JP2003243718A - Light emitting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To improve heat dissipation and to suppress the secular deterioration of reflection property. <P>SOLUTION: One to a plurality of storage recesses 3 opened to a front face are formed on the surface of a ceramic substrate 2, and light emitting diode chips 1 are mounted on the bottoms of the storage recesses 3. A plurality of radiation fins 6 are protrusively disposed downward in positions turning back to the storage recess 3 at the back of the substrate 2. Light that the light emitting diode chip 1 emits is reflected on the inner peripheral face of the storage recess 3 and it is efficiently radiated to the front of the substrate 2. The inner peripheral face of the storage recess 3 fulfills the function of a reflector. Thus, secular deterioration due to heat and light which the light emitting diode chip 1 emits can be suppressed compared to a conventional case where the function of the reflector is given to a resin frame member 26. Since the radiation fins 6 are arranged at the back of the substrate 2 and a surface area is increased, heat that the light emitting diode chip 1 emits can efficiently be radiated outside through the substrate 2. <P>COPYRIGHT: (C)2003,JPO

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a light emitting device using a light emitting diode chip.

[0002]

2. Description of the Related Art The present inventors have already proposed a light emitting device using a light emitting diode chip, as shown in FIG. 15 (see Japanese Patent Application No. 2001-258680). This conventional device is made of a metal material having a high thermal conductivity such as aluminum, and has a protruding portion 21 having a storage recess 22 that is open to the front.
With a metal plate 20 projecting forward and a storage recess 22
Of the light emitting diode chip 24 mounted on the bottom surface of the metal plate 20 and thermally coupled to the metal plate 20, and an insulating substrate formed with an insertion hole 25a into which the protruding portion 21 is inserted and being overlapped with the back surface of the metal plate 20. The material 25, a frame-shaped frame member 26 that is joined to the surface of the insulating base material 25 and surrounds the light emitting diode chip 24 and the protruding portion 21, and a resin portion 27 that is transparent and that seals the light emitting diode chip 24. And a frame member 26
Through the resin portion 27 filled inside the
Illumination is performed by the light emitted from the light emitting diode chip 24 radiating upward.

[0003]

The light quantity of the light emitting diode is generally smaller than that of other light sources for illumination (such as discharge lamps and incandescent lamps). Therefore, in order to increase the light quantity, a current flowing through the light emitting diode is used. Needs to be increased. The current light emitting diode has an efficiency of converting input power into light of about 10%, and most of the input power is consumed as heat, and the heat causes the temperature of the light emitting diode itself to remarkably rise. . It is known that when the temperature of the light emitting diode rises, the light emitting efficiency decreases due to a phenomenon such as phonon scattering, and when the temperature rises significantly, the light emitting diode chip 2
The resin portion 27 that seals 4 and the resin frame member 26 having the function of the reflection plate are deteriorated, and due to these factors, the luminous efficiency is further reduced.

Therefore, in the above conventional device, the light emitting diode chip 24 mounted on the bottom surface of the storage recess 22 is mounted on the metal plate 20.
By thermally coupling to the resin part 2 as described above, the heat dissipation is improved and the temperature rise of the light emitting diode chip 24 is suppressed.
This suppresses a decrease in luminous efficiency due to deterioration of No. 7 and the like.

However, in the above conventional device, the frame member 2 made of resin is generated by the heat generated by the light emitting diode chip 24 and the light emitted from the light emitting diode chip 24.
6 was deteriorated and colored, and the reflection performance might be deteriorated.

The present invention has been made in view of the above circumstances, and an object thereof is to provide a light emitting device capable of improving heat dissipation and suppressing deterioration of reflection performance over time.

[0007]

In order to achieve the above object, the invention of claim 1 is directed to a ceramic substrate having one or a plurality of storage recesses formed on the front surface, and a storage recess. Light emitting diode chip mounted on the bottom of the place,
Characterized in that it comprises a heat dissipation means arranged on the back surface of the substrate, the light emitted from the light-emitting diode chip is reflected on the inner peripheral surface of the storage recess and efficiently radiated forward,
Since the substrate on which the storage recess is formed is made of ceramic, it is possible to suppress deterioration over time due to heat or light emitted from the light emitting diode chip. Moreover, by disposing the heat dissipation means on the back surface of the substrate, heat dissipation can be improved.

According to a second aspect of the present invention, in the first aspect of the invention, the heat radiating means is composed of a ceramic heat radiating fin, and the heat radiating fin increases the surface area of the back surface of the substrate to improve the heat radiating property. Can be achieved.

The invention of claim 3 is characterized in that, in the invention of claim 1, the heat dissipation means is made of a metal member, and since metal generally has a higher thermal conductivity than ceramics, By providing the metal member on the back surface, heat dissipation can be improved.

The invention of claim 4 is the invention of claim 1 or 2 or 3.
In the invention described above, a protrusion for abutting the light emitting diode chip is provided on the bottom surface of the recess of the substrate, the contact area between the light emitting diode chip and the substrate can be increased, and the thermal resistance can be reduced. The heat generated by is efficiently conducted to the substrate, and the heat dissipation is further improved.

According to a fifth aspect of the present invention, in any one of the first to fourth aspects, the coefficient of thermal expansion of the substrate is substantially the same as the coefficient of thermal expansion of the substrate forming the light emitting diode chip, Even when a sudden temperature change occurs between the light emitting diode chip and the substrate, stress is less likely to occur in the electrode part of the light emitting diode chip, and cracks and damages are prevented from occurring in the light emitting diode chip to ensure reliability. Can be improved.

According to a sixth aspect of the present invention, in the third aspect of the present invention, the back surface of the substrate and the front surface of the metal member are provided with fitting portions that are engaged with each other by projections and recesses. It can be firmly fixed without using any agent, resulting in cost reduction of material cost.

In order to achieve the above object, a seventh aspect of the present invention is a substrate formed by ceramic-coating at least the surface of a metal member having one or a plurality of storage recesses formed in the front surface formed on the surface. A light emitting diode chip mounted on the bottom surface of the storage recess, wherein the light emitted from the light emitting diode chip is reflected by the inner peripheral surface of the storage recess and efficiently radiated forward, and the storage Since the surface of the substrate on which the recess is formed is ceramic-coated, it is possible to suppress deterioration over time due to heat or light emitted from the light emitting diode chip. Further, since the substrate is made of a metal member, heat dissipation can be improved.

[0014]

BEST MODE FOR CARRYING OUT THE INVENTION (Embodiment 1) In this embodiment, as shown in FIG.
Is formed on the surface of the ceramic substrate 2, and the light emitting diode chip 1 is mounted on the bottom surface of each storage recess 3.

On the surface of the substrate 2 (upper surface in FIG. 1), 1
A plurality of columnar protrusions 2a are projected forward (upward in FIG. 1), and a mortar-shaped storage recess 3 is formed on the front surface of the protrusions 2a and is open in a substantially circular shape in plan view. ing. The bottom surface of the storage recess 3 is a flat surface, and the light emitting diode chip 1 is mounted face down on the flat bottom surface. A wiring portion (wiring pattern) 4 made of copper foil is formed on the surface of the substrate 2 including the inner peripheral surface of the storage recess 3 and the bottom surface excluding the central portion. Furthermore, the substrate 2
A plurality of radiating fins 6 are provided so as to project downward at positions on the back surface (the lower surface in FIG. 1) that face the storage recesses 3 and their backs.

The light emitting diode chip 1 comprises a gallium nitride-based light emitting layer (n layer 1b and p layer 1c) formed on a sapphire substrate 1a, and an electrode portion 5 is formed on each layer 1b, 1c.
a and 5b are joined. Here, one electrode portion 5a
Is bonded to the main surface (p layer 1c) of the light emitting diode chip 1, and the other electrode portion 5b is an n layer 1b exposed by partially removing the p layer 1c at the end of the light emitting diode chip 1.
The electrode portions 5a and 5b are electrically connected to the wiring portion 4, and power is supplied to the light emitting diode chip 1 via the wiring portion 4. However, the structure of the light-emitting diode chip 1 is an example, and for example, the structure in which the n layer 1b and the p layer 1c are reversed or a semiconductor other than gallium nitride-based may be used.

Thus, in this embodiment, the light emitted from the light emitting diode chip 1 is reflected by the inner peripheral surface of the storage recess 3 and is efficiently radiated to the front of the substrate 2, and the storage recess 3 The inner peripheral surface of the plays the function of a reflector. By thus providing the ceramic substrate 2 with the function of the reflecting plate, heat generated by the light emitting diode chip 1 and the heat generated by the light emitting diode chip 1 can be compared with the conventional example in which the resin frame member 26 has the function of the reflecting plate. Aging deterioration due to light can be suppressed. Further, ceramic generally has a higher thermal conductivity than resin, and in this embodiment, the surface area is increased by providing the radiation fins 6 on the back surface of the substrate 2, so that the light emitting diode chip 1
The heat generated by can be efficiently radiated to the outside through the substrate 2.

By the way, if the substrate 2 is made of a ceramic material having a thermal expansion coefficient substantially the same as that of the sapphire substrate 1a forming the light emitting diode chip 1, a rapid temperature change between the light emitting diode chip 1 and the substrate 2 occurs. Even if it occurs, stress is less likely to be generated in the electrode portions 5a and 5b, and there is an advantage that the light emitting diode chip 1 is prevented from being cracked or damaged and the reliability is improved.

In this embodiment, only one light emitting diode chip 1 is mounted on the bottom surface of the storage recess 3, but as shown in FIG. 2, a plurality of (for example, two) light emitting diode chips 1, 1 are mounted. May be mounted side by side, and there is an advantage that the luminous efficiency can be improved by increasing the number of mounted light emitting diode chips 1 in the storage recess 3.

Although the light emitting diode chip 1 is mounted face down in the present embodiment, the light emitting diode chip 1 may be mounted face up on the bottom surface of the storage recess 3 as shown in FIG. In this case, since the sapphire substrate 1a of the light emitting diode chip 1 and the substrate 2 can be directly contacted with each other to increase the contact area between them and reduce the thermal resistance, the heat generated by the light emitting diode chip 1 can be efficiently emitted from the substrate 2 The heat dissipation can be further improved. The light emitting diode chip 1 and the wiring portion 4 are connected by wire bonding the n layer 1b and the p layer 1c and the wiring portion 4 with a wire 7 made of gold, copper, aluminum or the like instead of the electrode portions 5a and 5b. It is done by joining.

Alternatively, as shown in FIG. 4, if the projection 2b provided on the bottom surface of the storage recess 3 is brought into contact with the main surface (p layer 1c) of the light emitting diode chip 1, the light emitting diode chip 1 and the substrate are formed. Since the contact area of 2 increases and the thermal resistance can be reduced, the heat generated by the light emitting diode chip 1 can be efficiently conducted to the substrate 2, and the heat dissipation can be further improved. Further, since the ceramic is excellent in electric insulation, the protrusion 2b causes the electrode portion 5a,
There is also an advantage that an electrical short circuit between 5b can be prevented.

(Embodiment 2) In this embodiment, as shown in FIG. 5, a metal member 8 is provided instead of the radiation fin 6 at a position on the back surface of the substrate 2 facing the housing recess 3 to form a heat radiation means. The point is characteristic. However, since other configurations are common to those of the first embodiment, common components are denoted by the same reference numerals, and description thereof will be omitted.

The metal member 8 is formed in a flat plate shape having a thermal conductivity higher than that of the ceramic material forming the substrate 2 and a thickness smaller than that of the substrate 2. It is attached by the method of. Alternatively, it is also possible to form the metal member 8 on the back surface of the substrate 2 by using a method such as plating, vapor deposition, precipitation from ceramics, metallization or alloying.

Thus, the heat generated by the light emitting diode chip 1 can be efficiently dissipated to the outside by the metal member 8 formed on the back surface of the substrate 2. When the light emitting device of the present embodiment is housed in a housing, if the metal member 8 is joined in a state of being in contact with the housing 9 as shown in FIG. The heat can be dissipated more efficiently.

(Third Embodiment) Since the basic configuration of this embodiment is the same as that of the first embodiment, common components are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 6, a plurality of metal members 10 also serving as wiring portions are joined to the back surface of the substrate 2, and through holes 10a are formed which penetrate from the bottom surface of the storage recess 3 to the back surface of the substrate 2 and these The hole 10a is plated. That is, this through hole 10a
The electrode parts 5a and 5b of the light emitting diode chip 1 mounted on the bottom surface of the storage recess 3 and the respective metal members 10 are electrically connected via the. In this embodiment, the wiring portion 4 on the surface of the substrate 2 is unnecessary.

Thus, the heat generated by the light emitting diode chip 1 is conducted to the metal member 10 on the back surface through the through hole 10a of the substrate 2 and is radiated to the outside through the metal member 10.

(Fourth Embodiment) Since the basic structure of this embodiment is the same as that of the first embodiment, the same components are designated by the same reference numerals and the description thereof will be omitted.

As shown in FIG. 7, a plurality of metal members 10 also serving as wiring portions are joined to the back surface of the substrate 2, and a through hole 10a penetrating from the bottom surface of the storage recess 3 to the back surface of the substrate 2 is plated. ing. Further, a protrusion 2c protruding forward is provided at the center of the bottom surface of the storage recess 3, and the light emitting diode chips 1 and 1 are mounted on both sides of the protrusion 2c. One of the light emitting diode chips 1 has one electrode portion 5
a is electrically connected to the wiring part 4, and the other electrode part 5
b is electrically connected to the metal member 10 through the through hole 10a. Similarly, in the other light-emitting diode chip 1, one electrode portion 5a is electrically connected to the metal member 10 through the through hole 10a, and the other electrode portion 5a.
b is electrically connected to the wiring portion 4.

The heat generated by the two light emitting diode chips 1 is conducted to the metal member 10 on the back surface through the through holes 10a of the substrate 2, and is radiated to the outside through the metal member 10. In addition, since the protrusion 2c partitions between the two light emitting diode chips 1,
When the conductive adhesive that connects the electrode portions 5a and 5b and the wiring portion 4 is applied, the conductive adhesive that connects one of the light emitting diode chips 1 does not protrude to the other light emitting diode chip 1 and It is possible to prevent the two light emitting diode chips 1 from being electrically short-circuited.

(Embodiment 5) In this embodiment, as shown in FIGS. 8 and 9, a flat metal member 8 is formed on the entire back surface of the substrate 2.
And a fitting recess 8a is provided on the front surface (upper surface in FIG. 8) of the metal member 8 and backward (downward in FIG. 8) at a position facing the housing recess 3 on the back surface of the substrate 2. Fitting projection 2 that projects and fits into fitting recess 8a
It is characterized in that d is projected. However, since other configurations are common to those of the first embodiment, illustration and description of common components are omitted.

As shown in FIG. 9, the fitting protrusion 2d of the substrate 2
The width dimension (width dimension on the left and right in FIG. 9) of the fitting recess 8a of the metal member 8 is set to be slightly larger. Here, a method of fixing the substrate 2 and the metal member 8 in this embodiment will be described. First, when the substrate 2 and the metal member 8 are left in a high temperature atmosphere, the metal member 8 has a larger coefficient of thermal expansion than the ceramic substrate 2, so that the metal member 8 is fitted as shown in FIG. The width dimension of the concave portion 8a becomes larger than the width dimension of the fitting convex portion 2d of the substrate 2. Then, in this state, the fitting convex portion 2d of the substrate 2 is inserted into the fitting concave portion 8 of the metal member 8.
When the substrate 2 and the metal member 8 are inserted into the inside a and the ambient temperature is returned from the high temperature to the normal temperature, the board 2 and the metal member 8 contract, the fitting convex portion 2d and the fitting concave portion 8a are fitted, and the board 2 and the metal member 8 are joined. It can be firmly fixed (see FIG. 8). In order to prevent thermal stress from being applied to the light emitting diode chip 1, the light emitting diode chip 1 should be mounted on the bottom surface of the housing recess 3 of the substrate 2 after fixing the substrate 2 and the metal member 8 in the above procedure. Is desirable.

As described above, in this embodiment, the substrate 2 and the metal member 8 can be firmly fixed without using an adhesive,
As a result, there is an advantage that the material cost can be reduced. The heat generated by the light emitting diode chip 1 can be efficiently dissipated through the metal member 8 fixed to the back surface of the substrate 2.

In this embodiment, the board 2 is fitted with the fitting protrusions 2.
d, the fitting recess 8a is provided in the metal member 8.
As shown in FIG. 13, a fitting concave portion 2e is provided on the back surface of the substrate 2 at a position facing the bottom of the housing concave portion 3 and a fitting convex portion 8b for fitting the concave concave portion 2e on the surface of the metal member 8. It may be provided. Also in this case, the fitting convex portion 8b of the metal member 8 is set to have a slightly larger width dimension (left and right width dimension in FIG. 11) than the fitting concave portion 2e of the substrate 2, and contrary to the above, in a low temperature atmosphere. Inserting the contracted fitting convex portion 8b into the fitting concave portion 2e and then returning the temperature to room temperature so that the fitting concave portion 2e and the fitting convex portion 8b are concave-convex fitted to firmly fix the substrate 2 and the metal member 8 to each other. You can

(Embodiment 6) This embodiment is characterized in that a substrate 11 having a ceramic layer 11b formed by ceramic coating on the surface of a metal substrate 11a is provided as shown in FIG.

On the surface of the substrate 11 (the upper surface in FIG. 14), one or a plurality of columnar protrusions 12 are provided so as to project forward (upward in FIG. 14), and the front face of the protrusion 12 is flat. A mortar-shaped storage recess 13 that opens in a substantially circular shape is formed. Similar to the first embodiment, the bottom surface of the storage recess 13 is a flat surface, and the light emitting diode chip 1 is mounted face down on the flat bottom surface. In addition, the substrate 11 including the inner peripheral surface of the storage recess 13 and the bottom surface excluding the central portion
A wiring portion (wiring pattern) 4 made of copper foil is formed on the surface (surface of the ceramic layer 11b). And
The electrode portions 5a and 5b of the light emitting diode chip 1 are electrically connected to the wiring portion 4.

Thus, in this embodiment, the surface of the light emitting diode chip 1 is insulated from the light emitting diode chip 1 by covering the surface with the ceramic layer 11b, and the heat generated by the light emitting diode chip 1 has a high thermal conductivity. Heat can be efficiently radiated to the outside through 11. Moreover,
Since the inner peripheral surface of the storage recess 13 is also covered with the ceramic layer 11b, the light emitted from the light emitting diode chip 1 can be reflected by the ceramic layer 11b to be efficiently radiated forward and the metal substrate 11a can be aged. Can be suppressed. Even when the light emitted from the light emitting diode chip 1 is transmitted through the ceramic layer 11b, if the metal substrate 11a is made of a metal having a high reflectance, such as aluminum, the light is efficiently reflected on the surface of the metal substrate 11a. It is possible to prevent the reflection performance from deteriorating.

[0038]

According to the first aspect of the present invention, there is provided a ceramic substrate on the surface of which one or a plurality of storage recesses that are open to the front are formed, and a light emitting diode chip mounted on the bottom of the storage recess. Since the heat radiation means arranged on the back surface of the substrate is provided, the light emitted from the light emitting diode chip is reflected by the inner peripheral surface of the storage recess and efficiently radiated forward, and
Since the substrate in which the storage recess is formed is made of ceramic, it is possible to suppress aged deterioration due to heat or light emitted from the light emitting diode chip, and moreover, by disposing the heat dissipation means on the back surface of the substrate, the heat dissipation is improved. There is an effect that it can be achieved.

According to a second aspect of the present invention, in the first aspect of the present invention, since the heat radiating means is composed of a ceramic heat radiating fin, the heat radiating fin can increase the surface area of the back surface of the substrate to improve the heat radiating property. effective.

According to a third aspect of the present invention, in the first aspect of the present invention, the heat dissipation means is made of a metal member. Therefore, generally, the heat conductivity of metal is higher than that of ceramic. By providing the member, there is an effect that the heat dissipation can be improved.

The invention of claim 4 relates to claim 1 or 2 or 3.
In the invention of claim 1, since the protrusion that abuts the light emitting diode chip is provided on the bottom surface of the recess of the substrate, the contact area between the light emitting diode chip and the substrate can be increased to reduce the thermal resistance, and the heat generated by the light emitting diode chip can be reduced. Is effectively conducted to the substrate to further improve the heat dissipation.

According to the invention of claim 5, in any one of claims 1 to 4, the coefficient of thermal expansion of the substrate is substantially the same as the coefficient of thermal expansion of the substrate forming the light emitting diode chip.
Even when a sudden temperature change occurs between the light emitting diode chip and the substrate, stress is less likely to occur in the electrode part of the light emitting diode chip, and cracks and damages are prevented from occurring in the light emitting diode chip to ensure reliability. There is an effect that it can be improved.

According to a sixth aspect of the present invention, in the third aspect of the present invention, the back surface of the substrate and the front surface of the metal member are provided with fitting portions that are fitted to each other by projections and recesses. It is possible to firmly fix it without having to do so, and as a result, it is possible to reduce the material cost.

In order to achieve the above-mentioned object, the invention of claim 7 is a substrate formed by coating at least the surface of a metal member having a front surface with one or a plurality of storage recesses formed therein, and a ceramic coating. Since the light emitting diode chip mounted on the bottom surface of the storage recess is provided, the light emitted from the light emitting diode chip is reflected by the inner peripheral surface of the storage recess and efficiently radiated forward, and the storage recess is Since the surface of the substrate to be formed is ceramic-coated, it is possible to suppress aged deterioration due to heat and light emitted from the light emitting diode chip, and further, because the substrate is made of a metal member, heat dissipation can be improved. There is an effect.

[Brief description of drawings]

FIG. 1 is a cross-sectional view showing a main part of a first embodiment.

FIG. 2 is a cross-sectional view showing a main part of another configuration of the above.

FIG. 3 is a sectional view showing a main part of still another configuration of the above.

FIG. 4 is a sectional view showing a main part of still another configuration of the above.

FIG. 5 is a sectional view showing a main part of the second embodiment.

FIG. 6 is a cross-sectional view showing the main parts of the third embodiment.

FIG. 7 is a sectional view showing a main part of the fourth embodiment.

FIG. 8 is a cross-sectional view showing the main parts of the fifth embodiment.

FIG. 9 is an explanatory diagram for explaining a method of fixing the substrate and the metal member in the above.

FIG. 10 is an explanatory diagram for explaining a method of fixing the substrate and the metal member in the above.

FIG. 11 is a cross-sectional view showing a main part of another configuration of the above.

FIG. 12 is an explanatory diagram for explaining a method of fixing the substrate and the metal member in the above.

FIG. 13 is an explanatory diagram for explaining a method of fixing the substrate and the metal member in the above.

FIG. 14 is a cross-sectional view showing the main parts of the sixth embodiment.

FIG. 15 is a cross-sectional view showing a main part of a conventional example.

[Explanation of symbols]

1 Light emitting diode chip 2 substrates 3 storage recess 4 wiring section 6 radiating fins

   ─────────────────────────────────────────────────── ─── Continued front page    (72) Inventor Masaru Sugimoto             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Eiji Shiohama             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Hideyoshi Kimura             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Yoshiyuki Uchino             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company (72) Inventor Toshiyuki Suzuki             1048, Kadoma, Kadoma-shi, Osaka Matsushita Electric Works Co., Ltd.             Inside the company F-term (reference) 5F041 AA33 AA44 DA04 DA09 DA20

Claims (7)

[Claims] 1. A ceramic substrate having one or a plurality of storage recesses formed on the front surface formed on the surface, a light emitting diode chip mounted on the bottom of the storage recess, and a rear surface of the substrate. A light emitting device, comprising: 2. The light emitting device according to claim 1, wherein the heat dissipation means is composed of a heat dissipation fin made of ceramic. 3. The light emitting device according to claim 1, wherein the heat dissipation means is made of a metal member. 4. The light emitting device according to claim 1, wherein a protrusion for contacting a light emitting diode chip is provided on a bottom surface of the recess of the substrate. 5. The light emitting device according to claim 1, wherein the coefficient of thermal expansion of the substrate is substantially the same as the coefficient of thermal expansion of a substrate on which a light emitting diode chip is formed. 6. The light emitting device according to claim 3, wherein fitting portions for fitting concave and convex are provided on the back surface of the substrate and the front surface of the metal member, respectively. 7. A substrate formed by ceramic-coating at least the surface of a metal member having one or a plurality of storage recesses formed on the front surface, and a light emitting diode chip mounted on the bottom surface of the storage recess. And a light-emitting device.