JP6206789B2 - Illumination light source and illumination device - Google Patents

Description

  The present invention relates to an illumination light source and an illumination device, and more particularly, to a light bulb shaped lamp including a light emitting module having a light emitting diode (LED) and an illumination device using the same.

  Semiconductor light-emitting elements such as LEDs are expected to serve as light sources for various products because of their small size, high efficiency, and long life. In particular, light bulb-type LED lamps (LED light bulbs) are being developed as illumination light sources that replace conventional light bulb-type fluorescent lamps and incandescent light bulbs (see, for example, Patent Document 1).

  The bulb-type LED lamp is configured to surround, for example, an LED module that serves as a light source, a globe that covers the LED module, a support member that supports the LED module, a drive circuit that supplies power to the LED module, and a drive circuit. An outer casing and a base for receiving power. The LED module includes a substrate and a plurality of LEDs (light emitting elements) mounted on the substrate.

JP 2006-313717 A

  In recent years, a light bulb-type LED lamp having a configuration similar to an incandescent bulb in light distribution characteristics and appearance has been studied. For example, a bulb-type LED lamp having a configuration in which an LED module is held hollow at a central position in the globe using a globe (clear bulb) made of transparent glass as used in an incandescent bulb has been proposed. In this case, for example, the LED module is fixed to the top of the column using a column extending from the globe opening toward the center of the globe.

  In the LED mounted on the LED module, heat is generated from the LED itself by light emission, thereby increasing the temperature of the LED and reducing the light output. That is, the light emission efficiency of the LED decreases due to the heat generated by itself. For this reason, the heat dissipation countermeasure of an LED module is important.

  On the other hand, light bulb-type LED lamps are required to have higher luminous flux, and research and development of high-power type LED lamps in which LEDs are frequently used are underway. For example, a bulb-type LED lamp having a brightness equivalent to 60 W has been studied. Therefore, measures for heat dissipation of the LED module are extremely important issues.

  An object of the present invention is to provide an illumination light source and an illumination apparatus that can improve the heat dissipation efficiency of heat generated in a light emitting module in consideration of the above-described conventional problems.

  In order to achieve the above object, an illumination light source according to one embodiment of the present invention receives a light emitting module, a globe arranged to cover the light emitting module, and electric power for light emission of the light emitting module from the outside. A base, a housing connected to the opening of the globe and the opening of the base, a base that supports the light emitting module, a first space that is a space in the globe, and a base in the base A base for partitioning the space and a second space formed by the space in the housing, and the base includes at least two passages for convection of gas between the first space and the second space. Pores are formed.

  In the illumination light source according to one aspect of the present invention, the base includes a pedestal provided with the at least two vent holes, and a support column provided to extend from the pedestal toward the inside of the globe. The light emitting module may be connected to an end of the support on the inner side of the globe.

  In the illumination light source according to one aspect of the present invention, a lead wire electrically connected to the base is connected to the light emitting module, and the lead wire is one of the at least two vent holes. It is good also as extending from said 2nd space to the said light emitting module in said 1st space in the state which penetrated one ventilation hole.

  In the illumination light source according to one aspect of the present invention, the outer diameter of the lead wire may be less than or equal to ½ of the inner diameter of the one vent hole through which the lead wire passes.

  In the illumination light source according to one aspect of the present invention, the one vent hole is provided in a concave shape from the inner surface of the one vent hole, and forms a space for accommodating at least a part of the outer periphery of the lead wire. A recess may be provided.

  In the illumination light source according to an aspect of the present invention, a lead wire electrically connected to the base is connected to the light emitting module, and the lead wire is further inserted into the base. A lead wire hole may be formed, and the lead wire may extend from the second space to the light emitting module in the first space in a state of penetrating the lead wire hole.

  An illumination device according to one embodiment of the present invention includes the illumination light source according to any one of the above embodiments.

  According to the present invention, it is possible to efficiently dissipate heat generated in the light emitting module.

External perspective view of a light bulb shaped lamp according to an embodiment Exploded perspective view of a light bulb shaped lamp according to an embodiment Sectional drawing of the bulb-type lamp which concerns on embodiment The figure which shows the structure outline | summary of the LED module in the lightbulb-shaped lamp which concerns on embodiment. The top view of the base which concerns on embodiment Sectional drawing of the base in CC 'line of FIG. 5A The schematic diagram which shows the convection of the gas in the inside of the lightbulb-shaped lamp of embodiment The top view of the base which concerns on the modification 1 of embodiment The top view which shows the shape of the vent hole which concerns on the modification 2 of embodiment The top view of the base which concerns on the modification 3 of embodiment The top view of the base which concerns on the modification 4 of embodiment Sectional drawing of the base which concerns on the modification 5 of embodiment Sectional drawing of the base which concerns on the modification 6 of embodiment Schematic sectional view of a lighting device according to an embodiment

  DESCRIPTION OF EMBODIMENTS Hereinafter, an illumination light source and an illumination device according to embodiments of the present invention will be described with reference to the drawings. Each figure is a schematic diagram and is not necessarily illustrated exactly.

  Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as arbitrary constituent elements.

  In the following embodiments, a bulb-type LED lamp (LED bulb) will be described as an example of a light source for illumination.

[Overall configuration of bulb-type lamp]
First, the whole structure of the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIGS. 1 and 2.

  FIG. 1 is an external perspective view of a light bulb shaped lamp 1 according to an embodiment.

  FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment.

  As shown in FIGS. 1 and 2, the light bulb shaped lamp 1 according to the present embodiment is a light bulb shaped lamp that is an alternative to a light bulb shaped fluorescent light or an incandescent light bulb.

  The light bulb shaped lamp 1 includes a globe 10, an LED module 20, which is an example of a light emitting module, a globe 10 disposed so as to cover the LED module 20, a base 90, and a housing connected to the globe 10 and the base 90. 80 and a base 45 that supports the LED module 20. In the present embodiment, the base 45 has a base 40 and a support 30.

  In the present embodiment, a drive circuit 50 for light emission of the LED module 20 is accommodated in the housing 80.

  In the light bulb shaped lamp 1 according to the present embodiment, an envelope is configured by the globe 10, the casing 80, and the base 90, and the internal space of the envelope is partitioned into two spaces by the base 45. It has been.

  Hereinafter, each component of the light bulb shaped lamp 1 according to the present embodiment will be described in detail with reference to FIG.

  FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the embodiment.

  In FIG. 3, the alternate long and short dash line drawn along the vertical direction on the paper indicates the lamp axis J (center axis) of the light bulb shaped lamp 1. In this embodiment, the lamp axis J is the axis of the globe 10. (Glove axis). The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown in FIG. 3), and coincides with the rotation axis of the base 90. Further, in FIG. 3, the drive circuit 50 is shown in a side view rather than a sectional view.

[Glove]
As shown in FIG. 3, the globe 10 is a translucent cover for taking out the light emitted from the LED module 20 to the outside of the lamp. The globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.

  The LED module 20 is covered with the globe 10. Thereby, the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10. In the present embodiment, the globe 10 is configured to house the LED module 20.

  The shape of the globe 10 is such that one end is closed in a spherical shape and the other end has an opening 11. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.

  As the globe 10 having such a shape, a glass bulb having a shape similar to that of a general bulb-type fluorescent lamp or incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.

  Further, the opening 11 of the globe 10 is placed on the surface of the pedestal 40, for example, and in this state, the globe 10 is fixed by applying an adhesive such as silicone resin between the pedestal 40 and the housing 80. Is done.

  The globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film can be formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate to the entire inner surface or outer surface of the globe 10. As described above, by providing the globe 10 with the light diffusion function, the light incident on the globe 10 from the LED module 20 can be diffused, so that the light distribution angle of the light bulb shaped lamp 1 can be expanded.

  Further, the shape of the globe 10 is not limited to the A shape or the like, and may be a spheroid or an oblate ball. The material of the globe 10 is not limited to a glass material, and a resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

[LED module]
The LED module 20 is a light emitting module having a light emitting element, and emits light of a predetermined color (wavelength) such as white.

  As shown in FIG. 3, the LED module 20 is disposed inward of the globe 10, and is formed at a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Preferably they are arranged.

  Thus, by arranging the LED module 20 at the center position of the globe 10, it is possible to realize a light distribution characteristic approximate to that of a conventional incandescent bulb using a filament coil.

  The LED module 20 is held hollow in the globe 10 by the support column 30 and emits light by electric power supplied from the drive circuit 50 via the lead wires 53a and 53b. In the present embodiment, the substrate 21 of the LED module 20 is supported by the support column 30.

  Here, each component of the LED module 20 which concerns on embodiment of this invention is demonstrated using FIG.

  FIG. 4 is a diagram showing a schematic configuration of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment.

  Specifically, FIG. 4A is a plan view of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment. FIG. 4B is a cross-sectional view of the LED module 20 taken along line AA ′ in FIG. FIG. 4C is a cross-sectional view of the LED module 20 taken along the line BB ′ of FIG.

  As shown to (a)-(c) of FIG. 4, the LED module 20 has the board | substrate 21, LED22, the sealing member 23, the metal wiring 24, the wire 25, and the terminals 26a and 26b.

  LED module 20 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on substrate 21. Hereinafter, each component of the LED module 20 will be described in detail.

  First, the substrate 21 will be described. The substrate 21 is a mounting substrate for mounting the LEDs 22, and includes a first main surface (front side surface) on which the LEDs 22 are mounted, and a second main surface (back side surface) facing the first main surface. Have

  As shown to (a) of FIG. 4, the board | substrate 21 is a rectangular-plate-shaped board | substrate with a planar view (when it sees from the top part of the globe 10), for example.

  The substrate 21 is connected to one end of the support column 30. Specifically, the second main surface of the substrate 21 and the end surface of the support column 30 are connected so as to be in surface contact.

  As the substrate 21, a substrate having a low light transmittance with respect to the light emitted from the LED 22, for example, a white substrate such as a white alumina substrate having a total transmittance of 10% or less or a metal substrate (metal base substrate) coated with a resin is used. Can be used.

  Thus, by using a substrate having a low light transmittance, it is possible to suppress light from being transmitted through the substrate 21 and emitted from the second main surface, and color unevenness can be suppressed. Further, since an inexpensive white substrate can be used, cost reduction can be realized.

  On the other hand, a light-transmitting substrate having a high light transmittance can be used as the substrate 21. By using the translucent substrate, the light of the LED 22 is transmitted through the inside of the substrate 21 and is also emitted from the surface (back side surface) on which the LED 22 is not mounted.

  Therefore, even if the LED 22 is mounted only on the first main surface (front side surface) of the substrate 21, light is emitted from the second main surface (back side surface), so that the light distribution approximates that of an incandescent bulb. It becomes possible to obtain characteristics. Moreover, since light can be emitted from the LED module 20 in all directions, it is possible to realize all light distribution characteristics.

  As the light-transmitting substrate, for example, a substrate having a total transmittance of 80% or more for visible light or a transparent substrate that is transparent to visible light (that is, the transmittance is extremely high and the other side can be seen through) is used. Can do. As such a translucent substrate, a translucent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin material made of transparent resin material A resin substrate or the like can be used.

  In the present embodiment, a white polycrystalline ceramic substrate made of sintered alumina is used as the light-transmitting substrate 21. For example, a white alumina substrate having a thickness of 1 mm and a light reflectance of 94%, or a white alumina substrate having a thickness of 0.635 mm and a light reflectance of 88% can be used.

  As the substrate 21, a resin substrate, a flexible substrate, or a metal base substrate can be used. In addition, the shape of the substrate 21 is not limited to a rectangle, and other shapes such as a square or a circle can be used.

  In addition, the substrate 21 is provided with two insertion holes 27a and 27b for electrical connection with the two lead wires 53a and 53b. The lead wire 53a (53b) is solder-connected to a terminal 26a (26b) formed on the substrate 21 with the tip portion inserted through the insertion hole 27a (27b).

  Next, the LED 22 will be described. The LED 22 is an example of a light emitting element, and is a semiconductor light emitting element that emits light with a predetermined power. The plurality of LEDs 22 on the substrate 21 are all the same, and the LEDs 22 are selected so that the Vf characteristics are all the same.

  Each LED 22 is a bare chip that emits monochromatic visible light. In this embodiment, a blue LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

  The LEDs 22 are mounted only on the first main surface (front side surface) of the substrate 21, and a plurality of LEDs 22 are mounted so as to form a plurality of rows along the long side direction of the substrate 21. In the present embodiment, 48 LEDs 22 are arranged on the substrate 21 in order to achieve brightness equivalent to 60 W. Specifically, 48 LEDs 22 are arranged on the first main surface (front side surface) of the substrate 21 so that four rows of element rows each composed of 12 LEDs 22 are arranged in parallel.

  Further, in the present embodiment, in the LEDs 22 adjacent to each other, the cathode electrode of one LED 22 and the anode electrode of the other LED 22 are connected via the metal wiring 24 by wire bonding using the wire 25.

  In addition, you may connect the wire bond part of adjacent LED22 directly with the wire 25, without passing through the metal wiring 24. FIG. That is, the adjacent LEDs 22 may be wire-bonded by chip-to-chip. In this case, the metal wiring 24 arrange | positioned between adjacent LED22 is unnecessary.

  In the present embodiment, the plurality of LEDs 22 are mounted on the substrate 21, but the number of LEDs 22 may be appropriately changed according to the use of the light bulb shaped lamp 1.

  For example, when the light bulb shaped lamp 1 is realized as a low output type LED lamp that replaces a miniature light bulb or the like, the LED module 20 may have one LED 22.

  On the other hand, when the light bulb shaped lamp 1 is realized as a high output type LED lamp, the number of LEDs 22 mounted in one element array may be further increased.

  Moreover, the element row | line | column of LED22 is good not only as 4 rows but 1-3 rows, and good also as 5 rows or more.

  Next, the sealing member 23 will be described. The sealing member 23 is made of, for example, resin and is configured to cover the LED 22.

  Specifically, the sealing member 23 is formed so as to collectively seal one row of the plurality of LEDs 22. In the present embodiment, since four element rows of the LED 22 are provided, four sealing members 23 are formed. Each of the four sealing members 23 is linearly provided on the first main surface of the substrate 21 along the arrangement direction (column direction) of the plurality of LEDs 22.

  The sealing member 23 is mainly made of a translucent material, but when it is necessary to convert the wavelength of the light of the LED 22 to a predetermined wavelength, a wavelength conversion material is mixed into the translucent material.

  The sealing member 23 in the present embodiment includes a phosphor as a wavelength conversion material. That is, the sealing member 23 is a wavelength conversion member that converts the wavelength (color) of light emitted from the LED 22.

  Such a sealing member 23 can be constituted by, for example, an insulating resin material (phosphor-containing resin) containing phosphor particles. The phosphor particles are excited by light emitted from the LED 22 and emit light of a desired color (wavelength).

  For example, a silicone resin can be used as the resin material constituting the sealing member 23. Further, a light diffusing material may be dispersed in the sealing member 23. The sealing member 23 is not necessarily formed of a resin material, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.

  For example, when the LED 22 is a blue LED that emits blue light, the phosphor particles to be contained in the sealing member 23 are, for example, YAG (yttrium, aluminum, garnet) -based yellow phosphor particles in order to obtain white light. Is adopted.

  Thereby, a part of the blue light emitted from the LED 22 is converted into yellow light by the yellow phosphor particles contained in the sealing member 23. Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 23, so that the white light is emitted from the sealing member 23. And emitted. In addition, particles such as silica are used as the light diffusing material.

  The sealing member 23 in the present embodiment is formed of a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin. For example, the sealing member 23 is formed by applying and curing the phosphor-containing resin on the first main surface of the substrate 21 with a dispenser. In this case, the shape of the cross section perpendicular to the longitudinal direction of the sealing member 23 is substantially semicircular.

  In order to convert the wavelength of light (leakage light) toward the back side of the substrate 21, fluorescent light is used as a second wavelength conversion member between the LED 22 and the substrate 21 or on the second main surface (back side surface) of the substrate 21. A phosphor film (phosphor layer) such as a sintered body film composed of body particles and an inorganic binder (binder) such as glass or the same phosphor-containing resin as the surface of the substrate 21 may be further formed.

  In this manner, by forming the second wavelength conversion member on the second main surface of the substrate 21, white light can be emitted from both surfaces of the substrate 21 even when light leaks from the second main surface. it can.

  Next, the metal wiring 24 will be described. The metal wiring 24 is a conductive wiring through which a current for causing the LED 22 to emit light flows, and is patterned in a predetermined shape on the surface of the substrate 21. As shown in FIG. 4A, the metal wiring 24 is formed on the first main surface of the substrate 21. The power supplied to the LED module 20 from the lead wires 53a and 53b is supplied to each LED 22 by the metal wiring 24.

  The metal wiring 24 can be formed by, for example, patterning or printing a metal film made of a metal material. As a material of the metal wiring 24, for example, silver (Ag), tungsten (W), copper (Cu), gold (Au), or the like can be used.

  The metal wiring 24 exposed from the sealing member 23 is preferably covered with a glass film (glass coat film) made of a glass material or a resin film (resin coat film) made of a resin material, except for the terminals 26a and 26b. . Thereby, for example, the insulation in the LED module 20 can be improved, and the reflectance of the surface of the substrate 21 can be improved.

  The wire 25 is an electric wire such as a gold wire. As shown in FIG. 4B, the wire 25 connects the LED 22 and the metal wiring 24.

  Specifically, the wire 25 is wire-bonded to the wire bonding portion provided on the upper surface of the LED 22 and the metal wiring 24 formed adjacent to both sides of the LED 22.

  In the present embodiment, the entire wire 25 is embedded in the sealing member 23 so as not to be exposed from the sealing member 23. This prevents light from being absorbed by the exposed wire 25, reflection of light, and the like.

  Next, the terminals 26a and 26b will be described. The terminals 26 a and 26 b are external connection terminals that receive DC power for causing the LEDs 22 to emit light from the outside of the LED module 20. In the present embodiment, terminals 26a and 26b are solder-connected to lead wires 53a and 53b.

  Terminals 26a and 26b are formed in a predetermined shape on the first main surface of substrate 21 so as to surround insertion holes 27a and 27b. The terminals 26 a and 26 b are formed continuously with the metal wiring 24 and are electrically connected to the metal wiring 24. The terminals 26 a and 26 b are patterned simultaneously with the metal wiring 24 using the same metal material as the metal wiring 24.

  The terminals 26 a and 26 b are power supply units of the LED module 20, and supply DC power received from the lead wires 53 a and 53 b to the respective LEDs 22 through the metal wiring 24 and the wires 25.

[Base]
The base 45 in this Embodiment has the support | pillar 30 and the base 40 as mentioned above.

  The base 45 is provided with at least two vent holes as a characteristic configuration. In the present embodiment, the base 40 of the base 45 is provided with a vent hole 43a and a vent hole 43b.

  By these vent holes 43a and 43b, convection of gas (for example, air) between the two spaces inside the light bulb shaped lamp 1 separated by the base 45 is generated.

  The functions of the vent holes 43a and 43b and various modifications will be described later with reference to FIGS.

  Each of the support column 30 and the pedestal 40 included in the base 45 will be described below.

[Support]
As shown in FIG. 3, the support column 30 is a long member that extends from the base 40 toward the inside of the globe 10. In the present embodiment, the support column 30 has the axis of the support column 30 extended along the lamp axis J. That is, the axis of the support column 30 and the lamp axis J are parallel.

  The support column 30 functions as a support member that supports the LED module 20, and the LED module 20 is connected to the end of the support column 30 on the inner side of the globe 10. That is, the LED module 20 is supported on the pedestal 40 via the support column 30.

  Thus, by attaching the LED module 20 to the support column 30 extending inward of the globe 10, it is possible to realize a light distribution characteristic with a wide light distribution angle similar to that of an incandescent bulb.

  Moreover, the support | pillar 30 functions also as a heat radiating member (heat sink) for radiating the heat which generate | occur | produces in the LED module 20 (LED22). Therefore, it is preferable that the support column 30 is made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity.

  Thereby, the heat generated in the LED module 20 via the support column 30 can be efficiently conducted to the base 40. The thermal conductivity of the support column 30 is preferably larger than the thermal conductivity of the substrate 21. In the present embodiment, the material of the support column 30 is aluminum.

  One end of the support column 30 on the top side of the globe 10 is connected to the center of the substrate 21 of the LED module 20, and the other end of the support 30 on the base 90 side is connected to the center of the base 40.

  The board | substrate 21 of the LED module 20 and the end surface of the support | pillar 30 are fixed by adhesives, such as a silicone resin, for example. Therefore, an adhesive may exist between the substrate 21 and the end face of the support column 30. In this case, considering the thermal conductivity between the substrate 21 and the support column 30, the thickness of the silicone resin is preferably 20 μm or less.

  Moreover, the board | substrate 21 and the support | pillar 30 may be fixed with the screw instead of an adhesive agent, for example. In this case, depending on the material or processing technique, there may be minute irregularities on the surface of the substrate 21 and the support column 30, and therefore there is a minute gap between the second main surface of the substrate 21 and the end surface of the support column 30. Sometimes. Even if there is such a small gap, if the gap is about 20 μm or less, it can be considered that the substrate 21 and the support column 30 are substantially in contact with each other.

  As the shape of the support column 30, for example, a solid cylindrical shape having a constant cross-sectional area (area in a cross section when cut along a plane having the axis of the support column 30 as a normal line) is employed.

  In addition, about the shape of the support | pillar 30, a cross-sectional area does not need to be constant, and the shape where a cross-sectional area changes in the middle, such as the shape which combined the cylinder and the prism, may be sufficient.

  Further, in the light bulb shaped lamp 1 according to the present embodiment, the support column 30 is not an essential component. That is, the base 45 may be realized only by the base 40. In this case, the LED module 20 is disposed on the pedestal 40, and for example, a hemispherical glove is employed as the glove 10.

[pedestal]
The pedestal 40 is a member that supports the LED module 20. In the present embodiment, the pedestal 40 supports the LED module 20 via the support column 30 as described above.

  As shown in FIG. 3, the pedestal 40 is configured to close the opening 11 of the globe 10.

  The pedestal 40 also functions as a heat radiating member (heat sink) for radiating heat generated by the LED module 20 (LED 22). Therefore, the pedestal 40 is preferably made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity. Thereby, the heat from the support | pillar 30 can be discharge | released and conducted to the housing | casing 80 efficiently. In the present embodiment, the material of the base 40 is aluminum.

  In the present embodiment, as shown in FIG. 3, the pedestal 40 is a disk-shaped member having a stepped portion, and is constituted by a small diameter portion 41 having a small diameter and a large diameter portion 42 having a large diameter. Yes.

  For example, the small-diameter portion 41 has a thickness of 3 mm and a diameter of about 30 mm, and the large-diameter portion 42 has a thickness of 3 mm and a diameter of about 42 mm. Note that the height of the stepped portion is, for example, about 4 mm.

  As shown in FIG. 3, the pedestal 40 is fitted into the opening of the housing 80 so that the outer peripheral surface of the large-diameter portion 42 is in contact with the upper inner peripheral surface of the housing 80. Thereby, the heat of the base 40 can be efficiently conducted to the housing 80.

  Further, the opening 11 of the globe 10 abuts on the upper surface of the large-diameter portion 42, and the opening 11 of the globe 10, the upper surface of the large-diameter portion 42, and the housing are made of, for example, an adhesive mainly composed of silicone resin. The upper inner peripheral surface of 80 is bonded. Thereby, the opening part 11 of the globe 10 is closed.

  Further, the pedestal 40 is provided with the vent holes 43a and 43b as described above. In this embodiment, as shown in FIG. 3, the vent holes 43a and 43b are used for wiring the lead wires 53a and 53b. It is used as a hole.

[Drive circuit]
As shown in FIG. 3, the drive circuit (circuit unit) 50 is a lighting circuit (power circuit) for causing the LED module 20 (LED 22) to emit light (lights), and supplies predetermined power to the LED module 20. . For example, the drive circuit 50 converts AC power supplied from the base 90 via the pair of lead wires 53c and 53d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 53a and 53b. Supply.

  The drive circuit 50 includes a circuit board 51 and a plurality of circuit elements (electronic components) 52 mounted on the circuit board 51.

  The circuit board 51 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 52 mounted on the circuit board 51. In the present embodiment, the circuit board 51 is arranged in a posture in which the main surface is orthogonal to the lamp axis J.

  The circuit element 52 is, for example, a capacitor element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a semiconductor element such as a diode or an integrated circuit element. Most of the circuit elements 52 are mounted on the main surface of the circuit board 51 on the base 90 side.

  The drive circuit 50 configured as described above is housed in the housing 80. In the present embodiment, the circuit board 51 is held by a protruding part (board holding part) provided on the inner surface of the housing 80. The drive circuit 50 may be appropriately selected and combined with a dimmer circuit, a booster circuit, or the like.

  The drive circuit 50 and the LED module 20 are electrically connected by a pair of lead wires 53a and 53b. The drive circuit 50 and the base 90 are electrically connected by a pair of lead wires 53c and 53d. These four lead wires 53a to 53d are, for example, alloy copper lead wires, and are composed of a core wire made of alloy copper and an insulating resin film covering the core wire.

  In the present embodiment, the lead wire 53a is a lead (plus-side output terminal wire) for supplying a positive voltage from the drive circuit 50 to the LED module 20, and the lead wire 53b is from the drive circuit 50 to the LED module 20. It is a conducting wire (minus output terminal wire) for supplying a negative voltage. The lead wires 53a and 53b are inserted into vent holes 43a and 43b provided in the base 40 and led out to the LED module 20 side (inside the globe 10).

  One end (core wire) of each of the lead wires 53a (53b) is inserted through the insertion hole 27a (27b) of the substrate 21 of the LED module 20 and soldered to the terminals 26a and 26b. On the other hand, the other end (core wire) of each of the lead wires 53a and 53b is solder-connected to the metal wiring of the circuit board 51.

  The lead wires 53c and 53d are electric wires for supplying power for lighting the LED module 20 from the base 90 to the drive circuit 50. One end (core wire) of each of the lead wires 53c and 53d is electrically connected to the base 90 (shell portion 91 or eyelet portion 93), and each other end (core wire) is a power input portion of the circuit board 51. It is electrically connected to (metal wiring) by solder or the like.

  Note that the light bulb shaped lamp 1 is not necessarily provided with the drive circuit 50. For example, when direct-current power is directly supplied to the light bulb shaped lamp 1 from a lighting fixture or a battery, the light bulb shaped lamp 1 may not include the drive circuit 50.

  The circuit board 51 does not have to be arranged in a posture in which the main surface is orthogonal to the lamp axis J. For example, the circuit board 51 may be arranged in a posture in which the main surface is parallel to the lamp axis J.

[Case]
As shown in FIG. 3, the housing 80 is a hollow member connected to the opening 11 of the globe 10 and the opening 90 a of the base 90. The material of the housing 80 is, for example, an insulating resin material such as PBT.

  In the present embodiment, the housing 80 includes a large-diameter cylindrical main body 81 and a small-diameter cylindrical screwing portion 82.

  Since the outer surface of the main body 81 is exposed to the outside air, the heat conducted to the housing 80 is mainly dissipated from the main body 81. The screwing portion 82 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 90, and a thread that is screwed with the base 90 is formed on the outer peripheral surface of the screwing portion 82.

  Note that a circuit case for housing the drive circuit 50 and a member such as a heat sink made of a material having high thermal conductivity such as metal may be disposed inside the housing 80.

  Further, the housing 80 may be configured by a main body constituting the main part of the housing 80, the circuit case, the heat sink, and the like. That is, the housing 80 may be configured by a combination of a plurality of members.

[Base]
The base 90 is a power receiving unit that receives power for causing the LED module 20 (LED 22) to emit light from the outside of the lamp. The base 90 is attached to a socket of a lighting fixture, for example. Thereby, the base 90 can receive electric power from the socket of the lighting fixture when lighting the light bulb shaped lamp 1.

  The base 90 is supplied with AC power from, for example, a commercial power supply of AC 100V. The base 90 in the present embodiment receives AC power through two contact points, and the power received by the base 90 is input to the power input unit of the drive circuit 50 via a pair of lead wires 53c and 53b.

  The base 90 has a metal bottomed cylindrical shape, and includes a shell portion 91 whose outer peripheral surface forms a male screw, and an eyelet portion 93 attached to the shell portion 91 via an insulating portion 92. . On the outer peripheral surface of the base 90, a screwing portion for screwing into the socket of the lighting fixture is formed. Further, on the inner peripheral surface of the base 90, a screwing portion for screwing with the screwing portion 82 of the housing 80 is formed.

  The type of the base 90 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used. For example, as the base 90, E26 type, E17 type, E16 type or the like can be mentioned.

[Characteristic configuration of light bulb shaped lamp]
Hereinafter, a characteristic configuration of the light bulb shaped lamp 1 according to the present embodiment and various modifications will be described with reference to FIGS. 5A to 12.

  FIG. 5A is a plan view of the base 45 according to the embodiment.

  FIG. 5B is a cross-sectional view of the base 45 taken along the line CC ′ of FIG. 5A.

  As shown in FIGS. 5A and 5B, the base 45 has vent holes 43a and 43b. Specifically, in the small-diameter portion 41 of the pedestal 40 provided in the base 45, two vent holes (43a, 43b) are arranged with the support 30 interposed therebetween.

  In the present embodiment, each of the vent holes 43a and 43b is a round hole that opens on both the main surface 40a and the back surface 40b of the base 40 as shown in FIG. 5A. Further, as shown in FIG. 5B, the inner diameter D of the vent hole 43a (43b) and the outer diameter d of the lead wire 53a (53b) arranged in a state of passing through the vent hole 43a (43b) have a predetermined relationship. is there.

  Specifically, in the present embodiment, the outer diameter of the lead wire 53a (53b) is ½ or less of the inner diameter of the vent hole 43a (43b) through which the lead wire 53a (53b) passes.

  In other words, the inner diameter of the vent hole 43a (43b) is at least twice the outer diameter of the lead wire 53a (53b).

  That is, the cross-sectional area of the lead wire 53a (53b) is ¼ or less of the cross-sectional area of the vent hole 43a (43b). In other words, the cross-sectional area of the vent hole 43a (43b) is four times or more the cross-sectional area of the lead wire 53a (53b).

  For example, when the outer diameter of the base 40 is about 42 mm, the thickness is about 3 mm, and the outer diameter of the lead wire 53a (53b) is about 1.5 mm, the inner diameter of the vent hole 43a (43b) is 3 mm. About 4 mm.

  These two vent holes 43a and 43b have a function of convection of gas in the internal space of the light bulb shaped lamp 1 partitioned by the base 45.

  FIG. 6 is a schematic diagram showing gas convection inside the light bulb shaped lamp 1 of the embodiment.

  In FIG. 6, the lead wires 53a to 53d are not shown.

  As shown in FIG. 6, in the present embodiment, the internal space of the light bulb shaped lamp 1 is largely divided into two spaces by a base 45.

  Specifically, the base 45 partitions a first space 210 that is a space in the globe 10 and a second space 220 that is formed by the space in the base 90 and the space in the housing 80.

  In the present embodiment, the vent holes 43a and 43b are arranged so as to connect the first space 210 and the second space 220, and the heat dissipation efficiency for the heat generated in the LED module 20 by the vent holes 43a and 43b. Is improved.

  In the present embodiment, the lead wire 53a (53b) electrically connected to the base 90 penetrates the vent hole 43a (43b) from the second space 220 to the LED in the first space 210. It extends to the module 20.

  Hereinafter, the outline of gas convection in the internal space of the light bulb shaped lamp 1 will be described with reference to FIG.

  In FIG. 6, the gas warmed by the heat generated in the LED module 20 rises (solid arrow in FIG. 6), and reaches the inside of the base 90 through at least one of the vent holes 43a and 43b (in FIG. 6). Solid arrows).

  Here, in the internal space of the light bulb shaped lamp 1, the heat sources are the LED module 20 and the drive circuit 50. It is.

  Accordingly, the gas heated by the heat from the LED module 20 and reaching the inside of the base 90 through at least one of the vent holes 43a and 43b is subjected to heat exchange with the base 90, and the temperature is lowered in FIG. To descend.

  That is, the gas cooled by the base 90 moves from the space inside the base 90 toward the base 40 and reaches the space around the LED module 20 through at least one of the vent holes 43a and 43b (FIG. 6). Dotted arrow).

  The gas that has reached the space around the LED module 20 rises in temperature by exchanging heat with the LED module 20, and moves upward in FIG. That is, the heat of the LED module 20 is taken away by the gas that has moved from the second space 220 to the first space 210 via at least one of the vent holes 43a and 43b.

  As described above, the gas convection between the first space 210 and the second space 220 improves the heat dissipation efficiency of the heat generated in the LED module 20. In addition, the effect of improving the heat dissipation efficiency of the heat generated in the drive circuit 50 is also achieved.

  As described above, the light bulb shaped lamp 1 of the present embodiment includes the LED module 20 supported by the base 45 as a light source.

  In addition, vent holes 43a and 43b are disposed between the first space 210 and the second space 220 inside the light bulb shaped lamp 1 and partitioned by the base 45, whereby the first space 210 and Gas convection occurs between the second spaces 220.

  That is, at least two vent holes (43a, 43b) are provided in the base 45 that partitions two spaces (the first space 210 and the second space 220) having different thermal environments. It is possible to positively generate gas convection.

  As a result, heat dissipation of the LED module 20 through the gas inside the light bulb shaped lamp 1 is efficiently performed.

  The configuration of the light bulb shaped lamp 1 according to the embodiment may be other than the configuration shown in FIGS. Accordingly, various modifications of the configuration of the light bulb shaped lamp 1 will be described with reference to FIGS.

(Modification 1)
FIG. 7 is a plan view of a base 45 according to Modification 1 of the embodiment.

  The ventilation holes 43a and 43b shown in FIG. 7 are perpendicular to the axial directions of the ventilation holes 43a and 43b (the penetration direction of the ventilation holes 43a and 43b in the base 45, and the same applies hereinafter in the Z-axis direction in the present embodiment). The cross section is elliptical.

  Therefore, as shown in FIG. 7, the lead wire 53a (53b) can be disposed so as to be accommodated in one side of the cross section of the vent hole 43a (43b) in the major axis direction. As a result, for example, it is possible to appropriately maintain the position of the lead wire 53a (53b) when the light bulb shaped lamp 1 is assembled.

  The vent hole 43a (43b) may have a recess (concave portion) for stabilizing the position of the lead wire 53a (53b). Accordingly, the vent hole 43a having a recess will be described as a second modification.

(Modification 2)
FIG. 8 is a plan view showing the shape of the vent hole 43a according to the second modification of the embodiment.

  The vent hole 43a shown in FIG. 8 has a circular shape as a whole in a cross section perpendicular to the axial direction, and has a concave portion 43c that is recessed in a part of the periphery.

  Specifically, the concave portion 43c is provided in a concave shape from the inner surface of the vent hole 43a, and forms a space that accommodates at least a part of the outer periphery of the lead wire 53a, thereby making the position of the lead wire 53a more stable. Can be maintained.

  Although not shown in FIG. 8, the vent hole 43b may have a recess similar to the recess 43c.

(Modification 3)
The vent holes 43a and 43b in the above embodiment are used as wiring holes for the lead wires 53a and 53b. However, the base 45 may have wiring holes for the lead wires 53a and 53b separately from the vent holes 43a and 43b.

  FIG. 9 is a plan view of a base 45 according to the third modification of the embodiment.

  The base 45 shown in FIG. 9 has lead wire holes 140a and 140b through which the lead wires 53a and 53b are inserted in addition to the vent holes 43a and 43b.

  That is, in the light bulb shaped lamp 1 including the base 45 shown in FIG. 9, the lead wire 53a (53b) passes through the lead wire hole 140a (140b) from the second space 220 to the first space 210. It extends to the LED module 20.

  Thus, by not using the vent holes 43a and 43b as wiring holes for the lead wires 53a and 53b, it becomes easy for gas to pass through each of the vent holes 43a and 43b. The efficiency of heat dissipation using gas convection in the space is improved.

(Modification 4)
In the above embodiment, the air holes 43a and 43b are round holes, and in the first modification, the air holes 43a and 43b are elliptical holes.

  However, the shape of the vent hole provided in the base 45 is not particularly limited. For example, a long slit in plan view may be provided in the base 45 as a vent hole.

  FIG. 10 is a plan view of a base 45 according to Modification 4 of the embodiment.

  The base 45 shown in FIG. 10 has two slits that penetrate the base 40 as the vent holes 46a and 46b.

  Thereby, for example, the vent holes 46a and 46b can be provided in the base 45 in a manner that is not conspicuous in appearance.

  In FIG. 10, the vent holes 46 a and 46 b are provided as long slits in the circumferential direction of the base 40. However, the vent holes 46a and 46b may be provided as long slits in the radial direction of the base 40, for example.

  In FIG. 10, the base 45 is provided with lead wire holes 140a and 140b in addition to the vent holes 46a and 46b. However, the lead wire holes 140a and 140b may not be provided in the base 45, and the vent holes 46a and 46b may be used as wiring holes for the lead wires 53a and 53b.

(Modification 5)
In the modified examples 3 and 4, the lead wire holes 140 a and 140 b are arranged in the base 45 so as to penetrate only the pedestal 40 and not penetrate the support column 30. However, the hole through which the lead wires 53 a and 53 b are inserted in the base 45 may penetrate the support column 30.

  FIG. 11 is a cross-sectional view of a base 45 according to Modification 5 of the embodiment.

  The base 45 shown in FIG. 11 has lead wire holes 141a and 141b penetrating the base 40 and the column 30 as holes through which the lead wires 53a and 53b are inserted.

  Thereby, for example, the lead wires 53a and 53b can be arranged in a manner that does not hinder gas movement in the first space 210. As a result, the efficiency of heat dissipation using gas convection in the internal space of the light bulb shaped lamp 1 is improved.

(Modification 6)
The vent holes 43a and 43b in the above embodiment have the same shape. However, each of the at least two vent holes provided in the base 45 may not have the same shape.

  FIG. 12 is a cross-sectional view of a base 45 according to Modification 6 of the embodiment.

  The base 45 shown in FIG. 12 has vent holes 47a and 47b having different shapes. Specifically, the vent hole 47a has a shape in which the opening of the main surface 40a is larger than the opening of the back surface 40b, and the vent hole 47b has a shape in which the opening of the main surface 40a is smaller than the opening of the back surface 40b.

  Thereby, the difference of conditions, such as resistance with respect to the distribution | circulation of the gas from one side of the 1st space 210 and the 2nd space 220 in the vent hole 47a and the vent hole 47b, becomes large.

  As a result, for example, one of the vent hole 47a and the vent hole 47b is mainly a gas flow path from the first space 210 to the second space 220, and the other of the vent hole 47a and the vent hole 47b is mainly the second space. It can be considered as a gas flow path from the space 220 to the first space 210.

  That is, by changing the shape, size, position, or the like of the vent holes 47a and 47b from each other, the conditions for the gas flow in the vent holes 47a and 47b can be made different. As a result, it is possible to activate gas convection in the internal space of the light bulb shaped lamp 1.

(Lighting device)
The present invention can be realized not only as the above-described light bulb shaped lamp 1 but also as an illumination device including the light bulb shaped lamp 1. Hereinafter, a lighting device according to an embodiment of the present invention will be described with reference to FIG.

  FIG. 13 is a schematic cross-sectional view of the illumination device 2 according to the embodiment.

  As shown in FIG. 13, the illuminating device 2 which concerns on embodiment of this invention is an apparatus with which it is mounted | worn with and used for an indoor ceiling, for example. The illuminating device 2 includes the light bulb shaped lamp 1 according to the above embodiment and the lighting fixture 3.

  The light bulb shaped lamp 1 may reflect at least one of various modifications shown in the first to sixth modifications.

  The lighting device 3 turns off and turns on the light bulb shaped lamp 1 and includes a device main body 4 attached to the ceiling and a translucent lamp cover 5 that covers the light bulb shaped lamp 1.

  The instrument body 4 has a socket 4a. A base 90 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.

(Supplement of the embodiment)
In the above embodiment and Modifications 1 to 6, two vent holes such as the vent hole 43a are provided in the base 45, but at least two vent holes are provided in the base 45 as described above. It only has to be done.

  That is, the base 45 may be provided with three or more vent holes. For example, three or more vent holes may be provided in the small diameter portion 41 so as to surround the support column 30.

  In addition, a mesh portion for convection of gas between the first space 210 and the second space 220 may be formed in the pedestal 40 by arranging vent holes having a relatively small inner diameter in the pedestal 40 in a matrix.

  Here, the base 45 is a member connected to the LED module 20 and also functions as a heat dissipation member as described above.

  Therefore, for example, when a plurality of relatively large ventilation holes are arranged in the pedestal 40, a plurality of thin portions that hinder heat conduction are generated in the pedestal 40, and as a result, the heat dissipation effect by the base 45 may be significantly reduced. It is done.

  Therefore, for example, the ratio of the volume of the two or more vent holes in the entire base 45 (the ratio of the volume of the base 45 decreasing by providing two or more vent holes) is within a predetermined range. A significant decrease in the heat dissipation effect due to 45 is prevented.

  For example, in the plan view of the base 45 shown in FIG. 5A, the vent holes 43a and 43b are provided so that the ratio of the total area of the vent holes 43a and 43b to the area of the base 40 is within a predetermined range. Thereby, both heat dissipation by the convection of the gas through the vent holes 43a and 43b and heat dissipation through the base 45 can be achieved.

  Further, the shape of the air holes, specifically, the cross-sectional shape perpendicular to the axial direction of the air holes and the parallel cross-sectional shape may be other than the shapes shown in the above embodiment and the first to sixth modifications. The shape may be a combination of straight lines.

  Further, in the base 45, it is not necessary to arrange two lead wire holes through which the lead wires 53a and 53b are inserted, and both the lead wires 53a and 53b are inserted into one lead wire hole. Also good.

  Further, the convection gas in the internal space of the light bulb shaped lamp 1 is not limited to air. For example, when a rare gas such as helium is enclosed in the light bulb shaped lamp 1, heat from the LED module 20 can be efficiently radiated by convection of the rare gas.

  In the above embodiment, the LED module 20 employs a COB type structure in which an LED chip is directly mounted on the substrate 21 as a light emitting element. However, the present invention is not limited to this.

  For example, as a light emitting element, a package type comprising a resin container having a recess (cavity), an LED chip mounted in the recess, and a sealing member (phosphor-containing resin) enclosed in the recess. An LED element (SMD type LED element) may be employed. That is, the light bulb shaped lamp 1 may be provided with an SMD type LED module 20 configured by mounting a plurality of the LED elements on the substrate 21 on which the metal wiring is formed.

  Moreover, in said embodiment, although the white board | substrate was used as the board | substrate 21 of LED module 20, the surface of the back side of the two white board | substrates in which LED22 and the sealing member 23 were formed on the surface are mutually. One LED module 20 may be configured by bonding.

  In the above embodiment, the LED module 20 is configured to emit white light by the blue LED chip and the yellow phosphor. However, the present invention is not limited to this. For example, in order to improve color rendering properties, a red phosphor or a green phosphor may be further mixed in addition to the yellow phosphor. Moreover, it is also possible to use a phosphor-containing resin containing a red phosphor and a green phosphor without using a yellow phosphor, and to emit white light by combining this with a blue LED chip. it can.

  Moreover, in said embodiment, you may use the LED chip which light-emits colors other than blue as an LED chip. For example, when an ultraviolet light emitting LED chip is used, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.

  In the above embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, or a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be used.

  In addition, the form obtained by making various modifications conceived by those skilled in the art with respect to the embodiments and modifications, or arbitrarily combining the components and functions in the embodiments and modifications without departing from the gist of the present invention Embodiments realized by this are also included in the present invention.

1 Light bulb shaped lamp (light source for illumination)
DESCRIPTION OF SYMBOLS 2 Illuminating device 3 Lighting fixture 4 Appliance main body 4a Socket 5 Lamp cover 10 Globe 11 Opening part 20 LED module (light emitting module)
21 Substrate 22 LED
23 Sealing member 24 Metal wiring 25 Wire 26a, 26b Terminal 27a, 27b Insertion hole 30 Post 40 Base 40a Main surface 40b Back surface 41 Small diameter part 42 Large diameter part 43a, 43b, 46a, 46b, 47a, 47b Vent hole 43c, Recess 45 Base 50 Drive circuit 51 Circuit board 52 Circuit element 53a, 53b, 53c, 53d Lead wire 80 Housing 81 Main body part 82 Screw part 90 Base 90a Opening part 91 Shell part 92 Insulating part 93 Eyelet part 140a, 140b, 141a, 141b Lead wire hole 210 First space 220 Second space

Claims (7)

A light emitting module;
A glove arranged to cover the light emitting module;
A base for receiving power for light emission of the light emitting module from the outside;
A housing connected to the opening of the globe and the opening of the base;
A base that supports the light emitting module, comprising: a first space that is a space in the globe; and a base that partitions the second space formed by the space in the base and the space in the housing. ,
The base is formed with at least two vent holes for convection of gas between the first space and the second space,
The base includes a pedestal provided with the at least two vent holes, and a support provided to extend from the pedestal toward the inside of the globe,
The light emitting module is connected to the inner end of the globe of the support,
The at least two vent holes are disposed in a region of the pedestal other than a region where the support column is disposed. A lead wire electrically connected to the base is connected to the light emitting module,
The lead wire extends from the second space to the light emitting module in the first space in a state of passing through one of the at least two vent holes. Light source for illumination. The light source for illumination according to claim 2, wherein an outer diameter of the lead wire is ½ or less of an inner diameter of the one vent hole through which the lead wire passes. The one vent hole is provided with a concave portion provided in a concave shape from an inner surface of the one vent hole, and forming a space for accommodating at least a part of the outer periphery of the lead wire. Light source for lighting. A lead wire electrically connected to the base is connected to the light emitting module,
The base is further formed with a lead wire hole through which the lead wire is inserted,
The illumination light source according to claim 1, wherein the lead wire extends from the second space to the light emitting module in the first space in a state of passing through the lead wire hole. A drive circuit is housed in the housing,
The first space and the space in the base communicate with each of the at least two vent holes and a gap between the drive circuit and the inner surface of the housing. The light source for illumination according to any one of 5. An illumination device comprising the illumination light source according to any one of claims 1 to 6 .

Images