WO2014024339A1 - Bulb-type lamp, illumination device, and method for manufacturing bulb-type lamp - Google Patents

Bulb-type lamp, illumination device, and method for manufacturing bulb-type lamp Download PDF

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Publication number
WO2014024339A1
WO2014024339A1 PCT/JP2013/001171 JP2013001171W WO2014024339A1 WO 2014024339 A1 WO2014024339 A1 WO 2014024339A1 JP 2013001171 W JP2013001171 W JP 2013001171W WO 2014024339 A1 WO2014024339 A1 WO 2014024339A1
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WO
WIPO (PCT)
Prior art keywords
substrate
globe
led
shaped lamp
light bulb
Prior art date
Application number
PCT/JP2013/001171
Other languages
French (fr)
Japanese (ja)
Inventor
洋介 藤巻
次弘 松田
康輔 菅原
Original Assignee
パナソニック株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Publication of WO2014024339A1 publication Critical patent/WO2014024339A1/en

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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0284—Details of three-dimensional rigid printed circuit boards
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2103/00—Elongate light sources, e.g. fluorescent tubes
    • F21Y2103/10—Elongate light sources, e.g. fluorescent tubes comprising a linear array of point-like light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007—Types of components
    • H05K2201/10106—Light emitting diode [LED]
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10409—Screws
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1572—Processing both sides of a PCB by the same process; Providing a similar arrangement of components on both sides; Making interlayer connections from two sides
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/30—Details of processes not otherwise provided for in H05K2203/01 - H05K2203/17
    • H05K2203/302—Bending a rigid substrate; Breaking rigid substrates by bending

Definitions

  • the present invention relates to a light bulb shaped lamp, a lighting device, and a light bulb shaped lamp manufacturing method, and more particularly, to a light bulb shaped lamp using a semiconductor light emitting element, a lighting device using the same, and a light bulb shaped lamp manufacturing method.
  • LEDs Light Emitting Diodes
  • Patent Document 1 discloses a conventional bulb-type LED lamp.
  • the conventional light bulb shaped LED lamp disclosed in Patent Document 1 includes a globe, a substrate disposed in the globe, and an LED mounted on the substrate.
  • a conventional light bulb shaped LED lamp realizes a wide light distribution angle like an incandescent light bulb using a filament coil.
  • the light distribution angle of the LED is limited to a certain range, so in order to realize a wide light distribution angle, the light irradiation direction of the LED should be adjusted to a desired direction. It is necessary to adjust the light distribution angle.
  • the conventional bulb-type LED lamp has a problem in that the light distribution angle of the LED cannot be easily adjusted because the LED is configured to be fixed at a constant angle in the globe.
  • the present invention has been made to solve such a problem, and an object thereof is to provide a light bulb shaped lamp, a lighting device, and a method for manufacturing the light bulb shaped lamp, in which the light distribution angle can be easily adjusted.
  • a light bulb shaped lamp according to the present invention is a light bulb shaped lamp comprising a globe and a semiconductor light emitting element arranged inside the globe, and is arranged inside the globe.
  • the bendable substrate is provided, and the substrate has a bent portion formed by being bent and a flat portion on which the semiconductor light emitting element is disposed.
  • a drive circuit for supplying power to the semiconductor light emitting element, and a lead wire for electrically connecting the semiconductor light emitting element and the drive circuit
  • the substrate may have a connection portion connected to the lead wire on a surface different from the plane including the flat portion.
  • the substrate further includes a support portion that extends in a direction intersecting with the planar portion and supports the semiconductor light emitting element disposed on the planar portion. May be.
  • the substrate may include a metal base layer and an insulating layer having the planar portion disposed on the base layer.
  • a plurality of the semiconductor light emitting elements may be provided, and the plurality of semiconductor light emitting elements may be arranged around the center position of the globe.
  • an aspect of the lighting device according to the present invention is a lighting device including any one of the above-described light bulb shaped lamps.
  • An aspect of the method for manufacturing a light bulb shaped lamp according to the present invention is a method for producing a light bulb shaped lamp comprising a globe and a semiconductor light emitting element disposed inside the globe, wherein the semiconductor light emitting device is provided on a flat surface.
  • the present invention it is possible to realize a light bulb shaped lamp, an illuminating device, and a method of manufacturing a light bulb shaped lamp whose light distribution angle can be easily adjusted.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing one cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 5 is a perspective view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 6 is a diagram showing a cross section of the LED in the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a diagram showing one cross section of the configuration of the light bulb
  • FIG. 7 is a flowchart for explaining a method of manufacturing the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 8 is a diagram for explaining a method of manufacturing the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 9 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.
  • FIG. 10 is a diagram showing a configuration of an LED module according to Modification 1 of the embodiment of the present invention.
  • FIG. 11 is a diagram showing a configuration of an LED module according to Modification 2 of the embodiment of the present invention.
  • FIG. 12 is a diagram showing a configuration of an LED module according to Modification 3 of the embodiment of the present invention.
  • FIG. 13 is a diagram showing a configuration of an LED module according to Modification 4 of the embodiment of the present invention.
  • FIG. 14 is a diagram showing a configuration of an LED module according to Modification 5 of the embodiment of the present invention.
  • FIG. 15 is a diagram showing a configuration of an LED module according to Modification 6 of the embodiment of the present invention.
  • FIG. 16 is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention.
  • FIG. 17A is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention.
  • FIG. 17B is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention.
  • FIG. 18 is a diagram showing a configuration of an LED module according to Modification 8 of the embodiment of the present invention.
  • FIG. 1 is an external perspective view of a light bulb shaped lamp 1 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • a light bulb shaped lamp 1 is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb, and includes a globe 10 and an LED that is a light source. Power is supplied to the module 20, the pedestal 40 on which the LED module 20 is placed, the housing 50 in which the drive circuit 70 is disposed, the metal member 60 disposed in the housing 50, and the LED module 20. A driving circuit 70 for receiving power and a base 80 for receiving power from the outside.
  • the bulb-type lamp 1 further includes lead wires 70a to 70d, a ring-shaped coupling member 30, and a screw 90.
  • an envelope is constituted by the globe 10, the housing 50 (outer housing portion 52), and the base 80. That is, the globe 10, the housing 50 (outer housing portion 52), and the base 80 are exposed to the outside, and each outer surface is exposed to the outside air. Further, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to, for example, a 40 W type.
  • the upper direction shown in these drawings is the upper direction, and the lower direction is the lower direction. That is, the globe 10 is disposed above the base 80.
  • the definition of the above direction is independent of the direction when the light bulb shaped lamp 1 is attached to the lighting fixture, and when the light bulb shaped lamp 1 is attached to the lighting fixture, any direction is upward or downward. It doesn't matter.
  • FIG. 3 is a view showing one section of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp 1 according to the embodiment of the present invention, and shows a cross sectional view when rotated about 90 ° from the state of FIG. 3 around the lamp axis. ing.
  • the lamp axis is an axis that becomes a rotation center when the bulb lamp 1 is attached to the socket of the lighting device, and coincides with the rotation axis of the base 80.
  • FIG.3 and FIG.4 the cross-sectional part of each component is shown except a circuit element. In FIG. 4, the circuit elements are omitted.
  • the globe 10 is a translucent cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp.
  • the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
  • the globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.
  • the shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end.
  • the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.
  • a glass bulb having the same shape as a general incandescent bulb can be used.
  • a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
  • the opening 11 of the globe 10 is located between the pedestal 40 and the housing 50. More specifically, the opening 11 of the globe 10 is press-fitted into the groove of the coupling member 30 disposed between the pedestal 40 and the housing 50. Thereby, the globe 10 is fixed. Further, a silicone resin is applied between the opening 11 of the globe 10 and the end of the housing 50 on the globe side, but this silicone resin is not always necessary.
  • the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function.
  • a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10.
  • the shape of the globe 10 is not limited to the A shape, and may be a spheroid or an oblate sphere.
  • the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
  • the LED module 20 is a light emitting module having a semiconductor light emitting element, and emits predetermined light. As shown in FIGS. 3 and 4, the LED module 20 is disposed inside the globe 10 and includes a plurality of LEDs 22. The plurality of LEDs 22 are preferably arranged around a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Thus, by arranging the LED 22 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to an incandescent light bulb using a conventional filament coil.
  • the LED module 20 is mounted on the pedestal 40 and emits light by the power supplied via the lead wires 70a and 70b. Note that the bottom surface of the LED module 20 is bonded to the pedestal 40 with an adhesive or the like. The detailed configuration of the LED module 20 will be described later.
  • the coupling member 30 is a member that couples the globe 10, the pedestal 40, and the metal member 60. As shown in FIG. 2, the coupling member 30 is configured in a ring shape so as to surround the periphery of the pedestal 40 (small diameter portion 40a).
  • the coupling member 30 can be molded by curing a fluid insulating resin (for example, silicon) poured into the gap between the outer peripheral surface of the base 40 and the outer portion 52a of the outer casing 52.
  • the coupling member 30 is fitted into a vertical groove 30 a formed in an annular shape so that the opening 11 of the globe 10 is inserted, and a horizontal groove provided in the base 40.
  • four protrusions 30c protruding downward (on the base side) are provided. Note that the outer surface of the coupling member 30 is in contact with the inner surface of the outer housing portion 52 of the housing 50.
  • the base 40 is a member on which the LED module 20 is placed, and is made of metal.
  • the configuration of the pedestal 40 will be described in detail with reference to FIGS. 3 and 4.
  • the pedestal 40 is a member mainly surrounded by the casing 50 (outer casing section 52). As shown in FIGS. 3 and 4, the pedestal 40 is configured to close the opening 11 of the globe 10.
  • the pedestal 40 is made of a metal material, and is made of an aluminum alloy in the present embodiment. Thereby, the heat generated in the LED module 20 can be efficiently conducted to the base 40. Thereby, the fall of the luminous efficiency of LED22 by the temperature rise and the fall of a lifetime can be suppressed.
  • the pedestal 40 is a cap-shaped member having a stepped portion, and includes a small diameter portion 40a having a small diameter and a large diameter portion 40b having a large diameter.
  • a lateral groove portion is formed along the circumferential direction of the small diameter portion 40a.
  • the coupling member 30 is disposed on the step portion of the pedestal 40 (above the large diameter portion 40b), and the flange 30b of the coupling member 30 and the lateral groove portion of the pedestal 40 are fitted to each other so that the coupling member 30 becomes the pedestal. 40 is fixed.
  • the small diameter portion 40 a is a disk-shaped member configured to support the LED module 20 and close the opening 11 of the globe 10.
  • the LED module 20 is placed at the center of the small diameter portion 40a.
  • the outer peripheral surface of the small diameter portion 40a and the inner peripheral surface of the coupling member 30 are in surface contact.
  • the small diameter portion 40a is provided with two through holes 40a1 for inserting the lead wires 70a and 70b.
  • the large-diameter portion 40 b is configured in a substantially cylindrical shape, and the outer peripheral surface is in surface contact with the inner peripheral surface of the metal member 60. Thereby, the heat of the base 40 can be efficiently conducted to the metal member 60.
  • four concave portions 40b1 are formed as guide holes when caulking with the metal member 60.
  • the housing 50 is an insulating case having an insulating property in which the drive circuit 70 is disposed on the inner side, and includes an inner housing portion (first housing portion) 51 and an outer housing portion (second housing portion) 52. It is constituted by.
  • the housing 50 can be made of an insulating resin material, and can be resin-molded with, for example, polybutylene terephthalate (PBT).
  • the inner casing 51 is an internal member (circuit case) that is disposed so as to surround the drive circuit 70 and is not visible from the outside of the lamp.
  • the inner housing part 51 includes a circuit cap part 51 a disposed so as to cover the drive circuit 70 and a circuit holder part 51 b disposed so as to cover the periphery of the drive circuit 70.
  • the circuit cap part 51a and the circuit holder part 51b are separated, and the circuit cap part 51a and the circuit holder part 51b are arranged in a non-contact state.
  • the upper surface shape of the circuit cap portion 51a is configured to follow the inner surface shape of the base 40. As a result, the circuit cap portion 51 a is fitted into the pedestal 40 and is fastened and fixed to the pedestal 40 by the screws 90.
  • the circuit holder 51b is configured in a cylindrical shape.
  • the base-side end of the circuit holder 51b is connected to the outer casing 52, and in this embodiment, the circuit holder 51b and the outer casing 52 are integrally molded.
  • a stepped portion on which the circuit board 71 of the drive circuit 70 is placed is formed at the globe side end of the circuit holder portion 51b.
  • the outer casing 52 is at least a part of the lamp envelope, and is an external member arranged so as to be visible from the outside of the lamp. A region other than the portion covered with the base 80 on the outer peripheral surface of the outer casing 52 is exposed to the outside of the lamp.
  • the outer housing part 52 has an outer part 52a exposed to the outside of the lamp and a screwing part 52b screwed into the base 80.
  • the outer portion 52a is configured by a substantially cylindrical member having a diameter larger than that of the screwing portion 52b.
  • the outer portion 52a is configured such that the diameter gradually decreases toward the base 80 side. That is, the inner peripheral surface and the outer peripheral surface of the outer portion 52a are inclined with respect to the lamp axis. Since the outer surface of the outer portion 52a is exposed to the atmosphere, the heat conducted to the housing 50 is radiated mainly from the outer surface of the outer portion 52a.
  • the screwing portion 52b is configured by a substantially cylindrical member having a diameter smaller than that of the outer portion 52a.
  • a base 80 is screwed into the screwing portion 52b. That is, the outer peripheral surface of the screwing portion 52 b is configured to contact the inner peripheral surface of the base 80.
  • the outer casing 52 (outer section 52 a) configured in this way is configured to surround the inner casing 51, the metal member 60, the base 40, and the coupling member 30.
  • a predetermined gap is provided between the inner surface of the outer casing 52 (outer part 52a) and the outer surface of the inner casing 51 (circuit cap part 51a and circuit holder part 51b).
  • the outer casing 52 (outer section 52a) and the metal member 60 are not in contact with each other, and as shown in FIG. 4, the inner surface of the outer casing 52 (outer section 52a) A certain gap exists between the outer surface of the metal member 60.
  • the metal member 60 is configured in a skirt shape so as to surround the inner casing 51 in the casing 50, and is disposed between the inner casing 51 and the outer casing 52. Thereby, the metal member 60 can be in a non-contact state with the drive circuit 70, and the insulation of the drive circuit 70 can be ensured.
  • the metal member 60 is made of a metal material and functions as a heat sink. Thereby, the heat generated from the LED module 20 and the drive circuit 70 can be efficiently radiated using the metal member 60. Specifically, the heat of the LED module 20 and the drive circuit 70 is propagated to the outer casing 52 through the inner casing 51 and the metal member 60, and is radiated from the outer casing 52 to the outside of the lamp. Can do.
  • the metal material of the metal member 60 for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat propagated to the metal member 60 can be efficiently propagated.
  • the metal member 60 is in contact with the pedestal 40.
  • the inner peripheral surface of the metal member 60 and the outer peripheral surface of the base 40 (large diameter portion 40b) are in surface contact. Since both the metal member 60 and the pedestal 40 are made of metal, the heat of the LED module 20 that has been conducted to the pedestal 40 is efficiently conducted to the metal member 60.
  • the metal member 60 in the present embodiment is not in contact with the outer casing portion 52 (outer portion 52a, screwing portion 52b) in the casing 50, and the inner casing portion 51 (circuit cap portion 51a, circuit). It is not in contact with the holder part 51b). That is, the metal member 60 is disposed in a non-contact state in both the inner housing part 51 and the outer housing part 52. Thereby, the insulation as the whole housing
  • the drive circuit (circuit unit) 70 is a lighting circuit (power supply circuit) for lighting (emitting) the LEDs 22 of the LED module 20, and supplies predetermined power to the LED module 20.
  • the drive circuit 70 converts AC power supplied from the base 80 via the pair of lead wires 70c and 70d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 70a and 70b. Supply.
  • the drive circuit 70 includes a circuit board 71 and a plurality of circuit elements (electronic components) 72 mounted on the circuit board 71.
  • the circuit board 71 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 72 mounted on the circuit board 71.
  • the circuit board 71 is arranged in a posture in which the main surface is orthogonal to the lamp axis. As shown in FIG. 4, the circuit board 71 is placed and clamped on the circuit holder part 51 b of the inner housing part 51.
  • the circuit element 72 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements.
  • the drive circuit 70 configured as described above is covered with the inner casing portion 51 of the casing 50, and thus is in a non-contact state with the metal member 60. Thereby, the insulation of the drive circuit 70 is ensured.
  • the drive circuit 70 is not limited to a smoothing circuit, and a dimmer circuit, a booster circuit, and the like can be appropriately selected and combined.
  • Each of the lead wires 70a to 70d is an alloy copper lead wire, and is composed of a core wire made of alloy copper and an insulating resin film covering the core wire.
  • the pair of lead wires 70 a and 70 b are electric wires for supplying DC power for lighting the LED module 20 from the drive circuit 70 to the LED module 20.
  • the drive circuit 70 and the LED module 20 are electrically connected by a pair of lead wires 70a and 70b.
  • one end portion (core wire) of each of the lead wires 70a and 70b is electrically connected to the power output portion (metal wiring) of the circuit board 71 by solder or the like, and the other end of each other.
  • the end portion (core wire) is electrically connected to the power input portion (electrode terminal) of the LED module 20 by solder or the like.
  • the pair of lead wires 70 c and 70 d are electric wires for supplying AC power from the base 80 to the drive circuit 70.
  • the drive circuit 70 and the base 80 are electrically connected by a pair of lead wires 70c and 70d.
  • one end portion (core wire) of each of the lead wires 70c and 70d is electrically connected to the base 80 (shell portion or eyelet portion), and each other end portion (core wire) is
  • the power input part (metal wiring) of the circuit board 71 is electrically connected by solder or the like.
  • the base 80 is a power receiving unit that receives power for causing the LEDs 22 of the LED module 20 to emit light from outside the lamp.
  • the base 80 is attached to a socket of a lighting fixture, for example, and when the light bulb shaped lamp 1 is turned on, the base 80 receives electric power from the socket of the lighting fixture.
  • the base 80 is supplied with AC power from a commercial power supply (AC 100 V).
  • the base 80 in the present embodiment receives AC power through two contact points, and the power received by the base 80 is input to the power input unit of the drive circuit 70 via a pair of lead wires 70c and 70b.
  • the base 80 has a metal bottomed cylindrical shape, and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion. Further, a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface of the base 80, and a screwing portion 52 b of the outer housing portion 52 is screwed on the inner peripheral surface of the base 80. A threaded portion for mating is formed.
  • the type of the base 80 is not particularly limited, but in this embodiment, a screw-type Edison type (E type) base is used.
  • E type screw-type Edison type
  • the base 80 an E26 type, an E17 type, an E16 type, or the like can be given.
  • FIG. 5 is a perspective view of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the LED module 20 includes a substrate 21, an LED 22, and a connector 23.
  • the LED module 20 in the present embodiment is a light emitting module of a surface mount (SMD: Surface Mount Device) type. That is, the LED module 20 is an LED module configured by mounting a plurality of SMD type LED elements on a substrate.
  • SMD Surface Mount Device
  • the substrate 21 is an LED mounting substrate for mounting the LEDs 22.
  • the substrate 21 in the present embodiment is a foldable flat plate-like rectangular substrate disposed inside the globe 10.
  • the substrate 21 includes an LED arrangement portion 21a, a bent portion 21b, a support portion 21c, a bent portion 21d, and a connector arrangement portion 21e.
  • the LED placement portion 21a is a flat rectangular portion on which the LEDs 22 are provided. Three LEDs 22 are placed on the flat surface portion 21a1 on the front surface (upper surface), and the back surface (the surface opposite to the flat surface portion 21a1). The three LEDs 22 are arranged on the flat planar portion 21a2 of the lower surface.
  • the LED 22 can be mounted easily. Moreover, since LED22 is mounted in both the surfaces (front surface and back surface) of the board
  • the bent portion 21b and the bent portion 21d are bent portions formed by bending the substrate 21. That is, the bent portion 21b and the bent portion 21d are formed by bending the rectangular substrate 21 at the positions of the bent portions 21b and 21d.
  • the bent portion 21b and the bent portion 21d maintain the bent state. That is, the positions of the LED placement portion 21a and the connector placement portion 21e with respect to the support portion 21c are fixed by the bent portion 21b and the bent portion 21d.
  • the bent portion 21b and the bent portion 21d are bent at a right angle so that the LED arrangement portion 21a and the connector arrangement portion 21e face the same direction, but the bending direction and angle are not limited. Further, even if the substrate 21 is bent once to form the bent portion 21b and the bent portion 21d, it can be bent again.
  • the support portion 21c is a portion that supports the LEDs 22 arranged in the plane portions 21a1 and 21a2 extending in a direction intersecting with the plane portions 21a1 and 21a2.
  • the support portion 21c is a flat rectangular portion extending in a direction orthogonal to the LED placement portion 21a. That is, the support portion 21c is connected to the LED placement portion 21a via the bent portion 21b, and serves as a support column that supports the LED placement portion 21a on which the LED 22 is placed.
  • the connector arrangement portion 21e is a flat rectangular portion in which the connector 23 is arranged on the upper surface and the lower surface is joined to the pedestal 40.
  • the connector placement portion 21e is connected to the support portion 21c through the bent portion 21d and is a bottom plate of the LED module 20 that extends in a direction orthogonal to the support portion 21c.
  • the connector 23 is a connection portion connected to the lead wires 70a and 70b in order to supply power to the LED 22.
  • the connector 23 is arrange
  • positioning part 21e which is a surface different from the plane containing plane part 21a1 and 21a2. That is, the LED 22, the LED placement portion 21a, the bent portion 21b, the support portion 21c, the bent portion 21d, the connector placement portion 21e, and the connector 23 are electrically connected by the wiring. Power is received from 70b through the connector 23 and the like.
  • the substrate 21 is a metal base substrate, and the LED arrangement portion 21a, the bent portion 21b, the support portion 21c, the bent portion 21d, and the connector arrangement portion 21e of the substrate 21 are made of a metal base layer 24a. And insulating layers 24b and 24c disposed on the base material layer 24a. That is, the base material layer 24a is a heat dissipation path for transferring the heat generated by the LED 22 to the pedestal 40 and radiating it.
  • the plane portion 21a1 is a plane formed on the insulating layer 24b, and the plane portion 21a2 is a plane formed on the insulating layer 24c.
  • the base material layer 24a is, for example, an iron (Fe) or aluminum (Al) layer
  • the insulating layers 24b, 24c are, for example, resin layers.
  • substrate 21 is a board
  • a flat rectangular substrate is used, but the substrate 21 may have any shape as long as it can be bent.
  • FIG. 6 is a diagram showing a cross section of the LED 22 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • Each LED 22 is a so-called SMD type light emitting device in which an LED chip and a phosphor are packaged, and as shown in FIG. 6, a package (container) 22a and an LED chip 22b accommodated in the package 22a And a sealing member 22c for sealing the LED chip 22b.
  • the LED 22 in the present embodiment is a white LED element that emits white light.
  • the package 22a is molded of white resin or the like, and includes an inverted frustoconical recess (cavity).
  • the inner side surface of the recess is an inclined surface and is configured to reflect light from the LED chip 22b upward.
  • the package 22a may be molded of a transparent resin or the like, and the light from the LED chip 22b may be irradiated to the side.
  • the LED chip 22b is an example of a semiconductor light emitting element, and is mounted in a recess of the package 22a.
  • the LED chip 22b is a bare chip that emits monochromatic visible light, and is die-bonded to the bottom surface of the recess of the package 22a by a die attach material (die bond material).
  • a blue LED chip that emits blue light when energized can be used as the LED chip 22b.
  • the sealing member 22c is a phosphor-containing resin containing a phosphor that is a light wavelength converter, and converts the wavelength of light from the LED chip 22b to a predetermined wavelength (color conversion) and seals the LED chip 22b. Thus, the LED chip 22b is protected.
  • the sealing member 22c is filled in the recess of the package 22a, and is sealed up to the opening surface of the recess.
  • a phosphor-containing resin in which YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. Can be used.
  • the sealing member 22c emits white light by the excited yellow light and the blue light of the blue LED chip. Is done.
  • the sealing member 22c may also contain a light diffusing material such as silica.
  • the LED 22 is configured. Although not shown, the LED 22 has two external connection terminals, a positive electrode and a negative electrode, and these external connection terminals and the wiring 22d are electrically connected. Moreover, in this Embodiment, although several LED22 on the board
  • the wiring 22d is a conductive thin film for electrically connecting the LEDs 22 to each other, and is patterned in a predetermined shape on the flat portions 21a1 and 21a2 of the substrate 21.
  • a metal wiring made of a metal such as copper or silver can be used as the wiring 22d.
  • the wiring 22d is intermittently formed along the longitudinal direction of the LED placement portion 21a in order to connect adjacent LEDs 22. Thereby, electric power is supplied to each LED 22 via the wiring 22d.
  • FIG. 7 is a flowchart for explaining a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 8 is a diagram for explaining a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the bent portions 21b and 21d are formed by bending the foldable substrate 21 in which the LEDs 22 are arranged on the flat portions 21a1 and 21a2 at positions different from the flat portions 21a1 and 21a2. Is formed (S102). Specifically, as shown in FIG. 8A, the substrate 21 is bent along the dotted line. Then, as shown in FIG. 8B, bent portions 21b and 21d are formed.
  • the folded substrate 21 is placed inside the globe 10 (S104). Specifically, the substrate 21 is disposed inside the globe 10 so that the centers of the plurality of LEDs 22 are located at the center of the globe 10.
  • the light bulb shaped lamp 1 is configured.
  • the substrate 21 includes the foldable substrate 21 disposed inside the globe 10, and the substrate 21 is bent to form a bent portion 21 b formed by bending. 21d and plane portions 21a1 and 21a2 on which the LEDs 22 are arranged.
  • the light bulb shaped lamp 1 by bending the substrate 21 on which the LED 22 is mounted, the light irradiation direction of the LED 22 can be adjusted to a desired direction, so that the light distribution angle can be easily adjusted.
  • the substrate 21 has a connector 23 which is a connection portion connected to the lead wires 70a and 70b on a surface different from the plane including the plane portions 21a1 and 21a2.
  • the angle of the surface on which the LED 22 is mounted is adjusted by bending the substrate 21, the angle of the surface is shifted in the configuration in which the lead wires 70a and 70b are connected to the surface on which the LED 22 is mounted.
  • the connector 23 is connected to a plane different from the plane including the plane portions 21a1 and 21a2
  • the lead wires 70a and 70b can be easily connected to the connector 23 while suppressing the adjustment of the light distribution angle. Can be connected.
  • the substrate 21 also has a support portion 21c that supports the LEDs 22 arranged on the plane portions 21a1 and 21a2, extending in a direction intersecting with the plane portions 21a1 and 21a2.
  • substrate 21 can also serve as the support
  • the substrate 21 includes a metal base layer 24a and insulating layers 24b and 24c disposed on the base layer 24a. That is, the substrate 21 improves the thermal conductivity of the substrate by the base material layer 24a while maintaining the insulating state of the substrate surface by the insulating layers 24b and 24c. Thereby, since the board
  • the plurality of LEDs 22 are arranged around the center position of the globe 10. Thereby, in the light bulb shaped lamp 1, a filament feeling like a conventional incandescent light bulb can be reproduced with a simple configuration.
  • the bendable substrate 21 in which the LEDs 22 are arranged on the flat portions 21a1 and 21a2 is bent at a position different from the flat portions 21a1 and 21a2. 21b and 21d are formed, and the bent substrate 21 is disposed inside the globe 10.
  • the light irradiation direction of the LED 22 can be adjusted to a desired direction by bending the substrate 21 on which the LED 22 is mounted, so that the light distribution angle can be easily adjusted. Can do.
  • FIG. 9 is a schematic cross-sectional view of the illumination device 2 according to the embodiment of the present invention.
  • the lighting device 2 As shown in FIG. 9, the lighting device 2 according to the embodiment of the present invention is used, for example, mounted on an indoor ceiling, and includes the light bulb shaped lamp 1 according to the above embodiment and the lighting fixture 3. Prepare.
  • the lighting fixture 3 turns off and turns on the light bulb shaped lamp 1 and includes a fixture main body 4 attached to the ceiling and a lamp cover 5 that covers the light bulb shaped lamp 1.
  • the appliance body 4 has a socket 4a.
  • the base 80 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.
  • the substrate in the following modifications is formed by the above-described foldable flat plate-like substrate as in the above embodiment, and a bent portion is formed by bending, and an LED is formed on the flat portion. Is arranged.
  • the substrate is disposed inside the globe so that the centers of the plurality of LEDs are located at the center of the globe.
  • FIG. 10 is a diagram showing a configuration of the LED module 120 according to the first modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 120 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 120 viewed from the front in FIG. .
  • the LED module 120 three LEDs 22 are arranged on the flat portion of the upper upper surface of the bent substrate 121, and three LEDs 22 are arranged on the flat portion of the upper lower surface of the bent substrate 122.
  • a connector 23 is disposed below the boards 121 and 122, and power is supplied to each LED 22.
  • FIG. 11 is a diagram showing a configuration of an LED module 220 according to the second modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 220 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 220 viewed from the front in FIG. .
  • the LED module 220 As shown in the figure, in the LED module 220, four LEDs 22 are arranged on the flat part on the upper part of the folded substrate 221 and four LEDs 22 are arranged on the flat part on the upper part of the bent board 222. ing. Note that both ends of the substrate 221 and the substrate 222 are bent in opposite directions. In addition, a connector 23 is disposed below the boards 221 and 222, and power is supplied to the respective LEDs 22.
  • FIG. 12 is a diagram showing a configuration of an LED module 320 according to the third modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 320 as viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 320 as viewed from the front in FIG. .
  • the LED module 320 As shown in the figure, in the LED module 320, four LEDs 22 are arranged on the flat portion of the upper upper surface of the bent substrate 321 and four LEDs 22 are arranged on the flat portion of the upper lower surface of the substrate 321.
  • the substrate 321 is bent at both ends so that the bent portion serves as a support column and supports the LED 22.
  • a connector 23 is disposed below the substrate 321, and power is supplied to each LED 22.
  • FIG. 13 is a diagram showing a configuration of an LED module 420 according to Modification 4 of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 420 as viewed from the front in FIG. 4, and FIG. 4B is a view of the LED module 420 as viewed from the right side in FIG. .
  • the LED module 420 eight LEDs 22 are arranged on the plane portion of the upper right surface of the bent substrate 421, and eight LEDs 22 are arranged on the plane portion of the upper left surface of the substrate 421. Note that the lower end of the substrate 421 is bent toward the left side. In addition, a connector 23 is disposed below the substrate 421, and power is supplied to each LED 22.
  • FIG. 14 is a diagram showing a configuration of an LED module 520 according to Modification 5 of the embodiment of the present invention.
  • FIG. 4A is a view of the LED module 520 viewed from above in FIG. 4
  • FIG. 4B is a view of the LED module 520 viewed from the front in FIG. (C) of the same figure is the figure which looked at the LED module 520 from the right side in FIG.
  • the LED module 520 eight LEDs 22 are arranged on each of the upper, lower, left and right plane portions of the bent substrate 521.
  • the lower end of the substrate 521 is bent toward the right side, and the upper part is bent three times so that the cross section becomes a square shape.
  • a connector 23 is disposed below the substrate 521 and power is supplied to each LED 22.
  • FIG. 15 is a diagram showing a configuration of an LED module 620 according to Modification 6 of the embodiment of the present invention. Specifically, this figure is a perspective view of the LED module 620 as seen from the upper right direction in FIG.
  • the protruding flat plate portion of the upper part of the substrate 621 is bent toward the rear of the figure, and three LEDs 22 are arranged on each of the eight side surfaces.
  • substrate 621 is bent toward the front of the figure.
  • the connector 23 is disposed below the substrate 621 and power is supplied to each LED 22.
  • FIGS. 16, 17A, and 17B are diagrams showing configurations of LED modules 720 and 820 according to Modification 7 of the embodiment of the present invention.
  • FIG. 16 is a perspective view of the LED module 720 viewed from the upper right direction in FIG. 17A is a view of the LED module 720 as viewed from the right side in FIG. 4, and
  • FIG. 17B is a view showing an LED module 820 as another configuration example of the LED module 720.
  • the substrate 721 is bent downward, and four LEDs 22 are arranged on each of the two side surfaces. Further, lead wires 70a and 70b are connected to the lower surface of the substrate 721, and power is supplied to the respective LEDs 22 from the lead wires 70a and 70b. In this modification, the substrate 721 is supported in the globe by the lead wires 70a and 70b. However, a configuration in which a support column for supporting the substrate 721 is separately provided may be used.
  • the LED 22 is an LED element that can irradiate light in five directions other than the lower side.
  • the LED module 720 can irradiate light with a wide light distribution angle.
  • the LED module 720 may have a configuration in which the lead wires 70a and 70b are connected to the upper surface of the substrate 721.
  • lead wires 70a and 70b are formed on the upper surface of the substrate 821. May be connected.
  • FIG. 18 is a diagram showing a configuration of an LED module 920 according to Modification 8 of the embodiment of the present invention. Specifically, this figure is a view of the LED module 920 as seen from the front in FIG.
  • the substrate 921 is bent in a bellows shape, and the LEDs 22 are arranged on the respective side surfaces.
  • lead wires 70a and 70b are connected to both ends of the substrate 921, and power is supplied to the respective LEDs 22 from the lead wires 70a and 70b.
  • the substrate 921 is supported in the globe by the lead wires 70a and 70b.
  • a configuration in which a support column for supporting the substrate 921 is provided may be used.
  • the substrate 921 is bent in a bellows shape, but the substrate may be bent in a spiral shape.
  • the light bulb shaped lamp and the lighting device according to the present invention have been described based on the embodiments and the modifications thereof, but the present invention is not limited to these embodiments and modifications.
  • the LED module 20 is an SMD type LED module, but is not limited thereto.
  • a COB (Chip On Board) type LED module in which a bare chip is directly mounted on the substrate 21 may be used.
  • the LED module 20 is configured to emit white light by the blue LED and the yellow phosphor, but is not limited thereto.
  • a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
  • the LED 22 may be an LED that emits a color other than blue.
  • a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles.
  • a wavelength conversion material other than the phosphor particles may be used.
  • the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light.
  • a material containing a substance that emits light may be used.
  • the LED is exemplified as the light emitting element.
  • a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence), or an inorganic EL may be used.
  • the bulb-type LED lamp using the globe 10 having the same shape as the incandescent bulb is used.
  • the present invention is not limited to this. That is, in the present embodiment, the size of the globe 10 is larger than the size of the housing 50, but the present invention is also applicable to a light bulb shaped lamp in which the size of the globe 10 is smaller than the size of the housing 50. Can do.
  • the screwing part 52 b is a part of the outer casing part 52, but may be a part of the inner casing part 51. That is, the screwing part 52b may be regarded as a part of a circuit case that houses the drive circuit 70, and more specifically, the screwing part 52b may be a part of the circuit holder part 51b.
  • the present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • General Engineering & Computer Science (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)

Abstract

A bulb-type lamp (1) provided with a globe (10) and LEDs (22) disposed inward of the globe (10), wherein the bulb-type lamp (1) is provided with a bendable substrate (21) disposed inward of the globe (10), and the substrate (21) has bent parts (21b, 21d) formed by bending and flat parts (21a1, 21a2) on which the LEDs (22) are disposed.

Description

電球形ランプ、照明装置及び電球形ランプの製造方法Light bulb shaped lamp, lighting device, and method of manufacturing light bulb shaped lamp
　本発明は、電球形ランプ、照明装置及び電球形ランプの製造方法に関し、特に、半導体発光素子を用いた電球形ランプ、これを用いた照明装置、及び電球形ランプの製造方法に関する。 The present invention relates to a light bulb shaped lamp, a lighting device, and a light bulb shaped lamp manufacturing method, and more particularly, to a light bulb shaped lamp using a semiconductor light emitting element, a lighting device using the same, and a light bulb shaped lamp manufacturing method.
　近年、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）等の半導体発光素子は、小型、高効率及び長寿命であることから、各種ランプの新しい光源として期待されており、ＬＥＤを光源とするＬＥＤランプの研究開発が進められている。 In recent years, semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be a new light source for various lamps because of their small size, high efficiency, and long life, and research and development of LED lamps using LEDs as light sources has been promoted. It has been.
　このようなＬＥＤランプとしては、フィラメントコイルを用いた白熱電球に代替する電球形のＬＥＤランプ（電球形ＬＥＤランプ）がある。例えば、特許文献１には、従来の電球形ＬＥＤランプが開示されている。 As such an LED lamp, there is a bulb-type LED lamp (bulb-shaped LED lamp) that replaces an incandescent bulb using a filament coil. For example, Patent Document 1 discloses a conventional bulb-type LED lamp.
　この特許文献１に開示された従来の電球形ＬＥＤランプでは、グローブと、グローブ内に配置された基板と、基板上に実装されたＬＥＤとを備えている。 The conventional light bulb shaped LED lamp disclosed in Patent Document 1 includes a globe, a substrate disposed in the globe, and an LED mounted on the substrate.
特開２００６－３１３７１７号公報JP 2006-313717 A
　ここで、従来の電球形ＬＥＤランプでは、フィラメントコイルを用いた白熱電球のような広配光角を実現することが望まれている。このため、従来の電球形ＬＥＤランプでは、ＬＥＤの配光角が一定の範囲に限定されるため、広配光角を実現するためには、ＬＥＤの光照射方向を所望の向きに調整することで配光角を調整する必要がある。しかしながら、従来の電球形ＬＥＤランプでは、ＬＥＤはグローブ内に一定角度で固定される構成であるため、当該ＬＥＤの配光角を容易に調整することができないという問題がある。 Here, it is desired that a conventional light bulb shaped LED lamp realizes a wide light distribution angle like an incandescent light bulb using a filament coil. For this reason, in the conventional bulb-type LED lamp, the light distribution angle of the LED is limited to a certain range, so in order to realize a wide light distribution angle, the light irradiation direction of the LED should be adjusted to a desired direction. It is necessary to adjust the light distribution angle. However, the conventional bulb-type LED lamp has a problem in that the light distribution angle of the LED cannot be easily adjusted because the LED is configured to be fixed at a constant angle in the globe.
　本発明は、このような問題を解決するためになされたものであり、配光角を容易に調整可能な電球形ランプ、照明装置及び電球形ランプの製造方法を提供することを目的とする。 The present invention has been made to solve such a problem, and an object thereof is to provide a light bulb shaped lamp, a lighting device, and a method for manufacturing the light bulb shaped lamp, in which the light distribution angle can be easily adjusted.
　上記目的を達成するために、本発明に係る電球形ランプの一態様は、グローブと、前記グローブ内方に配置された半導体発光素子とを備える電球形ランプであって、前記グローブ内方に配置された折り曲げ可能な基板を備え、前記基板は、折り曲げられることで形成された屈曲部と、前記半導体発光素子が配置された平面部とを有することを特徴とする。 In order to achieve the above object, one embodiment of a light bulb shaped lamp according to the present invention is a light bulb shaped lamp comprising a globe and a semiconductor light emitting element arranged inside the globe, and is arranged inside the globe. The bendable substrate is provided, and the substrate has a bent portion formed by being bent and a flat portion on which the semiconductor light emitting element is disposed.
　また、本発明に係る電球形ランプの一態様において、さらに、前記半導体発光素子に電力を供給するための駆動回路と、前記半導体発光素子と前記駆動回路とを電気的に接続するためのリード線とを備え、前記基板は、前記平面部を含む平面とは異なる面に、前記リード線と接続される接続部を有することにしてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, a drive circuit for supplying power to the semiconductor light emitting element, and a lead wire for electrically connecting the semiconductor light emitting element and the drive circuit The substrate may have a connection portion connected to the lead wire on a surface different from the plane including the flat portion.
　また、本発明に係る電球形ランプの一態様において、前記基板は、さらに、前記平面部と交差する方向に延びる、前記平面部に配置された前記半導体発光素子を支持する支持部を有することにしてもよい。 Moreover, in one aspect of the light bulb shaped lamp according to the present invention, the substrate further includes a support portion that extends in a direction intersecting with the planar portion and supports the semiconductor light emitting element disposed on the planar portion. May be.
　また、本発明に係る電球形ランプの一態様において、前記基板は、金属製の基材層と、前記基材層上に配置された前記平面部を有する絶縁層とを備えることにしてもよい。 Moreover, in one aspect of the light bulb shaped lamp according to the present invention, the substrate may include a metal base layer and an insulating layer having the planar portion disposed on the base layer. .
　また、本発明に係る電球形ランプの一態様において、前記半導体発光素子を複数備え、前記複数の半導体発光素子は、前記グローブの中心位置を中心に配列されていることにしてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, a plurality of the semiconductor light emitting elements may be provided, and the plurality of semiconductor light emitting elements may be arranged around the center position of the globe.
　また、本発明に係る照明装置の一態様は、上記いずれかの電球形ランプを備える照明装置であることを特徴とする。 Further, an aspect of the lighting device according to the present invention is a lighting device including any one of the above-described light bulb shaped lamps.
　また、本発明に係る電球形ランプの製造方法の一態様は、グローブと、前記グローブ内方に配置された半導体発光素子とを備える電球形ランプの製造方法であって、平面部に前記半導体発光素子が配置された折り曲げ可能な基板を、前記平面部とは異なる位置で折り曲げることで、屈曲部を形成する折り曲げ工程と、折り曲げられた前記基板を前記グローブ内方に配置する配置工程とを含むことを特徴とする。 An aspect of the method for manufacturing a light bulb shaped lamp according to the present invention is a method for producing a light bulb shaped lamp comprising a globe and a semiconductor light emitting element disposed inside the globe, wherein the semiconductor light emitting device is provided on a flat surface. A folding step of forming a bent portion by bending a foldable substrate on which an element is arranged at a position different from the plane portion, and an arranging step of arranging the bent substrate inside the globe. It is characterized by that.
　本発明によれば、配光角を容易に調整可能な電球形ランプ、照明装置及び電球形ランプの製造方法を実現することができる。 According to the present invention, it is possible to realize a light bulb shaped lamp, an illuminating device, and a method of manufacturing a light bulb shaped lamp whose light distribution angle can be easily adjusted.
図１は、本発明の実施の形態に係る電球形ランプの外観斜視図である。FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る電球形ランプの分解斜視図である。FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention. 図３は、本発明の実施の形態に係る電球形ランプの構成の一の断面を示す図である。FIG. 3 is a diagram showing one cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention. 図４は、本発明の実施の形態に係る電球形ランプの構成の他の断面を示す図である。FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp according to the embodiment of the present invention. 図５は、本発明の実施の形態に係る電球形ランプにおけるＬＥＤモジュールの斜視図である。FIG. 5 is a perspective view of the LED module in the light bulb shaped lamp according to the embodiment of the present invention. 図６は、本発明の実施の形態に係る電球形ランプにおけるＬＥＤの断面を示す図である。FIG. 6 is a diagram showing a cross section of the LED in the light bulb shaped lamp according to the embodiment of the present invention. 図７は、本発明の実施の形態に係る電球形ランプの製造方法を説明するためのフローチャートである。FIG. 7 is a flowchart for explaining a method of manufacturing the light bulb shaped lamp according to the embodiment of the present invention. 図８は、本発明の実施の形態に係る電球形ランプの製造方法を説明するための図である。FIG. 8 is a diagram for explaining a method of manufacturing the light bulb shaped lamp according to the embodiment of the present invention. 図９は、本発明の実施の形態に係る照明装置の概略断面図である。FIG. 9 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention. 図１０は、本発明の実施の形態の変形例１に係るＬＥＤモジュールの構成を示す図である。FIG. 10 is a diagram showing a configuration of an LED module according to Modification 1 of the embodiment of the present invention. 図１１は、本発明の実施の形態の変形例２に係るＬＥＤモジュールの構成を示す図である。FIG. 11 is a diagram showing a configuration of an LED module according to Modification 2 of the embodiment of the present invention. 図１２は、本発明の実施の形態の変形例３に係るＬＥＤモジュールの構成を示す図である。FIG. 12 is a diagram showing a configuration of an LED module according to Modification 3 of the embodiment of the present invention. 図１３は、本発明の実施の形態の変形例４に係るＬＥＤモジュールの構成を示す図である。FIG. 13 is a diagram showing a configuration of an LED module according to Modification 4 of the embodiment of the present invention. 図１４は、本発明の実施の形態の変形例５に係るＬＥＤモジュールの構成を示す図である。FIG. 14 is a diagram showing a configuration of an LED module according to Modification 5 of the embodiment of the present invention. 図１５は、本発明の実施の形態の変形例６に係るＬＥＤモジュールの構成を示す図である。FIG. 15 is a diagram showing a configuration of an LED module according to Modification 6 of the embodiment of the present invention. 図１６は、本発明の実施の形態の変形例７に係るＬＥＤモジュールの構成を示す図である。FIG. 16 is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention. 図１７Ａは、本発明の実施の形態の変形例７に係るＬＥＤモジュールの構成を示す図である。FIG. 17A is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention. 図１７Ｂは、本発明の実施の形態の変形例７に係るＬＥＤモジュールの構成を示す図である。FIG. 17B is a diagram showing a configuration of an LED module according to Modification 7 of the embodiment of the present invention. 図１８は、本発明の実施の形態の変形例８に係るＬＥＤモジュールの構成を示す図である。FIG. 18 is a diagram showing a configuration of an LED module according to Modification 8 of the embodiment of the present invention.
　以下、本発明の実施の形態に係る電球形ランプ及び照明装置について、図面を参照しながら説明する。なお、以下に説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。したがって、以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態、工程、工程の順序などは、一例であって本発明を限定する主旨ではない。よって、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、任意の構成要素として説明される。なお、各図は、模式図であり、必ずしも厳密に図示したものではない。 Hereinafter, a light bulb shaped lamp and an illumination device according to an embodiment of the present invention will be described with reference to the drawings. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of constituent elements, processes, order of processes, and the like shown in the following embodiments are merely examples and do not limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements. Each figure is a schematic diagram and is not necessarily illustrated exactly.
　（電球形ランプの全体構成）
　まず、本実施の形態に係る電球形ランプ１の全体構成について、図１及び図２を用いて説明する。図１は、本発明の実施の形態に係る電球形ランプ１の外観斜視図である。また、図２は、本発明の実施の形態に係る電球形ランプ１の分解斜視図である。 (Overall configuration of bulb-type lamp)
First, the whole structure of the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIGS. FIG. 1 is an external perspective view of a light bulb shaped lamp 1 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment of the present invention.
　図１及び図２に示すように、本実施の形態に係る電球形ランプ１は、電球形蛍光灯又は白熱電球の代替品となる電球形ＬＥＤランプであって、グローブ１０と、光源であるＬＥＤモジュール２０と、ＬＥＤモジュール２０を載置する台座４０と、内方に駆動回路７０が配置された筐体５０と、筐体５０内に配置された金属部材６０と、ＬＥＤモジュール２０に電力を供給する駆動回路７０と、外部から電力を受電する口金８０とを備える。なお、電球形ランプ１は、その他に、リード線７０ａ～７０ｄと、リング状の結合部材３０と、ネジ９０とを備える。また、電球形ランプ１は、グローブ１０と筐体５０（外側筐体部５２）と口金８０とによって外囲器が構成されている。すなわち、グローブ１０と筐体５０（外側筐体部５２）と口金８０とは外部に露出しており、それぞれの外面は外気に曝されている。また、本実施の形態における電球形ランプ１は、例えば４０Ｗ形相当の明るさとなるように構成されている。 As shown in FIGS. 1 and 2, a light bulb shaped lamp 1 according to the present embodiment is a light bulb shaped LED lamp that is a substitute for a light bulb shaped fluorescent light or an incandescent light bulb, and includes a globe 10 and an LED that is a light source. Power is supplied to the module 20, the pedestal 40 on which the LED module 20 is placed, the housing 50 in which the drive circuit 70 is disposed, the metal member 60 disposed in the housing 50, and the LED module 20. A driving circuit 70 for receiving power and a base 80 for receiving power from the outside. The bulb-type lamp 1 further includes lead wires 70a to 70d, a ring-shaped coupling member 30, and a screw 90. In the light bulb shaped lamp 1, an envelope is constituted by the globe 10, the housing 50 (outer housing portion 52), and the base 80. That is, the globe 10, the housing 50 (outer housing portion 52), and the base 80 are exposed to the outside, and each outer surface is exposed to the outside air. Further, the light bulb shaped lamp 1 in the present embodiment is configured to have a brightness equivalent to, for example, a 40 W type.
　なお、以降の説明においては、これらの図に示す上側の方向を上方、下側の方向を下方として、説明を行う。つまり、グローブ１０は、口金８０の上方に配置されている。なお、上記の方向の定義は、電球形ランプ１が点灯器具に取り付けられる場合の方向とは関係なく、電球形ランプ１が点灯器具に取り付けられる場合には、いずれの方向が上方又は下方になってもかまわない。 In the following description, the upper direction shown in these drawings is the upper direction, and the lower direction is the lower direction. That is, the globe 10 is disposed above the base 80. The definition of the above direction is independent of the direction when the light bulb shaped lamp 1 is attached to the lighting fixture, and when the light bulb shaped lamp 1 is attached to the lighting fixture, any direction is upward or downward. It doesn't matter.
　以下、本実施の形態に係る電球形ランプ１の各構成要素について、図２を参照しながら、図３及び図４を用いて詳細に説明する。図３は、本発明の実施の形態に係る電球形ランプ１の一の断面を示す図である。図４は、本発明の実施の形態に係る電球形ランプ１の構成の他の断面を示す図であって、図３の状態からランプ軸を中心に約９０°回転したときの断面図を示している。なお、ランプ軸とは、電球形ランプ１を照明装置のソケットに取り付ける際の回転中心となる軸であり、口金８０の回転軸と一致している。また、図３及び図４において、回路素子以外は、各構成部材の断面部分を図示している。また、図４では、回路素子を省略して図示している。 Hereinafter, each component of the light bulb shaped lamp 1 according to the present embodiment will be described in detail with reference to FIG. 2 and FIG. 3 and FIG. FIG. 3 is a view showing one section of the light bulb shaped lamp 1 according to the embodiment of the present invention. FIG. 4 is a diagram showing another cross section of the configuration of the light bulb shaped lamp 1 according to the embodiment of the present invention, and shows a cross sectional view when rotated about 90 ° from the state of FIG. 3 around the lamp axis. ing. The lamp axis is an axis that becomes a rotation center when the bulb lamp 1 is attached to the socket of the lighting device, and coincides with the rotation axis of the base 80. Moreover, in FIG.3 and FIG.4, the cross-sectional part of each component is shown except a circuit element. In FIG. 4, the circuit elements are omitted.
　（グローブ）
　図３及び図４に示すように、グローブ１０は、ＬＥＤモジュール２０を収納するとともに、ＬＥＤモジュール２０からの光をランプ外部に透光する透光性カバーである。グローブ１０の内面に入射したＬＥＤモジュール２０の光は、グローブ１０を透過してグローブ１０の外部へと取り出される。 (Glove)
As shown in FIGS. 3 and 4, the globe 10 is a translucent cover that houses the LED module 20 and transmits light from the LED module 20 to the outside of the lamp. The light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10.
　本実施の形態におけるグローブ１０は、可視光に対して透明なシリカガラス製のガラスバルブ（クリアバルブ）である。したがって、グローブ１０内に収納されたＬＥＤモジュール２０は、グローブ１０の外側から視認することができる。 The globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.
　グローブ１０の形状は、一端が球状に閉塞され、他端に開口部１１を有する形状である。具体的には、グローブ１０の形状は、中空の球の一部が、球の中心部から遠ざかる方向に伸びながら狭まったような形状であり、球の中心部から遠ざかった位置に開口部１１が形成されている。このような形状のグローブ１０としては、一般的な白熱電球と同様の形状のガラスバルブを用いることができる。例えば、グローブ１０として、Ａ形、Ｇ形又はＥ形等のガラスバルブを用いることができる。 The shape of the globe 10 is a shape in which one end is closed in a spherical shape and an opening 11 is provided at the other end. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed. As the globe 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.
　また、グローブ１０の開口部１１は、台座４０と筐体５０との間に位置する。より具体的に、グローブ１０の開口部１１は、台座４０と筐体５０との間に配置された結合部材３０の溝部に圧入されている。これにより、グローブ１０が固定されている。さらに、グローブ１０の開口部１１と筐体５０のグローブ側端部との間にはシリコーン樹脂が塗布されているが、このシリコーン樹脂は必ずしも必要ではない。 Also, the opening 11 of the globe 10 is located between the pedestal 40 and the housing 50. More specifically, the opening 11 of the globe 10 is press-fitted into the groove of the coupling member 30 disposed between the pedestal 40 and the housing 50. Thereby, the globe 10 is fixed. Further, a silicone resin is applied between the opening 11 of the globe 10 and the end of the housing 50 on the globe side, but this silicone resin is not always necessary.
　なお、グローブ１０は、必ずしも可視光に対して透明である必要はなく、グローブ１０に光拡散機能を持たせてもよい。例えば、シリカや炭酸カルシウム等の光拡散材を含有する樹脂や白色顔料等をグローブ１０の内面又は外面の全面に塗布することによって乳白色の光拡散膜を形成してもよい。このように、グローブ１０に光拡散機能を持たせることにより、ＬＥＤモジュール２０からグローブ１０に入射する光を拡散させることができるので、ランプの配光角を容易に拡大させることができる。 Note that the globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10. Thus, by providing the globe 10 with the light diffusion function, the light incident on the globe 10 from the LED module 20 can be diffused, so that the light distribution angle of the lamp can be easily expanded.
　また、グローブ１０の形状としては、Ａ形等に限らず、回転楕円体又は偏球体であってもよい。また、グローブ１０の材質としては、ガラス材に限らず、アクリル（ＰＭＭＡ）やポリカーボネート（ＰＣ）等の合成樹脂等による樹脂材を用いてもよい。 Further, the shape of the globe 10 is not limited to the A shape, and may be a spheroid or an oblate sphere. Further, the material of the globe 10 is not limited to a glass material, and a resin material such as a synthetic resin such as acrylic (PMMA) or polycarbonate (PC) may be used.
　（ＬＥＤモジュール）
　ＬＥＤモジュール２０は、半導体発光素子を有する発光モジュールであって、所定の光を放出する。図３及び図４に示すように、ＬＥＤモジュール２０は、グローブ１０の内方に配置されており、複数のＬＥＤ２２を備えている。そして、当該複数のＬＥＤ２２は、グローブ１０によって形成される球形状の中心位置（例えば、グローブ１０の内径が大きい径大部分の内部）を中心に配列されることが好ましい。このように、グローブ１０の中心位置にＬＥＤ２２が配置されることにより、電球形ランプ１の配光特性は、従来のフィラメントコイルを用いた白熱電球と近似した配光特性となる。 (LED module)
The LED module 20 is a light emitting module having a semiconductor light emitting element, and emits predetermined light. As shown in FIGS. 3 and 4, the LED module 20 is disposed inside the globe 10 and includes a plurality of LEDs 22. The plurality of LEDs 22 are preferably arranged around a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Thus, by arranging the LED 22 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to an incandescent light bulb using a conventional filament coil.
　また、ＬＥＤモジュール２０は、台座４０に載置されており、リード線７０ａ及び７０ｂを介して供給される電力によって発光する。なお、ＬＥＤモジュール２０は、底面が台座４０に接着剤等で接合されている。ＬＥＤモジュール２０の詳細な構成についての説明は、後述する。 The LED module 20 is mounted on the pedestal 40 and emits light by the power supplied via the lead wires 70a and 70b. Note that the bottom surface of the LED module 20 is bonded to the pedestal 40 with an adhesive or the like. The detailed configuration of the LED module 20 will be described later.
　（結合部材）
　結合部材３０は、グローブ１０と台座４０と金属部材６０とを結合する部材である。図２に示すように、結合部材３０は、台座４０（径小部４０ａ）の周囲を囲むようにリング状に構成されている。結合部材３０は、台座４０の外周面と外側筐体部５２の外郭部５２ａとの隙間に流し込まれた流動性絶縁樹脂（例えばシリコン）を硬化させることで成型することができる。 (Coupling member)
The coupling member 30 is a member that couples the globe 10, the pedestal 40, and the metal member 60. As shown in FIG. 2, the coupling member 30 is configured in a ring shape so as to surround the periphery of the pedestal 40 (small diameter portion 40a). The coupling member 30 can be molded by curing a fluid insulating resin (for example, silicon) poured into the gap between the outer peripheral surface of the base 40 and the outer portion 52a of the outer casing 52.
　図３及び図４に示すように、結合部材３０は、グローブ１０の開口部１１が挿入されるように円環状に形成された縦溝部３０ａと、台座４０に設けられた横溝部に嵌め込まれるように形成された横方向に突出する鍔部（環状凸部）３０ｂと、台座４０との位置合わせを行うために下方向（口金側）に突出する４つの凸部３０ｃとを備える。なお、結合部材３０の外面は、筐体５０の外側筐体部５２の内面と接触している。 As shown in FIGS. 3 and 4, the coupling member 30 is fitted into a vertical groove 30 a formed in an annular shape so that the opening 11 of the globe 10 is inserted, and a horizontal groove provided in the base 40. In order to perform alignment with the pedestal 40, four protrusions 30c protruding downward (on the base side) are provided. Note that the outer surface of the coupling member 30 is in contact with the inner surface of the outer housing portion 52 of the housing 50.
　（台座）
　台座４０は、ＬＥＤモジュール２０を載置する部材であり、金属によって構成されている。ここで、台座４０の構成について、図３及び図４を参照しながら詳細に説明する。 (pedestal)
The base 40 is a member on which the LED module 20 is placed, and is made of metal. Here, the configuration of the pedestal 40 will be described in detail with reference to FIGS. 3 and 4.
　台座４０は、主に筐体５０（外側筐体部５２）に囲まれた部材である。台座４０は、図３及び図４に示すように、グローブ１０の開口部１１を塞ぐように構成されている。台座４０は、金属材料によって構成されており、本実施の形態では、アルミニウム合金によって構成されている。これにより、ＬＥＤモジュール２０で発生した熱を、台座４０に効率良く伝導させることができる。これにより、温度上昇によるＬＥＤ２２の発光効率の低下及び寿命の低下を抑制することができる。また、台座４０は、段差部を有するキャップ状部材であって、直径が小さい径小部４０ａと直径が大きい径大部４０ｂとによって構成されている。 The pedestal 40 is a member mainly surrounded by the casing 50 (outer casing section 52). As shown in FIGS. 3 and 4, the pedestal 40 is configured to close the opening 11 of the globe 10. The pedestal 40 is made of a metal material, and is made of an aluminum alloy in the present embodiment. Thereby, the heat generated in the LED module 20 can be efficiently conducted to the base 40. Thereby, the fall of the luminous efficiency of LED22 by the temperature rise and the fall of a lifetime can be suppressed. The pedestal 40 is a cap-shaped member having a stepped portion, and includes a small diameter portion 40a having a small diameter and a large diameter portion 40b having a large diameter.
　径小部４０ａと径大部４０ｂとの境界には、径小部４０ａの周方向に沿って横溝部が形成されている。また、台座４０の段差部（径大部４０ｂの上）には結合部材３０が配置され、結合部材３０の鍔部３０ｂと台座４０の横溝部とが嵌合することによって、結合部材３０が台座４０に固定される。 At the boundary between the small diameter portion 40a and the large diameter portion 40b, a lateral groove portion is formed along the circumferential direction of the small diameter portion 40a. Further, the coupling member 30 is disposed on the step portion of the pedestal 40 (above the large diameter portion 40b), and the flange 30b of the coupling member 30 and the lateral groove portion of the pedestal 40 are fitted to each other so that the coupling member 30 becomes the pedestal. 40 is fixed.
　径小部４０ａは、図３及び図４に示すように、ＬＥＤモジュール２０を支持するとともに、グローブ１０の開口部１１を塞ぐように構成された円盤状部材である。ＬＥＤモジュール２０は、径小部４０ａの中央部に載置されている。なお、径小部４０ａの外周面と結合部材３０の内周面とは面接触している。また、径小部４０ａには、リード線７０ａ及び７０ｂを挿通するための２つの貫通孔４０ａ１が設けられている。 As shown in FIGS. 3 and 4, the small diameter portion 40 a is a disk-shaped member configured to support the LED module 20 and close the opening 11 of the globe 10. The LED module 20 is placed at the center of the small diameter portion 40a. In addition, the outer peripheral surface of the small diameter portion 40a and the inner peripheral surface of the coupling member 30 are in surface contact. The small diameter portion 40a is provided with two through holes 40a1 for inserting the lead wires 70a and 70b.
　径大部４０ｂは、略円筒状に構成されており、外周面が金属部材６０の内周面と面接触している。これにより、台座４０の熱を金属部材６０に効率良く伝導させることができる。なお、径大部４０ｂには、金属部材６０とのカシメを行う時のガイド穴として４つの凹部４０ｂ１が形成されている。 The large-diameter portion 40 b is configured in a substantially cylindrical shape, and the outer peripheral surface is in surface contact with the inner peripheral surface of the metal member 60. Thereby, the heat of the base 40 can be efficiently conducted to the metal member 60. In the large diameter portion 40b, four concave portions 40b1 are formed as guide holes when caulking with the metal member 60.
　（筐体）
　筐体５０は、内方に駆動回路７０が配置された絶縁性を有する絶縁ケースであり、内側筐体部（第１筐体部）５１と外側筐体部（第２筐体部）５２とによって構成されている。筐体５０は、絶縁性樹脂材料によって構成することができ、例えば、ポリブチレンテレフタレート（ＰＢＴ）によって樹脂成型することができる。 (Casing)
The housing 50 is an insulating case having an insulating property in which the drive circuit 70 is disposed on the inner side, and includes an inner housing portion (first housing portion) 51 and an outer housing portion (second housing portion) 52. It is constituted by. The housing 50 can be made of an insulating resin material, and can be resin-molded with, for example, polybutylene terephthalate (PBT).
　内側筐体部５１は、図３及び図４に示すように、駆動回路７０を囲むように配置されており、ランプ外部から視認できないように配置された内部部材（回路ケース）である。内側筐体部５１は、駆動回路７０を蓋するように配置された回路キャップ部５１ａと、駆動回路７０の周囲を覆うように配置された回路ホルダ部５１ｂとを有する。回路キャップ部５１ａと回路ホルダ部５１ｂとは分離されており、回路キャップ部５１ａと回路ホルダ部５１ｂとは非接触状態で配置されている。 As shown in FIGS. 3 and 4, the inner casing 51 is an internal member (circuit case) that is disposed so as to surround the drive circuit 70 and is not visible from the outside of the lamp. The inner housing part 51 includes a circuit cap part 51 a disposed so as to cover the drive circuit 70 and a circuit holder part 51 b disposed so as to cover the periphery of the drive circuit 70. The circuit cap part 51a and the circuit holder part 51b are separated, and the circuit cap part 51a and the circuit holder part 51b are arranged in a non-contact state.
　回路キャップ部５１ａの上面形状は、台座４０の内面形状に沿うように構成されている。これにより、回路キャップ部５１ａは、台座４０に嵌め込まれて、ネジ９０によって台座４０に締め付け固定される。 The upper surface shape of the circuit cap portion 51a is configured to follow the inner surface shape of the base 40. As a result, the circuit cap portion 51 a is fitted into the pedestal 40 and is fastened and fixed to the pedestal 40 by the screws 90.
　回路ホルダ部５１ｂは、円筒形状に構成されている。回路ホルダ部５１ｂの口金側端部は外側筐体部５２と接続されており、本実施の形態では、回路ホルダ部５１ｂと外側筐体部５２とが一体成型されている。また、回路ホルダ部５１ｂのグローブ側端部には、駆動回路７０の回路基板７１を載置する段差部が形成されている。 The circuit holder 51b is configured in a cylindrical shape. The base-side end of the circuit holder 51b is connected to the outer casing 52, and in this embodiment, the circuit holder 51b and the outer casing 52 are integrally molded. In addition, a stepped portion on which the circuit board 71 of the drive circuit 70 is placed is formed at the globe side end of the circuit holder portion 51b.
　また、外側筐体部５２は、少なくともランプ外囲器の一部となっており、ランプ外部から視認することができるように配置された外部部材である。外側筐体部５２の外周面のうち口金８０で覆われている部分以外の領域は、ランプ外部に露出されている。本実施の形態において、外側筐体部５２は、ランプ外部に露出する外郭部５２ａと、口金８０と螺合する螺合部５２ｂとを有する。 The outer casing 52 is at least a part of the lamp envelope, and is an external member arranged so as to be visible from the outside of the lamp. A region other than the portion covered with the base 80 on the outer peripheral surface of the outer casing 52 is exposed to the outside of the lamp. In the present embodiment, the outer housing part 52 has an outer part 52a exposed to the outside of the lamp and a screwing part 52b screwed into the base 80.
　外郭部５２ａは、螺合部５２ｂよりも直径が大きい略円筒部材によって構成されている。本実施の形態において、外郭部５２ａは、口金８０側に向かって漸次直径が小さくなるように構成されている。つまり、外郭部５２ａの内周面及び外周面は、ランプ軸に対して傾斜している。外郭部５２ａの外表面は大気に曝されているので、筐体５０に伝導した熱は、主に外郭部５２ａの外表面から放熱される。 The outer portion 52a is configured by a substantially cylindrical member having a diameter larger than that of the screwing portion 52b. In the present embodiment, the outer portion 52a is configured such that the diameter gradually decreases toward the base 80 side. That is, the inner peripheral surface and the outer peripheral surface of the outer portion 52a are inclined with respect to the lamp axis. Since the outer surface of the outer portion 52a is exposed to the atmosphere, the heat conducted to the housing 50 is radiated mainly from the outer surface of the outer portion 52a.
　螺合部５２ｂは、外郭部５２ａよりも直径が小さい略円筒部材によって構成される。螺合部５２ｂには口金８０がねじ込まれる。つまり、螺合部５２ｂの外周面は、口金８０の内周面と接触するように構成されている。 The screwing portion 52b is configured by a substantially cylindrical member having a diameter smaller than that of the outer portion 52a. A base 80 is screwed into the screwing portion 52b. That is, the outer peripheral surface of the screwing portion 52 b is configured to contact the inner peripheral surface of the base 80.
　このように構成される外側筐体部５２（外郭部５２ａ）は、内側筐体部５１、金属部材６０、台座４０及び結合部材３０を囲むように構成されている。また、外側筐体部５２（外郭部５２ａ）の内面と内側筐体部５１（回路キャップ部５１ａ及び回路ホルダ部５１ｂ）の外面との間には、所定の間隔が設けられている。さらに、本実施の形態において、外側筐体部５２（外郭部５２ａ）と金属部材６０とは接触しておらず、図４に示すように、外側筐体部５２（外郭部５２ａ）の内面と金属部材６０の外面との間には、一定の空隙が存在する。 The outer casing 52 (outer section 52 a) configured in this way is configured to surround the inner casing 51, the metal member 60, the base 40, and the coupling member 30. In addition, a predetermined gap is provided between the inner surface of the outer casing 52 (outer part 52a) and the outer surface of the inner casing 51 (circuit cap part 51a and circuit holder part 51b). Furthermore, in the present embodiment, the outer casing 52 (outer section 52a) and the metal member 60 are not in contact with each other, and as shown in FIG. 4, the inner surface of the outer casing 52 (outer section 52a) A certain gap exists between the outer surface of the metal member 60.
　（金属部材）
　金属部材６０は、筐体５０における内側筐体部５１を囲むようにスカート状に構成されており、内側筐体部５１と外側筐体部５２との間に配置される。これにより、金属部材６０は駆動回路７０と非接触状態とすることができ、駆動回路７０の絶縁性を確保することができる。 (Metal member)
The metal member 60 is configured in a skirt shape so as to surround the inner casing 51 in the casing 50, and is disposed between the inner casing 51 and the outer casing 52. Thereby, the metal member 60 can be in a non-contact state with the drive circuit 70, and the insulation of the drive circuit 70 can be ensured.
　また、金属部材６０は、金属材料によって構成されており、ヒートシンクとして機能する。これにより、ＬＥＤモジュール２０及び駆動回路７０から発生する熱を、金属部材６０を利用して効率良く放熱させることができる。具体的には、ＬＥＤモジュール２０及び駆動回路７０の熱は、内側筐体部５１及び金属部材６０を介して外側筐体部５２へと伝搬され、外側筐体部５２からランプ外部に放熱させることができる。 The metal member 60 is made of a metal material and functions as a heat sink. Thereby, the heat generated from the LED module 20 and the drive circuit 70 can be efficiently radiated using the metal member 60. Specifically, the heat of the LED module 20 and the drive circuit 70 is propagated to the outer casing 52 through the inner casing 51 and the metal member 60, and is radiated from the outer casing 52 to the outside of the lamp. Can do.
　金属部材６０の金属材料としては、例えばＡｌ、Ａｇ、Ａｕ、Ｎｉ、Ｒｈ、Ｐｄ、あるいは、これらのうちの２以上からなる合金、又はＣｕとＡｇとの合金などが考えられる。このような金属材料は、熱伝導性が良好であるため、金属部材６０に伝搬した熱を効率良く伝搬させることができる。 As the metal material of the metal member 60, for example, Al, Ag, Au, Ni, Rh, Pd, an alloy composed of two or more of these, or an alloy of Cu and Ag can be considered. Since such a metal material has good thermal conductivity, the heat propagated to the metal member 60 can be efficiently propagated.
　また、金属部材６０は、台座４０と接触している。本実施の形態では、上述のように、金属部材６０の内周面と台座４０（径大部４０ｂ）の外周面とが面接触している。金属部材６０と台座４０とはいずれも金属からなるので、台座４０に伝導してきたＬＥＤモジュール２０の熱は金属部材６０へと効率良く伝導することになる。 Further, the metal member 60 is in contact with the pedestal 40. In the present embodiment, as described above, the inner peripheral surface of the metal member 60 and the outer peripheral surface of the base 40 (large diameter portion 40b) are in surface contact. Since both the metal member 60 and the pedestal 40 are made of metal, the heat of the LED module 20 that has been conducted to the pedestal 40 is efficiently conducted to the metal member 60.
　また、本実施の形態における金属部材６０は、筐体５０における外側筐体部５２（外郭部５２ａ、螺合部５２ｂ）に接触しておらず、内側筐体部５１（回路キャップ部５１ａ、回路ホルダ部５１ｂ）にも接触していない。すなわち、金属部材６０は、内側筐体部５１及び外側筐体部５２のいずれにも非接触状態で配置されている。これにより、筐体５０全体としての絶縁性を十分確保することができる。 In addition, the metal member 60 in the present embodiment is not in contact with the outer casing portion 52 (outer portion 52a, screwing portion 52b) in the casing 50, and the inner casing portion 51 (circuit cap portion 51a, circuit). It is not in contact with the holder part 51b). That is, the metal member 60 is disposed in a non-contact state in both the inner housing part 51 and the outer housing part 52. Thereby, the insulation as the whole housing | casing 50 is fully securable.
　（駆動回路）
　駆動回路（回路ユニット）７０は、ＬＥＤモジュール２０のＬＥＤ２２を点灯（発光）させるための点灯回路（電源回路）であって、ＬＥＤモジュール２０に所定の電力を供給する。例えば、駆動回路７０は、一対のリード線７０ｃ及び７０ｄを介して口金８０から供給される交流電力を直流電力に変換し、一対のリード線７０ａ及び７０ｂを介して当該直流電力をＬＥＤモジュール２０に供給する。 (Drive circuit)
The drive circuit (circuit unit) 70 is a lighting circuit (power supply circuit) for lighting (emitting) the LEDs 22 of the LED module 20, and supplies predetermined power to the LED module 20. For example, the drive circuit 70 converts AC power supplied from the base 80 via the pair of lead wires 70c and 70d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 70a and 70b. Supply.
　駆動回路７０は、回路基板７１と、回路基板７１に実装された複数の回路素子（電子部品）７２とによって構成されている。 The drive circuit 70 includes a circuit board 71 and a plurality of circuit elements (electronic components) 72 mounted on the circuit board 71.
　回路基板７１は、金属配線がパターン形成されたプリント基板であり、当該回路基板７１に実装された複数の回路素子７２同士を電気的に接続する。本実施の形態において、回路基板７１は、主面がランプ軸と直交する姿勢で配置されている。回路基板７１は、図４に示すように、内側筐体部５１の回路ホルダ部５１ｂに載置され挟持されている。 The circuit board 71 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 72 mounted on the circuit board 71. In the present embodiment, the circuit board 71 is arranged in a posture in which the main surface is orthogonal to the lamp axis. As shown in FIG. 4, the circuit board 71 is placed and clamped on the circuit holder part 51 b of the inner housing part 51.
　回路素子７２は、例えば、各種コンデンサ、抵抗素子、整流回路素子、コイル素子、チョークコイル（チョークトランス）、ノイズフィルタ、ダイオード又は集積回路素子等である。 The circuit element 72 is, for example, various capacitors, resistor elements, rectifier circuit elements, coil elements, choke coils (choke transformers), noise filters, diodes, or integrated circuit elements.
　このように構成される駆動回路７０は、筐体５０における内側筐体部５１によって覆われているので、金属部材６０とは非接触状態となっている。これにより、駆動回路７０の絶縁性が確保されている。 The drive circuit 70 configured as described above is covered with the inner casing portion 51 of the casing 50, and thus is in a non-contact state with the metal member 60. Thereby, the insulation of the drive circuit 70 is ensured.
　なお、駆動回路７０は、平滑回路のみに限られるものではなく、調光回路や昇圧回路などを適宜選択して組み合わせることもできる。 Note that the drive circuit 70 is not limited to a smoothing circuit, and a dimmer circuit, a booster circuit, and the like can be appropriately selected and combined.
　（リード線）
　リード線７０ａ～７０ｄは、いずれも合金銅リード線であり、合金銅からなる芯線と当該芯線を被覆する絶縁性の樹脂被膜とによって構成されている。 (Lead)
Each of the lead wires 70a to 70d is an alloy copper lead wire, and is composed of a core wire made of alloy copper and an insulating resin film covering the core wire.
　一対のリード線７０ａ及び７０ｂは、ＬＥＤモジュール２０を点灯させるための直流電力を、駆動回路７０からＬＥＤモジュール２０に供給するための電線である。駆動回路７０とＬＥＤモジュール２０は、一対のリード線７０ａ及び７０ｂによって電気的に接続される。具体的には、リード線７０ａ及び７０ｂの各々の一方の端部（芯線）は、回路基板７１の電力出力部（金属配線）と半田等によって電気的に接続されているとともに、各々の他方の端部（芯線）は、ＬＥＤモジュール２０の電力入力部（電極端子）と半田等によって電気的に接続されている。 The pair of lead wires 70 a and 70 b are electric wires for supplying DC power for lighting the LED module 20 from the drive circuit 70 to the LED module 20. The drive circuit 70 and the LED module 20 are electrically connected by a pair of lead wires 70a and 70b. Specifically, one end portion (core wire) of each of the lead wires 70a and 70b is electrically connected to the power output portion (metal wiring) of the circuit board 71 by solder or the like, and the other end of each other. The end portion (core wire) is electrically connected to the power input portion (electrode terminal) of the LED module 20 by solder or the like.
　また、一対のリード線７０ｃ及び７０ｄは、口金８０からの交流電力を駆動回路７０に供給するための電線である。駆動回路７０と口金８０とは、一対のリード線７０ｃ及び７０ｄによって電気的に接続される。具体的に、リード線７０ｃ及び７０ｄの各々の一方の端部（芯線）は、口金８０（シェル部又はアイレット部）と電気的に接続されるとともに、各々の他方の端部（芯線）は、回路基板７１の電力入力部（金属配線）と半田等によって電気的に接続されている。 The pair of lead wires 70 c and 70 d are electric wires for supplying AC power from the base 80 to the drive circuit 70. The drive circuit 70 and the base 80 are electrically connected by a pair of lead wires 70c and 70d. Specifically, one end portion (core wire) of each of the lead wires 70c and 70d is electrically connected to the base 80 (shell portion or eyelet portion), and each other end portion (core wire) is The power input part (metal wiring) of the circuit board 71 is electrically connected by solder or the like.
　（口金）
　図３及び図４に示すように、口金８０は、ＬＥＤモジュール２０のＬＥＤ２２を発光させるための電力をランプ外部から受電する受電部である。口金８０は、例えば、照明器具のソケットに取り付けられ、電球形ランプ１を点灯させる際、口金８０は、照明器具のソケットから電力を受ける。例えば、口金８０には商用電源（ＡＣ１００Ｖ）から交流電力が供給される。本実施の形態における口金８０は二接点によって交流電力を受電し、口金８０で受電した電力は、一対のリード線７０ｃ及び７０ｂを介して駆動回路７０の電力入力部に入力される。 (Base)
As shown in FIGS. 3 and 4, the base 80 is a power receiving unit that receives power for causing the LEDs 22 of the LED module 20 to emit light from outside the lamp. The base 80 is attached to a socket of a lighting fixture, for example, and when the light bulb shaped lamp 1 is turned on, the base 80 receives electric power from the socket of the lighting fixture. For example, the base 80 is supplied with AC power from a commercial power supply (AC 100 V). The base 80 in the present embodiment receives AC power through two contact points, and the power received by the base 80 is input to the power input unit of the drive circuit 70 via a pair of lead wires 70c and 70b.
　口金８０は、金属製の有底筒体形状であって、外周面が雄ネジとなっているシェル部と、シェル部に絶縁部を介して装着されたアイレット部とを備える。また、口金８０の外周面には、照明装置のソケットに螺合させるための螺合部が形成されており、口金８０の内周面には、外側筐体部５２の螺合部５２ｂに螺合させるための螺合部が形成されている。 The base 80 has a metal bottomed cylindrical shape, and includes a shell portion whose outer peripheral surface is a male screw and an eyelet portion attached to the shell portion via an insulating portion. Further, a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface of the base 80, and a screwing portion 52 b of the outer housing portion 52 is screwed on the inner peripheral surface of the base 80. A threaded portion for mating is formed.
　口金８０の種類は、特に限定されるものではないが、本実施の形態では、ねじ込み型のエジソンタイプ（Ｅ型）の口金を用いている。例えば、口金８０として、Ｅ２６形又はＥ１７形、あるいはＥ１６形等が挙げられる。 The type of the base 80 is not particularly limited, but in this embodiment, a screw-type Edison type (E type) base is used. For example, as the base 80, an E26 type, an E17 type, an E16 type, or the like can be given.
　（ＬＥＤモジュールの詳細な構成）
　次に、本発明の実施の形態に係るＬＥＤモジュール２０の各構成要素について、図５を用いて説明する。図５は、本発明の実施の形態に係る電球形ランプ１におけるＬＥＤモジュール２０の斜視図である。 (Detailed configuration of LED module)
Next, each component of the LED module 20 which concerns on embodiment of this invention is demonstrated using FIG. FIG. 5 is a perspective view of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
　図５に示すように、ＬＥＤモジュール２０は、基板２１と、ＬＥＤ２２と、コネクタ２３とを備えている。本実施の形態におけるＬＥＤモジュール２０は、表面実装（ＳＭＤ：Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ）型の発光モジュールである。つまり、ＬＥＤモジュール２０は、ＳＭＤ型のＬＥＤ素子を基板上に複数個実装することで構成されたＬＥＤモジュールである。以下、ＬＥＤモジュール２０の各構成要素について詳述する。 As shown in FIG. 5, the LED module 20 includes a substrate 21, an LED 22, and a connector 23. The LED module 20 in the present embodiment is a light emitting module of a surface mount (SMD: Surface Mount Device) type. That is, the LED module 20 is an LED module configured by mounting a plurality of SMD type LED elements on a substrate. Hereinafter, each component of the LED module 20 will be described in detail.
　まず、基板２１について説明する。基板２１は、ＬＥＤ２２を実装するためのＬＥＤ実装基板である。本実施の形態における基板２１は、グローブ１０内方に配置された折り曲げ可能な平板状の矩形基板である。具体的には、基板２１は、ＬＥＤ配置部２１ａと、屈曲部２１ｂと、支持部２１ｃと、屈曲部２１ｄと、コネクタ配置部２１ｅとを備えている。 First, the substrate 21 will be described. The substrate 21 is an LED mounting substrate for mounting the LEDs 22. The substrate 21 in the present embodiment is a foldable flat plate-like rectangular substrate disposed inside the globe 10. Specifically, the substrate 21 includes an LED arrangement portion 21a, a bent portion 21b, a support portion 21c, a bent portion 21d, and a connector arrangement portion 21e.
　ＬＥＤ配置部２１ａは、ＬＥＤ２２が設けられる平板状の矩形部位であり、表面（上面）の平面状の平面部２１ａ１には３個のＬＥＤ２２が配置され、裏面（平面部２１ａ１とは反対側の面、下面）の平面状の平面部２１ａ２には３個のＬＥＤ２２が配置されている。 The LED placement portion 21a is a flat rectangular portion on which the LEDs 22 are provided. Three LEDs 22 are placed on the flat surface portion 21a1 on the front surface (upper surface), and the back surface (the surface opposite to the flat surface portion 21a1). The three LEDs 22 are arranged on the flat planar portion 21a2 of the lower surface.
　このように、ＬＥＤ２２が実装される面が平面となっているため、ＬＥＤ２２を容易に実装することができる。また、ＬＥＤ２２が基板２１の双方の面（表面及び裏面）に実装されているため、双方の面から光が出射され、白熱電球と近似した配光特性を得ることが可能となる。なお、ＬＥＤ配置部２１ａに配置されるＬＥＤ２２の個数は上記には限定されず、また、表面又は裏面の一方にのみＬＥＤ２２が配置されている構成でも構わない。 Thus, since the surface on which the LED 22 is mounted is a flat surface, the LED 22 can be mounted easily. Moreover, since LED22 is mounted in both the surfaces (front surface and back surface) of the board | substrate 21, light is radiate | emitted from both surfaces and it becomes possible to obtain the light distribution characteristic approximated with an incandescent lamp. Note that the number of LEDs 22 arranged in the LED arrangement portion 21a is not limited to the above, and a configuration in which the LEDs 22 are arranged only on one of the front surface and the back surface may be used.
　屈曲部２１ｂ及び屈曲部２１ｄは、基板２１が折り曲げられることで形成された屈曲状の部位である。つまり、矩形状の基板２１が屈曲部２１ｂ及び２１ｄの位置で折り曲げられることで、屈曲部２１ｂ及び屈曲部２１ｄが形成される。 The bent portion 21b and the bent portion 21d are bent portions formed by bending the substrate 21. That is, the bent portion 21b and the bent portion 21d are formed by bending the rectangular substrate 21 at the positions of the bent portions 21b and 21d.
　ここで、基板２１が折り曲げられた場合に、屈曲部２１ｂ及び屈曲部２１ｄは、当該折り曲げられた状態を維持する。つまり、屈曲部２１ｂ及び屈曲部２１ｄによって、支持部２１ｃに対するＬＥＤ配置部２１ａ及びコネクタ配置部２１ｅの位置が固定される。 Here, when the substrate 21 is bent, the bent portion 21b and the bent portion 21d maintain the bent state. That is, the positions of the LED placement portion 21a and the connector placement portion 21e with respect to the support portion 21c are fixed by the bent portion 21b and the bent portion 21d.
　なお、屈曲部２１ｂ及び屈曲部２１ｄは、ＬＥＤ配置部２１ａとコネクタ配置部２１ｅとが同じ方向に向くように直角に屈曲しているが、屈曲する方向及び角度は限定されない。また、基板２１は、一度折り曲げられて屈曲部２１ｂ及び屈曲部２１ｄを形成した場合であっても、再度折り曲げ直すことができる。 The bent portion 21b and the bent portion 21d are bent at a right angle so that the LED arrangement portion 21a and the connector arrangement portion 21e face the same direction, but the bending direction and angle are not limited. Further, even if the substrate 21 is bent once to form the bent portion 21b and the bent portion 21d, it can be bent again.
　支持部２１ｃは、平面部２１ａ１及び２１ａ２と交差する方向に延びる、平面部２１ａ１及び２１ａ２に配置されたＬＥＤ２２を支持する部位である。具体的には、支持部２１ｃは、ＬＥＤ配置部２１ａと直交する方向に延びる平板状の矩形部位である。つまり、支持部２１ｃは、屈曲部２１ｂを介してＬＥＤ配置部２１ａと接続されており、ＬＥＤ２２が配置されたＬＥＤ配置部２１ａを支持する支柱の役割りを担っている。 The support portion 21c is a portion that supports the LEDs 22 arranged in the plane portions 21a1 and 21a2 extending in a direction intersecting with the plane portions 21a1 and 21a2. Specifically, the support portion 21c is a flat rectangular portion extending in a direction orthogonal to the LED placement portion 21a. That is, the support portion 21c is connected to the LED placement portion 21a via the bent portion 21b, and serves as a support column that supports the LED placement portion 21a on which the LED 22 is placed.
　コネクタ配置部２１ｅは、上面にコネクタ２３が配置され、下面が台座４０と接合される平板状の矩形部位である。コネクタ配置部２１ｅは、屈曲部２１ｄを介して支持部２１ｃと接続されており、支持部２１ｃと直交する方向に延びるＬＥＤモジュール２０の底板である。 The connector arrangement portion 21e is a flat rectangular portion in which the connector 23 is arranged on the upper surface and the lower surface is joined to the pedestal 40. The connector placement portion 21e is connected to the support portion 21c through the bent portion 21d and is a bottom plate of the LED module 20 that extends in a direction orthogonal to the support portion 21c.
　コネクタ２３は、ＬＥＤ２２に電力を供給するために、リード線７０ａ及び７０ｂと接続される接続部である。コネクタ２３は、平面部２１ａ１及び２１ａ２を含む平面とは異なる面であるコネクタ配置部２１ｅの上面２１ｅ１に配置されている。つまり、ＬＥＤ２２と、ＬＥＤ配置部２１ａと、屈曲部２１ｂと、支持部２１ｃと、屈曲部２１ｄと、コネクタ配置部２１ｅと、コネクタ２３とが配線により導通しており、ＬＥＤ２２は、リード線７０ａ及び７０ｂからコネクタ２３等を介して電力を受電する。 The connector 23 is a connection portion connected to the lead wires 70a and 70b in order to supply power to the LED 22. The connector 23 is arrange | positioned at the upper surface 21e1 of the connector arrangement | positioning part 21e which is a surface different from the plane containing plane part 21a1 and 21a2. That is, the LED 22, the LED placement portion 21a, the bent portion 21b, the support portion 21c, the bent portion 21d, the connector placement portion 21e, and the connector 23 are electrically connected by the wiring. Power is received from 70b through the connector 23 and the like.
　ここで、基板２１はメタルベース基板であり、基板２１のＬＥＤ配置部２１ａと、屈曲部２１ｂと、支持部２１ｃと、屈曲部２１ｄと、コネクタ配置部２１ｅとは、金属製の基材層２４ａと、基材層２４ａ上に配置された絶縁層２４ｂ、２４ｃとから形成されている。つまり、基材層２４ａは、ＬＥＤ２２で発生した熱を台座４０に伝熱して放熱するための放熱経路である。また、平面部２１ａ１は絶縁層２４ｂに形成された平面であり、平面部２１ａ２は絶縁層２４ｃに形成された平面である。 Here, the substrate 21 is a metal base substrate, and the LED arrangement portion 21a, the bent portion 21b, the support portion 21c, the bent portion 21d, and the connector arrangement portion 21e of the substrate 21 are made of a metal base layer 24a. And insulating layers 24b and 24c disposed on the base material layer 24a. That is, the base material layer 24a is a heat dissipation path for transferring the heat generated by the LED 22 to the pedestal 40 and radiating it. The plane portion 21a1 is a plane formed on the insulating layer 24b, and the plane portion 21a2 is a plane formed on the insulating layer 24c.
　具体的には、基材層２４ａは、例えば鉄（Ｆｅ）又はアルミ（Ａｌ）の層であり、絶縁層２４ｂ、２４ｃは、例えば樹脂層である。このように、基板２１は、熱伝導性に優れ、表面が絶縁され、また、ＬＥＤ２２とコネクタ２３とを導通させることができる基板である。なお、本実施の形態における基板２１の形状としては、平板状の矩形基板を用いているが、基板２１は、折り曲げ可能であれば、どのような形状であってもよい。 Specifically, the base material layer 24a is, for example, an iron (Fe) or aluminum (Al) layer, and the insulating layers 24b, 24c are, for example, resin layers. Thus, the board | substrate 21 is a board | substrate which is excellent in thermal conductivity, the surface is insulated, and can enable LED22 and the connector 23 to conduct | electrically_connect. As the shape of the substrate 21 in the present embodiment, a flat rectangular substrate is used, but the substrate 21 may have any shape as long as it can be bent.
　次に、ＬＥＤ２２について説明する。図６は、本発明の実施の形態に係る電球形ランプ１におけるＬＥＤ２２の断面を示す図である。 Next, the LED 22 will be described. FIG. 6 is a diagram showing a cross section of the LED 22 in the light bulb shaped lamp 1 according to the embodiment of the present invention.
　各ＬＥＤ２２は、ＬＥＤチップと蛍光体とがパッケージ化された、いわゆるＳＭＤ型の発光素子であって、図６に示すように、パッケージ（容器）２２ａと、パッケージ２２ａに収容されるＬＥＤチップ２２ｂと、ＬＥＤチップ２２ｂを封止する封止部材２２ｃとを備えている。本実施の形態におけるＬＥＤ２２は、白色光を発する白色ＬＥＤ素子である。 Each LED 22 is a so-called SMD type light emitting device in which an LED chip and a phosphor are packaged, and as shown in FIG. 6, a package (container) 22a and an LED chip 22b accommodated in the package 22a And a sealing member 22c for sealing the LED chip 22b. The LED 22 in the present embodiment is a white LED element that emits white light.
　パッケージ２２ａは、白色樹脂等で成型されており、逆円錐台形状の凹部（キャビティ）を備える。凹部の内側面は傾斜面であり、ＬＥＤチップ２２ｂからの光を上方に反射させるように構成されている。なお、パッケージ２２ａが透明の樹脂等で成型されており、ＬＥＤチップ２２ｂからの光を側方にも照射する構成でも構わない。 The package 22a is molded of white resin or the like, and includes an inverted frustoconical recess (cavity). The inner side surface of the recess is an inclined surface and is configured to reflect light from the LED chip 22b upward. Note that the package 22a may be molded of a transparent resin or the like, and the light from the LED chip 22b may be irradiated to the side.
　ＬＥＤチップ２２ｂは、半導体発光素子の一例であって、パッケージ２２ａの凹部に実装されている。ＬＥＤチップ２２ｂは、単色の可視光を発するベアチップであり、ダイアタッチ材（ダイボンド材）によって、パッケージ２２ａの凹部の底面にダイボンダィング実装されている。ＬＥＤチップ２２ｂとしては、例えば通電されると青色光を発光する青色ＬＥＤチップを用いることができる。 The LED chip 22b is an example of a semiconductor light emitting element, and is mounted in a recess of the package 22a. The LED chip 22b is a bare chip that emits monochromatic visible light, and is die-bonded to the bottom surface of the recess of the package 22a by a die attach material (die bond material). For example, a blue LED chip that emits blue light when energized can be used as the LED chip 22b.
　封止部材２２ｃは、光波長変換体である蛍光体を含む蛍光体含有樹脂であって、ＬＥＤチップ２２ｂからの光を所定の波長に波長変換（色変換）するとともに、ＬＥＤチップ２２ｂを封止してＬＥＤチップ２２ｂを保護する。封止部材２２ｃは、パッケージ２２ａの凹部に充填されており、当該凹部の開口面まで封入されている。封止部材２２ｃとしては、例えばＬＥＤチップ２２ｂが青色ＬＥＤである場合、白色光を得るために、ＹＡＧ（イットリウム・アルミニウム・ガーネット）系の黄色蛍光体粒子をシリコーン樹脂に分散させた蛍光体含有樹脂を用いることができる。これにより、黄色蛍光体粒子は青色ＬＥＤチップの青色光によって励起されて黄色光を放出するので、封止部材２２ｃからは、励起された黄色光と青色ＬＥＤチップの青色光とによって白色光が放出される。なお、封止部材２２ｃに、シリカ等の光拡散材も含有させても構わない。 The sealing member 22c is a phosphor-containing resin containing a phosphor that is a light wavelength converter, and converts the wavelength of light from the LED chip 22b to a predetermined wavelength (color conversion) and seals the LED chip 22b. Thus, the LED chip 22b is protected. The sealing member 22c is filled in the recess of the package 22a, and is sealed up to the opening surface of the recess. As the sealing member 22c, for example, when the LED chip 22b is a blue LED, a phosphor-containing resin in which YAG (yttrium, aluminum, garnet) -based yellow phosphor particles are dispersed in a silicone resin in order to obtain white light. Can be used. As a result, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light. Therefore, the sealing member 22c emits white light by the excited yellow light and the blue light of the blue LED chip. Is done. The sealing member 22c may also contain a light diffusing material such as silica.
　このようにして、ＬＥＤ２２が構成されている。また、図示しないが、ＬＥＤ２２は、正極及び負極の２つの外部接続端子を有しており、これらの外部接続端子と配線２２ｄとが電気的に接続されている。また、本実施の形態において、基板２１上の複数のＬＥＤ２２は配線２２ｄによって直列接続されているが、並列接続、あるいは、直列接続と並列接続とを組み合わせた接続としてもよい。 Thus, the LED 22 is configured. Although not shown, the LED 22 has two external connection terminals, a positive electrode and a negative electrode, and these external connection terminals and the wiring 22d are electrically connected. Moreover, in this Embodiment, although several LED22 on the board | substrate 21 is connected in series by wiring 22d, it is good also as a connection which combined the parallel connection or the serial connection and the parallel connection.
　配線２２ｄは、ＬＥＤ２２同士を電気的に接続するための導電性薄膜であって、基板２１の平面部２１ａ１、２１ａ２に所定形状にパターン形成されている。配線２２ｄとしては、銅又は銀等の金属からなる金属配線を用いることができる。配線２２ｄは、例えば、隣接するＬＥＤ２２を接続するためにＬＥＤ配置部２１ａの長手方向に沿って断続的に形成されている。これにより、配線２２ｄを介して各ＬＥＤ２２に電力が供給される。 The wiring 22d is a conductive thin film for electrically connecting the LEDs 22 to each other, and is patterned in a predetermined shape on the flat portions 21a1 and 21a2 of the substrate 21. As the wiring 22d, a metal wiring made of a metal such as copper or silver can be used. For example, the wiring 22d is intermittently formed along the longitudinal direction of the LED placement portion 21a in order to connect adjacent LEDs 22. Thereby, electric power is supplied to each LED 22 via the wiring 22d.
　（電球形ランプの製造方法）
　次に、本実施の形態に係る電球形ランプ１の製造方法について、図７及び図８を用いて説明する。図７は、本発明の実施の形態に係る電球形ランプ１の製造方法を説明するためのフローチャートである。図８は、本発明の実施の形態に係る電球形ランプ１の製造方法を説明するための図である。 (Manufacturing method of light bulb shaped lamp)
Next, a method for manufacturing the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIGS. FIG. 7 is a flowchart for explaining a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention. FIG. 8 is a diagram for explaining a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
　図７に示すように、まず、折り曲げ工程として、平面部２１ａ１、２１ａ２にＬＥＤ２２が配置された折り曲げ可能な基板２１を、平面部２１ａ１、２１ａ２とは異なる位置で折り曲げることで、屈曲部２１ｂ、２１ｄを形成する（Ｓ１０２）。具体的には、図８の（ａ）に示すように、基板２１が点線部分で折り曲げられる。そして、図８の（ｂ）に示すように、屈曲部２１ｂ、２１ｄが形成される。 As shown in FIG. 7, first, as a bending step, the bent portions 21b and 21d are formed by bending the foldable substrate 21 in which the LEDs 22 are arranged on the flat portions 21a1 and 21a2 at positions different from the flat portions 21a1 and 21a2. Is formed (S102). Specifically, as shown in FIG. 8A, the substrate 21 is bent along the dotted line. Then, as shown in FIG. 8B, bent portions 21b and 21d are formed.
　図７に戻り、次に、配置工程として、折り曲げられた基板２１をグローブ１０内方に配置する（Ｓ１０４）。具体的には、複数のＬＥＤ２２の中心がグローブ１０の中心位置になるように、基板２１がグローブ１０内方に配置される。 Referring back to FIG. 7, next, as a placement step, the folded substrate 21 is placed inside the globe 10 (S104). Specifically, the substrate 21 is disposed inside the globe 10 so that the centers of the plurality of LEDs 22 are located at the center of the globe 10.
　以上のようにして、本実施の形態に係る電球形ランプ１が構成される。このように、本実施の形態における電球形ランプ１によれば、グローブ１０内方に配置された折り曲げ可能な基板２１を備えており、基板２１は、折り曲げられることで形成された屈曲部２１ｂ、２１ｄと、ＬＥＤ２２が配置された平面部２１ａ１、２１ａ２とを有している。これにより、電球形ランプ１において、ＬＥＤ２２が実装された基板２１を折り曲げることで、ＬＥＤ２２の光照射方向を所望の向きに調整することができるため、配光角を容易に調整することができる。 Thus, the light bulb shaped lamp 1 according to the present embodiment is configured. As described above, according to the light bulb shaped lamp 1 in the present embodiment, the substrate 21 includes the foldable substrate 21 disposed inside the globe 10, and the substrate 21 is bent to form a bent portion 21 b formed by bending. 21d and plane portions 21a1 and 21a2 on which the LEDs 22 are arranged. Thereby, in the light bulb shaped lamp 1, by bending the substrate 21 on which the LED 22 is mounted, the light irradiation direction of the LED 22 can be adjusted to a desired direction, so that the light distribution angle can be easily adjusted.
　また、基板２１は、平面部２１ａ１、２１ａ２を含む平面とは異なる面に、リード線７０ａ、７０ｂと接続される接続部であるコネクタ２３を有している。ここで、基板２１は折り曲げられてＬＥＤ２２が実装された面の角度が調整されているため、ＬＥＤ２２が実装された面にリード線７０ａ、７０ｂを接続する構成では、当該面の角度がずれてしまうおそれがある。このため、平面部２１ａ１、２１ａ２を含む平面とは異なる面にコネクタ２３を有していることで、配光角の調整がずれるのを抑制しつつ、コネクタ２３にリード線７０ａ、７０ｂを容易に接続することができる。 Further, the substrate 21 has a connector 23 which is a connection portion connected to the lead wires 70a and 70b on a surface different from the plane including the plane portions 21a1 and 21a2. Here, since the angle of the surface on which the LED 22 is mounted is adjusted by bending the substrate 21, the angle of the surface is shifted in the configuration in which the lead wires 70a and 70b are connected to the surface on which the LED 22 is mounted. There is a fear. For this reason, by having the connector 23 on a plane different from the plane including the plane portions 21a1 and 21a2, the lead wires 70a and 70b can be easily connected to the connector 23 while suppressing the adjustment of the light distribution angle. Can be connected.
　また、基板２１は、平面部２１ａ１、２１ａ２と交差する方向に延びる、平面部２１ａ１、２１ａ２に配置されたＬＥＤ２２を支持する支持部２１ｃを有している。これにより、基板２１がＬＥＤ２２を支持する支柱の役割りも兼用することができるため、支柱を別に設ける必要が無く、電球形ランプ１を構成する部品点数を低減することができる。 The substrate 21 also has a support portion 21c that supports the LEDs 22 arranged on the plane portions 21a1 and 21a2, extending in a direction intersecting with the plane portions 21a1 and 21a2. Thereby, since the board | substrate 21 can also serve as the support | pillar which supports LED22, it is not necessary to provide a support | pillar separately and the number of parts which comprise the lightbulb-shaped lamp 1 can be reduced.
　また、基板２１は、金属製の基材層２４ａと、基材層２４ａ上に配置された絶縁層２４ｂ、２４ｃとを備えている。つまり、基板２１は、絶縁層２４ｂ、２４ｃによって基板表面の絶縁状態を保ちながら、基材層２４ａによって基板の熱伝導性を向上させている。これにより、ＬＥＤ２２によって発生した熱を基板２１が効率良く台座４０に伝達することができるため、当該熱を効率良く放熱させることができる。 The substrate 21 includes a metal base layer 24a and insulating layers 24b and 24c disposed on the base layer 24a. That is, the substrate 21 improves the thermal conductivity of the substrate by the base material layer 24a while maintaining the insulating state of the substrate surface by the insulating layers 24b and 24c. Thereby, since the board | substrate 21 can transmit the heat | fever generate | occur | produced by LED22 to the base 40 efficiently, the said heat can be thermally radiated efficiently.
　また、複数のＬＥＤ２２は、グローブ１０の中心位置を中心に配列されている。これにより、電球形ランプ１において、単純な構成で、従来の白熱電球のようなフィラメント感を再現することができる。 The plurality of LEDs 22 are arranged around the center position of the globe 10. Thereby, in the light bulb shaped lamp 1, a filament feeling like a conventional incandescent light bulb can be reproduced with a simple configuration.
　また、本実施の形態における電球形ランプ１の製造方法によれば、平面部２１ａ１、２１ａ２にＬＥＤ２２が配置された折り曲げ可能な基板２１を、平面部２１ａ１、２１ａ２とは異なる位置で折り曲げて屈曲部２１ｂ、２１ｄを形成し、折り曲げられた基板２１をグローブ１０内方に配置する。これにより、電球形ランプ１の製造方法において、ＬＥＤ２２が実装された基板２１を折り曲げることで、ＬＥＤ２２の光照射方向を所望の向きに調整することができるため、配光角を容易に調整することができる。 Further, according to the method for manufacturing the light bulb shaped lamp 1 in the present embodiment, the bendable substrate 21 in which the LEDs 22 are arranged on the flat portions 21a1 and 21a2 is bent at a position different from the flat portions 21a1 and 21a2. 21b and 21d are formed, and the bent substrate 21 is disposed inside the globe 10. Thereby, in the manufacturing method of the light bulb shaped lamp 1, the light irradiation direction of the LED 22 can be adjusted to a desired direction by bending the substrate 21 on which the LED 22 is mounted, so that the light distribution angle can be easily adjusted. Can do.
　また、本発明は、このような電球形ランプ１として実現することができるだけでなく、電球形ランプ１を備える照明装置としても実現することができる。以下、本発明の実施の形態に係る照明装置について、図９を用いて説明する。図９は、本発明の実施の形態に係る照明装置２の概略断面図である。 Further, the present invention can be realized not only as such a light bulb shaped lamp 1 but also as an illumination device including the light bulb shaped lamp 1. Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to FIG. FIG. 9 is a schematic cross-sectional view of the illumination device 2 according to the embodiment of the present invention.
　図９に示すように、本発明の実施の形態に係る照明装置２は、例えば、室内の天井に装着されて使用され、上記の実施の形態に係る電球形ランプ１と、点灯器具３とを備える。 As shown in FIG. 9, the lighting device 2 according to the embodiment of the present invention is used, for example, mounted on an indoor ceiling, and includes the light bulb shaped lamp 1 according to the above embodiment and the lighting fixture 3. Prepare.
　点灯器具３は、電球形ランプ１を消灯及び点灯させるものであり、天井に取り付けられる器具本体４と、電球形ランプ１を覆うランプカバー５とを備える。 The lighting fixture 3 turns off and turns on the light bulb shaped lamp 1 and includes a fixture main body 4 attached to the ceiling and a lamp cover 5 that covers the light bulb shaped lamp 1.
　器具本体４は、ソケット４ａを有する。ソケット４ａには、電球形ランプ１の口金８０が螺合される。このソケット４ａを介して電球形ランプ１に電力が供給される。 The appliance body 4 has a socket 4a. The base 80 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.
　次に、電球形ランプ１が備えるＬＥＤモジュール２０の変形例について、図１０～図１８を用いて説明する。なお、以下の変形例では、電球形ランプが備えるＬＥＤモジュール以外の構成要素は、上記の実施の形態における電球形ランプ１が備える構成要素と同様であるため、ＬＥＤモジュール以外の構成要素についての説明は省略する。 Next, modified examples of the LED module 20 included in the light bulb shaped lamp 1 will be described with reference to FIGS. In addition, in the following modifications, since components other than the LED module included in the light bulb shaped lamp are the same as the components included in the light bulb shaped lamp 1 in the above embodiment, description of the components other than the LED module is provided. Is omitted.
　また、以下の変形例における基板は、上記実施の形態と同様に、全て上述した折り曲げ可能な平板状の基板で形成されており、折り曲げられることで屈曲部が形成されるとともに、平面部にＬＥＤが配置されている。また、複数のＬＥＤの中心がグローブの中心位置になるように、基板がグローブ内方に配置される。 In addition, the substrate in the following modifications is formed by the above-described foldable flat plate-like substrate as in the above embodiment, and a bent portion is formed by bending, and an LED is formed on the flat portion. Is arranged. In addition, the substrate is disposed inside the globe so that the centers of the plurality of LEDs are located at the center of the globe.
　（変形例１）
　図１０は、本発明の実施の形態の変形例１に係るＬＥＤモジュール１２０の構成を示す図である。具体的には、同図の（ａ）は、ＬＥＤモジュール１２０を図４における上方から見た図であり、同図の（ｂ）は、ＬＥＤモジュール１２０を図４における前方から見た図である。 (Modification 1)
FIG. 10 is a diagram showing a configuration of the LED module 120 according to the first modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 120 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 120 viewed from the front in FIG. .
　同図に示すように、ＬＥＤモジュール１２０は、折り曲げられた基板１２１の上部上面の平面部に３つのＬＥＤ２２が配置されているとともに、折り曲げられた基板１２２の上部下面の平面部に３つのＬＥＤ２２が配置されている。なお、基板１２１と基板１２２とは、対向する方向に両端が折り曲げられている。また、基板１２１、１２２の下部にはコネクタ２３が配置され、それぞれのＬＥＤ２２に電力が供給される。 As shown in the figure, in the LED module 120, three LEDs 22 are arranged on the flat portion of the upper upper surface of the bent substrate 121, and three LEDs 22 are arranged on the flat portion of the upper lower surface of the bent substrate 122. Has been placed. Note that both ends of the substrate 121 and the substrate 122 are bent in opposite directions. In addition, a connector 23 is disposed below the boards 121 and 122, and power is supplied to each LED 22.
　（変形例２）
　図１１は、本発明の実施の形態の変形例２に係るＬＥＤモジュール２２０の構成を示す図である。具体的には、同図の（ａ）は、ＬＥＤモジュール２２０を図４における上方から見た図であり、同図の（ｂ）は、ＬＥＤモジュール２２０を図４における前方から見た図である。 (Modification 2)
FIG. 11 is a diagram showing a configuration of an LED module 220 according to the second modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 220 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 220 viewed from the front in FIG. .
　同図に示すように、ＬＥＤモジュール２２０は、折り曲げられた基板２２１の上部の平面部に４つのＬＥＤ２２が配置されているとともに、折り曲げられた基板２２２の上部の平面部に４つのＬＥＤ２２が配置されている。なお、基板２２１と基板２２２とは、互いに逆向きに両端が折り曲げられている。また、基板２２１、２２２の下部にはコネクタ２３が配置され、それぞれのＬＥＤ２２に電力が供給される。 As shown in the figure, in the LED module 220, four LEDs 22 are arranged on the flat part on the upper part of the folded substrate 221 and four LEDs 22 are arranged on the flat part on the upper part of the bent board 222. ing. Note that both ends of the substrate 221 and the substrate 222 are bent in opposite directions. In addition, a connector 23 is disposed below the boards 221 and 222, and power is supplied to the respective LEDs 22.
　（変形例３）
　図１２は、本発明の実施の形態の変形例３に係るＬＥＤモジュール３２０の構成を示す図である。具体的には、同図の（ａ）は、ＬＥＤモジュール３２０を図４における上方から見た図であり、同図の（ｂ）は、ＬＥＤモジュール３２０を図４における前方から見た図である。 (Modification 3)
FIG. 12 is a diagram showing a configuration of an LED module 320 according to the third modification of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 320 as viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 320 as viewed from the front in FIG. .
　同図に示すように、ＬＥＤモジュール３２０は、折り曲げられた基板３２１の上部上面の平面部に４つのＬＥＤ２２、及び基板３２１の上部下面の平面部に４つのＬＥＤ２２が配置されている。なお、基板３２１は下方に向けて両端が折り曲げられることで、折り曲げられた部位が支柱の役割りを担い、ＬＥＤ２２を支持している。また、基板３２１の下部にはコネクタ２３が配置され、それぞれのＬＥＤ２２に電力が供給される。 As shown in the figure, in the LED module 320, four LEDs 22 are arranged on the flat portion of the upper upper surface of the bent substrate 321 and four LEDs 22 are arranged on the flat portion of the upper lower surface of the substrate 321. The substrate 321 is bent at both ends so that the bent portion serves as a support column and supports the LED 22. In addition, a connector 23 is disposed below the substrate 321, and power is supplied to each LED 22.
　（変形例４）
　図１３は、本発明の実施の形態の変形例４に係るＬＥＤモジュール４２０の構成を示す図である。具体的には、同図の（ａ）は、ＬＥＤモジュール４２０を図４における前方から見た図であり、同図の（ｂ）は、ＬＥＤモジュール４２０を図４における右側から見た図である。 (Modification 4)
FIG. 13 is a diagram showing a configuration of an LED module 420 according to Modification 4 of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 420 as viewed from the front in FIG. 4, and FIG. 4B is a view of the LED module 420 as viewed from the right side in FIG. .
　同図に示すように、ＬＥＤモジュール４２０は、折り曲げられた基板４２１の上部右面の平面部に８つのＬＥＤ２２、及び基板４２１の上部左面の平面部に８つのＬＥＤ２２が配置されている。なお、基板４２１は左側に向けて下端が折り曲げられている。また、基板４２１の下部にはコネクタ２３が配置され、それぞれのＬＥＤ２２に電力が供給される。 As shown in the figure, in the LED module 420, eight LEDs 22 are arranged on the plane portion of the upper right surface of the bent substrate 421, and eight LEDs 22 are arranged on the plane portion of the upper left surface of the substrate 421. Note that the lower end of the substrate 421 is bent toward the left side. In addition, a connector 23 is disposed below the substrate 421, and power is supplied to each LED 22.
　（変形例５）
　図１４は、本発明の実施の形態の変形例５に係るＬＥＤモジュール５２０の構成を示す図である。具体的には、同図の（ａ）は、ＬＥＤモジュール５２０を図４における上方から見た図であり、同図の（ｂ）は、ＬＥＤモジュール５２０を図４における前方から見た図であり、同図の（ｃ）は、ＬＥＤモジュール５２０を図４における右側から見た図である。 (Modification 5)
FIG. 14 is a diagram showing a configuration of an LED module 520 according to Modification 5 of the embodiment of the present invention. Specifically, FIG. 4A is a view of the LED module 520 viewed from above in FIG. 4, and FIG. 4B is a view of the LED module 520 viewed from the front in FIG. (C) of the same figure is the figure which looked at the LED module 520 from the right side in FIG.
　同図に示すように、ＬＥＤモジュール５２０は、折り曲げられた基板５２１の上部の上下左右の平面部に８つずつのＬＥＤ２２が配置されている。なお、基板５２１は右側に向けて下端が折り曲げられ、上部は断面が四角形状になるように３回折り曲げられている。また、基板５２１の下部にはコネクタ２３が配置され、それぞれのＬＥＤ２２に電力が供給される。 As shown in the figure, in the LED module 520, eight LEDs 22 are arranged on each of the upper, lower, left and right plane portions of the bent substrate 521. The lower end of the substrate 521 is bent toward the right side, and the upper part is bent three times so that the cross section becomes a square shape. In addition, a connector 23 is disposed below the substrate 521 and power is supplied to each LED 22.
　（変形例６）
　図１５は、本発明の実施の形態の変形例６に係るＬＥＤモジュール６２０の構成を示す図である。具体的には、同図は、ＬＥＤモジュール６２０を図４における右上方向から見た斜視図である。 (Modification 6)
FIG. 15 is a diagram showing a configuration of an LED module 620 according to Modification 6 of the embodiment of the present invention. Specifically, this figure is a perspective view of the LED module 620 as seen from the upper right direction in FIG.
　同図に示すように、ＬＥＤモジュール６２０は、基板６２１の上部の突出状の平板部が同図の後方に向けて折り曲げられ、８つの側面それぞれに３つずつのＬＥＤ２２が配置されている。なお、基板６２１の下部は同図の前方に向けて折り曲げられている。また、基板６２１の下部にはコネクタ２３が配置され、それぞれのＬＥＤ２２に電力が供給される。 As shown in the figure, in the LED module 620, the protruding flat plate portion of the upper part of the substrate 621 is bent toward the rear of the figure, and three LEDs 22 are arranged on each of the eight side surfaces. In addition, the lower part of the board | substrate 621 is bent toward the front of the figure. In addition, the connector 23 is disposed below the substrate 621 and power is supplied to each LED 22.
　（変形例７）
　図１６、図１７Ａ及び図１７Ｂは、本発明の実施の形態の変形例７に係るＬＥＤモジュール７２０、８２０の構成を示す図である。具体的には、図１６は、ＬＥＤモジュール７２０を図４における右上方向から見た斜視図である。また、図１７Ａは、ＬＥＤモジュール７２０を図４における右側から見た図であり、図１７Ｂは、ＬＥＤモジュール７２０の他の構成例としてのＬＥＤモジュール８２０を示す図である。 (Modification 7)
FIGS. 16, 17A, and 17B are diagrams showing configurations of LED modules 720 and 820 according to Modification 7 of the embodiment of the present invention. Specifically, FIG. 16 is a perspective view of the LED module 720 viewed from the upper right direction in FIG. 17A is a view of the LED module 720 as viewed from the right side in FIG. 4, and FIG. 17B is a view showing an LED module 820 as another configuration example of the LED module 720.
　図１６及び図１７Ａに示すように、ＬＥＤモジュール７２０は、基板７２１が下方に向けて折り曲げられ、２つの側面それぞれに４つずつのＬＥＤ２２が配置されている。また、基板７２１の下面にはリード線７０ａ、７０ｂが接続され、このリード線７０ａ、７０ｂから、それぞれのＬＥＤ２２に電力が供給される。なお、本変形例では、リード線７０ａ、７０ｂによって基板７２１がグローブ内で支持されるが、別に基板７２１を支持する支柱を備えている構成でも構わない。 16 and 17A, in the LED module 720, the substrate 721 is bent downward, and four LEDs 22 are arranged on each of the two side surfaces. Further, lead wires 70a and 70b are connected to the lower surface of the substrate 721, and power is supplied to the respective LEDs 22 from the lead wires 70a and 70b. In this modification, the substrate 721 is supported in the globe by the lead wires 70a and 70b. However, a configuration in which a support column for supporting the substrate 721 is separately provided may be used.
　また、図１７Ａに示すように、本変形例では、ＬＥＤ２２は、下方以外の５方向に光を照射できるＬＥＤ素子である。このようにＬＥＤ２２を配置することで、ＬＥＤモジュール７２０は、広配光角で光を照射することができる。 Also, as shown in FIG. 17A, in this modification, the LED 22 is an LED element that can irradiate light in five directions other than the lower side. By arranging the LEDs 22 in this way, the LED module 720 can irradiate light with a wide light distribution angle.
　なお、ＬＥＤモジュール７２０において、基板７２１の上面にリード線７０ａ、７０ｂが接続される構成でも構わない。また、図１７Ｂに示すように、基板８２１が下方に向けて２箇所折り曲げられ、２つの側面それぞれに４つずつのＬＥＤ２２が配置されたＬＥＤモジュール８２０において、基板８２１の上面にリード線７０ａ、７０ｂが接続される構成でも構わない。 The LED module 720 may have a configuration in which the lead wires 70a and 70b are connected to the upper surface of the substrate 721. In addition, as shown in FIG. 17B, in an LED module 820 in which the substrate 821 is bent at two locations downward and four LEDs 22 are arranged on each of the two side surfaces, lead wires 70a and 70b are formed on the upper surface of the substrate 821. May be connected.
　（変形例８）
　図１８は、本発明の実施の形態の変形例８に係るＬＥＤモジュール９２０の構成を示す図である。具体的には、同図は、ＬＥＤモジュール９２０を図４における前方から見た図である。 (Modification 8)
FIG. 18 is a diagram showing a configuration of an LED module 920 according to Modification 8 of the embodiment of the present invention. Specifically, this figure is a view of the LED module 920 as seen from the front in FIG.
　同図に示すように、ＬＥＤモジュール９２０は、基板９２１が蛇腹状に折り曲げられ、それぞれの側面にＬＥＤ２２が配置されている。また、基板９２１の両端部にはリード線７０ａ、７０ｂが接続され、このリード線７０ａ、７０ｂから、それぞれのＬＥＤ２２に電力が供給される。なお、本変形例では、リード線７０ａ、７０ｂによって基板９２１がグローブ内で支持されるが、別に基板９２１を支持する支柱を備えている構成でも構わない。 As shown in the figure, in the LED module 920, the substrate 921 is bent in a bellows shape, and the LEDs 22 are arranged on the respective side surfaces. In addition, lead wires 70a and 70b are connected to both ends of the substrate 921, and power is supplied to the respective LEDs 22 from the lead wires 70a and 70b. In this modification, the substrate 921 is supported in the globe by the lead wires 70a and 70b. However, a configuration in which a support column for supporting the substrate 921 is provided may be used.
　また、ＬＥＤモジュール９２０においては、基板９２１が蛇腹状に折り曲げられている構成であるが、基板が螺旋状に折り曲げられている構成でも構わない。 Further, in the LED module 920, the substrate 921 is bent in a bellows shape, but the substrate may be bent in a spiral shape.
　以上、本発明に係る電球形ランプ及び照明装置について、実施の形態及びその変形例に基づいて説明したが、本発明は、これらの実施の形態及び変形例に限定されるものではない。 As described above, the light bulb shaped lamp and the lighting device according to the present invention have been described based on the embodiments and the modifications thereof, but the present invention is not limited to these embodiments and modifications.
　例えば、上記の実施の形態及び変形例において、ＬＥＤモジュール２０はＳＭＤ型のＬＥＤモジュールであることとしたが、これに限らない。例えば、ベアチップが基板２１上に直接実装されたＣＯＢ（Ｃｈｉｐ　Ｏｎ　Ｂｏａｒｄ）型のＬＥＤモジュールを用いても構わない。 For example, in the above-described embodiment and modification, the LED module 20 is an SMD type LED module, but is not limited thereto. For example, a COB (Chip On Board) type LED module in which a bare chip is directly mounted on the substrate 21 may be used.
　また、上記の実施の形態及び変形例において、ＬＥＤモジュール２０は、青色ＬＥＤと黄色蛍光体とによって白色光を放出するように構成したが、これに限らない。例えば、赤色蛍光体及び緑色蛍光体を含有する蛍光体含有樹脂を用いて、これと青色ＬＥＤと組み合わせることによりに白色光を放出するように構成しても構わない。 Further, in the above-described embodiment and modification, the LED module 20 is configured to emit white light by the blue LED and the yellow phosphor, but is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used so that white light is emitted by combining this with a blue LED.
　また、ＬＥＤ２２は、青色以外の色を発光するＬＥＤを用いても構わない。例えば、ＬＥＤ２２として紫外線発光のＬＥＤチップを用いる場合、蛍光体粒子としては、三原色（赤色、緑色、青色）に発光する各色蛍光体粒子を組み合わせたものを用いることができる。さらに、蛍光体粒子以外の波長変換材を用いてもよく、例えば、波長変換材として、半導体、金属錯体、有機染料、顔料など、ある波長の光を吸収し、吸収した光とは異なる波長の光を発する物質を含んでいる材料を用いてもよい。 The LED 22 may be an LED that emits a color other than blue. For example, when an LED chip that emits ultraviolet rays is used as the LED 22, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.
　また、上記の実施の形態及び変形例において、発光素子としてＬＥＤを例示したが、半導体レーザ等の半導体発光素子、有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）又は無機ＥＬ等の発光素子を用いてもよい。 In the above-described embodiments and modifications, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence), or an inorganic EL may be used.
　また、上記の実施の形態及び変形例では、白熱電球と同形状のグローブ１０を用いた電球形ＬＥＤランプとしたが、これに限らない。つまり、本実施の形態では、グローブ１０の大きさを筐体５０の大きさよりも大きくしているが、グローブ１０の大きさを筐体５０の大きさよりも小さくした電球形ランプにも適用することができる。 In the above-described embodiment and modification, the bulb-type LED lamp using the globe 10 having the same shape as the incandescent bulb is used. However, the present invention is not limited to this. That is, in the present embodiment, the size of the globe 10 is larger than the size of the housing 50, but the present invention is also applicable to a light bulb shaped lamp in which the size of the globe 10 is smaller than the size of the housing 50. Can do.
　また、上記の実施の形態及び変形例において、螺合部５２ｂは、外側筐体部５２の一部としたが、内側筐体部５１の一部としても構わない。すなわち、螺合部５２ｂを、駆動回路７０を収納する回路ケースの一部とみなしてもよく、より具体的には、螺合部５２ｂを回路ホルダ部５１ｂの一部としても構わない。 In the above-described embodiment and modification, the screwing part 52 b is a part of the outer casing part 52, but may be a part of the inner casing part 51. That is, the screwing part 52b may be regarded as a part of a circuit case that houses the drive circuit 70, and more specifically, the screwing part 52b may be a part of the circuit holder part 51b.
　その他、本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態及び変形例に施したもの、又は、実施の形態及び変形例における構成要素を組み合わせて構築される形態も、本発明の範囲内に含まれる。 In addition, as long as it does not deviate from the gist of the present invention, various modifications conceived by those skilled in the art are applied to the present embodiment and the modified examples, or a form constructed by combining the constituent elements in the embodiments and modified examples, It is included within the scope of the present invention.
　本発明は、従来の白熱電球等を代替する電球形ランプとして有用であり、照明装置等において広く利用することができる。 The present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.
　１　電球形ランプ
　２　照明装置
　３　点灯器具
　４　器具本体
　４ａ　ソケット
　５　ランプカバー
　１０　グローブ
　１１　開口部
　２０、１２０、２２０、３２０、４２０、５２０、６２０、７２０、８２０、９２０　ＬＥＤモジュール
　２１、１２１、１２２、２２１、２２２、３２１、４２１、５２１、６２１、７２１、８２１、９２１　基板
　２１ａ　ＬＥＤ配置部
　２１ａ１、２１ａ２　平面部
　２１ｂ　屈曲部
　２１ｃ　支持部
　２１ｄ　屈曲部
　２１ｅ　コネクタ配置部
　２２　ＬＥＤ
　２２ａ　パッケージ
　２２ｂ　ＬＥＤチップ
　２２ｃ　封止部材
　２２ｄ　配線
　２３　コネクタ
　２４ａ　基材層
　２４ｂ、２４ｃ　絶縁層
　３０　結合部材
　３０ａ　縦溝部
　３０ｂ　鍔部
　３０ｃ　凸部
　４０　台座
　４０ａ　径小部
　４０ａ１　貫通孔
　４０ｂ　径大部
　４０ｂ１　凹部
　５０　筐体
　５１　内側筐体部
　５１ａ　回路キャップ部
　５１ｂ　回路ホルダ部
　５２　外側筐体部
　５２ａ　外郭部
　５２ｂ　螺合部
　６０　金属部材
　７０　駆動回路
　７０ａ～７０ｄ　リード線
　７１　回路基板
　７２　回路素子
　８０　口金
　９０　ネジ DESCRIPTION OF SYMBOLS 1 Light bulb-shaped lamp 2 Lighting device 3 Lighting fixture 4 Appliance main body 4a Socket 5 Lamp cover 10 Globe 11 Opening 20, 120, 220, 320, 420, 520, 620, 720, 820, 920 LED module 21, 121, 122, 221, 222, 321, 421, 521, 621, 721, 821, 921 Substrate 21 a LED placement portion 21 a 1, 21 a 2 Planar portion 21 b Bend portion 21 c Support portion 21 d Bend portion 21 e Connector placement portion 22 LED
22a Package 22b LED chip 22c Sealing member 22d Wiring 23 Connector 24a Base material layer 24b, 24c Insulating layer 30 Coupling member 30a Longitudinal groove part 30b Gutter part 30c Convex part 40 Base 40a Small diameter part 40a1 Through hole 40b Large diameter part 40b1 Concave part 50 Housing 51 Inner housing portion 51a Circuit cap portion 51b Circuit holder portion 52 Outer housing portion 52a Outer portion 52b Screwed portion 60 Metal member 70 Drive circuit 70a to 70d Lead wire 71 Circuit board 72 Circuit element 80 Base 90 Screw

Claims (7)

  1. 　グローブと、前記グローブ内方に配置された半導体発光素子とを備える電球形ランプであって、
    　前記グローブ内方に配置された折り曲げ可能な基板を備え、
    　前記基板は、折り曲げられることで形成された屈曲部と、前記半導体発光素子が配置された平面部とを有する
    　電球形ランプ。     A light bulb shaped lamp comprising a globe and a semiconductor light emitting element disposed inside the globe,
    Comprising a foldable substrate disposed inside the globe,
    The substrate has a bent portion formed by being bent and a flat portion on which the semiconductor light emitting element is disposed.
  2. 　さらに、
    　前記半導体発光素子に電力を供給するための駆動回路と、
    　前記半導体発光素子と前記駆動回路とを電気的に接続するためのリード線とを備え、
    　前記基板は、前記平面部を含む平面とは異なる面に、前記リード線と接続される接続部を有する
    　請求項１に記載の電球形ランプ。     further,
    A drive circuit for supplying power to the semiconductor light emitting device;
    A lead wire for electrically connecting the semiconductor light emitting element and the drive circuit;
    The light bulb shaped lamp according to claim 1, wherein the substrate has a connection portion connected to the lead wire on a surface different from a plane including the planar portion.
  3. 　前記基板は、さらに、前記平面部と交差する方向に延びる、前記平面部に配置された前記半導体発光素子を支持する支持部を有する
    　請求項１又は２に記載の電球形ランプ。     3. The light bulb shaped lamp according to claim 1, wherein the substrate further includes a support portion that supports the semiconductor light emitting element disposed on the planar portion, extending in a direction intersecting with the planar portion.
  4. 　前記基板は、金属製の基材層と、前記基材層上に配置された前記平面部を有する絶縁層とを備える
    　請求項１～３のいずれか１項に記載の電球形ランプ。     The light bulb shaped lamp according to any one of claims 1 to 3, wherein the substrate includes a metal base layer and an insulating layer having the planar portion disposed on the base layer.
  5. 　前記半導体発光素子を複数備え、
    　前記複数の半導体発光素子は、前記グローブの中心位置を中心に配列されている
    　請求項１～４のいずれか１項に記載の電球形ランプ。     A plurality of the semiconductor light emitting elements,
    The light bulb shaped lamp according to any one of claims 1 to 4, wherein the plurality of semiconductor light emitting elements are arranged around a center position of the globe.
  6. 　請求項１～５のいずれか１項に記載の電球形ランプを備える
    　照明装置。     An illumination device comprising the light bulb shaped lamp according to any one of claims 1 to 5.
  7. 　グローブと、前記グローブ内方に配置された半導体発光素子とを備える電球形ランプの製造方法であって、
    　平面部に前記半導体発光素子が配置された折り曲げ可能な基板を、前記平面部とは異なる位置で折り曲げることで、屈曲部を形成する折り曲げ工程と、
    　折り曲げられた前記基板を前記グローブ内方に配置する配置工程と
    　を含む電球形ランプの製造方法。     A method of manufacturing a light bulb shaped lamp comprising a globe and a semiconductor light emitting element disposed inside the globe,
    A bending step of forming a bent portion by bending a foldable substrate in which the semiconductor light emitting element is disposed in a flat portion at a position different from the flat portion;
    An arrangement step of arranging the bent substrate inside the globe.
PCT/JP2013/001171 2012-08-08 2013-02-27 Bulb-type lamp, illumination device, and method for manufacturing bulb-type lamp WO2014024339A1 (en)

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