JP2009032466A - Illuminating device - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide an LED illuminating device with emission efficiency improved and degradation of life restrained through securement of heat dissipating properties. <P>SOLUTION: LEDs 23 are mounted on a top face of the substrate 16 (a substrate 18). A dissipating member 17 (an exoergic member 19) is set in protrusion at an upper side upper than the top face of the substrate 16 (the substrate 18). An underside of the substrate 18 (a substrate 20) with the LEDs 23 mounted on the top face is arranged at an upper side upper than the top face of the dissipating member 17 (the dissipating member 19). The LEDs 23 are arranged three-dimensionally to secure an exoergic property by enabling dissipation of heat from the dissipating member 17 (the dissipating member 19), which improves emission efficiency and restrains degradation of life. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a lighting device that radiates heat from a light source.

Conventionally, in this type of lighting device, a planar substrate having a point light source such as an LED is disposed on an upper portion of an outer member that is a substantially covered cylindrical metal casing having a lower end connected to a base. In addition, a configuration is known in which a lighting circuit for lighting a point light source is accommodated inside an outer member via an insulating member, and the substrate is covered with a globe as a diffusion member (see, for example, Patent Document 1). .)
JP 2006-313717 A (page 5-6, FIG. 2)

  In the above-described lighting device, in general, when heat is radiated from the light source, it is inefficient due to an air layer between the light source and the glove. Heat dissipation. Such a configuration has a certain effect on the suppression of the temperature rise of the light source and the overall miniaturization, but when further miniaturization is achieved, the outer member and the base for radiating the heat from the light source are also reduced. Therefore, there is a problem that the heat radiation area may be insufficient.

  Further, since the outer member is close in distance to the base, there is a problem that when the base is attached to a socket or the like, the inside of the outer member becomes a closed space and the heat dissipation effect is further reduced.

  This invention is made | formed in view of such a point, and it aims at providing the illuminating device which ensured heat dissipation, improved luminous efficiency, and suppressed the lifetime reduction.

  The lighting device according to claim 1, wherein a light source is mounted on one surface side and has one substrate having a loop shape; a heat dissipating member disposed so as to protrude above one surface side of the one substrate; A light source is mounted, and the other surface side is provided with another substrate disposed above the heat dissipating member.

  For example, an LED is preferably used as the light source, but the light source is not limited to the LED, and may be a solid light emitting element such as an organic EL.

  Each substrate is formed in, for example, a loop shape, and light sources connected in series with each other are mounted on one surface.

  The heat dissipating member is formed of a member having excellent heat dissipating properties such as metal, and one substrate is attached thereto.

  Then, a light source is mounted on one surface side of one substrate, a heat radiating member is disposed so as to protrude above the one surface side of the one substrate, and a light source is mounted on the one surface side above the heat radiating member. By arranging the other side of the other substrate, the light source is arranged three-dimensionally, heat radiation from the heat radiating member is enabled, heat radiation is ensured, luminous efficiency is improved, and lifetime reduction is suppressed. .

  A lighting device according to a second aspect is the lighting device according to the first aspect, wherein each substrate has an annular shape and is arranged concentrically with each other.

  Then, by arranging the annular substrates concentrically with each other, the space can be saved.

  According to a third aspect of the present invention, in the illuminating device according to the first or second aspect, the heat dissipating member has a reflection function on the outer surface for reflecting light from the light source of one substrate.

  And since it has the reflective function which reflects the light from the light source of one board | substrate in the outer surface of a heat radiating member, it becomes possible to reflect the light from a light source on an outer surface, and to increase light emission.

  According to the lighting device of claim 1, the light source is mounted on one surface side of one substrate, the heat dissipating member is disposed so as to protrude above the one surface side of the one substrate, and the upper side of the heat dissipating member. In addition, by arranging the other side of the other substrate with the light source mounted on one side, the light source can be arranged in three dimensions to enable heat dissipation from the heat dissipation member, ensuring heat dissipation and improving luminous efficiency It is possible to suppress a decrease in the service life.

  According to the illuminating device described in claim 2, in addition to the effect of the illuminating device described in claim 1, space can be saved by arranging the annular substrates concentrically with each other.

  According to the illuminating device of claim 3, in addition to the effect of the illuminating device of claim 1 or 2, by having a reflection function of reflecting light from the light source of one substrate on the outer surface of the heat dissipation member, Light from the light source can be reflected from the outer surface to increase light emission.

  Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

  FIG. 1 shows a first embodiment, FIG. 1 is a front view in which a part of the lighting device is cut out, FIG. 2 is a plan view of the lighting device, and FIG. 3 is a partial cross-sectional view of FIG.

  As shown in FIG. 1 and FIG. 2, an LED bulb-shaped LED lighting device 11 that is a lighting device has a disk-shaped substrate 14 disposed on a base 12 via an outer member 13. A cylindrical heat radiating member 15 is disposed, and an annular (doughnut-shaped) substrate 16 is disposed on the heat radiating member 15. Inside the substrate 16, a cylindrical heat radiating member 17 is disposed on the substrate 14, and an annular substrate 18 is disposed above the heat radiating member 17. Inside the substrate 18, a cylindrical heat dissipating member 19 is disposed on the substrate 14, and a disc-shaped substrate 20 is disposed above the heat dissipating member 19.

  The base 12 is a so-called E-type base used for, for example, a general incandescent bulb.

  The outer member 13 is formed in a cylindrical shape whose diameter is increased from the base 12 side to the substrate 14 side by a member such as aluminum having excellent heat dissipation, for example, and a lighting circuit 21 is disposed therein. The lighting circuit 21 is electrically connected to the base 12 and the substrate 14.

  The substrate 14 is provided so as to close the upper end portion of the outer shell member 13.

  The heat dissipating members 15, 17, and 19 are formed in a cylindrical shape having an axial direction in the vertical direction with a metal such as aluminum, and are disposed concentrically with the substrate 14 on the upper surface that is one surface of the substrate 14. In addition, the heat dissipation members 15, 17, and 19 are successively reduced in outer diameter and projecting from the substrate 14. The heat dissipation member 17 protrudes above the upper surface of the substrate 16, and the heat dissipation member 19 is the substrate 18. It protrudes above the upper surface of. Therefore, the heat dissipating members 15, 17, and 19 have a surface area serving as a heat dissipating area extending in the vertical direction. The projecting dimensions of the heat dissipating members 17 and 19 with respect to the substrates 16 and 18 are set to be substantially equal to each other. And the outer peripheral surface of the heat radiating members 17 and 19 has a reflective function which reflects light. This reflection function is formed by, for example, mirroring the outer peripheral surfaces of the heat radiating members 17 and 19 or coating the outer peripheral surfaces of the heat radiating members 17 and 19 with a reflective member such as titanium oxide.

  As shown in FIG. 3, the substrates 16, 18, and 20 are formed in a loop shape with a metal such as aluminum or copper, and a plurality of LEDs 23 that are light sources are provided at predetermined positions on the upper surface near the outer peripheral edge. This is an LED module in which the protruding portions 25 to be disposed are formed on the same circumference. Therefore, the LEDs 23 are arranged in a circular loop shape. Further, the surface of each protrusion 25 is covered with a silver plating layer 27. Further, an insulating layer 32 is provided between the projecting portions 25 and 25 via an adhesive layer 31, and a conductor 33 is provided on each insulating layer 32. A light reflecting layer 34 is provided above the conductor 33. Is provided. The substrates 16, 18, and 20 are formed by concentrically cutting out the same large substrate (not shown) at a predetermined interval. Accordingly, the substrates 16, 18, and 20 have outer diameter dimensions substantially equal to the outer diameter dimensions of the heat dissipation members 15, 17, and 19, respectively, and the inner diameter dimension of the substrate 16 is equal to the outer diameter dimension of the substrate 18 (heat dissipation member 17). The inner diameter of the substrate 18 is configured to be approximately equal to the outer diameter of the substrate 20 (heat dissipating member 19), and is arranged concentrically in plan view. For this reason, the inner peripheral surfaces of the substrates 16 and 18 are substantially in contact with the outer peripheral surfaces of the heat dissipating members 17 and 19. The inner diameters of the substrates 16 and 18 are formed smaller than the inner diameters of the heat dissipating members 15 and 17. Therefore, space portions 35 are formed between the heat radiating members 15 and 17 that are inside the heat radiating member 15, between the heat radiating members 17 and 19 that are inside the heat radiating member 17, and inside the heat radiating member 19, respectively. Has been. These space portions 35 communicate with each other via a vent hole H (FIG. 1) provided at a position on the substrate 14 which is the lower end portion of each of the heat dissipating members 15, 17, and 19 and the vent hole H of the heat dissipating member 15. It communicates with the outside of the lighting device 11 via the.

  The LED 23 has an element substrate 37 bonded to a silver plating layer 27 with a light-transmitting die bond material 36, for example, and a semiconductor light emitting layer 38 is laminated on the element substrate 37, and electrodes are formed on the semiconductor light emitting layer 38. Reference numerals 41 and 42 denote semiconductor chips disposed apart from each other. Further, these electrodes 41 and 42 are electrically connected to the conductors 33 and 33 by bonding wires 44 and 45. Accordingly, the LEDs 23 are connected to each other in series by the conductor 33. The LED 23 is sealed with a sealing member (not shown).

  The die bond material 36 is an adhesive made of, for example, a translucent silicone resin.

  The element substrate 37 is a sapphire substrate, for example, and the semiconductor light emitting layer 38 is an element that emits monochromatic light such as blue.

  The sealing member is made of, for example, a resin in which a phosphor (not shown) is mixed. This phosphor emits light of a color different from that of the LED 23 when excited by a part of the light emitted from the LED 23, for example. In this embodiment, yellow light is emitted with respect to the blue light of the LED 23. By doing so, it is configured to obtain white illumination light.

  Further, the protruding portion 25 is provided such that the height including the silver plating layer 27, for example, makes the height position of the upper surface of the LED 23 equal to or higher than the height position of the conductor 33.

  The silver plating layer 27 is provided at a time together with, for example, the light reflection layer 34 by electroless plating.

  The adhesive layer 31 is configured by impregnating a thermosetting adhesive resin into a sheet made of a fiber material such as paper or cloth.

  For the insulating layer 32, for example, a white glass epoxy substrate is used in order to obtain light reflection performance.

  Next, the operation of the first embodiment will be described.

  By screwing the base 12 into a light bulb socket or the like (not shown) and supplying power from a commercial AC power source, the lighting circuit 21 performs AC-DC conversion and the voltage is adjusted, and each substrate is connected via the conductor 33 and bonding wires 44 and 45. A predetermined voltage is applied to each LED 23 of 16, 18, and 20, and these LEDs 23 light up.

  A part of the light emitted from the LED 23 strikes the phosphor of the sealing member and excites the phosphor to emit yellow light, so that the LED 23 passes through the sealing member without hitting the phosphor of the sealing member. The white light is mixed with the blue light.

  The illumination light from each LED 23 is directly irradiated to the outside of the LED illumination device 11, and a part of the illumination light is reflected by the outer peripheral surfaces of the heat radiating members 17 and 19 and irradiated in the vertical direction.

  Further, the heat from each LED 23 is transmitted to the heat radiating members 15, 17, 19 through the substrates 16, 18, 20, and is radiated from the surface of these heat radiating members 15, 17, 19 to the outside and the space 35, The heat radiated to the space 35 is radiated to the outside through the vent hole H, and the remaining part is radiated by the substrate 14, the outer member 13, the base 12, and the like.

  As described above, the LED 23 is mounted on the upper surface of the substrate 16 (substrate 18), and the heat radiating member 17 (heat radiating member 19) is projected above the upper surface of the substrate 16 (substrate 18). 19) By arranging the lower surface of the substrate 18 (substrate 20) on which the LED 23 is mounted on the upper surface above the upper surface of the LED 19), the LEDs 23 are arranged in three dimensions, and from the heat radiation member 17 (heat radiation member 19). It is possible to dissipate heat to ensure heat dissipation, improve luminous efficiency, and suppress a decrease in lifetime.

  That is, by arranging the boards 16, 18, and 20 in three steps in a step shape by the heat radiating members 15, 17, and 19, the heat from the LED 23 is also dispersed, and the heat radiating efficiency by the heat radiating members 15, 17, and 19 is ensured. it can.

  As a result, even if the LED lighting device 11 is downsized, the heat radiation area can be secured by arranging the substrates 16, 18, and 20 in three dimensions with the heat dissipation members 17 and 19, so that the LED lighting device 11 can be downsized. it can.

  In addition, since the annular substrates 16, 18, and 20 are arranged concentrically with each other, the arrangement space of the substrates 16, 18, and 20 can be stored inward from the outer edge portion of the substrate 16. , Space saving.

  Further, by cutting the substrates 16, 18, and 20 concentrically from the same large substrate, the substrates 16, 18, and 20 can be efficiently formed by efficiently using the large substrate.

  When the light source is disposed on the planar substrate, for example, when a spherical glove or the like is attached to the outer member, uneven light distribution may occur, whereas the heat radiating member 17, The outer peripheral surface of 19 has a reflection function to reflect the light from the LED 23 on the substrates 16 and 18, so that the light from the LED 23 is reflected in the vertical direction on the outer peripheral surface of the heat dissipating members 17 and 19 to increase light emission. And can be dispersed to suppress uneven light distribution.

  In addition, the LEDs 23 are arranged in a circular shape on the substrates 16, 18 and 20, and a part of the illumination light from the LEDs 23 is reflected by the cylindrical heat radiation members 17 and 19, so that the LEDs are arranged in a square shape or the like. As compared with the case where the light is reflected by the rectangular tube-shaped heat radiating member, the light from the LED 23 can be reflected more uniformly, and a more uniform light distribution can be obtained.

  Therefore, since the heat dissipation capability can be increased even for LED lighting devices having the same cross-sectional area, more power can be input and a large luminous flux can be realized.

  Next, FIG. 4 shows a second embodiment, and FIG. 4 is a front view in which a part of the lighting device is cut away. In addition, about the structure and effect | action similar to the said 1st Embodiment, the same code | symbol is attached | subjected and the description is abbreviate | omitted.

  In the second embodiment, an annular substrate 46 having an LED 23 mounted on the upper surface thereof is concentric with the substrates 16, 18, and 20 in the same manner as the substrates 16 and 18 in the first embodiment. The inclined surfaces 47 are formed on the outer peripheral surfaces of the heat dissipating members 15, 17, and 19, respectively.

  That is, the heat dissipating member 15 is so arranged that the entire outer peripheral surface is reduced in diameter from the LED 23 side to the upper side of the substrate 14 so that the light from the LED 23 of the substrate 14 is reflected to the upper side in the figure which is the front end side. For example, the entire outer peripheral surface is an inclined surface 47 inclined in the direction of the central axis from the lower side to the upper side.

  Similarly, in the heat dissipation members 17 and 19, the entire outer peripheral surface at a position above the upper surface, which is the mounting surface of the LED 23 of the substrates 16 and 18, becomes an inclined surface 47 inclined in the direction of the central axis from the lower side to the upper side. These inclined surfaces 47 are configured to reflect light from the LED 23 upward in the drawing.

  Further, the heat dissipating member 19 is formed in a columnar shape that does not have the space portion 35 of the first embodiment. Further, the substrate 20 disposed on the heat radiating member 19 is formed in a disk shape placed on the entire upper surface of the heat radiating member 19.

  As in the first embodiment, the base 12 is screwed into a light bulb socket or the like (not shown), and power is supplied from a commercial AC power source, whereby a predetermined voltage is applied to each LED 23 on each substrate 16, 18, 20, 46. When applied, these LEDs 23 light up.

  A part of the light emitted from the LED 23 strikes the phosphor of the sealing member and excites the phosphor to emit yellow light, so that the LED 23 passes through the sealing member without hitting the phosphor of the sealing member. The white light is mixed with the blue light.

  The illumination light from each LED 23 is directly irradiated to the outside of the LED illumination device 11, and a part of the illumination light is reflected and irradiated upward by the inclined surfaces 47 of the respective heat radiation members 15, 17, and 19.

  The heat from each LED 23 is transmitted to the heat radiating members 15, 17, 19 through the substrates 16, 18, 20, 46, and radiated from the surface of the heat radiating members 15, 17, 19 to the outside or the space 35. The heat radiated to the space 35 is radiated upward, and the remaining part is radiated by the substrate 14, the outer member 13, the base 12, and the like.

  As a result, also in the second embodiment, the same operational effects as in the first embodiment can be obtained, and a part of the light from the LED 23 is directed to the heat radiating members 15, 17, 19. By providing the inclined surface 47 to be reflected, it is possible to irradiate the tip side and the radial direction side equally, thereby increasing light emission and suppressing uneven light distribution.

  In each of the above embodiments, the above configuration can also be used for general LED lighting devices without a base 12.

  The outer member 13 may be provided with a globe that is a covering member that covers the entire substrates 16, 18, 20, 46 and the heat radiating members 15, 17, 19 and diffuses light from the LED 23.

  Further, a globe may be provided so as to cover only the LEDs 23 of the respective substrates 16, 18, 20, 46.

  And it is good also as a structure which permeate | transmits the light from LED23 as illumination light as it is, without providing fluorescent substance in a sealing member.

  Further, the substrate and the heat radiating member are not limited to the three-stage configuration as described above, and may have two stages or four or more stages.

  Furthermore, the loop shape of each substrate 16, 18, 20, 46 is not limited to an annular shape, but may be a polygonal shape, an elliptical shape, a spiral shape, or the like. Therefore, the heat radiating members 15, 17, and 19 are not limited to a cylindrical shape or a columnar shape as long as the shape corresponds to the shape of each of the substrates 16, 18, 20, and 46.

  The details of the substrates 16, 18, 20, and 46 are not limited to the above configuration.

  Further, one substrate and another substrate are not limited to a pair.

It is the front view which notched a part of illuminating device which shows the 1st Embodiment of this invention. It is a top view of an illuminating device same as the above. FIG. 3 is a partial cross-sectional view of FIG. 2. It is the front view which notched some lighting apparatuses which show the 2nd Embodiment of this invention.

Explanation of symbols

11 LED lighting device as a lighting device
15, 17, 19 Heat dissipation member
16, 18, 20, 46 substrate
23 LED as light source

Claims (3)

A substrate having a light source mounted on one side and having a loop shape;
A heat dissipating member disposed so as to protrude above the one surface side of the one substrate;
A light source is mounted on one side, and the other side is disposed on the upper side of the heat dissipation member;
A lighting device characterized by comprising: The lighting device according to claim 1, wherein each substrate has an annular shape and is disposed concentrically with each other. The lighting device according to claim 1, wherein the heat dissipating member has a reflection function on the outer surface for reflecting light from the light source of one substrate.

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