CN105546499A - Radiator and flip-chip mining lamp - Google Patents
Radiator and flip-chip mining lamp Download PDFInfo
- Publication number
- CN105546499A CN105546499A CN201610102523.6A CN201610102523A CN105546499A CN 105546499 A CN105546499 A CN 105546499A CN 201610102523 A CN201610102523 A CN 201610102523A CN 105546499 A CN105546499 A CN 105546499A
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- component
- radiator
- diameter
- parts
- aluminium nitride
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
An embodiment of the invention discloses a COB (chip on board) light source of a flip-chip mining lamp. The flip-chip mining lamp comprises an optical lens, an aluminum nitride ceramic bracket, an FR4 line and a radiator. According to the light source produced with a novel design concept, the size of the radiator is smaller than that of a conventional radiator, and the radiator can bear the temperature as high as 70 DEG C; an LED light source produced with a flip-chip technology has quite good shock-proof stability due to the facts that the welding die bonding is adopted, wire bonding is not needed, and an eutectic bracket and the radiator are connected through reflow soldering; the optical glass lens is designed on the surface of a chip packaging block, so that an adhesive surface of the chip packaging block can be protected from pollution, permeation of water and air can be prevented, the adhesive surface is isolated from direct contact with the environment, aging of the adhesive surface is retarded, and the service life of a product is prolonged greatly.
Description
Technical field
The embodiment of the present invention relates to the technical field of illumination, particularly relates to a kind of radiator and covers brilliant bulkhead lamp capable.
Background technology
At present, the bulkhead lamp capable lighting source product major part that market is applied is high-pressure mercury lamp, fraction adopts the solid state LED lighting source product that direct die bond the traditional handicraft mode of bonding wire are produced on aluminium base, copper base or ceramic substrate, additional secondary lens.Because common LED light source needs to use insulating cement or elargol to carry out die bond mostly, its thermal resistance is generally at 12 DEG C/W, and thermal resistance is relatively high, and light source heat radiation exists very large problem.The LED light source adopting traditional bonding wire craft to make in addition, can not bear larger pulse current, more can not long-time stable work under the driving of big current; All can be greatly affected because the driving of pulse current excessive or long-time big current (1A) can cause the colloid of product, gold thread and chip P to N to tie, easily cause colloid expanded by heating, break the problem such as dead lamp and junction temperature of chip rising.And common LED bulkhead lamp capable light source can not stand dither for a long time, because long-term dither very easily causes light source to occur the problems such as dead lamp, loose contact that break, greatly reduce the service life of product, the light efficiency of common LED bulkhead lamp capable is generally at 70-90lm/w, and light extraction efficiency is lower and light source and secondary lens are splits.
Summary of the invention
The object of the embodiment of the present invention is propose a kind of radiator and cover brilliant bulkhead lamp capable, is intended to solve LED bay light light source and can not stands dither for a long time, because long-term dither very easily causes light source to occur the problems such as dead lamp, loose contact that break.
For reaching this object, the embodiment of the present invention by the following technical solutions:
First aspect, a kind of radiator, described radiator comprises: barrel radiator body, caping, described barrel radiator and described caping are close to, be close to around described barrel radiator body and catch is set, described caping comprises first component, second component and the 3rd parts, and the center of circle of described first component, described second component and described 3rd parts is overlapping, and the shape of the shape of described first component, the shape of described second component and described 3rd parts is the circle with preset thickness; At the diameter that the diameter of described first component is less than the diameter of described second component, the diameter of described second component is less than the 3rd parts, four emptying apertures are set near the border of described 3rd parts.
Preferably, described catch is evenly arranged on described barrel radiator body.
Preferably, the diameter of described first component is 0 to 34.1mm, and the diameter of described second component is 0 to 99mm, and the diameter of described 3rd parts is 0 to 118.6mm.
Preferably, the thickness of described first component is 0 to 0.8mm, and the thickness of described second component is 0 to 4mm, and the thickness of described 3rd parts is 0 to 4mm.
Preferably, the diameter of described emptying aperture is 0 to 4mm.
Preferably, described barrel radiator body and caping are stainless steel.
Second aspect, one covers brilliant bulkhead lamp capable, described in cover brilliant bulkhead lamp capable and comprise: optical lens, aluminium nitride ceramics support, FR4 circuit and radiator;
There is circular groove the middle, bottom of described optical glass lens, and there is frosted process at the edge of described optical glass lens, and described optical glass lens is pasted onto directly over crystal covered chip;
Described aluminium nitride ceramics support comprises the rack body be made up of aluminium nitride ceramics, the one side of described support support body is evenly provided with multiple crystal bonding area, the back side of described aluminium nitride ceramics support, all there is electrogilding process at crystal bonding area and the pin place in front, the die bond groove with barrier wall structure is formed after surrounding's box dam enclosure wall glue of each crystal bonding area, the crystal covered chip of the gold-tin alloy that the bottom of described die bond groove is coated with sticks to the crystal bonding area of described aluminium nitride ceramics support by scaling powder, and evenly phosphor gel is applied on the chip of crystal bonding area, the number in parallel of described crystal bonding area die bond comprises the number pre-set,
Described radiator comprises barrel radiator body, caping, described barrel radiator and described caping are close to, be close to around described barrel radiator body and catch is set, described caping comprises first component, second component and the 3rd parts, the center of circle of described first component, described second component and described 3rd parts is overlapping, and the shape of the shape of described first component, the shape of described second component and described 3rd parts is the circle with preset thickness; At the diameter that the diameter of described first component is less than the diameter of described second component, the diameter of described second component is less than the 3rd parts, four emptying apertures are set near the border of described 3rd parts;
Described aluminium nitride ceramics support, the direct reflow soldering of described FR4 circuit are on described radiator, and circuit is drawn by described FR4 by the substrate of the aluminium nitride ceramics support of reflow soldering on described radiator.
Preferably, the high-performance glue that described optical glass lens high transmission rate is ageing-resistant is pasted onto directly over the chip package block of coating fluorescent material.
Preferably, described aluminium nitride ceramics support when high pressure reaches more than 3000V, described in cover brilliant bulkhead lamp capable thermal resistance be 0.5 DEG C/W.
Preferably, the operating current covering brilliant bulkhead lamp capable described in is 350mA to 1000mA.
The embodiment of the present invention provides one to cover brilliant bulkhead lamp capable, describedly cover brilliant bulkhead lamp capable and comprise: optical lens, aluminium nitride ceramics support, FR4 circuit and radiator, adopt the light source that new designing concept makes, heat sink size is little before comparing, and the temperature that radiator can bear can reach 70 degree; Common LED bulkhead lamp capable light source can not stand dither for a long time, because long-term dither very easily causes light source to occur the problems such as dead lamp, loose contact that break, greatly reduces the service life of product; And adopt the LED light source covering brilliant explained hereafter just to there is not this problem, because of its adopt welding die bond, again without the need to bonding wire and be coupled together by reflow soldering between eutectic support and radiator, its vibrostability is very good; And owing to encapsulating without gold thread, single chips also there will not be the dead lamp problem of broken string under the driving of 350mA-1000mA electric current; The high-performance glue that another high transmission rate ageing-resistant performance is excellent high transmission rate optical glass lens is pasted on applied fluorescent material chip package block directly over, lens are directly designed on light source product, eliminate the problem of the continuation choice for use secondary lens that will face when terminal uses; Not only can protect IC package blocks make glue face not contaminated at the surface design optical glass lens of chip package block; the infiltration of moisture and air can also be prevented; isolated glue face contacts with the direct of environment, slows down the aging of glue face, the service life of product is greatly improved.
Accompanying drawing explanation
Fig. 1 is the structural representation of a kind of radiator that the embodiment of the present invention provides;
Fig. 2 is the structural representation of a kind of caping that the embodiment of the present invention provides;
Fig. 3 is the top view of a kind of caping that the embodiment of the present invention provides;
Fig. 4 is the side schematic view of a kind of caping that the embodiment of the present invention provides;
Fig. 5 is a kind of structural representation covering brilliant bulkhead lamp capable that the embodiment of the present invention provides;
Fig. 6 is a kind of top view covering brilliant bulkhead lamp capable that the embodiment of the present invention provides;
Fig. 7 is a kind of side schematic view covering brilliant bulkhead lamp capable that the embodiment of the present invention provides;
Fig. 8 is the structural representation of a kind of optical lens that the embodiment of the present invention provides;
Fig. 9 is the structural representation of a kind of aluminium nitride ceramics support that the embodiment of the present invention provides.
Main element symbol description:
101 is barrel radiator body, and 102 is caping, and 1021 is first component, 1022 is second component, 1023 is the 3rd parts, and 501 is optical glass lens, and 502 is radiator, 801 is optical glass lens, 802 is radiating copper substrate, and 901 is the positive electrode pad of aluminium nitride ceramics support, and 902 is the negative electrode pad of aluminium nitride ceramics support, 903 is die bond groove, and 904 is crystal bonding area.
Detailed description of the invention
Below in conjunction with drawings and Examples, the embodiment of the present invention is described in further detail.Be understandable that, specific embodiment described herein is only for explaining the embodiment of the present invention, but not the restriction to the embodiment of the present invention.It also should be noted that, for convenience of description, illustrate only the part relevant to the embodiment of the present invention in accompanying drawing but not entire infrastructure.
Embodiment one
With reference to the structural representation that figure 1, Fig. 1 is a kind of radiator that the embodiment of the present invention provides.
As shown in Figure 1, barrel radiator body, caping, described barrel radiator and described caping are close to, be close to around described barrel radiator body and catch is set, described caping comprises first component, second component and the 3rd parts, the center of circle of described first component, described second component and described 3rd parts is overlapping, and the shape of the shape of described first component, the shape of described second component and described 3rd parts is the circle with preset thickness; At the diameter that the diameter of described first component is less than the diameter of described second component, the diameter of described second component is less than the 3rd parts, four emptying apertures are set near the border of described 3rd parts.
Preferably, described catch is evenly arranged on described barrel radiator body.
Preferably, the diameter of described first component is 0 to 34.1mm, and the diameter of described second component is 0 to 99mm, and the diameter of described 3rd parts is 0 to 118.6mm.
Preferably, the thickness of described first component is 0 to 0.8mm, and the thickness of described second component is 0 to 4mm, and the thickness of described 3rd parts is 0 to 4mm.
Preferably, the diameter of described emptying aperture is 0 to 4mm.
Preferably, described barrel radiator body and caping are stainless steel.
The embodiment of the present invention provides a kind of radiator, and described heat sink size is little before comparing, and the temperature that radiator can bear can reach 70 degree.
Embodiment two
A kind of structural representation covering brilliant bulkhead lamp capable that the embodiment of the present invention provides with reference to figure 5, Fig. 5.
In embodiment two, described in cover brilliant bulkhead lamp capable and comprise: optical lens, aluminium nitride ceramics support, FR4 circuit and radiator;
There is circular groove the middle, bottom of described optical glass lens, and there is frosted process at the edge of described optical glass lens, and described optical glass lens is pasted onto directly over crystal covered chip;
Described aluminium nitride ceramics support comprises the rack body be made up of aluminium nitride ceramics, the one side of described support support body is evenly provided with multiple crystal bonding area, the back side of described aluminium nitride ceramics support, all there is electrogilding process at crystal bonding area and the pin place in front, the die bond groove with barrier wall structure is formed after surrounding's box dam enclosure wall glue of each crystal bonding area, the crystal covered chip of the gold-tin alloy that the bottom of described die bond groove is coated with sticks to the crystal bonding area of described aluminium nitride ceramics support by scaling powder, and evenly phosphor gel is applied on the chip of crystal bonding area, the number in parallel of described crystal bonding area die bond comprises the number pre-set,
Described radiator comprises barrel radiator body, caping, described barrel radiator and described caping are close to, be close to around described barrel radiator body and catch is set, described caping comprises first component, second component and the 3rd parts, the center of circle of described first component, described second component and described 3rd parts is overlapping, and the shape of the shape of described first component, the shape of described second component and described 3rd parts is the circle with preset thickness; At the diameter that the diameter of described first component is less than the diameter of described second component, the diameter of described second component is less than the 3rd parts, four emptying apertures are set near the border of described 3rd parts;
Described aluminium nitride ceramics support, the direct reflow soldering of described FR4 circuit are on described radiator, and circuit is drawn by described FR4 by the substrate of the aluminium nitride ceramics support of reflow soldering on described radiator.
Preferably, the high-performance glue that described optical glass lens high transmission rate is ageing-resistant is pasted onto directly over the chip package block of coating fluorescent material.
Preferably, described aluminium nitride ceramics support when high pressure reaches more than 3000V, described in cover brilliant bulkhead lamp capable thermal resistance be 0.5 DEG C/W.
Preferably, the operating current covering brilliant bulkhead lamp capable described in is 350mA to 1000mA.
The embodiment of the present invention provides one to cover brilliant bulkhead lamp capable, describedly cover brilliant bulkhead lamp capable and comprise: optical lens, aluminium nitride ceramics support, FR4 circuit and radiator, adopt the light source that new designing concept makes, heat sink size is little before comparing, and the temperature that radiator can bear can reach 70 degree; Common LED bulkhead lamp capable light source can not stand dither for a long time, because long-term dither very easily causes light source to occur the problems such as dead lamp, loose contact that break, greatly reduces the service life of product; And adopt the LED light source covering brilliant explained hereafter just to there is not this problem, because of its adopt welding die bond, again without the need to bonding wire and be coupled together by reflow soldering between eutectic support and radiator, its vibrostability is very good; And owing to encapsulating without gold thread, single chips also there will not be the dead lamp problem of broken string under the driving of 350mA-1000mA electric current; The high-performance glue that another high transmission rate ageing-resistant performance is excellent high transmission rate optical glass lens is pasted on applied fluorescent material chip package block directly over, lens are directly designed on light source product, eliminate the problem of the continuation choice for use secondary lens that will face when terminal uses; Not only can protect IC package blocks make glue face not contaminated at the surface design optical glass lens of chip package block; the infiltration of moisture and air can also be prevented; isolated glue face contacts with the direct of environment, slows down the aging of glue face, the service life of product is greatly improved.
Embodiment three
With reference to the structural representation that figure 8, Fig. 8 is a kind of optical lens that the embodiment of the present invention provides.
In fig. 8, there is circular groove the middle, bottom of described optical glass lens 801, and there is frosted process at the edge of described optical glass lens 801; Described optical glass lens 801 is pasted onto directly over the chip package block on radiating copper substrate 802.
The refraction coefficient of described optical glass lens is 1.474.
The acid resistance of described optical glass lens reaches 1 grade, and alkali resistance reaches A level.
The coefficient of expansion of described optical glass lens is 3.3.
Concrete, it is high, wear-resistant that the material of optical glass lens has transparency, smooth surface, cleaning easily, the advantages such as health; The coefficient of expansion of this optical glass lens is 3.3, the high-boron-silicon glass coefficient of expansion is low, is generally to be taken out by glass to water the hot water just opened from refrigerating chamber at once, and glass can not break, the glassware of individual layer directly can enter micro-wave oven, and can be placed on naked light dry combustion method 20 minutes.
The embodiment of the present invention provides a kind of optical glass lens, and there is circular groove the middle, bottom of described optical glass lens, and there is frosted process at the edge of described optical glass lens; Described optical glass lens is pasted onto directly over the chip package block on radiating copper substrate, thus the use of solution light source terminal needs the problem selecting rational secondary lens.
Embodiment four
With reference to the structural representation that figure 9, Fig. 9 is a kind of aluminium nitride ceramics support that the embodiment of the present invention provides.
In fig .9, described aluminium nitride ceramics support comprises the rack body be made up of aluminium nitride ceramics, the one side of described support support body is evenly provided with multiple crystal bonding area 904, the back side of described aluminium nitride ceramics support, all there is electrogilding process at crystal bonding area 904 and the pin place in front, the die bond groove 903 with barrier wall structure is formed after surrounding's box dam enclosure wall glue of each crystal bonding area 904, the crystal covered chip of the gold-tin alloy that the bottom of described die bond groove 903 is coated with sticks to the crystal bonding area 904 of described aluminium nitride ceramics support by scaling powder, the number in parallel of crystal bonding area 904 die bond of described aluminium nitride ceramics support comprises the number pre-set.
The dual-side of described aluminium nitride ceramics rack body is provided with positive electrode 901 for welding with external power leads and negative electrode 902.
The another side of described aluminium nitride ceramics support is provided with the ceramic pad with the reflow soldering of described radiating copper substrate.
On the surface of described aluminium nitride ceramics rack body, plating has layer gold or silver layer.
The bottom land of described each die bond groove is equipped with the locating hole of locating described crystal covered chip for die bond.
Described barrier wall structure is circular barrier wall structure or square barrier wall structure or rectangle barrier wall structure.
The embodiment of the present invention provides a kind of aluminium nitride ceramics support, described aluminium nitride ceramics support comprises the rack body be made up of aluminium nitride ceramics, the one side of described support support body is evenly provided with multiple crystal bonding area, the back side of described aluminium nitride ceramics support, all there is electrogilding process at crystal bonding area and the pin place in front, the die bond groove with barrier wall structure is formed after surrounding's box dam enclosure wall glue of each crystal bonding area, the crystal covered chip of the gold-tin alloy that the bottom of described die bond groove is coated with sticks to the crystal bonding area of described aluminium nitride ceramics support by scaling powder, the number in parallel of the crystal bonding area die bond of described aluminium nitride ceramics support comprises the number pre-set, good thermoelectricity separating effect can be realized, flip-chip adopts the mode covering crystalline substance to be fixed on die bond groove, not only can avoid the uneven loss causing luminous flux because of elargol amount in elargol die bond process, and make the combination of flip-chip and support very firm, adhesion is very good, the phenomenon come off can not be there is in chip because of ambient influnence.
Below the know-why of the embodiment of the present invention is described in conjunction with specific embodiments.These describe the principle just in order to explain the embodiment of the present invention, and can not be interpreted as the restriction to embodiment of the present invention protection domain by any way.Based on explanation herein, those skilled in the art does not need to pay other detailed description of the invention that performing creative labour can associate the embodiment of the present invention, these modes all by fall into the embodiment of the present invention protection domain within.
Claims (10)
1. a radiator, it is characterized in that, described radiator comprises: barrel radiator body, caping, described barrel radiator and described caping are close to, be close to around described barrel radiator body and catch is set, described caping comprises first component, second component and the 3rd parts, the center of circle of described first component, described second component and described 3rd parts is overlapping, and the shape of the shape of described first component, the shape of described second component and described 3rd parts is the circle with preset thickness; At the diameter that the diameter of described first component is less than the diameter of described second component, the diameter of described second component is less than the 3rd parts, four emptying apertures are set near the border of described 3rd parts.
2. radiator according to claim 1, is characterized in that, described catch is evenly arranged on described barrel radiator body.
3. radiator according to claim 1, is characterized in that, the diameter of described first component is 0 to 34.1mm, and the diameter of described second component is 0 to 99mm, and the diameter of described 3rd parts is 0 to 118.6mm.
4. radiator according to claim 1, is characterized in that, the thickness of described first component is 0 to 0.8mm, and the thickness of described second component is 0 to 4mm, and the thickness of described 3rd parts is 0 to 4mm.
5. radiator according to claim 1, is characterized in that, the diameter of described emptying aperture is 0 to 4mm.
6. the radiator according to claim 1 to 5 any one, is characterized in that, described barrel radiator body and caping are stainless steel.
7. cover a brilliant bulkhead lamp capable, it is characterized in that, described in cover brilliant bulkhead lamp capable and comprise: optical lens, aluminium nitride ceramics support, FR4 circuit and radiator;
There is circular groove the middle, bottom of described optical glass lens, and there is frosted process at the edge of described optical glass lens, and described optical glass lens is pasted onto directly over crystal covered chip;
Described aluminium nitride ceramics support comprises the rack body be made up of aluminium nitride ceramics, the one side of described support support body is evenly provided with multiple crystal bonding area, the back side of described aluminium nitride ceramics support, all there is electrogilding process at crystal bonding area and the pin place in front, the die bond groove with barrier wall structure is formed after surrounding's box dam enclosure wall glue of each crystal bonding area, the crystal covered chip of the gold-tin alloy that the bottom of described die bond groove is coated with sticks to the crystal bonding area of described aluminium nitride ceramics support by scaling powder, and evenly phosphor gel is applied on the chip of crystal bonding area, the number in parallel of described crystal bonding area die bond comprises the number pre-set,
Described radiator comprises barrel radiator body, caping, described barrel radiator and described caping are close to, be close to around described barrel radiator body and catch is set, described caping comprises first component, second component and the 3rd parts, the center of circle of described first component, described second component and described 3rd parts is overlapping, and the shape of the shape of described first component, the shape of described second component and described 3rd parts is the circle with preset thickness; At the diameter that the diameter of described first component is less than the diameter of described second component, the diameter of described second component is less than the 3rd parts, four emptying apertures are set near the border of described 3rd parts;
Described aluminium nitride ceramics support, the direct reflow soldering of described FR4 circuit are on described radiator, and circuit is drawn by described FR4 by the substrate of the aluminium nitride ceramics support of reflow soldering on described radiator.
8. according to claim 7ly cover brilliant bulkhead lamp capable, it is characterized in that, the ageing-resistant high-performance glue of described optical glass lens high transmission rate is pasted onto directly over the chip package block of coating fluorescent material.
9. according to claim 7ly cover brilliant bulkhead lamp capable, it is characterized in that, described aluminium nitride ceramics support when high pressure reaches more than 3000V, described in cover brilliant bulkhead lamp capable thermal resistance be 0.5 DEG C/W.
10. according to claim 7ly cover brilliant bulkhead lamp capable, it is characterized in that, described in cover brilliant bulkhead lamp capable operating current be 350mA to 1000mA.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102523.6A CN105546499A (en) | 2016-02-25 | 2016-02-25 | Radiator and flip-chip mining lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102523.6A CN105546499A (en) | 2016-02-25 | 2016-02-25 | Radiator and flip-chip mining lamp |
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| Publication Number | Publication Date |
|---|---|
| CN105546499A true CN105546499A (en) | 2016-05-04 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610102523.6A Pending CN105546499A (en) | 2016-02-25 | 2016-02-25 | Radiator and flip-chip mining lamp |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106099A (en) * | 2019-12-10 | 2020-05-05 | 温州大学新材料与产业技术研究院 | High-power COB heat dissipation packaging structure |
| CN116410001A (en) * | 2021-12-31 | 2023-07-11 | 江苏博睿光电股份有限公司 | Substrate, preparation method and application |
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| CN103474566A (en) * | 2013-09-13 | 2013-12-25 | 中国科学院工程热物理研究所 | LED radiator |
| CN203534296U (en) * | 2013-08-14 | 2014-04-09 | 奉化市垭特机电科技有限公司 | Novel LED sunflower radiator |
| CN105098031A (en) * | 2015-07-09 | 2015-11-25 | 深圳市格天光电有限公司 | Chip-on-board (COB) light source of flip chip mining lamp |
| CN205383579U (en) * | 2016-02-25 | 2016-07-13 | 深圳市格天光电有限公司 | Radiator with cover brilliant industrial and mining lamp |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN201576701U (en) * | 2009-12-25 | 2010-09-08 | 上海必威电机电器有限公司 | Metal cooling device for LED lamp chip |
| CN203534296U (en) * | 2013-08-14 | 2014-04-09 | 奉化市垭特机电科技有限公司 | Novel LED sunflower radiator |
| CN103474566A (en) * | 2013-09-13 | 2013-12-25 | 中国科学院工程热物理研究所 | LED radiator |
| CN105098031A (en) * | 2015-07-09 | 2015-11-25 | 深圳市格天光电有限公司 | Chip-on-board (COB) light source of flip chip mining lamp |
| CN205383579U (en) * | 2016-02-25 | 2016-07-13 | 深圳市格天光电有限公司 | Radiator with cover brilliant industrial and mining lamp |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111106099A (en) * | 2019-12-10 | 2020-05-05 | 温州大学新材料与产业技术研究院 | High-power COB heat dissipation packaging structure |
| CN116410001A (en) * | 2021-12-31 | 2023-07-11 | 江苏博睿光电股份有限公司 | Substrate, preparation method and application |
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Application publication date: 20160504 |