JP2008252141A - Led-lighting device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To supply a LED-lighting device capable of efficiently discharging heat generated from a LED element to the outside, and capable of alleviating the effect of heat to a direct current power source circuit. <P>SOLUTION: The LED-lighting device has installed a LED-mounted substrate with a LED element mounted; a radiation means provided on the LED-mounted substrate; a direct current power source circuit for outputting a predetermined direct current voltage, while receiving a commercial power source; and a cover for storing the LED-mounted substrate, the radiation means and the direct current power source circuit. The device is also provided with a heat conducting means for transmitting the heat of the radiation means to the cover. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to an LED lighting device using an LED element as a light source.

  As this type of LED lighting device, there is one disclosed in Japanese Patent Laid-Open No. 2001-243809 (Patent Document 1), and FIG. 9 is a side view with a part thereof cut away. This LED lighting device has a power feeding function, and has a bottomed cylindrical base 11 having an opening, and a trumpet shape extending from the opening at the base end to the opening at the tip, and the opening at the base end is the base. 11 is a heat dissipating means attached to the inner wall surface of the opening portion 11 through an insulator, specifically, a trumpet-shaped metal heat dissipating portion 12 and an inner surface slightly on the front end side from the opening at the base end of the trumpet-shaped metal heat dissipating portion 12 A high heat conductive member 14 having an insulating property provided in a ring shape, and an LED mounting substrate having a base end fixed to the high heat conductive member 14 and provided inside the trumpet-shaped metal heat radiating portion 12, specifically, a cylindrical shape Metal substrate 18, LED element 1 mounted on cylindrical metal substrate 18, DC power supply circuit 4 for converting AC to DC provided inside cylindrical metal substrate 18, and DC power supply circuit 4 to which the DC power supply circuit 4 is attached The mounting plate 10 fixed to the metal substrate 18 and L So as to cover the D element 1 is configured to include a trumpet shape metal heat radiation part transparent translucent cover 16 attached to the opening at the tip of 12.

  The cylindrical metal substrate 18 will be described in detail. The cylindrical metal substrate 18 is a bottomed cylindrical metal substrate whose base end is open to the base 11, and an LED is formed on the outer surface of the distal end portion of the cylindrical metal substrate 18. Element 1 is mounted.

  When this LED lighting device is turned on, the LED element 1 emits light and a predetermined illuminance is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, the heat generated from the LED element 1 is caused by gas convection generated in the space Y formed between the translucent cover 16 or the trumpet-shaped metal heat radiating portion 12 and the cylindrical metal substrate 18. In addition to being radiated to the outside via the trumpet-shaped metal heat radiating portion 12, the heat is transmitted from the cylindrical metal substrate 18 to the trumpet-shaped metal radiating portion 12 via the high thermal conductive member 14 and radiated to the outside. Further, the heat generated from the DC power supply circuit 4 is transmitted from the cylindrical metal substrate 18 to the trumpet-shaped metal heat radiating portion 12 through the high heat conducting member 14 and radiated to the outside, and the space inside the cylindrical metal substrate 18 The heat is radiated to the outside through the base 1 by the convection of the gas generated in X, or is radiated from the cylindrical metal substrate 18 to the space Y. In this way, heat of the LED element 1 and the DC power supply circuit 4 is released to the outside, and the LED element 1 and the DC power supply circuit 4 are used within a range that does not exceed the allowable temperature of the components used.

  Further, when this is changed from a light bulb shape to a spotlight shape, the one shown in FIG. 10 can be considered. The LED lighting device houses an LED mounting board 2 on which the LED element 1 is mounted, a DC power supply circuit 4 that receives a commercial power supply and outputs a predetermined DC voltage, and the LED mounting board 2 and the DC power supply circuit 4. A cylindrical cover 5 having an opening on one side and a lens 7 attached to the opening surface of the cover are provided.

  When this LED lighting device is turned on, the LED element 1 emits light and a predetermined light flux is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, the heat generated from the LED element 1 is radiated to the outside through the lens 7 and the cover 5 by convection of gas generated in the space formed between the lens 7, the cover 5 and the LED mounting substrate 2. The heat is transmitted to the cover 5 from the LED mounting board 2 and radiated to the outside, or is radiated to the outside by convection of gas generated in the space X formed between the LED mounting board 2, the cover 5 and the DC power supply circuit 4. . Further, the heat generated from the DC power supply circuit 4 is radiated to the outside by the convection of the gas generated in the space X as described above, and is also transmitted from the DC power supply circuit 4 to the cover 5 and radiated to the outside. In this way, heat generated from the LED element 1 and the DC power supply circuit 4 is released to the outside, and the temperature of components used in the LED element 1 and the DC power supply circuit 4 is lowered to a predetermined value.

Further, although the DC power supply circuit 4 is not provided, a printed circuit board on which the LED element 1 is mounted, such as that disclosed in Japanese Patent Application Laid-Open No. 2002-93206, can be used to dissipate heat generated from the LED element 1. There is a configuration in which heat dissipating means such as aluminum heat dissipating fins are provided on the back surface of the material via an insulating sheet.
JP-A-2001-243809

  However, in the LED lighting device described above, the LED element 1 and the DC power supply circuit 4 are thermally affected through the space X. For example, if the number of LED elements 1 is increased or the current passed through the LED elements 1 is increased in order to increase the light output of the LED lighting device, the amount of heat generated by the LED elements 1 increases, and this heat is converted into direct current. The power supply circuit 4 may be affected. Further, since the DC power supply circuit 4 needs to increase the current supplied to the LED element 1, its own heat generation amount increases, and this heat is transmitted to the metal substrate 18 and the LED mounting substrate 2 through the space X. The temperature of the mounted LED element 1 may be raised.

  Further, in the case of FIG. 10, even if heat dissipating means such as aluminum heat dissipating fins is provided on the LED mounting substrate 2 in order to lower the temperature of the LED element 1, the temperature of the space X is increased. For this reason, since the temperature of the DC power supply circuit 4 also rises, it is necessary to use a DC power supply circuit 4 having a higher thermal stress.

  As the amount of heat generated by the LED element 1 increases in this way, the heat affects the DC power supply circuit 4, and the heat from the DC power supply circuit 4 also affects the LED element 1. Therefore, the heat generated from the LED element 1 is efficiently radiated to the outside, and further, there is room for improvement so that the LED element 1 and the DC power supply circuit 4 have little influence on each other.

  The present invention has been made in view of the above-mentioned reasons. The object of the present invention is to more efficiently dissipate the heat generated from the LED elements to the outside, and to reduce the influence of the heat on the DC power supply circuit. To provide an LED lighting device.

The invention according to claim 1 includes an LED mounting board on which an LED element is mounted, a heat dissipating means provided on the LED mounting board, a DC power supply circuit that receives a commercial power supply and outputs a predetermined DC voltage, and the LED mounting. in the LED lighting device provided with a cover for accommodating a DC power source circuit substrate and the heat dissipating means, and has a plate-like bottom plate, and is provided with heat transfer means in direct contact with the heat dissipation hand stage, further around the bottom plate Is directly in contact with the cover .

  According to a second aspect of the present invention, in the first aspect, the cover includes a light source unit storage cover that stores the LED mounting substrate and the heat dissipation means, and a power source unit storage cover that stores the DC power supply circuit. The part storage cover is a heat transfer means.

  According to a third aspect of the present invention, in the second aspect, a part of the light source unit storage cover is a heat radiating means.

  According to a fourth aspect of the present invention, in any one of the first to third aspects, the heat radiation means and the LED element are joined via an adhesive having good thermal conductivity.

In the invention of claim 1, the LED mounting substrate on which the LED element is mounted, the heat dissipation means provided on the LED mounting substrate, a DC power supply circuit that receives a commercial power supply and outputs a predetermined DC voltage, in the LED lighting device provided with a cover for accommodating the DC power supply circuit and the LED mounting substrate and the heat dissipating means has a plate-like bottom plate, and is provided with heat transfer means in direct contact with the heat dissipation hand stage, further Since the contact area between the LED mounting substrate and the cover is increased by directly contacting the periphery of the bottom plate with the cover, the heat generated from the LED element is radiated to the outside more efficiently. As a result, the temperature of the LED element is lowered, and the influence of heat on the DC power supply circuit can be mitigated.

  According to a second aspect of the present invention, the cover includes a light source unit storage cover that stores the LED mounting substrate and the heat dissipation means, and a power source unit storage cover that stores the DC power supply circuit. When the cover is a heat transfer means, the effect described in claim 1 can be obtained, and the heat from the LED element is hardly transmitted to the DC power supply circuit, and the influence of the heat on the DC power supply circuit can be reduced.

In the invention according to claim 3, when a part of the light source unit storage cover is a heat dissipating means, the effect of claim 2 can be achieved and the number of components of the constituent members can be reduced.
In invention of Claim 4, when the said thermal radiation means and LED element are joined through the adhesive agent with favorable heat conductivity, there exists an effect described in Claim 1 thru | or 3. In addition, the heat of the LED element is transmitted to the heat radiating means more quickly.

(First embodiment)
A first embodiment of the present invention will be described with reference to FIGS. 1 is a sectional view of an LED lighting device, FIG. 2 is a view of a heat transfer means, FIG. 2 (a) is a front view, FIG. 2 (b) is a side view with a part cut away, and FIG. 4 and FIG. 4 are LED mounting substrates, FIG. 4 (a) is a front view, and FIG. 4 (b) is a side view.

  This LED lighting device includes an LED mounting board 2 on which the LED element 1 is mounted, a heat radiation means 3 provided on the LED mounting board 2, a DC power supply circuit 4 that receives a commercial power supply and outputs a predetermined DC voltage, A cover 5 for housing the LED mounting board 2, the heat radiation means 3, and the DC power supply circuit 4 and a lens 7 attached to the opening surface of the cover are provided.

  The LED element 1 is a blue light emitting diode composed of a chip element, wire bonding, and a phosphor with a forward ON voltage of 3.6V. The chip element is a rectangular parallelepiped having a bottom surface of 0.5 mm × 0.5 mm and a height of 0.3 mm, and is formed of a lower insulating layer and an upper semiconductor layer. In the upper semiconductor layer, anode and cathode electrodes are arranged in the diagonal direction, and wiring is made from each of them to the LED mounting substrate 2 by wire bonding.

  The LED mounting board 2 is obtained by processing a printed wiring board with good thermal conductivity into a disk shape, and includes 12 LED elements 1 and electronic parts 20 (chip parts such as transistors, resistors, capacitors, and diodes) that control the LED elements 1. It is mounted on one side as shown in FIG. The mounting of the LED element 1 on the LED mounting board 2 will be described in more detail. The LED element 1 is formed on the LED mounting board 2 with an adhesive agent on the bottom part of the pit provided deeper than the chip element. Has been implemented through. That is, the insulating layer of the chip element is mounted with being bonded to the adhesive. And the fluorescent substance which can change light from blue to white is filled in the hollow provided in the LED mounting substrate 2 so that a chip element may be covered.

  The heat dissipating means 3 is obtained by processing a metal material such as aluminum into a disk shape substantially equivalent to the LED mounting substrate 2, and is integrated with the LED mounting substrate 2 on the back surface of the LED mounting substrate 2 so that the LED element 1 is easily radiated. Installed.

  The DC power supply circuit 4 inputs commercial AC 100V and outputs DC 24V, and is mounted on a printed wiring board having a disk shape substantially equivalent to the LED mounting board 2. Further, the cover 5 is formed in a substantially bottomed cylindrical shape having an opening above the resin material, and a power terminal block for receiving a commercial power source is provided below the bottom surface of the cover 5. Is provided with a hole for drawing a power line from the power terminal block. A DC power supply circuit 4 is attached to a substantially middle portion between the bottom surface portion and the opening of the cover 5, and an LED mounting substrate 2 and a heat dissipating means 3 are attached above the LED power supply circuit 4. Yes. A lens 7 is attached to the opening of the cover 5.

  What is important here is that the heat transfer means 6 that can transfer the heat of the heat dissipation means 3 to the cover is provided. Specifically, the heat transfer means 6 is obtained by processing a metal material such as aluminum and is provided between the heat dissipation means 3 and the DC power supply circuit 4. As shown in FIG. 2, the heat transfer means 6 has a disk shape that is slightly larger than the heat dissipation means 3, and a hole for passing a power supply line from the DC power supply circuit 4 is provided in the center thereof. A bottom plate 6a, a wall portion 6b that rises around the bottom plate 6a, and an attachment fixing portion 6c to the cover 5 provided at a position opposite to the wall portion 6b are configured. The heat dissipating means 3 integrated with the LED mounting substrate 2 is attached to the bottom plate 6a on the wall 6b side of the heat transfer means 6.

  When the LED lighting device configured as described above is turned on, the LED element 1 emits light and a predetermined light flux is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, the heat generated from the LED element 1 is radiated to the outside through the lens 7 and the cover 5 by convection of gas generated in the space formed between the lens 7, the cover 5 and the LED mounting substrate 2. The heat is transferred from the LED mounting substrate 2 to the heat transfer means 6 via the heat dissipation means 3 and is radiated to the outside through the cover 5 from the wall portion 6b and the mounting fixing portion 6c of the heat transfer means 6, or the heat transfer means 6 and the cover. The heat is radiated to the outside by the convection of the gas generated in the space X formed between 5 and the DC power supply circuit 4.

According to this embodiment, conventionally, the LED mounting substrate 2 is directly attached to the cover 5 by attaching the heat transfer means 6 having the wall portion 6b rising around the bottom plate 6a to the cover 5 by the attachment fixing portion 6c. Since the contact area with the cover 5 is increased as compared with the conventional one, the heat from the LED mounting substrate 2 is more efficiently transmitted to the cover 5 and dissipated, and the wall 6b is provided on the LED element side. In addition, since the heat transfer means 6 is provided between the heat dissipation means 3 and the DC power supply circuit 4, the heat from the LED element 1 is hardly transmitted to the DC power supply circuit 4. As a result, the heat generated from the LED element 1 can be radiated to the outside more efficiently, so that the temperature of the LED element 1 is lowered and the influence of the heat on the DC power supply circuit 4 can be mitigated.
The LED mounting substrate 2 may be provided with an LED mounting hole through which the LED element 1 penetrates, and the LED element 1 may be bonded to the heat radiation means 3 via an adhesive having good thermal conductivity and mounted. Thereby, the heat | fever of the LED element 1 is transmitted to the thermal radiation means 3 more rapidly, and the temperature of the LED element 1 can be made lower.

  FIG. 5 is an application example of the first embodiment, and FIG. 5 is a cross-sectional view of the LED lighting device. In this application example, the configuration of the heat transfer means 6 described above is changed. That is, the heat transfer means 6 is formed by a continuous portion provided continuously from the cover 5 located in the vicinity of the heat dissipation means 3. And the cover 5 whole is comprised with metal materials, such as an aluminum material with good heat conductivity. According to this application example, the number of components of the constituent members can be reduced, and the entire cover 5 is made of a metal material such as an aluminum material. Therefore, the heat dissipation performance as the LED lighting device is higher than that described in the first embodiment. Therefore, the temperature of the LED element 1 and the DC power supply circuit 4 can be further lowered.

(Second Embodiment)
A second embodiment of the present invention will be described with reference to FIGS. FIG. 6 is a cross-sectional view of the LED lighting device, and FIG. 7 is a side view in which the LED lighting device is separated. This is obtained by changing the shape of the cover 5 in the first embodiment. In the figure, the cover 5 is composed of a light source unit storage cover 5a for storing the LED mounting substrate 2 and the heat dissipation means 3, and a power source unit storage cover 5b for storing the DC power supply circuit 4, and the heat transfer means 6 is used as the light source. It is formed by the part storage cover 5a.

  The light source unit storage cover 5a is formed in a substantially bottomed cylindrical shape having an opening upward from a metal material such as an aluminum material having good heat conductivity, and a power supply line from the DC power supply circuit 4 is provided at the center of the bottom surface. A hole is provided for passing through. The heat dissipating means 3 integrated with the LED mounting substrate 2 is attached to the bottom surface portion with the LED mounting surface facing up. A lens 7 is attached to the opening of the light source storage cover 5a.

  The power source storage cover 5b is formed of a resin material in a substantially cylindrical shape having an upper surface portion and a bottom surface portion, and a power terminal block for receiving commercial power is provided below the bottom surface portion, A hole for drawing a power line from the power terminal block is provided. A DC power supply circuit 4 is attached inside and above the cover 5, and a hole for passing a power supply line of the DC power supply circuit 4 is provided at the center thereof. The same components as those of the first embodiment are denoted by the same reference numerals, and the description thereof is omitted.

  When the LED lighting device configured as described above is turned on, the LED element 1 emits light and a predetermined illuminance is obtained. At the same time, heat is generated from the LED element 1 and the DC power supply circuit 4. However, the heat generated from the LED element 1 is radiated to the outside through the lens 7 and the cover 5 by convection of gas generated in the space formed between the lens 7, the cover 5 and the LED mounting substrate 2. The light is transferred from the LED mounting substrate 2 to the heat transfer means 6 formed on the bottom surface of the light source storage cover 5a via the heat dissipation means 3, and is radiated to the outside through the light source storage cover 5a.

  According to this embodiment, since the contact area with the cover 5 is increased as compared with the conventional case where the LED mounting board 2 is directly attached to the cover 5, the heat from the LED mounting board 2 is more efficiently covered. Therefore, the temperature of the LED element 1 is lowered and the influence of heat on the DC power supply circuit 4 can be mitigated. In addition, the case 5 is separated into a light source unit storage cover 5a for storing the LED mounting substrate 2 and the heat dissipation means 3 and a power source unit storage cover 5b for storing the DC power supply circuit 4, so that the first embodiment is provided. Further, the heat from the LED element 1 is less likely to be transmitted to the DC power supply circuit 4 than that described in the above.

  FIG. 8 is an application example of the second embodiment, and FIG. 8 is a cross-sectional view of the LED lighting device. In this application example, the bottom surface of the light source housing cover 5a described above is changed. In the figure, the bottom surface portion of the light source unit storage cover 5a is constituted by the heat radiation means 3, which is fixed to the side surface of the light source unit storage cover 5a.

  According to this application example, the usage amount of the heat radiating member of the light source storage cover 5a can be reduced.

It is sectional drawing of the LED lighting device which concerns on the 1st Embodiment of this invention. It is a figure which shows the heat transfer means of an LED lighting device same as the above, FIG. 2 (a) is a front view, FIG.2 (b) is the side view which notched one part. It is a front view of the lens of an LED lighting device same as the above. It is a figure which shows the LED mounting board | substrate of an LED lighting device same as the above, FIG. 4 (a) is a front view, FIG.4 (b) is a side view. It is sectional drawing which shows the application example of an LED lighting device same as the above. It is sectional drawing of the LED lighting device which concerns on the 2nd Embodiment of this invention. It is the side view which isolate | separated the LED lighting device same as the above. It is sectional drawing which shows the application example of an LED lighting device same as the above. It is the side view which notched a part of LED lighting device concerning the 1st conventional example. It is sectional drawing of the LED lighting device which concerns on a 2nd prior art example.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 LED element 2 LED mounting board 3 Heat radiation means 4 DC power supply circuit 5 Cover 5a Light source storage cover 5b Power supply storage cover 6 Heat transfer means 7 Lens

Claims (4)

LED mounting board on which LED elements are mounted , heat dissipation means provided on the LED mounting board, DC power supply circuit that outputs a predetermined DC voltage by receiving commercial power, LED mounting board, heat dissipation means, and DC power supply circuit in the LED lighting device provided with a cover, the accommodating bets, that has a plate-like bottom plate, and a heat transfer means in direct contact with the heat dissipation hands stage provided in contact more directly the periphery of the bottom plate to the cover LED lighting device characterized by this. The cover includes a light source unit storage cover that stores an LED mounting substrate and a heat dissipation unit, and a power source unit storage cover that stores a DC power supply circuit, and the light source unit storage cover is a heat transfer unit. The LED lighting device according to claim 1. 3. The LED lighting device according to claim 2, wherein a part of the light source storage cover is a heat radiating means. 4. The LED lighting device according to claim 1, wherein the heat dissipating means and the LED element are bonded via an adhesive having good thermal conductivity.

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