CN204668356U

CN204668356U - Substrate, light-emitting device and illumination light source

Info

Publication number: CN204668356U
Application number: CN201390000927.4U
Authority: CN
Inventors: 仓地敏明; 田上直纪; 大村考志; 松田次弘
Original assignee: Panasonic Intellectual Property Management Co Ltd
Current assignee: Panasonic Intellectual Property Management Co Ltd
Priority date: 2012-11-30
Filing date: 2013-11-06
Publication date: 2015-09-23
Anticipated expiration: 2023-11-06
Also published as: JPWO2014083777A1; JP5830668B2; WO2014083777A1

Abstract

The utility model provides substrate, light-emitting device and illumination light source.This light-emitting device (1) possesses, the LED (20) of the substrate (10) with light transmission and the first interarea (10a) being installed in substrate (10), substrate (10), at the second interarea (10b) with the first interarea (10a) opposite side, there is jog (11), jog (11), is formed on the position relative with LED (20).

Description

Substrate, light-emitting device and illumination light source

Technical field

The utility model relates to, the manufacture method of substrate, light-emitting device, illumination light source and substrate, particularly relates to for the substrate of diode installed (LED:Light Emitting Diode) and manufacture method thereof and the light-emitting device and illumination light source etc. that make use of this substrate.

Background technology

LED, due to high efficiency and long-life, therefore, expecting the light source (LED light source) becoming various product, such as, is that the research and development of the LED of light source are in progress with LED.

LED has, and replaces the bulb-shaped LED (LED bulb) of lamp-bulb type fluorescent lamp and incandescent lamp bulb or replaces the Straight LED etc. of straight-pipe fluorescent lamp.Such as, the open bulb-shaped LED in the past of patent documentation 1.Such as, the open Straight LED in the past of patent documentation 2.

In LED, utilize and multiple LED installed by substrate and the LED module (light-emitting device) formed, using as light source.

(prior art document)

(patent documentation)

Patent documentation 1: Japanese Unexamined Patent Publication 2006-313717 publication

Patent documentation 2: Japanese Unexamined Patent Publication 2009-043447 publication

Utility model content

The problem that utility model will solve

In recent years, the bulb-shaped LED of the structure of the light distribution characteristic having imitated incandescent lamp bulb and outward appearance mould is being studied.Such as, propose the enclosed globe shade (glass ball bulb lamp) utilizing incandescent lamp bulb to utilize, the center in this enclosed globe shade keeps the scheme of the bulb-shaped LED of the structure of LED module with hollow state.More specifically, consider to utilize from the opening of the enclosed globe shade pillar (post core) extended to the center of enclosed globe shade, in the structure of the top fixed L ED module of this pillar.In the case, in order to make light distribution characteristic close to incandescent lamp bulb, and preferably, utilize the LED module of all releasing the double-side of light to the top side of enclosed globe shade and lamp holder side.

Method for the LED module forming double-side has, and utilizes the method for the two-sided installation LED at substrate.Accordingly, all light can be released from the front of substrate and the back side.

But Problems existing is, needs complicated manufacturing equipment in order to the two-sided installation LED at substrate, cause manufacturing cost to improve.So, also can consider to utilize two substrates being only provided with LED at one side, by the method fitted each other in the back side of this substrate.But in the case, Problems existing is, needs two substrates, therefore, cause material cost to improve.

Further, other the method for LED module forming double-side has, and utilizes substrate that the light transmission of transparency carrier etc. is high (such as roughly transparency carrier), only installs the method for LED in the face of a side of this substrate.In the case, the light that LED sends, externally releases from the face (front) being provided with LED, and transmission substrate is also externally released from the face (back side) with the face opposite side being provided with LED.

But Problems existing is, the substrate that light transmission is high, light transmission is higher, and the price of substrate is higher, and on the other hand, light transmission is lower, and the amount of the light externally radiated from the back side of substrate is fewer, can not obtain sufficient light quantity.

In order to solve such problem, the purpose of this utility model is to provide, even if when the substrate utilizing the light transmission of white substrate etc. low, from light-emitting component with the face of installed surface opposite side also can obtain sufficient light quantity, the manufacture method of substrate, light-emitting device, illumination light source and substrate.

For the means of dealing with problems

In order to realize described object, one of embodiment of the substrate that the utility model relates to, wherein, this substrate is the substrate for installing light emitting element, and described substrate has light transmission, and, there is jog at the mask with the face opposite side for installing described light-emitting component, described jog, being formed by processing described substrate, further, the position relative with the position for installing described light-emitting component is formed on.

Further, in one of embodiment of the substrate that the utility model relates to, also can be that described substrate is the polycrystalline ceramics substrate in conjunction with multiple crystal grain, and the surface configuration of the exposed surface of described jog is, the surface configuration of described multiple crystal grain.

Further, one of embodiment of the light-emitting device that the utility model relates to, wherein, possesses: the substrate with light transmission; And be installed in the light-emitting component of the first interarea of described substrate, described substrate, there is jog at the mask with the face opposite side of installing described light-emitting component, described jog, be formed by processing described substrate, and, be formed on the position relative with described light-emitting component.

Further, in one of embodiment of the light-emitting device that the utility model relates to, also can be that described substrate is the polycrystalline ceramics substrate in conjunction with multiple crystal grain, and the surface configuration of described jog is, the surface configuration of described multiple crystal grain.

Further, in one of embodiment of the light-emitting device that the utility model relates to, also can be, also possess seal member, sealing parts comprise wavelength shifter, and, seal described light-emitting component.

Further, in one of embodiment of the light-emitting device that the utility model relates to, also can be, possess: the substrate with light transmission; Be installed in the light-emitting component of the first interarea of described substrate; Seal member, comprises wavelength shifter, and, seal described light-emitting component; And comprise the wavelength conversion member of wavelength shifter, described substrate, jog is had at the mask with the face opposite side of installing described light-emitting component, described jog, be formed on the position relative with described light-emitting component, also possess wavelength conversion member, this wavelength conversion member comprises wavelength shifter, further, described wavelength conversion member is formed overlapping with described jog.

Further, in one of embodiment of the light-emitting device that the utility model relates to, also can be that described jog is formed not exceed described wavelength conversion member.

Further, one of embodiment of the illumination light source that the utility model relates to, wherein, possesses: the light-emitting device described in described any one; And the radiator to be connected with described light-emitting device, described radiator, that be connected to the described substrate of described light-emitting device with face that the is face opposite side for installing described light-emitting component, do not form described jog at the joint face of described radiator and described substrate.

Further, in one of embodiment of the illumination light source that the utility model relates to, also can be also possess the enclosed globe shade covering described light-emitting device, described radiator be, is set to extend to the inside of described enclosed globe shade and support the pillar of described light-emitting device.

Utility model effect

According to the utility model, even if when the substrate utilizing the light transmission of white substrate etc. low, also sufficient light quantity can be obtained from light-emitting component with the face of installed surface opposite side.

Accompanying drawing explanation

Figure 1A is the plane graph that make use of the light-emitting device of substrate that embodiment 1 of the present utility model relates to.

Figure 1B is the sectional view of this light-emitting device on the X-X' line of Figure 1A.

Fig. 1 C is the sectional view of this light-emitting device on the Y-Y' line of Figure 1A.

Fig. 2 is the amplification sectional view of LED (LED chip) periphery of the light-emitting device that embodiment 1 of the present utility model relates to.

Fig. 3 is the main portion amplification sectional view of the light-emitting device that embodiment 1 of the present utility model relates to.

Fig. 4 A is the surperficial SEM picture of substrate when carrying out etch processes to the surface of polycrystalline ceramics substrate after only sintering.

The surperficial SEM picture of substrate Fig. 4 B carries out etch processes after being the surface of cutting polycrystalline ceramics substrate in order to adjust thickness time.

Fig. 5 is the key diagram of the method for transmissivity for measuring light-transmitting substrate.

Fig. 6 is the key diagram of the etching period of the polycrystalline ceramics substrate of Fig. 4 A and the relation of Transmission light amount.

Fig. 7 A is the plane graph of the light-emitting device that embodiment 2 of the present utility model relates to.

Fig. 7 B is the sectional view of this light-emitting device on the X-X' line of Fig. 7 A.

Fig. 7 C is the sectional view of this light-emitting device on the Y-Y' line of Fig. 7 A.

Fig. 8 is the sectional view of the light-emitting device that the variation of embodiment 2 of the present utility model relates to.

Fig. 9 is the sectional view of the bulb-shaped LED that embodiment 3 of the present utility model relates to.

Figure 10 A is the plane graph of the light-emitting device that embodiment 3 of the present utility model relates to.

Figure 10 B is the sectional view of this light-emitting device on the X-X' line of Figure 10 A.

Figure 10 C is the sectional view of this light-emitting device on the Y-Y' line of Figure 10 A.

Figure 10 D is the sectional view of this light-emitting device on the Z-Z' line of Figure 10 A.

Figure 11 is the sectional view of the lighting device that embodiment 4 of the present utility model relates to.

symbol description

1,2,2A, 110 light-emitting devices

10 substrates

10a first interarea

10b second interarea

11 jogs

11a ceramic crystalline grain

11b binding agent

20 LED

21 sapphire substrates

22 nitride semiconductor layers

23 cathode electrodes

24 anode electrodes

25,26 line junction surfaces

27 chip join materials

30 seal members

40 metal lines

50 wiring

60a, 60b terminal

70,70A wavelength conversion member

80a, 80b, 81 through holes

120 enclosed globe shades

121 peristomes

130 support units

131 pillars

131a protuberance

132 pedestals

Little portion, 132a footpath

Large portion, 132b footpath

140 drive circuits

141 circuit boards

142 circuit elements

143a, 143b, 143c, 143d go between

150 circuit box

151 box main body portions

151a first box portion

151b second box portion

152 caps

160 first frameworks

170 second frameworks

180 lamp holders

181 shell portions

182 insulation divisions

183 contact chip portions

190 screws

200 lighting tool

210 appliance bodies

211 lamp sockets

220 lampshades

300 lighting devices

Embodiment

Below, for the manufacture method etc. of substrate, light-emitting device, illumination light source and substrate that embodiment of the present utility model relates to, be described with reference to accompanying drawing.And the embodiment below illustrated, all illustrates a preferred object lesson of the present utility model.Therefore, shown in following embodiment, numerical value, shape, material, inscape, inscape allocation position and connect form etc. and be, an example, instead of limit aim of the present utility model.Therefore, in the inscape of following embodiment, there is no the inscape recorded in independent claims that upper concept of the present utility model is shown, be illustrated as arbitrary inscape.

And each figure is ideograph, might not be the figure tightly illustrated.Further, in each figure, identical symbol is enclosed to identical component parts.

(embodiment 1)

Below, the substrate 10 related to for embodiment 1 of the present utility model and the structure of light-emitting device 1, utilize Figure 1A to Fig. 1 C and Fig. 2 to be described.Figure 1A to Fig. 1 C is the figure that make use of the structure of the light-emitting device of substrate illustrating that embodiment 1 of the present utility model relates to, and Figure 1A is plane graph, and Figure 1B is the sectional view on the X-X' line of Figure 1A, and Fig. 1 C is the sectional view on the Y-Y' line of Figure 1A.Fig. 2 is the amplification sectional view of LED (LED chip) periphery of the light-emitting device that embodiment 1 of the present utility model relates to.

The light-emitting device 1 of the present embodiment has the light emitting module of light-emitting component, releases the light of the color (wavelength) of regulation.The light-emitting device 1 of the present embodiment is, the LED module be made up of LED.

As Figure 1A to Fig. 1 C illustrates, light-emitting device 1 possesses substrate 10 and LED20.Light-emitting device 1 also has, seal member 30, metal line 40, wiring 50 and terminal 60a and 60b.The light-emitting device 1 of the present embodiment is, bare chip is directly installed on COB (the Chip On Board) structure on substrate 10.

Below, each inscape of light-emitting device 1 is described in detail.

(substrate)

Substrate 10 is, for the light-emitting device mounting substrate of installing light emitting element, have as the installation first interarea 10a (positive side) in face of LED20 and the second interarea 10b (dorsal surface) as the face relative with this first interarea 10a.As Figure 1A illustrates, for substrate 10, such as, can utilize and overlook as rectangular rectangular-shaped substrate.And, for the plan view shape of substrate 10, be not limited only to rectangle, and square or other the substrate of shape such as circular can be utilized.

Substrate 10 is the translucidus substrates with translucidus.The substrate 10 of the present embodiment is that the substrate that light transmission is low for the light sent from LED20, such as total transmissivity rate is the substrate of less than 10%.For such substrate 10, the white oxide aluminium base be made up of the pottery of aluminium oxide etc. or the resin substrate be made up of the resin of glass epoxy resin etc. can be utilized.

In the present embodiment, for substrate 10, the thickness that utilization is fired aluminium oxide particles (ceramic particle) and formed is the polycrystal alumina substrate (polycrystalline ceramics substrate) of about 1mm.Such as, thickness 1mm can be utilized and light reflectance be 94% white oxide aluminium base, or thickness 0.635mm and light reflectance are the white oxide aluminium base of 88%.

So, for substrate 10, utilize the substrate that light transmission is low, thus the cost of substrate can be suppressed.Particularly, utilize the white substrate of the cheapness among ceramic substrate, thus can cost degradation be realized.

Add binding agent after the ceramic raw material of mixed oxidization aluminum particulate etc. and scattering object and sintering aid (additive) and carry out press molding, then, fire, thus can ceramic substrate be manufactured.And the aluminium oxide particles (ceramic particle) of raw material, carries out grain growth and crystallization, thus becomes the alumina grain that particle diameter is several μm to tens of μm by firing.

Further, as Figure 1B and Fig. 1 C illustrates, substrate 10, has jog 11 at the second interarea 10b.Jog 11 is, minute asperities constructs, and is at least formed on the position relative with LED20.The jog 11 of the present embodiment, corresponding with for the formation of the region of seal member 30 and be formed, the region for the formation of jog 11 is identical with the region for the formation of seal member 30.That is, jog 11, along the long side direction of substrate 10, is formed with 4 row with elongate.

(LED)

LED20 is, an example of light-emitting component, and is the semiconductor light-emitting elements of luminescence because of the electric power of regulation.All utilizing identical LED for multiple LED20, is all the bare chip sending monochromatic visible ray.In the present embodiment, the blue-light-emitting LED chip of blue light is sent after utilizing energising.For blue LED die, such as, can utilize be made up of the material of InGaN system, centre wavelength is the gallium nitride based semiconductor light-emitting elements of 440nm to 470nm.

Further, LED20, be only arranged on the first interarea 10a of substrate 10, the long side direction along substrate 10 is provided with multiple in the mode becoming multiple row.In the present embodiment, so that multiple LED20 is configured to 4 row as the mode that the element line of row is parallel.

And, in the present embodiment, multiple LED20 is installed, but, for the installation quantity of LED20, suitably change according to the purposes of light-emitting device 1.Such as, when being used in the LED of the low output type replacing pea lamp etc., LED20 can be one.On the other hand, when being used in the LED of high performance type, also more can increase the installation quantity of the LED20 in an element line.Further, for the element line of LED20, be not limited only to 4 row, can be 1 to 3 row, also can be more than 5 row.

At this, for the LED20 utilized in the present embodiment, Fig. 2 is utilized to be described.Fig. 2 is the amplification sectional view of LED (LED chip) periphery of the light-emitting device that embodiment 1 of the present utility model relates to.

As shown in Figure 2, LED20 has, sapphire substrate 21 and be layered on this sapphire substrate 21, by the mutually different multiple nitride semiconductor layers 22 formed.

At the both ends of the upper surface of nitride semiconductor layer 22, be provided with cathode electrode 23 and anode electrode 24.Further, on cathode electrode 23 and anode electrode 24, line junction surface 25 and 26 is respectively arranged with.

In LED20 adjacent one another are, the anode electrode 24 of the cathode electrode 23 of the LED20 of a side and the LED20 of the opposing party is respective, carries out routing engage to be connected by wiring 50 and metal line 40.And, also can not via metal line 40, and the electrode of adjacent LED20 is directly connected by wiring 50 each other.That is, also can be that Chip-to-Chip connects.

Each LED20, in the mode that the face of sapphire substrate 21 side is relative with the first interarea 10a of substrate 10, is installed on the substrate 10 by the chip join material 27 of light transmission.For chip join material 27, can utilize containing the silicones etc. by the inserts of oxidized metal.Translucent material is used to chip join material 27, thus the loss of the light sent from the side of LED20 can be reduced, the generation of the shadow based on chip join material 27 can be suppressed.

(seal member)

Seal member 30, such as, is made up of resin, is formed on the substrate 10 in the mode covering LED20.Seal member 30, as Figure 1A and Figure 1B illustrates, is formed as elongate in the mode of the row sealing multiple LED20 in the lump.In the present embodiment, with 4 row, LED20 element line is installed, therefore, forms four seal members 30.Article four, seal member 30 is respective, and the orientation (column direction) along multiple LED20 is arranged on the first interarea 10a of substrate 10 with linearity.

Seal member 30, is formed primarily of translucent material, but when needing to be the wavelength specified by the wavelength conversion of the light of LED20, wavelength shifter is mixed in translucent material.

The seal member 30 of the present embodiment is, comprise as wavelength shifter fluorophor, wavelength conversion member that the wavelength (color) of the light that LED20 sends is converted.For such seal member 30, such as, can be made up of the resin material of the insulating properties containing fluorophor particle (containing fluorophor resin).Fluorophor particle, the light sent because of LED20 and encourage the light of releasing desired color (wavelength).

For the resin material forming seal member 30, such as, silicones can be utilized.Further, in seal member 30, photodiffusion material can be made to disperse.And, for seal member 30, might not need to be formed by resin material, except the organic material of fluororesin etc., can also be formed by the inorganic material of low-melting glass and sol-gel glasses etc.

Such as, for the fluorophor particle comprised in seal member 30, when LED20 is the blue led sending blue light, in order to obtain white light, and the yellow fluorophor particle of such as YAG system can be utilized.Accordingly, a part for the blue light that LED20 sends, is transformed to sodium yellow by the yellow fluorophor particle wavelengths comprised in seal member 30.And, not by the blue light of yellow fluorophor particle absorption and the sodium yellow after being converted by yellow fluorophor particle wavelengths, diffusion and mixing in seal member 30, thus become white light to penetrate from seal member 30.Further, for photodiffusion material, the particle of silicon dioxide etc. is utilized.

The seal member 30 of the present embodiment is, that has disperseed the fluorophor particle specified in silicones contains fluorophor resin, is coated on the first interarea 10a of substrate 10 and hardens to be formed by dispenser.In the case, as Fig. 1 C illustrates, the shape in the cross section vertical with the long side direction of seal member 30, roughly becomes semicircle.

And seal member 30, may not be linearity, and rectangular shape when being formed as overlooking.In the case, seal member 30, such as, also can be formed as all LED20 on hermetic sealing substrate 10 in the lump.Or seal member 30, also can be formed as covering each LED20 respectively.In the case, seal member 30, such as, can be formed as roughly hemispherical.

(metal line)

Metal line 40 is, for making the conductive traces of the current flowing of LED20 luminescence, as Figure 1A illustrates, is formed in the first interarea 10a of substrate 10 with regulation character pattern.Supply power to the electric power of light-emitting device 1, be supplied to each LED20 by metal line 40.

Metal line 40, the multiple LED20 in arranging to make each LED element are one another in series and connect and be formed.Such as, metal line 40, is formed island between adjacent LED.Further, metal line 40, is formed to make each element line be connected in parallel with each other.Each LED20, is electrically connected with metal line 40 via wiring 50.

Metal line 40 is, such as, by the metal film patterning or printing be made up of metal material, thus can be formed.For the metal material of metal line 40, such as, silver (Ag), tungsten (W) or copper (Cu) etc. can be utilized.And, also on the surface of metal line 40, the gold-plated process of nickel (Ni)/gold (Au) etc. can be performed.

Further, for the metal line 40 exposed from seal member 30, preferably, beyond terminal 60a and 60b, covered by the glass-film (glass coating film) based on glass material or the resin molding (resinous coat film) based on resin material.Accordingly, the insulating properties of light-emitting device 1 can be improved, or, the reflectivity on the surface of substrate 10 can be improved.

(wiring)

Wiring 50 is, the conductor wire of such as golden electric wire etc.As Figure 1B illustrates, wiring 50, connects LED20 and metal line 40.As the explanation of Fig. 2, by wiring 50, be arranged on the cathode electrode 23 (or anode electrode 24) of the upper surface of LED20 and engaged by routing via line junction surface 25 (or 26) at the metal line 40 of the adjacent formation in the both sides of LED20.

And as the present embodiment, wiring 50, in the mode can not exposed from seal member 30, overall landfill is in seal member 30.

(terminal)

Terminal 60a and 60b is, for accepting the galvanic external connection terminals for making LED20 luminescence from the outside of light-emitting device 1.Further, terminal 60a and 60b is, the power supply of light-emitting device 1, and the direct current accepted by terminal 60a and 60b, is supplied to each LED20 via metal line 40 and wiring 50.

Terminal 60a and 60b, is formed regulation shape at the first interarea 10a of substrate 10.Specifically, terminal 60a and 60b, is formed in succession with metal line 40, and is electrically connected with metal line 40.Therefore, for terminal 60a and 60b, the metal material identical with metal line 40 can be utilized, be formed with pattern while of metal line 40.

(feature of the present utility model)

The light-emitting device 1 of formation like this possesses, and is formed with the substrate 10 of jog 11.Jog 11 is, is formed directly into the sag and swell of substrate 10, is made up of the countless recess on surface of the second interarea 10b and protuberance being formed on substrate 10.

The jog 11 of the present embodiment, according to form ceramic substrate ceramic crystalline grain shape and be formed.Below, for this point, Fig. 3 is utilized to be described in detail.Fig. 3 is the main portion amplification sectional view of the light-emitting device that embodiment 1 of the present utility model relates to, and schematically shows the cross section structure of ceramic substrate.

As Fig. 3 illustrates, as the substrate 10 of polycrystalline ceramics substrate (ceramic post sintering substrate), form by becoming multiple ceramic crystalline grains (sintering particle) 11a of parent and the binding agent 11b for making adjacent ceramic crystalline grain 11a be bonded to each other.Such as, when substrate 10 is polycrystal alumina substrate, ceramic crystalline grain 11a is alumina grain, and binding agent 11b is the inorganic material of glass material etc.

In the present embodiment, the surface configuration (concaveconvex shape) of jog 11 is, as Fig. 3 illustrates, and the surface configuration of the ceramic crystalline grain 11a exposed.That is, the surface configuration of jog 11 is, along the shape of the fluctuating of the multiple ceramic crystalline grain 11a exposed.

The jog 11 of the minute asperities structure of formation like this such as, is used as the polycrystalline ceramics substrate of substrate 10, utilizes acid to carry out surface treatment to this polycrystalline ceramics substrate, thus can be formed.

Specifically, the surface of the acid of hot sulfuric acid etc. to the second interarea 10b of substrate 10 (polycrystalline ceramics substrate) is utilized to carry out etch processes.Accordingly, the binding agent 11b of the near surface of the second interarea 10b of substrate 10 dissolves, thus the interface portion of ceramic crystalline grain 11a that binding agent 11b existed becomes groove (recess) occurs.That is, before carrying out the surface treatment based on acid, ceramic crystalline grain 11a and binding agent 11b exposes the surface at substrate 10 (polycrystalline ceramics substrate), but, by carrying out the surface treatment based on acid, exposing and dissolving selectively at the binding agent 11b on surface.Accordingly, recess can be formed on the surface of substrate 10.Its result is, on the surface of substrate 10, ceramic crystalline grain 11a becomes protuberance to occur.Accordingly, jog 11 is formed on the surface of substrate 10.

Further, when the regulation region of the part only on the surface of substrate 10 forms jog 11, after mask is carried out in the region not forming jog 11 among the surface of substrate 10, the etch processes based on acid is carried out.In the present embodiment, as Fig. 3 illustrates, form jog 11 in the position relative with seal member 30 of the second interarea 10b of substrate 10, therefore, after carrying out mask beyond the position relative with seal member 30 of the second interarea 10b, carry out etch processes.Accordingly, only jog 11 can be formed in the position relative with seal member 30 of the second interarea 10b.

And jog 11 is, by what also can be formed based on the method beyond the surface treatment of acid.Such as, utilize the grinding means of sand paper etc. to carry out attrition process to the surface of substrate 10, thus also can form jog 11.In the case, preferably, the surface after attrition process is washed.Or, perform blasting treatment on the surface of substrate 10, thus also can form jog 11.

Further, for other the method forming jog 11 at substrate 10, fire after the stage formation jog of mould before the firing, thus also can manufacture the polycrystalline ceramics substrate with jog 11.But if form jog in the stage of mould, when firing, the position that jog exists is different with the percent thermal shrinkage at the non-existent position of jog, therefore, the face had installing LED20 produces unwanted concavo-convex, thus is difficult to the situation of installing LED20.Therefore, in order to form jog 11 at polycrystalline ceramics substrate, and preferably, in manufacture two-sided be the polycrystalline ceramics substrate of plane after, formation jog 11.

Further, even if when utilizing the resin substrate as substrate 10, forming recess at the second interarea 10b, thus also can form jog 11.

And in the present embodiment, jog 11, is formed on the position relative with LED20 of the second interarea 10b of substrate 10.Accordingly, compared with not forming the situation of jog 11, the extracted amount of the light towards the second interarea 10b among light that the LED20 that is installed in the first interarea 10a sends can be increased.For this point, below simply illustrate.

Be installed in the LED20 of the first interarea 10a, centered by LED20, send light to omnirange.Therefore, when substrate 10 has light transmission, the light of LED20, incides in substrate 10 from the first interarea 10a, transmission substrate 10, also towards the second interarea 10b.In the case, even if when the light reflectivity of substrate 10 is more than 80% and light transmission is low, the light of LED20 is also as light leak, and transmission substrate 10, externally penetrates from the second interarea 10b.

Now, when because not forming jog 11, the second interarea 10b is tabular surface, advance in substrate 10 towards the part for the light of oblique incidence relative to the second interarea 10b among the light of the second interarea 10b, reflect at the second interarea 10b, be not extracted to the outside of substrate 10.Such as, at the light that the second interarea 10b carries out total reflection, the outside of substrate 10 is not extracted to.

On the other hand, when being formed with jog 11, the light of oblique incidence relative to the second interarea 10b, the sag and swell via jog 11 is easily extracted to outside.Accordingly, be formed with the region of jog 11, compared with not forming the region of jog 11, the extracted amount of light can be increased.

So, when the second interarea 10b of substrate 10 arranges jog 11, compared with the situation of jog 11 is not set, the ratio of the light from the second interarea 10b extraction of the inside of transmission substrate 10 can be increased.

Therefore, even utilize the white substrate with light transmission as substrate 10 only to configure the structure of LED20 at the first interarea 10a, form jog 11 in the position relative with LED20, thus also can increase the Transmission light amount from the second interarea 10b.

At this, for the structure of the jog 11 that reality is formed, Fig. 4 A and Fig. 4 B is utilized to be described.Fig. 4 A is the surperficial SEM picture of substrate when carrying out etch processes to the surface of polycrystalline ceramics substrate after only sintering.Further, the surperficial SEM picture of substrate when Fig. 4 B carries out etch processes after being the surface of cutting polycrystalline ceramics substrate in order to adjust thickness.And in figs. 4 a and 4b, for polycrystalline ceramics substrate, the aluminum oxide substrate all utilizing thickness to be 1mm, utilizes the hot sulfuric acid as etch processes liquid.

As Fig. 4 A and Fig. 4 B illustrates, learn, in which situation all, the binding agent between alumina grain is dissolved, and forms the jog along the surface configuration of alumina grain on the surface of polycrystalline ceramics substrate.

Further, for the polycrystalline ceramics substrate of Fig. 4 A and Fig. 4 B, transmissivity is measured.And the method according to Fig. 5, has carried out the measurement of transmissivity.Fig. 5 is the key diagram of the method for transmissivity for measuring light-transmitting substrate.

As Fig. 5 illustrates, for the surface of polycrystalline ceramics substrate becoming measuring object, irradiate benchmark blue light via slit, measured the amount (Transmission light amount) of the light of transmission polycrystalline ceramics substrate by detector (integrating sphere+optical spectrum instrumentation).

Its result is, which the polycrystalline ceramics substrate for Fig. 4 A and Fig. 4 B all confirms, and compared with not forming the situation of jog, Transmission light amount increases.

And, dissolve for binding agent and the degree of depth of the recess be formed, if compare the polycrystalline ceramics substrate of Fig. 4 A and the polycrystalline ceramics substrate of Fig. 4 B, then what learn is, the polycrystalline ceramics substrate of Fig. 4 A, compared with the polycrystalline ceramics substrate of Fig. 4 B, is formed with darker recess.

Therefore, Fig. 4 A (situation to the polycrystalline ceramics substrate after only sintering etches), compared with Fig. 4 B (carrying out the situation of etch processes after cutting the surface of polycrystalline ceramics substrate), easily control etch quantity according to etching period, therefore, it is possible to the jog 11 desired by being formed.Its result is, the polycrystalline ceramics substrate of Fig. 4 A, compared with the polycrystalline ceramics substrate of Fig. 4 B, easily controls Transmission light amount according to etching period.

At this, utilize Fig. 6, the etching period of the polycrystalline ceramics substrate of key diagram 4A and the relation of Transmission light amount.Fig. 6 is the key diagram of the etching period of the polycrystalline ceramics substrate of Fig. 4 A and the relation of Transmission light amount.And in figure 6, transverse axis represents etching period, the longitudinal axis represents the optical output ratio of the Transmission light amount (output of the light rearwardly passed) of the polycrystalline ceramics substrate of initial (before processing) before for etching.

As Fig. 6 illustrates, if utilize hot sulfuric acid to carry out etching 2 hours to polycrystalline ceramics substrate (aluminum oxide substrate), then, compared with the polycrystalline ceramics substrate of situation about not etching (initially), Transmission light amount adds 6%.Further, equally, if carry out etching 4 hours, 12 hours, Transmission light amount then adds 12%, 56% respectively.So, learn, if etching period is elongated, Transmission light amount then increases.And even if etching period is elongated, the thickness of polycrystalline ceramics substrate does not also change itself.This is because what dissolve because of etching is not the alumina grain becoming parent, and the cause of mainly binding agent.

Above, according to the substrate 10 that the present embodiment relates to, be formed with jog 11 in the position relative with LED20 of the second interarea 10b.Accordingly, even if only when the one side configuration LED20 of the first interarea 10a, the Transmission light amount from the second interarea 10b also can be increased by jog 11.Accordingly, except releasing except light from the first interarea 10a, the light of amount fully can also be released from the second interarea 10b.Therefore, it is possible to utilize the white substrate of low cost to realize the light-emitting device (LED module) of double-side.

Further, in the present embodiment, utilize acid to carry out surface treatment to polycrystalline ceramics substrate, thus form jog 11.So, utilize the polycrystalline ceramics substrate as substrate 10, thus jog 11 can be formed with simple method.

(embodiment 2)

Then, for the light-emitting device 2 that embodiment 2 of the present utility model relates to, Fig. 7 A to Fig. 7 C is utilized to be described.Fig. 7 A to Fig. 7 C is the figure of the structure that the light-emitting device that embodiment 2 of the present utility model relates to is shown, Fig. 7 A is plane graph, and Fig. 7 B is the sectional view on the X-X' line of Fig. 7 A, and Fig. 7 C is the sectional view on the Y-Y' line of Fig. 7 A.

As Fig. 7 A to Fig. 7 C illustrates, the light-emitting device 2 of the present embodiment, compared with the light-emitting device 1 shown in Figure 1A to Fig. 1 C, also possesses wavelength conversion member 70 (second wave length transform component).

Wavelength conversion member 70, that be formed on the second interarea 10b of substrate 10, relative with LED20 position.Be formed with jog 11 in the position relative with LED20, therefore, wavelength conversion member 70 is formed, overlapping with jog 11 when the overlooking of substrate 10.In the present embodiment, wavelength conversion member 70, is formed on the position relative with seal member 30 across substrate 10.That is, wavelength conversion member 70, is formed with four with elongate.

Wavelength conversion member 70, comprises the wavelength shifter of fluorophor etc., converts the wavelength (color) of the light of the LED20 of transmission substrate 10.The wavelength conversion member 70 of the present embodiment is, the material identical with seal member 30, such as, be blue light wavelength is transformed to sodium yellow yellow fluorophor particle dispersion in silicones containing fluorophor resin.In the case, wavelength conversion member 70 is, same with seal member 30, can be coated be formed by dispenser.

So, in this variation, be formed with wavelength conversion member 70 in the position (being formed with the region of jog 11) relative with LED20, therefore, after transmission substrate 10, be transformed to the wavelength of regulation from the light of the LED20 of the second interarea 10b releasing.In the present embodiment, LED20 emit blue light, and blue light wavelength is transformed to sodium yellow by wavelength conversion member 70.Accordingly, from a part for the blue light of the second interarea 10b injection after transmission substrate 10, be sodium yellow by wavelength conversion member 70 wavelength conversion, after this sodium yellow and the blue light not by wavelength conversion member 70 wavelength conversion, become white light to release from wavelength conversion member 70.Therefore, it is possible to realize from the two-sided light-emitting device can releasing white light.

And wavelength conversion member 70 is formed, overlapping with the jog 11 making Transmission light amount increase, therefore, it is possible to make the light quantity of the white light of externally releasing from the second interarea 10b increase.

Further, if jog 11 is formed to exceed wavelength conversion member 70, then from the light that the jog 11 exceeded sends, can not by colour switching, and also Transmission light quantitative change is large.Its result is, produces uneven color.Therefore, preferably, jog 11 is formed not exceed wavelength conversion member 70.That is, preferably, wavelength conversion member 70 is formed as, covers jog 11, the region being formed with jog 11 is become identical with the region being formed with wavelength conversion member 70.

And, in this variation, make use of as wavelength conversion member 70 containing fluorophor resin, but, be not limited only to this.Such as, wavelength conversion member 70 also can be, as the fluorescent membrane (luminescent coating) of the sintered body of the inorganic bond material (binding agent) of fluorophor particle and glass etc.

(variation of embodiment 2)

Then, the light-emitting device 2A that the variation for embodiment 2 of the present utility model relates to, utilizes Fig. 8 to be described.Fig. 8 is the sectional view of the structure that the light-emitting device that the variation of embodiment 2 of the present utility model relates to is shown.And, Fig. 8 is corresponding with the sectional view of Fig. 7 C.

The light-emitting device 2A of this variation is, is broadened by the width of the wavelength conversion member 70 of the light-emitting device 2 of embodiment 2.

Specifically, as Fig. 8 illustrates, in the light-emitting device 2A of this variation, the length (length of the short side direction of the substrate 10 in this variation) of the Width orthogonal with the thickness direction of substrate 10 of wavelength conversion member 70A is longer than the length of this Width of seal member 30.

So, the length of the Width of wavelength conversion member 70A is set to longer than the length of the Width of seal member 30, thus can suppress to expand and the light (blue light) of the LED20 advanced in substrate 10, the second interarea 10b not by wavelength conversion same as before from substrate 10 spills.

Further, preferably, become large along with by the width of wavelength conversion member 70A, also the region forming jog 11 is become large, such as, same with described embodiment 2, by forming the region of jog 11, become identical with the region being formed with wavelength conversion member 70A.

(embodiment 3)

Then, the illumination light source that embodiment 3 of the present utility model relates to is described.In the present embodiment, as an example of illumination light source, bulb-shaped LED (LED bulb) 100 is described.

Fig. 9 is the sectional view of the bulb-shaped LED that embodiment 3 of the present utility model relates to.And in fig .9, the single dotted broken line described along accompanying drawing above-below direction illustrates the lamp axle J (central shaft) of bulb-shaped lamp 100, in the present embodiment, lamp axle J, consistent with enclosed globe shade axle.Further, lamp axle J is, becomes the axle of pivot when bulb-shaped lamp 100 being assembled to the lamp socket of lighting device (not illustrating), consistent with the rotating shaft of lamp holder 180.Further, shown in Figure 9, drive circuit 140, is not sectional view but side view.

As Fig. 9 illustrates, the bulb-shaped lamp 100 that the present embodiment relates to is, becomes the bulb-shaped LED of the substitute of lamp-bulb type fluorescent lamp or incandescent lamp bulb, possesses: as the light-emitting device (LED module) 110 of light source; Enclosed globe shade 120; The support unit 130 of supporting light-emitting device 110; For making the drive circuit 140 of light-emitting device 1 luminescence; Be configured to the circuit box 150 surrounding drive circuit 140; Be configured to the first framework 160 surrounding circuit box 150; Be configured to surround the first framework 160 and form the second peripheral framework 170; The lamp holder 180 of electric power is accepted from outside; And screw 190.

And, for bulb-shaped lamp 100, form peripheral device by enclosed globe shade 120 and the second framework 170 and lamp holder 180.That is, enclosed globe shade 120 and the second framework 170 and lamp holder 180 expose in outside, and respective outer surface is exposed in extraneous air (air).

Below, for each inscape of the bulb-shaped lamp 100 that the present embodiment relates to, be described in detail with reference to Fig. 9.

(light-emitting device)

Light-emitting device 110 is LED modules of double-side.As Fig. 9 illustrates, light-emitting device 110, is configured in the inside of enclosed globe shade 120, preferably, is configured in the center (the most inside, footpath that such as, the internal diameter of enclosed globe shade 120 is large) of the ball shape formed by enclosed globe shade 120.So, at the center of enclosed globe shade 120 configuration light-emitting device 110, thus the light distribution characteristic approximate with the incandescent lamp bulb of the heater winding that make use of in the past can be realized.

Further, light-emitting device 110, remains on the hollow in enclosed globe shade 120 by support unit 130, luminous because of the electric power supplied from drive circuit 140 via lead-in wire 143a and 143b.

At this, for each inscape of the light-emitting device 110 that the present embodiment relates to, Figure 10 is utilized to be described.Figure 10 A to Figure 10 D is the figure of the structure that the light-emitting device that embodiment 3 of the present utility model relates to is shown, Figure 10 A is plane graph, Figure 10 B is the sectional view on the X-X' line of Figure 10 A, and Figure 10 C is the sectional view on the Y-Y' line of Figure 10 A, and Figure 10 D is the sectional view on the Z-Z' line of Figure 10 A.

As Figure 10 A to Figure 10 D illustrates, the light-emitting device 110 of the present embodiment is, compared with the light-emitting device 1 shown in Figure 1A to Fig. 1 C, also arranges the structure of through hole 80a, 80b and 81 at substrate 10.

Through hole 80a and 80b is, for carrying out the structure of the electrical connection of light-emitting device 110 and two 143a and 143b that go between.As Fig. 9 illustrates, lead-in wire 143a (143b), after leading section inserts through hole 80a (80b), welds with the terminal 60a (60b) of substrate 10.Further, through hole 81 is, for the structure chimeric with the protuberance 131a at the top being arranged on support unit 130.Make protuberance 131a chimeric with through hole 81, thus light-emitting device 110 is connected with support unit 130.

And, as Figure 10 A illustrates, in the present embodiment, at least, joint face (contact-making surface), i.e. Figure 10 A as the substrate 10 of light-emitting device 110 and the coupling part (contact portion) at the top of the pillar 131 of support unit 130 with dotted line around region, do not form jog 11.Accordingly, light-emitting device 110 can be made to become good with the thermo-contact as the support unit 130 of radiator.

(enclosed globe shade)

Turn back to Fig. 9, enclosed globe shade 120 is, for the light of releasing from light-emitting device 110 being extracted the roughly hemispheric diffuser of lamp outside.The enclosed globe shade 120 of the present embodiment is, the glass ball bulb lamp (transparent bulb lamp) of the silicon-based glass transparent relative to visible ray.Therefore, the light-emitting device 110 be accommodated in enclosed globe shade 120 is, can see from the outside of enclosed globe shade 120.

Light-emitting device 110, is covered by enclosed globe shade 120.Accordingly, incide the light of the light-emitting device 110 of the inner surface of enclosed globe shade 120, after transmission enclosed globe shade 120, be extracted to the outside of enclosed globe shade 120.In the present embodiment, enclosed globe shade 120 is configured to, storage light-emitting device 110.

The shape of enclosed globe shade 120 is, one end, with spherical obstruction, has the shape of peristome 121 at the other end.Specifically, the shape of enclosed globe shade 120 is, a part for the ball of hollow, the central part of Xiang Congqiu away from direction extend narrow shape, from the central part of ball away from position be formed with peristome 121.For the enclosed globe shade 120 of such shape, the glass ball bulb lamp of the shape same with general lamp-bulb type fluorescent lamp and incandescent lamp bulb can be utilized.Such as, for enclosed globe shade 120, the glass ball bulb lamp of A shape, G shape or E shape etc. can be utilized.

Further, the peristome 121 of enclosed globe shade 120, between support unit 130 and the second framework 170.In this condition, the adhesive of silicone-coating etc. between support unit 130 and the second framework 170, thus fixing enclosed globe shade 120.

And enclosed globe shade 120, might not need transparent relative to visible ray, and enclosed globe shade 120 also can be made to have light diffusion function.Such as, the resin of the photodiffusion material containing silicon dioxide and calcium carbonate etc. and Chinese white etc. are coated on the inner surface of enclosed globe shade 120 or the comprehensive of outer surface, thus milky optical diffusion film can be formed.So, make enclosed globe shade 120 have light diffusion function, thus the light diffusion inciding enclosed globe shade 120 from light-emitting device 110 can be made, therefore, it is possible to expand the light distribution angle of lamp.

Further, for the shape of enclosed globe shade 120, being not limited only to A shape etc., also can be ellipsoid of revolution or spheroid.For the material of enclosed globe shade 120, be not limited only to glass material, also can utilize the resin etc. of propylene (PMMA) and polycarbonate (PC) etc.

(support unit)

Support unit 130 is, the supporting station of supporting light-emitting device 110, at support unit 130, and assembling light-emitting device 110.Support unit 130, can be made up of metal or resin.When support unit 130 is made up of resin, can be made up of coloured resin material of white etc., also can be made up of the resin material with light transmission.

Support unit 130, also plays function as the thermal component (radiator) be used for the heat that light-emitting device 110 (LED20) occurs is dispelled the heat.Therefore, preferably, support unit 130, by being that the resin material that the metal material of principal component or thermal conductivity are high is formed with aluminium (Al), copper (Cu) or iron (Fe) etc.Accordingly, the heat that light-emitting device 110 can be occurred via support unit 130 is transmitted to the first framework 160 expeditiously.

Support unit 130, by be mainly positioned at enclosed globe shade 120 inside pillar 131 and form primarily of the pedestal 132 that the first framework 160 surrounds.In the present embodiment, pillar 131 and pedestal 132, all utilize aluminium and be formed.

Pillar 131 is set to, nearby extending to the inside of enclosed globe shade 120 from the peristome 121 of enclosed globe shade 120.Pillar 131, plays function as keeping the holding member of light-emitting device 110.So, light-emitting device 110 is set at the pillar 131 extended to the inside of enclosed globe shade 120, thus the light distribution characteristic of wide light distribution angle can be realized, therefore, it is possible to obtain the light distribution characteristic same with incandescent lamp bulb.

Further, one end of pillar 131 is connected with light-emitting device 110, and the other end of pillar 131 is connected with pedestal 132.

At the top of pillar 131, be formed with the stationary plane of the substrate 10 for fixing light-emitting device 110, this stationary plane is, with the contact-making surface of the rear-face contact of substrate 10.Light-emitting device 110, such as, is positioned in stationary plane, and is bonded in stationary plane by adhesive etc.In the present embodiment, at the top of pillar 131, be provided with from the outstanding protuberance 131a of stationary plane.Protuberance 131a is configured to, chimeric with the through hole 81 (with reference to Figure 10 A) of the substrate 10 being arranged on light-emitting device 110.Protuberance 131a, the position restraining portions as the position of restriction light-emitting device 110 plays function, and being configured to plan view shape is rectangle.

Pedestal 132 is, the parts of support column 131, is configured to the peristome 121 blocking enclosed globe shade 120.Pedestal 132 is, has the disc-shaped part of stage portion, is made up of the footpath that diameter is little little portion 132a and the large large portion 132b in footpath of diameter.Be made up of the stage portion of pedestal 132 difference of the diameter of footpath little portion 132a and the large portion 132b in footpath, this stage portion (upper surface of the large portion 132b in footpath) abuts with the peristome 121 of enclosed globe shade 120.Accordingly, the peristome 121 of enclosed globe shade 120 is blocked.

And, in the stage portion of pedestal 132, under state between the open end being sandwiched in the enclosed globe shade side of support unit 130 and the first framework 160 at the peristome 121 of enclosed globe shade 120, at the adhesive (not illustrating) of their periphery silicone-coating etc., thus the peristome 121 of support unit 130 and the first framework 160 and enclosed globe shade 120 can be bonded.

The little portion 132a in footpath is configured to discoideus part in pedestal 132, is configured to supporting strut 131, and, the peristome 121 of blocking enclosed globe shade 120.Pillar 131 is configured in the central portion of the little portion 132a in footpath.And the little portion 132a in footpath, is provided with two through holes for making lead-in wire 143a and 143b insert.

Large portion, footpath (blade) 132b is, the part chimeric with the first framework 160, and the outer peripheral face of the large portion 132b in footpath contacts with the inner peripheral surface of the first framework 160, thus support unit 130 is connected with the first framework 160.Accordingly, the heat of support unit 130 (pedestal 132) can be transmitted to the first framework 160 expeditiously.

The large portion 132b in footpath is, the structure that little portion 132a is extended to lamp holder side from footpath, such as, is the roughly cylindrical conformation that external diameter gradually changes.The large portion 132b in footpath can be configured to, and such as, outer surface becomes the surface of the frustum of a cone.

Further, the top (light-emitting device side end) of large portion 132b in footpath, is formed with four recesses as bullport during riveted joint first framework 160 a part of.Recess is formed, and cuts a part for the upper end of the large portion 132b in footpath.

(drive circuit)

Drive circuit (circuit unit) 140 is, for making the lamp circuit of light-emitting device 110 (LED20) luminous (lighting), supplies the electric power of regulation to light-emitting device 110.Such as, drive circuit 140 is power circuits, for by being direct current via pair of lead wires 143c and 143d from the convert alternating current that lamp holder 180 supplies, supplies this direct current via pair of lead wires 143a and 143b to light-emitting device 110.

Drive circuit 140 is, is made up of circuit board 141 and multiple circuit elements (electronic unit) 142 of being arranged on circuit substrate 141.

Circuit board 141 is, the printed wiring board that metal line is formed by pattern, is electrically connected to each other by the multiple circuit elements 142 being arranged on this circuit board 141.In the present embodiment, circuit board 141 is configured to, the posture that interarea is orthogonal with lamp axle.Circuit board 141, is clamped by box main body portion 151 and cap 152 and is kept.

Circuit element 142 is, such as, and the semiconductor element etc. of the capacity cell of various capacitors etc., resistive element, convertor circuit element, coil part, choke (choke transformer), noise filter, diode or integrated circuit component etc.The major part of circuit element 142, is installed in the interarea of a side of circuit board 141.

The drive circuit 140 of formation like this, is incorporated in circuit box 150, such as, is screwed, bonds or engaging etc. and be fixed on circuit box 150.So, drive circuit 140, is covered by circuit box 150, thus guarantees insulating properties.And, at drive circuit 140, also can suitably select and combine light adjusting circuit and booster circuit etc.

Drive circuit 140 and light-emitting device 110, be electrically connected by pair of lead wires 143a and 143b.Further, drive circuit 140 and lamp holder 180, be electrically connected by pair of lead wires 143c and 143d.These four lead-in wire 143a to 143d are that such as, alloyed copper goes between, and are made up of the resin coating of the insulating properties of the heart yearn and this heart yearn of covering that comprise alloyed copper.

In the present embodiment, lead-in wire 143a is, for supplying the wire (positive side lead-out terminal line) of high side voltage from drive circuit 140 to light-emitting device 110, lead-in wire 143b is, for supplying the wire (minus side lead-out terminal line) of low-pressure side voltage from drive circuit 140 to light-emitting device 110.Lead-in wire 143a and 143b, after inserting the through hole being arranged on support unit 130, is pulled out to light-emitting device side (in enclosed globe shade 120).

And one end (heart yearn) that lead-in wire 143a (143b) is respective, after inserting the through hole 80a (80b) of the substrate 10 of light-emitting device 110, welds with terminal 60a and 60b.On the other hand, lead-in wire 143a and the 143b other end separately (heart yearn), is electrically connected by solder etc. with the metal line of circuit board 141.

On the other hand, 143c and 143d that go between is, for will being used for the electric power making light-emitting device 110 lighting, the electric wire supplied from lamp holder 180 to drive circuit 140.Lead-in wire 143c and 143d one end separately (heart yearn), be electrically connected with lamp holder 180 (shell portion 181 or contact chip portion 183), further, the respective other end (heart yearn), is electrically connected by solder etc. with the power input (metal line) of circuit board 141.

(circuit box)

Circuit box 150 is, for receiving the insulation booth of drive circuit 140, is incorporated in the first framework 160 and lamp holder 180.Circuit box 150, is made up of box main body portion 151 and cap 152.

Box main body portion 151 is, there is the box body (framework) of the insulating properties of opening, by the first box portion 151a of the large footpath cylindrical shape with the roughly the same shape of the first framework 160 and link with the first box portion 151a and form with the second box portion 151b of the path cylindrical shape of the roughly the same shape of lamp holder 180 in both sides.

The the first box portion 151a being positioned at enclosed globe shade side is incorporated in the first framework 160.The major part of drive circuit 140, is covered by this first box portion 151a.

On the other hand, the second box portion 151b being positioned at lamp holder side is incorporated in lamp holder 180, is embedded in the second box portion 151b outside lamp holder 180.Accordingly, the opening of the lamp holder side of circuit box 150 (box main body portion 151) is blocked.In the present embodiment, formed at the outer peripheral face of the second box portion 151b and screw up portion for what screw up with lamp holder 180, lamp holder 180 is screwed into the second box portion 151b, thus is fixed on circuit box 150 (box main body portion 151).Box main body portion 151 is, such as, utilizes the insulative resin material of polybutylene terephthalate (PBT) (PBT) etc. etc. to form.

Cap 152 is, what be configured to the insulating properties of lid roughly has round-ended cylinder parts.Cap 152, same with box main body portion 151, such as, the formations such as the insulative resin material of PBT etc. also can be utilized.

The upper surface shape of cap 152 is configured to, along the inner surface configuration of the pedestal 132 of support unit 130.Accordingly, cap 152 is embedded into pedestal 132, is tightened be fixed to support unit 130 (pedestal 132) by screw 190.

And, in the present embodiment, be provided with cap 152 at circuit box 150, but also can be, cap 152 is not set, and only by box main body portion 151 forming circuit box 150.

The circuit box 150 of formation like this is configured to, and has the interval of regulation between the first box portion 151a and the first framework 160.That is, the outer surface of the first box portion 151a and the inner surface of the first framework 160 become contactless state.

(the first framework)

First framework 160 is configured to, and surrounds drive circuit 140.That is, drive circuit 140 is had in the internal configurations of the first framework 160.In the present embodiment, the first framework 160, surrounds drive circuit 140 via circuit box 150.

Further, the first framework 160, plays function as radiator (radiator), is connected under the state contacted with support unit 130 with support unit 130.Accordingly, in the heat that light-emitting device 110 occurs, the first framework 160 is transmitted to via support unit 130.Accordingly, can dispel the heat to the heat of light-emitting device 110.

First framework 160, preferably, the material high by thermal conductivity is formed, and such as, can be metal metal parts.In the present embodiment, the first framework 160, utilizes aluminium and is formed.And the first framework 160 is also passable, is not metal, and utilizes the nonmetallic materials of resin etc. and be formed.In the case, the first framework 160, preferably, utilizes the nonmetallic materials that thermal conductivity is high.

In the present embodiment, the first framework 160 is configured to, chimeric with the pedestal 132 of support unit 130, and this telescoping part of the first framework 160, becomes the tapered portion of the bevel angle with regulation.In the present embodiment, the inner peripheral surface of the first framework 160 is that face contacts with the outer peripheral face of the pedestal 132 of support unit 130.

First framework 160 is, have the cylindrical shell of the opening (the first opening) of enclosed globe shade side and the opening (the second opening) of lamp holder side, the opening of enclosed globe shade side is configured to larger than the opening of lamp holder side.Specifically, the first framework 160 is, wall thickness is certain and the roughly cylinder part that gradually changes of internal diameter and external diameter, such as, is configured to skirt, becomes the surface of the frustum of a cone with inner surface and outer surface.First framework 160 of the present embodiment is configured to, and diminishes gradually towards lamp holder 180 side internal diameter and external diameter.Therefore, inner peripheral surface and the outer peripheral face of the first framework 160 are be configured to the taper surface (inclined plane) tilted relative to lamp axle J.

First framework 160 of formation like this, to have the mode in the gap of regulation between circuit box 150 (the first box portion 151a) and the second framework 170, is configured between circuit box 150 and the second framework 170.That is, between the inner peripheral surface and the outer peripheral face of circuit box (the first box portion 151a) of the first framework 160, and, between the outer peripheral face and the inner peripheral surface of the second framework 170 of the first framework 160, there is air layer.Accordingly, even if different metal first framework 160 of thermal coefficient of expansion and resinous second framework 170 or circuit box 150 thermal expansion, the thermal expansion difference of the first framework 160 and the second framework 170 or circuit box 150 can also be absorbed by this gap.Accordingly, can suppress, in the second framework 170 and circuit box 150, crack occurs.

(the second framework)

Second framework 170 is, is configured to the insulating properties cover of the surrounding surrounding the first framework 160.By second framework 170 of the second framework 170 covering metal with insulating properties, thus the insulating properties of bulb-shaped lamp 100 can be improved.Second framework 170 is, such as, can be made up of the insulative resin material of PBT etc.

The outer surface of the second framework 170, exposes at lamp outside (in air).On the other hand, the inner peripheral surface of the second framework 170 is relative with the outer peripheral face of the first framework 160.In the present embodiment, between the outer peripheral face and the inner peripheral surface of the first framework 160 of the second framework 170, there is gap.

Second framework 170 is, wall thickness is certain and the roughly cylinder part that gradually changes of internal diameter and external diameter, such as, is configured to skirt, becomes the surface of the frustum of a cone with inner surface and outer surface.Second framework 170 of the present embodiment is configured to, and diminishes gradually towards lamp holder 180 side internal diameter and external diameter.

(lamp holder)

Lamp holder 180 is, accepts the power receiving section of the electric power being used for making light-emitting device 110 (LED20) luminous from lamp outside.Lamp holder 180, such as, is mounted to the lamp socket of ligthing paraphernalia.Accordingly, lamp holder 180, when making bulb-shaped lamp 100 lighting, can accept electric power from the lamp socket of ligthing paraphernalia.Such as, at lamp holder 180, from the source power supply supply alternating current of AC100V.The lamp holder 180 of the present embodiment, accepts alternating current by two point, and the electric power accepted by lamp holder 180 is input to the power input of drive circuit 140 via pair of lead wires 143c and 143b.

Lamp holder 180 is, metal have end cylindrical shape, possesses shell portion 181 that outer peripheral face is male thread and is arranged on the contact chip portion 183 in shell portion 181 via insulation division 182.Be formed at the outer peripheral face of lamp holder 180, screw up portion for what screw up with the lamp socket of ligthing paraphernalia.Further, be formed at the inner peripheral surface of lamp holder 180, what the portion of screwing up for the housing section 51 (the second box portion 151b) with circuit box 150 screwed up screws up portion.

For the kind of lamp holder 180, there is no particular limitation, but, in the present embodiment, utilize the lamp holder of the Edison screw type (E type) of spiral type.Such as, for lamp holder 180, E26 shape or E17 shape or E16 shape etc. can be enumerated.In the present embodiment, the lamp holder of E17 shape is utilized.And, for lamp holder 180, lamp holder of insert type etc., other the lamp holder of structure also can be utilized.

According to the bulb-shaped lamp 100 that the present embodiment as constructed as above relates to, make use of the light-emitting device 110 of the double-side with jog 11, therefore, the light that light-emitting device 110 sends, to comprehensive radiation centered by light-emitting device 110.Accordingly, the bulb-shaped LED of the light distribution characteristic of the wide light distribution angle be similar to incandescent lamp bulb can be realized having.

And then, in the present embodiment, be formed with jog 11 at the substrate 10 of light-emitting device 110, but jog 11, is not formed on the coupling part of light-emitting device 110 (substrate 10) and support unit 130 (pillar 131).Accordingly, light-emitting device 110 can be made to become good with the thermo-contact of support unit 130, therefore, it is possible to suppress the thermal diffusivity of light-emitting device 110 because of jog 11 to reduce.

And, in the present embodiment, light-emitting device 110 be make use of to the light-emitting device of the structure same with the light-emitting device 1 of embodiment 1, but, also can utilize the light-emitting device of the structure same with embodiment 2 or its variation.Accordingly, from the two-sided releasing white light of light-emitting device, therefore, it is possible to obtain the illumination light more approximate with incandescent lamp bulb.

(embodiment 4)

Then, for the lighting device that embodiment 4 of the present utility model relates to, Figure 11 is utilized to be described.Figure 11 is the sectional view of the lighting device that embodiment 4 of the present utility model relates to.

As Figure 11 illustrates, the lighting device 300 that the present embodiment relates to, such as, is installed in indoor ceiling and is used, and possesses bulb-shaped lamp 100 and lighting tool 200 that described embodiment 3 relates to.

Lighting tool 200, for making bulb-shaped lamp 100 turn off the light and lighting, possesses the lampshade 220 of the appliance body 210 being mounted to ceiling and the light transmission covering bulb-shaped lamp 100.

Appliance body 210 has lamp socket 211.The lamp holder 180 of bulb-shaped lamp 100 is screwed into lamp socket 211.Electric power is supplied to bulb-shaped lamp 100 via this lamp socket 211.

So, the bulb-shaped lamp 100 that described embodiment can be related to utilizes as the light source of lighting device.

(other)

Above, the utility model is related to, substrate and manufacture method, light-emitting device, illumination light source and lighting device, be illustrated according to embodiment and variation, but the utility model is not limited only to these embodiments and variation.

Such as, in the embodiment shown, show example light-emitting device being applicable to bulb-shaped lamp, but, also can by described light-emitting device, the light source as the lamp of other kind of Straight lamp etc. utilizes, and the light source as the ligthing paraphernalia of Down lamp and spotlight or basis illumination etc. utilizes, in addition, also the light source of described light-emitting device as various lighting device can be utilized.Further, also can by described light-emitting device, except utilizing as illumination light source, also utilize as display light source etc., other the light source of product.

Further, in described embodiment and variation, light-emitting device (LED module) although the structure adopted releases white light by blue LED die and yellow fluorophor, be not limited only to this.Such as, in order to improve color rendering, except yellow fluorophor, red-emitting phosphors and green-emitting phosphor can also be mixed.Further, also can be configured to, not utilize yellow fluorophor, and utilize containing red-emitting phosphors and green-emitting phosphor containing fluorophor resin, it and blue LED die combination are released white light.

Further, in described embodiment and variation, for LED chip, the LED chip of the light of the color sent beyond blueness can also be utilized.Such as, when utilizing the LED chip of luminescence-utraviolet, for fluorophor particle, send the combination of each color fluorescence body particle of the light of three primary colors (red, green, blue).And then, also the wavelength shifter beyond fluorophor particle can be utilized, such as, for wavelength shifter, the material of material of light also can utilize light that comprise semiconductor, metal misfit thing, organic dyestuff, pigment etc., that absorb certain wavelength, sending the wavelength different from the light absorbed.

And, in described embodiment and variation, show the example of the LED as light-emitting component, but, also can utilize other the solid-state light emitting element of the semiconductor light-emitting elements of semiconductor laser etc., organic EL (Electro Luminescence) or inorganic EL etc.

In addition, the various distortion that those skilled in the art expect is implemented and the form obtained to each embodiment, and the form that the inscape of each embodiment of combination in any and function realize in the scope not departing from aim of the present utility model, be also contained in the utility model.

Industrial applicibility

The utility model, the substrate that can be used in installing light emitting element widely and the light-emitting device possessing it and possess the lamp and lighting device etc. of light-emitting device.

Claims

1. a substrate, this substrate is the substrate for installing light emitting element, it is characterized in that,

Described substrate has light transmission, and, there is jog at the mask with the face opposite side for installing described light-emitting component,

Described jog, is formed by processing described substrate, and, be formed on the position relative with the position for installing described light-emitting component.

2. substrate as claimed in claim 1, is characterized in that,

Described substrate is the polycrystalline ceramics substrate in conjunction with multiple crystal grain,

The surface configuration of the exposed surface of described jog is, the surface configuration of described multiple crystal grain.

3. a light-emitting device, is characterized in that, possesses:

There is the substrate of light transmission; And

Be installed in the light-emitting component of the first interarea of described substrate,

Described substrate, has jog at the mask with the face opposite side of installing described light-emitting component,

Described jog, is formed by processing described substrate, and, be formed on the position relative with described light-emitting component.

4. light-emitting device as claimed in claim 3, is characterized in that,

The surface configuration of described jog is, the surface configuration of described multiple crystal grain.

5. the light-emitting device as described in claim 3 or 4, is characterized in that,

Also possess seal member, sealing parts comprise wavelength shifter, and, seal described light-emitting component.

6. light-emitting device as claimed in claim 5, is characterized in that possessing:

There is the substrate of light transmission;

Be installed in the light-emitting component of the first interarea of described substrate;

Seal member, comprises wavelength shifter, and, seal described light-emitting component; And

Comprise the wavelength conversion member of wavelength shifter,

Described jog, is formed on the position relative with described light-emitting component,

Described wavelength conversion member is formed overlapping with described jog.

7. light-emitting device as claimed in claim 6, is characterized in that,

Described jog is formed not exceed described wavelength conversion member.

8. an illumination light source, is characterized in that, possesses:

Light-emitting device described in any one of claim 3 to 7; And

The radiator be connected with described light-emitting device,

Described radiator, that be connected to the described substrate of described light-emitting device with face that the is face opposite side for installing described light-emitting component,

Described jog is not formed at the joint face of described radiator and described substrate.

9. illumination light source as claimed in claim 8, is characterized in that,

Also possess the enclosed globe shade covering described light-emitting device,

Described radiator is, is set to extend to the inside of described enclosed globe shade and support the pillar of described light-emitting device.