CN101140973A - White light luminous diode - Google Patents
White light luminous diode Download PDFInfo
- Publication number
- CN101140973A CN101140973A CNA2007100501645A CN200710050164A CN101140973A CN 101140973 A CN101140973 A CN 101140973A CN A2007100501645 A CNA2007100501645 A CN A2007100501645A CN 200710050164 A CN200710050164 A CN 200710050164A CN 101140973 A CN101140973 A CN 101140973A
- Authority
- CN
- China
- Prior art keywords
- light
- chip
- white light
- purple
- blue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011248 coating agent Substances 0.000 claims abstract description 21
- 238000000576 coating method Methods 0.000 claims abstract description 21
- 239000000843 powder Substances 0.000 claims abstract description 12
- 239000002131 composite material Substances 0.000 claims abstract description 8
- 239000011521 glass Substances 0.000 claims abstract description 8
- 238000009413 insulation Methods 0.000 claims description 10
- 125000006850 spacer group Chemical group 0.000 claims description 7
- 239000000463 material Substances 0.000 claims description 6
- 238000004519 manufacturing process Methods 0.000 abstract description 8
- 230000000694 effects Effects 0.000 abstract description 5
- 239000003822 epoxy resin Substances 0.000 abstract description 4
- 229920000647 polyepoxide Polymers 0.000 abstract description 4
- 230000032683 aging Effects 0.000 abstract description 3
- 238000005538 encapsulation Methods 0.000 abstract 1
- 238000010422 painting Methods 0.000 abstract 1
- 239000000047 product Substances 0.000 description 5
- 238000005516 engineering process Methods 0.000 description 3
- 239000004593 Epoxy Substances 0.000 description 2
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000013078 crystal Substances 0.000 description 2
- 230000002950 deficient Effects 0.000 description 2
- 238000002845 discoloration Methods 0.000 description 2
- 239000003292 glue Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 239000007787 solid Substances 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 241000233855 Orchidaceae Species 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000000295 complement effect Effects 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 230000008030 elimination Effects 0.000 description 1
- 238000003379 elimination reaction Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000003317 industrial substance Substances 0.000 description 1
- 239000012212 insulator Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000011514 reflex Effects 0.000 description 1
- 239000011265 semifinished product Substances 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/44—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the coatings, e.g. passivation layer or anti-reflective coating
- H01L33/46—Reflective coating, e.g. dielectric Bragg reflector
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/50—Wavelength conversion elements
- H01L33/507—Wavelength conversion elements the elements being in intimate contact with parts other than the semiconductor body or integrated with parts other than the semiconductor body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48257—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a die pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/483—Containers
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention relates to a white light LED, which comprises an electrode bracket made of physical composite material, a transparence crust, a diode chip with blue or purple light, a chip and a connecting wire for bracket electrode. The invention is characterized in that: on the inner concave blue of the scattered light female surface of transparence crust, painting the fluorescent coating which can make blue or purple light emitted from the blue or purple chips complemented with the light emitted by the fluorescent powder to form the white light. When using glass as transparence crust and setting the glisten layer on the outer surface of insulated compart ball, the white light LED can overcome the shortcomings that the epoxy resin is easy to be of aging and nigrescence by the effect of UV, improve the effluence efficiency of the chip light and greatly reduces the encapsulation and production cost of white light LED due to the simplified manufacturing process.
Description
Technical field:
The present invention relates to a kind of light-emitting diode (LED), especially a kind of light-emitting diode that emits white light.
Background technology:
The white light emitting diode (LED) that existing blue streak or purple light are transformed into white light is by the entity epoxy package, blue look of LED or purple light chip, supporting light-emitting diode chip for backlight unit, and connect electrode suppor, chip and the support connecting line of two electrodes and be coated in Lan Se or purple light chip light ejecting end and the fluorescence variable color powder coating that covers chip are formed by epoxyresin insulator.Transparent light transmitting shell of entity and led support and other devices are carried out the embedding of no gap, do not have the light complementation formation white light that the gap covers chip, blue look that chip sends or purple light and fluorescence variable color powder are sent because fluorescence variable color powder coating is coated in chip light ejecting end.With regard to existing white light LEDs, because improving constantly of chip power, luminous intensity constantly strengthens, the heat conduction and heat radiation problem of chip itself is very outstanding, adding chip is not had the gap and is covered in the fluorescence variable color powder coating, outside heat dissipation channel is degenerated the heat radiation heat conduction condition of chip by obstruct, and after transparent outer cover adopts the epoxy resin embedding, under the overwhelming majority's outdoor service condition, be subjected to the easily aging blackout of ultraviolet irradiation (UV) effect to make white light LEDs owing to produce light decay, luminous intensity constantly weakens (have data to show white light LEDs owing to the UV effect, light decay reaches 35% when using at 4000 hours).Therefore, await above-mentioned white light LEDs is done further to improve.
Summary of the invention:
Order of the present invention ground, be to adopt brand-new white light to form technical scheme to the blue streak of present mainly employing or the white light emitting diode that purple light is transformed into white light, provide and the essentially identical a kind of mature production technology of the production procedure of existing pea lamp, more can guarantee product quality, improve the new blue streak of chip cooling, heat conduction condition, the present product of the elimination defective that the epoxy resin housing easily wears out under the UV effect or the new manufacturing technology of the white light emitting diode that purple light is transformed into white light, the simplification by manufacturing process simultaneously reduces the production cost.
The blue streak of my invention or the white light emitting diode that purple light is transformed into white light, has hollow transparent light transmitting shell, the LED electrode suppor adopts the physics composite material, reflecting coating is set, chip and stent electrode connecting line and fluorescent material discoloration coating in the light-emitting diode negative pole boss pit that this support is manufactured.Blue look of described LED or purple light chip are included in the inner concave of transparent light transmitting shell fully, blue look of light-emitting diode or purple chip are installed in the electrode suppor negative pole boss pit, be connected on the positive pole and negative pole of physics composite material bracket by chip and the stent electrode connecting line both positive and negative polarity with chip in the light-emitting diode, the fluorescent material discoloration coating is coated on the concave surface of transparent light transmitting shell equably.
In the present invention, described transparent light transmitting shell adopts glass to make, and also can adopt the industrial chemicals of other transparent printing opacities to make.
Making of the present invention, realize by following mode, earlier light-emitting diode physics composite electrode support is positioned on the special equipment, elargol is coated on equably in the boss pit of support, again with Zhuan Yong Clip tool with blue streak or purple light chip expand draw back crystal grain after, place the elargol surface of boss pit to implement the cloth crystalline substance crystal grain, on the solid brilliant routing device of special use, realize that two electrodes are connected (ultrasonic bonding) with the routing of support outer electrode on the chip, again hollow transparent insulation shell is placed on the special-purpose coating machine, the inner concave of hollow transparent light transmitting shell is contained blue streak that all blue looks or purple chip send or purple light partly to be coated with equably and to apply fluorescence variable color powder and oven dry, to realize the light-emitting diode electrode suppor and the transparent insulation housing of solid brilliant routing at last, implement automation assembling sealing-in by special equipment, thereby finish the making of white light emitting diode of the present invention.
Among the present invention, described hollow transparent light transmitting shell can be a glass, but also can make of other transparent printing opacity chemical materials.Adopting the glass housing be the best, because of the anti-UV ability of glass is much better than other transparent light transmissive materials.
Compare with existing like product, beneficial effect of the present invention is: fluorescence variable color powder coating since be coated transparent insulating enclosure inner concave partly, therefore, no longer there is not the radiating condition that gap containing blue streak or purple light chip have improved chip, reduce the thermal resistance of heat dissipation channel, make blue streak or purple light chip obtain prolonging in the following life-span of prerequisite of equal-wattage, luminous intensity is improved.If transparent light transmitting shell adopts glass to make again, and insulation spacer ball surface is provided with reflector layer inner chamber made vacuum state, and then the life-span of blue streak or purple light chip will improve, also enhancing thereupon of luminous intensity simultaneously.
Content of the present invention further illustrates with the following Examples, but content of the present invention is not limited only to the content that embodiment relates to.
Description of drawings:
Fig. 1 is the structure chart of white light emitting diode among the embodiment.
Embodiment:
As shown in Figure 1, white light emitting diode in the present embodiment is the LED electrode suppor of being made by the physics composite material: 1, the insulation spacer ball of band reflecting coating: 2, transparent light transmitting shell: 3, fluorescence variable color powder: 4, chip and stent electrode connecting line: 5, LED blue streak or purple light chip: 6, reflective heat conducting coating: 7, conductive silver glue: 8, described white light LEDs blue streak or purple light chip 6 are placed in the surface of conductive silver glue 8, and promptly blue streak or purple light chip are placed in the centre with the transparent insulating enclosure lens.Chip and stent electrode connecting line 5 are connected on the positive and negative terminals and chip both positive and negative polarity of 1LED physics composite electrode support by supersonic welding respectively, the insulation spacer ball 2 of band reflecting coating plays insulation and separates two outer electrodes lead-in wire, and the reverse light of the directive that chip is sent reflexes to the light ejecting end simultaneously.The scattered light of transparent light transmitting shell 3 inner concave is partly contained fully by fluorescence variable color powder 4, i.e. orchid or the purple light that is sent by Lan Se or purple chip 6 must pass that fluorescence variable color powder coating 7 is complementary to become outside scattering behind the white lights.Be coated with hollow transparent light transmitting shell after the fluorescence variable color powder coating with concave surface, that covers that physics composite electrode support makes is equipped with blue streak or purple chip and implements on the white light LEDs semi-finished product that electrode connects, and implements just to have realized after fixing the manufacturing of white light LEDs product of the present invention.
In the present embodiment, the surface of boss pit is provided with reflective and heat conducting coating 7.In the present embodiment, above-mentioned transparent light transmitting shell 3 can be an epoxy package, and the insulation spacer ball of above-mentioned band reflecting coating is a bead.If transparent light transmitting shell 3 is made by glass, and insulation spacer ball 1 outer being coated with is provided with reflecting coating, the delivery efficiency that then further solves the light that sends at the easily aging defective of turning black of UV effect lower house and chip further improves, and uses out of doors and constitutes new embodiment thereby be more conducive to product.
Claims (3)
- A white light LEDs, have physics composite electrode support, chip and stent electrode connecting line, transparent light transmitting shell, send out the led chip of blue streak or purple light, insulation spacer ball, the fluorescent material variable color powder coating of band reflecting coating, it is characterized in that: fluorescent material is uniformly coated on the inner concave of transparent light transmitting shell, and is included in the coating fully by blue streak or the purple light that Lan Se or purple LED chip send.
- 2. white light LEDs as claimed in claim 1 is characterized in that: described transparent light transmitting shell is a glass shell.
- 3. white light LEDs as claimed in claim 1 is characterized in that: described insulation spacer ball outer surface is provided with reflecting coating.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100501645A CN101140973A (en) | 2007-10-08 | 2007-10-08 | White light luminous diode |
| PCT/CN2008/072591 WO2009049526A1 (en) | 2007-10-08 | 2008-09-28 | White light emitting diode |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNA2007100501645A CN101140973A (en) | 2007-10-08 | 2007-10-08 | White light luminous diode |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101140973A true CN101140973A (en) | 2008-03-12 |
Family
ID=39192803
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNA2007100501645A Pending CN101140973A (en) | 2007-10-08 | 2007-10-08 | White light luminous diode |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN101140973A (en) |
| WO (1) | WO2009049526A1 (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009049526A1 (en) * | 2007-10-08 | 2009-04-23 | Ze Chen | White light emitting diode |
| CN101964384A (en) * | 2010-08-19 | 2011-02-02 | 深圳市佳比泰电子科技有限公司 | Method for coating LED fluorescent powder |
| CN102606919A (en) * | 2012-03-02 | 2012-07-25 | 李建营 | Method for improving luminance of LED tube and high-luminance LED tube |
| CN104409606A (en) * | 2014-12-09 | 2015-03-11 | 苏州科利亚照明科技有限公司 | Light-emitting device |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2454896Y (en) * | 2000-12-07 | 2001-10-17 | 叶昭钦 | Improved structure of lamp |
| JP2004352928A (en) * | 2003-05-30 | 2004-12-16 | Mitsubishi Chemicals Corp | Light emitting equipment and lighting unit |
| CN101140973A (en) * | 2007-10-08 | 2008-03-12 | 陈泽 | White light luminous diode |
| CN201117677Y (en) * | 2007-10-18 | 2008-09-17 | 陈泽 | White light luminous diode |
-
2007
- 2007-10-08 CN CNA2007100501645A patent/CN101140973A/en active Pending
-
2008
- 2008-09-28 WO PCT/CN2008/072591 patent/WO2009049526A1/en active Application Filing
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2009049526A1 (en) * | 2007-10-08 | 2009-04-23 | Ze Chen | White light emitting diode |
| CN101964384A (en) * | 2010-08-19 | 2011-02-02 | 深圳市佳比泰电子科技有限公司 | Method for coating LED fluorescent powder |
| CN102606919A (en) * | 2012-03-02 | 2012-07-25 | 李建营 | Method for improving luminance of LED tube and high-luminance LED tube |
| CN104409606A (en) * | 2014-12-09 | 2015-03-11 | 苏州科利亚照明科技有限公司 | Light-emitting device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2009049526A1 (en) | 2009-04-23 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| C57 | Notification of unclear or unknown address | ||
| DD01 | Delivery of document by public notice |
Addressee: Chen Ze Document name: Notification of Passing Preliminary Examination of the Application for Invention |
|
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C12 | Rejection of a patent application after its publication | ||
| RJ01 | Rejection of invention patent application after publication |
Open date: 20080312 |