JP3125529U - Radiant heat dissipation structure - Google Patents

Abstract

An object of the present invention is to provide a new heat dissipation mechanism that is simple to assemble and manufacture and has high heat dissipation efficiency.
A radiation heat dissipating structure 1 of the present invention comprises a frame 3 having a concave portion 2 capable of accommodating a heat generating source H at a central portion, and the periphery of the bottom of the frame 3 is projected substantially horizontally outward. (I) The recess 2 has a shape that fits the heat source H, and when the heat source H is accommodated, the inner bottom 5 of the recess 2 and the bottom of the heat source H are It is formed so as to be in close contact with each other, and the highest portion U of the heat generation source H is formed at the same position as or lower than the upper edge 6 of the recess 2, and (ii) the structure 1 emits radiation It is made of heat-dissipating ceramics.
[Selection] Figure 1

Description

  The present invention relates to all industrial fields that require a heat-dissipating mechanism of a heat source, such as electronic equipment fields such as communication / information equipment and electrical equipment fields.

  In recent years, various electronic and electrical products having a built-in heat source have been required to have higher performance. For example, in an LED package, high brightness is required for use in liquid crystal backlights, various displays, and illumination. However, in products using conventional resin type packages, heat radiation is not properly performed, and there is a problem that the heat generation of the heat source causes deterioration of the function of the heat source itself and the product incorporating the heat source or failure. It was. As a solution to this problem, conventionally, measures have been taken to cool the vicinity of the heat source by utilizing a convection phenomenon, such as incorporating an air cooling / water cooling fan or a radiator (heat sink) in the product. However, since such fans and heat sinks are bulky, there is a problem that does not meet the recent demands for miniaturization of products and members.

  Further, as another countermeasure, the combined use of a heat conductive silicone and a heat conductive sheet has been attempted, but such a conventional heat conductive material is inferior in terms of heat dissipation even if the thermal conductivity is good, and a sufficient heat dissipation effect is obtained. There is also a problem that the structure of the product becomes complicated. For example, in a conventional apparatus, heat generated from an LED is led to a pressed conductor mainly made of copper through an LED terminal, and the guided heat is partially emitted from the pressed conductor, and is also conducted to the back surface of the LED electrode. Silicone and a heat conductive insulating sheet are provided, and the heat generated by the LED electrode is conducted from the heat conductive silicone to the separately attached aluminum frame through the heat conductive insulating sheet, and is radiated to the outside. That is, in this device, the cooling effect is secured by heat diffusion or heat dissipation by heat conduction, but the conventional heat conductor used has excellent heat conductivity and absorbs a lot of heat. However, the heat radiation is insufficient, the cooling mechanism itself accumulates heat, and when the temperature of the cooling mechanism approaches the ambient temperature, there is a problem that the heat is no longer absorbed and the cooling function is not performed. The structure of the device is obviously complicated. Many other conventional devices, like this conventional device, have a heat dissipation effect based on a structural design that focuses on heat conduction, and still have insufficient heat radiation, making the device structure complicated and complicated to manufacture. It is accompanied by. Therefore, there is still a demand for a new heat dissipation mechanism that is easy to assemble and manufacture and has high heat dissipation efficiency.

  Therefore, the inventors, etc., this time, in the three-dimensional structure having a recess that can accommodate a heat source, the structure is composed of a ceramic of a radioactive heat dissipation material, and the opening of the recess is configured to face upward. The heat generation accommodated in the concave portion by burying the heat generation source accommodated in the concave portion and ensuring as much as possible a close contact state with the heat generation source accommodated inside the concave portion. We found that the heat dissipation effect of the source was significantly increased and completed the present invention.

  That is, the present invention consists of a frame body having a concave portion opening in the center, and a support portion is formed by projecting the periphery of the bottom portion of the frame body substantially horizontally to the outside. A self-supporting structure in which the concave portion has a shape suitable for the heat source, and the inner bottom portion of the concave portion and the bottom portion of the heat source are in close contact with each other when the heat source is accommodated. And the highest part of the heat source is formed so as to fit in the same position as or lower than the upper edge of the recess, and the structure is made of radiant heat radiation ceramics. It is related with the radiation heat dissipation structure (henceforth a 1st structure) characterized by these.

  The present invention also includes a flat frame having a plurality of recesses opened upward in parallel, each of the recesses having a support portion formed by projecting the periphery of the bottom of the frame substantially horizontally outward. A self-supporting structure capable of accommodating a heat source, wherein each of the recesses has a shape suitable for the heat source accommodated in the recess, and when the heat source is accommodated, an inner bottom portion of the recess And the bottom of the heat source are in close contact with each other, and the highest part of the housed heat source is molded so as to be in the same position as the upper edge of the recess or in a position lower than that, and The present invention relates to a radiation heat dissipating structure (hereinafter referred to as a second structure) capable of accommodating a plurality of heat sources, wherein the structure is made of a radiation heat dissipating ceramic.

The present invention further relates to the radiation heat dissipating structure, wherein the frame body has one or a plurality of holes penetrating from the inside of the concave portion to the outside of the frame body.
Here, in the description of the present specification, the “shape suitable for the heat source” means that when the heat source is accommodated in the concave portion of the structure, the heat source is 0 to 1.0 mm at the side and bottom. The shape which opposes the inner wall of the said recessed part at intervals and complements the said recessed wall is meant.

All of the structures of the present invention have a radiation heat dissipation material, that is, a material having both high thermal conductivity that sufficiently absorbs heat from the heat source and high thermal emissivity that effectively radiates the conducted heat. Therefore, in combination with the structural features, an excellent heat dissipation effect that cannot be obtained by a conventional heat dissipation structure using a heat dissipation material is obtained. It is desirable that the radiation-dissipating material used in the structure of the present invention is electrically insulating at the same time, and as such a material, paying attention to Al ₂ O _{3 which} has good radiation-dissipating property, especially metal is used as the material. without using a so-called common pottery, using the inorganic material used for the porcelain (ceramic), preferably ceramic thermal radiation of solid wood to be created through the sintering step, among them, the Al ₂ O ₃ Ceramic heat radiation with a content of 95% by weight or more, in particular, Al ₂ O ₃ content of 95% by weight or more, thermal conductivity of 30-60W / m · K and thermal emissivity of 0.93-0.99 Solids are preferred. Such ceramic heat-radiating solids do not affect electromagnetic waves such as absorption and reflection, and according to the structure of the present invention using them, it is possible to suppress leakage current and noise at a high level. . Note that “thermal emissivity” in the present specification means the proportion of heat absorbed by an object and then released (radiated) to the outside by the object.

  Each of the structures of the present invention accommodates a heat source inside the recess, directly absorbs the heat generated by the heat source in the recess, and radiates and radiates a part of the absorbed heat from the peripheral side wall surface of the recess. A part of the heat absorbed by the concave portion is conducted to the protruding portion around the bottom of the frame body, and radiated and radiated from the surface of the protruding portion. The first structure of the present invention has a concave portion having a shape suitable for a heat source to be accommodated in a central portion at an upper opening, and has various shapes in which the periphery of the bottom portion protrudes substantially horizontally outward. Depending on the amount of heat generation and size of the heat source to be housed, the space around the heat source and the location of the installation location, etc., the height and thickness of the frame side wall around the recess, and The degree of protrusion at the bottom of the frame can be changed. The second structure of the present invention is a flat shape such as a plate shape or a trapezoid shape made of a radiation heat dissipating material, and has a plurality of concave portions at predetermined intervals on the upper surface thereof, and around the bottom of the frame body It consists of a frame of various shapes that protrudes almost horizontally to the outside, depending on the amount of heat generated and the size of the individual heat sources to be accommodated, the space around each heat source, the location where it is installed, etc. The height, the thickness of the outer wall of the frame, the degree of protrusion at the bottom of the frame, the interval between the adjacent recesses, and the like can be appropriately changed.

  In addition, it has been confirmed by the inventors that all the frame bodies in the present invention achieve an excellent heat generation effect when they have a volume that is 0.5 times or more the total volume of the heat generation source accommodated. Moreover, the first structure of the present invention that is versatile generally has a height of 110 to 300% of the height of the heat source to be accommodated, and is a book for accommodating a plurality of heat sources having different shapes. The second structure of the invention is generally convenient having a height of 110-300% of the height of the tallest heat source.

  The said recessed part in the structure of this invention has a shape suitable for the heat generating source accommodated, and the heat absorption amount increases, so that the contact area with the heat generating source accommodated is large, and is preferable. That is, the concave portion is preferably formed so that at least the inner bottom portion thereof is in close contact with the bottom portion of the heat source to be accommodated, and the inner side wall is also formed to be in close contact with the side wall of the heat source to be accommodated. More preferably. And it has been confirmed by the devised designers that the closer the close contact between the inner wall of the recess and the surface of the heat source, the higher the heat dissipation effect. However, when the inner bottom portion of the concave portion is formed so as to be in close contact with the bottom portion of the heat source, the distance between the inner side wall of the concave portion and the side wall of the heat source facing the concave portion is less than 0.1 mm. It has been confirmed by the inventors that there is no significant influence on the heat dissipation effect of the structure. However, when this gap is 0.1 mm or more and less than 1.0 mm, the gap may be filled with a conductive adhesive such as a conductive paste mainly composed of silver. The heat dissipation efficiency of the structure can be maintained.

  The concave portion is arranged so that the contained heat source does not protrude from the upper edge of the concave portion, that is, the highest portion of the accommodated heat source is the same as or lower than the upper edge of the concave portion. The heat generating source is buried in the recess so that as much heat as possible can be absorbed from the heat generating source. Moreover, generally the frame bottom part under the said recessed part is excellent in the thermal radiation effect, so that it is thick.

  The support part in the present invention fulfills the function of stabilizing the frame body as well as the function of radiating and radiating heat. The supporting portion may be formed by annularly projecting the periphery of the bottom of the frame, or may be formed by partially projecting the periphery of the bottom at a predetermined interval. It protrudes in a shape and arrangement that can stably support the center of the frame. The support portion is formed so as to protrude continuously and integrally around the bottom of the frame body, and is formed by fusing and integrating a material molded separately from the frame body around the frame bottom portion. However, in order to obtain excellent heat dissipation efficiency, it is preferable to use a die or the like that is integrally pressed with the frame.

  For example, a single heat source that requires heat dissipation is a prismatic shape with a size of 5 to 30 mm in length × 5 to 30 mm in width × 5 to 30 mm in height, or a cylindrical shape with a size of 5 to 30 mm in diameter × 5 to 30 mm in height In some cases, as an aspect of the first structure of the present invention that accommodates the frame, the frame has a height of 110 to 300% of the height of the heat source, and the side wall of the frame has the support portion. The upper part has a thickness of 5 to 30 mm around the recessed part, the support part has a height of 10 to 90% of the height of the frame body, and 5 to 5 around the bottom part of the frame body A column that fits to the heat source and protrudes to the outside of 15 mm, and in which the concave portion at the center of the upper surface of the frame has a depth that is not less than the height of the heat source and not more than 95% of the height of the frame. The thing which is a cavity of shape is mentioned.

  For example, there are multiple heat sources that require heat dissipation, each of which is a prismatic shape with a size of 5 to 30 mm in length × 5 to 30 mm in width × 5 to 30 mm in height, or a cylindrical shape with a size of 5 to 30 mm in diameter × 5 to 30 mm in height In the case of the second structural body of the present invention that accommodates the frame, the frame body is 110% to 300% higher than the highest heat source among the plurality of heat sources. And the side wall has a thickness of 5 to 30 mm outside the concave portion above the support portion, and the support portion has a height of 10 to 90% of the height of the frame body. And protrudes 5 to 15 mm around the bottom of the frame, and each recess on the upper surface of the frame is 95% or less of the height of the frame above the height of the heat source to be accommodated And a column-shaped cavity that fits the heat source.

  Each of the frame bodies in the first and second structures of the present invention can be provided with one or a plurality of holes penetrating from the inside of the recess to the outside of the frame body. That is, when the heat source to be accommodated has a terminal at the bottom, the bottom of the frame can be provided with the shape and the number of holes corresponding to the terminal, and the heat source terminal corresponding to the hole, By inserting from the inside of the concave portion to the lower outside of the frame body, the bottom portion of the concave portion and the bottom portion of the heat source can be brought into contact, and the heat source can be accommodated in the concave portion in an embedded state. It becomes possible. Such holes are provided, for example, with a diameter larger by 0.1 to 0.3 mm than the diameter of the terminal of the inserted frame.

The structure of the present invention allows part of the heat generated by the heat source to escape from the upper opening of the recess, absorbs the generated heat to the maximum possible, and radiates and radiates from the side wall around the recess of the frame. At the same time, part of the absorbed heat is released to the support part and can be radiated and radiated from the support part, thereby achieving a significantly superior heat dissipation effect. In addition, the structure of the present invention can be stably self-supporting in an appropriate shape according to the situation of the installation location, is easy to handle, and is easy to manufacture. Moreover, the structure of the present invention having the hole at the bottom of the frame body can also accommodate a heat source having a terminal in a desired manner, and can achieve extremely excellent heat generation efficiency. Furthermore, the structure of the present invention having a plurality of the concave portions can accommodate a plurality of heat sources and achieve an excellent heat generation effect. In addition, the present invention uses a ceramic heat-radiating solid material having a thermal conductivity of 30 to 60 W / m · K and a thermal emissivity of 0.93 to 0.99 as the material, particularly with an Al ₂ O ₃ content of 95% by weight or more. According to the structure, leakage current and noise can be suppressed at a high level.

1 to 3 show specific examples of the radiation heat dissipation structure of the present invention.
[Example 1]
A structure 1 of the present invention shown in FIG. 1 is for accommodating a heat source H having a substantially flat bottom portion having a cubic shape of 10 mm long × 10 mm wide × 10 mm high. The structure 1 is composed of a deformed quadrangular prism-shaped frame 3 projecting around the bottom. That is, the frame 3 has a height h of 25 mm, the outer peripheral cross section of the portion 9 from the bottom surface of the frame 3 to the upper 15 mm is a square with a side of 40 mm (e), and the outer peripheral cross section of the upper portion 8 of the portion 9 Is a square, deformed quadrangular prism shape with a side of 30 mm (d). At the center of the upper surface of the frame 3, a cube-shaped recess 2 having a length (a) 10.05 mm × width (b) 10.05 mm × depth (c) 10.05 mm is provided. The periphery of the bottom of the frame 3 protrudes outward with a width w of 5 mm to form a support 4 having a height of 15 mm. The bottom 5 of the recess 2 is formed to be substantially flat.

With this configuration, the structure 1 allows the heat source H in the concave portion 2 to have a space of 0.05 mm or less between the concave portion inner side wall and the heat source side wall with the concave portion bottom 5 and the bottom surface of the heat source H in close contact with each other. The upper surface U of the heat generation source H that can be accommodated in a space is accommodated in a position that is approximately 0.05 mm lower than the upper edge 6 of the recess 2. The structure 1 of the present invention shown in FIG. 1 can be stably placed on a printed circuit board (not shown).
A conductive paste may be appropriately filled in the gap between the side surface of the heat generation source H accommodated and the inner wall surface of the recess 2.

The structure 1 of the present invention shown in FIG. 1 is made of a ceramic radioactive solid material having the following physical properties.
(I) The content of Al ₂ O ₃ is 95% by weight or more.
(Ii) The thermal conductivity measured by a laser flash method (JIS R1611) using a measuring instrument [TS-7000 ULVAC-RIKO Co., Ltd.] is 30 W / m · K.
(Iii) The thermal emissivity measured in the measurement region 370 to 7800 cm ⁻¹ by an FTIR apparatus [Perkin Elmer system 2000 type] is 0.93 to 0.99.

[Example 2]
A structure 1 ′ of the present invention shown in FIG. 2A is for accommodating a cube-shaped heat source H ′ having a length of 10 mm × width of 10 mm × height of 10 mm having two terminals T with a diameter of 1.5 mm at the bottom. . The structure 1 'of the present invention shown in this figure is the frame 3 shown in FIG. 1 except that two holes 7 having a diameter of 1.8 mm are provided at intervals of 3 mm in the bottom of the frame 3 shown in FIG. It consists of frame body 3 'of the same composition.
According to the structure 1 ′ of the present invention shown in FIG. 2A, each terminal T of the heat source H ′ is inserted into the hole 7 of the corresponding frame 3 ′ from the inside of the recess 2 ′, and into the inside of the recess 2 ′. The heat source H ′ can be accommodated in a state where the bottom of the heat source H ′ is in close contact with the inner bottom portion 5 ′ of the recess, and the upper surface U ′ of the heat source H ′ is the upper edge 6 ′ of the recess 2 ′ of the frame 3 ′. It does not protrude from.
As shown in FIG. 2B, a silver electrode portion E is provided outside the bottom of the frame 3 ′, and the electrode portion E and the heat source terminal T penetrating the hole 7 are fixed by soldering R or the like. In addition, by doing so, the terminal T does not come out or shift from the hole 7, and the heat source H ′ can be more stably accommodated and held in the concave portion 2 ′.

[Example 3]
The structure (1′-2) of the present invention shown in FIG. 2C is for accommodating a heat source (H′-2) having a substantially flat bottom and a cylindrical shape having a diameter of 10 mm × height of 10 mm. It is. This structure (1′-2) is a cylindrical recess having a diameter (a′-2) of 10.05 mm × depth of 10.05 mm, instead of the cubic pillar-shaped recess 2 on the upper surface of the frame 3 shown in FIG. It is composed of a frame (3′-2) having the same configuration as the frame 3 shown in FIG. 1 except that (2′-2) is provided. This structure (1′-2) also has the heat source (H′-2) in the recess (2′-2), the bottom of the recess and the bottom surface of the heat source (H′-2) in close contact with each other. (H'-2) can be accommodated with a gap of 0.05 mm or less between the side wall of the recess (2'-2) and the upper surface of the accommodated heat source (H'-2) It does not protrude from the upper edge of the recess (2′-2).

[Example 4]
The structure 1 ″ of the present invention shown in FIGS. 3A and 3B accommodates three cube-shaped heat sources H ″ having a length of 10 mm × width of 10 mm × height of 10 mm having two terminals T ″ having a diameter of 1.5 mm at the bottom. This structure 1 "is composed of a flat deformed quadrangular prism-shaped frame 3" protruding around the bottom. That is, the frame 3 "has a height h" of 20 mm, The outer peripheral cross section of the portion 9 "from the bottom of the frame 3" to the upper 10mm is a rectangular parallelepiped of vertical (e "-1) 50mm x horizontal (e" -2) 92mm, and the outer peripheral cross section of the upper portion 8 " Is a rectangular, deformed quadrangular prism shape of 30 mm in length (d "-1) x 72 mm in width (d" -2). On the upper surface of the frame 3 ″, there are three recesses 2 ″ hollowed in a cube shape of length (a ″) 10.05 mm × width (b ″) 10.05 mm × depth (c ″) 10.05 mm, with a distance of 10 mm. (K) is provided, and the periphery of the bottom of the frame 3 "protrudes outward with a width (w") of 10 mm to form a support 4 "having a height of 10 mm. The bottom 5 ″ of the recess 2 ″ is formed substantially flat and has two holes 7 ″ each having a diameter of 1.8 mm.

  With this configuration, the structure 1 ″ of the present invention is configured such that in the recess 2 ″, the terminal T ″ of the housed heat source H ″ is inserted into the hole 7 ″ so that the recess bottom 5 ″ and the bottom surface of the heat source H ″ And the heat source H "can be accommodated with a gap of 0.05 mm or less from the side wall of the recess, and the upper surface U" of the stored heat source H "is more than the upper edge 6" of the recess 2 ". It is about 0.05 mm lower and does not protrude from the upper edge 6 ". The structure 1" of the present invention can be stably placed on a printed circuit board (not shown). The structure 1 "of the present invention is also made of the same ceramic radioactive solid material as the structure 1 of the present invention shown in FIG.

[Example 5]
The structure (1 "-2) of the present invention shown in FIG. 3C can accommodate three cylindrical heat sources (H" -2) each having a diameter of 10 mm and a height of 10 mm. This structure (1 ″ -2) has a diameter (a ″ −2) of 10.05 mm × depth in place of the cubic pillar-shaped recess 2 ″ provided on the upper surface of the frame 3 ″ shown in FIGS. 3A and 3B. A frame 3 shown in FIGS. 3A and 3B, except that three recesses (2 ″ -2) hollowed into a cylindrical shape of 10.05 mm are provided with an interval of 10 mm (k ″ -2). It consists of a frame (3 "-2) with the same structure as". This structure (1 "-2) has a heat source (H" -2) in each recess (2 "-2), a bottom surface of the heat source (H" -2) and a bottom surface of the recess (2 "-2). Can be accommodated with a gap of 0.05 mm or less between the side wall of the recess (2 "-2) and the side wall of the heat source (H" -2). The upper surface of H ″ -2) does not protrude from the upper edge of the recess (2 ″ -2).

[Example 6]
The heat dissipation effect of the structure of the present invention was evaluated as follows.
A heat source [mica heater (rated 30 W, rated 10 mm in diameter) with a current of 64 V and 0.49 A flowing when the structure 1 ′ of the present invention shown in FIG. 2 is used and when a conventional metal aluminum substrate is used. X height 5 mm)] was measured and evaluated by a surface thermometer [HFT-40 Anritsu Meter Co., Ltd.]. The results are shown in Table 1. In the case of using the structure 1 ′ of the present invention, a mica heater is accommodated in the recess 2 ′ of the structure 1 ′, and in the case of using a conventional metal aluminum substrate, two holes having a diameter of 1.8 mm are formed. On the metal aluminum substrate (vertical 20 mm × width 20 mm × thickness 2 mm), the same mica heater was stably held by passing the terminal through the hole.

From Table 1, the excellent heat dissipation effect of the structure of the present invention is clear.
That is, the structure of the present invention exhibits a very excellent temperature control function of maintaining a constant equilibrium temperature after providing a high cooling effect to the heat source in the early stage of heat generation. The structure of the present invention is a device to be applied by determining the size, shape, etc. of the frame and the support from various factors such as the heating temperature of the heating element and the desired equilibrium temperature after initial cooling. -A cooling mechanism having an optimal cooling action can be designed according to the device or the like.

[Example 7]
The noise suppression effect of the structure of the present invention was evaluated as follows.
Using the FTIR apparatus (Perkin Elmer, System 2000 type) equipped with an integrating sphere (Labsphere, RSA-PE-200-ID), the ceramic radioactive material constituting the structure of the present invention shown in FIGS. The infrared radiation characteristics of a solid material (ceramic radioactive solid material) made of the same material as the solid material and a conventional alumina ceramic were measured. The measurement area was 1800-7800 cm ⁻¹ , the number of integrations was 200 times, the light source was MIR, the detector was MIR-TGS, and the resolution was 16 cm ⁻¹ . The results are shown in FIG.
From FIG. 4, regarding the infrared radiation intensity curve, the ceramic radioactive solid has a single line with small waves in the wave number range of 2000 to 6000 cm ⁻¹ (FIG. 4A). On the other hand, in the general alumina ceramic, an abnormal peak (noise N) that induces noise and image flickering is generated in the vicinity of 2500 cm ⁻¹ and 4000 cm ⁻¹ (FIG. 4B). It can be seen from this result that the structure of the present invention is made of the same material as the ceramic radioactive solid and exhibits a noise suppressing effect.

FIG. 1 is a diagram showing an embodiment of a structure of the present invention for housing a heat source without a terminal. 1A is a longitudinal sectional view, and FIG. 1B is a plan view. FIG. 2 is a diagram showing another embodiment of the structure of the present invention. FIG. 2A is a longitudinal sectional view showing an aspect of the structure of the present invention for accommodating a prismatic heat source with terminals. FIG. 2B is a longitudinal sectional view showing an aspect of the structure of the present invention that can more stably accommodate the heat source shown in FIG. 2A. FIG. 2C is a plan view showing an aspect of the structure of the present invention for housing a cylindrical heat source. FIG. 3 is a diagram showing various aspects of the structure of the present invention that can accommodate a plurality of heat sources. 3A shows a longitudinal longitudinal sectional view of one embodiment of the structure of the present invention for accommodating a plurality of prismatic heat sources with terminals, and FIG. 3B shows a plan view of the structure shown in FIG. 3A. . FIG. 3C shows a plan view of an embodiment of the structure of the present invention for accommodating a plurality of cylindrical heat sources. FIG. 4 is a graph showing the noise suppression effect of the structure of the present invention in comparison with conventional alumina ceramics. FIG. 4A shows an infrared radiation intensity curve of a ceramic radioactive solid, and FIG. 4B shows an infrared radiation intensity curve of a conventional alumina ceramic.

Explanation of symbols

1, 1 ', 1'-2, 1 ", 1" -2 Structure 2, 2', 2'-2, 2 ", 2" -2 of the present invention Recess 3, 3 ', 3'-2, 3 ", 3" -2 Frame 4, 4 ', 4'-2, 4 ", 4" -2 Support section 5, 5', 5 "Bottom section 6, 6 ', 6" Top edge 7, 7 of recess "Hole a, a" Depth length b, b "Depth width c, c" Depth depth a'-2, a "-2 Depth diameter d Perimeter cross section of frame upper part Side length d "-1 Vertical length d" -2 of the outer peripheral cross section of the upper part of the frame body Horizontal length e of outer peripheral cross section of the upper part of the frame body Length of one side of the outer peripheral cross section of the bottom of the frame body e "-1 Vertical length of the outer peripheral cross section of the bottom of the frame e" -2 Horizontal length of the outer peripheral cross section of the bottom of the frame h, h "Height of the frame k, k" -2 Between the recesses Interval w, w "Protrusion width of support part
H, H ', H'-2, H ", H" -2 Heat source U, U', U "Upper surface of heat source E Silver electrode part R Solder T Heat source terminal
N noise

Claims (7)

A self-supporting structure comprising a frame having a concave portion opening upward in the center, and having a support portion formed by projecting the periphery of the bottom of the frame substantially horizontally to the outside. Can accommodate
The concave portion has a shape adapted to the heat source, and when the heat source is accommodated, the inner bottom portion of the concave portion and the bottom portion of the heat source are in close contact with each other, and the highest portion of the heat source Is formed so as to fit in the same position as or lower than the upper edge of the recess, and
A radiation heat dissipation structure, wherein the structure is made of a radiation heat dissipation ceramic. A self-supporting structure comprising a flat frame having a plurality of recesses opened upward in parallel, wherein the support is formed by projecting the periphery of the bottom of the frame substantially horizontally outward, A heat source can be accommodated in each of the recesses;
Each of the recesses has a shape suitable for the heat source accommodated in the recess, and when the heat source is accommodated, the inner bottom portion of the recess and the bottom portion of the heat source are in close contact with each other, and The highest portion of the housed heat source is shaped to fit in the same position as or lower than the upper edge of the recess, and
A radiation heat dissipating structure capable of accommodating a plurality of heat sources, wherein the structure is made of a radiation heat dissipating ceramic. The radiation heat dissipating structure according to claim 1 for accommodating a prismatic or cylindrical heat generating source,
The frame has a height of 110 to 300% of the height of the heat source, and its side wall has a thickness of 5 to 30 mm around the recess above the support;
The support portion has a height of 10 to 90% of the height of the frame body, and the periphery of the bottom portion of the frame body protrudes outside by 5 to 15 mm;
2. The concave portion is a columnar cavity adapted to the heat source, and has a depth not less than the height of the heat source and not more than 95% of the height of the frame. The radiation heat dissipation structure as described in 1. The radiation heat dissipating structure according to claim 2 for housing a heat source having the same or different shape of a prismatic shape or a cylindrical shape,
The frame body has a height of 110 to 300% of the height of the highest heat source, and its side wall has a thickness of 5 to 30 mm outside the concave portion above the support portion. ,
The support portion has a height of 10 to 90% of the height of the frame body, and the periphery of the bottom portion of the frame body protrudes 5 to 15 mm,
Each of the recesses is a columnar cavity adapted to the heat source to be accommodated, and has a depth not less than the height of the heat source to be accommodated and not more than 95% of the height of the frame. The radiating and heat dissipating structure according to claim 2, wherein The concave portion is shaped such that when the heat source is accommodated, an interval between an inner side wall of the concave portion and a side wall of the accommodated heat source is 0 to 0.1 mm. Item 5. The radiation heat dissipating structure according to any one of Items 1 to 4. The radiation heat dissipation property according to any one of claims 1 to 5, wherein the frame body has one or a plurality of holes penetrating from the inside of the concave portion to the lower outside of the frame body. Structure. The radiative heat dissipation ceramic is characterized by having an Al ₂ O ₃ content of 95% by weight or more, a thermal conductivity of 30 to 60 W / m · K, and a thermal emissivity of 0.93 to 0.99. The radiation heat dissipating structure according to any one of claims 1 to 6.

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