CN104282831B - A kind of LED encapsulation structure and packaging technology - Google Patents
A kind of LED encapsulation structure and packaging technology Download PDFInfo
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- CN104282831B CN104282831B CN201410493102.1A CN201410493102A CN104282831B CN 104282831 B CN104282831 B CN 104282831B CN 201410493102 A CN201410493102 A CN 201410493102A CN 104282831 B CN104282831 B CN 104282831B
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- 238000012536 packaging technology Methods 0.000 title claims 2
- 238000005538 encapsulation Methods 0.000 title 1
- 239000000758 substrate Substances 0.000 claims abstract description 54
- 229910000679 solder Inorganic materials 0.000 claims abstract description 44
- 239000003292 glue Substances 0.000 claims abstract description 25
- 239000002184 metal Substances 0.000 claims abstract description 17
- 229910052751 metal Inorganic materials 0.000 claims abstract description 17
- 238000005476 soldering Methods 0.000 claims abstract description 4
- 229910000831 Steel Inorganic materials 0.000 claims description 3
- 239000000919 ceramic Substances 0.000 claims description 3
- 239000003822 epoxy resin Substances 0.000 claims description 3
- 239000011521 glass Substances 0.000 claims description 3
- 229920000647 polyepoxide Polymers 0.000 claims description 3
- 229910052594 sapphire Inorganic materials 0.000 claims description 3
- 239000010980 sapphire Substances 0.000 claims description 3
- 239000010959 steel Substances 0.000 claims description 3
- 238000007711 solidification Methods 0.000 claims description 2
- 230000008023 solidification Effects 0.000 claims description 2
- 238000009413 insulation Methods 0.000 claims 10
- 239000012528 membrane Substances 0.000 claims 4
- 239000004568 cement Substances 0.000 claims 1
- 238000000465 moulding Methods 0.000 claims 1
- 230000003287 optical effect Effects 0.000 claims 1
- 238000004806 packaging method and process Methods 0.000 abstract description 7
- 238000012858 packaging process Methods 0.000 abstract description 7
- 238000003466 welding Methods 0.000 abstract 2
- 238000000034 method Methods 0.000 description 5
- 230000004048 modification Effects 0.000 description 3
- 238000012986 modification Methods 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000005684 electric field Effects 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000004033 plastic Substances 0.000 description 1
Classifications
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/857—Interconnections, e.g. lead-frames, bond wires or solder balls
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10H—INORGANIC LIGHT-EMITTING SEMICONDUCTOR DEVICES HAVING POTENTIAL BARRIERS
- H10H20/00—Individual inorganic light-emitting semiconductor devices having potential barriers, e.g. light-emitting diodes [LED]
- H10H20/80—Constructional details
- H10H20/85—Packages
- H10H20/851—Wavelength conversion means
- H10H20/8511—Wavelength conversion means characterised by their material, e.g. binder
- H10H20/8512—Wavelength conversion materials
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Abstract
本发明公开了一种LED封装结构及封装工艺，它包括透明绝缘基板、荧光胶，透明绝缘基板的上下面设有一列或者多列焊盘或者焊点，若干个LED芯片倒装在两焊盘或者焊点之间，在透明绝缘基板两侧设有金属电极，金属电极穿出透明外套，金属电极和透明外套之间密封连接，在两焊盘或者焊点之间的透明绝缘基板的间隙上印刷有荧光薄膜，在倒装LED芯片一面的透明绝缘基板上涂覆荧光胶。本发明LED封装结构及封装工艺能实现蓝光LED芯片的全包裹，彻底杜绝蓝光外泄，极大地提升了LED灯丝灯的发光品质、荧光胶用量减少二分之一至三分之二，成本大幅降低，体积也缩小近三分之一。
The invention discloses an LED packaging structure and a packaging process, which comprises a transparent insulating substrate and fluorescent glue. One or more rows of welding pads or soldering points are arranged on the upper and lower sides of the transparent insulating substrate, and several LED chips are flip-mounted on the two welding pads. Or between the solder joints, metal electrodes are provided on both sides of the transparent insulating substrate, the metal electrodes pass through the transparent jacket, and the metal electrode and the transparent jacket are sealed and connected, on the gap between the two solder pads or the transparent insulating substrate A fluorescent film is printed, and fluorescent glue is coated on the transparent insulating substrate on one side of the flip-chip LED chip. The LED packaging structure and packaging process of the present invention can realize the full package of blue LED chips, completely eliminate the leakage of blue light, greatly improve the luminous quality of LED filament lamps, reduce the amount of fluorescent glue by one-half to two-thirds, and greatly reduce the cost lowered, the volume is also reduced by nearly one-third.
Description
技术领域technical field
本发明涉及LED封装，具体是指一种LED封装结构及封装工艺。The invention relates to LED packaging, in particular to an LED packaging structure and a packaging process.
背景技术Background technique
LED 是发光二极管 (LED,Lighting emitted diode的缩写)，它是利用在电场作用下，PN 结 发光的固态发光器件。它具有高寿命、环保、节能的特点，是绿色环保的新光源。现有的LED广泛在家庭、商场、酒店、汽车等诸多邻域应用。LED is a light-emitting diode (LED, Lighting emitted diode abbreviation), which is a solid-state light-emitting device that uses the PN junction to emit light under the action of an electric field. It has the characteristics of high life, environmental protection and energy saving, and is a new green light source. Existing LEDs are widely used in many neighborhoods such as homes, shopping malls, hotels, and automobiles.
目前的封装器件，LED 灯丝本是最近一两年产生的封装类型器件，其360度发光、光效高的特性被用于替代传统白炽灯泡，有着白炽灯泡光线柔和、光束角大（360度）、防水雾的优良特性，更比白炽灯节能90%、比普通贴片LED灯泡节能30%以上的优异节能率，日渐受到消费者与市场的极力推捧。当前的LED灯丝光源，有两种做法，一种是将绝缘透明基板两端固定金属端子作为电极，在绝缘透明基板上正装芯片，芯片间及芯片与金属电极间用金线连接，然后在透明基板两面滴荧光胶；一种是将一长金属支架用塑胶连接一短金属端子，两金属端子间断开作为两个独立的电极，长端金属端子上正装LED芯片，芯片、电极间用金线连接，长端子芯片与芯片中间部位钻孔，以将光线通过孔导入到反面，两面点荧光胶，实现反面也有发光。两种做法均有一个很大的缺陷，就是基板本身有一个厚度，约0.3-0.6mm，芯片底部与侧部发出的光线，无法全部被荧光胶所包裹，这样就会有部分的蓝光外泄，严重影响到光源的发光品质。为了尽可能减少蓝光外泄，通常的做法是基板两面涂覆荧光胶，反面荧光胶涂覆面积加大，用量基本是正面荧光胶量的1.5-2.5倍，造成成本的增加。The current packaged device, LED filament is a packaged device that has been produced in the last one or two years. Its 360-degree light emission and high luminous efficiency are used to replace traditional incandescent bulbs. The light of incandescent bulbs is soft and the beam angle is large (360 degrees). , Excellent characteristics of water-proof fog, more than 90% energy saving than incandescent lamps, and more than 30% energy saving than ordinary SMD LED bulbs. There are two methods for the current LED filament light source. One is to fix the metal terminals at both ends of the insulating transparent substrate as electrodes, and mount the chip on the insulating transparent substrate. Fluorescent glue is dripped on both sides of the substrate; one is to connect a long metal bracket with plastic to a short metal terminal, disconnect the two metal terminals as two independent electrodes, and install LED chips on the long metal terminals, and use gold wires between the chips and electrodes To connect, the long terminal chip and the middle part of the chip are drilled to guide the light into the reverse side through the hole, and fluorescent glue is applied on both sides to realize that the reverse side also emits light. Both methods have a big defect, that is, the substrate itself has a thickness of about 0.3-0.6mm, and the light emitted from the bottom and side of the chip cannot be completely wrapped by fluorescent glue, so that part of the blue light will leak out , seriously affecting the luminous quality of the light source. In order to reduce blue light leakage as much as possible, the usual practice is to coat both sides of the substrate with fluorescent glue, and the coating area of fluorescent glue on the back side is enlarged, and the amount used is basically 1.5-2.5 times that of the front fluorescent glue, resulting in an increase in cost.
发明内容Contents of the invention
本发明的目的是提供一种实现蓝光LED芯片的全包裹、彻底杜绝蓝光外泄、极大地提升了LED灯丝灯的发光品质、荧光胶用量减少二分之一至三分之二、成本大幅降低、体积也缩小近三分之一LED灯丝封装结构和LED灯丝封装工艺。The purpose of the present invention is to provide a method that realizes the full package of blue LED chips, completely prevents the leakage of blue light, greatly improves the luminous quality of LED filament lamps, reduces the amount of fluorescent glue by one-half to two-thirds, and greatly reduces the cost. , The volume is also reduced by nearly one-third of the LED filament packaging structure and LED filament packaging process.
为了实现上述目的，本发明采用了一种LED封装结构，包括透明绝缘基板、荧光胶，透明绝缘基板的上下面设有一列或者多列焊盘或者焊点，若干个LED芯片倒装在两焊盘或者焊点之间，在透明绝缘基板两侧设有金属电极，金属电极穿出透明外套，金属电极和透明外套之间密封连接，在两焊盘或者焊点之间的透明绝缘基板的间隙上印刷有荧光薄膜，在倒装LED芯片一面的透明绝缘基板上涂覆荧光胶。In order to achieve the above object, the present invention adopts a LED packaging structure, including a transparent insulating substrate, fluorescent glue, one or more rows of solder pads or solder joints are arranged on the upper and lower sides of the transparent insulating substrate, and several LED chips are flip-chip mounted on two solder joints. Between the pads or solder joints, there are metal electrodes on both sides of the transparent insulating substrate. The metal electrodes pass through the transparent jacket, and the metal electrode and the transparent jacket are sealed and connected. A fluorescent film is printed on the top, and fluorescent glue is coated on the transparent insulating substrate on one side of the flip-chip LED chip.
所述透明绝缘基板的上面设有一列LED芯片，LED芯片倒装在两焊盘或者焊点之间，相邻焊盘或者焊点的间隔为0.5～5mm，焊盘或者焊点的高度为0.1～0.2mm，在焊盘或者焊点的间隔处设有荧光薄膜，荧光胶仅涂覆在透明绝缘基板的倒装有LED芯片的一面。A row of LED chips is arranged above the transparent insulating substrate, and the LED chips are flip-chip mounted between two pads or solder joints, the interval between adjacent pads or solder joints is 0.5-5 mm, and the height of the solder pads or solder joints is 0.1 mm. ~0.2mm, there is a fluorescent film at the interval between the pads or solder joints, and the fluorescent glue is only coated on the side of the transparent insulating substrate where the LED chip is flipped.
所述透明绝缘基板为玻璃基板或者环氧树脂基板或者蓝宝石基板或者透明陶瓷基板。The transparent insulating substrate is a glass substrate or an epoxy resin substrate or a sapphire substrate or a transparent ceramic substrate.
所述透明绝缘基板的厚度小于0.5mm。The thickness of the transparent insulating substrate is less than 0.5mm.
本发明还公开了一种LED灯丝封装工艺，包括以下步骤：The invention also discloses an LED filament packaging process, which includes the following steps:
A、在透明绝缘基板的上下面设有一列或者多列焊盘或者焊点，焊盘或者焊点的高度0.1～0.2mm；A. There are one or more rows of solder pads or solder joints on the upper and lower sides of the transparent insulating substrate, and the height of the solder pads or solder joints is 0.1-0.2mm;
B、制作一精密钢网，焊盘或者焊点的位置被挡住，其余部位被印刷一层厚度约0.1mm厚的荧光薄膜，根据规格温度将荧光薄膜固化成型，B. Make a precision steel mesh, the position of the pad or solder joint is blocked, and the rest of the part is printed with a layer of fluorescent film with a thickness of about 0.1mm, and the fluorescent film is cured and formed according to the specified temperature.
C、在两焊盘或者焊点之间倒装LED芯片，回流焊固化后，在芯片上部滴注一层荧光胶。C. Flip-chip the LED chip between the two pads or solder joints. After reflow soldering and curing, drip a layer of fluorescent glue on the top of the chip.
本发明LED灯丝封装结构及封装工艺实现了蓝光LED芯片的全包围，彻底杜绝了蓝光外泄，并且荧光胶量减少了60%以上，产品体积也缩小了三分之一左右。The LED filament packaging structure and packaging process of the present invention realize the full envelopment of the blue LED chip, completely eliminate the leakage of blue light, reduce the amount of fluorescent glue by more than 60%, and reduce the volume of the product by about one-third.
附图说明：Description of drawings:
图1是本发明LED灯丝的主视图；Fig. 1 is the front view of LED filament of the present invention;
图2是图1的AA方内剖视结构示意图；Fig. 2 is a schematic diagram of the internal sectional structure of the AA side of Fig. 1;
图3是本发明LED灯丝的立体结构示意图。Fig. 3 is a schematic diagram of the three-dimensional structure of the LED filament of the present invention.
具体实施方式Detailed ways
为了便于本领域技术人员的理解，下面将结合具体实施例及附图对本发明的结构原理作进一步的详细描述。In order to facilitate the understanding of those skilled in the art, the structural principles of the present invention will be further described in detail below in conjunction with specific embodiments and accompanying drawings.
如图1～3所示，一种LED灯丝结构，包括透明绝缘基板1、荧光胶2，透明绝缘基板1的上下面设有一列或者多列焊盘或者焊点5，若干个LED芯片3倒装在两焊盘或者焊点5之间，在透明绝缘基板1两侧设有金属电极4，金属电极4穿出透明外套，金属电极4和透明外套之间密封连接，在两焊盘或者焊点5之间的透明绝缘基板1的间隙上印刷有荧光薄膜6，在倒装LED芯片3一面的透明绝缘基板1上涂覆荧光胶2。As shown in Figures 1 to 3, an LED filament structure includes a transparent insulating substrate 1, fluorescent glue 2, one or more rows of pads or solder joints 5 are arranged on the upper and lower sides of the transparent insulating substrate 1, and several LED chips 3 are inverted. Installed between two pads or solder joints 5, metal electrodes 4 are provided on both sides of the transparent insulating substrate 1, the metal electrodes 4 pass through the transparent jacket, and the metal electrodes 4 and the transparent jacket are sealed and connected. A fluorescent film 6 is printed on the gap between the dots 5 on the transparent insulating substrate 1 , and a fluorescent glue 2 is coated on the transparent insulating substrate 1 on one side of the flip-chip LED chip 3 .
如图2所示，所述透明绝缘基板1的上面设有一列LED芯片3，LED芯片3倒装在两焊盘或者焊点5之间，相邻焊盘或者焊点5的间隔为0.5～5mm，焊盘或者焊点5的高度为0.1～0.2mm，在焊盘或者焊点5的间隔处设有荧光薄膜6，荧光胶2仅涂覆在透明绝缘基板1的倒装有LED芯片3的一面。As shown in Figure 2, a row of LED chips 3 is arranged on the transparent insulating substrate 1, and the LED chips 3 are flip-chip mounted between two solder pads or solder joints 5, and the interval between adjacent solder pads or solder joints 5 is 0.5-5. 5mm, the height of the pads or solder joints 5 is 0.1-0.2mm, a fluorescent film 6 is provided at the interval between the pads or solder joints 5, and the fluorescent glue 2 is only coated on the transparent insulating substrate 1 with the LED chip 3 inverted side.
本发明所述透明绝缘基板1为玻璃基板或者环氧树脂基板或者蓝宝石基板或者透明陶瓷基板。The transparent insulating substrate 1 of the present invention is a glass substrate or an epoxy resin substrate or a sapphire substrate or a transparent ceramic substrate.
本发明所述透明绝缘基板1的厚度小于0.5mm。The thickness of the transparent insulating substrate 1 of the present invention is less than 0.5mm.
一种LED灯丝封装工艺，结合图2所示，包括以下步骤：A LED filament packaging process, as shown in Figure 2, comprises the following steps:
A、在透明绝缘基板1的上下面设有一列或者多列焊盘或者焊点5，焊盘或者焊点5的高度0.1～0.2mm；A. One or more rows of solder pads or solder joints 5 are arranged on the upper and lower sides of the transparent insulating substrate 1, and the height of the solder pads or solder joints 5 is 0.1-0.2 mm;
B、制作一精密钢网，焊盘或者焊点5的位置被挡住，其余部位被印刷一层厚度约0.1mm厚的荧光薄膜，根据规格温度将荧光薄膜固化成型，B. Make a precision steel mesh, the position of the pad or solder joint 5 is blocked, and the rest of the parts are printed with a layer of fluorescent film with a thickness of about 0.1mm, and the fluorescent film is cured and formed according to the specified temperature.
C、在两焊盘或者焊点5之间倒装LED芯片3，回流焊固化后，在芯片上部滴注一层荧光胶。C. Flip-chip the LED chip 3 between the two solder pads or solder joints 5, and drip a layer of fluorescent glue on the top of the chip after reflow soldering and solidification.
本发明与现有技术的产品的区别在于：The difference between the present invention and the product of prior art is:
1.现有技术的LED灯丝采用正装芯片，芯片底部用绝缘胶粘接在细长条形状的基板上，芯片间及芯片与两端电极间用金线导通连接，本发明采用倒装芯片；1. The LED filament of the prior art adopts a front-mounted chip, and the bottom of the chip is bonded on a slender strip-shaped substrate with insulating glue. The chips and the chip and the electrodes at both ends are connected with gold wires. The present invention uses a flip chip ;
2.本发明采用透光基板上印刷银浆作为电极，电极厚度0.1-0.2mm，芯片与基板电极间用锡膏熔接，导热系数较传统方案提升200倍；2. The present invention uses silver paste printed on the light-transmitting substrate as the electrode, the electrode thickness is 0.1-0.2mm, and the chip and the substrate electrode are welded with solder paste, and the thermal conductivity is 200 times higher than that of the traditional solution;
3.本发明在银浆电极之外的透光基板位置，印刷了一层约0.1mm后的荧光薄膜，LED芯片底部发出的光线或反射、折射到上述方位的光线全部被荧光薄膜所吸收转换成白光；3. In the present invention, a fluorescent film of about 0.1 mm is printed on the position of the light-transmitting substrate outside the silver paste electrode, and the light emitted from the bottom of the LED chip or the light reflected or refracted to the above-mentioned directions is all absorbed and converted by the fluorescent film into white light;
4.倒装LED芯片后，本发明在LED芯片为中心的位置滴注约0.8mm宽的荧光胶，由于LED芯片位置比荧光薄膜位置高，芯片的宽度一般在0.4mm以内，从而实现了LED芯片被荧光材料的360度全方位包围，彻底杜绝该产品的蓝光外泄；4. After flipping the LED chip, the present invention instills about 0.8mm wide fluorescent glue at the center of the LED chip. Since the position of the LED chip is higher than that of the fluorescent film, the width of the chip is generally within 0.4mm, thereby realizing the LED The chip is surrounded by a 360-degree fluorescent material, which completely prevents the leakage of blue light from the product;
5.本发明由于LED芯片底部已有荧光薄膜，无需在透光基板背面再涂覆荧光胶，减少了此部分的工艺与成本。5. In the present invention, since there is a fluorescent film at the bottom of the LED chip, there is no need to apply fluorescent glue on the back of the light-transmitting substrate, which reduces the process and cost of this part.
以上所述，仅为本发明的较佳实施例而已，并非对本发明作任何形式上的限制；凡本行业的普通技术人员均可按说明书附图所示和以上所述而顺畅地实施本发明；但是，凡熟悉本专业的技术人员在不脱离本发明技术方案范围内，可利用以上所揭示的技术内容而作出的些许更动、修饰与演变的等同变化，均为本发明的等效实施例；同时，凡依据本发明的实质技术对以上实施例所作的任何等同变化的更动、修饰与演变等，均仍属于本发明的技术方案的保护范围之内。The above descriptions are only preferred embodiments of the present invention, and are not intended to limit the present invention in any form; all those skilled in the art can smoothly implement the present invention as shown in the attached drawings and the above descriptions. However, any equivalent change, modification and evolution that can be made by those skilled in the art without departing from the scope of the technical solution of the present invention by using the technical content disclosed above are all equivalent implementations of the present invention Example; at the same time, any modification, modification and evolution of any equivalent changes made to the above embodiments according to the substantive technology of the present invention still belong to the protection scope of the technical solution of the present invention.
Claims (5)
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410493102.1A CN104282831B (en) | 2014-09-24 | 2014-09-24 | A kind of LED encapsulation structure and packaging technology |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410493102.1A CN104282831B (en) | 2014-09-24 | 2014-09-24 | A kind of LED encapsulation structure and packaging technology |
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| Publication Number | Publication Date |
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| CN104282831A CN104282831A (en) | 2015-01-14 |
| CN104282831B true CN104282831B (en) | 2018-03-20 |
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| CN105226176A (en) * | 2015-08-25 | 2016-01-06 | 江苏华英光宝科技股份有限公司 | Cover brilliant high temperature resistant PI film printing opacity reelability filament and preparation method thereof |
| ES2828432T3 (en) * | 2015-12-10 | 2021-05-26 | Shandong Prosperous Star Optoelectronics Co Ltd | One LED illuminant connected in parallel and one LED illumination lamp |
| CN106340580A (en) * | 2016-11-19 | 2017-01-18 | 莆田莆阳照明有限公司 | Long-service-life LED lamp |
| CN106895282A (en) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | Fluorescence membrane is used for the method that LED filament makes bulb lamp |
| DE102017213307A1 (en) * | 2017-08-01 | 2019-02-07 | Robert Bosch Gmbh | battery Pack |
| EP3514440B1 (en) * | 2018-01-18 | 2021-12-29 | BGT Materials Limited | Method of manufacturing a led light bulb having thermal radiation filaments |
| CN108386738B (en) * | 2018-02-09 | 2019-11-22 | 安徽省富鑫雅光电科技有限公司 | A kind of flexible filament lamp of high aobvious finger |
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| CN101532612A (en) * | 2009-03-10 | 2009-09-16 | 广州南科集成电子有限公司 | Method for manufacturing integrated LED chip light source |
| CN102280555A (en) * | 2010-06-08 | 2011-12-14 | 曲丹 | Light-emitting diode and manufacturing method thereof |
| CN203589021U (en) * | 2013-12-09 | 2014-05-07 | 惠州市英吉尔光电科技有限公司 | 360-degree light-transmitting LED lamp filament |
| CN203586033U (en) * | 2013-12-12 | 2014-05-07 | 惠州市英吉尔光电科技有限公司 | 360-degree non-light-tight car lamp |
| CN103972377A (en) * | 2014-05-08 | 2014-08-06 | 南京华鼎电子有限公司 | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding |
| CN103972369B (en) * | 2014-05-26 | 2017-01-18 | 苏州东山精密制造股份有限公司 | LED (Light Emitting Diode) lamp bar and manufacturing method thereof |
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