CN103972369B - LED (Light Emitting Diode) lamp bar and manufacturing method thereof - Google Patents

LED (Light Emitting Diode) lamp bar and manufacturing method thereof Download PDF

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Publication number
CN103972369B
CN103972369B CN201410225999.XA CN201410225999A CN103972369B CN 103972369 B CN103972369 B CN 103972369B CN 201410225999 A CN201410225999 A CN 201410225999A CN 103972369 B CN103972369 B CN 103972369B
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CN
China
Prior art keywords
described
adhesive layer
fluorescent adhesive
lamp bar
led lamp
Prior art date
Application number
CN201410225999.XA
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Chinese (zh)
Other versions
CN103972369A (en
Inventor
黄勇鑫
充国林
羊鹏
王成
袁永刚
Original Assignee
苏州东山精密制造股份有限公司
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Priority to CN201410225999.XA priority Critical patent/CN103972369B/en
Publication of CN103972369A publication Critical patent/CN103972369A/en
Application granted granted Critical
Publication of CN103972369B publication Critical patent/CN103972369B/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481Disposition
    • H01L2224/48135Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
    • H01L2224/48137Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85909Post-treatment of the connector or wire bonding area
    • H01L2224/8592Applying permanent coating, e.g. protective coating
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181Encapsulation

Abstract

The invention provides an LED (Light Emitting Diode) lamp bar which comprises a transparent base plate, a first fluorescent adhesive layer, a plurality of LED chips and a second fluorescent adhesive layer, wherein the surface of the transparent base plate is covered with the first fluorescent adhesive layer; the plurality of LED chips are mounted on the first fluorescent adhesive layer; the second fluorescent adhesive layer is positioned on the first fluorescent adhesive layer; the plurality of LED chips are covered with the second fluorescent adhesive layer. Compared with the prior art, the LED lamp bar is surrounded by fluorescent adhesive, so that the problem that blue light leaks from a side surface of the LED lamp bar is completely solved, the LED lamp bar is uniform in light emission on four edges, the light emission effect is good, moreover the process is simple, the production efficiency is high due to adoption of a die pressing process, no blue light leaks from the side surface of the LED lamp bar, a single surface of the transparent base plate is provided with the fluorescent adhesive in a pressing manner, and a small amount of mixture of fluorescent powder and glue is used, so that the production cost is greatly lowered.

Description

A kind of LED lamp bar and its manufacture method

Technical field

The present invention relates to lighting field, more particularly, to a kind of LED lamp bar and its manufacture method.

Background technology

With developing rapidly of led (light-emitting diode, light emitting diode) industry, emerge in large numbers very in the world Many led manufacturing enterprises.For realizing 360 ° of luminous effects of LED lamp bar, usually direct one side die bond on the transparent substrate, so Two-sided pressing mold fluorescent adhesive layer on the transparent substrate afterwards.The manufacturing process of existing transparency carrier LED lamp bar is as follows: in transparency carrier Chip surface both positive and negative polarity is connected with the electrode that is connected power supply, by mould pressing process by fluorescence by upper fixed chip by conductor wire Glue (mixture of glue and fluorescent material) is attached to transparency carrier positive and negative, and full wafer transparency carrier is cut into single LED lamp bar.

Have following defects that the positive and negative sealing of (1) transparency carrier in prior art, but do not have at cutting back side edge transparency carrier There is fluorescent material, lead to side can expose blue light, cause whole LED lamp bar four sides non-uniform light, illumination effect is bad;(2) saturating The two-sided pressure fluorescent glue of bright substrate, causes Material Cost higher.

Therefore, it is necessary to be further improved to defect of the prior art.

Content of the invention

It is an object of the present invention to provide a kind of lamp bar four sides lights and the good LED lamp bar of illumination effect, it can It is fully solved the problem that blue light is leaked in LED lamp bar side.

Another object of the present invention is to providing a kind of manufacture method of above-mentioned LED lamp bar, its process is simple, using one side Pressure fluorescent glue is simultaneously realized LED lamp bar side and is not leaked blue light, greatly reduces the use of fluorescent glue, reduces production cost.

For reaching object defined above, a kind of present invention LED lamp bar, comprising:

One transparency carrier;

First fluorescent adhesive layer, it is covered in described transparency carrier surface;

Several led chips, it is installed on described first fluorescent adhesive layer;

Second fluorescent adhesive layer, it is located on described first fluorescent adhesive layer and covers several led chips.

As one preferred embodiment of the present invention, described transparency carrier has one layer of conductive layer, described transparency carrier Including glass substrate, resin substrate, sapphire substrate and transparent ceramic base.

As one preferred embodiment of the present invention, described first fluorescent adhesive layer is covered in wherein the one of described transparency carrier Surface, the size being smaller in size than or being equal to described transparency carrier of described first fluorescent adhesive layer.

As one preferred embodiment of the present invention, several led chips described pass through on described first fluorescent adhesive layer Conductor wire led in series chip array.

As one preferred embodiment of the present invention, described first fluorescent adhesive layer is the side by spraying, printing or molding Formula is bonded on described transparency carrier.

As one preferred embodiment of the present invention, described second fluorescent adhesive layer is integrally to be covered in by way of molding Described first fluorescent adhesive layer surface simultaneously coats several led chips.

As one preferred embodiment of the present invention, the thickness of described second fluorescent adhesive layer is more than described first fluorescent adhesive layer Thickness.

For reaching aforementioned another object, a kind of manufacture method as above-mentioned LED lamp bar of the present invention, comprising:

One transparency carrier is provided;

First fluorescent adhesive layer is covered by the one side in described transparency carrier by spraying, printing or press moulding mode;

Several led chips are installed on described first fluorescent adhesive layer, several led chips described are in described first fluorescence Some rows are arranged on glue-line, often row includes several led chips;

By conductor wire, the both positive and negative polarity of several led chip surfaces on described first fluorescent adhesive layer is connected and form chip Described chipset is connected with the electrode of the connection power supply on described transparency carrier by collection by conductor wire again;

By way of pressing mold, the second fluorescent adhesive layer is covered in described first fluorescent adhesive layer surface and coats several led Chip;

Along often arranging led chip, described transparency carrier is cut into some LED lamp bars.

As one preferred embodiment of the present invention, several led chips described are to be fixed on institute by reflow soldering process State on the first fluorescent adhesive layer.

As one preferred embodiment of the present invention, every LED lamp bar includes several led chips, several led described Chip is to be connected in series on described transparency carrier.

Beneficial effects of the present invention: compared with prior art, the LED lamp bar of the present invention, its four face ring has fluorescent glue, completely Solve the problems, such as LED lamp bar side leakage blue light, LED lamp bar four sides is luminous uniformly, and illumination effect is good, and the technique of the present invention Simply, high using stamping technique production efficiency, and LED lamp bar side does not leak blue light, the one side pressure fluorescent glue of transparency carrier, uses Fluorescent material and glue mixture less, greatly reduce production cost.

Brief description

Fig. 1 is the structural representation of LED lamp bar of the present invention;

Fig. 2 is the manufacturing process flow of LED lamp bar of the present invention;

Fig. 3 a is the structural representation of the transparency carrier that LED lamp bar of the present invention is used;

Fig. 3 b be LED lamp bar of the present invention manufacturing process flow in the first fluorescent adhesive layer be covered on described transparency carrier Structural representation;

Fig. 3 c is the structural representation of die bond step in the manufacturing process flow of LED lamp bar of the present invention;

Fig. 3 d is the structural representation of bonding wire step in the manufacturing process flow of LED lamp bar of the present invention;

Fig. 3 e (1) be LED lamp bar of the present invention manufacturing process flow in the second fluorescent adhesive layer carry out on described led chip The structural representation of pressing mold;

Fig. 3 e (2) is the structural representation of finished product after 3e (1) pressing mold;

Fig. 3 f is wherein one LED lamp bar after punching in Fig. 3 e (2).

Specific embodiment

Below in conjunction with the accompanying drawings the present invention is described in further detail.

" embodiment " or " embodiment " referred to herein refers to may be included at least one implementation of the present invention Special characteristic, structure or characteristic." in one embodiment " that different places occur in this manual not refers both to same Individual embodiment, is not single or optionally mutually exclusive with other embodiment embodiment.

Refer to Fig. 1, it is the structural representation of LED lamp bar of the present invention.Described LED lamp article include transparency carrier 101, One fluorescent adhesive layer 102, several led chips 103 and the second fluorescent adhesive layer 105.Several led chips 103 described pass through conduction Line 104 is electrically connected on the electrode (not shown) of described transparency carrier 101.

Described transparency carrier 101 includes but is not limited to glass substrate, resin substrate, sapphire substrate and crystalline ceramics base Plate, can also be the substrate of other transparences.

Described first fluorescent adhesive layer 102 is covered in described transparency carrier 101 surface.Described first fluorescent adhesive layer 102 be by Glue and fluorescent material mix, and the present invention is not limited to the mixed proportion of described glue and fluorescent material, can be according to actual led chip Depending on 103 light-out effect.Described first fluorescent adhesive layer 102 is by spraying, printing or be bonded in described by way of being molded On bright substrate 101.In this embodiment, described first fluorescent adhesive layer 102 is covered in wherein one table of described transparency carrier 101 Face, the size being smaller in size than described transparency carrier 101 of described first fluorescent adhesive layer 102.In another embodiment, described The size of one fluorescent adhesive layer 102 can also be equal to the size of described transparency carrier 101.

Several led chips 103 described are installed on described first fluorescent adhesive layer 102.Several led chips 103 described Conductor wire 104 led chip array in series is passed through on described first fluorescent adhesive layer 102.

Described second fluorescent adhesive layer 105, it is located on described first fluorescent adhesive layer 102 and covers several led chips 103.Described second fluorescent adhesive layer 105 is to be mixed by glue and fluorescent material, the mixing ratio to described glue and fluorescent material for the present invention Example be not limited, can be according to the light-out effect of actual led chip depending on.In this embodiment, described second fluorescent adhesive layer 105 is Integrally it is covered in described first fluorescent adhesive layer 102 surface by way of molding and coats led chip 103, this allows for led core The surrounding of piece 103 is coated by the first fluorescent adhesive layer 102 and the second fluorescent adhesive layer 105, and achievable led chip 103 surrounding lights, no The side leakage blue light phenomenon of LED lamp bar occurs, considerably increases illumination effect.In other embodiments, described second fluorescence Glue-line 105 can also be covered in described first fluorescent adhesive layer 102 surface by other means and coat led chip 103.

In the present invention, the thickness of described second fluorescent adhesive layer 105 is more than the thickness of described first fluorescent adhesive layer 102, and this is just Described second fluorescent adhesive layer 105 1 aspect is allow to protect led chip, on the other hand ensure led chip 103 goes out light efficiency Really.In one embodiment, the thickness of the second fluorescent adhesive layer 105 can be adjusted according to the effect that required led chip 103 goes out light.

Refer to Fig. 2 and Fig. 3 a 3f, Fig. 2 is the manufacturing process flow of LED lamp bar of the present invention.The system of described LED lamp bar Make technique and specifically include following steps:

Step s210 a: transparency carrier 101 is provided.Refer to Fig. 3 a, its transparent base being used by LED lamp bar of the present invention The structural representation of plate.Described transparency carrier 101 includes but is not limited to glass substrate, resin substrate, sapphire substrate and transparent Ceramic substrate, can also be the substrate of other transparences.

Step s220: by spraying, printing or press moulding mode by the first fluorescent adhesive layer 102 uniform fold in described transparent base The one side of plate 101.Refer to Fig. 3 b, it is covered in institute for the first fluorescent adhesive layer in the manufacturing process flow of LED lamp bar of the present invention State the structural representation on transparency carrier.First fluorescent adhesive layer 102 of the present invention is to be uniformly covered on described transparency carrier 101 On, to ensure the uniformity of led chip light-emitting.

Step s230: die bond: several led chips 103 are installed on described first fluorescent adhesive layer 102, described several Led chip is arranged in some rows on described first fluorescent adhesive layer 102, and often row includes several led chips 103.Refer to figure 3c, it is the structural representation of die bond step in the manufacturing process flow of LED lamp bar of the present invention.Several led chips 103 described It is to be fixed on described first fluorescent adhesive layer 102 by reflow soldering process.First described transparency carrier 101 is placed on base plate So as to one faces up on carrier is (not shown), described led chip 103 is fixed on by described first fluorescence by reflow soldering process On glue-line 102, and then complete die bond technique, and then make the back side of led chip 103 be coated with the first fluorescent adhesive layer 102.

Step s240: bonding wire, by conductor wire 104 by several led chip 103 surfaces on the first fluorescent adhesive layer 102 Both positive and negative polarity connect and form chipset, by conductor wire 104 again by the connection electricity on described chipset and described transparency carrier 101 The electrode in source (not shown) is connected.Refer to Fig. 3 d, it is bonding wire step in the manufacturing process flow of LED lamp bar of the present invention Structural representation.First, described transparency carrier 101 is placed on base plate carrier (not shown), makes that there is led chip 103 One faces up, and is connected shape by the both positive and negative polarity on described led chip 103 surface on conductor wire 104 just first fluorescent adhesive layer 102 Become chipset, then pass through conductor wire again by the connection power supply on the described chipset connecting and described transparency carrier 101 (not Diagram) on electrode be connected, turned on by conductor wire 104 between described led chip 103 and electrode, complete bonding wire.Wherein, Described connection power supply is electrically connected with external power source by wire, is lighted described led chip by external power source.Need Bright, in the present invention, described transparency carrier 101 has layer of transparent conductive layer (not shown).Have on described transparency conducting layer The transparent conductive pattern made through photoetching process, described transparency conducting layer is provided with electrode, and described chipset is by conductor wire 104 are connected with the electrode of the connection power supply on conductive layer.

Step s250: pressing mold, by way of pressing mold, the second fluorescent adhesive layer 105 is covered in described first fluorescent adhesive layer 102 surfaces simultaneously coat several led chips 103.Refer to Fig. 3 e (1), it is in the manufacturing process flow of LED lamp bar of the present invention Second fluorescent adhesive layer carries out the structural representation of pressing mold on described led chip.Refer to Fig. 3 e (2), after it is 3e (1) pressing mold The schematic cross-section of finished product.The pressing mold effect of the upper mould 120 of molding board and lower mould 110 will mix sufficient glue and fluorescent material pressure Together in the first fluorescent adhesive layer 102 on described transparency carrier 101 surface with formed cladding led chip 103 the second fluorescent glue 105 Layer.Refer to Fig. 3 e (1) and Fig. 3 e (2), in the present invention, because only the one side in described transparency carrier 101 fixes led chip 103, and the face pressing mold fluorescent glue in transparency carrier 101, therefore can reduce the usage amount of fluorescent material and glue, greatly reduce Production cost.

Step s260: punching.Please continue to refer to Fig. 3 e (2), along often arranging led chip, described transparency carrier 101 is cut into Some LED lamp bars 130.Refer to Fig. 3 f, it is wherein one LED lamp bar after punching in Fig. 3 e (2).As Fig. 3 e (2) and 3f Shown, every LED lamp bar 130 includes several led chips (not shown), and several led chips described are in described transparency carrier It is to be connected in series on 101.In LED lamp article 130 after the cutting of the present invention, led chip circumference is by the first fluorescent adhesive layer 102 and Two fluorescent adhesive layers 105 coat completely, and when described led chip 103 lights, a part of light can be by coating led chip 102 Second fluorescent adhesive layer 105 transmission is gone out, and described in a part of light penetration, the first fluorescent adhesive layer 102 and transparency carrier 101 transmit Go, and then form 360 ° of the surrounding of led chip 103 to light.It should be noted that due to the first fluorescent adhesive layer 102 thickness relatively Thin, in therefore Fig. 3 f, the first fluorescent adhesive layer 102 does not embody, but this does not have the first fluorescent adhesive layer 102 in representative graph 3f.Due to Led chip 103 surrounding is coated completely by the first fluorescent adhesive layer 102 and the second fluorescent adhesive layer 105, therefore, completely solves LED lamp The problem of blue light is leaked in bar 130 side, and LED lamp bar 130 four sides is luminous uniformly, and illumination effect is good.In this embodiment, described led Lamp bar 130 be shaped as cylindricality, now, the distance that light source that described led chip 103 produces passes through from transparency carrier 101 side Shorter, also improve the illumination effect of transparency carrier 101 side to a certain extent.In other embodiments, to described LED lamp bar 130 shape is not limited.

In the present invention, the size and dimension of described transparency carrier 101 is not limited, is ensureing that transparency carrier 101 is maximum Depending on can be according to the quantity of actually required LED lamp bar and led chip on the premise of utilization rate.

It should be noted that the manufacture of the similarly suitable single led chip of the processing technology of the LED lamp bar of the present invention.

The LED lamp bar of the present invention, its four face ring has fluorescent glue, completely solves the problem that blue light is leaked in LED lamp bar side, LED lamp bar four sides is luminous, and uniformly illumination effect is good, and the process is simple of the present invention, high using stamping technique production efficiency, and LED lamp bar side does not leak blue light, and the one side of transparency carrier presses fluorescent glue, the fluorescent material of use and the mixture of glue less, significantly Reduce production cost.

Described above has fully disclosed the specific embodiment of the present invention.It is pointed out that being familiar with this field Any change that technical staff is done to the specific embodiment of the present invention is all without departing from the scope of claims of the present invention. Correspondingly, the scope of the claim of the present invention is also not limited only to previous embodiment.

Claims (8)

1. a kind of LED lamp bar it is characterised in that: comprising:
One transparency carrier;
First fluorescent adhesive layer, it is covered in described transparency carrier surface;
Several led chips, it is installed on described first fluorescent adhesive layer, and wherein, several led chips described are described first Some rows are arranged on fluorescent adhesive layer, often row includes several led chips, and wherein, led chip is to be directly fixed on the first fluorescence On glue-line;
Second fluorescent adhesive layer, it is located on described first fluorescent adhesive layer and covers several led chips described,
Described LED lamp bar be shaped as cylindricality,
Described second fluorescent adhesive layer is integrally to be covered in described first fluorescent adhesive layer surface by way of molding and coat some Individual led chip, the thickness of described second fluorescent adhesive layer is more than the thickness of described first fluorescent adhesive layer.
2. LED lamp bar according to claim 1 it is characterised in that: one layer of conductive layer is had on described transparency carrier, described Transparency carrier includes glass substrate, resin substrate, sapphire substrate and transparent ceramic base.
3. LED lamp bar according to claim 1 it is characterised in that: described first fluorescent adhesive layer is covered in described transparent base Wherein one surface of plate, the size being smaller in size than or being equal to described transparency carrier of described first fluorescent adhesive layer.
4. LED lamp bar according to claim 1 it is characterised in that: several led chips described are in described first fluorescent glue Conductor wire led in series chip array is passed through on layer.
5. LED lamp bar according to claim 1 it is characterised in that: described first fluorescent adhesive layer be by spraying, printing or The mode of molding is bonded on described transparency carrier.
6. a kind of manufacture method of described LED lamp bar as arbitrary in claim 1 to 5 it is characterised in that comprising:
One transparency carrier is provided;
First fluorescent adhesive layer is covered by the one side in described transparency carrier by spraying, printing or press moulding mode;
Several led chips are installed on described first fluorescent adhesive layer, several led chips described are in described first fluorescent adhesive layer On be arranged in some rows, often row include several led chips;
By conductor wire, the both positive and negative polarity of several led chip surfaces on described first fluorescent adhesive layer is connected and forms chipset, Again described chipset is connected with the electrode of the connection power supply on described transparency carrier by conductor wire;
By way of pressing mold, the second fluorescent adhesive layer is covered in described first fluorescent adhesive layer surface and coats several led cores Piece;
Along often arranging led chip, described transparency carrier is cut into some LED lamp bars, described LED lamp bar be shaped as cylindricality.
7. LED lamp bar according to claim 6 manufacture method it is characterised in that: several led chips described are to pass through Reflow soldering process is fixed on described first fluorescent adhesive layer.
8. LED lamp bar according to claim 6 manufacture method it is characterised in that: every LED lamp bar includes several Led chip, several led chips described are to be connected in series on described transparency carrier.
CN201410225999.XA 2014-05-26 2014-05-26 LED (Light Emitting Diode) lamp bar and manufacturing method thereof CN103972369B (en)

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Application Number Priority Date Filing Date Title
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CN103972369B true CN103972369B (en) 2017-01-18

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CN104282831B (en) * 2014-09-24 2018-03-20 惠州市英吉尔光电科技有限公司 A kind of LED encapsulation structure and packaging technology
WO2016049938A1 (en) * 2014-09-30 2016-04-07 东莞保明亮环保科技有限公司 Omnidirectional led light source and manufacturing method therefor
CN104295973A (en) * 2014-10-11 2015-01-21 京东方光科技有限公司 Light bar manufacturing method
CN104319342A (en) * 2014-10-21 2015-01-28 深圳市瑞丰光电子股份有限公司 Led filament
CN104384067B (en) * 2014-10-30 2017-06-30 木林森股份有限公司 One kind is used for LED light bar Glue dripping head for dispensing glue and dispensing method
CN105702838A (en) * 2016-01-22 2016-06-22 常州市武进区半导体照明应用技术研究院 Fluorescent powder coating method
CN105609621A (en) * 2016-01-22 2016-05-25 常州市武进区半导体照明应用技术研究院 360-degree light source packaging device
CN106025004A (en) * 2016-06-30 2016-10-12 昆山初本电子科技有限公司 Method for coating protection material on LED chip
CN105977361A (en) * 2016-06-30 2016-09-28 昆山初本电子科技有限公司 LED packaging method
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Effective date of registration: 20190327

Address after: 224000 Yandu District Intelligent Terminal Industrial Park, Yancheng City, Jiangsu Province

Patentee after: Yancheng Dongshan Precision Manufacturing Co., Ltd.

Address before: 215107 No. 8 Fenghuangshan Road, Dongshan Industrial Park, Wuzhong District, Suzhou City, Jiangsu Province

Patentee before: Suzhou Dongshan Precision Manufacturing Co., Ltd.