CN203023891U - Light source for illuminating and illuminating device - Google Patents
Light source for illuminating and illuminating device Download PDFInfo
- Publication number
- CN203023891U CN203023891U CN2012207361079U CN201220736107U CN203023891U CN 203023891 U CN203023891 U CN 203023891U CN 2012207361079 U CN2012207361079 U CN 2012207361079U CN 201220736107 U CN201220736107 U CN 201220736107U CN 203023891 U CN203023891 U CN 203023891U
- Authority
- CN
- China
- Prior art keywords
- heat
- light source
- lamp
- illumination light
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Images
Abstract
The utility model provides a light source for illuminating, which can guarantee the heat dissipation property of a driving circuit and also has the excellent reliability and the security. The light source for the illuminating comprises an LED (light-emitting diode) module (110) with an LED (112), a driving circuit (120) and a heat conduction part (130), wherein the driving circuit (120) is provided with a circuit baseplate (121) and a circuit element (122) arranged on the circuit baseplate (121), and the driving circuit (120) can be used for supplying electric power to the LED module (110); and the heat conduction part (130) covers the circuit element (122), and the heat conduction part (130) is minly made of a ceramic material.
Description
Technical field
The utility model relates to illumination light source and lighting device, relates in particular to the illumination light source of light-emitting components such as (LED:Light Emitting Diode) that possesses light emitting diode and the lighting device that has utilized this illumination light source.
Background technology
LED due to have efficient and the life-span long, wait in expectation and can as the new light source in the various lamps such as in the past known fluorescent lamp and incandescent lamp, utilize the research and development of the lamp (LED lamp) of LED also constantly making progress.
Have as the LED light fixture: alternative both ends have the LED lamp (Straight LED lamp) of Straight of the straight-pipe fluorescent lamp of electrode coil, perhaps substitute both ends and have the lamp-bulb type fluorescent lamp of luminous tube of electrode coil and the LED lamp (bulb-shaped LED lamp) etc. of bulb-shaped that has utilized the incandescent lamp of heater winding.For example, the disclosed Straight LED of patent documentation 1 lamp.And, the disclosed bulb-shaped LED lamp of patent documentation 2.
The built-in drive circuit (lamp circuit) that LED is lit a lamp that is useful in bulb-shaped LED lamp.Drive circuit for example will be converted to direct current from the alternating current of lamp holder, a plurality of components (electronic devices and components) that possess circuit substrate and be installed in this circuit substrate.
(prior art document)
(patent documentation)
Patent documentation 1 TOHKEMY 2009-043447 communique
Patent documentation 2 TOHKEMY 2009-037995 communiques
Situation about occurring in LED lamp in the past is, for the temperature of the component that suppresses drive circuit rises, so that heat-conduction component is covered in the mode of drive circuit, forms this heat-conduction component.Example technology as is known is by cast sealing heat conductivity resin in taking in the resin circuit case of drive circuit, thereby component to be covered by the heat conductivity resin.
In the past, in the situation that because component abnormal heating etc. causes becoming high temperature, can occur that drive circuit catches fire or the phenomenon of resin circuit case fusing.Especially because of through the time the aging component that enters end of lifetime, because abnormal heating etc. causes the possibility that component catches fire to increase.In this case, because in the past heat conductivity resin is not non-flame properties, therefore can not suppress catching fire of drive circuit.Like this, having utilized the problem that the LED lamp of heat conductivity resin in the past has is that reliability and security are relatively poor.
The utility model content
The utility model is in order to solve the above problems, and purpose is to provide a kind of thermal diffusivity that can either guarantee drive circuit, has again illumination light source and the lighting device of good reliability and security.
In order to solve above-mentioned problem in the past, an embodiment of the illumination light source that the utility model is related is for comprising: light emitting module has light-emitting component; Drive circuit, the component that has circuit substrate and be installed in this circuit substrate is used for feeding electrical power to described light emitting module; And heat-conduction component, cover described component; The main component of described heat-conduction component is ceramic material.
And, can be also that in an embodiment of the related illumination light source of the utility model, described ceramic material is ceramic powder.
And, can be also that in an embodiment of the related illumination light source of the utility model, described ceramic powder is alumina powder.
And, can be also that in an embodiment of the related illumination light source of the utility model, described ceramic powder is glass dust.
And, can be also that in an embodiment of the related illumination light source of the utility model, described heat-conduction component comprises adhesive resin.
And, can be also, in an embodiment of the related illumination light source of the utility model, this illumination light source further comprises circuit case, this circuit case is used for taking in described drive circuit; Described heat-conduction component contacts with described circuit case.
And, can be also that in an embodiment of the related illumination light source of the utility model, described heat-conduction component is filled in described circuit case.
And, can be also that in an embodiment of the illumination light source that the utility model is related, described component comprises capacity cell or semiconductor element; Described heat-conduction component is formed in the mode that covers described capacity cell or described semiconductor element.
And, can be also that in an embodiment of the related illumination light source of the utility model, this illumination light source further comprises: enclosed globe shade covers described light emitting module; And lamp holder, accept to be used for making the luminous electric power of described light emitting module.
And, can be also that in an embodiment of the related illumination light source of the utility model, described heat-conduction component contacts with described lamp holder inner face.
And can be also that in an embodiment of the related illumination light source of the utility model, this illumination light source further comprises: longilineal diffuser be used for covering described light emitting module; Longilineal base plate is used for supporting described light emitting module; And lamp holder, be arranged at the end of the length direction of described diffuser.
And in an embodiment of the related lighting device of the utility model, this lighting device possesses the described illumination light source of any one in technique scheme.
By the utility model, can realize a kind ofly can either guaranteeing that the thermal diffusivity of drive circuit has again illumination light source and the lighting device of good reliability and security.
Description of drawings
Fig. 1 is the profile of the related bulb-shaped LED lamp of embodiment 1 of the present utility model.
Fig. 2 shows the blending ratio of alumina powder in dusty material B and the relation between pyroconductivity.
Fig. 3 is the profile of the related bulb-shaped LED lamp of the variation 1 of embodiment 1 of the present utility model.
Fig. 4 is the profile of the related bulb-shaped LED lamp of the variation 2 of embodiment 1 of the present utility model.
Fig. 5 is the profile of the related bulb-shaped LED lamp of the variation 3 of embodiment 1 of the present utility model.
Fig. 6 is the profile of the related bulb-shaped LED lamp of embodiment 2 of the present utility model.
Fig. 7 is the profile of the related Straight LED lamp of embodiment 3 of the present utility model.
Fig. 8 is the profile of the related Straight LED lamp of the variation of embodiment 3 of the present utility model.
Fig. 9 is the summary section of the related lighting device of embodiment 4 of the present utility model.
Figure 10 is the stereoscopic figure of the related lighting device of embodiment 5 of the present utility model.
The specific embodiment
Below, with reference to accompanying drawing, embodiment of the present utility model related illumination light source and lighting device are described.And the embodiment that below will illustrate is a preferred object lesson of the present utility model.Therefore, the setting position of the numerical value shown in following embodiment, shape, material, inscape, inscape and connection form etc. is all examples of the present utility model, and the utility model is not limit by these.And, there is no the inscape of record among the inscape in following embodiment, independent claims that the upper concept is shown, can illustrate as inscape arbitrarily.And each accompanying drawing is ideograph, is not rigorous diagram.
(embodiment 1)
At first, utilize Fig. 1 that embodiment 1 of the present utility model is described.In the present embodiment, an example as illumination light source describes bulb-shaped LED lamp.Fig. 1 is the profile of the related bulb-shaped LED lamp of embodiment 1 of the present utility model.
And in Fig. 1, the chain-dotted line of drawing along the above-below direction of paper represents the lamp axle J (central shaft) of bulb-shaped LED lamp, and in the present embodiment, lamp axle J is consistent with the axle of LED enclosed globe shade.And lamp axle J is, becomes the axle of pivot in the lamp socket that bulb-shaped LED lamp 100 is installed to lighting device (not illustrating), and is consistent with the rotating shaft of lamp holder 180.
As shown in Figure 1, bulb-shaped LED lamp 100 is the bulb-shaped LED lamps that become the substitute of lamp-bulb type fluorescent lamp or incandescent lamp, and this bulb-shaped LED lamp 100 possesses: as the LED module 110 of light source, be used for will regulation the electric power heat-conduction component 130 that supplies to the drive circuit 120 of LED module 110 and be used for the heat of drive circuit is conducted.
The bulb-shaped LED lamp 100 of present embodiment also comprises: cover the enclosed globe shade 140 of LED module 110, the base plate 150 that carries LED module 110, the circuit case 160 of taking in drive circuit 120, the framework 170 that covers circuit case 160 and the lamp holder 180 of accepting electric power from the outside.And, in bulb-shaped LED lamp 100 in the present embodiment, consist of peripheral device by enclosed globe shade 140, framework 170, lamp holder 180.
Below, with reference to Fig. 1, each component parts of bulb-shaped LED lamp 100 is elaborated.
[LED module]
LED112 has been mounted a plurality of on a face of installation base plate 111.LED112 is an example of semiconductor light-emitting elements, is for example LED chip.And the quantity of LED112 is not to be subject to a plurality ofly, can be one yet.And, be equipped with pair of electrodes (not illustrating) on LED module 110, this pair of electrodes is electrically connected to the pair of lead wires 123a and the 123b that derive from the electric power efferent of drive circuit 120, and by to this pair of electrodes supply direct current, thereby LED112 is luminous.
In the present embodiment, LED112 is the blue-light-emitting LED chip that penetrates blue light, and seal 113 is to contain the translucent resin material that the blue light wavelength is converted to the fluorophor particle fluorophor particle of system (for example YAG) of sodium yellow.Like this, the part of the blue light that penetrates from LED112 is converted to sodium yellow by seal 113 wavelength, and the white light by this sodium yellow of being changed by wavelength generates with the secondary colour of the blue light that is not converted radiates from LED module 110.
And, on installation base plate 111, be formed be used to the metal line that the luminous electric current of LED112 is flow through with the shape of stipulating.And, be formed with the electrode terminal (external connecting electrode) that is connected with lead-in wire 123a and 123b on installation base plate 111.Electrode terminal can be also the part of metal line.
[drive circuit]
Drive circuit (circuit unit) the 120th be used to the light a lamp lamp circuit of (luminous) of the LED112 that makes LED module 110, supplies to LED module 110 with the electric power of regulation.For example, drive circuit 120 will be converted to direct current by the alternating current that lamp holder 180 is supplied with by pair of lead wires 123c and 123d, by pair of lead wires 123a and 123b, this direct current be supplied to LED module 110.Drive circuit 120 is made of circuit substrate 121 and a plurality of components (electronic devices and components) 122 of being installed to circuit substrate 121.
The drive circuit 120 that consists of like this is received in circuit case 160, is secured to circuit case 160 such as be screwed, adhere or engaging etc.Particularly, circuit substrate 121 is fixed to circuit case 160.
And drive circuit 120 and LED module 110 are electrically connected by pair of lead wires 123a and 123b.And drive circuit 120 and lamp holder 180 are electrically connected by pair of lead wires 123c and 123d.These 4 lead-in wire 123a to 123d are for example alloyed copper lead-in wires, insulating properties resin-coated that comprises the heart yearn that is made of alloyed copper and cover this heart yearn.
In the present embodiment, lead-in wire 123a is for positive voltage being supplied to the wire (anode-side lead-out terminal line) of LED module 110 from drive circuit 120, and lead-in wire 123b supplies to the wire (cathode side lead-out terminal line) of LED module 110 for the voltage that will bear from drive circuit 120.The interspersed through hole 150a that is arranged on base plate 150 of lead-in wire 123a and 123b, and be drawn out to LED module side (in enclosed globe shade 140).And, lead-in wire 123a and a 123b end (heart yearn) separately, with metal line (electrode terminal) welding of the installation base plate 111 of LED module 110, the other end separately (heart yearn) is with the metal line welding of circuit substrate 121.
In addition, lead-in wire 123c and 123d are be used to the electric power that LED module 110 is lit a lamp (for example alternating current of commercial 100V), to supply to the electric wire of drive circuit 120 from lamp holder 180.Lead-in wire 123c and a 123d end (heart yearn) separately and lamp holder 180 (shell section 181 or contact chip (eyelet) section 183) are electrically connected to, and the electric power input part (metal line) of the other end separately (heart yearn) and circuit substrate 121 is electrically connected by scolding tin etc.
[heat-conduction component]
Heat-conduction component 130 is the heat conductivity parts with heat conductivity, is constituted as the component 122 that covers drive circuit 120.In the present embodiment, heat-conduction component 130 is with can all components 122 of landfill and be formed.That is, all components 122 all are embedded in heat-conduction component 130.
Heat-conduction component 130 is made of the non-flame properties insulating materials of the pyroconductivity with regulation.The main component of heat-conduction component 130 is the inorganic material of insulating properties, for example can utilize the countless nonmetallic particulate (powder) that is made of the particle diameter of stipulating.In the present embodiment, the main component of heat-conduction component 130 is ceramic materials.As such ceramic material such as utilizing ceramic powder or the glass dust such as alumina powder.
Alumina powder pyroconductivity in ceramic powder is higher, by with the main component of alumina powder as heat-conduction component 130, thus the heat of the drive circuit 120 that can easily leave.
More specifically, be that the heat-conduction component 130 that consists of with alumina powder is by Al as main component
2O
3(89%), SiO
2(2 ~ 4%), Fe
2O
3(1 ~ 1.5%) and remaining by TiO
2, CaO, MgO consist of, and can utilize pyroconductivity for approximately 0.035W/ (mK), particle diameter are the dusty material A of 0.075mm.
In addition, be the heat-conduction component 130 that consists of with the alumina powder Al by the blending ratio with regulation as main component
2O
3, and remaining by SiO
2, Fe
2O
3, Na
2O consists of, and can utilize particle diameter to be the dusty material B of 0.003mm.
At this, utilize Fig. 2 to the alumina powder (Al in dusty material B
2O
3) blending ratio (with respect to SiO
2) and pyroconductivity between relation describe.Fig. 2 shows the blending ratio of the alumina powder in dusty material B and the relation between pyroconductivity.
As can be known from Fig. 2, the pyroconductivity of dusty material B increases along with the increase of the blending ratio of alumina powder.For example, in the situation that the blending ratio of the alumina powder in dusty material B is 1.0%, 85%, 96%, 99.5%, pyroconductivity is respectively approximately 1.1W/ (mK), approximately 16W/ (mK), approximately 24W/ (mK), about 25W/ (mK) as can be known.And as can be known, in dusty material B, wanting to make pyroconductivity is the heat conductivity resin of 1.9W/ (mK) greater than pyroconductivity, as long as the blending ratio of aluminium oxide is set as more than 10%.
And, be that the heat-conduction component 130 that consists of with glass dust is by SiO as main component
2(98.6%) and remaining by Al
2O
3, Fe
2O
3, Na
2O, K
2O consists of, and can utilize pyroconductivity for approximately 1.1W/ (mK), particle diameter are the dusty material C of 0.08mm.
And, also can comprise adhesive resin in the heat-conduction component 130 that is consisted of by ceramic powder.Contain adhesive resin by making in heat-conduction component 130, can ceramic powder be combined each other by adhesive resin, like this, can freely change the shape of heat-conduction component 130.That is, contain adhesive resin by making in heat-conduction component 130, thereby can make heat-conduction component 130 have viscosity, thereby can improve the free degree of the formation position of heat-conduction component 130.Accordingly, can make the whole of component 122 or only some is covered by heat-conduction component 130.
And, as the main component of heat-conduction component 130, also can the above-mentioned powdery type inorganic material of unfavorable use, but the ceramic material that the inorganic fibers that the ceramic fibre by numerous wire can be consisted of consists of is as main component.For example, can utilize the mineral wool that consists of with glass fibre.
The heat-conduction component 130 that consists of like this preferably contacts with circuit case 160.Like this, can guarantee heat dissipation path via component 122 and the circuit case 160 of heat-conduction component 130.Therefore, can easily pass through heat-conduction component 130, the heat of drive circuit 120 is transmitted to circuit case 160, thereby can guarantee the thermal diffusivity of drive circuit 120.And, be transmitted to the heat of circuit case 160, rejected heat to extraneous air via framework 170.
In the present embodiment, heat-conduction component 130 is filled in circuit case 160.Accordingly, heat-conduction component 130 is all contacted with the inner face of circuit case 160.Therefore, can more produce effect the heat of drive circuit 120 is transmitted to circuit case 160, thereby can improve the thermal diffusivity of drive circuit 120.
And in the present embodiment, heat-conduction component 130 also is filled into lamp holder 180.Like this, heat-conduction component 130 is contacted with the inner face of lamp holder 180, can guarantee the heat dissipation path of component 122 and lamp holder 180 by heat-conduction component 130.Therefore, by heat-conduction component 130, the heat of drive circuit 120 is transmitted to lamp holder 180, thereby can further improves the thermal diffusivity of drive circuit 120.That is, the heat that is transmitted to lamp holder 180 is transmitted to the lamp socket of ligthing paraphernalia, dispels the heat by utilizing lamp holder 180, thereby can improve significantly the thermal diffusivity of drive circuit 120.
[enclosed globe shade]
Enclosed globe shade 140 be for the outside that will be fetched into from the light that LED module 110 is emitted lamp, hemispheric diffuser with light transmission roughly, be in the present embodiment the shape that open side (lamp holder side) narrows down.LED module 110 is covered by this enclosed globe shade 140.Like this, incide the light of LED module 110 of the inner face of enclosed globe shade 140, see through enclosed globe shade 140, penetrated to the outside of enclosed globe shade 140.
In the present embodiment, enclosed globe shade 140 is configured to, and its open side edges edge is sandwiched between base plate 150 and framework 170.The state that is clipped with the open side edges edge of enclosed globe shade 140 is coated with silicones at the enclosed globe shade side opening edge part De Zhou side of base plate 150 and framework 170, thus fixing enclosed globe shade 140.
And enclosed globe shade 140 also can have light diffusion function.For example, the resin by will contain the photodiffusion materials such as silica or calcium carbonate or Chinese white etc. are coated to all of the inner face of enclosed globe shade 140 or outside, thereby can form milky optical diffusion film.Like this, have light diffusion function by making enclosed globe shade 140, thereby can make the light diffusion of inciding enclosed globe shade 140 from LED module 110, can enlarge like this luminous intensity distribution angle of lamp.
In addition, although the shape of enclosed globe shade 140 as hemispherical, but be not to be limited by this.As the shape of enclosed globe shade 140, can be also ellipsoid of revolution or oblate spheroid.And, as the material of enclosed globe shade 140, can utilize resin material or the glass materials such as propylene (PMMA) or Merlon (PC).
[base plate]
Be provided with two through hole 150a at base plate 150, be used for making the interarea of enclosed globe shade side and the interarea of framework side to connect, by these through holes 150a, the pair of lead wires 123a of drive circuit 120 and 123b are exported the LED module side of base plate 150.
And base plate 150 for example is made of metal material.For example can consider it is Al, Ag, Au, Ni, Rh, Pd as metal material, perhaps by the two or more alloys that consist of among these, or with alloy of Cu and Ag etc.For example, base plate 150 can be shaped to roughly discoideus metal substrate by aluminium die casting.
[circuit case]
The first housing department 161 that is positioned at the enclosed globe shade side is accommodated in framework 170.And the second housing section 162 that is positioned at the lamp holder side is incorporated in lamp holder 180, and lamp holder 180 is outer is embedded in second housing section 162.Accordingly, the opening of the lamp holder side of circuit case 160 is clogged.In the present embodiment, be formed with for the section that screws up that screws up with lamp holder 180 at the outer peripheral face of second housing section 162, lamp holder 180 is fixed to circuit case 160 by being screwed into second housing section 162.Circuit case 160 is shaped such as utilizing the insulative resin material such as polybutylene terephthalate (PBT) etc. and is integrated.
[framework]
In the opening (the first peristome) of the enclosed globe shade side of framework 170, the open side edges edge of taking in base plate 150 and enclosed globe shade 140, for example framework 170 is fixed on base plate 150 by riveted joint.And, also sticker can be flow into the space 170a that framework 170, base plate 150 and enclosed globe shade 140 impale, framework 170 is fixed to base plate 150.
In the present embodiment, framework 170 is the metal-made frameworks that are made of metal.Like this, framework 170 can play a role as radiator, will by the heat of LED module 110 and drive circuit 120 generations, reject heat to efficiently the outside of bulb-shaped LED lamp 100 by framework 170.As the metal material that consists of framework 170, for example can consider Al, Ag, Au, Ni, Rh, Pd, perhaps by the two or more alloys that consist of in these metal materials, or the alloy of Cu and Ag etc.Because the heat conductivity of such metal material is good, therefore, the heat energy that is transmitted to framework 170 is transmitted to the lamp holder side enough efficiently.Therefore, the heat by LED module 110 and drive circuit 120 occur can be rejected heat to the ligthing paraphernalia side by lamp holder 180.In the present embodiment, framework 170 is made of aluminum alloy materials.And, in order to improve the thermal emissivity rate of framework 170, also can carry out on the surface of framework 170 alumite and process.And the material of framework 170 is not to be defined in metal, can be resin yet.For example, can consist of framework 170 with high resin of pyroconductivity etc.
[lamp holder]
The kind of lamp holder 180 does not have special restriction, for example can utilize Edison screw (E type) lamp holder of screw-type, can list E26 lamp holder, E17 lamp holder or E16 lamp holder etc.
[characteristic formation of the present utility model]
Then, to characteristic formation and the action effect of the related bulb-shaped LED lamp 100 of embodiment 1 of the present utility model, and realize that longitude and latitude of the present utility model is elaborated.
In LED lamp in the past, for the temperature that suppresses component rises, adopted the heat conductivity resin take resins such as silicones as main component.For example, such heat conductivity resin-cast is sealed in circuit case, thereby covers component with the heat conductivity resin.
In this case, cause in the situation of high temperature when component abnormal heating etc., drive circuit just might occur catches fire, and the LED lamp can not be lit a lamp, the fusing of resin circuit case, the situation that dielectric voltage withstand reduces.Especially because of through the time component that enters latter stage of aging life-span, because abnormal heating etc. causes the possibility that component catches fire to increase.
But heat conductivity resin in the past take resin as main component, is not non-flame properties resin, therefore, can not suppress catching fire of drive circuit.Like this, utilized the LED lamp of heat conductivity resin in the past the problem that reliability and security reduce will occur.Therefore, become extremely important to dispelling the heat in the heat of drive circuit generation.
And in the situation of resin as the heat conductivity resin of main component in the past, pyroconductivity is low, is difficult to guarantee sufficient thermal diffusivity.Especially for the drive circuit of height output use, can not obtain sufficient thermal diffusivity.
In fact, the application's utility model personnel are by being used as circuit case and heat conductivity resin (silicones) with nonflammable UL94V-O, carried out Strong heat run processed, thereby learnt at the component adstante febre, circuit case and heat conductivity resin can dissolve.
The utility model is based on above-mentioned wisdom, by the ceramic material that the heat-conduction component 130 that covers component 122 is adopted as the inorganic material of noninflammability and insulating properties, thereby not only can guarantee the thermal diffusivity of heat-conduction component 130, but also realize the heat resistance of heat-conduction component 130 and the raising of fire resistance.
Therefore, in the present embodiment, be embedded to the mode of heat-conduction component 130 with component 122, heat-conduction component 130 is filled in circuit case 160.Accordingly, make heat-conduction component 130 cover component 122.As making heat-conduction component 130 cover the method for component 122, following method is arranged.
For example, at first at the interior configuration driven circuit 120 of circuit case 160, afterwards, the heat-conduction component 130 that will comprise the regulation of adhesive resin flows into and is coated to circuit case 160, thereby heat-conduction component 130 is filled in circuit case 160.Afterwards, make as required heat-conduction component 130 sclerosis.And, also can not use adhesive resin, and the heat-conduction component 130 of powdery is flow in circuit case 160.
And, can be also, at the interior configuration driven circuit 120 of circuit case 160, afterwards, only stay for the hand-hole that injects heat-conduction component 130, make circuit case 160 become air-tight state, from hand-hole, heat-conduction component 130 is injected in circuit case 160, thereby heat-conduction component 130 is filled in circuit case 160.Afterwards, as required, seal hand-hole with landfill parts etc., and make as required heat-conduction component 130 sclerosis.And, can be also first heat-conduction component 130 is filled into the state in circuit case 160, drive circuit 120 to be inserted in circuit case 160.
In sum, the bulb-shaped LED lamp 100 related according to embodiment 1 of the present utility model, owing to having used pyroconductivity with regulation and the ceramic material of insulating properties as heat-conduction component 130, therefore can guarantee insulating properties and the thermal diffusivity of drive circuit 120, and can dispel the heat to the heat that component 122 occurs.Accordingly, the deteriorated etc. of the component 122 that causes because of thermal conductance and circuit case 160 can be prevented, and can not lighting a lamp and the reduction of dielectric voltage withstand of LED lamp can be prevented.
And, as the main component of heat-conduction component 130 and the ceramic material that uses, owing to having heat resistance and fire resistance, therefore, even in the situation that because component 122 abnormal heatings etc. become high temperature, also can suppress drive circuit 120 and catch fire.Like this, by present embodiment, the thermal diffusivity of drive circuit 120 can either be guaranteed, the LED lamp that reliability and security are good can be realized again.
And, as heat-conduction component 130, preferably adopt the high ceramic powders of pyroconductivity such as alumina powder.Accordingly, can further improve the thermal diffusivity of drive circuit 120.Like this, can in limited volume, improve all thermal diffusivities of LED lamp.Therefore, can either easily realize the high output of LED lamp, the security that can improve again the LED lamp.
Especially, preferably adopt the ceramic powder of above-mentioned dusty material B as heat-conduction component 130, the ratio of aluminium oxide is become more than 10%.Accordingly, compare with in the past heat conductivity resin (pyroconductivity: approximately 1.9W/ (mK)), owing to can improving significantly pyroconductivity, therefore can realize having the LED lamp of the heat dissipation characteristics of very good drive circuit 120.And, due to ceramic powder or glass dust less expensive, therefore can realize that cost is low, thermal diffusivity is high, reliability and the good LED lamp of security.
And heat-conduction component 130 also can not contain adhesive resin, but only consists of heat-conduction component 130 with dusty materials such as alumina powder or glass dust.In this case, sew from the position of the regulations such as circuit case 160 for the heat-conduction component 130 that the dusty material that does not only make by powdery (sand shape) consists of, preferably making the space of heat-conduction component 130 (dusty material) filling is confined space.For example, in the situation that heat-conduction component 130 only is filled into circuit case 160, preferably at circuit case 160, bottom and upper cover are set, make circuit case 160 become air-tight state (air-tight state or semi-hermetic state fully).And, in the situation that heat-conduction component 130 is filled into circuit case 160 and lamp holder 180, preferably at circuit case 160, upper cover is set, make the space that is formed by circuit case 160 and lamp holder 180 become air-tight state.In these cases, the formation of confined space is not so long as make dusty material sew to get final product, so long as the particle diameter of dusty material following gap, also it doesn't matter even be present in confined space.In addition, be arranged on the through hole of circuit case 160 in order to draw lead-in wire 123c and 123d, preferably seal with landfill parts etc., in order to avoid heat-conduction component 130 leaks.
(variation 1 of embodiment 1)
Then, utilize Fig. 3 that the related bulb-shaped LED lamp 100A of the variation 1 of embodiment 1 of the present utility model is described.Fig. 3 is the profile of the related bulb-shaped LED lamp of the variation 1 of embodiment 1 of the present utility model.
The basic comprising of bulb-shaped LED lamp 100A in this variation is identical with the formation of bulb-shaped LED lamp in embodiment 1 shown in Figure 1.Therefore, in this variation, by with embodiment 1 difference centered by describe.
As shown in Figure 3, although the heat-conduction component 130 in above-mentioned embodiment 1 is that to be filled into the inside of circuit case 160 and lamp holder 180 all, but the heat-conduction component 130A in this variation is filled into the part in circuit case 160.
Particularly, in this variation, only be formed on the state in the face of lamp holder side of circuit substrate 121 of drive circuit 120 with heat-conduction component 130A, and be filled in circuit case 160.That is, heat-conduction component 130A only is formed on, face in the interarea of circuit substrate 121, that be mounted numerous components 122.In this variation, heat-conduction component 130A is in the mode of all components 122 on the interarea of the lamp holder side that can landfill be installed in circuit substrate 121 and be formed.And it is all that heat-conduction component 130A also can not be formed on the inner face of circuit case 160, and can be formed on the part of the inner face of circuit case 160.
In sum, in the bulb-shaped LED of this variation lamp 100A, also can realize the effect same with embodiment 1.That is, the thermal diffusivity of drive circuit 120 can either be guaranteed, the LED lamp that reliability and security are good can be realized again.
(variation 2 of embodiment 1)
Then, utilize Fig. 4 that the related bulb-shaped LED lamp 100B of the variation 2 of embodiment 1 of the present utility model is described.Fig. 4 is the profile of the related bulb-shaped LED lamp of the variation 2 of embodiment 1 of the present utility model.
The basic comprising of bulb-shaped LED lamp 100B in this variation is identical with the formation of bulb-shaped LED lamp in embodiment 1 shown in Figure 1.Therefore, in this variation, by with embodiment 1 difference centered by describe.
As shown in Figure 4, although the heat-conduction component 130 in above-mentioned embodiment 1 has been filled into circuit case 160 and lamp holder 180, heat-conduction component 130B in this variation does not contact with circuit case 160, but be installed in landfill circuit substrate 121 the lamp holder side interarea all components 122 mode and be formed.And, in this variation can be, heat-conduction component 130 is coated to the component 122 of drive circuit 120, after hardening, drive circuit 120 is configured to circuit case 160.
In sum, even in the bulb-shaped LED of this variation lamp 100B, also can realize the effect same with embodiment 1.That is, the thermal diffusivity of drive circuit 120 can either be guaranteed, the LED lamp that reliability and security are good can be realized again.
(variation 3 of embodiment 1)
Then, utilize Fig. 5 that the related bulb-shaped LED lamp 100C of the variation 3 of embodiment 1 of the present utility model is described.Fig. 5 is the profile of the related bulb-shaped LED lamp of the variation 3 of embodiment 1 of the present utility model.
The basic comprising of bulb-shaped LED lamp 100C in this variation is identical with the formation of bulb-shaped LED lamp in embodiment 1 shown in Figure 1.Therefore, in this variation, by with embodiment 1 difference centered by describe.
As shown in Figure 5, the circuit substrate 121 in above-mentioned embodiment 1 is configured to interarea and lamp axle J quadrature, and it is parallel with lamp axle J that the circuit substrate 121 in this variation is configured to interarea.That is, in this variation, circuit substrate 121 is vertically configured.And heat-conduction component in this variation 130 is same with embodiment 1, is filled in circuit case 160 and in lamp holder 180.
In sum, even in the bulb-shaped LED of this variation lamp 100C, also can realize the effect same with embodiment 1.That is, the thermal diffusivity of drive circuit 120 can either be guaranteed, the LED lamp that reliability and security are good can be realized again.
And, even also can be suitable for above-mentioned variation 1 or variation 2 in this variation, also heat-conduction component 130 can be constituted a part of only filling circuit case 160 or not contact with circuit case 160.
(embodiment 2)
Then, utilize Fig. 6 that embodiment 2 of the present utility model is described.In the present embodiment, an example as illumination light source also describes bulb-shaped LED lamp.Fig. 6 is the profile of the related bulb-shaped LED lamp of embodiment 2 of the present utility model.
As shown in Figure 6, the related bulb-shaped LED lamp 200 of present embodiment is the LED lamp of transparent type, and is same with embodiment 1, comprising: LED module 110, drive circuit 120, heat-conduction component 130, enclosed globe shade 240, circuit case 260 and lamp holder 180.Bulb-shaped LED lamp 200 also comprises pillar 251 and support plate 252.
In bulb-shaped LED lamp 200 in the present embodiment, different from embodiment 1, consist of peripheral device by enclosed globe shade 240, circuit case 260 (the first housing department 261), lamp holder 180.Below, by with embodiment 1 difference centered by, the component parts of the bulb-shaped LED lamp 200 in present embodiment is described.
(enclosed globe shade)
Enclosed globe shade 240 is the frameworks be used to the hollow of taking in LED module 110, is made of the translucent material that is used for making light from LED module 110 to be transmitted to the outside of lamp.In the present embodiment, enclosed globe shade 240 is glass bulbs (clear lamp) of making for the transparent silica glass of visible light.Therefore, can be visual to being received to the interior LED module 110 of enclosed globe shade 240 from the outside of enclosed globe shade 240.
Being shaped as of enclosed globe shade 240, an end is spherical for sealing, and the other end has peristome 241.In other words, being shaped as of enclosed globe shade 240, the part of the ball of hollow being along with extending and narrow down gradually to the direction away from the central part of ball, is being formed with peristome 241 on the central part position farthest of ball.As the enclosed globe shade 240 of this shape, can adopt with general incandescent lamp is the glass bulb of same shape.For example, as enclosed globe shade 240, can adopt the glass bulbs such as A shape, G shape or E shape.
In addition, it is transparent that enclosed globe shade 240 also can need not to be for visible light, just passable as long as enclosed globe shade 240 has a light diffusion function.For example, also can be coated to inner face or the outside of enclosed globe shade 240 with containing the resin of the photodiffusion materials such as silica or calcium carbonate or Chinese white etc., and form milky optical diffusion film.And, be not to be subject to glass material as the material of enclosed globe shade 240, also can adopt the resin material by formations such as the synthetic resin such as propylene (PMMA) or Merlon (PC).
(pillar)
In this case, the installation base plate 111 of LED module 110 preferably adopts the high substrate of light transmittance, and for example, adopting full light transmittance for visible light is substrate more than 80%, or is transparent substrate for visible light.As such substrate, the transparent glass substrate that can use the light transparent ceramic substrate that consisted of by multicrystal aluminium oxide or aluminium nitride, be consisted of by glass, the quartz wafer that is consisted of by crystal, the sapphire substrate that is consisted of by sapphire or transparent resin substrate of being consisted of by transparent resin material etc.Accordingly, the light of LED112 can see through installation base plate 111 and penetrate from the face of an opposite side, therefore, can realize having the LED lamp with the large light distribution characteristic in incandescent lamp approximate luminous intensity distribution angle.
And pillar 251 is made of metal material, also can play a role as the thermal component (radiator) that is used for the heat that occurs at LED module 110 is dispelled the heat.Therefore, pillar 251 is preferably by to consist of as the high metal material of the pyroconductivity of main component such as aluminium (Al), copper (Cu) or iron (Fe) etc.Like this, can pass through pillar 251, will be transmitted to efficiently support plate 252 in the heat that LED module 110 occurs, and can suppress the luminous efficiency of LED112 and the reduction in life-span respond wellly.In the present embodiment, pillar 251 is made of aluminium alloy.And pillar 251 can not be also only to be made of metal, and the surface of the columnar part that also can make at resin forms metal film and consists of pillar 251.
(support plate)
And in the present embodiment, support plate 252 is made of the disc-shaped part with stage portion.The openend butt of the peristome 241 of this stage portion and enclosed globe shade 240, thus the peristome 241 of enclosed globe shade 240 is blocked.And in stage portion, the openend of the peristome 241 of support plate 252 and circuit case 260 and enclosed globe shade 240 is fixed by adhesives such as silicones.
(circuit case)
In sum, the bulb-shaped LED lamp 200 in present embodiment also can be same with embodiment 1, and the heat-conduction component 130 take ceramic material as main component is filled in circuit case 160, and component 122 is covered by heat-conduction component 130.
Like this, present embodiment also can realize the effect same with embodiment 1.That is, the thermal diffusivity of drive circuit 120 can either be guaranteed, the LED lamp that reliability and security are good can be realized again.In addition, present embodiment also can be suitable for above-mentioned variation 1 to 3.
(embodiment 3)
Then, utilize Fig. 7 that embodiment 3 of the present utility model is described.In the present embodiment, an example as illumination light source describes Straight LED lamp.Fig. 7 is the profile of the related Straight LED lamp of embodiment 3 of the present utility model.
As shown in Fig. 7 (a) to (c), Straight LED lamp 300 is the longilineal Straight LED lamps that are used as the alternative illumination of in the past straight-pipe fluorescent lamp, identical with embodiment 1, comprise LED module 310, drive circuit 120 and heat-conduction component 130.Drive circuit 120 is same with embodiment 1, comprises installation base plate 121 and a plurality of components 122.The formation of heat-conduction component 130 is also same with embodiment 1.Present embodiment is also that heat-conduction component 130 is filled in circuit case 360.
[LED module]
[diffuser]
[base plate]
And the radiator that base plate 350 dispels the heat as the heat that LED module 310 is occured plays a role.Therefore, the formation at the back side of base plate 350 is to expose to the outside of Straight LED lamp 300.Particularly, the Outboard Sections as the back side of the mounting surface of base plate 350 is equipped with the fin 352 as radiating part.Fin 352 is configured to expose to the outside of Straight LED lamp, and is outstanding from mounting portion 351 to Straight LED lamp foreign side.Fin 352 in present embodiment is made of a plurality of roughly plate-shaped members, is laid along Y direction.
[circuit case]
The surface of the circuit case 360 in present embodiment becomes reflecting surface, is used for making the light that penetrates from LED module 310, penetrates to the outside of diffuser 340.By this reflecting surface structure, even circuit case 360 is configured in the end of Straight LED lamp 300, also can with the light that penetrates from LED module 310, inject to the outside of diffuser 340.The briliancy that like this, can be suppressed at the end of Straight LED lamp 300 reduces.
[lamp holder]
In sum, even in Straight LED lamp 300 in the present embodiment, also can realize the effect same with embodiment 1.That is, can realize to guarantee the thermal diffusivity of drive circuit 120, have again the LED lamp of good reliability and security.
In addition, in the present embodiment, although be that heat-conduction component 130 has been filled into the inside of circuit case 360 is all, but, also heat-conduction component 130 only can be filled into the part of circuit case 360 or not contact with circuit case 360.
(variation of embodiment 3)
Then, utilize Fig. 8 that the related Straight LED lamp 300A of the variation of embodiment 3 of the present utility model is described.Fig. 8 is the profile of the related Straight LED lamp of the variation of embodiment 3 of the present utility model.
The basic formation of Straight LED lamp 300A in this variation is identical with the formation of Straight LED lamp in embodiment 3 shown in Figure 7.Therefore, in this variation, by with embodiment 3 differences centered by describe.
[LED module]
LED module 310A in this variation is the light emitting module of COB type, possesses: longilineal installation base plate, be installed into a plurality of LED (bare chip) of row and the seal of wire that a plurality of LED are sealed in the lump.In addition, also can replace LED module 310A, and adopt the LED module 310 of above-mentioned SMD type.On the contrary, in embodiment 3, also can replace LED module 310, and adopt the LED module 310A of COB type.
[diffuser]
Diffuser 340A is identical with embodiment 3, and it constitutes and covers LED module 310A.The longilineal straight tube of diffuser 340 for having light transmission in this variation taken in the base plate 350A that mounting has LED module 310A.Can adopt the glass tube (glass bulb) of glass system or resinous plastic tube etc. as diffuser 340A.In addition, also can make diffuser 340A have light diffusion function.
[base plate]
Base plate 350A is longilineal metal base plate, except the function with radiator that heat that LED module 310A is occured dispels the heat, also has the function for the fixed part of mounting and fixed L ED module 310A.Base plate 350A is incorporated in the diffuser 340A of tubular, and the inner face of base plate 350A and diffuser 340A is fixing by adhesive etc.
[lamp holder]
Lamp holder 381A and 382A are arranged on respectively the both ends of the length direction of diffuser 340A.Lamp holder 381A in this variation and 382A are the Splittable lamp holders that is made of two parts, and it can be decomposed into two parts in up and down take the plane of the tubular axis by diffuser 340A as divisional plane.And, also can replace lamp holder 381A and the 382A of Splittable, and adopt the lamp holder 381 and 382 of the non-Splittable of embodiment 3.On the contrary, in embodiment 3, also can replace the lamp holder 381 and 382 of non-Splittable, and adopt lamp holder 381A and the 382A of Splittable.
In this variation, circuit case 360 is incorporated in diffuser 340A.And in this variation, heat-conduction component 130 also is filled in circuit case 360.
In sum, even in the Straight LED of this variation lamp 300A, also can realize the effect same with embodiment 3.That is, can realize to guarantee the thermal diffusivity of drive circuit 120, have again the LED lamp of good reliability and security.
In addition, in this variation, although heat-conduction component 130 is that to be filled into the inside of circuit case 360 all, but can be also that heat-conduction component 130 is filled into the part of circuit case 360 or does not contact with circuit case 360.
(embodiment 4)
Then, utilize Fig. 9 that the related lighting device 400 of embodiment 4 of the present utility model is described.Fig. 9 is the summary section of the related lighting device of embodiment 4 of the present utility model.
As shown in Figure 9, the related lighting device 400 of embodiment 4 of the present utility model for example is mounted and is used for indoor ceiling 400C, possesses bulb-shaped LED lamp 100 and the ligthing paraphernalia 410 of above-mentioned embodiment 1.
Ligthing paraphernalia (utensil of lighting a lamp) 410 is used for making disappear lamp and lighting a lamp of bulb-shaped LED lamp 100, the light cover 413 that possesses the appliance body 411 that is assembled in ceiling 400C and cover the light transmission of bulb-shaped LED lamp 100.
Appliance body 411 has lamp socket 411a.Lamp socket 411a is for assembling incandescent lamp in the past or the build-up member of the lamp such as bulb-shaped LED lamp 100, is again the power supply part of powering to bulb-shaped LED lamp 100.For example, be screwed into lamp socket 411a by the lamp holder with bulb-shaped LED lamp 100, thereby bulb-shaped LED lamp 100 is installed in lamp socket 411a.And the alternating current of commercial 100V is fed into bulb-shaped LED lamp 100 from lamp socket 411a.Like this, the related bulb-shaped LED lamp 100 of above-mentioned embodiment 1 can be realized as lighting device 400.
In addition, lamp socket 411a is not limited only to the formation that the lamp holder of bulb-shaped LED lamp is screwed up, and can be also the formation that simple lamp holder is inserted into.And, in the present embodiment, though adopted the related bulb-shaped LED lamp 100 of embodiment 1, the variation 1 to 3 of embodiment 1 or the bulb-shaped LED lamp of embodiment 2 also can be adopted.
(embodiment 5)
Then, utilize Figure 10 that the related lighting device 500 of embodiment 5 of the present utility model is described.Figure 10 is the stereoscopic figure of the related lighting device of embodiment 5 of the present utility model.
As shown in figure 10, the related lighting device 500 of present embodiment is lighting devices of basic illumination type, possesses Straight LED lamp 300 and the ligthing paraphernalia 510 of embodiment 3.In the present embodiment, as shown in figure 10, adopt 2 Straight LED lamps 300.
Has the ligthing paraphernalia 510 of this formation such as being installed to ceiling etc. by fix stopper.And, the cap assembly of the light transmission that covers Straight LED lamp 300 also can be set.
As previously discussed, the related Straight LED lamp 300 of present embodiment can be realized as lighting device.And, in the present embodiment, although what use is the Straight LED lamp 300 of embodiment 3, but, also can use the Straight LED lamp 300A of the variation of embodiment 3.
(other)
Above according to embodiment and variation, illumination light source and the lighting device related to the utility model are illustrated, and but, the utility model is not limit by these embodiments and variation.
For example, in above-mentioned embodiment 1 to 5 and their variation, although adopted circuit case, circuit case is not to be essential thing.In this case, preferably the heat-conduction component with dimensionally stable covers component 122, so contains adhesive resin in heat-conduction component.
And, in above-mentioned embodiment 1 to 5 and their variation, heat-conduction component 130 although being formed, heat-conduction component 130 covers all components 122 that are installed on circuit substrate 121, but also can be formed and only cover a part of component 122.In this case, the low component of heat resistance among a plurality of components 122, for example, the semiconductor elements such as the capacity cell such as electrolytic capacitor or IPD (smart power device) especially need to consider the heat radiation countermeasure, heat-conduction component 130 is formed cover the low component of heat resistance.In this case, heat-conduction component 130 preferably also contacts with lamp holder.Like this, can respond well the low component of heat resistance be dispelled the heat.
And in above-mentioned embodiment 1 to 5 and their variation, drive circuit 120 is configured as non-light adjusting circuit, consists of but also can be used as light adjusting circuit.In this case, as component 122, the integrated circuit component that is used for brightness adjustment control is installed to circuit substrate 121.
And in above-mentioned embodiment 1 to 5 and their variation, the formation of LED module is emitted white light by blue led chip and yellow fluorophor, but is not to be limited by this.For example, also can adopt contain red-emitting phosphors and green-emitting phosphor contain the fluorophor resin, thereby by emitting white light with the blue led chip portfolio.And LED chip also can adopt the LED chip of the light that sends blue color in addition.For example, in the situation that the LED chip of ultraviolet is sent in use, as fluorophor particle, can make up utilization to the versicolor fluorophor particle that sends three primary colors (redness of the skin or complexion ， Green look, cyan) light.And, also can use fluorophor particle material for transformation of wave length in addition, as material for transformation of wave length, contain semiconductor, metal complex, organic dyestuff, pigment etc. and can absorb the light of certain wavelength such as adopting, and send the material of the material of the light different from the light wavelength that absorbs.
And, in above-mentioned embodiment 1 to 5 and their variation, electroluminescent) or the light-emitting component such as inorganic EL although show for example LED as light-emitting component, but also can adopt other semiconductor light-emitting elements, organic EL (the Electro Luminescence: such as semiconductor laser.
And, in above-mentioned embodiment 1 to 5 and their variation, though be illustrated for bulb-shaped LED lamp and Straight LED lamp as an example of illumination light source, be not to be limited by this.For example, the utility model also can be applicable to tubular lamp that possesses by LED module and drive circuit etc. in the pipe of ring-type.
And, in above-mentioned embodiment 1 to 2 and their variation, although the formation of LED module 110 is the COB type of LED chip of directly installing, but also can adopt the LED module of the SMD type of the LED element that has utilized the SMD type on substrate.
And, in above-mentioned embodiment 3 and variation thereof, be only to accept the one-sided power supply mode of power supply with lamp holder from the power supply of a side although Straight LED lamp adopts, but also can adopt the bilateral power supply mode of accepting power supply from both sides.In this case, in the end of the both sides of diffuser, the circuit case 360 of taking in drive circuit 120 is set, heat-conduction component 130 is filled into this circuit case 360.
In addition, in the situation that do not break away from purport of the present utility model, the various distortion that those skilled in the art can be expected are executed in the formation of present embodiment and variation, and the formation after perhaps the inscape in embodiment and variation being made up all is included in scope of the present utility model.
The utility model can be widely used in the illumination light sources such as bulb-shaped LED lamp or Straight LED lamp and lighting device etc.
Symbol description
100,100A, 100B, 100C, 200 bulb-shaped LED lamps
110,310,310A LED module
111,311 installation base plates
112，312 LED
113 seals
120 drive circuits
121 circuit substrates
122 components
123a, 123b, 123c, 123d lead-in wire
130,130A, the 130B heat-conduction component
140,240 enclosed globe shades
150,350,350A base plate
The 150a through hole
160,260,360 circuit cases
161,261 first housing departments
162,262 second housing sections
170 frameworks
The 170a space
180,381,381A, 382,382A lamp holder
181 shell sections
182 insulation divisions
183 contact chip sections
190 insulated rings
241 peristomes
251 pillars
252 support plates
300,300A Straight LED lamp
340,340A diffuser
351 mounting portions
352 fin
The 381a pin of powering
400,500 lighting devices
The 400C ceiling
410,510 ligthing paraphernalias
411,511 appliance bodies
411a, the 511a lamp socket
413 light covers.
Claims (12)
1. illumination light source comprises:
Light emitting module has light-emitting component;
Drive circuit, the component that has circuit substrate and be installed in this circuit substrate is used for feeding electrical power to described light emitting module; And
Heat-conduction component covers described component;
The main component of described heat-conduction component is ceramic material.
2. illumination light source as claimed in claim 1,
Described ceramic material is ceramic powder.
3. illumination light source as claimed in claim 2,
Described ceramic powder is alumina powder.
4. illumination light source as claimed in claim 2,
Described ceramic powder is glass dust.
5. illumination light source as described in any one of claim 2 to 4,
Described heat-conduction component comprises adhesive resin.
6. illumination light source as claimed in claim 1,
This illumination light source further comprises circuit case, and this circuit case is used for taking in described drive circuit;
Described heat-conduction component contacts with described circuit case.
7. illumination light source as claimed in claim 6,
Described heat-conduction component is filled in described circuit case.
8. illumination light source as claimed in claim 1,
Described component comprises capacity cell or semiconductor element;
Described heat-conduction component is formed in the mode that covers described capacity cell or described semiconductor element.
9. illumination light source as claimed in claim 1,
This illumination light source further comprises:
Enclosed globe shade covers described light emitting module; And
Lamp holder accepts to be used for making the luminous electric power of described light emitting module.
10. illumination light source as claimed in claim 9,
Described heat-conduction component contacts with described lamp holder inner face.
11. illumination light source as claimed in claim 1,
This illumination light source further comprises:
Longilineal diffuser is used for covering described light emitting module;
Longilineal base plate is used for supporting described light emitting module; And
Lamp holder is arranged at the end of the length direction of described diffuser.
12. a lighting device possesses the described illumination light source of any one of claim 1 to 11.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012207361079U CN203023891U (en) | 2012-12-27 | 2012-12-27 | Light source for illuminating and illuminating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2012207361079U CN203023891U (en) | 2012-12-27 | 2012-12-27 | Light source for illuminating and illuminating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203023891U true CN203023891U (en) | 2013-06-26 |
Family
ID=48647875
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2012207361079U Expired - Lifetime CN203023891U (en) | 2012-12-27 | 2012-12-27 | Light source for illuminating and illuminating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203023891U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104832800A (en) * | 2014-02-07 | 2015-08-12 | 松下知识产权经营株式会社 | Light source for illumination and lighting apparatus |
| CN108278504A (en) * | 2016-12-30 | 2018-07-13 | 朗德万斯公司 | Lighting device, lighting device LED component and the method for assembling lighting device |
-
2012
- 2012-12-27 CN CN2012207361079U patent/CN203023891U/en not_active Expired - Lifetime
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104832800A (en) * | 2014-02-07 | 2015-08-12 | 松下知识产权经营株式会社 | Light source for illumination and lighting apparatus |
| JP2015149235A (en) * | 2014-02-07 | 2015-08-20 | パナソニックＩｐマネジメント株式会社 | Light source for lighting and lighting device |
| CN104832800B (en) * | 2014-02-07 | 2017-04-12 | 松下知识产权经营株式会社 | Light source for illumination and lighting apparatus |
| CN108278504A (en) * | 2016-12-30 | 2018-07-13 | 朗德万斯公司 | Lighting device, lighting device LED component and the method for assembling lighting device |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN202839730U (en) | Light emitting device, light emitting module and lamp | |
| CN203549432U (en) | Bulb-shaped lamp and lighting device | |
| CN203734891U (en) | Light source for lighting and lighting device | |
| US20120320563A1 (en) | Lamp Device | |
| CN103282718A (en) | Bulb-shaped lamp and lighting device | |
| JP2017532793A (en) | Substrate used for LED sealing, three-dimensional LED sealing body, light bulb having three-dimensional LED sealing body, and manufacturing method thereof | |
| JP5545547B2 (en) | Light source body and lighting apparatus | |
| CN103307464A (en) | Light-emitting diode (LED) bulb | |
| JPWO2014083777A1 (en) | Light emitting device and light source for illumination | |
| CN102506317A (en) | U-shaped light-emitting diode (LED) energy-saving lamp | |
| CN203384709U (en) | Illumination light source and illumination device | |
| CN203023891U (en) | Light source for illuminating and illuminating device | |
| CN203068184U (en) | Large-power large-angle light-emitting diode (LED) lamp capable of dissipating heat through lamp base | |
| CN202074270U (en) | Light emitting diode (LED) lamp capable of emitting light within 360 degrees | |
| CN104896324B (en) | Illumination light source and lighting device | |
| EP3099974B1 (en) | Led bulb | |
| CN204573634U (en) | A kind of ceramic LED light source of integrated driving | |
| CN204680689U (en) | Light-emitting device, illumination light source and lighting device | |
| CN102980071A (en) | LED (light-emitting diode) bulb with heat-dissipating structure | |
| CN102980076B (en) | LED bulb lamp | |
| CN203517403U (en) | Light source for illumination and an illumination device | |
| CN203703691U (en) | Illumination light source and illumination device | |
| CN204573618U (en) | Illumination light source and lighting device | |
| CN203757410U (en) | Bulb lamp and illuminating device | |
| CN203273409U (en) | Light-emitting device, light source for lighting and lighting device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term |
Granted publication date: 20130626 |
|
| CX01 | Expiry of patent term |