CN104505454B - Specular removal street lamp flip COB light source and its production technology - Google Patents
Specular removal street lamp flip COB light source and its production technology Download PDFInfo
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- CN104505454B CN104505454B CN201410737952.1A CN201410737952A CN104505454B CN 104505454 B CN104505454 B CN 104505454B CN 201410737952 A CN201410737952 A CN 201410737952A CN 104505454 B CN104505454 B CN 104505454B
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/62—Arrangements for conducting electric current to or from the semiconductor body, e.g. lead-frames, wire-bonds or solder balls
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
- H01L33/56—Materials, e.g. epoxy or silicone resin
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
- H01L33/641—Heat extraction or cooling elements characterized by the materials
Abstract
The invention discloses a kind of specular removal street lamp flip COB light source and its production technology, the COB light source includes red metal heat-radiating substrate, lens, aluminium oxide ceramics support and flip-chip；Flip-chip by eutectic furnace under the protection of nitrogen atmosphere flip on the crystal bonding area of aluminium oxide ceramics support；Aluminium oxide ceramics support is fixed on the heavy platform of red metal heat-radiating substrate by the way of reflow soldering；Lens include that what is flipped up prolongs the lens section of edge and the upward oval hemispherical shelled peanut shape in bulge-structure；Lens are fixed on red metal heat-radiating substrate by the glue of high transmission rate, and both enclose a cavity, and the aluminium oxide ceramics support that flip has flip-chip is fixed in the cavity, and groove is located at the surface in the fluorescent material area of aluminium oxide ceramics support；The bottom of flip-chip is coated with high heat conduction gold-tin alloy.Production technology of the invention is advanced and production efficiency is high, and the product that production is obtained has the advantages that luminous efficiency is high, light transmittance is high, light-gathering good, excellent radiation performance.
Description
Technical field
The present invention relates to lighting technical field, more particularly to a kind of specular removal street lamp flip COB light source and its production technology.
Background technology
At present, the street lighting light source product major part of in the market application is high-pressure mercury lamp, and fraction is utilized in aluminium base
The solid state LED that the traditional handicraft mode of direct die bond and bonding wire is produced on board mount, copper-based board mount or ceramic substrate support is shone
Mingguang City's product-derived.Because common LED light source needs to use insulating cement or elargol to carry out die bond mostly, its thermal resistance is general in 12 DEG C/W, heat
Resistance is of a relatively high, and light source heat radiation there are problems that very big.The LED light source for being made using traditional bonding wire craft in addition, it is impossible to bear
Larger pulse current, can not the long-time stable work under the driving of high current；Because pulse current is excessive or big for a long time
Electric current 1000mA drives can cause colloid, gold thread and the chip P-N junction of product to be all greatly affected, and easily cause colloid and receive
The problems such as thermal expansion, the dead lamp of broken string and junction temperature of chip are raised.And common LED road-light light-source can not for a long time undergo dither,
Because long-term dither easily caused by light source there is the problems such as dead lamp of broken string, loose contact, greatly reduce the use longevity of product
Life.Furthermore, common LED lighting source product generally needs to face when terminal is used and continues to select to use secondary light-distribution lens to ask
Topic, and to coordinate the suitable waterproof gasket cement of selection to carry out waterproof sealing treatment.
There is following defect in use in the description of summary, existing light source：
1st, the waterproof of light source, vibrostability problem；
2nd, light source terminal use will select the problem of secondary light-distribution lens and waterproof gasket cement；
3rd, light source light-emitting efficiency is low and produces the problem of gold-tinted circle；
4th, the bad problem of light source integral heat sink；
5th, the thermoelectricity separation problem of chip and support；
6th, the bad problem of products air tightness；
7th, the inconsistent problem of the thermal coefficient of expansion of chip, elargol and support；
8th, between elargol and chip and support adhesion problem；
9th, light source can not bear the problem of long-term high current steady operation.
The content of the invention
For weak point present in above-mentioned technology, a kind of luminous efficiency of present invention offer is high, light transmittance is high, light-gathering
Good, heat resistant, weatherability and thermal conductivity factor area of dissipation high is big, the specular removal street lamp flip COB light of excellent radiation performance
Source and its production technology.
To achieve the above object, the present invention provides a kind of specular removal street lamp flip COB light source, including is made up of red metal material
Red metal heat-radiating substrate, the lens, aluminium oxide ceramics support and the flip-chip that are made up of high-boron-silicon glass material；
The aluminium oxide ceramics support forms silver layer, and the aluminium oxide ceramics branch in its surface after doing plate silver treatment
Be equipped with crystal bonding area on frame, the flip-chip by eutectic furnace under the protection of nitrogen atmosphere flip to aluminium oxide ceramics support
Crystal bonding area on；And the surface of the flip-chip is uniformly coated with phosphor gel；
Liang Ge copper foil circuits area is distributed with the one side of the red metal heat-radiating substrate, and is caved on the middle position in the face and has
Heavy platform, Liang Ge copper foil circuits area is located at the both sides of heavy platform respectively, and two ends of the red metal heat-radiating substrate are equipped with and are symmetrical arranged
Through hole；The surface in the heavy platform, through hole and copper foil circuit area is plated with nickeline floor, and heavy platform, copper foil circuit area surface
Silver-colored nickel coating has good surface tension and heat conduction anti-corrosion capability, and the silver-colored nickel coating on copper foil circuit area surface can form pole
Good minute surface, also has excellent optical specular reflection effect to light, greatly reduces the loss of light energy and improves hair
Light efficiency；The aluminium oxide ceramics support is fixed on the heavy platform of red metal heat-radiating substrate by the way of reflow soldering；
The lens include flip up prolong edge and upwards in bulge-structure oval hemispherical shelled peanut shape it is saturating
Mirror portion；The a plurality of parabolical texture with optically focused effect, many textures are provided with the surface of the lens section in the width direction
Width be in the structure distribution gradually successively decreased from lens section centre to both sides, and per adjacent two texture between form embedded knot
Structure；The inside centre of the lens section is provided with the groove that can protect flip-chip and tool optically focused effect along the direction of width；
The lens are fixed on red metal heat-radiating substrate by the glue of high transmission rate, and both enclose a cavity, institute
The aluminium oxide ceramics support that stating flip has flip-chip is fixed in the cavity, is applied in the crystal bonding area of the aluminium oxide ceramics support
Fluorescent material area is formed after covering fluorescent material, the groove is located at the surface in the fluorescent material area of aluminium oxide ceramics support；
The bottom of the flip-chip is coated with high heat conduction gold-tin alloy.
Wherein, the crystal bonding area it is outer place coating enclosure wall glue after by the crystal bonding area box dam into barricade；The barricade with
Groove encloses package cavity between the two, and the Flip-Chip Using is in the package cavity.
Wherein, silver-plated process is done at the back side of the aluminium oxide ceramics support, positive crystal bonding area and pin.
Wherein, multiple chip positioning grooves, the upside-down mounting core are vertically arranged with the crystal bonding area of the aluminium oxide ceramics support
Piece is fixed in chip positioning groove.
Wherein, it is provided with the pressure matched with the shape size of external fixator at the bottom peripheral edge of the lens section
Ring；And the pressure ring is engaged and formed successively by multiple arc shape outer lug head and the tail of different sizes.
Wherein, the section of many textures is serrated structure distribution；The curved structure distribution of inwall of the groove,
And the groove is in half cylindrical structure.
Wherein, the surface of the red metal heat-radiating substrate is divided into the plating nickeline area and non-plated nickeline area of plated nickel silver layer, described non-
Applied in plating nickeline area and be coated with white oil；And multiple nickeline pads are also electroplate with the one side of red metal heat-radiating substrate.
Wherein, the depth of the heavy platform is 0.38mm or so, and a diameter of 3.5mm of through hole or so.
To achieve the above object, the present invention also provides a kind of production technology of specular removal street lamp flip COB light source, including with
Lower step：
Step 1, die bond：By aluminium oxide ceramics support alcohol washes it is clean after flip-chip is sticked into oxygen with scaling powder
Change on aluminium ceramics bracket crystal bonding area；
Step 2, eutectic：The aluminium oxide ceramics branch that die bond is completed is placed in the eutectic furnace for set technological parameter to be carried out
Eutectic technology operation；
Step 3, the aluminium oxide ceramics support that eutectic is completed is carried out the operation of enclosure wall glue and toasted；
Step 4, coats phosphor gel and is tested, and baking process operation is carried out after test passes；Baking completes laggard
Row test and quality of finished inspection again；
Step 5, aluminium oxide ceramics support is fixed on the heavy platform of red metal heat-radiating substrate by the way of reflow soldering；
Step 6, using high transmission rate heat resistant glue by the high-boron-silicon glass lens of oval hemispherical shelled peanut shape
It is fixed on red metal heat-radiating substrate, and forms COB light source.
Wherein, the baking process in the step 4 is 50 DEG C and toasts 2 hours, turns 60 DEG C and toasts 1.5 hours, then turns 150 DEG C
Baking 2 hours.
Compared with prior art, the present invention is provided specular removal street lamp flip COB light source and its production technology, with following
Beneficial effect：
1）The bottom of flip-chip is coated with high heat conduction gold-tin alloy, illustrates that the flip-chip is welded using high thermal conductivity alloy
Die bond, the elargol or insulating cement die bond in traditional handicraft are instead of, chip obscission is not occurred because of ambient influnence；
2）The aluminium oxide ceramics support of use can realize good thermoelectricity separating effect, high pressure resistant up to more than 3000V；
3）Using the big red metal heat-radiating substrate of thermal conductivity factor area of dissipation high, flip-chip and eutectic technology is combined, greatly
The heat dispersion of product is optimized, product thermal resistance is reduced to 0.5 DEG C/W, solve the radiating hardly possible problem of product；
4）Common LED road-light light-source can not for a long time undergo dither, because long-term dither easily caused by light source occur
Break dead lamp, loose contact the problems such as, greatly reduce the service life of product；And use the LED light source of flip technique productions
Just in the absence of this problem, because it is using welding die bond and without being to pass through between bonding wire and eutectic support and heat-radiating substrate
What reflow soldering was coupled together, its vibrostability is very good；And due to being welded without gold thread, single chip is in 1000mA electric currents
Driving under be also not in the dead lamp problem of broken string；
5）With the high-performance glue of high transmission rate heat resistant by the high-boron-silicon glass lens of high transmission rate good weatherability
The surface of the flip-chip for having coated phosphor gel is pasted on, lens are directly designed on light source product, both eliminated
The continuation to be faced when terminal is used selects to use the problem of secondary light-distribution lens to turn avoid the suitable anti-watertight of cooperation selection
Sealing carries out the trouble of waterproof sealing treatment；
6）Due to having done the treatment of plating nickeline on copper foil circuit area surface, high-boron-silicon glass lens and red metal can be greatly improved
Surface between heat-radiating substrate combines tension force so that the combination between lens and red metal heat-radiating substrate, aluminium oxide ceramics support is tight
It is close firmly difficult for drop-off；And the light that light source is emitted plated can have the surface of nickeline to form mirror-reflection, light is anti-
After shooting out from high-boron-silicon glass lens carry out with treatment, luminous energy can farthest be utilized, and greatly improve light
The luminous efficiency in source, and the gold-tinted circle produced when eliminating luminous；
7）In the surface design high-boron-silicon glass lens of flip-chip not only there is good optical concentration effect also to protect
Flip-chip makes glue surface not be contaminated, and can also prevent the infiltration of moisture and air, and isolation glue surface connects with the direct of environment
Touch to slow down the aging of glue surface, the service life of product is greatly improved；
8）Production technology of the invention is advanced and production efficiency is high, and the product that obtains of production has that luminous efficiency is high, printing opacity
Rate is high, light-gathering is good, heat resistant, weatherability and thermal conductivity factor area of dissipation high big, excellent radiation performance the advantages of.
Brief description of the drawings
Fig. 1 is the structure chart of aluminium oxide ceramics support in the present invention；
Fig. 2 is the structure chart after installation flip-chip in Fig. 1；
Fig. 3 is the structure chart of red metal heat-radiating substrate in the present invention；
Fig. 4 is the structure chart after the treatment of Fig. 3 plating nickeline；
Fig. 5 is the structure chart of lens in the present invention；
Fig. 6 is the upward view of Fig. 5；
Fig. 7 is the sectional view of Fig. 5；
Fig. 8 is the structure chart of specular removal street lamp flip COB light source in the present invention；
Fig. 9 is the production technological process of specular removal street lamp flip COB light source in the present invention.
Main element symbol description is as follows：
1st, red metal heat-radiating substrate 2, lens
3rd, aluminium oxide ceramics support 4, flip-chip
11st, copper foil circuit area 12, heavy platform
13rd, through hole 14, nickeline layer
15th, non-plated nickeline area 16, nickeline pad
21st, edge 22, lens section is prolonged
23rd, pressure ring 31, crystal bonding area
32nd, barricade 33, chip positioning groove
221st, texture 222, groove
231st, outer lug.
Specific embodiment
In order to more clearly state the present invention, the present invention is further described below in conjunction with the accompanying drawings.
Refer to Fig. 1-8, the specular removal street lamp flip COB light source that the present invention is provided, including by red metal material be made it is red
Copper heat-radiating substrate 1, the lens 2, aluminium oxide ceramics support 3 and the flip-chip 4 that are made up of high-boron-silicon glass material；
Aluminium oxide ceramics support 3 forms silver layer, and the aluminium oxide ceramics support 3 in its surface after doing plate silver treatment
On be equipped with crystal bonding area 31, flip-chip 4 by eutectic furnace under the protection of nitrogen atmosphere flip to aluminium oxide ceramics support 3
On crystal bonding area 31；And the surface of the flip-chip 4 is uniformly coated with phosphor gel；
Liang Ge copper foil circuits area 11 is distributed with the one side of red metal heat-radiating substrate 1, and is caved on the middle position in the face and has
Heavy platform 12, Liang Ge copper foil circuits area 11 is located at the both sides of heavy platform 12 respectively, and two ends of the red metal heat-radiating substrate 1 are equipped with symmetrically
The through hole 13 of setting；The surface of heavy platform 12, through hole 13 and copper foil circuit area 11 is plated with nickeline floor 14, and sinks platform, Copper Foil line
The silver-colored nickel coating on Lu Qu surfaces has good surface tension and heat conduction anti-corrosion capability, and the silver-colored nickel on copper foil circuit area surface is plated
Layer can form splendid minute surface, also have excellent optical specular reflection effect to light, greatly reduce the loss of light energy
And improve luminous efficiency；Aluminium oxide ceramics support 3 is fixed on the heavy platform 12 of red metal heat-radiating substrate 1 by the way of reflow soldering
On；The substrate is made of red metal material, improves the thermal conductivity factor and area of dissipation of the substrate, and then greatly optimizes light source
Heat dispersion, light source product thermal resistance is reduced to 0.5 DEG C/W, solve light source product radiating hardly possible problem；And in Copper Foil line
The treatment of plating nickeline is done on the surface in road area 11, greatly improves the tension force on the surface of radiating red metal heat-radiating substrate 1, make lens 2 with it is red
Being tightly combined between copper heat-radiating substrate 1 is firmly difficult for drop-off；And the light that light source is emitted is by being plated with nickeline
Surface can form mirror-reflection, and luminous energy can farthest be utilized, and greatly improve the luminous efficiency of light source, and disappear
Except the gold-tinted circle produced when lighting；
Lens 2 include that what is flipped up prolongs the lens of edge 21 and the upward oval hemispherical shelled peanut shape in bulge-structure
Portion 22；The a plurality of parabolical texture 221 with optically focused effect, many textures are provided with the surface of lens section 22 in the width direction
221 width is in the structure distribution gradually successively decreased from the centre of lens section 22 to both sides, and per adjacent two texture 221 between shape
Into insert structure；The inside centre of lens section 22 is provided with along the direction of width and can protect the groove of flip-chip 4 and optically focused
222；Lens are directly made using high-boron-silicon glass material so that the lens have excellent condenser performance and weather resistance；Thoroughly
Mirror coordinates the design of oval hemispherical shelled peanut shape structure design and the parabolical texture with optically focused effect, by the saturating of the design
Mirror is directly designed on light source product, has both been eliminated the continuation to be faced when terminal is used and has been selected to use secondary light-distribution lens
Problem, turn avoid the suitable waterproof gasket cement of cooperation selection to carry out the cumbersome of waterproof sealing treatment, in the course of the work light
The light in source be reflected after coming from the high-boron-silicon glass lens carry out with treatment, luminous energy can farthest be utilized
Come, greatly improve the luminous efficiency of light source, and the gold-tinted circle problem produced when also eliminating luminous；Further, groove
Design, chip that can be after protection packaging makes glue surface not be contaminated, moreover it is possible to prevent the infiltration of moisture and air, completely cut off glue surface with
The directly contact of environment, has greatly delayed the aging of glue surface, the service life of light source is greatly improved；
Lens 2 are fixed on red metal heat-radiating substrate 1 by the glue of high transmission rate heat resistant, and both enclose one
Cavity, the aluminium oxide ceramics support 3 that flip has flip-chip 4 is fixed in the cavity, the crystal bonding area 31 of aluminium oxide ceramics support 3
Fluorescent material area is formed after interior coating fluorescent material, the groove is located at the surface in the fluorescent material area of aluminium oxide ceramics support；The coating
Fluorescent material area is shaped as rectangle；
The bottom of flip-chip 4 is coated with high heat conduction gold-tin alloy.
In the present embodiment, crystal bonding area 31 it is outer place coating enclosure wall glue after by the box dam of crystal bonding area 31 into barricade 32；
Barricade 32 encloses package cavity between the two with groove 222, and flip-chip 4 is encapsulated in the package cavity.Aluminium oxide ceramics support 3
Silver-plated process is done at the back side, positive crystal bonding area and pin.It is vertically arranged with the crystal bonding area 31 of aluminium oxide ceramics support 3 many
Individual chip positioning groove 33, flip-chip 4 is fixed in chip positioning groove 33.The barricade is rectangle, it is, of course, also possible to be other shapes
Shape.
In the present embodiment, it is provided with the bottom peripheral edge of lens section 22 and is matched with the shape size of external fixator
Pressure ring 23；And the pressure ring 23 is engaged and formed successively by multiple head and the tail of arc shape outer lug 231 of different sizes.Work as flip-chip
4 it is packaged with lens 2 after, it is necessary to a whole set of light source is enclosed within external fixator, the lens using pressure ring 23 realize lens 2 with
The fixation of external fixator.Certainly, the concrete structure of pressure ring 23 is not limited in this case, can be solid according to practical matter and outside
The structure for determining part is changed, if the implementation method changed to the concrete structure of pressure ring 23, belongs to the simple change to this case
Shape or conversion, fall into the protection domain of this case.
In the present embodiment, the section of many textures 221 is serrated structure distribution；Certainly, the section of texture 221 is not
Be confined to be laciniation distribution, can also be other shapes；The curved structure distribution of inwall of groove 222, and this is recessed
Groove 222 is in half cylindrical structure.The arc of the groove 222 and height can be according to being designed the need for street lamp optics.In addition, this
Increased or decreased the need for the length of lens 2 and the light emission rate that can highly combine chip in case.
In the present embodiment, the surface of the red metal heat-radiating substrate 1 is divided into the plating nickeline area of plated nickel silver layer 14 and non-nickel plating
Silver-colored area 15, applies in non-plated nickeline area 15 and is coated with white oil；And multiple nickeline pads are also electroplate with the one side of red metal heat-radiating substrate 1
16.The non-plated nickeline area 15 of insulating effect has been equipped between each copper foil circuit area 11 and the side of heavy platform 12.White oil has
The effects such as insulating corrosion decoration, can further extend the service life of the substrate.Certainly, non-plated nickeline area 15 is not limited to apply
Cover white oil, can also be dirty oil or other there is the material of similar effect.
In the present embodiment, sink platform 12 depth for 0.38mm or so, and a diameter of 3.5mm of through hole 13 or so.This case
In optimal embodiment be that the depth of heavy platform 12 is 0.38mm and a diameter of 3.5mm of through hole 13.Certainly, can be according to practical matter
Specific size to the heavy platform 12 and through hole 13 is changed.
To achieve the above object, the present invention also provides a kind of production technology of specular removal street lamp flip COB light source, including with
Lower step：
Step S1, die bond：By aluminium oxide ceramics support alcohol washes it is clean after flip-chip is sticked to scaling powder
On aluminium oxide ceramics support crystal bonding area；
Step S2, eutectic：The aluminium oxide ceramics branch that die bond is completed is placed in the eutectic furnace for set technological parameter
Row eutectic technology operation；
Step S3, the aluminium oxide ceramics support that eutectic is completed is carried out the operation of enclosure wall glue and toasted；Baking in the step
Curing process is 150 DEG C and toasts 1 hour；
Step S4, coats phosphor gel and is tested, and is toasted after test passes；Baking process is 50 DEG C of bakings 2
Hour, turn 60 DEG C toast 1.5 hours, then turn 150 DEG C toast 2 hours；Semi-finished product in the step can be carried out with just subparameter to survey
Try and record test data；Tested again after the completion of to be baked and checked with quality of finished；
Step S5, aluminium oxide ceramics support is fixed on the heavy platform of red metal heat-radiating substrate by the way of reflow soldering；Should
Welded using middle temperature tin cream in step；
Step S6, using high transmission rate heat resistant glue by the high-boron-silicon glass lens of oval hemispherical shelled peanut shape
It is fixed on red metal heat-radiating substrate, and forms COB light source.After glue is adhesively fixed in the step and it is quiet put 6 hours after again 70
, finally be arranged on complete established COB light source on the external heat sink of autonomous die sinking design by DEG C baking 1 hour.
Specular removal street lamp flip COB light source and its production technology that the present invention is provided, have the advantage that：
1）The bottom of flip-chip is coated with high heat conduction gold-tin alloy, illustrates that the flip-chip is welded using high thermal conductivity alloy
Die bond, the elargol or insulating cement die bond in traditional handicraft are instead of, chip obscission is not occurred because of ambient influnence；
2）The aluminium oxide ceramics support of use can realize good thermoelectricity separating effect, high pressure resistant up to more than 3000V；
3）Using the big red metal heat-radiating substrate of thermal conductivity factor area of dissipation high, flip-chip and eutectic technology is combined, greatly
The heat dispersion of product is optimized, product thermal resistance is reduced to 0.5 DEG C/W, solve the radiating hardly possible problem of product；
4）Common LED road-light light-source can not for a long time undergo dither, because long-term dither easily caused by light source occur
Break dead lamp, loose contact the problems such as, greatly reduce the service life of product；And use the LED light source of flip technique productions
Just in the absence of this problem, because it is using welding die bond and without being to pass through between bonding wire and eutectic support and heat-radiating substrate
What reflow soldering was coupled together, its vibrostability is very good；And due to being welded without gold thread, single chip is in 1000mA electric currents
Driving under be also not in the dead lamp problem of broken string；
5）With the high-performance glue of high transmission rate heat resistant by the high-boron-silicon glass lens of high transmission rate good weatherability
The surface of the flip-chip for having coated fluorescent material is pasted on, lens are directly designed on light source product, both eliminated at end
The end continuation to be faced when using selects to use the problem of secondary light-distribution lens, turn avoid the cooperation suitable waterproof sealing of selection
Glue carries out the trouble of waterproof sealing treatment；
6）Due to having done the treatment of plating nickeline on copper foil circuit area surface, the heat conduction that can not only strengthen red metal heat-radiating substrate is resistance to
Erosion ability, the surface that can be also greatly improved between high-boron-silicon glass lens and red metal heat-radiating substrate is combined tension force so that lens with
Being tightly combined between red metal heat-radiating substrate, flip-chip is firmly difficult for drop-off；And the light that light source is emitted can be plated
Have nickeline surface formed mirror-reflection, light be reflected come after from high-boron-silicon glass lens carry out with treatment, luminous energy can
Farthest it is utilized, greatly improves the luminous efficiency of light source, and the gold-tinted circle produced when eliminating luminous；
7）In the surface design high-boron-silicon glass lens of flip-chip not only there is good optical concentration effect also to protect
Flip-chip makes glue surface not be contaminated, and can also prevent the infiltration of moisture and air, and isolation glue surface connects with the direct of environment
Touch to slow down the aging of glue surface, the service life of product is greatly improved；
8）Production technology of the invention is advanced and production efficiency is high, and the product that obtains of production has that luminous efficiency is high, printing opacity
Rate is high, light-gathering is good, heat resistant, weatherability and thermal conductivity factor area of dissipation high big, excellent radiation performance the advantages of..
Disclosed above is only several specific embodiments of the invention, but the present invention is not limited to this, any ability
What the technical staff in domain can think change should all fall into protection scope of the present invention.
Claims (8)
1. a kind of specular removal street lamp flip COB light source, it is characterised in that including be made up of red metal material red metal heat-radiating substrate,
Lens, aluminium oxide ceramics support and the flip-chip being made up of high-boron-silicon glass material；
The aluminium oxide ceramics support is formed on silver layer, and the aluminium oxide ceramics support in its surface after doing plate silver treatment
Crystal bonding area is equipped with, the flip-chip passes through eutectic furnace flip consolidating to aluminium oxide ceramics support under the protection of nitrogen atmosphere
On crystalline region；And the surface of the flip-chip is uniformly coated with phosphor gel；
Liang Ge copper foil circuits area is distributed with the one side of the red metal heat-radiating substrate, and is caved on the middle position in the face and has heavy
Platform, Liang Ge copper foil circuits area is located at the both sides of heavy platform respectively, and two ends of the red metal heat-radiating substrate are equipped with symmetrically arranged
Through hole；The surface in the heavy platform, through hole and copper foil circuit area is plated with nickeline floor, and heavy platform, the silver on copper foil circuit area surface
Nickel coating has good surface tension and heat conduction anti-corrosion capability, and the silver-colored nickel coating on copper foil circuit area surface can form splendid
Minute surface, to light also have excellent optical specular reflection effect, greatly reduce the loss of light energy and improve luminous
Efficiency；The aluminium oxide ceramics support is fixed on the heavy platform of red metal heat-radiating substrate by the way of reflow soldering；
The lens include that what is flipped up prolongs the lens section of edge and the upward oval hemispherical shelled peanut shape in bulge-structure；
The a plurality of parabolical texture with optically focused effect, the width of many textures are provided with the surface of the lens section in the width direction
From lens section centre to both sides insert structure is formed between the structure distribution gradually successively decreased, and every adjacent two texture；Institute
The inside centre for stating lens section is provided with the groove that can protect flip-chip and tool optically focused effect along the direction of width；
The lens are fixed on red metal heat-radiating substrate by the glue of high transmission rate, and both enclose a cavity, described to cover
The aluminium oxide ceramics support that crystalline substance has flip-chip is fixed in the cavity, is coated in the crystal bonding area of the aluminium oxide ceramics support glimmering
Fluorescent material area is formed after light powder, the groove is located at the surface in the fluorescent material area of aluminium oxide ceramics support；
The bottom of the flip-chip is coated with high heat conduction gold-tin alloy.
2. specular removal street lamp flip COB light source according to claim 1, it is characterised in that in the periphery of the crystal bonding area
By the crystal bonding area box dam into barricade after upper coating enclosure wall glue；The barricade encloses package cavity, the upside-down mounting between the two with groove
Chip package is in the package cavity.
3. specular removal street lamp flip COB light source according to claim 1, it is characterised in that the aluminium oxide ceramics support
The back side, do silver-plated process at positive crystal bonding area and pin.
4. specular removal street lamp flip COB light source according to claim 3, it is characterised in that the aluminium oxide ceramics support
Crystal bonding area on be vertically arranged with multiple chip positioning grooves, the flip-chip is fixed in chip positioning groove.
5. specular removal street lamp flip COB light source according to claim 1, it is characterised in that outside the bottom of the lens section
The pressure ring matched with the shape size of external fixator is provided with peripheral edge；And the pressure ring is by multiple arc shapes of different sizes
Engagement is formed outer lug head and the tail successively.
6. specular removal street lamp flip COB light source according to claim 1, it is characterised in that the section of many textures
Be serrated structure distribution；The curved structure distribution of inwall of the groove, and the groove is in half cylindrical structure.
7. specular removal street lamp flip COB light source according to claim 1, it is characterised in that the table of the red metal heat-radiating substrate
Face is divided into the plating nickeline area and non-plated nickeline area of plated nickel silver layer, is applied in the non-plated nickeline area and is coated with white oil；And red metal radiates
Multiple nickeline pads are also electroplate with the one side of substrate.
8. specular removal street lamp flip COB light source according to claim 1, it is characterised in that the depth of the heavy platform is
0.38mm or so, and a diameter of 3.5mm of through hole or so.
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| CN201410737952.1A CN104505454B (en) | 2014-12-06 | 2014-12-06 | Specular removal street lamp flip COB light source and its production technology |
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| CN201410737952.1A CN104505454B (en) | 2014-12-06 | 2014-12-06 | Specular removal street lamp flip COB light source and its production technology |
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| CN104505454B true CN104505454B (en) | 2017-06-20 |
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| CN105440964B (en) * | 2016-01-09 | 2018-03-30 | 厦门煜明光电有限公司 | A kind of mirror sections guard method of COB mirror-surface aluminum base boards |
| CN105789412B (en) * | 2016-03-11 | 2023-08-04 | 厦门理工学院 | Wafer-level LED with remote fluorescent powder layer and preparation method thereof |
| CN107316933A (en) * | 2017-07-18 | 2017-11-03 | 中山市圣上光电科技有限公司 | The special LED high beams of high ferro |
| CN107482001A (en) * | 2017-09-26 | 2017-12-15 | 深圳市立洋光电子股份有限公司 | A kind of super high power COB light source and its manufacture craft |
| CN110242877A (en) * | 2019-04-12 | 2019-09-17 | 华芯半导体研究中心(广州)有限公司 | A kind of high heat dissipation high-power LED lamp bead and preparation method thereof |
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|---|---|---|---|---|
| CN103151343A (en) * | 2010-02-12 | 2013-06-12 | 安德瑞国际有限公司 | Light emitting diode (LED) structure with functions of improving light-emitting efficiency and heat dissipation efficiency |
| CN103682059A (en) * | 2012-09-05 | 2014-03-26 | 长华电材股份有限公司 | Pre-manufacturing method and pre-manufactured structure for LED package |
| CN103972377A (en) * | 2014-05-08 | 2014-08-06 | 南京华鼎电子有限公司 | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| JP2011151268A (en) * | 2010-01-22 | 2011-08-04 | Sharp Corp | Light-emitting device |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103151343A (en) * | 2010-02-12 | 2013-06-12 | 安德瑞国际有限公司 | Light emitting diode (LED) structure with functions of improving light-emitting efficiency and heat dissipation efficiency |
| CN103682059A (en) * | 2012-09-05 | 2014-03-26 | 长华电材股份有限公司 | Pre-manufacturing method and pre-manufactured structure for LED package |
| CN103972377A (en) * | 2014-05-08 | 2014-08-06 | 南京华鼎电子有限公司 | Method for packaging omni-directional lighting LED lamp filament by means of flip bonding |
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