JP6112480B2 - Illumination light source and illumination device - Google Patents

Description

  The present invention relates to an illumination light source and an illumination device, and more particularly, to a light bulb shaped lamp including a light emitting module having a light emitting diode (LED) and the like and an illumination device using the same.

  Semiconductor light-emitting elements such as LEDs are expected to serve as light sources for various products because of their small size, high efficiency, and long life. In particular, light bulb-type LED lamps (LED light bulbs) are being developed as illumination light sources that replace conventional light bulb-type fluorescent lamps and incandescent light bulbs (see, for example, Patent Document 1).

  The bulb-type LED lamp is configured to surround, for example, an LED module that serves as a light source, a globe that covers the LED module, a support member that supports the LED module, a drive circuit that supplies power to the LED module, and a drive circuit. An outer casing and a base for receiving power. The LED module includes a substrate and a plurality of LEDs (light emitting elements) mounted on the substrate.

JP 2006-313717 A

  In recent years, a light bulb-type LED lamp having a configuration similar to an incandescent bulb in light distribution characteristics and appearance has been studied. For example, a bulb-type LED lamp having a configuration in which an LED module is held hollow at a central position in the globe using a globe (clear bulb) made of transparent glass as used in an incandescent bulb has been proposed.

  A light bulb shaped lamp including such a light emitting module such as an LED module is attached to a lighting device installed on the ceiling so that the globe faces downward, for example.

  For this reason, it is important to firmly fix the glove to parts other than the glove so that the glove does not come off from the light bulb shaped lamp.

  In addition, when a complicated structure or a complicated member for fixing the globe is employed, for example, the production process of the light bulb shaped lamp is complicated, which is not preferable.

  An object of the present invention is to provide an illumination light source and an illumination device having a simple structure for fixing a globe, which is a illumination light source including a globe that covers a light emitting module in consideration of the above-described conventional problems. To do.

  In order to achieve the above object, an illumination light source according to an aspect of the present invention includes a light emitting module, a globe that covers the light emitting module, a pedestal that supports the light emitting module, and the pedestal on the light emitting module side. A fixing member that fixes the opening of the glove on a peripheral portion of the main surface that is a surface, and the pedestal is an engaging portion into which at least a part of the fixing member is inserted, and from the main surface An illumination light source having a latching portion provided in a concave shape in a direction not parallel to the axial direction of the globe and not orthogonal.

  Moreover, the illumination light source which concerns on 1 aspect of this invention WHEREIN: Even if the said latching | locking part is a through-hole which connects the said main surface of the said base, and the back surface which is a surface on the opposite side to the said main surface. Good.

  Moreover, the illumination light source which concerns on 1 aspect of this invention WHEREIN: The said latching | locking part is good also as a groove | channel or a slit provided in the said base.

  In the illumination light source according to one aspect of the present invention, the pedestal includes a small-diameter portion, a large-diameter portion having a diameter larger than the small-diameter portion, and a step connecting the small-diameter portion and the large-diameter portion. It is a disk-shaped member which has a part, The said latching | locking part is good also as arrange | positioning at the said level | step-difference part.

  Further, in the illumination light source according to one aspect of the present invention, the opening of the globe has the main member of the pedestal in a state where the fixing member containing resin flows into the locking portion and is cured. It is good also as fixing to the said peripheral part of a surface.

  Further, in the illumination light source according to one aspect of the present invention, the fixing member is a protrusion provided at the opening of the globe and locked by the locking portion in a state of being inserted into the locking portion. There may be.

  The illumination light source according to one aspect of the present invention further includes a support column provided so as to extend from the pedestal toward the inner side of the globe, and the light emitting module includes an inner side of the globe of the support column. It may be connected to the side end.

  An illumination device according to an aspect of the present invention includes the illumination light source according to any one of the above aspects.

  According to the present invention, it is possible to provide an illumination light source and an illumination device having a simple structure for fixing a globe.

External perspective view of a light bulb shaped lamp according to an embodiment Exploded perspective view of a light bulb shaped lamp according to an embodiment Sectional drawing of the bulb-type lamp which concerns on embodiment The figure which shows the structure outline | summary of the LED module in the lightbulb-shaped lamp which concerns on embodiment. The perspective view which shows the external appearance of the base in embodiment Plan view of the base in the embodiment Sectional drawing of the base in CC 'line of FIG. 6A The fragmentary sectional view which shows the structure around the latching | locking part in the light bulb shaped lamp which concerns on embodiment Sectional drawing which shows the latching | locking part which concerns on the modification 1 of embodiment Sectional drawing which shows the latching | locking part which concerns on the modification 2 of embodiment Sectional drawing which shows the latching | locking part which concerns on the modification 3 of embodiment Sectional drawing which shows the latching | locking part which concerns on the modification 4 of embodiment The top view which shows the latching | locking part which concerns on the modification 5 of embodiment Sectional drawing which shows the latching | locking part which concerns on the modification 6 of embodiment Sectional drawing which shows the latching | locking part which concerns on the modification 7 of embodiment Sectional drawing which shows the latching | locking part and fixing member which concern on the modification 8 of embodiment Sectional drawing which shows the fixing member which concerns on the modification 9 of embodiment Schematic sectional view of a lighting device according to an embodiment

  DESCRIPTION OF EMBODIMENTS Hereinafter, an illumination light source and an illumination device according to embodiments of the present invention will be described with reference to the drawings. Each figure is a schematic diagram and is not necessarily illustrated exactly.

  Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as arbitrary constituent elements.

  In the following embodiments, a bulb-type LED lamp (LED bulb) will be described as an example of a light source for illumination.

[Overall configuration of bulb-type lamp]
First, the whole structure of the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIGS.

  FIG. 1 is an external perspective view of a light bulb shaped lamp 1 according to an embodiment.

  FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment. In FIG. 2, the lead wires 53a to 53d are omitted.

  FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the embodiment.

  As shown in FIGS. 1 to 3, the light bulb shaped lamp 1 according to the present embodiment is a light bulb shaped lamp that is an alternative to a light bulb shaped fluorescent light or an incandescent light bulb.

  The light bulb shaped lamp 1 includes a globe 10, an LED module 20 that is an example of a light emitting module, a pedestal 40 that supports the LED module 20, and a fixing member 120 for fixing the globe 10.

  The fixing member 120 is a member that fixes the opening 11 of the globe 10 to the peripheral portion of the main surface 40a that is the surface of the base 40 on the LED module 20 side. In the present embodiment, for example, an adhesive mainly composed of a silicone resin is employed as the fixing member 120.

  In the present embodiment, the light bulb shaped lamp 1 further includes a support column 30, a drive circuit 50, a circuit case 60, a heat sink 70, an outer casing 80, and a base 90. Note that the support 45 and the base 40 constitute a base 45.

  The bulb-shaped lamp 1 includes an envelope formed by the globe 10, the outer casing 80, and the base 90.

  Hereinafter, each component of the light bulb shaped lamp 1 according to the present embodiment will be described in detail with reference to FIG.

  In FIG. 3, the alternate long and short dash line drawn along the vertical direction on the paper indicates the lamp axis J (center axis) of the light bulb shaped lamp 1. In this embodiment, the lamp axis J is the axis of the globe 10. (Glove axis G).

  The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base 90. Further, in FIG. 3, the drive circuit 50 is shown in a side view rather than a sectional view.

[Glove]
As shown in FIG. 3, the globe 10 is a translucent cover for taking out the light emitted from the LED module 20 to the outside of the lamp. The globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.

  The LED module 20 is covered with the globe 10. Thereby, the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10. In the present embodiment, the globe 10 is configured to house the LED module 20.

  The shape of the globe 10 is such that one end is closed in a spherical shape and the other end has an opening 11. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.

  As the globe 10 having such a shape, a glass bulb having a shape similar to that of a general bulb-type fluorescent lamp or incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.

  Moreover, the opening part 11 of the globe 10 is connected to the surface of the base 40, for example. The globe 10 is fixed by applying a fixing member 120, which is an adhesive such as silicone resin, between the pedestal 40 and the outer casing 80.

  The globe 10 does not necessarily need to be transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film can be formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate to the entire inner surface or outer surface of the globe 10. As described above, by providing the globe 10 with the light diffusion function, the light incident on the globe 10 from the LED module 20 can be diffused, so that the light distribution angle of the light bulb shaped lamp 1 can be expanded.

  Further, the shape of the globe 10 is not limited to the A shape or the like, and may be a spheroid or an oblate ball. The material of the globe 10 is not limited to a glass material, and a resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

  For example, when the light bulb shaped lamp 1 does not have the support column 30 and the LED module 20 is disposed on the main surface 40 a of the pedestal 40, for example, a hemispherical globe is employed as the globe 10.

  Further, when the outer shape of the globe 10 is a rotating body as in the present embodiment, the globe axis G coincides with the rotating axis of the rotating body.

  It can also be said that the globe axis G is an axis parallel to the normal line of the plane including the ring formed by the opening of the opening 11 of the globe 10.

  In the present embodiment, as described above, the globe axis G coincides with the lamp axis J, but the globe axis G and the lamp axis J do not need to coincide.

[LED module]
The LED module 20 is a light emitting module having a light emitting element, and emits light of a predetermined color (wavelength) such as white.

  As shown in FIG. 3, the LED module 20 is disposed inward of the globe 10, and is formed at a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Preferably they are arranged.

  Thus, by arranging the LED module 20 at the center position of the globe 10, it is possible to realize a light distribution characteristic approximate to that of a conventional incandescent bulb using a filament coil.

  The LED module 20 is held hollow in the globe 10 by the support column 30 and emits light by electric power supplied from the drive circuit 50 via the lead wires 53a and 53b. In the present embodiment, the substrate 21 of the LED module 20 is supported by the support column 30.

  Here, each component of the LED module 20 which concerns on embodiment of this invention is demonstrated using FIG.

  FIG. 4 is a diagram showing a schematic configuration of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment.

  Specifically, FIG. 4A is a plan view of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment. FIG. 4B is a cross-sectional view of the LED module 20 taken along line AA ′ in FIG. FIG. 4C is a cross-sectional view of the LED module 20 taken along the line BB ′ of FIG.

  As shown to (a)-(c) of FIG. 4, the LED module 20 has the board | substrate 21, LED22, the sealing member 23, the metal wiring 24, the wire 25, and the terminals 26a and 26b.

  LED module 20 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on substrate 21. Hereinafter, each component of the LED module 20 will be described in detail.

  First, the substrate 21 will be described. The substrate 21 is a mounting substrate for mounting the LEDs 22, and includes a first main surface (front side surface) on which the LEDs 22 are mounted, and a second main surface (back side surface) facing the first main surface. Have

  As shown to (a) of FIG. 4, the board | substrate 21 is a rectangular-plate-shaped board | substrate with a planar view (when it sees from the top part of the globe 10), for example.

  The substrate 21 is connected to one end of the support column 30. Specifically, the second main surface of the substrate 21 and the end surface of the support column 30 are connected so as to be in surface contact.

  As the substrate 21, a substrate having a low light transmittance with respect to the light emitted from the LED 22, for example, a white substrate such as a white alumina substrate having a total transmittance of 10% or less or a metal substrate (metal base substrate) coated with a resin is used. Can be used.

  Thus, by using a substrate having a low light transmittance, it is possible to suppress light from being transmitted through the substrate 21 and emitted from the second main surface, and color unevenness can be suppressed. Further, since an inexpensive white substrate can be used, cost reduction can be realized.

  On the other hand, a light-transmitting substrate having a high light transmittance can be used as the substrate 21. By using the translucent substrate, the light of the LED 22 is transmitted through the inside of the substrate 21 and is also emitted from the surface (back side surface) on which the LED 22 is not mounted.

  Therefore, even if the LED 22 is mounted only on the first main surface (front side surface) of the substrate 21, light is emitted from the second main surface (back side surface), so that the light distribution approximates that of an incandescent bulb. It becomes possible to obtain characteristics. Moreover, since light can be emitted from the LED module 20 in all directions, it is possible to realize all light distribution characteristics.

  As the light-transmitting substrate, for example, a substrate having a total transmittance of 80% or more for visible light or a transparent substrate that is transparent to visible light (that is, the transmittance is extremely high and the other side can be seen through) is used. Can do. As such a translucent substrate, a translucent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin material made of transparent resin material A resin substrate or the like can be used.

  In the present embodiment, a white polycrystalline ceramic substrate made of sintered alumina is used as the light-transmitting substrate 21. For example, a white alumina substrate having a thickness of 1 mm and a light reflectance of 94%, or a white alumina substrate having a thickness of 0.635 mm and a light reflectance of 88% can be used.

  As the substrate 21, a resin substrate, a flexible substrate, or a metal base substrate can be used. In addition, the shape of the substrate 21 is not limited to a rectangle, and other shapes such as a square or a circle can be used.

  In addition, the substrate 21 is provided with two insertion holes 27a and 27b for electrical connection with the two lead wires 53a and 53b. The lead wire 53a (53b) is solder-connected to a terminal 26a (26b) formed on the substrate 21 with the tip portion inserted through the insertion hole 27a (27b).

  Next, the LED 22 will be described. The LED 22 is an example of a light emitting element, and is a semiconductor light emitting element that emits light with a predetermined power. The plurality of LEDs 22 on the substrate 21 are all the same, and the LEDs 22 are selected so that the Vf characteristics are all the same.

  Each LED 22 is a bare chip that emits monochromatic visible light. In this embodiment, a blue LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

  The LEDs 22 are mounted only on the first main surface (front side surface) of the substrate 21, and a plurality of LEDs 22 are mounted so as to form a plurality of rows along the long side direction of the substrate 21. In the present embodiment, 48 LEDs 22 are arranged on the substrate 21 in order to achieve brightness equivalent to 60 W. Specifically, 48 LEDs 22 are arranged on the first main surface (front side surface) of the substrate 21 so that four rows of element rows each composed of 12 LEDs 22 are arranged in parallel.

  Further, in the present embodiment, in the LEDs 22 adjacent to each other, the cathode electrode of one LED 22 and the anode electrode of the other LED 22 are connected via the metal wiring 24 by wire bonding using the wire 25.

  In addition, you may connect the wire bond part of adjacent LED22 directly with the wire 25, without passing through the metal wiring 24. FIG. That is, the adjacent LEDs 22 may be wire-bonded by chip-to-chip. In this case, the metal wiring 24 arrange | positioned between adjacent LED22 is unnecessary.

  In the present embodiment, the plurality of LEDs 22 are mounted on the substrate 21, but the number of LEDs 22 may be appropriately changed according to the use of the light bulb shaped lamp 1.

  For example, when the light bulb shaped lamp 1 is realized as a low output type LED lamp that replaces a miniature light bulb or the like, the LED module 20 may have one LED 22.

  On the other hand, when the light bulb shaped lamp 1 is realized as a high output type LED lamp, the number of LEDs 22 mounted in one element array may be further increased.

  Moreover, the element row | line | column of LED22 is good not only as 4 rows but 1-3 rows, and good also as 5 rows or more.

  Next, the sealing member 23 will be described. The sealing member 23 is made of, for example, resin and is configured to cover the LED 22.

  Specifically, the sealing member 23 is formed so as to collectively seal one row of the plurality of LEDs 22. In the present embodiment, since four element rows of the LED 22 are provided, four sealing members 23 are formed. Each of the four sealing members 23 is linearly provided on the first main surface of the substrate 21 along the arrangement direction (column direction) of the plurality of LEDs 22.

  The sealing member 23 is mainly made of a translucent material, but when it is necessary to convert the wavelength of the light of the LED 22 to a predetermined wavelength, a wavelength conversion material is mixed into the translucent material.

  The sealing member 23 in the present embodiment includes a phosphor as a wavelength conversion material. That is, the sealing member 23 is a wavelength conversion member that converts the wavelength (color) of light emitted from the LED 22.

  Such a sealing member 23 can be constituted by, for example, an insulating resin material (phosphor-containing resin) containing phosphor particles. The phosphor particles are excited by light emitted from the LED 22 and emit light of a desired color (wavelength).

  For example, a silicone resin can be used as the resin material constituting the sealing member 23. Further, a light diffusing material may be dispersed in the sealing member 23. The sealing member 23 is not necessarily formed of a resin material, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.

  For example, when the LED 22 is a blue LED that emits blue light, the phosphor particles to be contained in the sealing member 23 are, for example, YAG (yttrium, aluminum, garnet) -based yellow phosphor particles in order to obtain white light. Is adopted.

  Thereby, a part of the blue light emitted from the LED 22 is converted into yellow light by the yellow phosphor particles contained in the sealing member 23. Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 23, so that the white light is emitted from the sealing member 23. And emitted. In addition, particles such as silica are used as the light diffusing material.

  The sealing member 23 in the present embodiment is formed of a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin. For example, the sealing member 23 is formed by applying and curing the phosphor-containing resin on the first main surface of the substrate 21 with a dispenser. In this case, the shape of the cross section perpendicular to the longitudinal direction of the sealing member 23 is substantially semicircular.

  In order to convert the wavelength of light (leakage light) toward the back side of the substrate 21, fluorescent light is used as a second wavelength conversion member between the LED 22 and the substrate 21 or on the second main surface (back side surface) of the substrate 21. A phosphor film (phosphor layer) such as a sintered body film composed of body particles and an inorganic binder (binder) such as glass or the same phosphor-containing resin as the surface of the substrate 21 may be further formed.

  In this manner, by forming the second wavelength conversion member on the second main surface of the substrate 21, white light can be emitted from both surfaces of the substrate 21 even when light leaks from the second main surface. it can.

  Next, the metal wiring 24 will be described. The metal wiring 24 is a conductive wiring through which a current for causing the LED 22 to emit light flows, and is patterned in a predetermined shape on the surface of the substrate 21. As shown in FIG. 4A, the metal wiring 24 is formed on the first main surface of the substrate 21. The power supplied to the LED module 20 from the lead wires 53a and 53b is supplied to each LED 22 by the metal wiring 24.

  The metal wiring 24 can be formed by, for example, patterning or printing a metal film made of a metal material. As a material of the metal wiring 24, for example, silver (Ag), tungsten (W), copper (Cu), gold (Au), or the like can be used.

  The metal wiring 24 exposed from the sealing member 23 is preferably covered with a glass film (glass coat film) made of a glass material or a resin film (resin coat film) made of a resin material, except for the terminals 26a and 26b. . Thereby, for example, the insulation in the LED module 20 can be improved, and the reflectance of the surface of the substrate 21 can be improved.

  The wire 25 is an electric wire such as a gold wire. As shown in FIG. 4B, the wire 25 connects the LED 22 and the metal wiring 24.

  Specifically, the wire 25 is wire-bonded to the wire bonding portion provided on the upper surface of the LED 22 and the metal wiring 24 formed adjacent to both sides of the LED 22.

  In the present embodiment, the entire wire 25 is embedded in the sealing member 23 so as not to be exposed from the sealing member 23. This prevents light from being absorbed by the exposed wire 25, reflection of light, and the like.

  Next, the terminals 26a and 26b will be described. The terminals 26 a and 26 b are external connection terminals that receive DC power for causing the LEDs 22 to emit light from the outside of the LED module 20. In the present embodiment, terminals 26a and 26b are solder-connected to lead wires 53a and 53b.

  Terminals 26a and 26b are formed in a predetermined shape on the first main surface of substrate 21 so as to surround insertion holes 27a and 27b. The terminals 26 a and 26 b are formed continuously with the metal wiring 24 and are electrically connected to the metal wiring 24. The terminals 26 a and 26 b are patterned simultaneously with the metal wiring 24 using the same metal material as the metal wiring 24.

  The terminals 26 a and 26 b are power supply units of the LED module 20, and supply DC power received from the lead wires 53 a and 53 b to the respective LEDs 22 through the metal wiring 24 and the wires 25.

[Support]
As shown in FIG. 3, the support column 30 is a long member that extends from the base 40 toward the inside of the globe 10. In the present embodiment, the support column 30 has the axis of the support column 30 extended along the lamp axis J. That is, the axis of the support column 30 and the lamp axis J are parallel.

  The support column 30 functions as a support member that supports the LED module 20, and the LED module 20 is connected to the end of the support column 30 on the inner side of the globe 10. That is, the LED module 20 is supported on the pedestal 40 via the support column 30.

  Thus, by attaching the LED module 20 to the support column 30 extending inward of the globe 10, it is possible to realize a light distribution characteristic with a wide light distribution angle similar to that of an incandescent bulb.

  Moreover, the support | pillar 30 functions also as a heat radiating member (heat sink) for radiating the heat which generate | occur | produces in the LED module 20 (LED22). Therefore, it is preferable that the support column 30 is made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity.

  Thereby, the heat generated in the LED module 20 via the support column 30 can be efficiently conducted to the base 40. The thermal conductivity of the support column 30 is preferably larger than the thermal conductivity of the substrate 21. In the present embodiment, the material of the support column 30 is aluminum.

  One end of the support column 30 on the top side of the globe 10 is connected to the center of the substrate 21 of the LED module 20, and the other end of the support 30 on the base 90 side is connected to the center of the base 40.

  The board | substrate 21 of the LED module 20 and the end surface of the support | pillar 30 are fixed by adhesives, such as a silicone resin, for example. Therefore, an adhesive may exist between the substrate 21 and the end face of the support column 30. In this case, considering the thermal conductivity between the substrate 21 and the support column 30, the thickness of the silicone resin is preferably 20 μm or less.

  Moreover, the board | substrate 21 and the support | pillar 30 may be fixed with the screw instead of an adhesive agent, for example. In this case, depending on the material or processing technique, there may be minute irregularities on the surface of the substrate 21 and the support column 30, and therefore there is a minute gap between the second main surface of the substrate 21 and the end surface of the support column 30. Sometimes. Even if there is such a small gap, if the gap is about 20 μm or less, it can be considered that the substrate 21 and the support column 30 are substantially in contact with each other.

  As the shape of the support column 30, for example, a solid cylindrical shape having a constant cross-sectional area (area in a cross section when cut along a plane having the axis of the support column 30 as a normal line) is employed.

  In addition, about the shape of the support | pillar 30, a cross-sectional area does not need to be constant, and the shape where a cross-sectional area changes in the middle, such as the shape which combined the cylinder and the prism, may be sufficient.

[pedestal]
The pedestal 40 is a member that supports the LED module 20. In the present embodiment, the pedestal 40 supports the LED module 20 via the support column 30 as described above.

  As shown in FIG. 3, the pedestal 40 is configured to close the opening 11 of the globe 10. The pedestal 40 is connected to the heat sink 70. In the present embodiment, the pedestal 40 is fitted into the opening 70 a of the heat sink 70 so that the outer periphery of the pedestal 40 contacts the inner surface of the heat sink 70.

  The pedestal 40 also functions as a heat radiating member (heat sink) for radiating heat generated by the LED module 20 (LED 22). Therefore, the pedestal 40 is preferably made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity. Thereby, the heat from the column 30 can be efficiently conducted to the heat sink 70. In the present embodiment, the material of the pedestal 40 is aluminum.

  As shown in FIG. 3, the pedestal 40 includes a small-diameter portion 41, a large-diameter portion 42 having a larger diameter than the small-diameter portion 41, and a step portion connecting the small-diameter portion 41 and the large-diameter portion 42. Have.

  For example, the small-diameter portion 41 has a thickness of 3 mm and a diameter of about 30 mm, and the large-diameter portion 42 has a thickness of 3 mm and a diameter of about 40 mm. Note that the height of the stepped portion is, for example, about 4 mm.

  The small diameter portion 41 is further provided with two insertion holes for inserting the lead wires 53a and 53b.

  The large diameter portion 42 constitutes a connection portion with the heat sink 70 and is fitted with the heat sink 70. As shown in FIG. 3, the pedestal 40 is fitted into the opening 70 a of the heat sink 70 so that the outer peripheral surface of the large diameter portion 42 is in contact with the inner peripheral surface of the heat sink 70. Thereby, the heat of the base 40 can be efficiently conducted to the heat sink 70.

  Further, the opening 11 of the globe 10 abuts on the upper surface of the large-diameter portion 42 and the opening 11 of the globe 10 is closed. Note that the pedestal 40 and the heat sink 70 can be fixed using an adhesive such as a silicone resin, instead of being fixed by caulking.

  Here, the pedestal 40 in the present embodiment has a concave locking portion 44 as a characteristic configuration. The opening 11 of the globe 10 is fixed to the pedestal 40 with at least a part of the fixing member 120 inserted into the locking portion 44. The locking portion 44 in the present embodiment will be described later with reference to FIGS.

[Drive circuit]
As shown in FIG. 3, the drive circuit (circuit unit) 50 is a lighting circuit (power circuit) for causing the LED module 20 (LED 22) to emit light (lights), and supplies predetermined power to the LED module 20. . For example, the drive circuit 50 converts AC power supplied from the base 90 via the pair of lead wires 53c and 53d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 53a and 53b. Supply.

  The drive circuit 50 includes a circuit board 51 and a plurality of circuit elements (electronic components) 52 mounted on the circuit board 51.

  The circuit board 51 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 52 mounted on the circuit board 51. In the present embodiment, the circuit board 51 is arranged in a posture in which the main surface is orthogonal to the lamp axis J.

  The circuit element 52 is, for example, a capacitor element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a semiconductor element such as a diode or an integrated circuit element. Most of the circuit elements 52 are mounted on the main surface of the circuit board 51 on the base 90 side.

  The drive circuit 50 configured as described above is housed in the circuit case 60. In the present embodiment, the circuit board 51 is placed on a protruding part (board holding part) provided on the inner surface of the case body 61, and the main surface of the circuit board 51 is provided on the cap part 62. The protrusion is in contact. Thereby, the circuit board 51 is held by the circuit case 60. The drive circuit 50 may be appropriately selected and combined with a dimmer circuit, a booster circuit, or the like.

  The drive circuit 50 and the LED module 20 are electrically connected by a pair of lead wires 53a and 53b. The drive circuit 50 and the base 90 are electrically connected by a pair of lead wires 53c and 53d. These four lead wires 53a to 53d are, for example, alloy copper lead wires, and are composed of a core wire made of alloy copper and an insulating resin film covering the core wire.

  In the present embodiment, the lead wire 53a is a lead (plus-side output terminal wire) for supplying a positive voltage from the drive circuit 50 to the LED module 20, and the lead wire 53b is from the drive circuit 50 to the LED module 20. It is a conducting wire (minus output terminal wire) for supplying a negative voltage. The lead wires 53a and 53b are inserted through insertion holes provided in the pedestal 40 and led out to the LED module 20 side (inside the globe 10).

  One end (core wire) of each of the lead wires 53a (53b) is inserted through the insertion hole 27a (27b) of the substrate 21 of the LED module 20 and soldered to the terminals 26a and 26b. On the other hand, the other end (core wire) of each of the lead wires 53a and 53b is solder-connected to the metal wiring of the circuit board 51.

  The lead wires 53c and 53d are electric wires for supplying power for lighting the LED module 20 from the base 90 to the drive circuit 50. One end (core wire) of each of the lead wires 53c and 53d is electrically connected to the base 90 (shell portion 91 or eyelet portion 93), and each other end (core wire) is a power input portion of the circuit board 51. It is electrically connected to (metal wiring) by solder or the like.

  Note that the light bulb shaped lamp 1 is not necessarily provided with the drive circuit 50. For example, when direct-current power is directly supplied to the light bulb shaped lamp 1 from a lighting fixture or a battery, the light bulb shaped lamp 1 may not include the drive circuit 50.

[Circuit case]
As shown in FIG. 3, the circuit case 60 is an insulating case for housing the drive circuit 50 and is configured to surround the drive circuit 50. The circuit case 60 is housed in the heat sink 70 and the base 90. In the present embodiment, the circuit case 60 is composed of a case body 61 and a cap 62.

  The case main body 61 is an insulating case (housing) having openings on both sides. Protruding portions (substrate holding portions) are provided at a plurality of locations (for example, 3 locations) on the inner surface of the case body 61 in order to place the circuit board 51. The material of the case body 61 is, for example, an insulating resin material such as polybutylene terephthalate (PBT).

  In the present embodiment, the case main body 61 has a large-diameter cylindrical first case 61 a that is substantially the same shape as the heat sink 70, and a small-diameter cylindrical shape that is connected to the first case 61 a and substantially the same shape as the base 90. It is comprised with the 2nd case part 61b.

  The first case portion 61 a located on the globe 10 side is housed in the heat sink 70. Most of the drive circuit 50 is covered by the first case portion 61a.

  On the other hand, the second case portion 61b located on the base 90 side is housed in the base 90, and the base 90 is fitted on the second case portion 61b. As a result, the opening on the base 90 side of the circuit case 60 (case body 61) is closed.

  In the present embodiment, a screwing portion for screwing with the base 90 is formed on the outer peripheral surface of the second case portion 61b, and the base case 90 is screwed into the second case portion 61b, whereby the circuit case 60 ( It is fixed to the case body 61).

  In the present embodiment, the cap portion 62 is an insulating substantially bottomed cylindrical member formed in a cap shape.

  The material of the cap part 62 is also an insulating resin material such as PBT, for example, similarly to the case main body part 61.

  In the present embodiment, the cap case 62 is provided in the circuit case 60, but the circuit case 60 may be configured by only the case main body portion 61 without providing the cap portion 62.

[heatsink]
The heat sink 70 is a heat radiating member and is connected to the pedestal 40. Thereby, the heat generated in the LED module 20 is conducted to the heat sink 70 via the support column 30 and the base 40. Thereby, the heat of the LED module 20 can be radiated.

  In the present embodiment, the heat sink 70 is configured to surround the drive circuit 50. That is, the drive circuit 50 is disposed inside the heat sink 70. Since the drive circuit 50 is surrounded by the circuit case 60, the heat sink 70 is configured to surround the circuit case 60. Thereby, the heat sink 70 can also dissipate heat generated in the drive circuit 50.

  In the present embodiment, the heat sink 70 extends to the boundary portion between the first case portion 61 a and the second case portion 61 b of the circuit case 60.

  The heat sink 70 is preferably made of a material having high thermal conductivity, and can be a metal member made of metal, for example. The heat sink 70 in the present embodiment is formed using aluminum. The heat sink 70 may be formed using a non-metallic material such as a resin instead of a metal. In this case, the heat sink 70 is preferably made of a nonmetallic material having high thermal conductivity.

  In the present embodiment, the heat sink 70 is configured to be fitted to the pedestal 40. In this embodiment, the inner peripheral surface of the heat sink 70 and the outer peripheral surface of the pedestal 40 are in surface contact with each other in the entire circumferential direction. ing.

[Outer casing]
As shown in FIG. 3, the outer casing 80 is an outer member configured to surround the periphery of the heat sink 70. The outer surface of the outer casing 80 is exposed outside the lamp (in the atmosphere). The outer casing 80 is an insulating cover having an insulating property made of an insulating material. By covering the metal heat sink 70 with the insulating outer casing 80, the insulating property of the light bulb shaped lamp 1 can be improved. The material of the outer casing 80 is, for example, an insulating resin material such as PBT.

  The outer casing 80 is a substantially cylindrical member having a constant thickness and an inner diameter and an outer diameter that gradually change. For example, the outer casing 80 can be configured in a skirt shape so that the inner surface and the outer surface are surfaces of a truncated cone. In the present embodiment, the outer casing 80 is configured such that the inner diameter and the outer diameter gradually decrease toward the base 90 side.

[Base]
The base 90 is a power receiving unit that receives power for causing the LED module 20 (LED 22) to emit light from the outside of the lamp. The base 90 is attached to a socket of a lighting fixture, for example. Thereby, the base 90 can receive electric power from the socket of the lighting fixture when lighting the light bulb shaped lamp 1.

  The base 90 is supplied with AC power from, for example, a commercial power supply of AC 100V. The base 90 in the present embodiment receives AC power through two contact points, and the power received by the base 90 is input to the power input unit of the drive circuit 50 via a pair of lead wires 53c and 53b.

  The base 90 has a metal bottomed cylindrical shape, and includes a shell portion 91 whose outer peripheral surface forms a male screw, and an eyelet portion 93 attached to the shell portion 91 via an insulating portion 92. . On the outer peripheral surface of the base 90, a screwing portion for screwing into the socket of the lighting fixture is formed. Further, on the inner peripheral surface of the base 90, a screwing portion for screwing with the screwing portion of the case main body portion 61 (second case portion 61b) of the circuit case 60 is formed.

  The type of the base 90 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used. For example, as the base 90, E26 type, E17 type, E16 type or the like can be mentioned.

[Characteristic configuration of light bulb shaped lamp]
Hereinafter, a characteristic configuration of the light bulb shaped lamp 1 according to the present embodiment and various modifications will be described with reference to FIGS.

  FIG. 5 is a perspective view showing an appearance of the base 45 in the embodiment.

  FIG. 6A is a plan view of the base 45 in the embodiment.

  6B is a cross-sectional view of the base 45 taken along the line CC ′ of FIG. 6A.

  As shown in these drawings, the pedestal 40 has a locking portion 44 provided in a concave shape from the main surface 40a. Specifically, the locking portion 44 is provided in a concave shape from the main surface 40 a in a direction that is not parallel to the globe axis G and is not orthogonal to the globe axis G.

  In the present embodiment, a through hole that connects the main surface 40 a and the back surface 40 b is provided in the base 40 as the locking portion 44. Further, as shown in FIG. 6B, the angle formed by the axis K of the through hole and the globe axis G is other than 0 degrees and 90 degrees.

  As shown in FIG. 6A, in the present embodiment, two locking portions 44 are provided on the step portion 43 that connects the small diameter portion 41 and the large diameter portion 42 having a diameter larger than that of the small diameter portion 41. Is provided.

  In addition, the number of the latching | locking parts 44 which the base 40 has is not limited to 2, One may be sufficient and three or more may be sufficient.

  For example, the locking portion 44 of this aspect is provided with a through hole at a position corresponding to the stepped portion 43 of the flat base 40 where the small diameter portion 41 and the large diameter portion 42 are not formed. The base 40 is provided by pressing so that the small-diameter portion 41 and the large-diameter portion 42 are formed.

  That is, simply speaking, by providing a through hole in the thickness direction of the disk-shaped metal material and pressing it, the base 40 having the locking portion 44 shown in FIGS. 5 to 6A can be manufactured. That is, the base 40 having the locking portion 44 can be manufactured by a relatively simple process.

  As described above, the locking portion 44 has a main surface 40a in the pedestal 40 in a direction oblique to the globe axis G (lamp axis J) (a direction parallel to and not perpendicular to the globe axis G (lamp axis J), hereinafter the same). Are provided in a concave shape. Thereby, the fixed state of the globe 10 by the fixing member 120 can be more reliably maintained.

  FIG. 7 is a partial cross-sectional view showing a structure around the locking portion 44 in the light bulb shaped lamp 1 according to the embodiment.

  As shown in FIG. 7, the opening 11 of the globe 10 is fixed to the peripheral edge of the main surface 40 a of the pedestal 40 by a fixing member 120 that is an adhesive.

  More specifically, since the fixing member 120 is also in contact with the inner surface of the outer casing 80, the opening 11 of the globe 10 is bonded to the base 40 and the outer casing 80 by the fixing member 120.

  Further, the fixing member 120 is inserted into a locking portion 44 provided in the base 40 in an oblique direction with respect to the globe axis G (lamp axis J). In FIG. 7, the globe axis G and the lamp axis J are parallel to the Z axis.

  Therefore, for example, it is possible to obtain an effect of preventing the globe 10 from falling when the light bulb shaped lamp 1 is attached to the lighting fixture so that the globe 10 faces downward.

  Specifically, the fixing member 120 is locked by the locking portion 44 while being connected to the opening 11 of the globe 10. That is, even if the fixing member 120 peels from the main surface 40 a of the pedestal 40, the globe 10 can maintain the connection state with the pedestal 40 via the fixing member 120.

  Here, it is also conceivable to provide a through hole such as the locking portion 44 in parallel to the globe axis G (lamp axis J) in the base 40.

  However, in this case, if the adhesive employed as the fixing member 120 does not spread and cure to the periphery of the opening on the back surface 40b side of the through hole, a sufficient fixing force for preventing the globe 10 from falling can be obtained. The problem that it cannot be obtained arises. Furthermore, it is also necessary to prevent the adhesive from dripping from the through-hole when applying the adhesive. For this reason, problems such as difficulty in setting an appropriate viscosity of the adhesive occur.

  It is also conceivable to provide a through hole such as the locking portion 44 perpendicular to the globe axis G (lamp axis J) in the base 40. However, in this case, since the adhesive employed as the fixing member 120 is difficult to flow into the through hole, for example, there may be a problem that a sufficient coupling force between the globe 10 and the base 40 cannot be obtained. .

  Further, in order to obtain a sufficient coupling force between the globe 10 and the pedestal 40, for example, an annular groove (step is formed in the stepped portion 43 of the pedestal 40 in a direction perpendicular to the globe axis G (lamp axis J). It is also conceivable to form a groove that goes around the portion 43.

  However, in this case, since a complicated process such as cutting for forming a groove for one round is required in the pedestal 40, it is not preferable from the viewpoint of, for example, efficient production of the light bulb shaped lamp 1.

  On the other hand, in the light bulb shaped lamp 1 of the present embodiment, the locking portion 44 is provided in an oblique direction with respect to the globe axis G (lamp axis J).

  Therefore, for example, in a state where the globe 10 is directed vertically upward and the globe axis G (lamp axis J) is parallel to the vertical line, the fixing member 120 that is an adhesive easily flows into the locking portion 44, and Even if the locking portion 44 is a through-hole, dripping of the adhesive hardly occurs. Moreover, in the state which the said adhesive agent hardened | cured, sufficient coupling | bonding force between the globe 10 and the base 40 can also be obtained.

  Thus, the light bulb shaped lamp 1 of the present embodiment includes the LED module 20 as a light source, and the pedestal 40 that supports the LED module 20 is a locking portion 44 into which at least a part of the fixing member 120 is inserted. In addition, the main surface 40a of the base 40 has a locking portion 44 that is provided in a concave shape in a direction that is not parallel to the axial direction of the globe 10 and that is not orthogonal.

  The pedestal 40 having such a locking portion 44 can be manufactured by a relatively simple process of, for example, providing a through hole in the thickness direction of a disk-shaped metal material and pressing it as described above.

  That is, the light bulb shaped lamp 1 in the embodiment can obtain a sufficient coupling force between the globe 10 and the base 40 with a simple structure. For example, it is possible to prevent the globe 10 from falling from the pedestal 40 when peeling occurs between the fixing member 120 that is an adhesive and the pedestal 40.

  In addition, the structure of the light bulb shaped lamp 1 according to the embodiment may be other than the structure shown in FIGS. Various modifications of the configuration of the light bulb shaped lamp 1 will be described with reference to FIGS.

(Modification 1)
FIG. 8 is a cross-sectional view showing a locking portion 44 according to Modification 1 of the embodiment.

  As shown in FIG. 8, the locking portion 44 may be located, for example, at the peripheral edge of the main surface 40 a of the pedestal 40 and immediately below the opening 11 of the globe 10.

  In other words, the locking portion 44 does not have to be disposed at the stepped portion 43 of the pedestal 40. If the locking portion 44 is provided in a concave shape obliquely with respect to the globe axis G (lamp axis J), at least the fixing member 120 is provided. In a state where a part is inserted, a sufficient coupling force between the globe 10 and the pedestal 40 can be generated.

(Modification 2)
FIG. 9 is a cross-sectional view showing a locking portion 44 according to Modification 2 of the embodiment.

  The locking portion 44 shown in FIG. 9 differs from the locking portion 44 shown in FIG. 7 and the locking portion 44 shown in FIG. 8 from the main surface 40a of the pedestal 40 to the outside of the pedestal 40, that is, the globe. It is formed in a concave shape toward the direction away from the axis G (lamp axis J).

  However, the locking portion 44 shown in FIG. 9 satisfies the condition that it is provided in a concave shape in an oblique direction with respect to the globe axis G (lamp axis J), and at least a part of the fixing member 120 is inserted. In this state, a sufficient coupling force between the globe 10 and the pedestal 40 can be generated.

(Modification 3)
FIG. 10 is a cross-sectional view showing a locking portion 44a according to Modification 3 of the embodiment.

  The locking portion 44a shown in FIG. 10 is provided in the pedestal 40 as a bottomed hole provided in the main surface 40a of the pedestal 40, instead of a through hole such as the locking portion 44 shown in FIG. That is, the locking portion 44a is a hole that forms a bottomed cylindrical space, and the axis of the hole is oblique to the globe axis G (lamp axis J).

  Accordingly, the locking portion 44a shown in FIG. 10 can generate a sufficient coupling force between the globe 10 and the base 40 in a state where at least a part of the fixing member 120 is inserted.

  In addition, what is necessary is just to determine the depth of the hole which is the latching | locking part 44a suitably according to the hardness etc. after hardening of the adhesive agent employ | adopted as the fixing member 120, for example.

(Modification 4)
FIG. 11 is a cross-sectional view showing a locking portion 44b according to Modification 4 of the embodiment.

  Unlike the locking portion 44a shown in FIG. 10, the locking portion 44b shown in FIG. 11 is formed in a concave shape from the main surface 40a of the pedestal 40 toward the upper side of the pedestal 40, that is, toward the LED module 20. ing.

  However, the locking portion 44b shown in FIG. 11 satisfies the condition that it is provided in a concave shape in an oblique direction with respect to the globe axis G (lamp axis J). Further, when the fixing member 120 that is an adhesive flows into the locking portion 44 b, the fixing member 120 is cured in a state of being folded back in the direction of the apex of the globe 10.

  That is, the locking portion 44b shown in FIG. 11 has an effect that the coupling force between the globe 10 and the base 40 can be further increased in a state where at least a part of the fixing member 120 is inserted.

  In addition, the latching | locking part 44b shown in FIG. 11 may be provided in the base 40 as a through-hole similarly to the latching | locking part 44 shown, for example in FIG.

(Modification 5)
The locking portions 44, 44a, 44b shown in the above embodiment and the first to fourth modifications are all through holes or bottomed holes, but the axial direction of these through holes or bottomed holes The cross-sectional shape perpendicular to the need not be an ellipse or a circle. That is, the shape of the cross section may be, for example, a polygon, or may be a ring shape composed of straight lines and curves.

  As the locking portion of the pedestal 40, for example, a long groove or slit may be provided in a top view (when the pedestal 40 is viewed from the main surface 40a side).

  FIG. 12 is a top view showing a locking portion 44c according to Modification 5 of the embodiment.

  Note that the cross section of the locking portion 44c parallel to the globe axis G (lamp axis J) has a shape penetrating the pedestal 40, for example, as shown in FIG. 6B, or a pedestal, for example, as shown in FIG. The shape does not penetrate 40.

  In any case, the locking portion 44c is provided in a concave shape in an oblique direction with respect to the globe axis G (lamp axis J), whereby at least a part of the fixing member 120 is inserted. In this case, a sufficient coupling force between the globe 10 and the base 40 can be generated.

(Modification 6)
The size or shape of the cross section perpendicular to the axial direction of the through hole or the bottomed hole provided as the locking portion in the base 40 may not be constant along the axial direction.

  For example, a through hole provided as a locking portion in the pedestal 40 may have a portion whose inner diameter increases as the back surface 40b is closer.

  FIG. 13: is sectional drawing which shows the latching | locking part 44d which concerns on the modification 6 of embodiment.

  The locking portion 44d shown in FIG. 13 is a through-hole whose inner diameter increases as it is closer to the back surface 40b. Further, the outer diameter of the portion of the fixing member 120 inserted into the locking portion 44d becomes larger as it is closer to the back surface 40b along the shape of the through hole.

  That is, the fixing member 120 is locked by the locking portion 44d in a state where it is very difficult to remove from the locking portion 44d due to the structure.

  That is, the locking portion 44d shown in FIG. 13 has an effect that the coupling force between the globe 10 and the base 40 can be further increased in a state where at least a part of the fixing member 120 is inserted.

  13 may be provided on the base 40 as a bottomed hole, for example, like the locking portion 44a shown in FIG.

(Modification 7)
A through hole or a bottomed hole provided as a locking portion in the pedestal 40 may have a portion with a smaller inner diameter as it is closer to the back surface 40b.

  FIG. 14 is a cross-sectional view showing a locking portion 44e according to Modification 7 of the embodiment.

  The locking portion 44e shown in FIG. 14 is a through hole whose inner diameter is smaller as it is closer to the back surface 40b. Therefore, for example, even when an adhesive having a relatively large viscosity is employed as the fixing member 120, the adhesive easily flows into the locking portion 44e.

  That is, the locking portion 44e shown in FIG. 14 forms a space in which at least a part of the fixing member 120 can be easily inserted, so that the globe 10 and the base 40 can be more reliably coupled. Play.

  14 may be provided on the pedestal 40 as a bottomed hole, for example, like the locking portion 44a shown in FIG.

(Modification 8)
In the above embodiment and Modifications 1 to 7, the opening on the main surface 40a side of the through hole or the bottomed hole provided as a locking portion in the base 40 is covered with the fixing member 120.

  However, the opening on the main surface 40 a side of the through hole or the bottomed hole provided as the locking portion in the base 40 may not be covered with the fixing member 120.

  FIG. 15 is a cross-sectional view showing the locking portion 44 and the fixing member 120 according to Modification 8 of the embodiment.

  In FIG. 15, a part of the fixing member 120 is inserted into the locking part 44, and a part of the opening on the main surface 40 a side of the locking part 44 is opened.

  That is, the opening on the main surface 40 a side of the locking portion 44 is not covered with the fixing member 120. Even in such a state, at least a part of the fixing member 120 is inserted into the locking portion 44 that is provided in a concave shape in an oblique direction with respect to the globe axis G (lamp axis J). The effect of locking to the fixing member 120 by 44 is exhibited.

  That is, the globe 10 and the pedestal 40 are coupled in a state where the globe 10 is difficult to be detached from the pedestal 40.

  Note that the effect of the above-mentioned locking is similarly exhibited even when the opening on the main surface 40a side of the bottomed hole such as the locking portion 44a shown in FIG. 10 is not covered by the fixing member 120. The

(Modification 9)
In the said embodiment and the modifications 1-8, the adhesive agent which has a silicone resin as a main component is employ | adopted as the fixing member 120, for example.

  However, an adhesive other than an adhesive may be employed as a fixing member that fixes the opening 11 of the globe 10 to the peripheral edge of the main surface 40a of the base 40.

  FIG. 16 is a cross-sectional view illustrating a fixing member 121 according to Modification 9 of the embodiment.

  The fixing member 121 shown in FIG. 16 is a protrusion provided in the opening 11 of the globe 10 made of resin, for example, and is a protrusion that is locked by the locking portion 44 in a state of being inserted into the locking portion 44. is there.

  That is, if the fixing member 121 is formed of a material having a predetermined elasticity, the fixing member 121 is inserted into the engaging portion 44 provided in a concave shape in an oblique direction with respect to the globe axis G (lamp axis J). It is possible to do. Furthermore, the fixing member 121 can be locked to the locking portion 44.

  Further, for example, the globe 10 having the fixing member 121 can be manufactured as an integrally molded product of resin. In this case, the effect of reducing the number of parts of the light bulb shaped lamp 1 is also achieved.

(Lighting device)
The present invention can be realized not only as the above-described light bulb shaped lamp 1 but also as an illumination device including the light bulb shaped lamp 1. Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to FIG.

  FIG. 17 is a schematic cross-sectional view of the illumination device 2 according to the embodiment.

  As shown in FIG. 17, the illuminating device 2 which concerns on embodiment of this invention is an apparatus with which it is mounted | worn with and used for an indoor ceiling, for example. The illuminating device 2 includes the light bulb shaped lamp 1 according to the above embodiment and the lighting fixture 3.

  The light bulb shaped lamp 1 may reflect at least one of various modifications shown in the first to sixth modifications.

  The lighting device 3 turns off and turns on the light bulb shaped lamp 1 and includes a device main body 4 attached to the ceiling and a translucent lamp cover 5 that covers the light bulb shaped lamp 1.

  The instrument body 4 has a socket 4a. A base 90 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.

(Supplement of the embodiment)
In the above embodiment, the base 40 is provided with two locking portions 44 (see FIG. 6A). However, the number of locking portions 44 provided on the pedestal 40 is not particularly limited, and at least one locking portion 44 may be provided on the pedestal 40.

  Moreover, in the said embodiment, although the LED module 20 employ | adopts the COB type structure which directly mounted the LED chip as a light emitting element on the board | substrate 21, it does not restrict to this.

  For example, as a light emitting element, a package type comprising a resin container having a recess (cavity), an LED chip mounted in the recess, and a sealing member (phosphor-containing resin) enclosed in the recess. An LED element (SMD type LED element) may be employed. That is, the light bulb shaped lamp 1 may be provided with an SMD type LED module 20 configured by mounting a plurality of the LED elements on the substrate 21 on which the metal wiring is formed.

  Moreover, in said embodiment, although the white board | substrate was used as the board | substrate 21 of LED module 20, the surface of the back side of the two white board | substrates in which LED22 and the sealing member 23 were formed on the surface are mutually. One LED module 20 may be configured by bonding.

  In the above embodiment, the LED module 20 is configured to emit white light by the blue LED chip and the yellow phosphor. However, the present invention is not limited to this. For example, in order to improve color rendering properties, a red phosphor or a green phosphor may be further mixed in addition to the yellow phosphor. Moreover, it is also possible to use a phosphor-containing resin containing a red phosphor and a green phosphor without using a yellow phosphor, and to emit white light by combining this with a blue LED chip. it can.

  Moreover, in said embodiment, you may use the LED chip which light-emits colors other than blue as an LED chip. For example, when an ultraviolet light emitting LED chip is used, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.

  In the above embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, or a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be used.

  In addition, the form obtained by making various modifications conceived by those skilled in the art with respect to the embodiments and modifications, or arbitrarily combining the components and functions in the embodiments and modifications without departing from the gist of the present invention Embodiments realized by this are also included in the present invention.

1 Light bulb shaped lamp (light source for illumination)
DESCRIPTION OF SYMBOLS 2 Illuminating device 3 Lighting fixture 4 Appliance main body 4a Socket 5 Lamp cover 10 Globe 11 Opening part 20 LED module (light emitting module)
21 Substrate 22 LED
23 Sealing member 24 Metal wiring 25 Wire 26a, 26b Terminal 27a, 27b Insertion hole 30 Post 40 Base 40a Main surface 40b Back surface 41 Small diameter portion 42 Large diameter portion 43 Stepped portion 44, 44a, 44b, 44c, 44d, 44e Stop portion 45 Base 50 Drive circuit 51 Circuit board 52 Circuit element 53a, 53b, 53c, 53d Lead wire 60 Circuit case 61 Case main body portion 61a First case portion 61b Second case portion 62 Cap portion 70 Heat sink 70a Opening portion 80 Case 90 Base 91 Shell part 92 Insulating part 93 Eyelet part 120, 121 Fixing member

Claims (8)

A light emitting module;
A glove covering the light emitting module;
A pedestal for supporting the light emitting module;
A fixing member for fixing the opening of the globe to the peripheral portion of the main surface that is the surface on the light emitting module side of the pedestal;
The pedestal is a locking portion into which at least a part of the fixing member is inserted, and the locking is provided in a concave shape from the main surface in a direction that is not parallel to the axial direction of the globe and is not orthogonal to the glove. Department have a,
The locking portion is a light source for illumination that is a hole oblique to the axial direction . Hole is the locking section, said main surface of said base, a through-hole for connecting the back surface is a surface opposite to the main surface, lighting of claim 1, wherein provided on the pedestal Light source. The illumination light source according to claim 1, wherein the hole serving as the locking portion has a long opening when the pedestal is viewed from the main surface side . The pedestal is a disk-shaped member having a small-diameter portion, a large-diameter portion having a diameter larger than the small-diameter portion, and a stepped portion connecting the small-diameter portion and the large-diameter portion,
The illumination light source according to any one of claims 1 to 3, wherein the locking portion is disposed in the stepped portion. The opening portion of the globe is fixed to the peripheral edge portion of the main surface of the pedestal in a state where the fixing member containing resin flows into the locking portion and is cured. The light source for illumination according to any one of 4. The said fixing member is a protrusion provided in the said opening part of the said glove | globe, and latched by the said latching | locking part in the state inserted in the said latching | locking part. Light source for illumination. Furthermore, it comprises a support provided to extend from the pedestal toward the inside of the globe,
The light source for illumination according to any one of claims 1 to 6, wherein the light emitting module is connected to an end of the support on the inner side of the globe. An illumination device comprising the illumination light source according to any one of claims 1 to 7.

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