CN104282831B - A kind of LED encapsulation structure and packaging technology - Google Patents
A kind of LED encapsulation structure and packaging technology Download PDFInfo
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- CN104282831B CN104282831B CN201410493102.1A CN201410493102A CN104282831B CN 104282831 B CN104282831 B CN 104282831B CN 201410493102 A CN201410493102 A CN 201410493102A CN 104282831 B CN104282831 B CN 104282831B
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- solder joint
- insulation substrate
- transparent insulation
- led
- transparent
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- Microelectronics & Electronic Packaging (AREA)
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- Led Device Packages (AREA)
Abstract
The invention discloses a kind of LED encapsulation structure and packaging technology, it includes transparent insulation substrate, fluorescent glue, the top and bottom of transparent insulation substrate are provided with a row either multiple row pad or solder joint, several LED chips are inverted between two pads or solder joint, metal electrode is provided with transparent insulation substrate both sides, metal electrode passes transparent jacket sheets, it is tightly connected between metal electrode and transparent jacket sheets, fluorescence membrane is printed with the gap of transparent insulation substrate between two pads or solder joint, fluorescent glue is coated in the transparent insulation substrate of flip LED chips one side.LED encapsulation structure and packaging technology of the present invention can realize the full parcel of blue-light LED chip, thoroughly prevent blue light to leak, greatly improve the luminescent quality of LED filament lamp, fluorescent glue dosage reduces half to 2/3rds, cost is greatly reduced, and volume also reduces nearly 1/3rd.
Description
Technical field
The present invention relates to LED encapsulation, in particular to a kind of LED encapsulation structure and packaging technology.
Background technology
LED is light emitting diode (LED, Lighting emitted diode abbreviation), and it is to utilize to make in electric field
Under, PN binds up one's hair the Sony ericsson mobile comm ab of light.It has the characteristics of high life, environmental protection, energy-conservation, is green new light
Source.Existing LED is extensively in many neighborhood applications such as family, market, hotel, automobile.
Current packaging, LED filaments are originally encapsulated type devices caused by nearest one or two years, its 360 degree it is luminous,
The high characteristic of light efficiency be used to substitute conventional incandescent bulb, there is that incandescent lamp bulb light is soft, beam angle is big（360 degree）, waterproof
The good characteristic of mist, more than 30% excellent fractional energy savings is saved more than incandescent streetlamp energy-saving 90%, than common paster LED bulb, increasingly
Handful is strongly pushed away by consumer and market.Current LED filament light source, there is two kinds of ways, and one kind is by insulating transparent substrate
Metal terminal is fixed as electrode in both ends, and positive cartridge chip, is used between chip chamber and chip and metal electrode on insulating transparent substrate
Gold thread connects, and then drips fluorescent glue on transparency carrier two sides；One kind is that a long metallic support plastic cement is connected into a short metal end
Son, the separated electrode independent as two of two metal terminals, packed LED chip on long end metal terminal, used between chip, electrode
Gold thread is connected, and long terminal chip and chip middle part drill, and light imported into reverse side by hole, two millet cake fluorescent glues,
It is luminous to realize that reverse side also has.Two kinds of ways have the defects of one very big, are exactly that substrate has a thickness, about 0.3- in itself
0.6mm, the light that chip bottom is sent with sidepiece, can not all be wrapped up by fluorescent glue, thus have outside the blue light of part
Let out, seriously affect the luminescent quality of light source.Leaked to reduce blue light as far as possible, it is common practice to which substrate coated on both sides is glimmering
Optical cement, reverse side fluorescent glue coated area increase, and dosage is substantially 1.5-2.5 times of front fluorescent glue amount, causes the increase of cost.
The content of the invention
It is an object of the invention to provide a kind of full parcel for realizing blue-light LED chip, thoroughly prevent blue light and leak, greatly
Improve the luminescent quality of LED filament lamp, fluorescent glue dosage reduction half to 2/3rds, cost is greatly reduced, volume
Also nearly 1/3rd LED filaments encapsulating structure and LED filament packaging technology are reduced.
To achieve these goals, present invention employs a kind of LED encapsulation structure, including transparent insulation substrate, fluorescent glue,
The top and bottom of transparent insulation substrate are provided with row either multiple row pad or a solder joint, several LED chips be inverted in two pads or
Between person's solder joint, metal electrode is provided with transparent insulation substrate both sides, metal electrode passes transparent jacket sheets, metal electrode and transparent
It is tightly connected between overcoat, fluorescence membrane is printed with the gap of the transparent insulation substrate between two pads or solder joint,
Fluorescent glue is coated in the transparent insulation substrate of flip LED chips one side.
Be provided with a row LED chip above the transparent insulation substrate, LED chip be inverted in two pads or solder joint it
Between, adjacent pad or solder joint at intervals of 0.5~5mm, the height of pad or solder joint is 0.1~0.2mm, in pad or
The interval of solder joint is provided with fluorescence membrane, and the upside-down mounting that fluorescent glue is applied only to transparent insulation substrate has the one side of LED chip.
The transparent insulation substrate is glass substrate either epoxy resin base plate or sapphire substrate or crystalline ceramics
Substrate.
The thickness of the transparent insulation substrate is less than 0.5mm.
The invention also discloses a kind of LED filament packaging technology, comprise the following steps：
A, the height of a row either multiple row pad or solder joint, pad or solder joint is provided with the top and bottom of transparent insulation substrate
Spend 0.1~0.2mm；
B, the position of one accurate steel mesh of making, pad or solder joint is blocked, and remaining position is printed a layer thickness about
Fluorescence membrane thick 0.1mm, according to specification temperature by fluorescence membrane curing molding,
C, the flip LED chips between two pads or solder joint, after Reflow Soldering solidification, instil one layer of fluorescence on chip top
Glue.
LED filament encapsulating structure of the present invention and packaging technology realize the full encirclement of blue-light LED chip, have thoroughly prevented indigo plant
Light leaks, and fluorescent glue amount reduces more than 60%, and small product size also reduces 1/3rd or so.
Brief description of the drawings：
Fig. 1 is the front view of LED filament of the present invention；
Fig. 2 is cross section structure diagram in Fig. 1 AA side；
Fig. 3 is the dimensional structure diagram of LED filament of the present invention.
Embodiment
For the ease of the understanding of those skilled in the art, below in conjunction with specific embodiment and accompanying drawing to structure of the invention
Principle is described in further detail.
As shown in Figures 1 to 3, a kind of LED filament structure, including transparent insulation substrate 1, fluorescent glue 2, transparent insulation substrate 1
Top and bottom be provided with row either multiple row pad or a solder joint 5, several LED chips 3 be inverted in two pads or solder joint 5 it
Between, metal electrode 4 is provided with the both sides of transparent insulation substrate 1, metal electrode 4 passes transparent jacket sheets, metal electrode 4 and transparent jacket sheets
Between be tightly connected, be printed with fluorescence membrane 6 on the gap of the transparent insulation substrate 1 between two pads or solder joint 5, fall
Fill and fluorescent glue 2 is coated in the transparent insulation substrate 1 of the one side of LED chip 3.
As shown in Fig. 2 being provided with a row LED chip 3 above the transparent insulation substrate 1, LED chip 3 is inverted in two welderings
Between disk or solder joint 5, adjacent pad or solder joint 5 at intervals of 0.5~5mm, the height of pad or solder joint 5 for 0.1~
0.2mm, fluorescence membrane 6 is provided with the interval of pad or solder joint 5, fluorescent glue 2 is applied only to the upside-down mounting of transparent insulation substrate 1
There is the one side of LED chip 3.
Transparent insulation substrate 1 of the present invention is glass substrate either epoxy resin base plate or sapphire substrate or saturating
Bright ceramic substrate.
The thickness of transparent insulation substrate 1 of the present invention is less than 0.5mm.
A kind of LED filament packaging technology, with reference to shown in Fig. 2, comprises the following steps：
A, a row either multiple row pad or solder joint 5, pad or solder joint 5 are provided with the top and bottom of transparent insulation substrate 1
0.1~0.2mm of height；
B, the position of one accurate steel mesh of making, pad or solder joint 5 is blocked, and remaining position is printed a layer thickness about
Fluorescence membrane thick 0.1mm, according to specification temperature by fluorescence membrane curing molding,
C, the flip LED chips 3 between two pads or solder joint 5, after Reflow Soldering solidification, on chip top, one layer of instillation is glimmering
Optical cement.
The present invention and the difference of the product of prior art are：
1. the LED filament of prior art uses positive cartridge chip, chip bottom is bonded in the base of elongate strip form with insulating cement
On plate, connection is turned on gold thread between chip chamber and chip and two end electrodes, the present invention uses flip-chip；
2. the present invention is electric with substrate as electrode, thickness of electrode 0.1-0.2mm, chip using silver paste is printed on transparent substrates
Interpolar tin cream welding, thermal conductivity factor lift 200 times compared with traditional scheme；
3. transparent substrates position of the present invention outside ag paste electrode, has printed the fluorescence membrane after one layer of about 0.1mm,
Light that LED chip bottom is sent or reflection, be refracted to above-mentioned orientation light all absorbed by fluorescence membrane be converted into it is white
Light；
4. after flip LED chips, fluorescent glue wide position instillation about 0.8mm of the present invention centered on LED chip, due to
LED chip position is higher than fluorescence membrane position, and the width of chip is typically within 0.4mm, it is achieved thereby that LED chip is by fluorescence
The 360 degrees omnidirection of material is surrounded, and the blue light for thoroughly preventing the product leaks；
5. the present invention, without being coated with fluorescent glue at the transparent substrates back side, subtracts due to the existing fluorescence membrane in LED chip bottom
The technique and cost of this part are lacked.
The foregoing is only a preferred embodiment of the present invention, not makees any formal limitation to the present invention；It is all
The those of ordinary skill of the industry can be shown in by specification accompanying drawing and described above and swimmingly implement the present invention；It is but all
Those skilled in the art without departing from the scope of the present invention, using disclosed above technology contents
The equivalent variations for a little variation, modification and evolution made, it is the equivalent embodiment of the present invention；It is meanwhile all according to the present invention
The variation, modification and evolution of any equivalent variations made to above example of substantial technological etc., still fall within the present invention's
Within the protection domain of technical scheme.
Claims (5)
1. a kind of LED filament encapsulating structure, including transparent insulation substrate (1), fluorescent glue（2）, transparent insulation substrate (1) up and down
Face is provided with a row either multiple row pad or solder joint（5）, several LED chips（3）It is inverted in two pads or solder joint（5）It
Between, it is provided with metal electrode in transparent insulation substrate (1) both sides（4）, metal electrode（4）Pass transparent jacket sheets, metal electrode（4）With
It is tightly connected between transparent jacket sheets, it is characterised in that：In two pads or solder joint（5）Between transparent insulation substrate (1) between
Fluorescence membrane is printed with gap（6）, in flip LED chips（3）Fluorescent glue is coated in transparent insulation substrate (1) simultaneously（2）.
2. LED filament encapsulating structure according to claim 1, it is characterised in that：Above the transparent insulation substrate (1)
Provided with a row LED chip（3）, LED chip（3）It is inverted in two pads or solder joint（5）Between, adjacent pad or solder joint（5）
At intervals of 0.5~5mm, pad or solder joint（5）Height be 0.1~0.2mm, in pad or solder joint（5）Interval
Provided with fluorescence membrane（6）, fluorescent glue（2）The upside-down mounting for being applied only to transparent insulation substrate (1) has LED chip（3）One side.
3. LED filament encapsulating structure according to claim 2, it is characterised in that：The transparent insulation substrate (1) is glass
Substrate either epoxy resin base plate or sapphire substrate or transparent ceramic base.
4. LED filament encapsulating structure according to claim 3, it is characterised in that：The thickness of the transparent insulation substrate (1)
Less than 0.5mm.
5. a kind of LED filament packaging technology for realizing any one of Claims 1 to 4 claim LED filament encapsulating structure, including
Following steps：
A, a row either multiple row pad or solder joint are provided with the top and bottom of transparent insulation substrate (1)（5）, pad or solder joint
（5）0.1~0.2mm of height；
B, an accurate steel mesh, pad or solder joint are made（5）Position be blocked, remaining position be printed a layer thickness about
Fluorescence membrane thick 0.1mm, according to specification temperature by fluorescence membrane curing molding,
C, in two pads or solder joint（5）Between flip LED chips（3）, after Reflow Soldering solidification, on chip top, one layer of instillation is glimmering
Optical cement.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410493102.1A CN104282831B (en) | 2014-09-24 | 2014-09-24 | A kind of LED encapsulation structure and packaging technology |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410493102.1A CN104282831B (en) | 2014-09-24 | 2014-09-24 | A kind of LED encapsulation structure and packaging technology |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104282831A CN104282831A (en) | 2015-01-14 |
| CN104282831B true CN104282831B (en) | 2018-03-20 |
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| CN201410493102.1A Expired - Fee Related CN104282831B (en) | 2014-09-24 | 2014-09-24 | A kind of LED encapsulation structure and packaging technology |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105226176A (en) * | 2015-08-25 | 2016-01-06 | 江苏华英光宝科技股份有限公司 | Cover brilliant high temperature resistant PI film printing opacity reelability filament and preparation method thereof |
| EP3179163B1 (en) * | 2015-12-10 | 2020-09-02 | Shandong Prosperous Star Optoelectronics Co., Ltd | A parallel-connected led illuminant and a led lighting lamp |
| CN106340580A (en) * | 2016-11-19 | 2017-01-18 | 莆田莆阳照明有限公司 | Long-service-life LED lamp |
| CN106895282A (en) * | 2017-03-13 | 2017-06-27 | 上海应用技术大学 | Fluorescence membrane is used for the method that LED filament makes bulb lamp |
| DE102017213307A1 (en) * | 2017-08-01 | 2019-02-07 | Robert Bosch Gmbh | battery Pack |
| EP3514440B1 (en) * | 2018-01-18 | 2021-12-29 | BGT Materials Limited | Method of manufacturing a led light bulb having thermal radiation filaments |
| CN108386738B (en) * | 2018-02-09 | 2019-11-22 | 安徽省富鑫雅光电科技有限公司 | A kind of flexible filament lamp of high aobvious finger |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN101532612A (en) * | 2009-03-10 | 2009-09-16 | 广州南科集成电子有限公司 | Method for manufacturing integrated LED chip light source |
| CN102280555A (en) * | 2010-06-08 | 2011-12-14 | 曲丹 | Light-emitting diode and manufacturing method thereof |
| CN203589021U (en) * | 2013-12-09 | 2014-05-07 | 惠州市英吉尔光电科技有限公司 | 360-degree light-transmitting LED lamp filament |
| CN203586033U (en) * | 2013-12-12 | 2014-05-07 | 惠州市英吉尔光电科技有限公司 | 360-degree non-light-tight car lamp |
| CN103972377A (en) * | 2014-05-08 | 2014-08-06 | 南京华鼎电子有限公司 | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding |
| CN103972369B (en) * | 2014-05-26 | 2017-01-18 | 苏州东山精密制造股份有限公司 | LED (Light Emitting Diode) lamp bar and manufacturing method thereof |
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