, and provide a production process which is basically the same as the production process of the existing miniature light bulb, and is more sure. New manufacturing technology for improving the thermal conductivity of the chip, eliminating the defect that the current product is susceptible to aging under the action of UV, and converting the blue or violet light into a white light-emitting diode, while reducing the manufacturing process. Product manufacturing costs.
本人发明的蓝光或紫光转变成白光的白光发光二极管，具有空心 透明透光外壳， LED 电极支架采用物理复合材料， 该支架制作的发 光二极管负极凸台凹坑内设置反光涂层，芯片与支架电极连接线和荧 光粉变色粉涂层。 所述发蓝光或紫光的 LED芯片被完全包容在透明 透光外壳的内凹面内， 发光二极管发蓝光或紫光的 LED芯片被安装 在电极支架负极凸台凹坑内，由芯片与支架电极连接线将发光二极管 内发蓝光或紫光的 LED芯片的正负极连接到物理复合材料支架的正 极和负极上，荧光粉变色涂层被均匀地涂敷到透明透光外壳的内凹表 面上。  The white light emitting diode which the blue light or the violet light which I invented is converted into white light has a hollow transparent transparent shell, and the LED electrode holder adopts a physical composite material, and the reflective anode of the LED negative electrode is provided with a reflective coating, and the chip is connected with the bracket electrode. Line and phosphor powder coating. The blue-emitting or violet-emitting LED chip is completely contained in the concave surface of the transparent light-transmitting outer casing, and the LED chip emitting light blue or violet light is mounted in the negative electrode boss of the electrode holder, and the chip and the bracket electrode connecting line will be The positive and negative electrodes of the LED chip emitting blue or violet light in the light emitting diode are connected to the positive and negative electrodes of the physical composite material support, and the phosphor color changing coating is uniformly applied to the concave surface of the transparent light transmissive outer casing.
在本发明中， 所述透明透光外壳采用玻璃制作， 也可以采用其 他透明透光的化工原料制作。  In the present invention, the transparent light-transmissive outer casing is made of glass, and may be made of other transparent and transparent chemical materials.
本发明的制作， 通过下面方式实现， 先将发光二极管物理复合 材料电极支架放置于固晶点胶机上，将银胶均匀地涂敷于支架的凸台 凹坑内， 再用夹具将发蓝光或紫光的 LED芯片膨胀拉开晶粒后， 将 晶粒置于凸台凹坑的银胶表面实施布晶，在打线机上实现芯片上两电 极与支架外引电极的打线连接 （超声波悍接）， 再将空心绝缘的透明 透光外壳置于一涂敷机上，将空心透明透光外壳的内凹面包容所有发 蓝光或紫光的 LED芯片发出的蓝光或紫光部份均匀地涂敷上荧光变 色粉并烘干，最后将已实现固晶打线的发光二极管电极支架与透明绝 缘的透明透光外壳， 通过注胶机或封管机实施自动化组装封接， 从而 完成本发明的白光发光二极管的制作。 The invention is produced by the following method: firstly placing the LED physical composite material electrode holder on the solid crystal dispensing machine, uniformly applying the silver glue to the boss pit of the bracket, and then using the clamp to emit blue or violet light. After the LED chip is expanded and the crystal grains are opened, the crystal grains are placed on the surface of the silver paste of the pit pits, and the wire bonding connection between the two electrodes on the chip and the external electrode of the bracket is realized on the wire bonding machine (ultrasonic bonding) , then the hollow insulation is transparent The light-transmissive outer casing is placed on a coating machine, and the concave or convex portion of the hollow transparent transparent outer casing is uniformly coated with the blue-light or violet light-emitting portion of the blue or violet light-emitting portion, and the fluorescent color-changing powder is evenly coated and dried. The light-emitting diode electrode holder for realizing the solid-crystal wire bonding and the transparent transparent transparent light-transmitting outer casing are automatically assembled and sealed by a glue injection machine or a sealing machine to complete the production of the white light-emitting diode of the present invention.
本发明中， 所述的空心透明透光外壳可以是玻璃， 但也可以用其 他透明透光化工材料制作。采用玻璃壳体为最佳， 因玻璃的抗 UV能 力远优于其他透明透光材料。  In the present invention, the hollow transparent light-transmissive outer casing may be glass, but may also be made of other transparent light-transmissive chemical materials. The use of a glass casing is preferred because the glass's UV resistance is much superior to other transparent light-transmissive materials.
与现有的同类产品相比较， 本发明的有益效果在于： 荧光变色 粉涂层由于是被涂敷的透明绝缘外壳的内凹面上， 因此， 不再无间隙 包容发蓝光或紫光的 LED芯片改善了芯片的散热条件， 并通过物理 复合材料支架的高传热材料，将芯片发光时产生的热量迅速传递到壳 体外， 使发蓝光或紫光的 LED芯片在相同功率的前提下寿命得到延 长， 发光强度得到提高。如果透明透光外壳再采用玻璃制作， 并且绝 缘分隔珠表面设置反光层将内腔制成真空状态， 则发蓝光或紫光的 LED 芯片的工作状态更佳， 荧光粉被氧化老化的可能性更小， 因此 其寿命将提高， 同时发光强度也随之增强。  Compared with the existing similar products, the invention has the beneficial effects that: the fluorescent color change powder coating is the concave surface of the transparent insulating shell to be coated, so that the LED chip which no longer contains the blue or violet light without gaps is improved. The heat dissipation condition of the chip and the high heat transfer material of the physical composite material support, the heat generated by the chip light is quickly transmitted to the outside of the casing, so that the LED chip emitting blue or violet light is prolonged under the premise of the same power, and the light is emitted. The strength is improved. If the transparent light-transmissive casing is made of glass, and the reflective separator surface is provided with a reflective layer to make the inner cavity into a vacuum state, the blue-emitting or violet-emitting LED chip works better, and the phosphor is less likely to be oxidized and aged. Therefore, its life will increase and the luminous intensity will increase.
本发明的内容结合以下实施例作更进一歩的说明， 但本发明的 内容不仅限于实施例涉及的内容。  The content of the present invention will be further described in conjunction with the following embodiments, but the contents of the present invention are not limited to the contents of the embodiments.
附图说明： BRIEF DESCRIPTION OF THE DRAWINGS:
图 1是实施例中白光发光二极管的结构图。  1 is a structural view of a white light emitting diode in an embodiment.
具体实施方式： 如图 1所示，本实施例中的白光发光二极管是由物理复合材料制 成的 LED电极支架 1，带反光涂层的绝缘分隔珠 2、透明透光外壳 3、 荧光变色粉 4、 芯片与支架电极连接线 5， 发蓝光或紫光的 LED芯片 6， 反光和导热涂层 7， 银胶 8， 所述发蓝光或紫光的 LED芯片 6被 置于银胶 8的表面， 即发蓝光或紫光的 LED芯片 6被置于透明透光 外壳 3透镜的中心部位。芯片与支架电极连接线 5分别被超声波悍接 于 LED物理复合材料电极支架 1的正负极柱和芯片正负极上， 带反 光涂层的绝缘分隔珠 2起绝缘分隔两外引电极引线的作用，同时将发 蓝光或紫光的 LED芯片 6发出的射向反向的光线反射到光射出端。 透明透光外壳 3的散射光部份的内凹面被荧光变色粉 4完全包容，即 由发蓝光或紫光的 LED芯片 6所发出的蓝或紫色光， 必须穿过荧光 变色粉 3涂层互补成白光后向外散射。即用凹面涂敷有荧光变色粉涂 层后的空心透明透光外壳 3， 罩到物理复合材料电极支架制成的装有 发蓝光或紫光的 LED芯片 6并实施电极连接的白光 LED半成品上， 并实施固定后就实现了本发明的白光 LED产品的制造。 Detailed ways: As shown in FIG. 1, the white light emitting diode in this embodiment is an LED electrode holder 1 made of a physical composite material, an insulating separator bead with a reflective coating, a transparent transparent shell 3, a fluorescent color changing powder 4, a chip and a support electrode connection line 5, a blue or violet LED chip 6, a reflective and thermal conductive coating 7, a silver paste 8, the blue or violet LED chip 6 is placed on the surface of the silver paste 8, that is, blue or violet light The LED chip 6 is placed at the center of the lens of the transparent light transmissive housing 3. The chip and the bracket electrode connection line 5 are respectively ultrasonically connected to the positive and negative columns of the LED physical composite electrode holder 1 and the positive and negative electrodes of the chip, and the insulating separation beads 2 with the reflective coating are insulated to separate the two external lead leads. At the same time, the light emitted from the LED chip 6 emitting blue or violet light is reflected to the light emitting end. The concave surface of the scattered light portion of the transparent light-transmissive casing 3 is completely contained by the fluorescent color powder 4, that is, the blue or purple light emitted by the blue-emitting or violet-emitting LED chip 6 must be complemented by the fluorescent color-changing powder 3 coating. White light then scatters outward. That is, the hollow transparent transparent shell 3 coated with the fluorescent color changing powder on the concave surface is covered on the white LED semi-finished product prepared by the physical composite material electrode holder and equipped with the LED chip 6 emitting blue or violet light and performing electrode connection. After the fixing is carried out, the manufacture of the white LED product of the present invention is achieved.
本实施例中， 凸台凹坑的表面设置反光和导热涂层 7。  In this embodiment, the surface of the land recess is provided with a reflective and thermally conductive coating 7.
在本实施例中， 上述透明透光外壳 3可以是环氧树脂外壳， 上述带反 光涂层的绝缘分隔珠为玻璃珠。如果透明透光外壳 3由玻璃制成， 并 且绝缘分隔珠 2外涂设置反光涂层，则进一歩解决在 UV作用下壳体 易老化发黑的缺陷和芯片发出的光的输出効率进一歩提高，更利于产 品在户外使用从而构成新的实施例。 In this embodiment, the transparent transparent outer casing 3 may be an epoxy resin outer casing, and the insulating separation beads with the reflective coating are glass beads. If the transparent light-transmissive casing 3 is made of glass, and the insulating separator bead 2 is coated with a reflective coating, the defect of aging and blackening of the casing under the action of UV and the output efficiency of the light emitted by the chip are further improved. It is more conducive to the use of the product outdoors to form a new embodiment.

Claims

1、 一种白光发光二极管， 具有物理复合材料电极支架， 芯片与 支架电极连接线， 透明透光外壳， 发蓝光或紫光的 LED芯片， 带反 光涂层的绝缘分隔珠、 荧光粉变色粉涂层， 其特征是： 荧光粉被均匀 地涂敷在透明透光外壳的内凹面上， 并且由发蓝光或紫光的 LED芯 片发出的蓝光或紫光被完全包容在荧光粉变色粉涂层内。  1. A white light emitting diode, having a physical composite electrode holder, a chip and a bracket electrode connection line, a transparent transparent shell, a blue or violet LED chip, an insulating separation bead with a reflective coating, and a phosphor powder coating The feature is: the phosphor is uniformly coated on the concave surface of the transparent light-transmitting casing, and the blue or violet light emitted by the blue-emitting or violet-emitting LED chip is completely contained in the phosphor powder coating.
2、 如权利要求 1所述的白光发光二极管， 其特征是： 所述透明 透光外壳是玻璃外壳。  2. A white light emitting diode according to claim 1, wherein: said transparent light transmissive housing is a glass outer casing.
3、 如权利要求 1所述的白光发光二极管， 其特征是： 所述绝缘分 隔珠外表面设置有反光涂层。  3. The white light emitting diode according to claim 1, wherein: the outer surface of the insulating spacer bead is provided with a reflective coating.
4、 一种制造权利要求 1所述白光发光二极管的方法， 包含以下歩骤： a、 首先将发光二极管物理复合材料电极支架放置于固晶点胶机 上， 将银胶均匀地涂敷于支架的凸台凹坑内；  4. A method of manufacturing the white light emitting diode of claim 1, comprising the steps of: a. first placing a light-emitting diode physical composite electrode holder on a solid-state dispenser, and uniformly applying the silver paste to the holder. Inside the boss pit;
b、 再用夹具将蓝光或紫光芯片膨胀拉开晶粒后， 将晶粒置于凸 台凹坑的银胶表面实施布晶，在打线机上实现芯片上两电极与支架外 引电极的打线连接；  b. After the blue or violet chip is expanded and opened by the jig, the die is placed on the surface of the silver paste of the pit pit, and the two electrodes on the chip and the external electrode of the bracket are realized on the wire bonding machine. Line connection
c、 再将空心透明绝缘壳置于涂敷机上， 将空心透明透光外壳的 内凹面包容所有发蓝光或紫光的 LED芯片发出的蓝光或紫光部份均 匀地涂敷上荧光变色粉并烘干；  c. The hollow transparent insulating shell is placed on the applicator, and the blue or violet portion of the hollow transparent transparent light-transmissive shell is uniformly coated with the blue-light or violet LED chip and the fluorescent color-changing powder is uniformly coated and dried. ;
d、 将已实现固晶打线的发光二极管电极支架与透明透光外壳， 通过注胶机或封管机实施自动化组装封接，从而完成白光发光二极管的  d. The LED electrode holder and the transparent transparent housing that have been solid-bonded are automatically assembled and sealed by a glue injection machine or a sealing machine to complete the white light emitting diode.
PCT/CN2008/072591 2007-10-08 2008-09-28 White light emitting diode WO2009049526A1 (en)

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CN101140973A (en) * 2007-10-08 2008-03-12 陈泽 White light luminous diode
CN101964384A (en) * 2010-08-19 2011-02-02 深圳市佳比泰电子科技有限公司 Method for coating LED fluorescent powder
CN102606919A (en) * 2012-03-02 2012-07-25 李建营 Method for improving luminance of LED tube and high-luminance LED tube
CN104409606A (en) * 2014-12-09 2015-03-11 苏州科利亚照明科技有限公司 Light-emitting device

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