JP6473927B2 - Illumination light source and illumination device - Google Patents

Description

  The present invention relates to an illumination light source and an illumination device including the same.

  Semiconductor light-emitting elements such as light-emitting diodes (LEDs) are expected to serve as light sources for various products because of their small size and long life. Among these, a bulb-type lamp using an LED (LED bulb) has been actively developed as an illumination light source that substitutes for a conventionally known bulb-type fluorescent lamp or incandescent bulb (see, for example, Patent Document 1). .

  The LED bulb includes, for example, an LED module (light emitting module), a globe (cover) that covers the LED module, a module plate for placing the LED module, a drive circuit for causing the LED module to emit light, and an LED module. And a base for receiving power for emitting light from the outside.

JP 2011-146241 A

  A heat sink is disposed in the LED bulb to dissipate heat generated by the LED module.

  An object of the present invention is to provide an illumination light source and an illumination device capable of easily and reliably fixing a heat sink.

  In order to achieve the above object, one aspect of a light source for illumination according to the present invention includes a light emitting module, a drive circuit for causing the light emitting module to emit light, a housing surrounding the drive circuit, the light emitting module, and a heat source. And the heat sink is fixed to the casing in a state in which the axial movement of the rotation is restricted by rotating the heat sink or the casing. And

  According to the present invention, the heat sink can be fixed easily and reliably.

It is sectional drawing of the LED bulb which concerns on embodiment. It is a disassembled perspective view of the LED bulb which concerns on embodiment. It is a perspective view for demonstrating a mode when incorporating a heat sink in a housing | casing. It is an expanded sectional view for demonstrating a mode when incorporating a heat sink in a housing | casing. It is a perspective view for demonstrating a mode when incorporating a heat sink in a housing | casing. It is a schematic sectional drawing of the illuminating device which concerns on embodiment. It is a top view for demonstrating a mode when fixing the heat sink and housing | casing in the LED bulb which concerns on a modification.

(Embodiment)
Embodiments of the present invention will be described below. Note that each of the embodiments described below shows a preferred specific example of the present invention. Therefore, numerical values, shapes, materials, components, arrangement positions and connection forms of components, and steps and order of steps shown in the following embodiments are merely examples and are not intended to limit the present invention. Absent. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements.

  Each figure is a mimetic diagram and is not necessarily illustrated strictly. In each figure, substantially the same configuration is denoted by the same reference numeral, and redundant description is omitted or simplified.

[LED bulb]
In the following embodiments, a light bulb shaped LED lamp (LED light bulb) serving as a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb will be described as an example of an illumination light source.

  First, the whole structure of the LED light bulb 1 which concerns on embodiment is demonstrated using FIG.1 and FIG.2. FIG. 1 is a cross-sectional view of an LED bulb 1 according to an embodiment. FIG. 2 is an exploded perspective view of the LED bulb 1 according to the embodiment.

  In FIG. 1, the alternate long and short dash line drawn along the vertical direction of the drawing indicates the central axis J of the LED bulb 1. In the present embodiment, the central axis J is the optical axis (lamp axis) of the LED bulb 1 and coincides with the axis of the globe 20 (globe axis). The central axis J is an axis that becomes a rotation center when the LED bulb 1 is attached to a socket of a lighting fixture (not shown), and coincides with the rotation axis of the base 60.

  As shown in FIGS. 1 and 2, the LED bulb 1 is thermally coupled to the LED module 10, a globe 20 covering the LED module 10, a drive circuit 30 for causing the LED module 10 to emit light, and the LED module 10. A heat sink 40 and a housing 50 surrounding the drive circuit 30. The LED bulb 1 further includes a base 60, lead wires 71 to 74, and a screw 80.

  In the present embodiment, the LED bulb 1 is configured as an envelope by the globe 20, the housing 50, and the base 60.

  Hereinafter, details of each component of the LED bulb 1 will be described with reference to FIGS. 1 and 2.

[LED module]
The LED module 10 is a light emitting device (light emitting module) that emits light of a predetermined color (wavelength). The LED module 10 is configured to emit white light, for example.

  The LED module 10 is disposed inside the globe 20 and emits light by electric power supplied from the drive circuit 30.

  The LED module 10 is fixed to the heat sink 40. Specifically, the LED module 10 is fixed to the first heat transfer plate 41 of the heat sink 40.

  The LED module 10 includes a substrate 11 and a light emitting element 12 disposed on the substrate 11.

  The substrate 11 is a mounting substrate for mounting the light emitting element 12. The board | substrate 11 is a substantially circular plate-shaped board | substrate in planar view, for example.

  The substrate 11 is provided with a hole portion 11a into which the claw portion 51a of the housing 50 is inserted. The hole 11 a is formed at a position corresponding to the hole 41 a of the heat sink 40. In the present embodiment, two holes 11a are formed at positions facing the central axis J as a center. Each hole portion 11a has a substantially arcuate slit shape. The hole portion 11a is, for example, a through hole that penetrates the substrate 11, but may be a recess that does not penetrate the substrate 11.

  The substrate 11 is fixed to the heat sink 40. Specifically, the substrate 11 is placed on the first heat transfer plate 41 of the heat sink 40 and fixed to the first heat transfer plate 41. The substrate 11 is provided with a through hole 11 b for inserting a screw 80. The substrate 11 and the first heat transfer plate 41 are fixed by screws 80. As shown in FIG. 1, a part of the screw portion of the screw 80 protrudes from the substrate 11. Although three screws 80 are used in the present embodiment, only one screw 80 is shown in FIG. The method for fixing the substrate 11 and the heat sink 40 is not limited to screwing, and other fixing means such as an adhesive may be used.

  Further, a through hole 11 c for inserting a pair of lead wires 71 and 72 led out from the drive circuit 30 is provided in the central portion of the substrate 11. Note that the position of the through hole 11 c may not be the central portion of the substrate 11. The substrate 11 is not provided with the through-hole 11c, but a notch is provided at the edge of the substrate 11 and a pair of lead wires 71 and 72 are inserted into the notch and the pair of electrodes of the substrate 11 is provided. It may be connected to a terminal.

  Examples of the substrate 11 include a metal base substrate obtained by applying an insulating film to a metal base material such as aluminum, a ceramic substrate that is a sintered body of a ceramic material such as alumina, or a resin substrate made of a resin material. Is used. Note that the shape of the substrate 11 is not limited to a circle, and a rectangular substrate may be used.

  A pair of electrode terminals (not shown) is provided on the surface of the substrate 11 as a power feeding unit. A pair of lead wires 71 and 72 led out from the drive circuit 30 are connected to each of the pair of electrode terminals. Further, metal wiring (not shown) for electrically connecting the electrode terminals and the plurality of light emitting elements 12 is formed on the surface of the substrate 11 in a pattern having a predetermined shape.

  A plurality of light emitting elements 12 are mounted on one side of the substrate 11. In the present embodiment, the plurality of light emitting elements 12 are arranged on a circumference around the central axis J so as to form an annular array. In FIG. 2, as an example, 22 light emitting elements 12 are mounted. However, the number of mounted light emitting elements 12 is not limited to this, and may be 1 or other than 22. There may be a plurality.

  The light emitting element 12 in the present embodiment is an individually packaged surface mount device (SMD) type LED element. As shown in FIG. 1, a container (package) 12a and a container 12a A primary mounted LED chip 12b and a sealing member 12c for sealing the LED chip 12b are provided. The light emitting element 12 that is an SMD type LED element is secondarily mounted on the substrate 11.

  The container 12a is a resin molded product made of white resin or a white ceramic molded product, and has an inverted frustoconical concave portion (cavity). The inner surface of the recess is inclined and is configured to reflect light from the LED chip 12b upward.

  The LED chip 12b is mounted on the bottom surface of the recess of the container 12a. The LED chip 12b is an example of a semiconductor light emitting element that emits light with a predetermined direct-current power, and is a bare chip that emits monochromatic visible light. The LED chip 12b is, for example, a blue LED chip that emits blue light when energized.

  The sealing member 12c is a light-transmitting insulating resin material such as silicone resin. The sealing member 12c in the present embodiment includes a phosphor as a wavelength conversion material that converts the wavelength of light from the LED chip 12b. That is, the sealing member 12c is a phosphor-containing resin in which a phosphor is contained in a translucent resin, and wavelength-converts (color converts) light from the LED chip 12b to a predetermined wavelength. The sealing member 12c is filled in the recess of the container 12a.

  As the sealing member 12c, for example, when the LED chip 12b is a blue LED, a phosphor-containing resin obtained by dispersing YAG (yttrium, aluminum, garnet) -based yellow phosphor particles in a silicone resin in order to obtain white light. Can be used. As a result, the yellow phosphor particles are excited by the blue light of the blue LED chip to emit yellow light, so that the sealing member 12c generates white light as a combined light of the excited yellow light and the blue light of the blue LED chip. Light is emitted. The sealing member 12c may contain a light diffusing material such as silica.

  The plurality of light emitting elements 12 configured in this way are connected in series, for example, and emit light by DC power supplied from the drive circuit 30 via a pair of lead wires 71 and 72. Note that the connection mode of the plurality of light emitting elements 12 (series connection, parallel connection, combination connection of series connection and parallel connection, etc.) is not particularly limited.

[Glove]
The globe 20 is a translucent cover that covers the LED module 10 and is configured to take out light emitted from the LED module 10 to the outside of the lamp. That is, the light of the LED module 10 that has entered the inner surface of the globe 20 passes through the globe 20 and is extracted to the outside of the globe 20.

  The globe 20 is a hollow member having an opening 21 and has a substantially spherical shape with the top on the opposite side of the opening 21 closed. As shown in FIG. 1, the globe 20 is a hollow rotating body having a central axis J as a rotation axis, for example, and has a shape in which the opening 21 is narrowed.

  The globe 20 is fixed to the opening on the globe side of the housing 50. In the present embodiment, the opening 21 of the globe 20 is inserted into a recess provided at the end of the opening of the outer shell 52 of the casing 50, and the opening 21 of the globe 20 is bonded with an adhesive such as silicone resin. And the outer shell 52 of the housing 50 are fixed.

  As the material of the globe 20, a translucent material made of a glass material such as silica glass transparent to visible light, or a resin material such as acrylic (PMMA) or polycarbonate (PC) can be used.

  The globe 20 is preferably subjected to a diffusion treatment for diffusing light emitted from the LED module 10. For example, the light diffusing function can be given to the globe 20 by forming a light diffusion film (light diffusion layer) on the inner surface or the outer surface of the globe 20.

  Specifically, a milky white light diffusing film can be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment or the like to the entire inner surface or outer surface of the globe 20. Alternatively, the globe 20 can be provided with a light diffusion function by forming a plurality of light diffusion dots or a plurality of minute depressions on the globe 20. As described above, by providing the globe 20 with the light diffusion function, the light incident on the globe 20 from the LED module 10 can be diffused, so that the light distribution angle can be widened.

  In addition, you may make the globe 20 transparent so that the LED module 10 inside can be visually recognized without giving the light diffusion function to the globe 20. In addition, the shape of the globe 20 may be a spheroid or oblate sphere, or may be a shape conforming to an A-type bulb that is a general bulb shape.

[Drive circuit]
The drive circuit 30 is a power supply circuit (power supply unit) for driving the LED module 10, and supplies power to the LED module 10 for causing the LED module 10 (light emitting element 12) to emit light. For example, the drive circuit 30 converts AC power supplied from the base 60 via a pair of lead wires 73 and 74 into DC power, and the DC power is supplied to the LED module 10 via a pair of lead wires 71 and 72. Supply. The LED module 10 (light emitting element 12) is turned on and off by the DC power supplied from the drive circuit 30 (lighting circuit).

  The drive circuit 30 includes a circuit board 31 and a plurality of electronic components (not shown) mounted on the circuit board 31. The drive circuit 30 is disposed between the LED module 10 and the base 60. Specifically, the drive circuit 30 is housed in the inner shell 51 of the housing 50 and is fixed to the inner shell 51 by screwing, bonding, engagement, or the like.

  The circuit board 31 is a printed circuit board (PCB) in which metal wiring such as copper foil is patterned on one surface (solder surface). The plurality of electronic components mounted on the circuit board 31 are electrically connected to each other by metal wiring formed on the circuit board 31. For example, the circuit board 31 is arranged in a posture (vertically placed) in which the main surface of the circuit board 31 is substantially parallel to the central axis J. The circuit board 31 is not limited to the vertical arrangement, and the main surface of the circuit board 31 may be arranged in a posture (horizontal arrangement) substantially orthogonal to the central axis J.

  The electronic components mounted on the circuit board 31 are a plurality of circuit elements for lighting the LED module 10. For example, capacitive elements such as electrolytic capacitors and ceramic capacitors, resistance elements such as resistors, rectifier circuit elements, coils An element, a choke coil (choke transformer), a noise filter, a semiconductor element such as a diode or an integrated circuit element, or the like.

  The drive circuit 30 configured in this way is ensured by being housed in the inner portion 51 of the casing 50 made of an insulating resin material. The drive circuit 30 may be combined with a dimmer circuit, a booster circuit, or the like.

  The drive circuit 30 and the LED module 10 are electrically connected by a pair of lead wires 71 and 72. The drive circuit 30 and the base 60 are electrically connected by a pair of lead wires 73 and 74. These four lead wires 71 to 74 are, for example, alloy copper lead wires, and include a core wire made of alloy copper and an insulating resin coating that covers the core wire.

  The pair of lead wires 71 and 72 are electric wires that supply DC power from the drive circuit 30 to the LED module 10. For example, the lead wire 71 is a high voltage side output terminal wire, and the lead wire 72 is a low voltage side output terminal wire. The lead wires 71 and 72 are inserted into through holes provided in the heat sink 40 and through holes provided in the LED module 10 and connected to the substrate 11 of the LED module 10.

  The lead wires 73 and 74 are electric wires for supplying AC power from the base 60 to the drive circuit 30. The lead wire 73 is connected to the shell portion 61 of the base 60. On the other hand, the lead wire 74 is connected to the eyelet portion 63 of the base 60.

[heatsink]
The heat sink 40 is a heat radiating member that mainly radiates heat generated in the LED module 10. Therefore, the heat sink 40 may be made of a material having high thermal conductivity such as metal. In the present embodiment, the heat sink 40 is made of metal, and can be formed by pressing a metal plate such as an aluminum plate, for example. Note that the heat sink 40 may also dissipate heat generated by the drive circuit 30.

  The heat sink 40 also functions as a support member for supporting the LED module 10, and the LED module 10 is fixed to the heat sink 40.

  The heat sink 40 is configured to surround the drive circuit 30 and is disposed between the LED module 10 and the base 60 in the direction of the central axis J.

  The heat sink 40 is a substantially bottomed cylindrical member, and includes a first heat transfer plate 41 corresponding to the bottom portion and a second heat transfer plate 42 corresponding to the tube portion. The second heat transfer plate 42 is a cylinder having a central axis J as a cylinder axis, and the first heat transfer plate 41 is a lid provided to cover the opening of the cylinder. In the present embodiment, the first heat transfer plate 41 and the second heat transfer plate 42 are integrally formed by pressing a metal plate or the like.

  The first heat transfer plate 41 is a plate-like member whose main surface is substantially orthogonal to the central axis J, and is, for example, a disk-shaped metal plate centered on the central axis J. In the present embodiment, when the heat sink 40 and the housing 50 are fixed, the axis direction of rotation when the heat sink 40 or the housing 50 is rotated coincides with the central axis J. For this reason, the main surface of the 1st heat exchanger plate 41 is substantially orthogonal to the axial direction of rotation when rotating the heat sink 40 or the housing | casing 50. As shown in FIG.

  The heat sink 40 has a hole 41 a provided in the first heat transfer plate 41. The hole 41 a is a through hole that penetrates the first heat transfer plate 41, for example, and is provided at a position corresponding to the claw portion 51 a of the housing 50 in the first heat transfer plate 41. The hole portion 41a is a first engagement portion and engages with a claw portion 51a (second engagement portion) of the housing 50. Two holes 41a are formed at positions facing the central axis J as a center. Each hole 41a has a substantially arcuate slit shape.

  Moreover, the 1st heat exchanger plate 41 is a mounting part in which the LED module 10 is mounted, and functions as a module plate. The LED module 10 is mounted on the first heat transfer plate 41 and fixed to the first heat transfer plate 41.

  Since the first heat transfer plate 41 and the LED module 10 are fixed by screws 80, the first heat transfer plate 41 is provided with a through hole 41 b for inserting the screws 80. The through hole 41 b is provided at a position corresponding to the through hole 11 b of the substrate 11. Further, a through hole 41 c for inserting the lead wires 71 and 72 is provided in the central portion of the first heat transfer plate 41. The through hole 41 c is provided at a position corresponding to the through hole 11 c of the substrate 11.

  The end of the inner shell 51 of the housing 50 on the globe 20 side is in contact with the surface (one surface) of the first heat transfer plate 41 on the base 60 side. Thereby, the heat sink 40 is supported by the inner part 51 of the housing 50. That is, the heat sink 40 is supported by the housing 50 in a state where the LED module 10 is fixed to the heat sink 40.

  The second heat transfer plate 42 is connected to the first heat transfer plate 41 and is configured to surround the drive circuit 30. In the present embodiment, the second heat transfer plate 42 surrounds the drive circuit 30 via the inner portion 51 of the housing 50.

  The second heat transfer plate 42 is located between the inner part 51 and the outer part of the housing 50. The inner surface of the second heat transfer plate 42 faces the outer surface of the inner shell 51, and the outer surface of the second heat transfer plate 42 faces the inner surface of the outer shell 52.

  The second heat transfer plate 42 is a cylindrical metal member having a central axis J as a cylinder axis, and is constituted by a metal plate having a constant thickness as an example. Specifically, the second heat transfer plate 42 includes a first cylindrical portion extending in the direction of the central axis J and having a constant diameter, and a tapered second configuration configured to be inclined with respect to the central axis J. 2 cylindrical parts. In the present embodiment, when the heat sink 40 and the housing 50 are fixed, the axis direction of rotation when the heat sink 40 or the housing 50 is rotated coincides with the central axis J. For this reason, the cylinder axis of the second heat transfer plate 42 is a rotation axis when the heat sink 40 or the housing 50 is rotated.

  The heat sink 40 configured as described above is fixed to the housing 50 by rotating the heat sink 40 or the housing 50 so that the axial movement of the rotation is restricted. Specifically, the heat sink 40 rotates when the hole 41a (first engagement portion) of the first heat transfer plate 41 and the claw portion 51a (second engagement portion) of the housing 50 are engaged. Are fixed to the housing 50 in a state in which the movement in the axial direction is restricted.

[Case]
The housing 50 is disposed between the globe 20 and the base 60 in the direction of the central axis J. The housing 50 has a double wall structure, and an inner portion (first housing portion) 51 that surrounds the drive circuit 30 and an outer portion (second housing) that surrounds the inner portion 51. Body part) 52. The inner shell 51 and the outer shell 52 are connected to each other at the base on the base 60 side.

  The inner portion 51 is a cylinder configured to surround the drive circuit 30 and functions as a circuit case that protects the drive circuit 30. The inner portion 51 is provided with a structure for fixing the circuit board 31 of the drive circuit 30. That is, the inner portion 51 also functions as a holding portion (holder) that holds the drive circuit 30.

  For example, the inner portion 51 is formed in a substantially cylindrical shape with a constant thickness formed so as to extend in the direction of the central axis J. The inner shell 51 is configured to sandwich the second heat transfer plate 42 of the heat sink 40 with the outer shell 52. Therefore, the outer surface of the inner shell 51 and the inner surface of the second heat transfer plate 42 face each other. Note that a gap (space) exists between the inner shell 51 and the second heat transfer plate 42.

  The housing 50 includes a claw portion 51a that engages with the hole 41a of the heat sink 40 as a second engaging portion. The claw part 51 a is provided in the inner part 51. Specifically, the claw portion 51a is provided at the end of the opening on the globe 20 side of the inner shell portion 51 that is a cylindrical body. In the present embodiment, a pair of claw portions 51a is provided. Each of a pair of nail | claw part 51a is provided in the position which opposes. The claw portion 51 a (second engagement portion) engages with the hole 41 a (first engagement portion) of the heat sink 40 by rotating the heat sink 40 or the housing 50. For example, the claw portion 51a engages with the hole portion 41a.

  Each of the pair of claw portions 51a has, for example, an L shape, and includes a through portion 51a1 that penetrates the hole portion 41a of the first heat transfer plate 41, and an extending portion 51a2 that extends from the through portion 51a1. The thickness of each claw portion 51 a is substantially the same as the thickness of the inner shell portion 51.

  The penetrating part 51 a 1 is a base part of the claw part 51 a connected to the end part of the opening part of the inner part 51, and the glove from the face (one face) on the base 60 side of the first heat transfer plate 41 of the heat sink 40 The hole 41a of the 1st heat exchanger plate 41 is penetrated toward the 20 side surface (the other surface). The length of the through-hole 51a in the direction of the central axis J is substantially the same as the thickness of the first heat transfer plate 41.

  The extending portion 51a2 is in contact with the surface on the globe 20 side of the first heat transfer plate 41, and extends along the other surface of the first heat transfer plate 41 from the penetrating portion 51a1. The extending portion 51a2 is configured to be able to pass through the hole 41a of the first heat transfer plate 41, and the length of the extending portion 51a2 is longer than the opening length of the hole 41a of the first heat transfer plate 41. short.

  Moreover, as shown in FIG. 2, the housing | casing 50 has the contact part 51b, the convex part 51c, and the screwing part 51d. The contact part 51b, the convex part 51c, and the screwing part 51d are provided in the inner part 51.

  The abutting portion 51 b abuts on the surface of the first heat transfer plate 41 on the base 60 side. The first heat transfer plate 41 of the globe 40 is sandwiched between the extended portion 51a2 of the claw portion 51a and the contact portion 51b. In the present embodiment, the contact portion 51 b is an end portion on the globe 20 side of the opening portion of the inner shell portion 51.

  The convex portion 51 c is a rotation restricting portion that restricts the movement of the heat sink 40 in the rotation direction. The movement of the heat sink 40 in the rotational direction is restricted when a part of a screw 80 for fixing the LED module 10 and the heat sink 40 contacts the convex portion 51c. The convex portion 51 c is provided on the side surface of the housing 50. Specifically, the convex part 51 c is provided on the outer surface of the inner part 51.

  The screwing portion 51d is screwed with the base 60. That is, the base 60 is screwed into the screwing portion 51d. The threaded portion 51d is formed in a portion extending toward the base 60 side of the inner portion 51.

  Further, the outer portion 52 is an exposed portion exposed to the outside (in the atmosphere), and constitutes an outer member of the LED bulb 1. Therefore, the outer surface of the outer shell 52 is exposed to the outside. Further, the outer shell 52 is configured to surround the second heat transfer plate 42 of the heat sink 40. Therefore, the inner surface of the outer shell 52 and the outer surface of the second heat transfer plate 42 face each other. The inner surface shape of the outer shell 52 is a shape along the surface shape of the second heat transfer plate 42.

  For example, the outer portion 52 has a substantially cylindrical shape with a constant thickness formed so as to extend in the direction of the central axis J. In addition, the inner peripheral surface and outer peripheral surface of the outer shell 52 are tapered surfaces (inclined surfaces) configured to be inclined with respect to the central axis J.

  A clearance is set between the outer shell 52 and the second heat transfer plate 42, and a gap (space) exists. That is, the outer shell 52 and the second heat transfer plate 42 are configured not to come into surface contact with each other. Thus, even if the heat sink 40 (second heat transfer plate 42) and the casing 50 (outer portion 52) are thermally expanded or contracted, a difference in thermal expansion due to a difference in linear expansion coefficient between the heat sink 40 and the casing 50 or The stress accompanying the heat shrinkage difference can be absorbed by the gap between the outer portion 52 and the second heat transfer plate 42. As an example, the gap between the outer shell 52 and the second heat transfer plate 42 is substantially constant. Note that the outer shell 52 and the second heat transfer plate 42 may be in contact with each other.

  The housing 50 configured in this manner is integrally formed of resin. That is, the inner shell 51 and the outer shell 52 are integrally formed. That is, the housing 50 is an integrally molded product made of resin. Thereby, the housing | casing 50 can be produced easily at low cost. The housing 50 can be made of an insulating resin material such as polybutylene terephthalate (PBT).

[Base]
The base 60 is a power receiving unit that receives power for causing the LED module 10 (light emitting element 12) to emit light from the outside of the lamp. The base 60 is attached to a socket of a lighting fixture, for example. Thereby, the base 60 can receive electric power from the socket of the lighting fixture when the LED bulb 1 is turned on.

  AC power is supplied to the base 60 from, for example, a commercial power source. The base 60 in the present embodiment receives AC power through two contact points, and the power received by the base 60 is input to the drive circuit 30 via a pair of lead wires 73 and 74.

  The base 60 has a bottomed cylindrical shape made of metal and includes a shell portion 61 whose outer peripheral surface is a male screw, and an eyelet portion 63 attached to the shell portion 61 via an insulating portion 62. The insulating part 62 is made of glass cullet, for example.

  On the outer peripheral surface of the base 60, a screwing portion for screwing into the socket of the lighting fixture is formed. Further, on the inner peripheral surface of the base 60, a screwing portion for screwing with the screwing portion 51 d of the inner shell portion 51 of the housing 50 is formed. The base 60 is externally fitted to the housing 50 (inner part 51) by being screwed into the screwed part 51 d of the inner part 51.

  The type of the base 60 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used. For example, E26 type, E17 type, E16 type, etc. are mentioned as the nozzle | cap | die 60. Further, as the base 60, a plug-in base may be used.

[Assembly method of LED bulb]
Next, an example of a method for assembling the LED bulb 1 will be described with reference to FIGS. 3 and 4 with reference to FIGS. 1 and 2. 3 and 4 are views for explaining a state when the heat sink 40 is assembled into the housing 50. FIG. Although the LED module 10 is not shown in FIG. 3, the LED module 10 is actually fixed to the heat sink 40.

  First, as shown in FIG. 1, the LED module 10 is fixed to the heat sink 40. Specifically, the substrate 11 of the LED module 10 and the first heat transfer plate 41 of the heat sink 40 are fixed with three screws 80 as shown in FIG. In this case, the screw 80 is inserted through the through hole 11 b of the substrate 11 and the through hole 41 b of the first heat transfer plate 41.

  Next, as shown in FIG. 3A, the heat sink 40 is placed on the inner portion 51 of the housing 50.

  Next, as shown in FIG. 3 (b), the claw 51 a of the inner shell 51 is inserted into the hole 41 a of the first heat transfer plate 41 of the heat sink 40, and the base 60 side of the first heat transfer plate 41. This is brought into contact with the end of the opening of the inner shell 51. The state at this time is shown in FIG.

  Next, as shown in FIG. 3C, the claw portion 51 a (second engaging portion) of the inner portion 51 of the housing 50 is rotated by the heat sink 40 about the central axis J as the rotation axis. The first heat transfer plate 41 is engaged with the hole 41a (first engagement portion). For example, the claw portion 51a is engaged with the first heat transfer plate 41 around the hole portion 41a. Specifically, as shown in FIG. 4B, the first heat transfer plate 41 is sandwiched between the extending portion 51 a 2 of the claw portion 51 a and the abutting portion 51 b of the inner shell portion 51, so that the claw portion 51 a is It is engaged with the hole 41a. In this way, by engaging the claw portion 51a with the hole portion 41a, the heat sink 40 is fixed to the housing 50 in a state where the axial movement of the rotation is restricted.

  At this time, as shown in FIG. 5, by rotating the heat sink 40, one of the screws 80 comes into contact with the convex portion 51 c of the housing 50. Specifically, the portion of the screw 80 protruding from the substrate 11 contacts the wall surface of the convex portion 51c. Thereby, the movement of the heat sink 40 in the rotational direction is restricted. In FIG. 5, the LED module 10 is not shown, but the LED module 10 is actually fixed to the heat sink 40.

  Thereafter, as shown in FIG. 1, the lead wires 71 and 72 led out from the drive circuit 30 are connected to the LED module 10 to fix the globe 20 to the housing 50. Further, the lead wires 73 and 74 led out from the drive circuit 30 are connected to the base 60, and the base 60 is screwed into the threaded portion 51 d of the inner portion 51 of the housing 50. Thereby, the LED bulb 1 is completed.

  In this embodiment, the claw portion 51a and the hole portion 41a are engaged by rotating the heat sink 40. However, the present invention is not limited to this, and the claw portion 51a and the hole are rotated by rotating the housing 50. The part 41a may be engaged.

(Summary)
As described above, according to the LED bulb 1 according to the present embodiment, the heat sink 40 is fixed to the housing 50 in a state where the axial movement of the rotation is restricted by rotating the heat sink 40 or the housing 50. ing.

  Thereby, the heat sink 40 can be easily and reliably fixed without dropping the heat sink 40 after the LED bulb 1 is installed in the lighting fixture.

  In the present embodiment, the heat sink 40 is in a state in which the axial movement of rotation is restricted by the engagement of the hole 41a (first engagement portion) and the claw portion 51a (second engagement portion). It is fixed to the housing 50.

  Thereby, the heat sink 40 can be engaged and fixed to the housing 50 with a simple configuration.

  Further, in the present embodiment, the hole 41a is provided in the first heat transfer plate 41 that is substantially orthogonal to the axial direction of rotation.

  Thereby, the axial movement of the heat sink 40 can be regulated with a simple configuration.

  Moreover, in this Embodiment, the nail | claw part 51a is comprised by the penetration part 51a1 and the extension part 51a2.

  Thus, the claw portion 51a can be engaged with the first heat transfer plate 41 using the hole portion 41a. Therefore, the heat sink 40 can be fixed to the housing 50 in a state where the axial movement of the rotation is restricted with a simple configuration.

  Further, in the present embodiment, the first heat transfer plate 41 is sandwiched between the extending portion 51a2 of the claw portion 51a and the contact portion 51b of the inner shell portion 51.

  Thereby, the heat sink 40 can be firmly fixed to the housing 50.

  In the present embodiment, the casing 50 is provided with a convex portion 51 c (rotation restricting portion) that restricts the movement of the heat sink 40 in the rotational direction.

  Thereby, the heat sink 40 is fixed to the housing 50 in a state where the movement in the axial direction of rotation is restricted and the movement in the rotational direction is also restricted.

  In this case, the movement of the heat sink 40 in the rotational direction is restricted by using a screw 80 for fixing the LED module 10 and the heat sink 40. Specifically, the movement of the heat sink 40 in the rotational direction is restricted when a part of the screw 80 contacts the convex portion 51c.

  Thereby, the movement of the rotation direction of the heat sink 40 can be regulated with a simple configuration without increasing the number of parts.

[Lighting device]
FIG. 6 is a schematic cross-sectional view of the illumination device 2 according to the embodiment.

  As shown in FIG. 6, the illumination device 2 according to the present embodiment is used by being attached to, for example, an indoor ceiling. The lighting device 2 includes the LED bulb 1 according to the above embodiment and a lighting fixture 3.

  The lighting fixture 3 turns off and turns on the LED bulb 1 and includes a fixture body 4 attached to the ceiling and a lamp cover 5 that covers the LED bulb 1.

  The appliance main body 4 has a socket 4 a for attaching the base 60 of the LED bulb 1 and supplying power to the LED bulb 1. A base 60 of the LED bulb 1 is screwed into the socket 4a, and electric power is supplied to the LED bulb 1 through the socket 4a. A translucent plate may be provided in the opening of the lamp cover 5.

(Other variations)
As described above, the illumination light source and the illumination device according to the present invention have been described based on the embodiment and the modification. However, the present invention is not limited to the above-described embodiment and each modification.

  For example, in the above-described embodiment, the heat sink 40 is configured such that the first engagement portion (hole portion 41a) and the second engagement portion (claw portion 51a) are engaged, thereby restricting the axial movement of the rotation. However, it is not limited to this. Specifically, as shown in FIG. 7, a plate-like lid 53 is provided in a part of the opening of the housing 50 </ b> A, and a part of the heat sink 40 </ b> A is attached to the lid 53 by rotating the heat sink 40 </ b> A. The movement of the heat sink 40A in the axial direction of the heat sink 40A may be restricted.

  Moreover, in said embodiment, although the hole part 41a was provided in the 1st heat exchanger plate 41, and the nail | claw part 51a was provided in the inner part 51, these were engaged, However, it is not restricted to this. For example, the heat sink 40 may be fixed to the housing 50 by providing a hole on the side surface of the second heat transfer plate 42 and providing a claw on the inner surface of the outer shell 52 and engaging them.

  In the above embodiment, the casing 50 has a double wall structure, but the present invention is not limited to this. For example, the housing 50 may not have the outer portion 52 surrounding the second heat transfer plate 42 of the heat sink 40, so that the second heat transfer plate 42 of the heat sink 40 becomes an outer portion and is exposed to the outside. It may be configured.

  In the above embodiment, the light emitting element 12 is an SMD type LED element, but is not limited thereto. For example, a COB (Chip On Board) type LED module in which a bare chip is directly mounted (primary mounting) on a substrate may be used. That is, the LED chip itself may be employed as the light emitting element 12. In this case, the plurality of LED chips may be collectively or individually sealed with a sealing member. The sealing member may contain a wavelength conversion material such as a yellow phosphor as described above.

  In the above embodiment, the light emitting element 12 is a BY type white LED element that emits white light by a blue LED chip and a yellow phosphor, but is not limited thereto. For example, a phosphor-containing resin containing a red phosphor and a green phosphor may be used and combined with this and a blue LED chip to emit white light. In addition to the yellow phosphor, a red phosphor or a green phosphor may be further mixed for the purpose of improving color rendering. Moreover, you may use the LED chip which light-emits colors other than blue, for example, using the ultraviolet LED chip which emits the ultraviolet light which is shorter wavelength than the blue light which a blue LED chip emits, mainly by ultraviolet light You may comprise so that white light may be emitted by the blue fluorescent substance, green fluorescent substance, and red fluorescent substance which are excited and discharge | release blue light, red light, and green light.

  Further, in the above embodiment and each modification, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, a light emitting element such as an organic EL (Electro Luminescence) or inorganic EL, and other solid light emitting elements are used. It may be used.

  In addition, a form obtained by making various modifications conceived by those skilled in the art to the above-described embodiment, or by arbitrarily combining the components and functions in the above-described embodiment without departing from the gist of the present invention. Implemented forms are also included in the present invention.

1 LED bulb (light source for lighting)
2 Lighting device 10 LED module (light emitting module)
30 drive circuit 40 heat sink 41 first heat transfer plate 41a hole (first engaging portion)
42 2nd heat exchanger plate 50 Case 51 Inner part 51a Claw part (2nd engaging part)
51a1 penetrating part 51a2 extending part 51c convex part (rotation restricting part)
52 Outer part 80 Screw

Claims (13)

A light emitting module;
A driving circuit for causing the light emitting module to emit light;
A housing having a substantially cylindrical tube surrounding the drive circuit;
A heat sink that is thermally coupled to the light emitting module and has a bottom and a cylindrical portion, and a bottomed cylindrical heat sink;
The outer surface of the cylindrical body of the housing and the inner surface of the cylindrical portion of the heat sink face each other,
A first engagement portion is formed at the bottom of the heat sink,
A second engagement portion is formed at the opening end of the cylindrical body of the housing,
The heat sink, the casing in a state where the heat sink or the housing the axial movement of the rotation in Rukoto rotated by engaging with said second engaging portion and the first engaging portion is restricted A light source for lighting that is fixed to the body. The illumination light source according to claim 1 , wherein an inner surface of a bottom portion of the heat sink is in contact with an opening end portion of the cylindrical body of the casing . The heat sink has a first heat transfer plate whose main surface is substantially orthogonal to the axial direction of rotation, and a second heat transfer plate connected to the first heat transfer plate and surrounding the drive circuit,
The heat sink has a hole provided in the first heat transfer plate as the first engagement portion,
Wherein the housing, the the second engaging portion, an illumination light source according to claim 1 or 2 having a pawl portion engaged with the hole. The claw portion is in contact with the penetrating portion penetrating the hole portion from one surface of the first heat transfer plate toward the other surface, and the other surface of the first heat transfer plate, and the penetrating portion. The illumination light source according to claim 3, further comprising: an extending portion extending along the other surface from the light source. The housing includes a contact portion that contacts the one surface of the first heat transfer plate,
The illumination light source according to claim 4, wherein the first heat transfer plate is sandwiched between the extending portion and the contact portion. The second heat transfer plate is a cylinder having a cylinder axis as the axis of rotation,
The illumination light source according to any one of claims 3 to 5, wherein the first heat transfer plate is a lid provided so as to cover the opening of the cylindrical body. The housing includes an inner shell portion that is the cylindrical body, and an outer shell portion that surrounds the inner shell portion,
The illumination light source according to claim 3, wherein the second heat transfer plate is located between the inner portion and the outer portion. The opening in the front Symbol inner contour unit, the illumination light source according to claim 7, in contact with one surface of the first heat transfer plate. The light source for illumination according to claim 3, wherein the light emitting module is fixed to the first heat transfer plate. The light source for illumination according to claim 1, wherein the housing includes a rotation restricting portion that restricts the movement of the heat sink in the rotation direction. A light emitting module;
A driving circuit for causing the light emitting module to emit light;
A housing surrounding the drive circuit;
A heat sink thermally coupled to the light emitting module;
And a screw for fixing said heat sink and the light emitting module,
The heat sink is fixed to the casing in a state where the axial movement of the rotation is restricted by rotating the heat sink or the casing.
The housing includes a rotation restricting portion that restricts the movement of the heat sink in the rotation direction,
The rotation restricting portion is a convex portion provided on a side surface of the housing,
The heat sink is restricted from moving in the rotational direction when a part of the screw comes into contact with the convex portion.
Lighting for the light source. The housing is made of resin,
The light source for illumination according to claim 1, wherein the heat sink is made of metal. An illumination device comprising the illumination light source according to any one of claims 1 to 12.

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