JP5493058B1 - Light bulb shaped lamp and lighting device - Google Patents

Abstract

  The light bulb shaped lamp (1) includes a globe (10), LED modules (20a) and (20b), and a column (40). The LED module (20a) includes a substrate (21) and a substrate (21). The LED module (20b) has an element array of LEDs (22b) provided on the front surface of the substrate, and the LED module (20b) includes an element array of LEDs (32) provided on the back surface of the substrate (21) and the substrate (21). The column (40) is disposed on the back side of the substrate (21), and the element array of the LEDs (22b) is disposed at a position facing the column (40) across the substrate (21).

Description

  The present invention relates to a light bulb shaped lamp and a lighting device, for example, a light bulb shaped lamp using a semiconductor light emitting element and a lighting device using the same.

  In recent years, semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be new light sources for various lamps because of their high efficiency and long life, and research and development of LED lamps using LEDs as light sources has been promoted. Yes.

  As such an LED lamp, there is a bulb-shaped LED lamp (bulb-shaped LED lamp). In the bulb-shaped LED lamp, an LED module including a substrate and a plurality of LEDs mounted on the substrate is used. For example, Patent Document 1 discloses a conventional bulb-type LED lamp.

JP 2006-313717 A

  By the way, in the conventional bulb-type LED lamp, a heat sink is used to dissipate heat generated by the LED, and the LED module is fixed to the heat sink. For example, in the light bulb-type LED lamp disclosed in Patent Document 1, a metal casing that functions as a heat sink is provided between a hemispherical globe and a base, and the LED module is placed on the upper surface of the metal casing. ing.

  Therefore, in such a conventional bulb-type LED lamp, the light emitted from the LED module to the heat sink side is blocked by the metal heat sink, so that all the incandescent bulbs, bulb-type fluorescent lamps, etc. The way the light spreads is different from a lamp having light distribution characteristics. That is, it is difficult to realize a wide light distribution angle similar to that of an incandescent bulb or a bulb-type fluorescent lamp with a conventional bulb-type LED lamp.

  Therefore, it is conceivable to use the same configuration as the incandescent bulb in the bulb-type LED lamp. That is, a bulb-type LED lamp having a configuration in which the filament coil of an incandescent bulb is simply replaced with an LED module without using a heat sink is conceivable. In this case, the light from the LED module is not blocked by the heat sink.

  However, the LED module used for the bulb-type LED lamp is usually configured to extract light from only one side of the substrate (the surface on which the LED is mounted). Therefore, even if the above-described replacement configuration is used, the luminous flux toward the base side of the bulb-type LED lamp is low, and it is difficult to realize a wide light distribution angle. On the other hand, another LED module that emits light toward the base can be added to the back surface (the surface on which the LED is not mounted) of the substrate of one LED module. However, in this case, the light emitted directly from the LED of one LED module passes through the substrate and is emitted as the light of the other LED module. Therefore, the light is emitted in all directions by the two LED modules. Color unevenness occurs.

  The present invention has been made to solve such a problem, and an object of the present invention is to provide a light bulb shaped lamp and an illumination device that have a wide light distribution angle and can suppress color unevenness.

  In order to solve the above-described problems, an aspect of a light bulb shaped lamp according to the present invention includes a translucent glove, a support column provided to extend inward of the glove, and the glove. A first light emitting element comprising a substrate and a plurality of first light emitting elements provided on a surface of the substrate. The sub-light-emitting module includes a substrate and a second light-emitting element group including a plurality of second light-emitting elements provided on the back surface of the substrate. It is arrange | positioned at the back surface side of a board | substrate, and the said 1st light emitting element group is arrange | positioned in the position facing the said support | pillar on both sides of the said board | substrate.

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the main light emitting module further includes a third light emitting element group composed of a plurality of third light emitting elements provided on the surface of the substrate, The third light emitting element may be disposed at a position facing the second light emitting element across the substrate.

  Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the substrate includes: a main substrate on which the first light emitting element group is provided on a surface; and a sub substrate on which the second light emitting element group is provided on the surface. The main substrate and the sub-substrate may be arranged such that back surfaces not provided with the first light emitting element group and the second light emitting element group are opposed to each other.

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the first light emitting element group is composed of a plurality of first light emitting elements connected in series, and the second light emitting element group is a plurality of connected in series. The third light emitting element group is composed of a plurality of third light emitting elements connected in series, the first light emitting element group, the second light emitting element group, and the third light emitting element group. Are made up of the same number of elements.

  Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the sub light emitting module is directly attached to the support column, and heat generated in the sub light emitting module is transferred to the support column, and the main light emitting module Is indirectly attached to the support via the sub-light-emitting module, and heat generated by the main light-emitting module is indirectly transferred to the support via the sub-light-emitting module. .

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, a heat conducting member may be provided between the main light emitting module and the sub light emitting module.

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the heat conducting member may be any one of a heat conducting resin, a ceramic paste, and a metal paste.

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the auxiliary light emitting module may be bonded and fixed to the support column.

  Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the substrate has a light reflectance of 50% with respect to light emitted from the first light emitting element group, the second light emitting element group, and the third light emitting element group. It can be said that it has the above.

Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the substrate may be mainly composed of any one of Al ₂ O ₃ , MgO, SiO, and TiO ₂ .

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the surface of the support column has a light reflectance with respect to light emitted from the first light emitting element group, the second light emitting element group, and the third light emitting element group. 30% or more.

  Furthermore, in one aspect of the light bulb shaped lamp according to the present invention, the support column may be mainly composed of any one of Al, Cu, and Fe.

  Furthermore, in an aspect of the light bulb shaped lamp according to the present invention, the main light emitting module has at least two or more first light emitting element groups, and the sub light emitting module has at least two or more second light emitting elements. It has an element group.

  Another embodiment of the lighting device according to the present invention includes the above-described light bulb shaped lamp.

  According to the present invention, it is possible to realize a light bulb shaped lamp and a lighting device with a simple structure having a wide light distribution angle.

FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 3 is a cross-sectional view of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 4 is a diagram showing a configuration of a light bulb shaped lamp according to an embodiment of the present invention, where (a) is a top view, and (b), (c), (d), and (e) are cross-sectional views. . FIG. 5 is an enlarged cross-sectional view of an LED in the LED module of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 6A is a top view showing a configuration of Modification 1 of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 6B is a top view showing the configuration of Modification 2 of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 6C is a cross-sectional view showing a configuration of Modification 3 of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 7 is a diagram showing a configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention, where (a) is a top view, and (b), (c), (d) and (e) are cross sections. FIG. FIG. 8 is a cross-sectional view of a modification of the light bulb shaped lamp according to the embodiment of the present invention. FIG. 9 is a schematic cross-sectional view of the illumination device according to the embodiment of the present invention.

  Hereinafter, embodiments of the present invention will be described in detail with reference to the drawings. Each of the embodiments described below shows a preferred specific example of the present invention. The numerical values, shapes, materials, constituent elements, arrangement positions and connecting forms of the constituent elements, steps, order of steps, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. The present invention is limited only by the claims. Therefore, among the constituent elements in the following embodiments, constituent elements that are not described in the independent claims showing the highest concept of the present invention are described as optional constituent elements. In the drawings, elements that represent substantially the same configuration, operation, and effect are denoted by the same reference numerals.

  First, the whole structure of the light bulb shaped lamp 1 according to the embodiment of the present invention will be described with reference to FIGS.

  FIG. 1 is a side view of a light bulb shaped lamp 1 according to the present embodiment. FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the present embodiment. FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the present embodiment.

  1 to 3, the upper side of the paper is the front of the light bulb shaped lamp 1, the lower side of the paper is the rear of the light bulb shaped lamp 1, and the left and right sides of the paper are the sides of the light bulb shaped lamp 1. Here, in this specification, “rear” refers to the direction of the base with respect to the substrate of the LED module, and “front” refers to the direction of the opposite side of the base with respect to the substrate of the LED module. That is, the “side” means a direction parallel to the main surface of the substrate of the LED module. 1 and 3, the alternate long and short dash line drawn in the vertical direction of the drawing indicates the lamp axis J (center axis) of the light bulb shaped lamp 1. The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown), and coincides with the rotation axis of the base.

  The light bulb shaped lamp 1 is an example of a light source for illumination, and is a light bulb shaped LED lamp (LED light bulb) that is a substitute for a light bulb shaped fluorescent lamp or an incandescent light bulb. The light bulb shaped lamp 1 includes a translucent globe 10, LED modules 20a and 20b that are light sources, a base 30 that receives power from the outside of the lamp, a support column 40, a support base 50, a resin case 60, a lead wire 70 and a lighting circuit 80.

  In the bulb-type lamp 1, an envelope is configured by the globe 10, the resin case 60 (first case portion 61), and the base 30.

[Glove]
The globe 10 houses the LED modules 20a and 20b. The globe 10 is a light-transmitting globe that is made of a material that is transparent to the light from the LED modules 20a and 20b, and transmits the light from the LED modules 20a and 20b to the outside of the lamp. Such a globe 10 can be a glass bulb (clear bulb) made of silica glass that is transparent to visible light. In this case, the LED modules 20 a and 20 b housed in the globe 10 can be viewed from the outside of the globe 10.

  The shape of the globe 10 is such that one end is closed in a spherical shape and the other end has an opening 11. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is formed at a position away from the center of the sphere. Has been. As the globe 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.

  The globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film may be formed by applying a resin containing a light diffusing material such as silica or calcium carbonate, a white pigment, or the like to the entire inner surface or outer surface of the globe 10. Moreover, the globe 10 does not need to be made of silica glass. For example, a globe 10 made of a resin material such as acrylic may be used.

[LED module]
The LED modules 20a and 20b are light emitting modules that have LEDs (LED chips) and emit light when electric power is supplied to the LEDs via the lead wires. The LED modules 20 a and 20 b are held in the hollow inside the globe 10 by the support column 40.

  The LED modules 20a and 20b are preferably arranged at a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Thus, by arranging the LED modules 20a and 20b at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil. .

  The detailed configuration of the LED modules 20a and 20b will be described later.

[Base]
The base 30 is a power receiving unit that receives electric power for causing the LEDs of the LED modules 20 a and 20 b to emit light from the outside of the light bulb shaped lamp 1. The base 30 receives AC power through two contacts, and the power received by the base 30 is input to the power input unit of the lighting circuit 80 via a lead wire. The base 30 is attached to a socket of a lighting fixture (lighting device), and turns on the light bulb shaped lamp 1 (LED modules 20a and 20b) by receiving power from the socket.

  For example, the base 30 is E-shaped, and a screwing portion for screwing into the socket of the lighting device is formed on the outer peripheral surface thereof, and a screwing portion for screwing the resin case 60 on the inner peripheral surface thereof. Is formed. The base 30 has a bottomed cylindrical shape made of metal. As the base 30, an E26 type or E17 type base or the like can be used as a screw-in type Edison type (E type) base. The base 30 may be a plug-in base.

[Support]
The support column 40 is a stem provided so as to extend from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10, and functions as a holding member that holds the LED modules 20 a and 20 b in the globe 10. One end of the column 40 is connected to the LED modules 20 a and 20 b, and the other end is connected to the support base 50.

  The support column 40 also functions as a heat dissipation member for dissipating heat generated in the LED modules 20a and 20b to the base 30 side. Accordingly, the heat radiation efficiency of the support column 40 can be increased by forming the support column 40 from a metal material having a high thermal conductivity, for example, aluminum having a thermal conductivity of 237 [W / m · K]. As a result, it is possible to suppress a decrease in light emission efficiency and lifetime of the LED due to temperature rise. In addition, the support | pillar 40 can also be comprised with resin etc.

  The support column 40 is configured by integrally molding a main shaft portion 41 and a fixed portion 42, for example. The main shaft portion 41 is a cylindrical member having a constant cross-sectional area. One end of the main shaft portion 41 is connected to the fixed portion 42, and the other end is connected to the support base 50. The fixing part 42 has a fixing surface to which the LED modules 20a and 20b are fixed, and this fixing surface is in contact with the back surfaces of the substrates of the LED modules 20a and 20b. The fixing portion 42 further has a protruding portion that protrudes from the fixing surface, and this protruding portion fits into a through hole provided in the substrate of the LED modules 20a and 20b. The LED modules 20a and 20b and the fixed surface are bonded to each other with a resin adhesive such as a silicone resin.

  The fixed portion 42 of the support column 40 has a cross-sectional area perpendicular to the lamp axis J (width in a direction perpendicular to the lamp axis J) larger than the main shaft portion 41 of the support column 40. The fixing portion 42 of the support column 40 has a cross-sectional area perpendicular to the lamp axis J in the direction toward the front of the light bulb shaped lamp 1, that is, the direction from the support base 50 toward the substrate of the LED modules 20a and 20b (the approaching direction). The shape becomes larger. In other words, the fixing portion 42 of the support column 40 has a shape in which the LED element array direction of the LED modules 20a and 20b and the width of the LED array direction in the element array are widened in the direction toward the front of the light bulb shaped lamp 1. have. Therefore, the column 40 has the largest cross-sectional area perpendicular to the lamp axis J on the fixing surface of the fixing portion 42 that contacts the substrates of the LED modules 20a and 20b. Thereby, the eclipse of the light of the LED module 20b by the support | pillar 40 can be suppressed, making the heat dissipation path from the LED module 20b to the support | pillar 40 wide. The main shaft portion 41 of the support column 40 may have such a shape that the width increases toward the substrate, or the width in the arrangement direction of the LED element rows may be constant.

  In addition, it is preferable that the fixed surface of the fixing | fixed part 42 of the support | pillar 40 is surface-treated so that the light of LED of the LED module 20b may be reflected. Thereby, it becomes possible to reflect the light which goes to the nozzle | cap | die 30 side of LED module 20b by a fixed surface, and to take out as light of LED module 20b.

[Support stand]
The support base (support plate) 50 is a support member that supports the support column 40 and is fixed to the resin case 60. The support base 50 is configured to be connected to the opening end of the opening 11 of the globe 10 and close the opening 11 of the globe 10. Specifically, the support base 50 is formed of a disk-shaped member having a stepped portion on the periphery, and the opening end of the opening 11 of the globe 10 is in contact with the stepped portion. And in this level | step-difference part, the support stand 50, the resin case 60, and the opening end of the opening part 11 of the globe 10 are adhere | attached with the adhesive agent.

  The support base 50 is made of a metal material having a high thermal conductivity such as aluminum, like the support column 40, so that the heat radiation efficiency of the LED modules 20a and 20b that conduct the heat of the support column 40 by the support table 50 is increased. It is done. As a result, it is possible to further suppress the decrease in light emission efficiency and lifetime of the LED due to temperature rise.

[Resin case]
The resin case 60 is an insulating case (circuit holder) that insulates the support column 40 and the base 30 and houses the lighting circuit 80. The resin case 60 has a large-diameter cylindrical first case portion 61 and a small-diameter cylindrical second. The case part 62 is comprised. The resin case 60 can be molded by, for example, polybutylene terephthalate (PBT).

  Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly radiated from the first case portion 61. The second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 30, and a screwing portion for screwing with the base 30 is formed on the outer peripheral surface of the second case portion 62. ing.

[Lead]
The two lead wires 70 are a pair of lead wires for supplying power for lighting the LED modules 20a and 20b from the lighting circuit 80 to the LED modules 20a and 20b. From the wire-like metal wires such as copper wires Can be configured. Each lead wire 70 is disposed in the globe 10, one end is electrically connected to the external terminals of the LED modules 20 a and 20 b, and the other end is electrically connected to the power output unit of the lighting circuit 80, in other words, the base 30. Has been. The lead wire 70 also functions as a support portion that supports the LED modules 20a and 20b by being partly connected to the external terminals of the LED modules 20a and 20b.

  The two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin that covers the core wire, and the LED modules 20a and 20b are not covered with the insulating resin and the surface is exposed. It is electrically connected via the core wire. At this time, the core wire may not be covered with the insulating resin between the portion of the two lead wires 70 protruding from the surface of the substrate 21 and the portion protruding from the back surface of the substrate 21 by 3 mm or less.

  The details of the connection relationship between the lead wire 70 and the LED modules 20a and 20b will be described later.

[Lighting circuit]
The lighting circuit 80 is a circuit unit for lighting the LEDs of the LED modules 20a and 20b, and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted. The lighting circuit 80 includes a circuit that converts AC power fed from the base 30 into DC power, and supplies the converted DC power to the LEDs of the LED modules 20 a and 20 b via the two lead wires 70.

  The light bulb shaped lamp 1 does not necessarily need to include the lighting circuit 80. For example, when direct-current power is directly supplied to the light bulb shaped lamp 1 from a lighting fixture or a battery, the light bulb shaped lamp 1 may not include the lighting circuit 80. Further, the lighting circuit 80 is not limited to a smoothing circuit, and a dimming circuit, a booster circuit, and the like can be appropriately selected and combined.

  Next, the detailed configuration of the LED modules 20a and 20b and the connection relationship between the LED modules 20a and 20b and the lead wire 70 will be described with reference to FIGS.

  FIG. 4 is a diagram showing a configuration of the light bulb shaped lamp 1 according to the present embodiment. FIG. 5 is an enlarged cross-sectional view of LEDs in the LED modules 20a and 20b of the light bulb shaped lamp 1 according to the present embodiment.

  4A is a plan view when the LED module 20a is viewed from above with the globe 10 removed from the light bulb shaped lamp 1. FIG. 4B is a cross-sectional view of the light bulb shaped lamp 1 cut along the line AA ′ in FIG. 4A, and FIG. 4C is the line BB ′ in FIG. FIG. 4D is a cross-sectional view of the light bulb shaped lamp 1 cut along the line CC ′ of FIG. 4A. (E) is a cross-sectional view of the same bulb shaped lamp 1 cut along the line DD ′ in (a).

  The LED module 20a is an example of a main light emitting module (first light emitting module), and has a COB (Chip On Board) structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 21. On the other hand, the LED module 20b is an example of a sub light emitting module (second light emitting module) and has a COB structure in which a bare chip is directly mounted on the back surface (the other main surface) of the substrate 21.

  The LED module 20a includes a substrate 21, a plurality of LEDs 22a and 22b provided on the surface of the substrate 21, sealing members 23a and 23b, metal wirings 24 and 26, wires 25, a conductive adhesive member 27, and terminals (external terminals). 28). On the other hand, the LED module 20 b includes a substrate 21, a plurality of LEDs 32 provided on the back surface of the substrate 21, a sealing member 33, metal wirings 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. Yes.

[substrate]
The substrate 21 can be a translucent substrate or a non-translucent substrate, such as a ceramic substrate made of aluminum oxide (alumina) or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or the like. . The substrate 21 is a rectangular mounting substrate (LED mounting substrate) for mounting the LEDs 22a, 22b, and 32. When the length of the long side of the substrate 21 is L1, the length of the short side is L2, and the thickness is d, for example, L1 = 26 mm, L2 = 13 mm, and d = 1 mm.

The substrate 21 is preferably composed of a white substrate such as a white alumina substrate having a low light transmittance with respect to light emitted from the LEDs 22a, 22b, and 32, for example, 10% or less, or a metal substrate. For example, the substrate 21 is a substrate that has a light reflectance of 50% or more with respect to light emitted from the LEDs 22a, 22b, and 32, and is mainly composed of any one of Al ₂ O ₃ , MgO, SiO, and TiO _2. Can be configured. When the light transmittance of the substrate 21 is high, in the LED module 20a, a part of the light of the LEDs 22a and 22b on the front surface side of the substrate 21 passes through the substrate 21 and then is emitted from the back surface side of the substrate 21. Similarly, in the LED module 20 b, a part of the light of the LED 32 on the back surface side of the substrate 21 is emitted from the front surface side of the substrate 21 after passing through the substrate 21. Therefore, in the light bulb shaped lamp 1, color unevenness occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color unevenness can be suppressed by reducing the light transmittance of the substrate 21. Further, since an inexpensive white substrate can be used, the cost of the light bulb shaped lamp 1 can be reduced.

  Two through holes 21b that penetrate from the front surface of the substrate 21 to the back surface are provided at both ends of the substrate 21 in the long side direction. These two through holes 21b constitute terminals 28 and 38 for connecting the power supply lead wire 70 and the LED modules 20a and 20b, and the lead wire 70 is inserted into each of the two through holes 21b. .

  In the central portion of the substrate 21, one through hole 21 a that penetrates from the front surface of the substrate 21 toward the back surface is provided. The through-hole 21a is for fixing the LED modules 20a and 20b to the support column 40, and the protruding portion 42b of the support column 40 is fitted into the through-hole 21a.

  In addition, even if there is no through-hole 21a, it is possible to fix the LED modules 20a and 20b to the column 40 with an adhesive. Accordingly, the through hole 21a may not be provided.

[LED]
A plurality of LEDs 22a and 22b are mounted on the surface of the substrate 21, respectively. The plurality of LEDs 22a includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22a in the element row of the LED 22a. They are arranged so that they are lined up. On the other hand, the plurality of LEDs 22b are arranged such that an element row arranged in a straight line with the same pitch in the long side direction of the substrate 21 is in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 22b in the element row of the LED 22b. A plurality of lines are arranged. At this time, the plurality of element rows of the LED 22 b are arranged so as to be positioned between the two element rows of the LED 22 a in the short side direction of the substrate 21.

  The plurality of LEDs 22a are connected in series in the element rows, and are connected in parallel in the element rows. Similarly, the plurality of LEDs 22b are also connected in series in the element rows, and are connected in parallel in the element rows. Furthermore, the element rows of the LED 22a and the element rows of the LED 22b are also connected in parallel. The element row of the LED 22b is an example of a first light emitting element group, and the element row of the LED 22a is an example of a third light emitting element group. For example, the plurality of LEDs 22a and 22b are arranged such that the interval (pitch) between adjacent LEDs in the element row is 1.8 mm. And the space | interval of LED which adjoins in the element row | line | column of LED22a and the element row | line | column of LED22b is arrange | positioned so that it may be set to 4 mm.

  Similarly, a plurality of LEDs 32 are mounted on the back surface of the substrate 21. The plurality of LEDs 32 includes a plurality of element rows arranged in a straight line at the same pitch in the long side direction of the substrate 21 in a direction perpendicular to the short side direction of the substrate 21, that is, the arrangement direction of the LEDs 32 in the element row of the LED 32. They are arranged so that they are lined up. The plurality of LEDs 32 are connected in series in the element rows, and are connected in parallel in the element rows. The element row of the LEDs 32 is an example of a second light emitting element group.

  The LED 22a is disposed so as to face the LED 32 with the substrate 21 interposed therebetween. For example, the entire lower surface of the LED 22a in contact with the substrate 21 is arranged so as to face the entire lower surface of the LED 32 in contact with the substrate 21. In this case, as shown in FIG. 4C, the entire LED 22a is present in the region F above the LED 32, and the entire LED 32 is present in the region E below the LED 22a. Therefore, the LED 22a is disposed to face the sealing member 33 with the substrate 21 and the LED 32 interposed therebetween, and the LED 32 is disposed to face the sealing member 23a with the substrate 21 and the LED 22a interposed therebetween.

  LED22b is arrange | positioned so that the fixed surface of the fixing | fixed part 42 of the support | pillar 40 may be opposed on both sides of the board | substrate 21. FIG. For example, the entire lower surface of the LED 22b in contact with the substrate 21 is disposed so as to face the fixing surface of the fixing portion 42 of the support column 40. In this case, as shown in FIG. 4C, the entire LED 22 b exists in the region X above the fixing surface of the fixing portion 42 of the support column 40.

  The LEDs 22a, 22b, and 32 are bare chips that emit monochromatic visible light in all directions, that is, sideward, upward, and downward. The LEDs 22a, 22b, and 32 emit, for example, 20% of the total light amount on the side, 60% of the total light amount on the upper side, and 20% of the total light amount on the lower side.

  The LEDs 22a, 22b, and 32 are rectangular (square) blue LED chips that emit blue light when energized, for example, each side having a length of about 0.35 mm (350 μm). As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

  As shown in FIG. 5, the LEDs 22a, 22b, and 32 include a sapphire substrate 122a and a plurality of nitride semiconductor layers 122b that are stacked on the sapphire substrate 122a and have different compositions.

  A cathode electrode 122c and an anode electrode 122d are provided at both ends of the upper surface of the nitride semiconductor layer 122b. A wire bond portion 122e is provided on the cathode electrode 122c, and a wire bond portion 122f is provided on the anode electrode 122d. For example, in adjacent LEDs 22a, the cathode electrode 122c of one LED 22a and the anode electrode 122d of the other LED 22a are connected by a wire 25 through wire bond portions 122e and 122f.

  The LEDs 22a, 22b and 32 are fixed on the substrate 21 with a translucent chip bonding material 122g so that the surface on the sapphire substrate 122a side faces the front surface or the back surface of the substrate 21. For the chip bonding material 122g, a silicone resin containing a filler composed of metal oxide can be used. By using a translucent material for the chip bonding material 122g, loss of light emitted from the side surface of the LED 22a can be reduced, and generation of shadows by the chip bonding material 122g can be suppressed.

[Sealing member]
The sealing member 23a is a conversion member that converts the wavelength of light emitted from the LED 22a, and is formed so as to cover the LED 22a. The sealing member 23a is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22a and a resin material that contains the wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by light emitted from the LED 22a and emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light. Note that a light diffusing material such as silica particles may be dispersed in the sealing member 23a.

  As such phosphor particles, when the LED 22a is a blue LED that emits blue light, phosphor particles that convert the wavelength of the blue light into yellow light are used in order to emit white light from the sealing member 23a. For example, YAG (yttrium / aluminum / garnet) -based yellow phosphor particles can be used as the phosphor particles. Thereby, a part of blue light emitted from the LED 22a is wavelength-converted into yellow light by the yellow phosphor particles contained in the sealing member 23a. And the blue light which was not absorbed by the yellow phosphor particles (the wavelength was not converted) and the yellow light which was wavelength-converted by the yellow phosphor particles were diffused and mixed in the sealing member 23a. The white light is emitted from the sealing member 23a. In addition to the yellow phosphor particles, green phosphor particles, red phosphor particles, and the like may be used as the phosphor particles. When the LED 22a is an LED 22a that emits ultraviolet rays, A combination of phosphor particles that emit light in the three primary colors (red, green, and blue) is used.

  On the other hand, as the resin material containing the phosphor particles, a transparent resin material such as a silicone resin, an organic material such as a fluorine-based resin, an inorganic material such as low-melting glass and sol-gel glass, and the like can be used.

  The sealing member 23a having the above-described configuration is formed in a straight line along the arrangement direction of the plurality of LEDs 22a constituting the element row, and collectively seals the element row of the LEDs 22a. At the same time, a plurality of sealing members 23a are formed along the arrangement direction of the element rows, and individually seal different element rows. Each sealing member 23a has a length of 24 mm, a line width of 1.6 mm, and a center maximum height of 0.7 mm, for example.

  Similarly, the sealing member 23b is a conversion member that converts the wavelength of light emitted from the LED 22b, and is formed to cover the LED 22b. The sealing member 23b is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 22b and a resin material containing the wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by the light emitted from the LED 22b and emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light.

  The sealing member 23b is linearly formed along the arrangement direction of the plurality of LEDs 22b constituting the element row, and collectively seals the element row of the LEDs 22b. At the same time, a plurality of sealing members 23b are formed along the arrangement direction of the element rows, and individually seal different element rows. At this time, the plurality of sealing members 23 b are formed so as to be positioned between the two sealing members 23 a in the short side direction of the substrate 21.

  Similarly, the sealing member 33 is a conversion member that converts the wavelength of light emitted from the LED 32, and is formed so as to cover the LED 32. The sealing member 33 is a sealing resin composed of a wavelength conversion material that converts the wavelength of light emitted from the LED 32 and a resin material that contains the wavelength conversion material. As the wavelength conversion material, phosphor particles that are excited by the light emitted from the LED 32 to emit light of a desired color (wavelength) can be used, or light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment. It is also possible to use a material containing a substance that emits light having a wavelength different from that of the absorbed light.

  The sealing member 33 is formed linearly along the arrangement direction of the plurality of LEDs 32 constituting the element row, and collectively seals the element rows of the LED 32. At the same time, a plurality of sealing members 33 are formed along the arrangement direction of the element rows, and individually seal different element rows.

  Note that the sealing members 23a, 23b, and 33 may be formed so as to individually cover the LEDs 22a, 22b, and 32, instead of collectively sealing a plurality of LEDs. In this case, each sealing member 23a, 23b, and 33 can be formed in a substantially hemispherical shape.

[Metal wiring, terminals]
Two metal wirings 26 are formed in an island shape in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element rows of the LEDs 22a and 22b and the terminals 28 in parallel. These two metal wirings 26 are formed on the surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 22a and 22b.

  The metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the LEDs 22 a and 22 b on the surface of the substrate 21. The protruding portion of the metal wiring 26 becomes a connection portion with the wire 25 from the LEDs 22a and 22b.

  Similarly, two metal wirings 36 are formed in an island shape in a predetermined shape at both ends of the substrate 21 in order to electrically connect the element array of the LED 32 and the terminal 38 in parallel. These two metal wirings 36 are formed on the back surface of the substrate 21 so as to sandwich the element rows of the plurality of LEDs 32.

  The metal wiring 36 protrudes toward the element row at a portion adjacent to the element row of the LED 32 on the back surface of the substrate 21. The protruding portion of the metal wiring 36 becomes a connection portion with the wire 35 from the LED 32.

  The terminal 28 is a power supply electrode provided with the conductive adhesive member 27, for example, a solder electrode to be soldered, and the surface of the substrate 21 so as to surround the through hole 21b and the opening on the surface side of the substrate 21 of the through hole 21b. And a connection land formed in a predetermined shape. Two terminals 28 are formed corresponding to each of the two metal wirings 26. The pair of terminals 28 are formed integrally with the corresponding metal wiring 26 and are connected by being in contact with the corresponding metal wiring 26. One wiring pattern is constituted by such a corresponding set of metal wirings 26 and terminals 28.

  The terminal 28 is a power supply unit of the LED module 20a, and receives power from the outside of the LED module 20a in order to cause the LEDs 22a and 22b to emit light, and receives the received power via the metal wirings 26 and 24 and the wire 25. 22b. The terminals 28 and 38 are arranged so as to be substantially concentric.

  Similarly, the terminal 38 is a power supply electrode on which the conductive adhesive member 37 is provided, and is formed in a predetermined shape on the back surface of the substrate 21 so as to surround the through hole 21b and the opening on the back surface side of the substrate 21 of the through hole 21b. And a connecting land. Two terminals 38 are formed corresponding to each of the two metal wirings 36. The pair of terminals 38 are formed integrally with the corresponding metal wiring 36 and are connected by being in contact with the corresponding metal wiring 36. One wiring pattern is constituted by such a corresponding set of metal wirings 36 and terminals 38.

  The terminal 38 is a power feeding unit of the LED module 20b, and receives power from the outside of the LED module 20b in order to cause the LED 32 to emit light, and supplies the received power to each LED 32 via the metal wirings 36 and 34 and the wire 35. .

  A plurality of metal wirings 24 are formed in a predetermined shape on the surface of the substrate 21 in order to electrically connect the plurality of LEDs 22a and 22b in series. The plurality of metal wirings 24 are formed in an island shape on the surface of the substrate 21 between the LEDs 22a and 22b adjacent in the element array.

  Similarly, a plurality of metal wirings 34 are formed in a predetermined shape on the back surface of the substrate 21 in order to electrically connect a plurality of LEDs 32 in series. The plurality of metal wirings 34 are formed in an island shape between the LEDs 32 adjacent in the element row on the back surface of the substrate 21.

  The metal wirings 26 and 24 and the terminals 28 having the above-described configuration are simultaneously patterned with the same metal material. As the metal material, for example, silver (Ag), tungsten (W), copper (Cu), or the like can be used. The metal wirings 26 and 24 and the surface of the terminal 28 may be plated with nickel (Ni) / gold (Au) or the like. Moreover, the metal wirings 26 and 24 and the terminal 28 may be comprised by a different metal material, and may be formed in a separate process.

  Similarly, the metal wirings 36 and 34 and the terminal 38 are simultaneously patterned with the same metal material.

[wire]
The wire 25 is an electric wire for connecting the LEDs 22a and 22b and the metal wiring 26, or the LEDs 22a and 22b and the metal wiring 24, and is, for example, a gold wire. As described with reference to FIG. 5, the metal wire 26 or the metal wire 24 formed adjacent to the wire bond portions 122e and 122f provided on the upper surfaces of the LEDs 22a and 22b and both sides of the LEDs 22a and 22b. And are wire-bonded.

  For example, the wire 25 is entirely embedded in the sealing members 23a and 23b so as not to be exposed from the sealing members 23a and 23b.

  Similarly, the wire 35 is an electric wire for connecting the LED 32 and the metal wiring 36 or the LED 32 and the metal wiring 34. As described with reference to FIG. 5, the wire 35 allows wire bonding between the wire bonding portions 122 e and 122 f provided on the upper surface of the LED 32 and the metal wiring 36 or the metal wiring 34 formed adjacent to both sides of the LED 32. Has been.

  For example, the entire wire 35 is embedded in the sealing member 33 so as not to be exposed from the sealing member 33.

[Conductive member]
The conductive adhesive member 27 is a conductive adhesive such as solder or silver paste that connects the terminal 28 to the lead wire 70. The conductive adhesive member 27 is provided in contact with both the terminal 28 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 28. The conductive adhesive member 27 is provided so as to close the opening on the surface side of the substrate 21 of the through hole 21b.

  Similarly, the conductive adhesive member 37 is a conductive adhesive that connects the terminal 38 to the lead wire 70. The conductive adhesive member 37 is provided in contact with both the terminal 38 and the lead wire 70 so as to cover the side surface of one end of the lead wire 70 on the surface of the terminal 38. The conductive adhesive member 37 is provided so as to close the opening on the back surface side of the substrate 21 of the through hole 21b.

  Here, the conductive adhesive member 27 may be covered with an insulating resin. The insulating resin may be a white resin having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less.

  In the LED modules 20a and 20b in FIG. 4, after the members except the conductive adhesive members 27 and 37 are provided on the front surface and the back surface of the substrate 21, the two lead wires 70 and the terminals 38 are connected by the conductive adhesive member 27. It is formed by connecting and connecting the two lead wires 70 and the terminal 28 by the conductive adhesive member 37. At this time, in the electrical connection between the lead wire 70 and the terminal 38, first, the lead wire 70 is provided so as to be inserted from the opening on the back surface side of the through hole 21b and protrude from the opening on the front surface side of the through hole 21b. Thereafter, a conductive adhesive member 37 is provided so as to be in contact with both the rear surface side portion of the lead wire 70 and the terminal 38, and the conductive adhesive member 27 is provided so as to be in contact with both the front surface portion and the terminal 28. Provided. Therefore, the terminal 28 and the terminal 38 are connected by the lead wire 70. The terminals 28 and 38 are connected to the same lead wire 70, and the plurality of LEDs 22 a and 22 b on the front surface of the substrate 21 and the plurality of LEDs 32 on the back surface of the substrate 21 are connected in parallel to the lead wire 70. That is, the LED module 20 a and the LED module 20 b are electrically connected in parallel via the pair of lead wires 70.

  In the LED module 20a of FIG. 4, the current supplied to one of the positive lead wires 70 passes through the conductive adhesive member 27, the terminal 28, the metal wiring 26, the LEDs 22a and 22b, and the metal wiring 24. It is output from the other negative lead wire 70. Similarly, in the LED module 20b, the current supplied to one positive-side lead wire 70 passes through the conductive adhesive member 37, the terminal 38, the metal wiring 36, the LED 32, and the metal wiring 34, and the other negative-side lead wire 70. Output from the lead wire 70.

  Further, in the LED module 20b of FIG. 4, the back surface of the substrate 21 and the fixed surface of the fixing portion 42 of the support column 40 are brought into contact with each other. Each member is not provided. Therefore, on the back surface of the substrate 21, the element rows of the plurality of LEDs 32 are provided so as to sandwich the fixing portion 42, and the interval between the element rows is larger than the interval between other element rows in the element row sandwiching the fixing portion 42 of the support column 40. It is getting bigger.

  In the LED modules 20a and 20b of FIG. 4, the conductive adhesive members 27 and 37 are provided apart from each other with a space in the through hole 21b. However, since the plurality of LEDs 22a, 22b and 32 are connected in parallel to the lead wire 70, there is no particular problem even if the conductive adhesive members 27 and 37 are in contact with each other. Therefore, the conductive adhesive members 27 and 37 may be provided as a single adhesive member instead of separate members. That is, one conductive member may be provided continuously in the through hole 21 b, on the surface of the substrate 21, and on the back surface of the substrate 21 so as to contact the terminals 28 and 38 and the lead wire 70. .

  Further, in the LED module 20 a of FIG. 4, the tip of the lead wire 70 is provided so as to be exposed on the surface of the conductive adhesive member 27, but it may be completely covered with the conductive adhesive member 27. In this case, since the contact area between the lead wire 70 and the conductive adhesive member 27 increases, the connection between the two can be strengthened.

  As described above, the light bulb shaped lamp 1 according to the present embodiment includes the globe 10, the support column 40 provided so as to extend inward of the globe 10, and the light bulb shaped lamp 1 that is disposed in the globe 10 and fixed to the support column 40. LED modules 20a and 20b are provided. The LED module 20 a includes a substrate 21 and an element array of LEDs 22 b provided on the surface of the substrate 21, and the LED module 20 b includes an element of the LED 21 provided on the substrate 21 and the back surface of the substrate 21. And a row. And the support | pillar 40 is arrange | positioned at the back surface side of the board | substrate 21, and the element row | line | column of LED22b is arrange | positioned in the position facing the support | pillar 40 on both sides of the board | substrate 21. FIG.

  In the light bulb shaped lamp 1 of the present embodiment, the LED 22a is composed of a plurality of LEDs 22a connected in series, and the LED 22b is connected to a plurality of LEDs 22b connected in series. And the element row | line | column of LED32 is comprised from several LED32 connected in series. And the element row | line | column of LED22a, the element row | line | column of LED22b, and the element row | line | column of LED32 are comprised from LED of the same number.

  Further, in the light bulb shaped lamp 1 of the present embodiment, the surface of the support column 40 has a light reflectance of 30% or more with respect to the light emitted from the element rows of the LEDs 22a and 22b and the element row of the LEDs 32. And the support | pillar 40 has either Al, Cu, and Fe as a main component.

  Further, in the light bulb shaped lamp of the present embodiment, the LED module 20a has an element array of a plurality of LEDs 22a and an element array of a plurality of LEDs 22b, and the LED module 20b has an element array of a plurality of LEDs 32.

  Thereby, since the light bulb shaped lamp 1 emits light from both surfaces of the substrate 21, light is taken out from the front and rear of the light bulb shaped lamp 1, and the light bulb shaped lamp 1 having a wide light distribution angle can be realized.

  Further, the light of the LED 22b that is transmitted through the substrate 21 and is emitted from the back surface of the substrate 21 is reflected or absorbed by the fixing surface of the fixing portion 42 of the support column 40 facing the LED 22b, is blocked, and is emitted as light of the LED module 20b. Absent. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.

  Further, in the light bulb shaped lamp 1 of the present embodiment, the LED module 20a further includes an element array of the LEDs 22a provided on the surface of the substrate 21, and the LED 22a is opposed to the LEDs 32 with the substrate 21 interposed therebetween. Is arranged. Thereby, the light of LED32 which permeate | transmits the board | substrate 21 and is emitted from the surface of the board | substrate 21 is reflected or absorbed by LED22a which opposes LED32, is light-shielded, and is not emitted as light of the LED module 20a. Similarly, the light of the LED 22a that is transmitted through the substrate 21 and is emitted from the back surface of the substrate 21 is reflected or absorbed by the LED 32 facing the LED 22a to be blocked, and is not emitted as light of the LED module 20b. Therefore, color unevenness can be suppressed for light emitted in all directions by the LED modules 20a and 20b.

  Further, in the light bulb shaped lamp 1 of the present embodiment, power is supplied to the LED modules 20a and 20b simply by connecting the lead wire 70 through the through-hole 21b to the two terminals 28 and 38 by the conductive adhesive members 27 and 37. It is realized by connecting with. Therefore, compared to a configuration in which the lead wire 70 is connected to one of the terminals 28 and 38 and the terminal 28 and the terminal 38 are connected by a via hole or the like, a configuration of a via hole or the like that connects the terminal 28 and the terminal 38 is unnecessary. It becomes. In addition, the number of lead wires 70 can be halved compared to a configuration in which separate lead wires 70 are connected to the terminals 28 and 38. As a result, the light bulb shaped lamp 1 having a simple structure can be realized.

Moreover, in the light bulb shaped lamp 1 of the present embodiment, the substrate 21 has a light reflectance of 50% or more with respect to the light emitted from the element rows of the LEDs 22a and 22b and the element row of the LEDs 32. Then, the substrate 21 is, for _{Al 2 O 3, MgO, SiO} , and one of TiO ₂ as a main component. Thereby, the light transmittance of the board | substrate 21 can be made low and the color nonuniformity of the light emitted from LED module 20a and 20b can be suppressed. Further, it is possible to reduce the cost of the light bulb shaped lamp 1 by using a low-cost white substrate for the substrate 21.

  Further, in the light bulb shaped lamp 1 of the present embodiment, the back surface of the substrate 21 is bonded and fixed to the column 40 so as to be in contact with the column 40, and the LED modules 20 a and 20 b are directly fixed to the column 40. . Thereby, the thermal radiation efficiency of the board | substrate 21 can be improved. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LEDs 22a, 22b, and 32 due to a temperature rise.

  In the light bulb shaped lamp 1 of the present embodiment, in the LED module 20a, the LEDs 22b are mounted so that all the LEDs in the element row of the LEDs 22b face the fixing surface of the fixing portion 42 of the support column 40. However, as shown in FIG. 6A, the LEDs 22b may be mounted such that only some of the LEDs in the element array of the LEDs 22b face the fixing surface of the fixing portion 42 of the support column 40. FIG. 6A is a top view showing a configuration of Modification 1 of the light bulb shaped lamp 1 according to the present embodiment, and shows a state when the LED module 20a is viewed from above without the globe 10. FIG. .

  Further, in the light bulb shaped lamp 1 of the present embodiment, in the LED module 20a, the element array of the LED 22a and the element array of the LED 22b are composed of the same number of LEDs, and the sealing member 23a and the sealing member 23b include the substrate 21. The lengths in the long side direction are assumed to be substantially the same. However, as shown in FIG. 6B, the element array of the LED 22b has a smaller number of LEDs than the element array of the LED 22a, and the sealing member 23b has the sealing member 23a with respect to the length in the long side direction of the substrate 21. It may be shorter. FIG. 6B is a top view showing a configuration of Modification 2 of the light bulb shaped lamp 1 according to the present embodiment, and shows a state when the LED module 20a is viewed from above without the globe 10. FIG. .

  In the light bulb shaped lamp 1 of the present embodiment, the LEDs 32 and the LEDs 22a are mounted on the substrate 21 so that the mounting region of the LEDs 22a on the front surface of the substrate 21 and the mounting region of the LEDs 32 on the back surface of the substrate 21 face each other. It was. However, as shown in FIG. 6C, the LED 32 and the LED 22a may be mounted on the substrate 21 so that the non-mounting area of the LED 22a and the mounting area of the LED 32 face each other. In other words, the LED 22a may be disposed to face the sealing member 33 with the substrate 21 interposed therebetween, and the LED 32 may be disposed to face the sealing member 23a with the substrate 21 interposed therebetween. For example, the entire lower surface of the LED 22a in contact with the substrate 21 may be disposed to face the sealing member 33, and the entire lower surface of the LED 32 in contact with the substrate 21 may be disposed to face the sealing member 23a. In this case, the entire LED 22a is present in the region F above the sealing member 33, and the entire LED 32 is present in the region E below the sealing member 23a. FIG. 6C is a cross-sectional view showing a configuration of Modification 3 of the light bulb shaped lamp according to the present embodiment, and corresponds to a cross-sectional view taken along line B-B ′ of FIG.

  In the configuration of FIG. 6C, the LEDs 32 are arranged so as to be shifted toward the support column 40 with respect to the LEDs 22 a in the short side direction of the substrate 21. In the short side direction of the substrate 21, the LEDs 22a and 32 have one end of the LED 22a coincident with the position of one end of the sealing member 33, and the one end of the LED 32 coincides with the position of one end of the sealing member 23a. Are arranged as follows. The LEDs 22a and 32 are mounted such that the non-mounting area of the LED 22a on the front surface of the substrate 21 and the mounting area of the LED 32 on the back surface of the substrate 21 face each other. Thereby, the heat | fever of LED22a and 22b can be efficiently radiated | emitted to the support | pillar 40 efficiently.

  In the configuration of FIG. 6C, the sealing member 23 a is arranged so as to be shifted to the opposite side of the support column 40 with respect to the sealing member 33 in the short side direction of the substrate 21. The sealing member 23 a is provided so that at least a part thereof is positioned above the LED 32 and is in contact with the surface of the substrate 21 above the LED 32. The sealing member 23 a located above the LED 32 converts the wavelength of the light of the LED 32 that is transmitted from the substrate 21 and emitted from the surface of the substrate 21 (the light of the LED 32 that passes through the surface of the substrate 21).

  In the configuration of FIG. 6C, the sealing member 33 is disposed so as to be shifted toward the support column 40 with respect to the sealing member 23 a in the short side direction of the substrate 21. The sealing member 33 is provided so that at least a part thereof is located below the LED 22a and is in contact with the back surface of the substrate 21 below the LED 22a. The sealing member 33 located below the LED 22a converts the wavelength of the light of the LED 22a that is transmitted from the back surface of the substrate 21 through the substrate 21 (the light of the LED 22a that passes through the back surface side of the substrate 21).

  At this time, the sealing member 33 may be disposed so as to be shifted with respect to the sealing member 23 a in the short side direction of the substrate 21, and may be disposed so as to be shifted to the side opposite to the support column 40. Even in this case, since the width of the sealing members 23a and 33 is larger than the width of the LEDs 22a and 32 in the short side direction of the substrate 21, the LED 22a is opposed to the sealing member 33 and the LED 32 is opposed to the sealing member 23a. Can do.

  In the configuration of FIG. 6C, the light of the LED 32 transmitted through the substrate 21 and emitted from the surface of the substrate 21 is wavelength-converted by the sealing member 23a facing the LED 32 and emitted as the light of the LED module 20a. Similarly, the light of the LED 22a transmitted through the substrate 21 and emitted from the back surface of the substrate 21 is wavelength-converted by the sealing member 33 facing the LED 22a and emitted as light of the LED module 20b. For example, high-intensity blue light emitted directly above the LED 32 is wavelength-converted by the sealing member 23a and emitted as white light, and high-intensity blue light emitted directly below the LED 22a is emitted by the sealing member 33. Wavelength converted and emitted as white light. Therefore, color unevenness can be suppressed for the light emitted from the LED modules 20a and 20b in all directions.

(Modification)
The light bulb shaped lamp 1 of the above embodiment forms two LED modules 20a and 20b by providing a light source and wiring for emitting light on both the front and back surfaces of a single substrate 21, and the light bulb shaped lamp 1 It was assumed that light was extracted to the base side and the opposite side. However, it is also possible to provide a light source and wiring for emitting light separately on the surfaces of two separate substrates, and bond the back surfaces of the two substrates to form one substrate 21. The light can be extracted. Therefore, the light bulb shaped lamp according to this modification is the above-described embodiment in that the substrate 21 of the LED module is configured by bonding two substrates each having a light source and wiring for emitting light on the surface thereof with an adhesive. Different from the bulb-type lamp 1 of FIG. Hereinafter, the difference from the light bulb shaped lamp 1 of the above-described embodiment will be described in detail.

  FIG. 7 is a diagram showing a configuration of a light bulb shaped lamp according to a modification of the embodiment of the present invention.

  In addition, (a) of FIG. 7 is a top view when the LED module 120a is seen from the upper side in the state which remove | excluded the globe 10 in the lightbulb-shaped lamp which concerns on this modification. 7B is a cross-sectional view of the same light bulb shaped lamp cut along the line AA ′ in FIG. 7A, and FIG. 7C is a line BB ′ in FIG. FIG. 7D is a cross-sectional view of the light bulb shaped lamp cut along the line CC ′ in FIG. 7A, and FIG. ) Is a cross-sectional view of the light bulb shaped lamp cut along the line DD ′ in FIG.

  The LED module 120a is an example of a main light emitting module (first light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 29. On the other hand, the LED module 120b is an example of a sub light emitting module (second light emitting module), and has a COB structure in which a bare chip is directly mounted on the surface (one main surface) of the substrate 39.

  The LED module 120a includes a substrate 29, a plurality of LEDs 22a and 22b, sealing members 23a and 23b, metal wirings 24 and 26, wires 25, a conductive adhesive member 27, and terminals 28 provided on the surface of the substrate 29. I have. On the other hand, the LED module 120 b includes a substrate 39, a plurality of LEDs 32 provided on the surface of the substrate 39, a sealing member 33, metal wirings 34 and 36, a wire 35, a conductive adhesive member 37, and a terminal 38. Yes.

  The substrate 29 is an example of a main substrate, and the substrate 39 is an example of a sub-substrate.

[substrate]
The substrates 29 and 39 have the same configuration and shape as each other, and the back surfaces of the substrates 29 and 39 are bonded together by an adhesive 90 to form one substrate 21. For the substrates 29 and 39, a light-transmitting substrate or a non-light-transmitting substrate can be used, for example, a ceramic substrate made of aluminum oxide or aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or the like. . The substrate 29 is a rectangular mounting substrate for mounting the LEDs 22a and 22b, and the substrate 39 is a rectangular mounting substrate for mounting the LEDs 32.

The substrates 29 and 39 are preferably made of a white substrate such as a white alumina substrate having a low light transmittance with respect to the light emitted from the LEDs 22a, 22b and 32, for example, 10% or less. For example, the substrates 29 and 39 have a light reflectance of 50% or more with respect to the light emitted from the LEDs 22a, 22b, and 32, and are mainly composed of any one of Al ₂ O ₃ , MgO, SiO, and TiO _2. It can be composed of a substrate. Thereby, the light transmittance as the board | substrate 21 can be made low, and the color nonuniformity of the light emitted from LED module 120a and 120b can be suppressed. Moreover, the low cost white board | substrate can be used for the board | substrates 29 and 39, and a light bulb-type lamp can be reduced in cost.

  Two through holes 29b are provided at both ends in the long side direction of the substrate 29 so as to penetrate from the front surface to the back surface of the substrate 29. Two through-holes 39b penetrating toward are provided. The through hole 29b constitutes a terminal 28 for connecting the lead wire 70 for power feeding and the LED module 120a, and the through hole 39b is a terminal 38 for connecting the lead wire 70 for power feeding and the LED module 120b. Is configured. The through holes 29 b and 39 b are arranged so as to be continuous to form the through hole 21 b of the substrate 21. Therefore, one lead wire 70 is inserted through one continuous through hole 29b and 39b.

  One through-hole 29 a that penetrates from the front surface of the substrate 29 toward the back surface is provided in the central portion of the substrate 29, and one penetration that penetrates from the front surface of the substrate 39 toward the back surface also in the central portion of the substrate 39. A hole 39a is provided. The through holes 29 a and 39 a are for fixing the LED modules 120 a and 120 b to the support column 40, and are arranged so as to form one through hole 21 a of the substrate 21. Accordingly, the protrusion 42b of the support column 40 is fitted into the continuous through holes 29a and 39a.

[adhesive]
The adhesive 90 is provided between the back surface of the substrate 29 and the back surface of the substrate 39 and adheres both, and is made of, for example, a resin such as a silicone resin or a metal paste such as an Ag paste. In the case of the metal paste, the thermal conductivity between the substrate 29 and the substrate 39 is increased and the thermal conductivity as the substrate 21 is increased, so that the heat dissipation efficiency of the substrate 21 can be increased. As a result, it is possible to suppress a decrease in luminous efficiency and lifetime of the LEDs 22a, 22b, and 32 due to a temperature rise. In addition, since the light shielding property of the adhesive 90, that is, the light shielding property of the substrate 21 can be improved, color unevenness due to light traveling from the front surface to the back surface of the substrates 29 and 39 can also be suppressed.

  The adhesive 90 prevents at least a part of the space between the through holes 29b and 39b between the back surface of the substrate 29 and the back surface of the substrate 39 so that the lead wire 70 does not interfere with the insertion of the through holes 29b and 39b. Is not provided. Further, the adhesive 90 does not interfere with the fitting between the through holes 29a and 39a and the protrusions of the support column 40, and between the through holes 29a and 39a between the back surface of the substrate 29 and the back surface of the substrate 39. It is not provided in all of the spaces.

  In the manufacture of the LED modules 120a and 120b in FIG. 7, first, a plurality of LEDs 22a and 22b, sealing members 23a and 23b, metal wirings 24 and 26, wires 25, and terminals 28 are provided on the surface of the substrate 29. Similarly, a plurality of LEDs 32, a sealing member 33, metal wirings 34 and 36, wires 35 and terminals 38 are provided on the surface of the substrate 39. Then, after the substrates 29 and 39 are bonded by the adhesive 90, the two lead wires 70 and the terminal 28 are connected by the conductive adhesive member 27, and the two lead wires 70 and the terminal 38 are connected by the conductive adhesive member 37. Is connected. Therefore, the LED modules 120a and 120b can be easily manufactured as compared with the case where a light source and wiring for emitting light are provided on both the front and back surfaces of one substrate 29.

  As described above, in the light bulb shaped lamp according to the present modification, a light bulb shaped lamp having a wide light distribution angle and capable of suppressing color unevenness for the same reason as the light bulb shaped lamp 1 of the above embodiment. Can be realized.

  Further, in the light bulb shaped lamp according to this modification, the substrate 21 includes a substrate 29 on which the element rows of the LEDs 22a and 22b are provided on the surface, and a substrate 39 on which the element row of the LEDs 32 is provided on the surface. The substrates 29 and 39 are arranged so that the back surfaces of the LED 22a and 22b and the LED 32 are not provided with the back surfaces thereof. At this time, the LED module 120b may be bonded and fixed to the support column 40. As a result, the LED modules 120a and 120b can be manufactured simply by preparing the separate substrates 29 and 39 and individually providing the respective members on the respective surfaces, and then bonding them, so that the LED modules 120a and 120b can be manufactured. Can be made easier. As a result, a light bulb shaped lamp that is easy to manufacture can be realized.

  In the light bulb shaped lamp according to this modification, the LED module 120 b is directly attached to the support column 40, and heat generated by the LED module 120 b is transferred to the support column 40. And the LED module 120a is indirectly attached to the support | pillar 40 via the LED module 120b, and the heat generated in the LED module 120a is indirectly transferred to the support 40 via the LED module 120b. An adhesive 90 as a heat conducting member is provided between the LED modules 120a and 120b. The adhesive 90 is any one of a heat conductive resin, a ceramic paste, and a metal paste. As a result, the heat dissipation efficiency and light shielding performance of the substrate 21 can be improved, so that the light emission efficiency and lifetime of the LEDs 22a, 22b and 32 are further suppressed, and at the same time, the color unevenness of the light emitted from the LED modules 120a and 120b is further suppressed. can do.

  In the light bulb shaped lamp according to this modification, the substrate 39 has a through-hole 39b that penetrates from the front surface to the back surface of the substrate 39, and the support column 40 penetrates the through-hole 39b of the substrate 39. You may contact the back side. That is, the through hole 39 b may be formed so as to fit the entire fixing portion 42 of the support column 40, and the fixing surface of the fixing portion 42 of the support column 40 and the back surface of the substrate 29 may be bonded by the adhesive 90. Thereby, the LED modules 120a and 120b can be easily fixed to the support column 40, and a light bulb shaped lamp that can be easily manufactured can be realized. Further, the LED module 120a is bonded and fixed to the support column 40 to shorten the heat dissipation path from the substrate 29 to the support column 40, and the inner wall of the through hole 39b of the substrate 39 and the fixing portion 42 of the support column 40 are thermally conductive such as grease. The heat dissipation path from the substrate 39 to the support column 40 can be widened by contacting through the member. As a result, it is possible to further suppress the light emission efficiency and lifetime of the LEDs 22a, 22b, and 32.

  As described above, the light bulb shaped lamp according to the present invention has been described based on the embodiments, but the present invention is not limited to these embodiments. The present invention includes various modifications made by those skilled in the art without departing from the scope of the present invention. Moreover, you may combine each component in several embodiment arbitrarily in the range which does not deviate from the meaning of invention.

  For example, in the above embodiments and modifications, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, an EL element such as an organic EL (Electro Luminescence) or an inorganic EL, or other solid state light emitting element. May be used.

  Further, in the above-described embodiments and modifications, the LED module has a COB type configuration in which LEDs are directly mounted on a substrate. However, the present invention is not limited to this. For example, a package type in which an LED chip is mounted in a cavity (concave portion) of a resin molded container and a phosphor-containing resin is enclosed in the cavity, that is, a surface mount type (SMD) LED element It is possible to use an LED module configured by mounting a plurality of SMD type LED elements on a substrate as light emitting elements. In particular, an SMD type LED module having a light-transmitting property with respect to LED light may be used.

  In the above-described embodiments and modifications, a plurality of element rows are provided on each of the front and back surfaces of the substrate. However, only one element row may be provided.

  Further, in the above-described embodiment and modification, the LED arrangement direction is parallel in the LED element arrays on the front and back surfaces of the substrate, and the predetermined direction included in the plane of the substrate intersects, for example, is orthogonal to the alignment direction. Although the short side direction of the substrate is shown as an example of this direction, the predetermined direction is not limited to the short side direction.

  Further, in the above-described embodiment and modification, the LED element array is provided on the surface of the substrate other than above the support column. However, the LED may be provided only above the support column.

  In the above embodiment and modification, the lead wire is provided outside the support column. However, as shown in the cross-sectional view of the light bulb shaped lamp in FIG. May be provided in the column cavity. In this case, after the lead wire enters the cavity in the column directly from the support base, it jumps out from the upper side surface of the column in the vicinity of the LED module and is connected to the LED module. Thereby, it can reduce that the light of an LED module is shielded by a lead wire. In FIG. 8, the lead wire is provided so as to pierce the substrate from the back surface side of the substrate, but the lead wire may be provided so as to pierce from the front surface side of the substrate by wrapping around to the front surface side of the substrate.

  Moreover, this invention can also be implement | achieved as an illuminating device provided with said bulb-type lamp. For example, as shown in FIG. 9, the lighting device 100 according to the present invention may be configured to include the light bulb shaped lamp 1 and a lighting fixture (lighting fixture) 200 to which the light bulb shaped lamp 1 is attached. Good. In this case, the lighting device 200 is for turning off and lighting the light bulb shaped lamp 1 and includes, for example, a device main body 210 attached to the ceiling and a lamp cover 220 covering the light bulb shaped lamp 1. Among these, the appliance main body 210 has a socket 211 to which the cap of the light bulb shaped lamp 1 is attached and which supplies power to the light bulb shaped lamp 1. A translucent plate may be provided in the opening of the lamp cover 220.

  INDUSTRIAL APPLICABILITY The present invention is useful as a light bulb shaped lamp that replaces a conventional incandescent light bulb and the like, and can be widely used in lighting devices and the like.

DESCRIPTION OF SYMBOLS 1 Light bulb-shaped lamp 10 Globe 11 Opening part 20a, 20b, 120a, 120b LED module 21, 29, 39 Board | substrate 21a, 21b, 29a, 29b, 39a, 39b Through-hole 22a, 22b, 32 LED
23a, 23b, 33 Sealing member 24, 26, 34, 36 Metal wiring 25, 35 Wire 27, 37 Conductive adhesive member 28, 38 Terminal 30 Base 40 Support column 41 Main shaft portion 42 Fixing portion 42b Protruding portion 50 Support base 60 Resin Case 61 First case part 62 Second case part 70 Lead wire 80 Lighting circuit 90 Adhesive 122a Sapphire substrate 122b Nitride semiconductor layer 122c Cathode electrode 122d Anode electrode 122e, 122f Wire bond part 122g Chip bonding material 100 Lighting device 200 Lighting device 210 Appliance body 211 Socket 220 Lamp cover

Claims (14)

Translucent gloves,
A support provided to extend inward of the globe;
A main light emitting module and a sub light emitting module disposed in the globe and fixed to the column;
The main light emitting module has a substrate and a first light emitting element group composed of a plurality of first light emitting elements provided on the surface of the substrate,
The sub-light-emitting module includes the substrate and a second light-emitting element group including a plurality of second light-emitting elements provided on the back surface of the substrate,
The support column is disposed on the back side of the substrate,
The first light emitting element group is disposed at a position facing the support column across the substrate,
The main light emitting module further includes a third light emitting element group composed of a plurality of third light emitting elements provided on the surface of the substrate,
The third light emitting element is disposed at a position facing the second light emitting element across the substrate,
The first light emitting element group is composed of a plurality of first light emitting elements connected in series,
The second light emitting element group includes a plurality of second light emitting elements connected in series,
The third light emitting element group is composed of a plurality of third light emitting elements connected in series,
The bulb-type lamp in which the first light emitting element group, the second light emitting element group, and the third light emitting element group are composed of the same number of elements. Translucent gloves,
A support provided to extend inward of the globe;
A main light emitting module and a sub light emitting module disposed in the globe and fixed to the column;
The main light emitting module has a substrate and a first light emitting element group composed of a plurality of first light emitting elements provided on the surface of the substrate,
The sub-light-emitting module includes the substrate and a second light-emitting element group including a plurality of second light-emitting elements provided on the back surface of the substrate,
The support column is disposed on the back surface of the substrate, and has a fixed surface in contact with the back surface of the substrate,
The first light emitting element group is disposed at a position facing the fixed surface of the support with the substrate interposed therebetween. The main light emitting module further includes a third light emitting element group composed of a plurality of third light emitting elements provided on the surface of the substrate,
The light bulb shaped lamp according to claim 2 , wherein the third light emitting element is disposed at a position facing the second light emitting element with the substrate interposed therebetween. The substrate is composed of a main substrate having the first light emitting element group provided on the surface and a sub-substrate having the second light emitting element group provided on the surface,
The main board and the sub board, any one of claims 1 to 3, the back side each other not provided with the first light emitting element group and the second light emitting element group are arranged so as to face each other The light bulb shaped lamp described in 1. The sub-board is directly attached to the support column and transfers heat generated by the sub-light emitting module to the support column.
Said main substrate, the indirectly attached to the strut through the auxiliary substrate, the heat generated in the main light emitting module, to indirectly transfer heat according to claim 4 to said post through said auxiliary light emitting module Light bulb shaped lamp as described. The light bulb shaped lamp according to claim 5, wherein a heat conducting member is provided between the main light emitting module and the sub light emitting module. The light bulb shaped lamp according to claim 6, wherein the heat conducting member is one of a heat conducting resin, a ceramic paste, and a metal paste. The light bulb shaped lamp according to any one of claims 5 to 7, wherein the sub light emitting module is bonded and fixed to the support column. The light bulb according to claim 1 or 3 , wherein the substrate has a light reflectance of 50% or more with respect to light emitted from the first light emitting element group, the second light emitting element group, and the third light emitting element group. Shaped lamp. The light bulb shaped lamp according to claim 9, wherein the substrate is mainly composed of any one of Al ₂ O ₃ , MgO, SiO, and TiO ₂ . Surface of said strut, said first light emitting element group, according to claim 1 or claim 3 having a light reflectance of 30% or more with respect to light emitted from the second light emitting element group and the third light emitting element group Bulb shaped lamp. The light bulb shaped lamp according to claim 11, wherein the support column is mainly composed of any one of Al, Cu, and Fe. The main light emitting module has at least two or more first light emitting element groups,
The light bulb shaped lamp according to any one of claims 1 to 12, wherein the sub light emitting module has at least two or more second light emitting element groups. An illumination device comprising the light bulb shaped lamp according to any one of claims 1 to 13.

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