CN204573618U - Illumination light source and lighting device - Google Patents

Abstract

There is provided a kind of and can either realize illumination light source and the lighting device that desired light distribution characteristic can realize again good heat dissipation characteristics.Illumination light source possesses: enclosed globe shade (10), the pillar (31) extended to the inner space of enclosed globe shade (10), be fixed on the base station (substrate 21) of pillar (31), be configured in the light-emitting component (LED22) of base station, and pillar (31) has to the extended thermal component (31a) in the inner space of enclosed globe shade (10) and the light transparent member (31b) covering thermal component (31a).

Description

Illumination light source and lighting device

Technical field

The utility model relates to illumination light source and possesses the lighting device of this illumination light source.

Background technology

The semiconductor light-emitting elements such as light emitting diode (LED:Light Emitting Diode), owing to having small-sized, efficient and the life-span is long, therefore wait in expectation as the light source of various goods.Wherein, the lamp-bulb type fluorescent lamp that bulb-shaped LED (LED bulb) is in the past known as an alternative or the illumination light source of incandescent lamp bulb constantly studied exploitation (patent document 1).

Bulb-shaped LED such as possesses: LED module (light emitting module), the enclosed globe shade covering LED module, the supporting station of supporting LED module, the drive circuit driven LED module, the peripheral framework be configured in the direct or indirect mode round drive circuit and accept the lamp holder of the electric power for making LED module lighting.

(prior art document)

(patent document)

Patent document 1 Japanese Unexamined Patent Publication 2006-313717 publication

But in bulb-shaped LED in the past, because the light of the LED module of directive lamp holder side is blocked by peripheral framework, therefore light distribution angle becomes narrow, is difficult to obtain the light distribution characteristic as lamp-bulb type fluorescent lamp or incandescent lamp.Especially, LED, when lambert's type luminous intensity distribution, owing to having the characteristic at radiation angle narrow (about 120 °), therefore, is difficult to realize large light distribution angle in bulb-shaped LED.

Further, LED is when luminescence, and LED self meeting heat-dissipating, makes the temperature of LED rise because of the heat occurred, thus cause light output to reduce.Therefore, the problem existed in bulb-shaped LED is, the problem that the heat occurred LED module is efficiently dispelled the heat.

Utility model content

The utility model is in view of above-mentioned problem, and object is that providing a kind of can either realize illumination light source and the lighting device that desired light distribution characteristic can obtain again good heat dissipation characteristics.

In order to reach above-mentioned object, an embodiment of the illumination light source involved by the utility model is possess: enclosed globe shade; Pillar, the inner space be configured to described enclosed globe shade extends; Base station, is fixed on described pillar; And light-emitting component, be configured in described base station, described pillar has thermal component and light transparent member, and described thermal component is configured to extend to the inner space of described enclosed globe shade, and described light transparent member covers described thermal component.

Further, also can be that, in an embodiment of the illumination light source involved by the utility model, described thermal component is metal parts.

Further, also can be that, in an embodiment of the illumination light source involved by the utility model, described thermal component is connected to described base station.

Further, also can be that, in an embodiment of the illumination light source involved by the utility model, described light transparent member covers the whole side of described thermal component.

Further, also can be that, in an embodiment of the illumination light source involved by the utility model, described light transparent member is made up of translucent resin.

Further, also can be, in an embodiment of the illumination light source involved by the utility model, be formed with recess or protuberance on the surface of described light transparent member.

Further, also can be, in an embodiment of the illumination light source involved by the utility model, be formed with recess or protuberance on the surface of described thermal component.

Further, also can be, in an embodiment of the illumination light source involved by the utility model, containing photodiffusion material in described light transparent member.

And, also can be, in an embodiment of the illumination light source involved by the utility model, described base station is flat substrate, there is the first interarea and second interarea relative with described first interarea, described substrate is configured to, and described first interarea is towards the top of described enclosed globe shade, and described light-emitting component is configured in described first interarea of described substrate.

Further, also can be that, in an embodiment of the illumination light source involved by the utility model, described substrate has light transmission.

And, also can be, in an embodiment of the illumination light source involved by the utility model, described base station is flat substrate, there is the first interarea and second interarea relative with described first interarea, described substrate is configured to, and described first interarea is towards the top of described enclosed globe shade, and described light-emitting component is arranged, respectively described first interarea of described substrate and described second interarea.

And, also can be, in an embodiment of the illumination light source involved by the utility model, described base station has flat first substrate and flat second substrate, described first substrate has the first interarea and second interarea relative with described first interarea, described second substrate has the 3rd interarea and four interarea relative with described 3rd interarea, described first substrate is configured to, described first interarea is towards the top of described enclosed globe shade, described second substrate is configured to, described 4th interarea is towards the top of described enclosed globe shade, described light-emitting component is arranged, respectively described first interarea of described first substrate and described 3rd interarea of described second substrate.

And, also can be that, in an embodiment of the illumination light source involved by the utility model, described light-emitting component is LED chip, described illumination light source also possesses seal member, and sealing parts are formed on described substrate in the mode covering described LED chip.

And, also can be, in an embodiment of the illumination light source involved by the utility model, the seal member that described light-emitting component has container, is configured in the LED chip in described container and is formed in described container, sealing parts are for covering described LED chip.

Further, also can be that, in an embodiment of the illumination light source involved by the utility model, described seal member comprises the wavelength shifter converted the wavelength of the light that described LED chip sends.

Further, an embodiment of the lighting device involved by the utility model is possess any one illumination light source above.

By the utility model, desired light distribution characteristic can either be realized and can obtain good heat dissipation characteristics again.

Accompanying drawing explanation

Fig. 1 is the outward appearance oblique view of the bulb-shaped lamp involved by embodiment of the present utility model.

Fig. 2 is the exploded perspective view of the bulb-shaped lamp involved by embodiment of the present utility model.

Fig. 3 is the profile of the bulb-shaped lamp involved by embodiment of the present utility model.

Fig. 4 a is the plane of the LED module in the bulb-shaped lamp involved by embodiment of the present utility model.

Fig. 4 b is the profile of this LED module at A-A ' the line place of Fig. 4 a.

Fig. 4 c is the profile of this LED module at B-B ' the line place of Fig. 4 a.

Fig. 5 a and Fig. 5 b is the profile of LED module in the bulb-shaped lamp involved by embodiment of the present utility model and supporting station (pillar).

Fig. 5 c is the profile at A-A ' the line place of Fig. 5 a.

Fig. 6 a and Fig. 6 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 1 of the present utility model and supporting station (pillar) are shown.

Fig. 6 c is the profile at A-A ' the line place of Fig. 6 a.

Fig. 7 a and Fig. 7 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 2 of the present utility model and supporting station (pillar) are shown.

Fig. 7 c is the profile at A-A ' the line place of Fig. 7 a.

Fig. 8 a and Fig. 8 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 3 of the present utility model and supporting station (pillar) are shown.

Fig. 8 c is the profile at A-A ' the line place of Fig. 8 a.

Fig. 9 a and Fig. 9 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 4 of the present utility model and supporting station (pillar) are shown.

Fig. 9 c is the profile at A-A ' the line place of Fig. 9 a.

Figure 10 a and Figure 10 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 5 of the present utility model and supporting station (pillar) are shown.

Figure 10 c is the profile at A-A ' the line place of Figure 10 a.

Figure 11 a and Figure 11 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 6 of the present utility model and supporting station (pillar) are shown.

Figure 11 c is the profile at A-A ' the line place of Figure 11 a.

Figure 12 is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 7 of the present utility model and supporting station (pillar) are shown.

Figure 13 is the summary section of the lighting device involved by embodiment of the present utility model.

Figure 14 is the profile of the pillar involved by variation 1 of bulb-shaped lamp involved by embodiment of the present utility model.

Figure 15 is the profile of the pillar involved by variation 2 of bulb-shaped lamp involved by embodiment of the present utility model.

Figure 16 is the profile of the pillar involved by variation 3 of bulb-shaped lamp involved by embodiment of the present utility model.

symbol description

1 bulb-shaped lamp

2 lighting devices

3 lighting tool

4 appliance bodies

4a lamp socket

5 lampshades

10 enclosed globe shades

11 opening portions

20,20E, 20F, 20G LED module

21 substrates (base station)

21A first substrate

21B second substrate

21a, 21Aa first interarea

21b, 21Ab second interarea

21Bc the 3rd interarea

21Bd the 4th interarea

22 LED (light-emitting component)

23 seal members

24 metal lines

25 wires

26a, 26b terminal

27a, 27b through hole

28 adhesives

30 supporting stations

31,31A, 31B, 31C, 31D, 31E, 31G pillar

31a thermal component

31a1 flat part

31a2 main shaft part

31a1,32b1 recess

31a2,32b2 protuberance

31aX flat part

31aY main shaft part

31b light transparent member

32 pedestals

Little portion, 32a footpath

Large portion, 32b footpath

40 drive circuits

41 circuit substrates

42 components

43a, 43b, 43c, 43d go between

50 circuit retainers

51 circuit cases

52 covers

60 radiators

70 peripheral frameworks

80 lamp holders

81 shell portions

82 insulation divisions

83 contact chip portions

90 adhesives

Detailed description of the invention

Referring to accompanying drawing, embodiment of the present utility model is described.Further, illustrated below embodiment is a preferred object lesson of the present utility model.Therefore, the allocation position of the numerical value shown in following embodiment, shape, material, inscape, inscape and connected mode etc. are an example, are not to limit purport of the present utility model.Therefore, in the inscape of following embodiment, for illustrating the inscape that the independent claims of upper concept of the present utility model are not recorded, illustrate as arbitrary inscape.

Further, each figure is ideograph, is not rigorous diagram.Further, give identical symbol for the identical formation in each figure, and omit or simplify repeat specification.

(illumination light source)

In the following embodiments, as an example of illumination light source, bulb-shaped LED (LED bulb) is described.

[entirety of bulb-shaped lamp is formed]

First, utilize Fig. 1 and Fig. 2 to form the entirety of the bulb-shaped lamp 1 involved by present embodiment to be described.Fig. 1 is the outward appearance oblique view of the bulb-shaped lamp involved by embodiment of the present utility model.Further, Fig. 2 is the exploded perspective view of the bulb-shaped lamp involved by embodiment of the present utility model.Further, lead-in wire 43a to 43d is omitted in fig. 2.

As shown in Figure 1 and Figure 2, bulb-shaped lamp 1 involved by present embodiment is the bulb-shaped LED of the substitute becoming lamp-bulb type fluorescent lamp or incandescent lamp bulb, possesses: the drive circuit 40 of enclosed globe shade 10, LED module 20 as light source, the supporting supporting station 30 of LED module 20, driving LED module 20, keep the circuit retainer 50 of drive circuit 40, with surround circuit retainer 50 mode and be configured radiator 60, to surround the mode of radiator 60 and the peripheral framework 70 that is configured and the lamp holder 80 accepting electric power from outside.

Bulb-shaped lamp 1 is by enclosed globe shade 10, peripheral framework 70, lamp holder 80 and constitute peripheral device.In bulb-shaped lamp 1, such as, formed with the LED module 20 that can send the brightness being equivalent to 60W.

Fig. 3 each inscape to the bulb-shaped lamp 1 involved by present embodiment is utilized to be described in detail referring to Fig. 2.Fig. 3 is the profile of the bulb-shaped lamp involved by embodiment of the present utility model.

The side view of shown in Figure 3 is drive circuit 40, instead of profile.Further, in figure 3, the chain-dotted line that the above-below direction along paper is drawn represents the lamp axle J (central shaft) of bulb-shaped lamp, and in the present embodiment, lamp axle J is consistent with enclosed globe shade axle.Further, lamp axle J refers to, becomes the axle of pivot when bulb-shaped lamp 1 being installed to the lamp socket of lighting device (not shown), consistent with the rotating shaft of lamp holder 80.

[enclosed globe shade]

As shown in Figure 3, enclosed globe shade 10 is the diffusers covering LED module 20, is configured to the outside that the light of being released by LED module 20 can be fetched into lamp.Therefore, be injected into the light transmission enclosed globe shade 10 of the LED module 20 of the inner surface of enclosed globe shade 10, and be fetched to the outside of enclosed globe shade 10.

Enclosed globe shade 10 is rotary bodies of the hollow with opening portion 11, and shape is in the present embodiment, one end is closed in spherical, and the other end has opening portion 11.Specifically, the shape of enclosed globe shade 10 is, the part of the ball of hollow extends to the direction of the central part away from ball and narrows, and is formed with opening portion 11 on the position of the central part away from ball.The axle of enclosed globe shade 10 is consistent with lamp axle J.As the enclosed globe shade 10 of this shape, the glass bulb identical with the shape of general lamp-bulb type fluorescent lamp or incandescent lamp bulb can be adopted.Such as, the A shape of the C7710 defined of JIS, G shape or E shape etc. can be adopted as enclosed globe shade 10.

As shown in Figure 3, enclosed globe shade 10 is configured to be supported by supporting station 30, and opening portion 11 abuts with the surface of supporting station 30 or close.Enclosed globe shade 10 is by the adhesives such as silicones 90, and the end of its opening portion 11 is fixed on supporting station 30.Further, in the present embodiment, enclosed globe shade 10, supporting station 30, peripheral framework 70 are interfixed by adhesive 90.

Enclosed globe shade 10 is the glass bulb (clear lamp) that transparent fused silica is made for visible ray.Therefore, be incorporated in LED module 20 in enclosed globe shade 10 can from the outside of enclosed globe shade 10 visual to.

Further, as the material of enclosed globe shade 10, be not limited to glass material, and the resin material etc. such as acrylic resin (PMMA) or polycarbonate (PC) can be used.Further, enclosed globe shade 10 also can need not to be transparent, and enclosed globe shade 10 also can be made to have light diffusion function.Such as, by the resin containing the photodiffusion material such as silica or calcium carbonate or Chinese white etc. being filled inner surface or the outer surface of enclosed globe shade 10, thus milky optical diffusion film is formed.Like this, by making enclosed globe shade 10 have light diffusion function, thus can the light inciding enclosed globe shade 10 from LED module 20 be spread, therefore, it is possible to expand the light distribution angle of lamp.

[LED module]

LED module 20 is the light emitting modules with light-emitting component, releases the light of the specified color (wavelength) such as white.LED module 20 in present embodiment is the White LED light sources of the B-Y type of being released white light by blue LED die and yellow fluorophor.

As shown in Figure 3, LED module 20 is maintained at the inner space central authorities of enclosed globe shade 10 by supporting station 30, come luminous by the electric power supplied from drive circuit 40 by lead-in wire 43a and 43b.

LED module 20 is preferably configured in the center (the most inside, footpath that such as, the internal diameter of enclosed globe shade 10 is large) of the ball shape of enclosed globe shade 10.Further, the LED module 20 in present embodiment is in elongate shape, is configured to its length direction orthogonal with the axle (lamp axle J) of pillar 31.Specifically, the substrate 21 of elongate is supported by pillar 31 in the mode that its length direction is orthogonal with the direction of principal axis of pillar 31.

At this, Fig. 4 a to Fig. 4 c each inscape to LED module 20 is utilized to be described.Fig. 4 a to Fig. 4 c shows the formation of the LED module in embodiment of the present utility model, and Fig. 4 a is plane, and Fig. 4 b is the profile at A-A ' the line place of Fig. 4 a, and Fig. 4 c is the profile at B-B ' the line place of Fig. 4 a.

As shown in Fig. 4 a to Fig. 4 c, LED module 20 has: substrate 21, LED22, seal member 23, metal line 24, wire 25, terminal 26a and 26b.LED module 20 in present embodiment is COB (Chip On Board: chip on board) structures that bare chip is directly installed on substrate 21.Below each inscape of LED module 20 is described in detail.

First substrate 21 is described.Substrate 21 is examples for base station, is fixed on the pillar 31 of supporting station 30.Substrate 21 in present embodiment is the installation base plates for installing LED22, it is the flat substrate with the first interarea (surface) 21a and the second interarea (back side) 21b, first interarea (surface) 21a is the face of installing LED22, and the second interarea (back side) 21b is the face relative with this first interarea 21a.

As shown in fig. 4 a, substrate 21 is such as plane depending on (during from the top of enclosed globe shade 10) is rectangular plate-like substrate.Further, the shape as substrate 21 also can be square beyond rectangle or circle, also can be the polygonal beyond the quadrangle such as hexagon or octagonal.

As substrate 21, such as, the light for sending from LED22 (seal member 23) can be adopted to be the light-transmitting substrate that light transmittance is high.By adopting light-transmitting substrate, thus the light sent from LED22 (seal member 23) can through the inside of substrate 21, and the second interarea 21b that never can install LED22 penetrates.Therefore, even if when LED22 is only installed in the first interarea 21a of substrate 21, because light also can penetrate from the second interarea 21b, therefore easily obtain the light distribution characteristic approximate with incandescent lamp bulb.

As light-transmitting substrate, such as can use the total transmissivity rate of visible ray is the substrate of more than 80%, or adopting for visible ray is transparent transparency carrier (that is, light transmittance is very high, can see the substrate of the state of opposite side through substrate).As this light-transmitting substrate, the transparent resin substrate etc. that light transparent ceramic substrate, the transparent glass substrate be made up of glass, the quartz wafer be made up of crystal, the sapphire substrate be made up of sapphire or the transparent resin material that the pottery of polycrystalline or aluminium nitride can be adopted to form are formed.Further, also resin substrate or flexible base board can be adopted as substrate 21.

In addition, also can adopt the substrate low to the transmitance of the light sent from LED22 as substrate 21, such as total transmissivity rate is white substrate such as the white oxide aluminium base of less than 10% or by the coated metal substrate (metal is the substrate at the end) etc. of resin molding.Like this, by adopting the substrate that light transmission is low, thus light transmission substrate 21 can be suppressed and penetrate from the second interarea 21b, therefore, it is possible to suppress the uneven of color.Further, due to cheap white substrate can be adopted, therefore, it is possible to reduce costs.

Substrate 21 is that the mode that face contacts is connected supporting station 30 with its second interarea 21b with the stationary plane of supporting station 30 (pillar 31).Further, two through holes are provided with at substrate 21, i.e. through hole 27a and 27b, to make lead-in wire 43a and the 43b electrical connection of two shown in Fig. 3.The leading section of lead-in wire 43a (43b) through through hole 27a (27b), and is welded with the terminal 26a (26b) being formed on substrate 21.

Then, LED22 is described.LED22 is an example of light-emitting component, is to carry out luminous semiconductor light-emitting elements by the electric power specified.Each LED22 is the bare chip sending monochromatic visible light.In the present embodiment, the blue LED die that can send blue light during energising is adopted.As blue LED die, such as can adopt be made up of the material of InGaN system, centre wavelength is the gallium nitride based semiconductor light-emitting elements of 440nm to 470nm.

Further, LED22 is only configured in the first interarea 21a of substrate 21, and on the long side direction along substrate 21, multiple LED22 is configured to multiple row.In the present embodiment, be configured with four row to be formed a line by multiple LED22 and the element line formed.Further, the element line of LED22 not limit by four row, and can be one to three row, also can be more than five row.

Then, seal member 23 is described.Seal member 23 is such as made up of resin, and is formed as covering LED22.Seal member 23 is formed, and seals in the lump each row of multiple row that multiple LED22 is formed.In the present embodiment, the element line due to LED22 is mounted with four row, therefore forms four seal members 23.Article four, each orientation along multiple LED22 (column direction) of seal member 23, is arranged on linearity on the first interarea 21a of substrate 21.

Seal member 23 is formed primarily of translucent material, when needing to be the wavelength specified by the wavelength conversion of the light of LED22, wavelength shifter is mixed into translucent material.

Seal member 23 in present embodiment is containing the wavelength conversion member as the fluorophor of wavelength shifter, can convert the wavelength of the light that LED22 sends (color).As this seal member 23, such as, can be made up of the resin material of the insulating properties containing fluorophor particle (containing fluorophor resin).The light stimulus that fluorophor particle is sent by LED22, and the light of color (wavelength) desired by releasing.

As the resin material forming seal member 23, such as, silicones can be adopted.Further, photodiffusion material also can be dispersed to seal member 23.Further, seal member 23 also can be formed by resin material, and except the organic materials such as fluorine resin, the inorganic material such as the glass can also made by low-melting glass, sol-gal process etc. are formed.

As fluorophor particle contained in seal member 23, such as, when LED22 is the blue led sending blue light, in order to obtain white light, such as, the yellow fluorophor particle of YAG system can be adopted.Accordingly, a part for the blue light that LED22 sends, the yellow fluorophor particle comprised by seal member 23 and be sodium yellow by wavelength conversion.Further, not by yellow fluorophor particle absorption blue light with converted by yellow fluorophor particle wavelengths after sodium yellow mix, thus penetrate white light from seal member 23.Further, the particles such as silica are adopted as photodiffusion material.

Seal member 23 in present embodiment for make the fluorophor particle of regulation be distributed to silicones and formed containing fluorophor resin, be applied to the first interarea 21a of substrate 21 by distributor and formed by hardening.In this case, seal member 23 is semi-cylindrical, and the shape in the cross section vertical with the length direction of seal member 23 is roughly semicircle.

And, in order to the light (spilling light) of the LED22 penetrated the second interarea 21b from substrate 21 carries out wavelength conversion, also can between LED22 and substrate 21 or the second interarea 21b of substrate 21 form second wave length transform component further, this second wave length transform component refers to, the fluorescent membranes (luminescent coating) such as the sintered body film be made up of the inorganic grafting material such as fluorophor particle and glass (adhesive), or identical with the surface of substrate 21 containing fluorophor resin.Like this, form second wave length transform component further by the second interarea 21b at substrate 21, thus white light can be released from two of substrate 21 face.

Then, metal line 24 is described.Metal line 24 is conductive traces of the current flowing for making LED22 luminescence, and the surface of substrate 21 is formed as by pattern the shape specified.As shown in fig. 4 a, metal line 24 is formed on the first interarea 21a of substrate 21.By metal line 24, the electric power being supplied to LED module 20 from lead-in wire 43a and 43b is fed into each LED22.

Multiple LED that metal line 24 is formed in each LED element row are one another in series connection.Such as, metal line 24 is formed rotary island shape between LED adjacent one another are.Further, metal line 24 is formed to be connected in parallel each other each element line.Each LED22 is electrically connected with metal line 24 via wire 25.Further, between adjacent LED22, also metal line 24 can not be set.In this case, LED22 adjacent one another are is by chip-to-chip (chip extremely chip) and by wire-bonded.

Metal line 24 such as can by carrying out patterning to the metal film be made up of metal material, and carry out printing to be formed.As the metal material of metal line 24, such as, can adopt silver (Ag), tungsten (W) or copper (Cu) etc.

And, for the metal line 24 exposed from seal member 23, except terminal 26a and 26b, the resin molding (resinous coat film) that the glass-film (glass coating film) be preferably made up of glass material or resin material are formed is coated.Accordingly, the insulating properties in LED module 20 can be improved, and the reflectivity on the surface of substrate 21 can be improved, and the oxidation of metal line 24 can be suppressed.As resin molding, such as, can use white etchant resist.

Then, wire 25 is described.Wire 25 is such as golden wire isoelectric line.As shown in Figure 4 b, wire 25 couples of LED22 are connected with metal line 24.Further, wire 25 is all embedded in seal member 23, not expose from seal member 23.

Then, terminal 26a and 26b is described.Terminal 26a and 26b is the galvanic external connection terminals accepted from the outside of LED module 20 for making LED22 luminescence.In the present embodiment, terminal 26a and 26b welds with lead-in wire 43a and 43b.

Further, terminal 26a and 26b is the power supply terminal of LED module 20, by the direct current accepted from lead-in wire 43a and 43b, is supplied to each LED22 via metal line 24 and wire 25.

Terminal 26a and 26b, respectively to surround the mode of through hole 27a and 27b, the first interarea 21a of substrate 21 is formed the shape specified.Terminal 26a and 2 6b and metal line 24 form continuously, and are electrically connected with metal line 24.Further, terminal 26a and 26b adopts the metal material identical with metal line 24, is formed with pattern while of metal line 24.

[supporting station]

Supporting station 30 is support units of supporting LED module 20, installs LED module 20 at supporting station 30.Further, the thermal component (radiator) that supporting station 30 dispels the heat as the heat for occurring LED module 20 (LED22) plays a role.As shown in Figure 3, supporting station 30 is made up of pillar 31 and pedestal 32.

First with reference to Fig. 3 utilize the formation of Fig. 5 a to Fig. 5 c to pillar 31 to be described.Fig. 5 a to Fig. 5 c is the profile of the formation that LED module in embodiment of the present utility model and supporting station (pillar) are shown.Further, profile when Fig. 5 a is the central portion along the length direction cut-out substrate 21 of this this substrate 21, profile when Fig. 5 b is the central portion along the short direction cut-out substrate 21 of this substrate 21, Fig. 5 c is the profile at A-A ' the line place of Fig. 5 a.

As shown in Figure 3, pillar 31 is nearby extended to the inner space of enclosed globe shade 10 elongate parts of the opening portion 11 from enclosed globe shade 10.In the present embodiment, pillar 31 is extended setting with the axle of self along the mode of lamp axle J.That is, the axle of pillar 31 is coaxial with lamp axle J.

Pillar 31 plays function as keeping the holding member of LED module 20, and plays function as the thermal component that the heat occurred LED module 20 (LED22) is dispelled the heat.

One end of pillar 31 is connected with LED module 20, and the other end of pillar 31 is connected with pedestal 32.Specifically, the stationary plane of the substrate 21 being used for fixed L ED module 20 is formed at the top of pillar 31.At the substrate 21 of the stationary plane mounting LED module 20 of pillar 31, substrate 21 and pillar 31 are such as by bondings such as adhesives.

The formation of pillar 31 comprises: thermal component (heat radiation column sections) 31a be made up of metal material and light transparent member (printing opacity column sections) 31b be made up of translucent material, has heat sinking function and optical function.

Thermal component 31a is the radiator that the heat for occurring LED module 20 (LED22) is dispelled the heat, and the inner space to enclosed globe shade 10 is extended.Thermal component 31a is higher than the pyroconductivity of light transparent member 31b, and the heat occurred at LED module 20 (LED22) is mainly transmitted to pedestal 32 via thermal component 31a.Further, thermal component 31a connects with substrate 21.

In the present embodiment, thermal component 31a is cross section is circular elongate parts, such as can roughly in cylindric.Further, as shown in Fig. 5 a and Fig. 5 b, the end of a side of the length direction of thermal component 31a contacts with the second interarea 21b face of substrate 21.Like this, by making thermal component 31a contact with substrate 21, thus can the heat transfer that well LED module 20 occurred of efficiency to pillar 31.

Further, as shown in Figure 3, the end of the opposing party of the length direction of thermal component 31a connects with pedestal 32.Accordingly, the heat being transmitted to pillar 31 can be conducted efficiently to pedestal 32.

Thermal component 31a in present embodiment is metal parts (metal mainstay portion), in this case, the formation of thermal component 31a can be, in order to efficiently the heat that LED module 20 occurs be rejected heat to pillar 31, therefore adopt the metal material that the pyroconductivities such as aluminium (Al), copper (Cu) or iron (Fe) are high as main component.Accordingly, in the heat that LED module 20 occurs, radiator 60 can be transmitted to efficiently via pillar 31.Further, thermal component 31a is not limited to and is made of metal, and also can adopt the resin material that pyroconductivity is high.When making thermal component 31a with resin, as the resin material of thermal component 31a, at least adopt the material higher than the pyroconductivity of the material of light transparent member 31b.

Light transparent member 31b is the light transparent member making the light transmission penetrated from LED module 20 (LED22).Light transparent member 31b can be made up of the translucent resin that light transmittance is high.Such as, light transparent member 31b can adopt transparent resin to form.

Further, light transparent member 31b covers thermal component 31a.Light transparent member 31b in present embodiment covers the whole side of thermal component 31a.Such as, the coated thermal component 31a of light transparent member 31b, to make pillar 31 entirety become columned mode, and is formed in the lateral circle surface of thermal component 31a.Further, as shown in Fig. 5 a and Fig. 5 b, the end of a side of the length direction of light transparent member 31b is that face contacts with the second interarea 21b of substrate 21.

Light transparent member 31b, owing to being made up of translucent material, therefore, incides light transparent member 31b from a part for the light of LED module 20 injection, and by the inside of leaded light to light transparent member 31b,, reflected by thermal component 31a meanwhile, and inject to outside from the surface of light transparent member 31b.Accordingly, the luminescence of pillar 31 can visually be felt.

Further, from other a part of the light that LED module 20 penetrates, at the surface reflection of light transparent member 31b.Accordingly, can light transparent member 31b be passed through, impel the light radiation of LED module 20 to lamp holder 80 side.

Light transparent member 31b also can contain photodiffusion material.Accordingly, because the light can derived by light transparent member 31b is spread by photodiffusion material, thus, easily can take out light from light transparent member 31b, like this, visually just more can feel that pillar 31 is luminous.And, by making photodiffusion material be contained in whole light transparent member 31b, like this, visually can feel that pillar 31 entirety is in luminescence.

Further, in the present embodiment, substrate 21 has light transmission, and as shown in Figure 5 b, LED22 (seal member 23) and light transparent member 31b are oppositely disposed.Accordingly, from the inside of the light transmission substrate 21 that the LED22 (seal member 23) be oppositely disposed with light transparent member 31b penetrates, be directly injected into light transparent member 31b, and inside directly via light transparent member 31b is guide-lighting.Accordingly, the luminescence of pillar 31 can visually be felt further.

Then, the formation of pedestal 32 is described.As shown in Figure 3, pedestal 32 is the parts of support column 31, is again the thermal component of the heat heat radiation for making LED module 20 (LED22) occur.Therefore, pedestal 32 can adopt the metal materials such as aluminium to be formed.

Pedestal 32 is configured to block the mode of the opening portion 11 of enclosed globe shade 10, and, be connected to radiator 60.Pedestal 32 and radiator 60 are such as fixed by riveted joint.

Pedestal 32 is the disc-shaped parts with stage portion, is made up of the footpath that diameter is little little portion 32a and the large large portion 32b in footpath of diameter.Footpath little portion 32a and the large portion 32b in footpath forms stage portion.Footpath little portion 32a and the large portion 32b in footpath is such as by carrying out punch process to be formed to aluminium sheet.

The little portion 32a in footpath forms the connecting portion with pillar 31.The little portion 32a in footpath (pedestal 32) and pillar 31 such as utilize the fixed part such as adhesive or screw to fix, and can fix by pillar 31 is pressed into the little portion 32a in footpath.Further, in footpath, little portion 32a is provided with two for making two reach through holes of lead-in wire 43a and 43b break-through.

The large portion 32b in footpath forms the connecting portion with radiator 60, and chimeric with radiator 60.Pedestal 32 is embedded into the opening portion of radiator 60 in the mode that the outer peripheral face of the large portion 32b in footpath contacts with the inner peripheral surface of radiator 60.Accordingly, the heat of pedestal 32 can be transmitted to radiator 60 efficiently.

Further, the opening portion 11 of enclosed globe shade 10 is connected to above the large portion 32b in footpath, thus the opening portion 11 of enclosed globe shade 10 is blocked.

In the present embodiment, although pillar 31 and pedestal 32 are that allosome is formed, but thermal component 31a and the pedestal 32 of pillar 31 also can be integrally formed.

[drive circuit]

Drive circuit (circuit unit) 40 is the lamp circuits for making LED module 20 (LED22) luminous (lighting), and the electric power of regulation is supplied to LED module 20.As shown in Figure 3, the drive circuit 40 in present embodiment is that the alternating current supplied from lamp holder 80 via pair of lead wires 43c and 43d is converted to direct current, and this direct current is supplied to the power circuit of LED module 20 via pair of lead wires 43a and 43b.

Drive circuit 40 is by circuit substrate 41 and for making multiple components (electronic unit) 42 of LED module lighting form.Each component 42 is installed in circuit substrate 41.

Circuit substrate 41 is printed circuit board (PCB)s that the face (solder side) of side is formed by metal wiring patterns such as Copper Foils.The multiple components being installed to circuit substrate 41 are electrically connected to each other by metal line.Further, multiple through hole (not shown) for making the lead-in wire of component (pin) insert is formed with at circuit substrate 41.In the present embodiment, circuit substrate 41 is held in circuit retainer 50 in roughly orthogonal with the lamp axle J mode of the interarea of self (laterally placing).Further, circuit substrate 41 also can be, is maintained at circuit retainer 50 in the mode (longitudinally placing) almost parallel with lamp axle J.

Component 42 is made up of element body portion and the lead-in wire (pin) that is connected with circuit substrate 41, the through hole of lead-in wire break-through circuit substrate 41, and is connected to circuit substrate 41 by welding etc.Component 42 is such as the capacity cell such as electrolytic capacitor or ceramic capacitor, the semiconductor elements etc. such as the resistive elements such as resistor, convertor circuit element, coil part, choking-winding (choke transformer), noise filter, diode or integrated circuit component.Component 42 is installed in the interarea (being lower surface face in figure 3) of the side of circuit substrate 41 mostly.That is, circuit substrate 41 is configured in the mode of the opening surface of the opening portion 11 in the face of enclosed globe shade 10 with another interarea of this circuit substrate 41 (in figure 3 for upper surface).

There is the drive circuit 40 of this formation by being incorporated in circuit retainer 50, thus ensure that the insulating properties with the outside of lamp.Further, in drive circuit 40, also light adjusting circuit or booster circuit etc. can be combined.

Drive circuit 40 is electrically connected by pair of lead wires 43a and 43b with LED module 20.Further, drive circuit 40 is electrically connected by pair of lead wires 43c and 43 with lamp holder 80.These four lead-in wire 43a to 43d are such as alloyed copper lead-in wires, and the resin coating of the insulating properties of the heart yearn be made up of alloyed copper and this heart yearn coated is formed.

In the present embodiment, lead-in wire 43a is high-pressure side lead-out terminal line, and lead-in wire 43b is low-pressure side lead-out terminal line.Lead-in wire 43a and 43b break-through is arranged on the through hole of supporting station 30, and is drawn out to LED module side (in enclosed globe shade 10).

Further, respective one end (heart yearn) of lead-in wire 43a and 43b, through through hole 27a and 27b of the substrate 21 of LED module 20, is welded with terminal 26a and 26b.Further, the respective other end (heart yearn) of lead-in wire 43a and 43b welds with the metal line of circuit substrate 41.

Further, lead-in wire 43c and 43d is the electric power by being used for making LED module 20 lighting, is supplied to the electric wire of drive circuit 40 from lamp holder 80.Respective one end (heart yearn) of lead-in wire 43c and 43d is electrically connected with lamp holder 80 (shell portion 81 or contact chip portion 83), and the respective other end (heart yearn) is electrically connected with the power input (metal line) of circuit substrate 41 by welding etc.

[circuit retainer]

Circuit retainer 50 is the holding members for keeping drive circuit 40, between enclosed globe shade 10 and lamp holder 80.Circuit retainer 50 in present embodiment as shown in Figure 3, is made up of circuit case 51 and cover 52.

Circuit case 51 surrounds the mode of component 42 and the insulation crust be configured, such as, can adopt the formations such as insulative resin material such as polybutylene terephthalate (PBT).The inner surface of circuit case 51 is provided with the protuberance etc. for holding circuit substrate 41.

Circuit case 51 is made up of the first housing department and second housing portion, and this first housing department is surrounded by radiator 60, and the outer peripheral face in this second housing portion is formed and screws up portion for what screw up with lamp holder 80.Lamp holder 80 by being screwed into circuit case 51, thus is fixed on circuit retainer 50 (circuit case).

Cover 52 be roughly tubular and be configured to the insulating properties of lid have end cylindrical shell.Cover 52 is also same with circuit case 51, such as, can adopt the formations such as insulative resin material such as PBT.

The upper surface shape of cover 52 is according to the surface configuration of supporting station 30 and formed, and is formed with and that be configured recess corresponding with pillar 31 at the upper surface of cover 52.This recess is formed from the back side of pedestal 32 outstanding to drive circuit 40 side.

Further, in the present embodiment, although circuit substrate 41 is configured to be kept by circuit case 51, but, also can be configured to be kept by cover 52.In this case, such as, can be configured to, the engagement pawl of being given prominence to downwards by the inner surface of the cap from cover 52 carrys out holding circuit substrate 41.Further, in the present embodiment, as circuit retainer 50 a part and be provided with cover 52, but cover 52 also can not be set, only carry out forming circuit retainer 50 by circuit case 51.

[radiator]

Radiator 60 surrounds the mode of drive circuit 40 and the cylindrical shell (framework) be configured.That is, drive circuit 40 is configured in the inner space of radiator 60.In the present embodiment, radiator 60 surrounds drive circuit 40 by circuit retainer 50.

Further, radiator 60 plays function, with the stateful connection contacted with supporting station 30 in supporting station 30 as radiating part.Accordingly, the heat that LED module 20 occurs is transmitted to radiator 60 via supporting station 30, therefore, it is possible to dispel the heat to the heat of LED module 20.

Radiator 60 can be made up of the material that pyroconductivity is high, in the present embodiment, is formed with the material larger than the pyroconductivity of circuit case 51.Radiator 60 can be made of metal, and in the present embodiment, is made up of aluminium.Further, radiator 60 may not be metal material, and the nonmetallic materials such as resin can be adopted to be formed.In this case, radiator 60 preferably adopts the nonmetallic materials that pyroconductivity is high.

Radiator 60 is configured to from enclosed globe shade 10 side to lamp holder 80 side, and its internal diameter and external diameter diminish gradually, the inner peripheral surface of radiator 60 and outer peripheral face with relative to lamp axle J for the state tilted and being configured, become the conical surface (inclined plane).Specifically, radiator 60 is that all wall thickness are fixed, and the parts roughly cylindrically that internal diameter and external diameter gradually change, such as, be configured to skirt with the state on inner surface and the outer surface surface that is the frustum of a cone.

The radiator 60 with this formation, to vacate the state in the gap of regulation between circuit case 51 and peripheral framework 70, is configured between circuit case 51 and peripheral framework 70.That is, between the inner peripheral surface and the outer peripheral face of circuit case 51 of radiator 60, there is air layer, and, between the outer peripheral face and the inner peripheral surface of peripheral framework 70 of radiator 60, also there is air layer.Accordingly, even if circuit case 51, radiator 60 and peripheral framework 70 linear expansion coefficient is each other different, the thermal contraction difference of all parts or thermal expansion difference also can be absorbed by gap, therefore, it is possible to suppress, at resin parts, crack occurs.

[peripheral framework]

Peripheral framework 70 is to vacate gap between radiator 60 and to be trapped among the surrounding of radiator 60 and the cylindrical shell (framework) that is configured.Peripheral framework 70 in present embodiment is insulating properties cap assemblies, such as, can be made up of insulative resin materials such as PBT.By being carried out the radiator 60 of covering metal by the peripheral framework 70 with insulating properties, thus the insulating properties of bulb-shaped lamp 1 can be improved.

The outer surface of peripheral framework 70 exposes the outside (in air) at lamp.Further, the inner peripheral surface of peripheral framework 70 is relative with the outer peripheral face of radiator 60.Gap is provided with between the outer peripheral face and the inner peripheral surface of radiator 60 of peripheral framework 70.

Peripheral framework 70 is parts roughly cylindrically that thickness is fixed and internal diameter and external diameter gradually change, such as, can be configured to the skirt that inner surface and outer surface become the surface of the frustum of a cone.Inner peripheral surface and the outer peripheral face of peripheral framework 70 are configured to the conical surface (inclined plane) with the state tilted relative to lamp axle J.In the present embodiment, peripheral framework 70 is configured to, along with towards lamp holder 80 side, its internal diameter and external diameter diminish gradually.

[lamp holder]

Lamp holder 80 is the power receiving sections accepted from the outside of lamp for the electric power making LED module 20 (LED22) luminous.Lamp holder 80 is such as installed in the lamp socket of ligthing paraphernalia.Accordingly, when making bulb-shaped lamp 1 lighting, lamp holder 80 can accept electric power from the lamp socket of ligthing paraphernalia.The alternating current of the source power supply from AC100V is such as supplied at lamp holder 80.Lamp holder 80 in present embodiment accepts alternating current by two contacts, and the electric power accepted at lamp holder 80 to be imported into the power input of drive circuit 40 via pair of lead wires 43c and 43d.

Lamp holder 80 has end cylindrical shape for metal, is the shell portion 81 of male thread and forms via the contact chip portion 83 that insulation division 82 is installed in shell portion 81 by outer peripheral face.What be formed with lamp socket for screwing up ligthing paraphernalia at the outer peripheral face of lamp holder 80 screws up portion.Further, be formed to screw up at the inner peripheral surface of lamp holder 80 and screw up portion in the portion that screws up of circuit case 51.

The kind of lamp holder 80 does not have special restriction, adopts the lamp holder of the Edison screw type (E type) of screw-in type in the present embodiment.Such as, E26 type, E17 type or E16 type etc. can be listed as lamp holder 80.Further, can be not only screw-in lamp holder as lamp holder 80, also can be plug-type lamp holder.

[action effect etc.]

Below the action effect of the bulb-shaped lamp 1 in present embodiment is described.

In bulb-shaped lamp 1 in the present embodiment, pillar 31 has to the extended thermal component 31a in the inner space of the enclosed globe shade 10 and light transparent member 31b covering this thermal component 31a.

Formed by this, due to can by the inside of the photoconduction light of LED module 20 (LED22) to light transparent member 31b, and can reflect on the surface of light transparent member 31b, therefore, it is possible to visually feel the luminescence of pillar 31, and lamp holder 80 side can be released to.Accordingly, due to the light distribution angle of bulb-shaped lamp 1 can be made to increase, therefore, it is possible to easily realize the light distribution characteristic approximate with incandescent lamp bulb.

And, because pillar 31 has thermal component 31a, therefore, it is possible to dispel the heat to the heat that LED module 20 (LED22) occurs efficiently.

Like this, by the bulb-shaped lamp 1 in present embodiment, desired light distribution characteristic and good heat dissipation characteristics can be made to realize simultaneously.

(variation)

Below the variation of such as accompanying drawing to bulb-shaped lamp is described.

(variation 1)

Fig. 6 a to Fig. 6 c is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 1 of the present utility model and supporting station (pillar) are shown.Further, Fig. 6 a is profile when being cut off along the length direction of this substrate 21 by the central portion of substrate 21, and Fig. 6 b is profile when being cut off along the short direction of this substrate 21 by the central portion of substrate 21, and Fig. 6 c is the profile at A-A ' the line place of Fig. 6 a.

As shown in Fig. 6 a to Fig. 6 c, in the pillar 31A in this distortion, be formed with multiple recess 31a1 on the surface of thermal component 31a.Recess 31a1 such as can cut into hemispherical formation by the part on the surface by thermal component 31a.Further, by being formed with formation light transparent member 31b around the thermal component 31a of recess 31a1, thus protuberance can be formed at light transparent member 31b accordingly with recess 31a1.

Like this, by forming recess 31a1 on the surface of thermal component 31a, thus the light of the guide-lighting inside to light transparent member 31b, can occur reflect and spread at the recess 31a1 of thermal component 31a, therefore, compared with above-mentioned embodiment, the luminescence of pillar 31A visually more can be felt.

(variation 2)

Fig. 7 a to Fig. 7 c is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 2 of the present utility model and supporting station (pillar) are shown.Further, Fig. 7 a is profile when being cut off along the length direction of this substrate 21 by the central portion of substrate 21, and Fig. 7 b is profile when being cut off along the short direction of this substrate 21 by the central portion of substrate 21, and Fig. 7 c is the profile at A-A ' the line place of Fig. 7 a.

As shown in Fig. 7 a to Fig. 7 c, in the pillar 31B in this distortion, define multiple protuberance 31a2 on the surface of thermal component 31a.Protuberance 31a2 such as can be protruded by the part on the surface making thermal component 31a and hemispherically to form.Further, by being formed with formation light transparent member 31b around the thermal component 31a of protuberance 31a2, thus protuberance can be formed at light transparent member 31b accordingly with protuberance 31a2.

Like this, by forming protuberance 31a2 on the surface of thermal component 31a, the guide-lighting light to the inside of light transparent member 31b owing to reflecting at the protuberance 31a2 of thermal component 31a and spread, therefore, compared with above-mentioned embodiment, visually more can feel the luminescence of pillar 31B.

(variation 3)

Fig. 8 a to Fig. 8 c is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 3 of the present utility model and supporting station (pillar) are shown.Further, Fig. 8 a is profile when being cut off along the length direction of this substrate 21 by the central portion of substrate 21, and Fig. 8 b is profile when being cut off along the short direction of this substrate 21 by the central portion of substrate 21, and Fig. 8 c is the profile at A-A ' the line place of Fig. 8 a.

As shown in Fig. 8 a to Fig. 8 c, in the pillar 31C in this distortion, define multiple recess 31b1 on the surface of light transparent member 31b.Recess 31b1 such as can cut into hemispherical formation by the part on the surface by light transparent member 31b.

Like this, by forming recess 31b1 on the surface of light transparent member 31b, thus the guide-lighting light to the inside of light transparent member 31b can be spread by recess 31b1, therefore compared with above-mentioned embodiment, visually more can feel the luminescence of pillar 31C.

(variation 4)

Fig. 9 a to Fig. 9 c is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 4 of the present utility model and supporting station (pillar) are shown.Further, Fig. 9 a is profile when being cut off along the length direction of this substrate 21 by the central portion of substrate 21, and Fig. 9 b is profile when being cut off along the short direction of this substrate 21 by the central portion of substrate 21, and Fig. 9 c is the section at A-A ' the line place of Fig. 9 a.

As shown in Fig. 9 a to Fig. 9 c, in the pillar 31D in this distortion, define multiple protuberance 31b2 on the surface of light transparent member 31b.Protuberance 31b2 is such as protruded by the part on the surface by light transparent member 31b and hemispherically to form.

Like this, the surface of light transparent member 31b forms protuberance 31b2, thus the guide-lighting light to the inside of light transparent member 31b can be spread by protuberance 31b2, therefore, compared with above-mentioned embodiment, visually more can feel the luminescence of pillar 31D.

(variation 5)

Figure 10 a to Figure 10 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 5 of the present utility model and supporting station (pillar) are shown.Further, Figure 10 a is profile when being cut off along the length direction of this substrate 21 by the central portion of substrate 21, and Figure 10 b is profile when being cut off along the short direction of this substrate 21 by the central portion of substrate 21, and Figure 10 c is the profile at A-A ' the line place of Figure 10 a.

As shown in Figure 10 a to Figure 10 c, the LED module 20E in this distortion is the LED module of lighting at two sides, is not only the first interarea 21a of substrate 21, is also provided with LED22 and seal member 23 at the second interarea 21b.As shown in fig. lob, the LED22 and the seal member 23 that are arranged on the second interarea 21b are configured to relative with the light transparent member 31b of pillar 31E.

Further, the lateral circle surface of the pillar 31E in this distortion is inclined plane in the end of LED module 20E side.Specifically, the lateral circle surface of light transparent member 31b is inclined plane in the end of LED module 20E side, is flexure plane in this variation.The inclined plane of this light transparent member 31b is configured to, and the light from LED module 20E can be reflexed to lamp holder 80 side.Further, the inclined plane of light transparent member 31b is not limited to flexure plane, also can be plane (conical surface).

More than by this variation, the part of the light penetrated from LED module 20E (part for the light especially penetrated to light transparent member 31b from the LED22 of the second interarea 21b and seal member 23 that are configured in substrate 21), incide light transparent member 31b from the inclined plane of light transparent member 31b also guide-lighting in light transparent member 31b, penetrate from light transparent member 31b after thermal component 31a reflects.Accordingly, the luminescence of pillar 31 can visually be felt.

And, other a part of the light penetrated from LED module 20E (other a part of the light especially penetrate to light transparent member 31b from the LED22 of the second interarea 21b and seal member 23 that are configured in substrate 21), is released to lamp holder 80 side after the inclined plane of light transparent member 31b reflects.Like this, due to light distribution angle can be made to increase, thus easily can obtain the light distribution characteristic approximate with incandescent lamp bulb.

(variation 6)

Figure 11 a to Figure 11 b is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 6 of the present utility model and supporting station (pillar) are shown.And, Figure 11 a be by the central portion of first substrate 21A and second substrate 21B along this first substrate 21A and second substrate 21B length direction cut off time profile, Figure 11 b is profile when being cut off along the short direction of this first substrate 21A and second substrate 21B by the central portion of first substrate 21A and second substrate 21B, and Figure 11 c is the profile at A-A ' the line place of Figure 11 a.

As shown in Figure 11 a to Figure 11 c, the LED module 20F in this variation adopts these two substrates of first substrate 21A and second substrate 21B to be used as base station.First substrate 21A is flat substrate, there is the first interarea (surface) 21Aa and second interarea (back side) 21Ab relative with the first interarea 21Aa, second substrate 21B is flat substrate, has the 3rd interarea (surface) 21Bc and four interarea (back side) 21Bd relative with the 3rd interarea 21Bc.The substrate 21 in above-mentioned embodiment can be adopted as first substrate 21A and second substrate 21B, in this variation, adopt cheap white substrate.

First substrate 21A is configured to, and the first interarea 21Aa is towards the top of enclosed globe shade 10, and the second interarea Ab is towards lamp holder 80 side.Second substrate 21B is configured to, and the 3rd interarea 21Bc is towards lamp holder 80 side, and the 4th interarea 21Bd is towards the top of enclosed globe shade 10.First substrate 21A and second substrate 21B is fitted by the adhesives such as silicones 28.

Further, the first interarea 21Aa of first substrate 21A and the 3rd interarea 21Bc of second substrate 21B are all configured with LED22 and seal member 23.First substrate 21A and be configured in the LED22 of this first substrate 21A and the formation of seal member 23 is identical with the LED module 20 in above-mentioned embodiment.Further, the LED22 of second substrate 21B and the formation of seal member 23 is configured in, identical with the LED22 being configured in the second interarea 21b of substrate 21 in variation 5 and seal member 23.

Like this, in this variation, by being fitted at the two pieces of white substrate back sides being each other formed with LED22 and seal member 23 from the teeth outwards, thus constitute the LED module 20F of lighting at two sides.

Further, in this variation, the pillar identical with the pillar 31E in variation 5 is adopted.

More than by this variation, the effect identical with variation 5 can be obtained.That is, the light penetrated from LED module 20F incides light transparent member 31b and after thermal component 31a reflects, from light transparent member 31b injection, meanwhile, is also released to lamp holder 80 side in the inclined plane reflection of light transparent member 31b.Accordingly, visually can not only feel the luminescence of pillar 31E, and easily can obtain the light distribution characteristic approximate with incandescent lamp bulb.

Further, in this variation, owing to have employed cheap white substrate to form the LED module 20F of lighting at two sides, therefore, it is possible to realize the bulb-shaped lamp of the low cost that not only there is desired light distribution characteristic but also there is good heat dissipation characteristics.

(variation 7)

Figure 12 is the profile of the formation that LED module in the bulb-shaped lamp involved by variation 7 of the present utility model and supporting station (pillar) are shown.

In pillar 31G in this variation, thermal component 31a is made up of the metal flat part 31aX of rectangular flat shape and columned metal main shaft part 31aY, and as shown in figure 12, the cross sectional shape of thermal component 31a is roughly T-shaped.Further, light transparent member 31b is identical with variation 6, forms inclined plane at light transparent member 31b.

Further, the formation of the LED module 20G in this variation is identical with the LED module 20F in variation 6.Be positioned at flat part 31aX on the face of enclosed globe shade 10 side, be fixed with the first substrate 21A being configured with LED22 and seal member 23.Further, be positioned at flat part 31aX on the face of lamp holder 80 side, be fixed with the second substrate 21B being configured with LED22 and seal member 23.That is, flat part 31aX is clamped by first substrate 21A and second substrate 21B.Further, the through hole for making main shaft part 31aY through is provided with at second substrate 21B.

More than by this variation, the effect identical with variation 6 can be obtained.That is, the light penetrated from LED module 20G incides light transparent member 31b, and from light transparent member 31b injection after thermal component 31a reflects, meanwhile, reflects and be released to lamp holder 80 side in the inclined plane of light transparent member 31b.Accordingly, visually can not only feel the luminescence of pillar 31E, and easily can obtain the light distribution characteristic approximate with incandescent lamp bulb.Further, owing to have employed cheap white substrate to constitute the LED module 20G of lighting at two sides, therefore, it is possible to realize the bulb-shaped lamp of the low cost that not only there is desired light distribution characteristic but also there is good heat dissipation characteristics.

And, in this variation, although have employed these two substrates of first substrate 21A and second substrate 21B, owing to there is metal flat part 31aX between first substrate 21A and second substrate 21B, therefore, it is possible to the heat transfer making LED22 occur efficiently is to flat part 31aX.Further, because flat part 31aX is connected to metal main shaft part 31aY, the heat being therefore transmitted to flat part 31aX can be transmitted to main shaft part 31aY efficiently.Accordingly, compared with variation 6, heat dissipation characteristics can be improved.

(lighting device)

Further, the utility model can not only realize as above-mentioned bulb-shaped lamp, and can realize as the lighting device possessing bulb-shaped lamp.Figure 13 is below utilized to be described the lighting device involved by embodiment of the present utility model.Figure 13 is the summary section of the lighting device involved by embodiment of the present utility model.

As shown in figure 13, the lighting device 2 involved by embodiment of the present utility model is such as installed in indoor ceiling and uses, and possesses the bulb-shaped lamp 1 involved by above-mentioned embodiment and lighting tool (ligthing paraphernalia) 3.

Lighting tool 3 is turned off the light and lighting for making bulb-shaped lamp 1, possesses the lampshade 5 of the appliance body 4 being installed in ceiling and the light transmission covering bulb-shaped lamp 1.

Appliance body 4 has lamp socket 4a.The lamp holder 80 of bulb-shaped lamp 1 is screwed into lamp socket 4a.Bulb-shaped lamp 1 is fed into via this lamp socket 4a electric power.

Further, not limit by the formation shown in Figure 13 as ligthing paraphernalia, can adopt as Down lamp or this ligthing paraphernalia etc. being embedded in the ceiling flush type of ceiling of shot-light.

(other variation etc.)

Above according to embodiment and variation, be illustrated the illumination light source involved by the utility model and lighting device, the utility model not limit by these embodiments and variation.

Such as, in above-mentioned embodiment and variation, although the profile in the cross section of thermal component 31a and light transparent member 31b is all circular, but, be not limited by this.Such as, shown in Figure 14, the profile in the cross section of thermal component 31a also can be cross shape, although not diagram, also can be other the shape such as rectangular shape.Further, as shown in figure 15, the outer of the cross section of light transparent member 31b can be made to be formed as cross shape, also can be rectangular shape (not shown) etc.Further, as shown in figure 16, although the profile in the cross section of thermal component 31a and light transparent member 31b is cross shape, but also can be rectangular shape etc.

Further, in above-mentioned embodiment and variation, although in the mode surrounding radiator 60 to be provided with peripheral framework 70, but peripheral framework 70 also can not be set.In this case, radiator 60 forms the peripheral framework of bulb-shaped lamp 1.

Further, in above-mentioned embodiment and variation, although be provided with radiator 60, but also radiator 60 can not be set.

And, in above-mentioned embodiment and variation, although the formation of LED module 20 is the formations of the COB type directly installing LED chip on the base plate (21, but it also can be the formation of SMD (Surface Mount Device: surface mount) type.In this case formation is, can adopt as light-emitting component and possess resinous container (packaging body), be configured in the LED chip in container and be formed in the LED element of the SMD type of the seal member (containing fluorophor resin) in container in the mode covering LED chip, and this LED element is installed multiple on the base plate (21.

Further, in above-mentioned embodiment and variation, the formation of LED module 20 for release white light by blue LED die and yellow fluorophor, but is not limited by this.Such as, in order to improve color rendering, except yellow fluorophor, red-emitting phosphors or green-emitting phosphor can also be mixed into.Further, also can not adopt yellow fluorophor, but adopt containing red-emitting phosphors and green-emitting phosphor containing fluorophor resin, make itself and blue LED die combine to release white light.

Further, in above-mentioned embodiment and variation, LED chip also can adopt the LED chip of the color sent beyond blueness.Such as, when adopting the LED chip of luminescence-utraviolet, each look fluorophor particle combination of three primary colors (red, green, blue) will be sent as fluorophor particle.And, also the wavelength shifter beyond fluorophor particle can be adopted, such as also can adopt the material containing, for example lower material as wavelength shifter, this material refers to, can absorb the light of certain medium wavelength such as semiconductor, metal complex, organic dyestuff, pigment, and send the material of the light different from the wavelength of the light absorbed.

And, in above-mentioned embodiment and variation, although show LED as light-emitting component citing, but also can adopt other the solid-state light emitting element such as the EL element such as the semiconductor light-emitting elements such as semiconductor laser, organic EL (Electro Luminescence: electroluminescent) or inorganic EL.

In addition, the various variation that the those skilled in the art implemented for each embodiment can expect and obtain ground embodiment, or in the scope not departing from purport of the present utility model, inscape in each embodiment and function are carried out combining the form realized arbitrarily and be all included in the utility model.

Claims (16)

1. an illumination light source, is characterized in that, possesses:

Enclosed globe shade;

Pillar, the inner space be configured to described enclosed globe shade extends;

Base station, is fixed on described pillar; And

Light-emitting component, is configured in described base station,

Described pillar has thermal component and light transparent member, and described thermal component is configured to extend to the inner space of described enclosed globe shade, and described light transparent member covers described thermal component.

2. illumination light source as claimed in claim 1, is characterized in that,

Described thermal component is metal parts.

3. illumination light source as claimed in claim 1, is characterized in that,

Described thermal component is connected to described base station.

4. illumination light source as claimed in claim 1, is characterized in that,

Described light transparent member covers the whole side of described thermal component.

5. illumination light source as claimed in claim 1, is characterized in that,

Described light transparent member is made up of translucent resin.

6. illumination light source as claimed in claim 1, is characterized in that,

The surface of described light transparent member is formed with recess or protuberance.

7. illumination light source as claimed in claim 1, is characterized in that,

The surface of described thermal component is formed with recess or protuberance.

8. illumination light source as claimed in claim 1, is characterized in that,

Containing photodiffusion material in described light transparent member.

9. the illumination light source as described in any one of claim 1 to 8, is characterized in that,

Described base station is flat substrate, has the first interarea and second interarea relative with described first interarea,

Described substrate is configured to, described first interarea towards the top of described enclosed globe shade,

Described light-emitting component is configured in described first interarea of described substrate.

10. illumination light source as claimed in claim 9, is characterized in that,

Described substrate has light transmission.

11. illumination light sources as described in any one of claim 1 to 8, is characterized in that,

Described base station is flat substrate, has the first interarea and second interarea relative with described first interarea,

Described substrate is configured to, described first interarea towards the top of described enclosed globe shade,

Described light-emitting component is arranged, respectively described first interarea of described substrate and described second interarea.

12. illumination light sources as described in any one of claim 1 to 8, is characterized in that,

Described base station has flat first substrate and flat second substrate, described first substrate has the first interarea and second interarea relative with described first interarea, described second substrate has the 3rd interarea and four interarea relative with described 3rd interarea

Described first substrate is configured to, described first interarea towards the top of described enclosed globe shade,

Described second substrate is configured to, described 4th interarea towards the top of described enclosed globe shade,

Described light-emitting component is arranged, respectively described first interarea of described first substrate and described 3rd interarea of described second substrate.

13. illumination light sources as claimed in claim 1, is characterized in that,

Described light-emitting component is LED chip,

Described illumination light source also possesses seal member, and sealing parts are formed on described substrate in the mode covering described LED chip.

14. illumination light sources as claimed in claim 1, is characterized in that,

The seal member that described light-emitting component has container, is configured in the LED chip in described container and is formed in described container, sealing parts are for covering described LED chip.

15. illumination light sources as described in claim 13 or 14, is characterized in that,

Described seal member comprises the wavelength shifter converted the wavelength of the light that described LED chip sends.

16. 1 kinds of lighting devices, is characterized in that, possess the illumination light source described in any one of claim 1 to 15.