JP2009037796A - Light source and illuminating device - Google Patents

Light source and illuminating device Download PDF

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JP2009037796A
JP2009037796A JP2007199862A JP2007199862A JP2009037796A JP 2009037796 A JP2009037796 A JP 2009037796A JP 2007199862 A JP2007199862 A JP 2007199862A JP 2007199862 A JP2007199862 A JP 2007199862A JP 2009037796 A JP2009037796 A JP 2009037796A
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heat
wiring board
light source
led
heat radiating
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JP5029822B2 (en
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Toshiyuki Ikeda
敏幸 池田
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Toshiba Lighting and Technology Corp
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Toshiba Lighting and Technology Corp
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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/484—Connecting portions
    • H01L2224/48463—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond
    • H01L2224/48465—Connecting portions the connecting portion on the bonding area of the semiconductor or solid-state body being a ball bond the other connecting portion not on the bonding area being a wedge bond, i.e. ball-to-wedge, regular stitch
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
    • H01L2224/732—Location after the connecting process
    • H01L2224/73251—Location after the connecting process on different surfaces
    • H01L2224/73265—Layer and wire connectors

Abstract

<P>PROBLEM TO BE SOLVED: To provide a light source of comparatively low cost and with a high heat-dissipating effect. <P>SOLUTION: A plurality of LEDs 22 lighting with supply of power from a lighting board are arranged on the main face of a wiring board 21. Heat-dissipating plates 23 with the surface formed in a rugged shape are fitted along an outer periphery face of the wiring board 21 with the LEDs 22 arranged. The heat-dissipating plates 23 can be formed comparatively at low cost without using a specific molding die or the like, and heat is directly transferred from the wiring board 21 to the heat-dissipating plates 23, so that heat dissipation can be more efficiently carried out by the heat-dissipating plates 23. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

本発明は、配線基板にＬＥＤを実装した光源およびこれを備えた照明装置に関する。   The present invention relates to a light source in which an LED is mounted on a wiring board and an illumination device including the same.

従来、例えばＬＥＤ(発光ダイオード)を点灯させる光源として、円形状の配線基板上にＬＥＤを実装したものがある。このような光源では、ＬＥＤの点灯により発生する熱が、ＬＥＤの発光効率に影響を与えるだけでなく、ＬＥＤ自体を劣化させてしまう。そこで、ＬＥＤを放熱するために、配線基板を収納したケース体の外面に、一体成形された複数の放熱フィンを突設した器体を備えた構成を有している（例えば、特許文献１参照。）。
特開２００６−４０７２７号公報(第４−５頁、図１−２) Conventionally, for example, as a light source for turning on an LED (light emitting diode), there is one in which an LED is mounted on a circular wiring board. In such a light source, heat generated by the lighting of the LED not only affects the light emission efficiency of the LED, but also degrades the LED itself. Therefore, in order to dissipate the LED, the outer surface of the case body housing the wiring board has a configuration in which a plurality of integrally formed heat radiation fins are protruded (see, for example, Patent Document 1). .)
JP 2006-40727 A (page 4-5, FIG. 1-2)

しかしながら、上述の光源では、ケース体の製造用に成形金型が必要となり、コストが増加するだけでなく、光源の重量が大きくなり、かつ、放熱効果も重量を多くした割に低いという問題点を有している。   However, the light source described above requires a molding die for manufacturing the case body, which not only increases the cost, but also increases the weight of the light source and lowers the heat dissipation effect for the increased weight. have.

本発明は、このような点に鑑みなされたもので、比較的安価で、かつ、放熱効果が高い光源およびこれを備えた照明装置を提供することを目的とする。   The present invention has been made in view of these points, and an object thereof is to provide a light source that is relatively inexpensive and has a high heat dissipation effect, and an illumination device including the light source.

請求項１記載の光源は、配線基板と；この配線基板に設けられたＬＥＤと；前記配線基板の外周縁部に沿って設けられた放熱体と；を具備しているものである。   The light source according to claim 1 includes a wiring board; an LED provided on the wiring board; and a heat radiator provided along an outer peripheral edge of the wiring board.

配線基板は、例えばアルミニウム、あるいは銅などの金属材料、または、熱伝導率の高いセラミックスなどの絶縁性材料により形成されている。   The wiring board is made of, for example, a metal material such as aluminum or copper, or an insulating material such as ceramic having high thermal conductivity.

放熱体は、熱伝導性、熱放射性に優れた金属材料などであり、例えば吸熱側と放熱側との温度勾配が高くなるものを用いる。   The heat radiating body is a metal material having excellent heat conductivity and heat radiating property, and for example, a material having a high temperature gradient between the heat absorbing side and the heat radiating side is used.

そして、ＬＥＤを配設した配線基板の外周縁部に沿って放熱体を設けることで、特殊な成形金型などを用いることなく放熱体が比較的安価に形成され、また、配線基板から放熱体へ直接伝熱されるため、放熱体により効率よく放熱される。   And by providing a radiator along the outer peripheral edge of the wiring board on which the LED is disposed, the radiator can be formed at a relatively low cost without using a special molding die or the like. Because heat is transferred directly to the heat sink, it is efficiently dissipated by the radiator.

請求項２記載の光源は、請求項１記載の光源において、放熱体は、表面が凹凸状に形成され、配線基板の周縁部に固定された放熱板であるものである。   The light source according to claim 2 is the light source according to claim 1, wherein the heat dissipating member is a heat dissipating plate whose surface is formed in a concavo-convex shape and is fixed to the peripheral edge of the wiring board.

そして、放熱体を、表面を凹凸状に形成した放熱板とし、この放熱板を配線基板の周縁部に固定することで、放熱体を容易に形成しつつ、放熱面の表面積が拡大し、放熱効率が向上する。   Then, the heat radiating body is a heat radiating plate having an uneven surface, and the heat radiating plate is fixed to the peripheral edge of the wiring board, so that the surface area of the heat radiating surface is enlarged while the heat radiating body is easily formed. Efficiency is improved.

請求項３記載の光源は、請求項１記載の光源において、放熱体は、配線基板の外周部の少なくとも一部が外部に露出することで一体的に形成されているものである。   A light source according to a third aspect is the light source according to the first aspect, wherein the radiator is integrally formed by exposing at least a part of the outer peripheral portion of the wiring board to the outside.

そして、配線基板の外周部の少なくとも一部を外部に露出させて放熱体と一体に形成することで、放熱体を別途設ける必要がなく、構成が簡略化する。   Then, by exposing at least a part of the outer peripheral portion of the wiring board to the outside and forming it integrally with the heat radiating body, it is not necessary to separately provide the heat radiating body, and the configuration is simplified.

請求項４記載の照明装置は、請求項１ないし３いずれか一記載の光源と；この光源が配設されている本体と；前記光源のＬＥＤを点灯させる点灯装置と；を具備しているものである。   A lighting device according to a fourth aspect includes the light source according to any one of the first to third aspects; a main body in which the light source is disposed; and a lighting device that lights an LED of the light source. It is.

本体は、例えば合成樹脂、あるいは金属などにより形成された外囲器である。   The main body is an envelope made of, for example, synthetic resin or metal.

点灯装置は、例えばＡＣ−ＤＣ変換回路や定電流回路などを備えて構成されている。なお、この点灯装置は、本体内に収容されていても、本体外部に配設されていてもよい。   The lighting device includes, for example, an AC-DC conversion circuit, a constant current circuit, and the like. In addition, even if this lighting device is accommodated in the main body, it may be arrange | positioned outside the main body.

そして、請求項１ないし３いずれか一記載の光源を備えることで、安価で効率よく放熱可能な照明装置が構成される。   And the illuminating device which can be thermally radiated efficiently is comprised by providing the light source as described in any one of Claims 1 thru | or 3.

請求項１記載の光源によれば、ＬＥＤを配設した配線基板の外周縁部に沿って放熱体を設けることで、特殊な成形金型などを用いることなく放熱体を比較的安価に形成でき、また、配線基板から放熱体へ直接伝熱されるため、放熱体により効率よく放熱できる。   According to the light source of the first aspect, the heat radiator can be formed at a relatively low cost without using a special molding die or the like by providing the heat radiator along the outer peripheral edge of the wiring board on which the LEDs are arranged. Moreover, since heat is directly transferred from the wiring board to the heat radiating body, heat can be radiated efficiently by the heat radiating body.

請求項２記載の光源によれば、請求項１記載の光源の効果に加えて、放熱体を、表面を凹凸状に形成した放熱板とし、この放熱板を配線基板の周縁部に固定することで、放熱体を容易に形成しつつ、放熱面の表面積を拡大でき、放熱効率を向上できる。   According to the light source of claim 2, in addition to the effect of the light source of claim 1, the heat radiator is a heat sink having an uneven surface, and the heat sink is fixed to the peripheral portion of the wiring board. Thus, the surface area of the heat radiating surface can be increased while easily forming the heat radiating body, and the heat radiating efficiency can be improved.

請求項３記載の光源によれば、請求項１記載の光源の効果に加えて、配線基板の外周部の少なくとも一部を外部に露出させて放熱体と一体に形成することで、放熱体を別途設ける必要がなく、構成を簡略化できる。   According to the light source of the third aspect, in addition to the effect of the light source of the first aspect, at least a part of the outer peripheral portion of the wiring board is exposed to the outside and formed integrally with the heat radiator. There is no need to provide it separately, and the configuration can be simplified.

請求項４記載の照明装置によれば、請求項１ないし３いずれか一記載の光源を備えることで、安価で効率よく放熱可能な照明装置を構成できる。   According to the illuminating device of the fourth aspect, by including the light source according to any one of the first to third aspects, it is possible to configure an illuminating device capable of efficiently and efficiently dissipating heat.

以下、本発明の一実施の形態を図面を参照して説明する。   Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

図１ないし図４に第１の実施の形態を示し、図１は光源の斜視図、図２は光源の平面図、図３は光源の断面図、図４は光源を備えた照明装置の一部を切り欠いて示す正面図である。   1 to 4 show a first embodiment, in which FIG. 1 is a perspective view of a light source, FIG. 2 is a plan view of the light source, FIG. 3 is a sectional view of the light source, and FIG. It is a front view which cuts and shows a part.

図４に示すように、照明装置であるＬＥＤ電球11は、外囲器である本体12の内部に、点灯装置としての点灯基板13と、光源14とが配設されて構成されている。   As shown in FIG. 4, an LED bulb 11 as a lighting device is configured by a lighting substrate 13 as a lighting device and a light source 14 disposed in a main body 12 as an envelope.

本体12は、例えば合成樹脂、あるいは金属などにより形成され、図示しない商用電源に接続される口金16が一端側に取り付けられているとともに、他端側が拡開状に開口され、この開口に光源14が取り付けられている。なお、この本体12は、口金16に代えて端子代を取り付けたり、外部から電源線を直接導入するように構成したりしてもよい。また、この本体12の開口側に、光源14を覆うグローブなどを設けてもよい。   The main body 12 is formed of, for example, synthetic resin or metal, and a base 16 connected to a commercial power source (not shown) is attached to one end side, and the other end side is opened in an open shape. Is attached. The main body 12 may be configured such that a terminal cost is attached instead of the base 16 or a power line is directly introduced from the outside. Further, a glove or the like covering the light source 14 may be provided on the opening side of the main body 12.

口金16は、いわゆるエジソンベースなどであり、既存の電球用のソケットなどにねじ込んで接続および固定可能に構成されている。   The base 16 is a so-called Edison base or the like, and is configured to be connected and fixed by being screwed into an existing socket for a light bulb.

点灯基板13は、基板18上に図示しない各種部品が実装されて、ＡＣ−ＤＣ変換回路や定電流回路などが形成され、例えば本体12内に上下方向に沿って配設されている。また、この点灯基板13は、図示しない配線を介して口金16に電気的に接続され、この口金16を介して、外部の商用電源に接続されて給電されている。   The lighting substrate 13 is mounted with various components (not shown) on the substrate 18 to form an AC-DC conversion circuit, a constant current circuit, and the like. For example, the lighting substrate 13 is disposed in the main body 12 along the vertical direction. The lighting substrate 13 is electrically connected to a base 16 through a wiring (not shown), and is connected to an external commercial power source through the base 16 to be fed.

光源14は、図１ないし図３に示すように、円板状の配線基板21の一主面上に光源本体である複数のＬＥＤ22が設けられているとともに、配線基板21の外側面である外周面に、放熱体である放熱板23が固定されている。   As shown in FIGS. 1 to 3, the light source 14 is provided with a plurality of LEDs 22 as a light source body on one main surface of a disk-shaped wiring substrate 21 and an outer periphery that is an outer surface of the wiring substrate 21. A heat radiating plate 23 as a heat radiating body is fixed to the surface.

配線基板21は、例えばアルミニウム、あるいは銅などの金属材料、または、熱伝導率の高いセラミックスなどの絶縁性材料により形成されている。   The wiring board 21 is formed of a metal material such as aluminum or copper, or an insulating material such as ceramics having high thermal conductivity.

各ＬＥＤ22は、例えば配線基板21上にサファイアなどの基体を介して半導体チップおよび樹脂などが積層されて白色光を放射する構造に形成され、点灯基板13により所定の直流電圧を供給されることで点灯可能である。また、これらＬＥＤ22は、例えば配線基板21の平面視での中心位置に対して略同心円上に、かつ、互いに略等間隔で配置され、互いに直列に接続されている。   Each LED 22 is formed in a structure in which a semiconductor chip and a resin are laminated on a wiring substrate 21 through a base such as sapphire to emit white light, and a predetermined DC voltage is supplied from the lighting substrate 13. Can be lit. Further, these LEDs 22 are arranged, for example, substantially concentrically with respect to the center position of the wiring board 21 in plan view, arranged at substantially equal intervals, and connected in series with each other.

放熱板23は、例えば１ｍｍ程度の厚みを有する金属、例えばアルミニウムなどの熱伝導性、熱放射性に優れた吸熱側と放熱側との温度勾配が高くなる板状の材料を、山部23aと谷部23bとが交互に隣接する波状にプレスするなどにより、表面が凹凸状となるように成形されている。また、この放熱板23は、配線基板21の外形形状に沿って、例えば熱伝導性に優れた接着剤、あるいは溶接により固定され、配線基板21の外周面全体を囲む環状をなしている。すなわち、放熱板23は、内周側に突出する谷部23bの先端が配線基板21の外周面に固定されている。さらに、この放熱板23は、例えば配線基板21の厚みよりも大きい高さ寸法を有し、高さ方向の略中間域に配線基板21が配設されている。したがって、放熱板23が本体12に固定され、配線基板21は本体12の開口側に対して直接接触せずに離間された状態で配設されている。   The heat radiating plate 23 is made of a plate-like material having a high temperature gradient between the heat absorbing side and the heat radiating side, such as a metal having a thickness of about 1 mm, for example, aluminum, which is excellent in thermal conductivity and heat radiation. The surface is formed to have an uneven shape by, for example, pressing in a wave shape adjacent to the portions 23b. Further, the heat radiating plate 23 is fixed along the outer shape of the wiring board 21 by, for example, an adhesive having excellent thermal conductivity or welding, and has an annular shape surrounding the entire outer peripheral surface of the wiring board 21. That is, in the heat sink 23, the tip of the valley portion 23b protruding to the inner peripheral side is fixed to the outer peripheral surface of the wiring board 21. Further, the heat radiating plate 23 has a height dimension larger than the thickness of the wiring substrate 21, for example, and the wiring substrate 21 is disposed in a substantially intermediate region in the height direction. Therefore, the heat radiating plate 23 is fixed to the main body 12, and the wiring board 21 is disposed in a state of being separated from the opening side of the main body 12 without being in direct contact.

次に、上記第１の実施の形態の作用を説明する。   Next, the operation of the first embodiment will be described.

ＬＥＤ電球11の口金16を所定のソケットにねじ込んだ状態で、商用電源からＬＥＤ電球11に給電すると、電力が口金16を介して点灯基板13へと供給され、この点灯基板13にてＡＣ−ＤＣ変換されるとともに電圧が調整されて、光源14のＬＥＤ22へと所定電圧が印加され、各ＬＥＤ22が点灯し、この光が本体12の開口から放射される。   When power is supplied to the LED bulb 11 from a commercial power source with the base 16 of the LED bulb 11 screwed into a predetermined socket, electric power is supplied to the lighting substrate 13 through the base 16, and AC-DC is supplied to the lighting substrate 13. The voltage is adjusted and the voltage is adjusted, a predetermined voltage is applied to the LEDs 22 of the light source 14, each LED 22 is turned on, and this light is emitted from the opening of the main body 12.

このとき、各ＬＥＤ22は、点灯により熱を発生させ、この熱がＬＥＤ22を配設した配線基板21に伝わる。そして、配線基板21の外周面に固定された放熱板23により、配線基板21に伝わった熱が放熱されることで、配線基板21の外周近傍の温度が、ＬＥＤ22近傍の位置よりも低くなり、ＬＥＤ22の点灯により発生した熱が、放熱板23側へと順次伝わって放熱される。   At this time, each LED 22 generates heat by lighting, and this heat is transmitted to the wiring board 21 on which the LED 22 is disposed. And, the heat transmitted to the wiring board 21 is radiated by the heat sink 23 fixed to the outer peripheral surface of the wiring board 21, so that the temperature near the outer periphery of the wiring board 21 becomes lower than the position near the LED 22, The heat generated by the lighting of the LED 22 is sequentially transmitted to the heat radiating plate 23 side and radiated.

以上のように、ＬＥＤ22を配設した配線基板21の外周縁部に沿って放熱板23を設けることで、特殊な成形金型などを用いることなく放熱板23を比較的安価に形成でき、また、配線基板21から放熱板23へ直接伝熱されるため、放熱板23により効率よく放熱できる。   As described above, by providing the heat sink 23 along the outer peripheral edge of the wiring board 21 on which the LEDs 22 are arranged, the heat sink 23 can be formed at a relatively low cost without using a special molding die. Since heat is directly transferred from the wiring board 21 to the heat sink 23, the heat sink 23 can efficiently dissipate heat.

特に、本実施の形態では、表面を凹凸状に形成した放熱板23を配線基板21の周縁部に固定して放熱体としているので、放熱板23を容易に形成できるとともに、放熱板23を山部23aと谷部23bとを交互に形成した凹凸形状とすることで放熱面積を拡大でき、放熱効率を、より向上できる。   In particular, in the present embodiment, since the heat sink 23 having an uneven surface is fixed to the peripheral portion of the wiring board 21 to form a heat radiator, the heat sink 23 can be easily formed and the heat sink 23 is By making the concave-convex shape in which the portions 23a and the valley portions 23b are alternately formed, the heat radiation area can be expanded, and the heat radiation efficiency can be further improved.

しかも、放熱板23は、厚みを比較的薄くし、温度勾配が高くなる部材により形成しているので、厚みを厚くしたり、温度勾配が小さい部材により形成したりする場合と比較して、放熱効率を、より向上できるだけでなく、放熱板23自体の重量も軽減でき、光源14およびＬＥＤ電球11が必要以上に重くなることもない。   In addition, since the heat sink 23 is formed of a member having a relatively thin thickness and a high temperature gradient, the heat dissipation plate 23 can be radiated in comparison with a case where the thickness is increased or a member having a small temperature gradient is formed. Not only can the efficiency be improved, but the weight of the heat sink 23 itself can be reduced, and the light source 14 and the LED bulb 11 do not become heavier than necessary.

そして、放熱板23を本体12に固定することにより、例えば本体12を、放熱性を有する部材などにより形成すれば、放熱板23からの熱を本体12側に伝えてこの本体12側からも放熱可能となり、放熱効率を、より向上できる。   Then, by fixing the heat radiating plate 23 to the main body 12, for example, if the main body 12 is formed of a heat radiating member or the like, the heat from the heat radiating plate 23 is transmitted to the main body 12 side and heat is also radiated from the main body 12 side. This makes it possible to further improve the heat dissipation efficiency.

なお、上記第１の実施の形態では、放熱板23の高さを配線基板21の高さよりも高く形成しているが、少なくとも配線基板21と同等程度の高さを有していれば、放熱板23による放熱効率を確保できる。   In the first embodiment, the height of the heat radiating plate 23 is formed higher than the height of the wiring board 21. However, as long as it has at least the same height as that of the wiring board 21, The heat dissipation efficiency by the plate 23 can be secured.

次に、図５ないし図７に第２の実施の形態を示し、図５は光源の斜視図、図６は光源の平面図、図７は光源の断面図である。なお、上記第１の実施の形態と同様の構成および作用については、同一符号を付してその説明を省略する。   5 to 7 show a second embodiment. FIG. 5 is a perspective view of the light source, FIG. 6 is a plan view of the light source, and FIG. 7 is a cross-sectional view of the light source. In addition, about the structure and effect | action similar to the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

この第２の実施の形態は、上記第１の実施の形態の放熱板23に代えて、放熱体25，26が配線基板21の各主面に固定され、配線基板21の外周面全体が外部に露出しているものである。   In this second embodiment, instead of the heat sink 23 of the first embodiment, the heat radiators 25 and 26 are fixed to the respective main surfaces of the wiring board 21, and the entire outer peripheral surface of the wiring board 21 is external. Is exposed.

放熱体25，26は、例えばアルミニウムなどの吸熱側と放熱側との温度勾配が比較的高くなる物質により、配線基板21の外周縁部に沿う環状、本実施の形態では円環状に形成され、配線基板21の外周縁部に沿って配設されている。また、これら放熱体25，26は、配線基板21の各主面に、放熱性に優れた接着剤、あるいは溶接などにより固定されている。   The radiators 25 and 26 are formed in an annular shape along the outer peripheral edge of the wiring board 21, for example, an annular shape in the present embodiment, by a material that has a relatively high temperature gradient between the heat absorption side and the heat dissipation side, such as aluminum. Arranged along the outer peripheral edge of the wiring board 21. Further, these heat radiators 25 and 26 are fixed to the respective main surfaces of the wiring board 21 by an adhesive having excellent heat dissipation or welding.

さらに、放熱体25，26の外周面は、配線基板21の外周面と略面一となるように形成されている。   Further, the outer peripheral surfaces of the radiators 25 and 26 are formed so as to be substantially flush with the outer peripheral surface of the wiring board 21.

そして、点灯基板13からの給電により各ＬＥＤ22が点灯し、この光が本体12の開口から放射される。このとき、各ＬＥＤ22は、点灯により熱を発生させ、この熱がＬＥＤ22を配設した配線基板21に伝わり、この配線基板21の外周近傍に固定された放熱体25，26により、配線基板21に伝わった熱を放熱するなど、上記第１の実施の形態と同様の作用効果を有することにより、上記第１の実施の形態と同様の作用効果を奏することが可能であるとともに、配線基板21の外周面を外部に露出させることで、この露出した外周面からの放熱を可能にして、放熱効率を向上できる。   Each LED 22 is turned on by power feeding from the lighting substrate 13, and this light is emitted from the opening of the main body 12. At this time, each LED 22 generates heat by lighting, and this heat is transmitted to the wiring board 21 on which the LED 22 is disposed, and the heat radiating bodies 25 and 26 fixed in the vicinity of the outer periphery of the wiring board 21 cause the LED 22 to By having the same operational effects as the first embodiment, such as radiating the transmitted heat, it is possible to achieve the same operational effects as the first embodiment, and the wiring board 21 By exposing the outer peripheral surface to the outside, it is possible to dissipate heat from the exposed outer peripheral surface and improve heat dissipation efficiency.

また、各放熱体25，26の外周面を配線基板21の外周面と略面一にすることで、各放熱体25，26が配線基板21の外周面よりも外方に突出しないので、光源14の径寸法を抑制できる。   In addition, by making the outer peripheral surface of each heat dissipating body 25, 26 substantially flush with the outer peripheral surface of the wiring board 21, each heat dissipating body 25, 26 does not protrude outward from the outer peripheral surface of the wiring board 21, so that the light source The diameter of 14 can be suppressed.

なお、上記第２の実施の形態において、放熱体25，26は、上記第１の実施の形態のように表面が凹凸状となる形状に形成した放熱板により形成してもよい。   In the second embodiment, the heat radiating bodies 25 and 26 may be formed of a heat radiating plate formed in a shape having an uneven surface as in the first embodiment.

また、配線基板21は、外周面の少なくとも一部を外部に露出するように形成してもよい。例えば、配線基板21の外周面などに突起を設け、これら突起を放熱体に対して挿通させて外部に露出するように構成してもよい。   The wiring board 21 may be formed so that at least a part of the outer peripheral surface is exposed to the outside. For example, protrusions may be provided on the outer peripheral surface of the wiring board 21 and the protrusions may be inserted into the heat radiating body and exposed to the outside.

さらに、放熱体は、配線基板21の少なくとも一方の主面側に位置していれば、上記第２の実施の形態と同様の作用効果を奏することができる。   Furthermore, if the heat radiating body is located on at least one main surface side of the wiring board 21, it is possible to achieve the same effects as those of the second embodiment.

次に、図８ないし図１０に第３の実施の形態を示し、この第３の実施の形態は、上記第２の実施の形態において、配線基板21の外周縁部の少なくとも一部が外部に露出することで放熱体と一体的に形成されているものである。   Next, FIG. 8 to FIG. 10 show a third embodiment. In the third embodiment, in the second embodiment, at least a part of the outer peripheral edge of the wiring board 21 is exposed to the outside. By being exposed, it is formed integrally with the heat radiating body.

具体的に、配線基板21は、図８ないし図１０に示すように、例えばアルミニウム、あるいは銅などの熱伝導性および熱放射性に優れた金属などの部材により形成されており、外周縁部近傍の上面の所定位置に、ＬＥＤ22を配設する突出部31が同一円周上およびこの円周の中心部に形成されている。また、この配線基板21の外周縁部には、この配線基板21の周囲を囲むように放熱体としての放熱部32が一体的に形成されている。   Specifically, as shown in FIGS. 8 to 10, the wiring substrate 21 is formed of a member such as aluminum or a metal having excellent thermal conductivity and thermal radiation, such as copper. Protruding portions 31 for disposing the LEDs 22 are formed on the same circumference and at the center of this circumference at predetermined positions on the upper surface. Further, a heat radiating portion 32 as a heat radiating body is integrally formed on the outer peripheral edge portion of the wiring substrate 21 so as to surround the periphery of the wiring substrate 21.

また、各突出部31の表面は、銀めっき層33により覆われている。さらに、突出部31，31間には、接着層34を介して絶縁層35が設けられ、各絶縁層35上には、導体36が設けられ、この導体36の上部には、光反射層37が設けられている。   Further, the surface of each protrusion 31 is covered with a silver plating layer 33. Further, an insulating layer 35 is provided between the protruding portions 31 and 31 via an adhesive layer 34. A conductor 36 is provided on each insulating layer 35, and a light reflecting layer 37 is provided above the conductor 36. Is provided.

ＬＥＤ22は、例えば透光性のダイボンド材41により銀めっき層33上に素子基板42が接着され、この素子基板42上に半導体発光層43が積層されているとともに、この半導体発光層43上に電極45，46が互いに離間されて配設された半導体チップである。さらに、これら電極45，46は、ボンディングワイヤ47，48により導体36，36に電気的に接続されている。したがって、各ＬＥＤ22は、導体36により、互いに直列に接続されている。そして、ＬＥＤ22は、図示しない封止部材により封止されている。   The LED 22 has an element substrate 42 bonded to a silver plating layer 33 with, for example, a light-transmitting die bond material 41, a semiconductor light emitting layer 43 laminated on the element substrate 42, and an electrode on the semiconductor light emitting layer 43. Reference numerals 45 and 46 denote semiconductor chips disposed apart from each other. Further, these electrodes 45 and 46 are electrically connected to the conductors 36 and 36 by bonding wires 47 and 48. Accordingly, the LEDs 22 are connected to each other in series by the conductor 36. The LED 22 is sealed with a sealing member (not shown).

ダイボンド材41は、例えば透光性のシリコーン樹脂などからなる接着剤である。   The die bond material 41 is an adhesive made of, for example, a translucent silicone resin.

素子基板42は、例えばサファイア基板などであり、半導体発光層43は、例えば青色などの単色発光の素子である。   The element substrate 42 is, for example, a sapphire substrate, and the semiconductor light emitting layer 43 is, for example, a single color light emitting element such as blue.

封止部材は、例えば内部に図示しない蛍光体が混入された樹脂により形成されている。この蛍光体は、例えばＬＥＤ22が発する光の一部により励起されることでＬＥＤ22と異なる色の光を放射するもので、本実施の形態では、ＬＥＤ22の青色の光に対して黄色の光を放射することで白色系の照明光を得るように構成されている。   The sealing member is made of, for example, a resin in which a phosphor (not shown) is mixed. This phosphor emits light of a color different from that of the LED 22 when excited by, for example, part of the light emitted by the LED 22. In this embodiment, the phosphor emits yellow light with respect to the blue light of the LED 22. By doing so, it is configured to obtain white illumination light.

銀めっき層33は、例えば光反射層37とともに無電解めっき処理により一度に設けられる。   The silver plating layer 33 is provided at a time together with, for example, the light reflection layer 37 by electroless plating.

接着層34は、例えば紙や布などの繊維材料からなるシートに熱硬化性の接着樹脂を含浸して構成されている。   The adhesive layer 34 is configured by impregnating a sheet made of a fiber material such as paper or cloth with a thermosetting adhesive resin.

絶縁層35は、光反射性能を得るために、例えば白色のガラスエポキシ基板などが用いられる。   For the insulating layer 35, for example, a white glass epoxy substrate is used in order to obtain light reflection performance.

また、放熱部32は、配線基板21と一体に設けられている。すなわち、放熱部32は、アルミニウム、あるいは銅などの熱伝導性および熱放射性に優れた金属などの部材により形成されている。また、この放熱部32は、配線基板21の周囲から、この配線基板21のＬＥＤ22が実装されている表面と反対側、すなわち裏面(図８中の下面)側に突出することで、表面積を拡げるように構成されている。   Further, the heat radiating portion 32 is provided integrally with the wiring board 21. That is, the heat radiating portion 32 is formed of a member such as a metal having excellent thermal conductivity and heat radiation, such as aluminum or copper. Further, the heat radiating portion 32 extends from the periphery of the wiring board 21 to the side opposite to the surface on which the LED 22 of the wiring board 21 is mounted, that is, the back surface (the lower surface in FIG. 8) side, thereby increasing the surface area. It is configured as follows.

そして、この第３の実施の形態では、上記各実施の形態と同様に、点灯基板13からの給電により各ＬＥＤ22が点灯し、この光が本体12の開口から放射される。このとき、各ＬＥＤ22は、点灯により熱を発生させ、この熱がＬＥＤ22を配設した配線基板21に伝わり、この配線基板21の外周縁部に一体に形成した放熱部32により、配線基板21に伝わった熱を放熱するなど、上記第１の実施の形態と同様の作用効果を有することにより、上記各実施の形態と同様の作用効果を奏することができるとともに、配線基板21の外周部の少なくとも一部を外部に露出させて放熱部32と一体に形成することで、放熱部32を別途設ける必要がなく、構成を簡略化できる。   And in this 3rd Embodiment, each LED22 lights by the electric power feeding from the lighting board | substrate 13 similarly to said each embodiment, This light is radiated | emitted from the opening of the main body 12. FIG. At this time, each LED 22 generates heat by lighting, and this heat is transmitted to the wiring board 21 on which the LED 22 is disposed, and the heat radiation part 32 integrally formed on the outer peripheral edge of the wiring board 21 causes the LED 22 to By having the same operational effects as the first embodiment, such as dissipating the transmitted heat, the same operational effects as the above-described embodiments can be obtained, and at least the outer peripheral portion of the wiring board 21 can be obtained. By exposing a part to the outside and forming it integrally with the heat radiating portion 32, it is not necessary to separately provide the heat radiating portion 32, and the configuration can be simplified.

また、放熱部32を、配線基板21の下面側へと突出させることで、放熱部32の表面積を拡げ、放熱性を、より向上できる。   Further, by projecting the heat dissipating part 32 to the lower surface side of the wiring substrate 21, the surface area of the heat dissipating part 32 can be expanded and the heat dissipation can be further improved.

なお、上記第３の実施の形態において、配線基板21の各種構成は、上記に限定されるものではない。   In the third embodiment, the various configurations of the wiring board 21 are not limited to the above.

また、上記各実施の形態において、配線基板21は、円板状としたが、例えば角板状など、任意の外形形状としてもよい。この場合には、放熱板23、あるいは放熱体25，26の形状を、配線基板21の外形形状に合わせることで、上記各実施の形態と同様の作用効果を奏することが可能になる。   Further, in each of the above embodiments, the wiring board 21 has a disk shape, but may have an arbitrary outer shape such as a square plate shape. In this case, by matching the shape of the heat radiating plate 23 or the heat radiating bodies 25 and 26 to the outer shape of the wiring board 21, it is possible to achieve the same effects as the above-described embodiments.

さらに、点灯基板13は、本体12の外部に配設することも可能である。この場合には、本体12の形状をより小さくすることができる。   Further, the lighting substrate 13 can be disposed outside the main body 12. In this case, the shape of the main body 12 can be further reduced.

そして、配線基板21のＬＥＤ22の配置などは、任意に設定できる。   The arrangement of the LEDs 22 on the wiring board 21 can be arbitrarily set.

また、ＬＥＤ電球11の細部の構成などは、上記実施の形態に限定されるものではない。   Further, the detailed configuration of the LED bulb 11 is not limited to the above embodiment.

本発明の第１の実施の形態を示す光源の斜視図である。It is a perspective view of the light source which shows the 1st Embodiment of this invention. 同上光源の平面図である。It is a top view of a light source same as the above. 同上光源の断面図である。It is sectional drawing of a light source same as the above. 同上光源を備えた照明装置の一部を切り欠いて示す正面図である。It is a front view which notches and shows a part of illuminating device provided with the light source same as the above. 本発明の第２の実施の形態を示す光源の斜視図である。It is a perspective view of the light source which shows the 2nd Embodiment of this invention. 同上光源の平面図である。It is a top view of a light source same as the above. 同上光源の断面図である。It is sectional drawing of a light source same as the above. 本発明の第３の実施の形態を示す光源の平面図である。It is a top view of the light source which shows the 3rd Embodiment of this invention. 同上光源の断面図である。It is sectional drawing of a light source same as the above. 同上光源の一部を拡大して示す断面図である。It is sectional drawing which expands and shows a part of light source same as the above.

符号の説明Explanation of symbols

11 照明装置としてのＬＥＤ電球
12 本体
13 点灯装置としての点灯基板
14 光源
21 配線基板
22 ＬＥＤ
23 放熱体としての放熱板
25，26 放熱体
32 放熱体としての放熱部 11 LED bulbs as lighting devices
12 Body
13 Lighting substrate as lighting device
14 Light source
21 Wiring board
22 LED
23 Heat sink as a radiator
25, 26 radiator
32 Heat dissipation part as a heat sink

Claims (4)

配線基板と；
この配線基板に設けられたＬＥＤと；
前記配線基板の外周縁部に沿って設けられた放熱体と；
を具備していることを特徴とする光源。 A wiring board;
An LED provided on the wiring board;
A heat dissipating body provided along an outer peripheral edge of the wiring board;
A light source characterized by comprising: 放熱体は、表面が凹凸状に形成され、配線基板の周縁部に固定された放熱板である
ことを特徴とする請求項１記載の光源。 The light source according to claim 1, wherein the heat dissipating member is a heat dissipating plate whose surface is formed in a concavo-convex shape and fixed to a peripheral portion of the wiring board. 放熱体は、配線基板の外周部の少なくとも一部が外部に露出することで一体的に形成されている
ことを特徴とする請求項１記載の光源。 The light source according to claim 1, wherein the heat dissipating body is integrally formed by exposing at least a part of the outer peripheral portion of the wiring board to the outside. 請求項１ないし３いずれか一記載の光源と；
この光源が配設されている本体と；
前記光源のＬＥＤを点灯させる点灯装置と；
を具備していることを特徴とする照明装置。 A light source according to any one of claims 1 to 3;
A body in which the light source is disposed;
A lighting device for lighting the LED of the light source;
An illumination device comprising:
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