JP2007042755A - Led-lighting device - Google Patents

Led-lighting device Download PDF

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JP2007042755A
JP2007042755A JP2005223247A JP2005223247A JP2007042755A JP 2007042755 A JP2007042755 A JP 2007042755A JP 2005223247 A JP2005223247 A JP 2005223247A JP 2005223247 A JP2005223247 A JP 2005223247A JP 2007042755 A JP2007042755 A JP 2007042755A
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substrate
lighting device
led
device housing
fin
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JP4740682B2 (en
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Hideki Fukuda
秀樹 福田
Takuo Murai
卓生 村井
Yasuo Imai
康雄 今井
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Mitsubishi Electric Corp
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Mitsubishi Electric Corp
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Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED-lighting device which can efficiently dissipate heat generated from an LED device, and which excels in maintenability, because of easy fitting to a box of the lighting device. <P>SOLUTION: The LED lighting device is provided with a substrate 1, having a concave 7 on its front surface wherein a reflection material 2 is provided; an LED element 3 mounted onto the bottom surface of the concave 7; a plurality of fins 1a provided to the rear side of the substrate 1; a box 5 of the lighting device, having grooves 5a to which the fins 1a are fitted detachably, respectively; engaging parts 1b and 1c which are projected from the side surface side of the fins 1a and partly comprises the fin; and engaged parts 5b and 5c which are formed in the grooves 5a of the casing 5 that are to be engaged with the engaging parts 1b and 1c so as to fix the substrate 1 and the box 5 of the lighting device. <P>COPYRIGHT: (C)2007,JPO&INPIT

Description

この発明は、LED素子を実装した基板と照明装置筐体の取り付けに関して放熱効果を高めるとともに、取り付けを容易にしたLED照明装置に関するものである。   The present invention relates to an LED lighting device that enhances the heat dissipation effect and facilitates the mounting with respect to the mounting of the substrate on which the LED element is mounted and the lighting device housing.

LED素子を用いた照明装置において、一般に、放電ランプや白熱灯などの一般照明装置と同等の光量を確保するために、複数のLED素子を集合させて使用するとともに、LED素子に流す電流を大きくして1個あたりの光量を増加させる必要がある。   In an illumination device using LED elements, in general, in order to secure the same amount of light as that of a general illumination device such as a discharge lamp or an incandescent lamp, a plurality of LED elements are used together, and a current flowing through the LED elements is increased. Therefore, it is necessary to increase the amount of light per piece.

このとき、LED素子より発生する熱は、LED素子の数や電流の増加につれて大きくなり、半導体であるLED素子の寿命特性や発光効率が悪化すると共に、LED素子周辺に充填した樹脂も劣化し、照明用光源として必要とされる光量を確保しにくくなる。   At this time, the heat generated from the LED elements increases as the number of LED elements and current increase, and the life characteristics and light emission efficiency of the LED elements that are semiconductors deteriorate, and the resin filled around the LED elements also deteriorates. It becomes difficult to secure the amount of light required as a light source for illumination.

このため、LEDを実装した基板の発光面裏側にフィンを設けて表面積を増やす構造、および基板を熱伝導率のより高い部材へ取り付ける構造により、放熱効果を高めたLED照明装置が提案されている。   For this reason, an LED lighting device with improved heat dissipation has been proposed by a structure in which fins are provided on the back side of the light emitting surface of the substrate on which the LED is mounted to increase the surface area and a structure in which the substrate is attached to a member having higher thermal conductivity. .

第1の従来技術として、LED素子がセラミック基板実装され、基板の裏面にフィンを設けて表面積を増大させ、LED素子の発する熱を効率よく外部に放熱している。また、セラミック基板の嵌合凸部は金属部材の嵌合凹部に対して幅寸法が若干大きく設定されている。基板と金属部材を高温雰囲気中に放置すると、金属部材の方がセラミック製の基板に比較して熱膨張率が大きいため、金属部材の嵌合凹部の幅寸法が基板の嵌合凸部の幅寸法よりも大きくなる。そして、この状態で基板の嵌合凸部を金属部材の嵌合凹部内に挿入し、さらに雰囲温度を高温から常温に戻せば、基板並びに金属部材が収縮して嵌合凸部と嵌合凹部とが嵌合して基板1を熱伝導率のより高い金属部材へ固定させるものである(例えば、特許文献1参照)。   As a first conventional technique, an LED element is mounted on a ceramic substrate, fins are provided on the back surface of the substrate to increase the surface area, and heat generated by the LED element is efficiently radiated to the outside. Further, the fitting convex portion of the ceramic substrate is set to have a slightly larger width dimension than the fitting concave portion of the metal member. If the substrate and the metal member are left in a high temperature atmosphere, the metal member has a larger coefficient of thermal expansion than the ceramic substrate, so the width dimension of the fitting recess of the metal member is the width of the fitting protrusion of the substrate. Larger than the dimensions. In this state, if the mating convex part of the board is inserted into the mating concave part of the metal member, and the ambient temperature is returned from the high temperature to the normal temperature, the board and the metal member are contracted to fit the mating convex part. The recess is fitted to fix the substrate 1 to a metal member having a higher thermal conductivity (see, for example, Patent Document 1).

第2の従来技術として、LED素子が基板に実装され、基板の下面が放熱固定板の上面に接するようにし、放熱カバーが基板を覆うように設けられ、これらをネジで樹脂ケースに固定し、LED素子の発する熱を効率よく外部に放熱している(例えば、特許文献2参照)。   As a second conventional technique, the LED element is mounted on the substrate, the lower surface of the substrate is in contact with the upper surface of the heat radiation fixing plate, the heat radiation cover is provided so as to cover the substrate, these are fixed to the resin case with screws, The heat generated by the LED elements is efficiently radiated to the outside (see, for example, Patent Document 2).

特開2003−243718号(段落番号0014、図1、段落番号0031、図5)JP 2003-243718 (paragraph number 0014, FIG. 1, paragraph number 0031, FIG. 5) 特開2002−299700号(段落番号0015、図5)JP 2002-299700 (paragraph number 0015, FIG. 5)

しかしながら、上記従来のLED照明装置では、基板の裏面に対してフィンが下方へ向けて垂直に設置されているため、これらを他の部材へ取り付ける際には、ネジおよび接着剤での固定、または熱膨張を利用しての固定などが必要であった。   However, in the conventional LED lighting device, since the fins are installed vertically downward with respect to the back surface of the substrate, when these are attached to other members, fixing with screws and an adhesive, or Fixing using thermal expansion was necessary.

また、接着剤や熱膨張を利用した固定では、基板を交換する際などに取り外しが困難なため、メンテナンス性に問題があった。   In addition, fixing using an adhesive or thermal expansion has a problem in maintainability because it is difficult to remove the substrate when replacing it.

この発明は上記のような問題を解決するためになされたものであり、LED素子から発生した熱を効率よく放熱するとともに、照明装置筺体への取り付けが容易なためメンテナンス性の良いLED照明装置を提供することを目的とする。   The present invention has been made to solve the above-described problems, and efficiently dissipates the heat generated from the LED elements, and an LED lighting device with good maintainability because it can be easily attached to the lighting device housing. The purpose is to provide.

この発明に係るLED照明装置は、反射材が設けられた凹部を前面に有する基板と、前記凹部の底面に実装されたLED素子と、前記基板の裏側に設けられた複数のフィンと、これらのフィンが各々着脱可能に嵌合される溝部を有する照明装置筐体と、前記フィンまたは前記基板の側面側に突設されフィンの一部をなす係止部と、前記照明装置筐体の前記溝部に形成され、前記係止部に係止されて前記基板と前記照明装置筐体を固定する被係止部と、を備えたものである。   The LED lighting device according to the present invention includes a substrate having a concave portion provided with a reflector on the front surface, an LED element mounted on the bottom surface of the concave portion, a plurality of fins provided on the back side of the substrate, and these A lighting device housing having a groove portion into which the fins are detachably fitted, a locking portion protruding from a side surface of the fin or the substrate and forming a part of the fin, and the groove portion of the lighting device housing And a locked portion that is locked to the locking portion and fixes the substrate and the lighting device casing.

以上のように、この発明によれば、基板の裏側に設けられた複数のフィンと、これらのフィンが各々着脱可能に嵌合される溝部を有する照明装置筐体と、前記フィンまたは前記基板の側面側に突設されフィンの一部をなす係止部と、前記照明装置筐体の前記溝部に形成され、前記係止部に係止されて前記基板と前記照明装置筐体を固定する被係止部と、を備えたので、熱伝導率のより高い照明装置筐体との接触面積が大きくなり、LED素子より発生する熱を効率よく外部へ放熱し、LED素子の寿命特性や発光効率の悪化を防ぐと共に、LED素子周辺に充填した樹脂の劣化も防ぐことにより、信頼性を高くすることができ、また、基板に形成したフィンの一部を利用して、照明装置筐体への取り付けが可能であり、取り付けが容易でメンテナンス性を良くすることができる。   As described above, according to the present invention, a plurality of fins provided on the back side of the substrate, a lighting device housing having grooves into which the fins are detachably fitted, and the fins or the substrate A locking portion that protrudes from the side surface and forms a part of the fin, and a cover that is formed in the groove portion of the lighting device casing and is locked by the locking portion to fix the substrate and the lighting device casing. The contact area with the luminaire housing having higher thermal conductivity is increased, the heat generated from the LED element is efficiently radiated to the outside, and the life characteristics and light emission efficiency of the LED element are provided. In addition to preventing deterioration of the resin filled around the LED element, the reliability can be increased, and a part of the fin formed on the substrate can be used to connect the lighting device housing. Can be installed, easy to install It is possible to improve the nonce property.

実施の形態1.
図1(a)、図1(b)は実施の形態1を示すLED照明装置の断面図、図2は図1(a)の分解斜視図である。
図1、図2において、LED照明装置は、表面に反射材2が設けられた凹部7を前面に有する基板1と、凹部7の底面に実装されたLED素子3と、LED素子を包み込むように溝部へ充填された樹脂4と、基板1の裏面に設けられた複数のフィン1aと、これらのフィン1aに対応して断面が凹凸形状に形成され、この凹状の溝部5aにフィン1aが各々着脱可能に嵌合される照明装置筐体5が設けられている。
Embodiment 1 FIG.
1 (a) and 1 (b) are cross-sectional views of the LED illumination device showing Embodiment 1, and FIG. 2 is an exploded perspective view of FIG. 1 (a).
In FIG. 1 and FIG. 2, the LED illumination device wraps the LED element, the substrate 1 having a concave portion 7 with a reflective material 2 provided on the front surface, the LED element 3 mounted on the bottom surface of the concave portion 7, and the LED element. The resin 4 filled in the groove, a plurality of fins 1a provided on the back surface of the substrate 1, and a cross-section is formed in an uneven shape corresponding to these fins 1a, and the fins 1a are attached to and detached from the concave groove 5a. An illuminating device housing 5 that can be fitted is provided.

図1(a)に示すLED照明装置は、基板1の裏面に設けられた複数のフィン1aの内、両外側のフィン1aの端部の外側面に断面四辺形状の係止部1bが形成され、これらの係止部1bに対応する照明装置筐体5の溝部5aの内、これらの係止部1bに対応する両外側の溝部5aに係止部1bに係止される被係止部5bが形成されている。
また、基板1の各フィン1a、各係止部1b及びこれらに対応する各溝部5a、各被係止部5bは基板の凹部7の中心軸に対して左右対称であり、また、図2に示すように長手方向に沿って長い形状である。
In the LED lighting device shown in FIG. 1A, a locking portion 1b having a quadrangular cross section is formed on the outer surface of the ends of the fins 1a on both outer sides of the plurality of fins 1a provided on the back surface of the substrate 1. Of the groove portions 5a of the lighting device housing 5 corresponding to these locking portions 1b, the locked portion 5b locked to the locking portion 1b in the outer groove portions 5a corresponding to these locking portions 1b. Is formed.
Further, each fin 1a, each locking portion 1b and each corresponding groove portion 5a, and each locked portion 5b of the substrate 1 are symmetrical with respect to the central axis of the concave portion 7 of the substrate, and FIG. As shown, the shape is long along the longitudinal direction.

図1(b)に示すLED照明装置は、基板1の裏面に設けられた複数のフィン1aの内、外側から2番目のフィン1aの側面に断面三角形状の係止部1cが形成され、照明装置筐体5の溝部5aの内、これらの係止部1cに対応する外側から2番目の溝部5aに係止部1cに係止される被係止部5cが形成されている。
また、基板1の各フィン1a、各係止部1c及びこれらに対応する各溝部5a、各被係止部5cは、基板の凹部7の中心軸に対して左右対称であり、また、長手方向に沿って長い形状である。
In the LED lighting device shown in FIG. 1B, a locking portion 1c having a triangular cross section is formed on the side surface of the second fin 1a from the outside among the plurality of fins 1a provided on the back surface of the substrate 1. Of the groove portions 5a of the apparatus housing 5, a second locked portion 5c from the outside corresponding to these locking portions 1c is formed with a locked portion 5c that is locked to the locking portion 1c.
Further, each fin 1a, each locking portion 1c and each corresponding groove portion 5a, and each locked portion 5c of the substrate 1 are symmetrical with respect to the central axis of the recess portion 7 of the substrate, and the longitudinal direction It is a long shape along.

照明装置筐体5は熱伝導率の高い材料であり、基板1は例えばセラミック基板である。 その凹部7は底部が平面であり、前面から底部にかけて狭くなる連続斜面を有する。また、凹部7の表面に配置した反射材2は例えば銀であり、可視光領域での反射率が高く、凹部7の外へ光を効率よく発光することが可能となる。   The lighting device housing 5 is a material having high thermal conductivity, and the substrate 1 is, for example, a ceramic substrate. The recess 7 has a flat bottom and a continuous slope that narrows from the front to the bottom. Moreover, the reflective material 2 arrange | positioned on the surface of the recessed part 7 is silver, for example, and the reflectance in a visible light area | region is high, and it becomes possible to light-emit efficiently out of the recessed part 7. FIG.

LED素子3は例えばサファイア基板上に窒化ガリウム系の発光層から形成され、各層に接合された電極を前記溝部の底面に配置された配線部と電気的に接続することにより電力を提供する。さらに、LED素子3を包み込むように凹部へ充填された樹脂4は、エポキシ材やシリコン材などからなる透明あるいは半透明の樹脂であり、特に、紫外光などに対して劣化速度が緩やかなものなど耐候性の強いものが良い。   The LED element 3 is formed of, for example, a gallium nitride-based light emitting layer on a sapphire substrate, and provides power by electrically connecting an electrode bonded to each layer to a wiring portion disposed on the bottom surface of the groove portion. Further, the resin 4 filled in the recess so as to wrap the LED element 3 is a transparent or translucent resin made of an epoxy material, a silicon material, or the like, and particularly has a slow deterioration rate against ultraviolet light or the like. Good weather resistance.

次に、基板1と照明装置筐体5の取り付けについて図1、図2により説明する。
基板1を照明装置筐体5に取り付けるときは、図2に示すように、基板1のフィン1a、係止部1bを照明装置筐体5の溝部5a、被係止部5bを各々合わせて、基板1を照明装置筐体5の横方向から挿入して嵌合させる。このとき、基板1のフィン1a、係止部1b及び照明装置筐体5の溝部5a、被係止部5bの各々の嵌合部に、熱伝導率の高いグリスを塗布する。また、基板1の両外側のフィン1aの外側面の係止部1bが、照明装置筐体5の両外側の溝部5aの被係止部5bに係止されて、基板1と照明装置筐体5を固定する。
Next, attachment of the substrate 1 and the lighting device housing 5 will be described with reference to FIGS.
When attaching the substrate 1 to the lighting device housing 5, as shown in FIG. 2, the fins 1a and the locking portions 1b of the substrate 1 are combined with the grooves 5a and the locked portions 5b of the lighting device housing 5, respectively. The board | substrate 1 is inserted and fitted from the horizontal direction of the illuminating device housing | casing 5. FIG. At this time, grease having a high thermal conductivity is applied to each fitting portion of the fin 1a, the locking portion 1b, the groove portion 5a of the lighting device housing 5, and the locked portion 5b. Further, the engaging portions 1b on the outer side surfaces of the fins 1a on both outer sides of the substrate 1 are engaged with the engaged portions 5b of the groove portions 5a on both outer sides of the lighting device housing 5, so that the substrate 1 and the lighting device housing are provided. 5 is fixed.

図1(B)の場合も同様に、基板1のフィン1a、係止部1cを照明装置筐体5の溝部5a、被係止部5cを各々合わせて、基板1を照明装置筐体5の横方向から挿入嵌合させると、基板1の外側から2番目のフィン1aの外側面に形成された係止部1cが、照明装置筐体5の溝部5aの被係止部5cに係止されて、基板1と照明装置筐体5を固定する。   Similarly, in the case of FIG. 1B, the board 1 is attached to the lighting device housing 5 by combining the fins 1a and the locking portions 1c of the substrate 1 with the grooves 5a and the locked portions 5c of the lighting device housing 5 respectively. When inserted and fitted from the side, the locking portion 1c formed on the outer surface of the second fin 1a from the outside of the substrate 1 is locked to the locked portion 5c of the groove portion 5a of the lighting device housing 5. Then, the substrate 1 and the lighting device housing 5 are fixed.

以上のように、基板1の裏側に設けられた複数のフィン1aと、これらのフィン1aが各々着脱可能に嵌合される溝部5aを有する照明装置筐体5と、フィン1aの側面側に突設されフィンの一部をなす係止部1b、1cと、照明装置筐体5の溝部5aに形成され、係止部1b、1cに係止されて前記基板と前記照明装置筐体を固定する被係止部5b、5cとを備えたので、熱伝導率のより高い照明装置筐体との接触面積が大きくなり、LED素子より発生する熱を効率よく外部へ放熱し、LED素子の寿命特性や発光効率の悪化を防ぐと共に、LED素子周辺に充填した樹脂の劣化も防ぐことにより、信頼性を高くすることができ、また、基板に形成したフィンの一部を利用して、照明装置筐体への取り付けが可能であり、取り付けが容易でメンテナンス性を良くすることができる。
また、嵌合部には熱伝導率の高いグリスを塗布することにより、基板1で発生した熱をより効率的に照明装置筐体5へ放熱することができる。
また、係止部1b、1cは、基板1の凹部7の中心軸に対して左右対称に設けられたので、工作性を良くすることができる。
As described above, the plurality of fins 1a provided on the back side of the substrate 1, the lighting device housing 5 having the groove portions 5a into which the fins 1a are detachably fitted, and the side surfaces of the fins 1a are projected. The locking portions 1b and 1c that are provided and form a part of the fin, and the groove portion 5a of the lighting device housing 5, are locked by the locking portions 1b and 1c to fix the substrate and the lighting device housing. Since the locked portions 5b and 5c are provided, the contact area with the luminaire housing with higher thermal conductivity is increased, the heat generated from the LED element is efficiently radiated to the outside, and the lifetime characteristics of the LED element In addition to preventing deterioration of the light emitting efficiency and the resin filled around the LED element, the reliability can be increased, and a part of the fin formed on the substrate can be used to make the lighting device housing. Easy to attach to the body It is possible to improve the maintainability.
Further, by applying grease having a high thermal conductivity to the fitting portion, the heat generated in the substrate 1 can be radiated to the lighting device housing 5 more efficiently.
Moreover, since the latching | locking parts 1b and 1c were provided left-right symmetrically with respect to the central axis of the recessed part 7 of the board | substrate 1, workability can be improved.

実施の形態2.
実施の形態1では、基板1の各フィン1a、各係止部1b及び照明装置筐体5の溝部5a、被係止部5bの側面の形状は、基板の凹部7の中心軸に対して、左右対称であるが、
本実施の形態は、基板1の凹部7の中心軸に対して、左右非対称としたものである。
Embodiment 2. FIG.
In Embodiment 1, the shape of the side surface of each fin 1a of each board | substrate 1, each latching | locking part 1b, the groove part 5a of the illuminating device housing | casing 5, and the to-be-latched part 5b is with respect to the central axis of the recessed part 7 of a board | substrate. Symmetrical but
This embodiment is asymmetrical with respect to the central axis of the recess 7 of the substrate 1.

図3の(a)(b)はこの発明の実施の形態2を示すLED照明装置の断面図である。図において、実施の形態1と同一または相当部分には同一符号を付け説明を省略する。   3 (a) and 3 (b) are cross-sectional views of an LED illumination device showing Embodiment 2 of the present invention. In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

図3(a)は基板1の両外側のフィン1aの一方の端部の外側面に突設した断面四辺形状の係止部1bを形成し、他方の端部の内側面に突設した断面四辺形状の係止部1dを形成している。これらの係止部1b、1dに対応して照明装置筐体5の溝部5aには、被係止部5b、5dを各々形成している。
また、基板1の各係止部1b、1d及びこれらに対応する各被係止部5b、5dは基板の凹部7の中心軸に対して左右非対称である。
図3(b)は基板1の一方の外側から2番目のフィン1aと他方の外側から1番目のフィン1aの外側面に断面三角形状の係止部1c、1eを各々形成し、これらの係止部1c、1eに対応して照明装置筐体5の溝部5aには、被係止部5c、5eを各々形成している。
また、基板1の各係止部1c、1e及びこれらに対応する各被係止部5c、5eは基板の凹部7の中心軸に対して各々非左右対称である。
FIG. 3A shows a cross section in which a locking portion 1b having a quadrilateral cross section projecting from one outer end surface of the fin 1a on both outer sides of the substrate 1 is formed and projecting from the inner surface of the other end portion. A four-sided locking portion 1d is formed. Corresponding to these locking portions 1b and 1d, locked portions 5b and 5d are formed in the groove portion 5a of the lighting device housing 5, respectively.
Further, the respective locking portions 1b and 1d of the substrate 1 and the corresponding locked portions 5b and 5d corresponding thereto are asymmetrical with respect to the central axis of the concave portion 7 of the substrate.
FIG. 3 (b) shows that engaging portions 1c and 1e having a triangular cross section are formed on the outer surfaces of the second fin 1a from the outside of the substrate 1 and the first fin 1a from the outside of the substrate 1, respectively. Locked portions 5c and 5e are formed in the groove portion 5a of the lighting device housing 5 corresponding to the stop portions 1c and 1e, respectively.
Further, the respective locking portions 1c and 1e of the substrate 1 and the corresponding locked portions 5c and 5e corresponding thereto are not symmetrical with respect to the central axis of the concave portion 7 of the substrate.

次に、基板1と照明装置筐体5の取り付けを説明する。
図3(a)の場合は、基板1の両外側のフィン1aの一方の端部の外側面に突設した係止部1bを照明装置筐体5の溝部5aの一方の被係止部5bに合わせ、また、基板1の他方の端部の内側面に突設した係止部1dを照明装置筐体5の溝部5aの他方の被係止部5dに合わせて、基板1を照明装置筐体5の横方向から挿入して嵌合させる。このとき、基板1の係止部1b、1dが、照明装置筐体5の被係止部5b、5dに各々係止されて、基板1と照明装置筐体5を固定する。
Next, attachment of the board | substrate 1 and the illuminating device housing | casing 5 is demonstrated.
In the case of FIG. 3A, the locking portion 1 b protruding from the outer surface of one end of the fin 1 a on both outer sides of the substrate 1 is used as one locked portion 5 b of the groove portion 5 a of the lighting device housing 5. In addition, the locking portion 1d protruding from the inner surface of the other end of the substrate 1 is aligned with the other locked portion 5d of the groove portion 5a of the lighting device housing 5, so that the substrate 1 is mounted on the lighting device housing. The body 5 is inserted from the lateral direction and fitted. At this time, the locking portions 1 b and 1 d of the substrate 1 are locked to the locked portions 5 b and 5 d of the lighting device housing 5 to fix the substrate 1 and the lighting device housing 5.

図3(b)の場合は、基板1の一方の外側から2番目のフィン1aと基板1の他方の外側から2番目のフィン1aの端部の外側面に突設した各々の係止部1c、1eを、被係止部5c、5eに合わせ、基板1を照明装置筐体5の横方向から挿入して嵌合させる。このとき、基板1の係止部1c、1eが照明装置筐体5の被係止部5c、5eに各々係止されて、基板1と照明装置筐体5を固定する。   In the case of FIG. 3B, each locking portion 1 c protruding from the outer surface of the end of the second fin 1 a from the outside of the substrate 1 and the second fin 1 a from the other outside of the substrate 1. 1e is aligned with the locked portions 5c and 5e, and the board 1 is inserted from the lateral direction of the lighting device housing 5 and fitted. At this time, the locking portions 1 c and 1 e of the substrate 1 are respectively locked with the locked portions 5 c and 5 e of the lighting device housing 5, and the substrate 1 and the lighting device housing 5 are fixed.

以上のように、係止部1b、1d、または、係止部1c、1eを、基板1の凹部7の中心軸に対して、各々左右非対称としたので、基板1を照明装置筐体5へ取り付ける際の方向性を確定することができる。このことにより、基板1の誤挿入などを防止することができる。   As described above, since the locking portions 1b and 1d or the locking portions 1c and 1e are asymmetrical with respect to the central axis of the concave portion 7 of the substrate 1, the substrate 1 is moved to the lighting device casing 5. The directionality when attaching can be determined. This can prevent erroneous insertion of the substrate 1.

実施の形態3.
図4はこの発明の実施の形態3を示すLED照明装置の斜視図である。図において、実施の形態1と同一または相当部分には同一符号を付け説明を省略する。
Embodiment 3 FIG.
FIG. 4 is a perspective view of an LED illumination device showing Embodiment 3 of the present invention. In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

本実施の形態は、実施の形態1の図1(a)、図2に示した基板1の両側のフィン1aの一部である係止部1bを、図4に示すように各々長手方向に沿った長さが短い係止部1fとし、照明装置筐体5の被係止部5fに基板1の係止部1fが係止する係止位置とは異なった位置に、係止部1fが差し込まれる差し込み口5gを設けたものである。
図4では基板1と照明装置筐体5の一端部を示しているが、他端部も同じ構成である。
In this embodiment, the locking portions 1b, which are part of the fins 1a on both sides of the substrate 1 shown in FIGS. 1 (a) and 2 of the first embodiment, are arranged in the longitudinal direction as shown in FIG. The locking portion 1f is set at a position different from the locking position at which the locking portion 1f of the substrate 1 is locked to the locked portion 5f of the lighting device housing 5, and the locking portion 1f of the lighting device housing 5 is locked. The insertion port 5g to be inserted is provided.
Although FIG. 4 shows one end of the substrate 1 and the lighting device casing 5, the other end also has the same configuration.

基板1を照明装置筐体5に取り付けるときは、基板1の両外側のフィン1aの係止部1fを、照明装置筐体5の被係止部5fに設けられた差し込み口5gに合わせて、基板1を照明装置筐体5の上方向から挿入し、挿入後、横方向にずらして照明装置筐体5の被係止部5fに基板1の係止部1fを係止させる。   When attaching the substrate 1 to the lighting device casing 5, the locking portions 1f of the fins 1a on both outer sides of the substrate 1 are aligned with the insertion openings 5g provided in the locked portions 5f of the lighting device casing 5, The board | substrate 1 is inserted from the upper direction of the illuminating device housing | casing 5, and after inserting, the latching | locking part 1f of the board | substrate 1 is latched to the to-be-latched part 5f of the illuminating device housing | casing 5.

以上のように、照明装置筐体5の被係止部5fに、フィン1aに設けた係止部1fが係止される係止位置とは異なった位置に、係止部1fが差し込まれる差し込み口5gを設けたので、基板1を照明装置筐体5へ取り付ける作業を容易にすることができ、メンテナンス性を良くすることができる。   As described above, the locking portion 1f is inserted into the locked portion 5f of the lighting device housing 5 at a position different from the locking position where the locking portion 1f provided on the fin 1a is locked. Since the opening 5g is provided, the work of attaching the substrate 1 to the lighting device housing 5 can be facilitated, and the maintainability can be improved.

実施の形態4.
図5はこの発明の実施の形態4を示すLED照明装置の断面図である。図において、実施の形態1と同一または相当部分には同一符号を付け説明を省略する。
Embodiment 4 FIG.
FIG. 5 is a cross-sectional view of an LED lighting device showing Embodiment 4 of the present invention. In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

図5において、LED素子3が実装される基板1の凹部7に近いのフィン1aの両側面とこのフィン1aが嵌合される照明装置筐体の溝部5aの両側面に、相互に接触するようにLED素子3の通電用の電極6が設けられている。   In FIG. 5, both side surfaces of the fin 1a close to the concave portion 7 of the substrate 1 on which the LED element 3 is mounted and both side surfaces of the groove portion 5a of the lighting device housing to which the fin 1a is fitted are in contact with each other. The electrode 6 for energizing the LED element 3 is provided on the surface.

この構成において、基板1を照明装置筐体5に取り付けると同時に、基板1のフィン1aの両側面と照明装置筐体の溝部5aの両側面に設けられた各々設けられた電極が接続される。   In this configuration, at the same time that the substrate 1 is attached to the lighting device housing 5, the electrodes provided on both side surfaces of the fins 1 a of the substrate 1 and both side surfaces of the groove portion 5 a of the lighting device housing are connected.

以上のように、フィン1aとこのフィン1aが嵌合される照明装置筐体5の溝部5aに、相互に接触するようにLED素子3の通電用の電極を備えたので、基板1と照明装置筐体5の取り付けと同時に電気的接続がされ、電気的接続作業を省くことができる。   As described above, since the electrode 1 for energizing the LED element 3 is provided in the groove 5a of the lighting device housing 5 in which the fin 1a and the fin 1a are fitted so as to contact each other, the substrate 1 and the lighting device The electrical connection is made simultaneously with the mounting of the housing 5, and the electrical connection work can be omitted.

実施の形態5.
図6の(a)(b)はこの発明の実施の形態5を示すLED照明装置の断面図、図7は図6(a)の分解斜視図である。図において、実施の形態1と同一または相当部分には同一符号を付け説明を省略する。
Embodiment 5. FIG.
6 (a) and 6 (b) are cross-sectional views of an LED lighting device showing Embodiment 5 of the present invention, and FIG. 7 is an exploded perspective view of FIG. 6 (a). In the figure, the same or corresponding parts as those in the first embodiment are denoted by the same reference numerals, and description thereof is omitted.

図6(a)に示すLED照明装置は、基板1の側面に突設されたフィン1a及びこのフィン1aに対応する照明装置筐体5の溝部5aが螺旋状に形成されており、フィン1aは係止部1hを兼ね、溝部5aは被係止部5hを兼ねている。
図6の(b)に示すLED照明装置は、基板1の裏側に複数のフィン1aが設けられ、フィン1aの内、外側のフィン1aの側面に断面三角形状の係止部1hが螺旋状に形成され、照明装置筐体5の外側の溝部5aに係止部1hに係止される被係止部5hが螺旋状に形成されている。
In the LED illumination device shown in FIG. 6A, a fin 1a protruding from the side surface of the substrate 1 and a groove 5a of the illumination device housing 5 corresponding to the fin 1a are formed in a spiral shape. The groove portion 5a also serves as the locked portion 5h.
In the LED lighting device shown in FIG. 6B, a plurality of fins 1a are provided on the back side of the substrate 1, and a locking portion 1h having a triangular cross section is spirally formed on the side surface of the outer fin 1a among the fins 1a. A locked portion 5h that is formed and is locked to the locking portion 1h in the groove 5a outside the lighting device housing 5 is formed in a spiral shape.

基板1を照明装置筐体5に取り付けるときは、基板1のフィン1a(係止部1h)を、照明装置筐体5の溝部5a(被係止部5h)にねじ込んで固定する。   When attaching the board | substrate 1 to the illuminating device housing | casing 5, the fin 1a (locking part 1h) of the board | substrate 1 is screwed and fixed to the groove part 5a (locked part 5h) of the illuminating device housing | casing 5. FIG.

以上のように、フィン1aの一部をなす係止部1hを、螺旋状に形成したので、基板1を照明装置筐体5へ取り付ける作業を容易にするとともに、基板1を確実に装着することができる。
なお、本実施の形態では、係止部1hを外側に設け、断面三角形状としたが、外側から例えば2番目でもよく、断面を4辺形状としてもよい。
As described above, since the locking portion 1h forming a part of the fin 1a is formed in a spiral shape, it is easy to attach the substrate 1 to the lighting device housing 5, and the substrate 1 is securely attached. Can do.
In the present embodiment, the locking portion 1h is provided on the outside and has a triangular cross section. However, for example, it may be the second from the outside, and the cross section may have a four-sided shape.

この発明の実施の形態1を示すLED照明装置の断面図である。It is sectional drawing of the LED lighting apparatus which shows Embodiment 1 of this invention. この発明の実施の形態1を示すLED照明装置の分解斜視図である。It is a disassembled perspective view of the LED lighting apparatus which shows Embodiment 1 of this invention. この発明の実施の形態2を示すLED照明装置の断面図である。It is sectional drawing of the LED lighting apparatus which shows Embodiment 2 of this invention. この発明の実施の形態3を示すLED照明装置の分解斜視図である。It is a disassembled perspective view of the LED lighting apparatus which shows Embodiment 3 of this invention. この発明の実施の形態4を示すLED照明装置の断面図である。It is sectional drawing of the LED lighting apparatus which shows Embodiment 4 of this invention. この発明の実施の形態5を示すLED照明装置の断面図である。It is sectional drawing of the LED lighting apparatus which shows Embodiment 5 of this invention. この発明の実施の形態5を示すLED照明装置の分解斜視図である。It is a disassembled perspective view of the LED lighting apparatus which shows Embodiment 5 of this invention.

符号の説明Explanation of symbols

1 基板、1a フィン、1b、1c、1d、1e、1f、1h 係止部、2 反射材、3 LED素子、4 樹脂、5 照明装置筐体、5a 溝部、5b、5c、5d、5e、5f、5h 被係止部、5g 差し込み口、6 電極。
1 Substrate, 1a Fin, 1b, 1c, 1d, 1e, 1f, 1h Locking portion, 2 Reflector, 3 LED element, 4 Resin, 5 Illuminating device housing, 5a Groove, 5b, 5c, 5d, 5e, 5f 5h Locked part, 5g insertion port, 6 electrodes.

Claims (6)

反射材が設けられた凹部を前面に有する基板と、
前記凹部の底面に実装されたLED素子と、
前記基板の裏側に設けられた複数のフィンと、
これらのフィンが各々着脱可能に嵌合される溝部を有する照明装置筐体と、
前記フィンまたは前記基板の側面側に突設されフィンの一部をなす係止部と、
前記照明装置筐体の前記溝部に形成され、前記係止部に係止されて前記基板と前記照明装置筐体を固定する被係止部と、
を備えたことを特徴とするLED照明装置。
A substrate having a concave portion provided with a reflector on the front surface;
LED elements mounted on the bottom surface of the recess,
A plurality of fins provided on the back side of the substrate;
An illuminating device housing having groove portions into which these fins are detachably fitted, and
A locking part protruding from the side of the fin or the substrate and forming a part of the fin;
A locked portion that is formed in the groove portion of the lighting device housing and is locked to the locking portion to fix the substrate and the lighting device housing;
An LED lighting device comprising:
前記係止部は、前記基板の前記凹部の中心軸に対して左右対称に設けられたことを特徴とする請求項1記載のLED照明装置。   The LED lighting device according to claim 1, wherein the locking portion is provided symmetrically with respect to a central axis of the concave portion of the substrate. 前記係止部は、前記基板の前記凹部の中心軸に対して左右非対称に設けられたことを特徴とする請求項1記載のLED照明装置。   The LED lighting device according to claim 1, wherein the locking portion is provided asymmetrically with respect to a central axis of the concave portion of the substrate. 前記照明装置筐体の前記被係止部に、前記フィンに設けた前記係止部が係止される係止位置とは異なった位置に、前記係止部が差し込まれる差し込み口を設けたことを特徴とする、請求項1〜3のいずれかに記載のLED照明装置。   The locking portion of the lighting device housing is provided with an insertion port into which the locking portion is inserted at a position different from a locking position where the locking portion provided on the fin is locked. The LED lighting device according to claim 1, wherein: 前記フィンとこのフィンが嵌合される照明装置筐体の溝部に、相互に接触するように前記LED素子の通電用の電極を備えたことを特徴とする請求項1〜4のいずれかに記載のLED照明装置。   The electrode for energization of the said LED element was provided in the groove part of the illuminating device housing | casing with which this fin and this fin are fitted so that it may mutually contact. LED lighting device. 前記フィンの一部をなす係止部を、螺旋状に形成したことを特徴とする請求項1記載のLED照明装置。
The LED lighting device according to claim 1, wherein a locking portion forming a part of the fin is formed in a spiral shape.
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