WO2014006790A1 - Bulb-shaped lamp, illumination device, and bulb-shaped lamp manufacturing method - Google Patents

Bulb-shaped lamp, illumination device, and bulb-shaped lamp manufacturing method Download PDF

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Publication number
WO2014006790A1
WO2014006790A1 PCT/JP2013/001303 JP2013001303W WO2014006790A1 WO 2014006790 A1 WO2014006790 A1 WO 2014006790A1 JP 2013001303 W JP2013001303 W JP 2013001303W WO 2014006790 A1 WO2014006790 A1 WO 2014006790A1
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WIPO (PCT)
Prior art keywords
terminal
light emitting
base
lead wire
light
Prior art date
Application number
PCT/JP2013/001303
Other languages
French (fr)
Japanese (ja)
Inventor
健太 渡邉
倉地　敏明
功幸 長浜
直紀 田上
考志 大村
Original Assignee
パナソニック株式会社
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Application filed by パナソニック株式会社 filed Critical パナソニック株式会社
Priority to JP2013541114A priority Critical patent/JPWO2014006790A1/en
Priority to CN201390000570.XU priority patent/CN204372573U/en
Publication of WO2014006790A1 publication Critical patent/WO2014006790A1/en

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    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V23/00—Arrangement of electric circuit elements in or on lighting devices
    • F21V23/001—Arrangement of electric circuit elements in or on lighting devices the elements being electrical wires or cables
    • F21V23/002—Arrangements of cables or conductors inside a lighting device, e.g. means for guiding along parts of the housing or in a pivoting arm
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21K—NON-ELECTRIC LIGHT SOURCES USING LUMINESCENCE; LIGHT SOURCES USING ELECTROCHEMILUMINESCENCE; LIGHT SOURCES USING CHARGES OF COMBUSTIBLE MATERIAL; LIGHT SOURCES USING SEMICONDUCTOR DEVICES AS LIGHT-GENERATING ELEMENTS; LIGHT SOURCES NOT OTHERWISE PROVIDED FOR
    • F21K9/00—Light sources using semiconductor devices as light-generating elements, e.g. using light-emitting diodes [LED] or lasers
    • F21K9/20—Light sources comprising attachment means
    • F21K9/23—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings
    • F21K9/232—Retrofit light sources for lighting devices with a single fitting for each light source, e.g. for substitution of incandescent lamps with bayonet or threaded fittings specially adapted for generating an essentially omnidirectional light distribution, e.g. with a glass bulb
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/02—Globes; Bowls; Cover glasses characterised by the shape
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/061—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being glass
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/06—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material
    • F21V3/062—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by the material the material being plastics
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V3/00—Globes; Bowls; Cover glasses
    • F21V3/04—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings
    • F21V3/10—Globes; Bowls; Cover glasses characterised by materials, surface treatments or coatings characterised by coatings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21V—FUNCTIONAL FEATURES OR DETAILS OF LIGHTING DEVICES OR SYSTEMS THEREOF; STRUCTURAL COMBINATIONS OF LIGHTING DEVICES WITH OTHER ARTICLES, NOT OTHERWISE PROVIDED FOR
    • F21V29/00—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems
    • F21V29/85—Protecting lighting devices from thermal damage; Cooling or heating arrangements specially adapted for lighting devices or systems characterised by the material
    • F21V29/89—Metals
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2107/00—Light sources with three-dimensionally disposed light-generating elements
    • F21Y2107/90—Light sources with three-dimensionally disposed light-generating elements on two opposite sides of supports or substrates
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F21—LIGHTING
    • F21Y—INDEXING SCHEME ASSOCIATED WITH SUBCLASSES F21K, F21L, F21S and F21V, RELATING TO THE FORM OR THE KIND OF THE LIGHT SOURCES OR OF THE COLOUR OF THE LIGHT EMITTED
    • F21Y2115/00—Light-generating elements of semiconductor light sources
    • F21Y2115/10—Light-emitting diodes [LED]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
    • H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
    • H01L2224/45001—Core members of the connector
    • H01L2224/45099—Material
    • H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
    • H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
    • H01L2224/45144—Gold (Au) as principal constituent
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L25/00—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof
    • H01L25/03—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes
    • H01L25/04—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers
    • H01L25/075—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00
    • H01L25/0753—Assemblies consisting of a plurality of individual semiconductor or other solid state devices ; Multistep manufacturing processes thereof all the devices being of a type provided for in the same subgroup of groups H01L27/00 - H01L33/00, or in a single subclass of H10K, H10N, e.g. assemblies of rectifier diodes the devices not having separate containers the devices being of a type provided for in group H01L33/00 the devices being arranged next to each other
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00011—Not relevant to the scope of the group, the symbol of which is combined with the symbol of this group
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/181—Encapsulation

Definitions

  • the present invention relates to a light bulb-shaped lamp, a lighting device and a method of manufacturing the light bulb-shaped lamp, and more particularly to a light bulb-shaped lamp using a semiconductor light emitting element, a lighting device using the same, and a method of manufacturing the light bulb-shaped lamp.
  • LEDs Light Emitting Diodes
  • LED lamp there is a bulb-shaped LED lamp (bulb-shaped LED lamp), and in the bulb-shaped LED lamp, a light emitting module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • a light emitting module including a substrate and a plurality of LEDs mounted on the substrate is used.
  • Patent Document 1 discloses a conventional bulb-shaped LED lamp.
  • a lead wire for supplying power to the LED is disposed in a through hole formed in a substrate on which the LED is mounted, and the substrate and the lead wire It is soldered.
  • the light emitting module used for the above-described bulb-shaped LED lamp is usually configured to extract light only from one side (the surface on which the LED is mounted) of the substrate,
  • the luminous flux to the base is low, and it is difficult to realize a wide light distribution angle. Therefore, it is conceivable to provide another light emitting module that emits light toward the base. That is, two light emitting modules are used, and the surfaces of the two light emitting modules on which the LEDs are not mounted are attached to each other.
  • the terminal on the upper surface of the light emitting module of the two light emitting modules is soldered to the lead wire, and the terminal on the lower surface of the light emitting module on the lower side is soldered to the lead wire.
  • the productivity at the time of connecting the lead wires to the two light emitting modules is reduced.
  • the present invention in view of such problems, in a configuration in which two light emitting modules are bonded together, a bulb-shaped lamp, a lighting device, and a light bulb capable of improving the productivity when connecting the lead wires to the two light emitting modules. It is an object of the present invention to provide a method of manufacturing a lamp.
  • a light bulb shaped lamp is a light bulb shaped lamp having a base and a translucent glove disposed above the base, the translucent glove A main light emitting module disposed inward and provided with a first light emitting element group on the upper surface, and is disposed inward of the translucent glove and joined to the lower surface of the main light emitting module, and a second light emission on the lower surface
  • An auxiliary light emitting module provided with an element group, a drive circuit for supplying power to the first light emitting element group and the second light emitting element group, the main light emitting module, the auxiliary light emitting module, and the drive circuit
  • the main light emitting module is provided on the main substrate and the upper or lower surface of the main substrate to electrically connect the first light emitting element group and the drive circuit.
  • the sub light emitting module is provided on the same side as the sub substrate and the surface on which the first terminal of the sub substrate is provided, and the second light emitting element group and the driving circuit And the second bulb for electrically connecting the two, and the bulb-shaped lamp further covers the lead wire, the first terminal and the second terminal, and the lead wire and the first terminal And a conductive member electrically connecting the second terminal and the second terminal.
  • a first through hole into which the lead wire is inserted is formed in the main substrate, and the first terminal is outside the first through hole.
  • a second through hole smaller than the first through hole, which is disposed on the upper surface of the main substrate and into which the lead wire is inserted, is formed in the sub substrate, and the second terminal is The conductive member is disposed inward of the first through hole, outside the second through hole and on the upper surface of the sub-substrate, and the conductive member is configured to connect the lead wire, the first terminal, and the second terminal. It may be covered from above.
  • the second terminal may be electrically connected to the second light emitting element group by a conductive via formed in the sub substrate. .
  • a through hole into which the lead wire is inserted is formed in the sub-substrate, and the first terminal is an inner side of the through hole and the main
  • the second terminal is disposed on the lower surface of the substrate, the second terminal is disposed on the outer side of the through hole and the lower surface of the sub substrate, and the conductive member is configured to connect the lead wire, the first terminal, and the second terminal. It may be covered from below.
  • the second terminal is disposed at an end of the lower surface of the sub substrate, and the first terminal is outside the sub substrate and on the lower surface of the main substrate.
  • the conductive member may be disposed at an end, and the conductive member may cover the lead wire, the first terminal, and the second terminal from below.
  • the first terminal may be electrically connected to the first light emitting element group by a conductive via formed in the main substrate. .
  • the illuminating device which concerns on 1 aspect of this invention is characterized by being an illuminating device provided with the said bulb-shaped lamp
  • a method of manufacturing a bulb-shaped lamp is a method of manufacturing a bulb-shaped lamp having a base and a translucent globe disposed above the base.
  • the light bulb shaped lamp includes a main light emitting module provided with a first light emitting element group, a sub light emitting module provided with a second light emitting element group, the first light emitting element group and the second light emitting element group And a lead wire for electrically connecting the main light emitting module and the sub light emitting module to the drive circuit
  • the method for manufacturing the bulb-shaped lamp comprising the steps of: A first terminal provided on the surface of the main substrate of the main light emitting module for electrically connecting the first light emitting element group to the drive circuit, and provided on the surface of the sub substrate of the sub light emitting module With a second light emitting element group
  • the connecting step in the connecting step, the first through hole formed in the sub substrate and the inner side of the first through hole formed in the main substrate.
  • the lead wire is disposed inward of the second through hole smaller than the hole, and the first terminal disposed on the outer side of the first through hole and on the upper surface of the main substrate, and the first through hole.
  • the lead wire and the lead wire are covered by covering the lead terminal from the upper side with the conductive member, and the lead terminal from the upper side of the second through hole and on the upper surface of the sub-substrate.
  • the first terminal and the second terminal may be electrically connected.
  • the productivity can be improved when connecting the lead wires to the two light emitting modules, a lighting device, and a method of manufacturing the light bulb shaped lamp Can be realized.
  • FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of a light bulb shaped lamp according to an embodiment of the present invention.
  • FIG. 4 is a diagram showing the configuration of the LED module according to the embodiment of the present invention.
  • FIG. 5 is a view showing the configuration of the connection portion between the LED module and the lead wire according to the embodiment of the present invention.
  • FIG. 6 is a view showing a connection portion with the lead wires of the first light emitting module and the second light emitting module according to the embodiment of the present invention.
  • FIG. 7 is a flowchart showing a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 8 is a flowchart showing a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 9 is a view for explaining the manufacturing process of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 10 is a view showing the configuration of the connection portion between the LED module and the lead wire in the light bulb shaped lamp according to the first modification of the embodiment of the present invention.
  • FIG. 11 is a flowchart showing a method of manufacturing a light bulb shaped lamp according to the first modification of the embodiment of the present invention.
  • FIG. 12 is a view for explaining the manufacturing process of the light bulb shaped lamp according to the first modification of the embodiment of the present invention.
  • FIG. 13 is a view showing the configuration of the connection portion between the LED module and the lead wire in the light bulb shaped lamp according to the second modification of the embodiment of the present invention.
  • FIG. 14 is a view showing the configuration of an LED module and a support according to a third modification of the embodiment of the present invention.
  • FIG. 1 is a side view of a light bulb shaped lamp 1 according to an embodiment of the present invention.
  • FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the embodiment of the present invention.
  • the bulb-shaped lamp 1 is a bulb-shaped LED lamp which is a substitute for a bulb-shaped fluorescent lamp or an incandescent lamp.
  • the light bulb-shaped lamp 1 includes a translucent globe 10, an LED module 2 as a light source, a support 40, a support plate 50, a resin case 60, a lead wire 70, a lighting circuit 80, and power from outside the lamp And a base 90 for receiving the
  • an envelope is configured by the globe 10, the resin case 60 (first case portion 61), and the base 90.
  • the description will be made with the Z-axis positive direction shown in these figures as the upper side and the Z-axis negative direction as the lower side. That is, the glove 10 is disposed above the base 90.
  • the definition of said direction is not related to the direction when the bulb-shaped lamp 1 is attached to the lighting fixture, and when the bulb-shaped lamp 1 is attached to the lighting fixture, which direction is upward or downward It does not matter.
  • the glove 10 accommodates the LED module 2.
  • the globe 10 is a translucent globe that is made of a material that is transparent to the light from the LED module 2 and transmits the light from the LED module 2 to transmit light to the outside of the lamp.
  • a globe 10 can be a glass bulb (clear bulb) made of silica glass that is transparent to visible light.
  • the LED module 2 housed in the glove 10 can be viewed from the outside of the glove 10.
  • the shape of the glove 10 is a shape in which one end is closed spherically and the other end has an opening 11. Specifically, the shape of the glove 10 is such that a part of the hollow sphere is narrowed while extending in the direction (Z-axis minus direction) away from the center of the sphere, and the position where the sphere is away from the center
  • the opening 11 is formed in the As the globe 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, as the glove 10, a glass bulb such as A-shaped, G-shaped or E-shaped can be used.
  • the globe 10 does not necessarily have to be transparent to visible light, and the globe 10 may have a light diffusing function.
  • a milky white light diffusion film may be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the glove 10.
  • the glove 10 does not have to be made of silica glass.
  • a glove 10 made of a resin material such as acrylic may be used.
  • the LED module 2 is a light emitting module that has an LED (LED chip) and emits light when power is supplied to the LED through the lead 70.
  • the LED module 2 is held in the hollow state in the glove 10 by the support 40.
  • the LED module 2 be disposed at a central position of the spherical shape formed by the globe 10 (for example, inside the major portion where the inner diameter of the globe 10 is large).
  • the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil.
  • the base 90 is a power receiving unit that receives power for causing the LEDs of the LED module 2 to emit light from the outside of the light bulb shaped lamp 1.
  • the base 90 receives AC power at two contacts, and the power received by the base 90 is input to the power input unit of the lighting circuit 80 through the lead wire.
  • the base 90 is attached to a socket of a lighting fixture (lighting device) and receives electric power from the socket to light the light bulb shaped lamp 1 (LED module 2).
  • the base 90 is E-shaped, and a screwing portion for screwing with a socket of the lighting apparatus is formed on the outer peripheral surface thereof, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface thereof. Is formed.
  • the base 90 is a bottomed cylindrical body made of metal.
  • an E26-type or E17-type nozzle or the like can be used as the nozzle 90.
  • the support 40 is a stem provided so as to extend upward (inward of the glove 10) from the vicinity of the opening 11 of the glove 10, and functions as a holding member for holding the LED module 2 in the glove 10.
  • One end of the support 40 is connected to the LED module 2, and the other end is connected to the support plate 50. That is, the upper surface of the support 40 is in contact with the lower surface of the LED module 2, and the support 40 and the LED module 2 are bonded by an adhesive of resin such as silicone resin, for example.
  • the columns 40 also function as a heat radiating member for radiating heat generated by the LED module 2 to the base 90 side. Therefore, the heat dissipation efficiency of the support 40 can be enhanced by configuring the support 40 with a metal material having high thermal conductivity, such as aluminum having a thermal conductivity of 237 [W / m ⁇ K]. As a result, it is possible to suppress the decrease in the light emission efficiency and the life of the LED due to the temperature rise.
  • the columns 40 can also be made of resin or the like.
  • the support plate 50 is a member for supporting the support column 40, and is fixed to the resin case 60.
  • the support plate 50 is connected to the open end of the opening 11 of the glove 10 and configured to close the opening 11 of the glove 10.
  • the support plate 50 is formed of a disk-like member having a stepped portion at the periphery, and the open end of the opening 11 of the glove 10 is in contact with the stepped portion. In the step portion, the support plate 50, the resin case 60, and the opening end of the opening 11 of the glove 10 are fixed by an adhesive.
  • the support plate 50 is made of a metal material having high thermal conductivity, such as aluminum, similarly to the support column 40, so that the heat radiation efficiency of the heat of the LED module 2 thermally conducted by the support plate 50 is enhanced. As a result, it is possible to further suppress the decrease in the light emission efficiency and the life of the LED due to the temperature rise.
  • the resin case 60 is an insulating case (circuit holder) for insulating the support 40 and the base 90 and housing the lighting circuit 80, and has a large diameter cylindrical first case portion 61 and a small diameter cylindrical second case. And a case portion 62.
  • the resin case 60 can be formed of, for example, polybutylene terephthalate (PBT).
  • the second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 90, and a screwing portion for screwing with the base 90 is formed on the outer peripheral surface of the second case portion 62. ing.
  • the two lead wires 70 are wire-shaped metal wires such as copper wires for supplying power for lighting the LED module 2 from the lighting circuit 80 to the LED module 2.
  • Each lead 70 is disposed in the glove 10, one end is electrically connected to the external terminal of the LED module 2, and the other end is electrically connected to the power output portion of the lighting circuit 80, in other words, the cap 90 There is. That is, the two lead wires 70 are a pair of lead wires for electrically connecting the lighting circuit 80 with the first light emitting module 20 and the second light emitting module 30 described later.
  • the lead wire 70 also functions as a support for supporting the LED module 2 by connecting a part of the lead wire 70 to the external terminal of the LED module 2.
  • the two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin for covering the core wire, and are not covered with the insulating resin with the LED module 2 and the surface is exposed. It is electrically connected through the core wire.
  • the lighting circuit 80 is a circuit unit for lighting the LEDs of the LED module 2 and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted.
  • the lighting circuit 80 converts alternating current power supplied from the base 90 into direct current power, and supplies the converted direct current power to the LED of the LED module 2 through the two lead wires 70. That is, the lighting circuit 80 is a drive circuit for supplying power to the first light emitting element 22 and the second light emitting element 32 described later.
  • the bulb-shaped lamp 1 does not necessarily have to include the lighting circuit 80.
  • the lighting circuit 80 is not limited to the smoothing circuit, and can be configured by appropriately selecting and combining the light control circuit, the booster circuit, and the like.
  • FIG. 4 is a view showing the configuration of the LED module 2 according to the embodiment of the present invention.
  • FIG. 4A is a plan view when the LED module 2 is viewed from above with the bulb 10 removed the globe 10.
  • 4 (b) is a cross-sectional view of the LED module 2 cut along the line AA 'in FIG. 4 (a)
  • FIG. 4 (c) is a diagram in FIG. 4 (a).
  • FIG. 6 is a cross-sectional view of the LED module 2 taken along the line BB ′ of FIG.
  • FIG. 5 is a view showing the configuration of the connection portion between the LED module 2 and the lead wire 70 according to the embodiment of the present invention. Specifically, (a) of FIG. 5 is a cross-sectional view of the LED module 2 cut along the line CC ′ of (a) of FIG. 4, and (b) of FIG. 5 is an enlarged view of a connection point between the lead wire 70 and the lead wire 70.
  • FIG. 5 is a view showing the configuration of the connection portion between the LED module 2 and the lead wire 70 according to the embodiment of the present invention. Specifically, (a) of FIG. 5 is a cross-sectional view of the LED module 2 cut along the line CC ′ of (a) of FIG. 4, and (b) of FIG. 5 is an enlarged view of a connection point between the lead wire 70 and the lead wire 70.
  • FIG. 6 is a view showing a connection portion of the first light emitting module 20 and the second light emitting module 30 with the lead wire 70 according to the embodiment of the present invention. Specifically, (a) of FIG. 6 is a plan view when the connection portion of the first light emitting module 20 with the lead wire 70 is viewed from above, and (b) of FIG. 6 is a first light emitting module 20 is a cross-sectional view of a connecting portion with the 20 lead wires 70.
  • FIG. 6C is a plan view of the connection portion of the second light emitting module 30 with the lead wire 70 as viewed from above, and FIG. 6D shows the lead of the second light emitting module 30.
  • FIG. 7 is a cross-sectional view of a connection portion with the line 70
  • the LED module 2 is a COB (Chip On Board) structure in which bare chips are directly mounted on the upper and lower surfaces.
  • the LED module 2 includes the first light emitting module 20, the second light emitting module 30 joined to the lower surface of the first light emitting module 20, and the conductive member 27. That is, the lead wire 70 supplies power to the first light emitting element 22 provided on the upper surface of the first light emitting module 20 described later and the second light emitting element 32 provided on the lower surface of the second light emitting module 30.
  • the first light emitting module 20 includes a first base 21, a plurality of first light emitting elements 22, a first sealing member 23, first metal wires 24 and 26, a first wire 25, and a first terminal ( And an external terminal 28).
  • the plurality of first light emitting elements 22, the first sealing member 23, the first metal wires 24 and 26, the first wires 25, and the first terminals 28 are disposed on the upper surface of the first base 21. It is provided.
  • the first light emitting module 20 corresponds to the "main light emitting module” described in the claims
  • the first base 21 corresponds to the "main substrate” described in the claims.
  • the second light emitting module 30 includes a second base 31, a plurality of second light emitting elements 32, a second sealing member 33, second metal wires 34 and 36, a second wire 35, and a second wire.
  • a terminal (external terminal) 38 is provided.
  • the plurality of second light emitting elements 32, the second sealing member 33, the second metal wires 34 and 36, and the second wires 35 are provided on the lower surface of the second base 31.
  • the second terminal 38 is provided on the same side as the surface on which the first terminal 28 of the second base 31 is provided, that is, on the upper surface.
  • the second light emitting module 30 corresponds to the “sub light emitting module” described in the claims
  • the second base 31 corresponds to the “sub substrate” described in the claims.
  • the first base 21 is, for example, a flat substrate such as a ceramic substrate such as aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or an alumina substrate.
  • the first base 21 may be formed of a white substrate such as a white alumina substrate or a white ceramic substrate having a low light transmittance, for example, 10% or less with respect to light emitted from the first light emitting element 22 or a metal substrate.
  • the first base 21 has a light reflectance of 50% or more with respect to light emitted from the first light emitting element 22, and is mainly made of any of Al 2 O 3 , MgO, SiO, and TiO 2.
  • the light transmittances of the first base 21 and the second base 31 are high, in the LED module 2, part of the light of the first light emitting element 22 on the surface side of the first base 21 is the first After passing through the base 21, the light further passes through the second base 31 and the second sealing member 33, and is emitted from the lower surface side of the second base 31.
  • the LED module 2 after part of the light of the second light emitting element 32 on the lower surface side of the second base 31 passes through the second base 31, the first base 21 and the first sealing member Further, the light source 23 is emitted from the upper surface side of the first base 21 through 23. Therefore, in the light bulb shaped lamp 1, color shift occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color shift can be suppressed by lowering the light transmittance of the first base 21 and the second base 31. Further, since an inexpensive white substrate can be used, cost reduction of the light bulb shaped lamp 1 can be realized.
  • first through holes 21a penetrating from the upper surface to the lower surface of the first base 21 are formed. It is done.
  • two second through holes 31a penetrating from the upper surface to the lower surface of the second base 31 are provided at positions corresponding to the first through holes 21a. It is formed.
  • the first through holes 21 a and the second through holes 31 a are for electrically connecting the lead wire 70 for feeding to the first terminal 28 and the second terminal 38, and the first through holes 21 a and the second through holes 31 a
  • the lead wire 70 is inserted through each of the second through holes 31 a.
  • the first through holes 21a and the second through holes 31a are through holes having a cylindrical shape (the cross section in the XY plane is circular).
  • the second through hole 31a is a through hole smaller than the first through hole 21a disposed inside the first through hole 21a.
  • the second through holes 31a are through holes having a hole diameter of about 1 mm
  • the first through holes 21a are through holes having a hole diameter of about 2 to 4 mm.
  • the diameter of the first through hole 21a is determined so that the first terminal 28 and the second terminal 38 are disposed close to each other.
  • the first base 21 and the second base 31 are attached without a gap by an adhesive or the like. It is fitted. Thereby, the heat conductivity between the first base 21 and the second base 31 is improved, and the heat generated in the first base 21 can be dissipated to the support 40 side.
  • a groove, a through hole, or the like may be formed in the central portion of the second base 31 so as to be fitted to the protrusion formed on the support 40.
  • pillar 40 with an adhesive agent may be used.
  • the first light emitting element 22 is a bare chip that emits monochromatic visible light in all directions, that is, sideward, upward, and downward.
  • the first light emitting element 22 emits, for example, 20% of the total light amount laterally, 60% of the total light amount upward, and 20% of the total light amount downward.
  • the first light emitting element 22 is, for example, a rectangular (square) blue light emitting LED chip that emits blue light when energized on a side of about 0.35 mm (350 ⁇ m).
  • the blue LED chip for example, a gallium nitride-based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.
  • a plurality of first light emitting elements 22 are mounted on the upper surface of the first base 21.
  • a plurality of first light emitting elements 22 are arranged in a straight line at the same pitch in the long side direction of the first base 21 so that a plurality of element rows are arranged in the short side direction of the first base 21. It is arranged.
  • the plurality of first light emitting elements 22 are connected in series in the element row, and are connected in parallel in the element rows. All or a part of the plurality of first light emitting elements 22 correspond to the “first light emitting element group” described in the claims.
  • all or part of the plurality of second light emitting elements 32 correspond to the “second light emitting element group” described in the claims.
  • the distance (pitch) between the adjacent first light emitting elements 22 in the element row is 1.8 mm, and in the adjacent element rows, the first light emitting elements 22 of one element row and the other
  • the distance between the first light emitting element 22 and the first light emitting element 22 is 4 mm, for example.
  • the cathode electrode of one first light emitting element 22 and the anode electrode of the other first light emitting element 22 are connected by the first wire 25.
  • the first light emitting elements 22 are arranged in six rows on the upper surface of the first base 21, and the second light emitting elements 32 are the second base. Although two rows are arranged on the lower surface of 31, the number of each row is not limited.
  • the first sealing member 23 is a conversion member that converts the wavelength of light emitted by the first light emitting element 22, and is formed to cover the first light emitting element 22.
  • the first sealing member 23 is a sealing resin composed of a wavelength conversion material for converting the wavelength of light emitted by the first light emitting element 22 and a resin material containing the wavelength conversion material.
  • the wavelength conversion material phosphor particles which are excited by the light emitted from the first light emitting element 22 and emit light of a desired color (wavelength) can also be used, and semiconductors, metal complexes, organic dyes, pigments, etc.
  • a material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light can also be used.
  • a light diffusing material such as silica particles may be dispersed.
  • the first light emitting element 22 is a blue LED that emits blue light
  • fluorescence for converting the wavelength of blue light into yellow light Body particles are used.
  • YAG (yttrium aluminum garnet) -based yellow phosphor particles can be used as the phosphor particles.
  • part of the blue light emitted from the first light emitting element 22 is wavelength-converted to yellow light by the yellow phosphor particles contained in the first sealing member 23.
  • the blue light not absorbed by the yellow phosphor particles (without wavelength conversion) and the yellow light wavelength-converted by the yellow phosphor particles are diffused and mixed in the first sealing member 23 As a result, the first sealing member 23 emits white light.
  • green phosphor particles, red phosphor particles, etc. may be used as the phosphor particles in addition to the yellow phosphor particles, and in the case where the first light emitting element 22 is the first light emitting element 22 emitting ultraviolet light, wavelength conversion As a fluorescent substance particle which is material, what combined each color fluorescent substance particle which emits light in three primary colors (red, green, blue) is used.
  • transparent resin materials such as silicone resin, organic materials such as fluorine resin, and inorganic materials such as low melting point glass and sol-gel glass can be used as the resin material containing the phosphor particles.
  • the first sealing member 23 having the above-described configuration is linearly formed along the arrangement direction of the plurality of first light emitting elements 22 constituting the element line, and collectively seals the element line of the first light emitting elements 22. There is. At the same time, a plurality of first sealing members 23 are formed along the arrangement direction of the element rows, and individually seal different element rows. Each first sealing member 23 has, for example, a length of 24 mm, a line width of 1.6 mm, and a central maximum height of 0.7 mm.
  • Two first metal wires 26 are formed in an island shape in a predetermined shape at both end portions of the first base 21 in order to electrically connect the element row of the first light emitting element 22 and the first terminal 28 in parallel. ing. The two first metal wires 26 are formed on the upper surface of the first base 21 so as to sandwich the element rows of the plurality of first light emitting elements 22.
  • the first metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the first light emitting element 22 on the upper surface of the first base 21.
  • the protruding portion of the first metal wiring 26 is a connection point to the first wire 25 from the first light emitting element 22.
  • the first terminal 28 is a pair of terminals formed in a predetermined shape on the surface of the first base 21 as a feed electrode on which the conductive member 27 is provided, for example, a solder electrode to be soldered. Specifically, the first terminal 28 is disposed outside the first through hole 21 a and on the upper surface of the first base 21. Two first terminals 28 are formed corresponding to each of the two first metal wires 26. The two first terminals 28 are integrally formed with the corresponding first metal wires 26. One corresponding wiring pattern is configured by the corresponding one set of the first metal wiring 26 and the first terminal 28.
  • the first terminal 28 is a power feeding unit of the LED module 2 and is a terminal for electrically connecting the first light emitting element 22 and the lighting circuit 80.
  • the first terminal 28 receives power from the outside of the LED module 2 in order to cause the first light emitting element 22 to emit light, and receives the received power via the first metal wires 26 and 24 and the first wire 25.
  • the element 22 is supplied.
  • the second terminal 38 is a terminal for electrically connecting the second light emitting element 32 and the lighting circuit 80.
  • a plurality of first metal wires 24 are formed in a predetermined shape on the upper surface of the first base 21 in order to electrically connect the plurality of first light emitting elements 22 in series.
  • the plurality of first metal wires 24 are formed in an island shape on the upper surface of the first base 21 between the adjacent first light emitting elements 22 in the element row.
  • the first metal wires 26 and 24 and the first terminal 28 configured as described above are simultaneously patterned with the same metal material.
  • a metal material silver (Ag), tungsten (W) or copper (Cu) etc. can be used, for example.
  • the surfaces of the first metal wires 26 and 24 and the first terminal 28 may be plated with nickel (Ni) / gold (Au) or the like.
  • the first metal wires 26 and 24 and the first terminal 28 may be made of different metal materials, or may be formed in separate steps.
  • two second metal wires 36 are formed in an island shape in a predetermined shape at both end portions of the second base 31.
  • the two second metal wires 36 are formed on the lower surface of the second base 31 so as to sandwich the element rows of the plurality of second light emitting elements 32.
  • the second metal wiring 36 protrudes toward the element row at a portion adjacent to the element row of the second light emitting element 32 on the lower surface of the second base 31.
  • the protruding portion of the second metal wire 36 serves as a connection point with the second wire 35 from the second light emitting element 32.
  • the second terminal 38 is formed in a predetermined shape on the surface of the second base 31 as a feed electrode on which the conductive member 27 is provided, for example, a solder electrode to which soldering is performed. Specifically, the second terminal 38 is disposed inward of the first through hole 21 a and on the outer side of the second through hole 31 a and on the upper surface of the second base 31. That is, the second terminal 38 is disposed so as to be exposed from the first through hole 21 a and is covered by the conductive member 27.
  • Two second terminals 38 are formed corresponding to each of the two second metal wires 36. The two second terminals 38 are electrically connected to the corresponding second metal wires 36 by the conductive vias formed in the second base 31.
  • the conductive via is a concept including both a via hole in which a hole is formed and a plug in which a hole is not formed.
  • the second terminal 38 is a feeding portion of the LED module 2 and is electrically connected to the second light emitting element 32 by the conductive via formed in the second base 31 described above.
  • the second terminal 38 receives power from the outside of the LED module 2 in order to cause the second light emitting element 32 to emit light, and receives the received power via the second metal wires 36 and 24 and the second wire 35.
  • the element 32 is supplied.
  • the second terminal 38 is preferably disposed at a position close to the first terminal 28.
  • a plurality of second metal wires 34 are formed in a predetermined shape on the lower surface of the second base 31 in order to electrically connect the plurality of second light emitting elements 32 in series.
  • the plurality of second metal wires 34 are formed in an island shape on the lower surface of the second base 31 between the adjacent second light emitting elements 32 in the element row.
  • the second metal wires 36 and 24 of the above-described configuration are simultaneously patterned with the same metal material.
  • silver (Ag), tungsten (W), copper (Cu) or the like can be used for the second metal wires 36 and 24 and the second terminal 38.
  • the surface of the second metal wires 36 and 24 or the second terminal 38 may be plated with nickel (Ni) / gold (Au) or the like.
  • the second metal wires 36 and 24 and the second terminal 38 may be made of different metal materials or may be formed in separate steps.
  • the first wire 25 is a wire for connecting the first light emitting element 22 and the first metal wire 26 or the first light emitting element 22 and the first metal wire 24, and is, for example, a gold wire.
  • the first metal wiring 26 or the first metal wiring 24 formed adjacent to both sides of the cathode electrode and the anode electrode of the first light emitting element 22 and both sides of the first light emitting element 22 are wire-bonded by the first wire 25 It is done.
  • the first wire 25 is entirely embedded in the first sealing member 23 so as not to be exposed from the first sealing member 23, for example.
  • the conductive member 27 is a conductive adhesive such as solder or silver paste which connects the first terminal 28, the second terminal 38, and the lead wire 70. That is, the conductive member 27 is a conductive member which covers the lead 70, the first terminal 28, and the second terminal 38, and electrically connects the lead 70, the first terminal 28, and the second terminal 38. is there. Specifically, the conductive member 27 covers the upper portion of the lead 70, the first terminal 28, and the second terminal 38 from the upper side, so that the upper portion of the lead 70, the first terminal 28, and the second terminal 38 Are electrically connected via the conductive member 27.
  • said "covering” is not limited to covering the whole, It is the concept also including covering at least one part.
  • the conductive member 27 may not cover the entire upper portion of the lead 70, the entire first terminal 28, and the entire second terminal 38, and at least a portion of the upper portion of the lead 70 and the first terminal 28. And at least a portion of the second terminal 38.
  • the current supplied to the plus lead wire 70 on one side is the conductive member 27, the first terminal 28, the first metal wiring 26, the first light emitting element 22 and the first metal. It passes through the wiring 24 and is outputted from the other negative lead wire 70. Similarly, the current supplied to one positive lead wire 70 passes through the conductive member 27, the second terminal 38, the second metal wire 36, the second light emitting element 32 and the second metal wire 34, and the other Is output from the lead wire 70 on the negative side of the
  • the first light emitting module 20 has the first terminal 28 provided on the upper surface of the first base 21, and the second light emission
  • the module 30 has a second terminal 38 provided on the upper surface of the second base 31. That is, the second terminal 38 is provided on the same side as the surface on which the first terminal 28 of the second base 31 is provided.
  • the conductive member 27 covers the lead wire 70, the first terminal 28, and the second terminal 38, whereby the lead wire 70, the first terminal 28, and the second terminal 38 are electrically connected.
  • the lead 70, the first terminal 28, and the second terminal 38 are easily electrically connected by covering the conductive member 27 once from one direction. Power can be supplied to the light emitting module 30. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
  • the first terminal 28 is disposed outside the first through hole 21 a formed in the first base 21 and on the upper surface of the first base 21.
  • the second terminal 38 is an inner side of the first through hole 21 a, and is an outer side and a second base of the second through hole 31 a smaller than the first through hole 21 a formed in the second base 31. It is arranged on the top of 31.
  • the conductive member 27 covers the lead 70, the first terminal 28, and the second terminal 38 from above in a state where the lead 70 is inserted into the first through hole 21a and the second through hole 31a. .
  • the lead wire 70, the first terminal 28, and the second terminal 38 can be electrically connected easily by the configuration in which the conductive member 27 is covered once from one direction.
  • the second terminal 38 is electrically connected to the second light emitting element 32 by the conductive via formed in the second base 31.
  • the manufacturing method of the lightbulb-shaped lamp 1 which has a structure which bonds together two light emitting modules, productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
  • FIG. 7 and 8 are flowcharts showing a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention. Specifically, FIG. 7 is a flowchart showing a method of connecting the LED module 2 and the lead wire 70. Moreover, FIG. 8 is a flowchart which shows in detail the connection process which electrically connects the lead wire 70, the 1st terminal 28, and the 2nd terminal 38. As shown in FIG.
  • FIG. 9 is a figure for demonstrating the manufacturing process of the lightbulb-shaped lamp 1 which concerns on embodiment of this invention.
  • the first light emitting module 20 and the second light emitting module 30 are bonded so that the first terminal 28 and the second terminal 38 are disposed on the same side.
  • S102 the first terminal 28 and the second terminal 38 are disposed on the upper surfaces of the first base 21 and the second base 31, respectively.
  • the first light emitting module 20 and the second light emitting module 30 are disposed.
  • the 1st light emitting module 20 and the 2nd light emitting module 30 are joined. Thereby, the first terminal 28 and the second terminal 38 are arranged to be exposed in the same direction (upward).
  • the lead wire 70, the first terminal 28, and the second terminal 38 are covered by covering the lead wire 70, the first terminal 28, and the second terminal 38 with the conductive member 27. Are electrically connected (S104). Below, this connection process is demonstrated in detail using FIG.
  • a lead wire is provided inward of the first through hole 21 a formed in the first base 21 and inward of the second through hole 31 a formed in the second base 31.
  • 70 are arranged (S202). Specifically, as shown in FIG. 9C, the lead wire 70 is inserted inward of the first through hole 21a and inward of the second through hole 31a.
  • the lead wire 70, the first terminal 28 and the second terminal 38 are electrically Connection (S204). Specifically, as shown in (d) of FIG. 9, the lead wire is soldered to the first terminal 28, the second terminal 38 and the lead wire 70 from above using the conductive member 27. 70, the first terminal 28 and the second terminal 38 are electrically connected.
  • the first light emission such that the first terminal 28 and the second terminal 38 are disposed on the same side surface
  • a bonding step of bonding the module 20 and the second light emitting module 30 is included.
  • the lead wire 70, the first terminal 28 and the second terminal 38 can be obtained by covering the lead wire 70, the first terminal 28 and the second terminal 38 with the conductive member 27. It includes a connecting step of electrically connecting. That is, the second terminal 38 is provided on the same side as the surface of the second base 31 on which the first terminal 28 is provided. Then, the conductive member 27 covers the lead wire 70, the first terminal 28, and the second terminal 38, whereby the lead wire 70, the first terminal 28, and the second terminal 38 are electrically connected.
  • the lead 70, the first terminal 28, and the second terminal 38 are easily electrically connected by covering the conductive member 27 once from one direction. Power can be supplied to the light emitting module 30. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
  • connection step the inside of the first through hole 21 a formed in the first base 21 and the inside of the second through hole 31 a smaller than the first through hole 21 a formed in the second base 31.
  • the lead wire 70 is placed on the side.
  • the conductive members 27 cover the first terminals 28 disposed on the upper surface of the first base 21, the second terminals 38 disposed on the upper surface of the second base 31, and the lead wires 70 from above.
  • the lead 70, the first terminal 28, and the second terminal 38 can be electrically connected easily by covering the conductive member 27 once in one direction from one direction.
  • the manufacturing method of the lightbulb-shaped lamp 1 which has a structure which bonds together two light emitting modules, productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
  • the area of the solder can be reduced particularly on the surface on which the light emitting element of the second base 31 is mounted. For this reason, it can suppress that the light reflectivity which the 2nd base 31 reflects the light from a light emitting element falls by a solder part, and can improve light extraction efficiency. That is, the substrate surface of the second base 31 is usually formed to have a high reflectance, for example, using a material having a light reflectance of 90% or more, but the surface of the solder has a low light reflectance. The reduction of the light reflectance of the second base 31 can be suppressed by reducing the area.
  • the contact area with the support column 40 can be increased, and the heat dissipation can be improved. That is, since it is necessary to set a predetermined distance sufficient to satisfy the dielectric breakdown voltage between the solder portion of the second base 31 and the support 40, the second base 31 and the support can be reduced by making the solder portion smaller.
  • the contact area with 40 can be expanded.
  • first base 21 and the second base 31 have different shapes
  • positioning when bonding the first base 21 and the second base 31 is possible. That is, in the case where the first base 21 and the second base 31 have different shapes, positioning using the shape of the substrate can not be performed, but the second terminal 38 is inserted into the first through hole 21a.
  • the first base 21 and the second base 31 can be positioned.
  • FIG. 10 is a view showing the configuration of the connection portion between the LED module and the lead wire 70 in the light bulb shaped lamp according to the first modification of the embodiment of the present invention.
  • the first terminal 28 and the second terminal 38 are disposed on the upper surface of the first base 21 and the second base 31, respectively.
  • the first terminal 128 and the second terminal 138 are disposed on the lower surface of the first base 121 and the second base 131, respectively. There is.
  • no through hole is formed in the first base 121, and a second through hole 131 a into which the lead wire 70 is inserted is formed in the second base 131.
  • the first terminal 128 is disposed inward of the second through hole 131 a and on the lower surface of the first base 121.
  • the second terminal 138 is disposed outside the second through hole 131 a and on the lower surface of the second base 131.
  • a conductive member 127 is provided which covers the lead 70, the first terminal 128, and the second terminal 138 from below, and electrically connects the lead 70, the first terminal 128, and the second terminal 138. .
  • the first terminal 128 is electrically connected to the first light emitting element 22 through the first metal wiring 26 by the conductive via formed in the first base 121. That is, the first terminal 128 is disposed to be exposed from the second through hole 131 a and is covered by the conductive member 127.
  • the conductive member 127 may not cover the entire upper portion of the lead 70, the entire first terminal 128, and the entire second terminal 138, and at least a portion of the upper portion of the lead 70 and the first terminal 128. And at least a portion of the second terminal 138.
  • FIG. 11 is a flowchart showing a method of manufacturing a light bulb shaped lamp according to the first modification of the embodiment of the present invention. Specifically, FIG. 11 is a flowchart showing in detail the connection process in FIG. Moreover, FIG. 12 is a figure for demonstrating the manufacturing process of the lightbulb-shaped lamp which concerns on the modification 1 of embodiment of this invention.
  • the first light emitting module 120 and the second light emitting module 130 are bonded so that the first terminal 128 and the second terminal 138 are disposed on the same side surface.
  • the first terminal 128 and the second terminal 138 are disposed on the lower surface of the first base 121 and the second base 131, respectively.
  • One light emitting module 120 and a second light emitting module 130 are disposed.
  • the 1st light emitting module 120 and the 2nd light emitting module 130 are joined. Thereby, the first terminal 128 and the second terminal 138 are arranged to be exposed in the same direction (downward).
  • connection step the lead 70, the first terminal 128, and the second terminal 138 are covered with the conductive member 127, whereby the lead 70, the first terminal 128, and the second terminal 138 Are electrically connected (S104 in FIG. 7).
  • this connection process is demonstrated in detail using FIG.
  • the lead wire 70 is disposed inward of the second through hole 131a formed in the second base 131 (S302). Specifically, as shown in FIG. 12C, the lead wire 70 is inserted into the second through hole 131a.
  • the lead wire 70, the first terminal 128 and the second terminal 138 from below are electrically Connection (S304).
  • the lead wire is soldered to the first terminal 128, the second terminal 138 and the lead wire 70 from below using the conductive member 127. 70, the first terminal 128 and the second terminal 138 are electrically connected.
  • the first light emitting module 120 has the first terminal 128 provided on the lower surface of the first base 121
  • the second light emitting module 130 has a second terminal 138 provided on the lower surface of the second base 131.
  • the conductive member 127 covers the lead 70, the first terminal 128, and the second terminal 138, whereby the lead 70, the first terminal 128, and the second terminal 138 are electrically connected.
  • the first terminal 128 is disposed inward of the second through hole 131a formed in the second base 131 and on the lower surface of the first base 121
  • the second terminal 138 is a second terminal.
  • the lead 70, the first terminal 128, and the second terminal 138 are easily electrically connected by covering the conductive member 127 once from one direction, and the first light emitting module 120 and the second The light emitting module 130 can be powered. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
  • the first terminal 128 is electrically connected to the first light emitting element 22 by a conductive via formed in the first base 121. With this configuration, even if the first terminal 128 and the first light emitting element 22 are disposed on different surfaces of the first base 121, the first terminal 128 and the first light emitting element 22 are easily electrically connected. can do.
  • productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
  • the through hole is not formed in the first base 121, but the through hole (the first through hole) is formed in the first base 121, and the lead wire is formed. 70 may be inserted into the through hole of the first base 121 and soldered.
  • FIG. 13 is a view showing the configuration of the connection portion between the LED module and the lead wire 70 in the light bulb shaped lamp according to the second modification of the embodiment of the present invention.
  • the first through hole 21a and the second through hole 31a are formed in the first base 21 and the second base 31, respectively, and the lead wire 70 is formed in the first through hole 21a. And, it is inserted into the second through hole 31a and soldered.
  • the first base 221 and the second base 231 have no through holes for soldering the lead wire 70. .
  • the second terminal 238 is disposed at the end of the lower surface of the second base 231.
  • the first terminal 228 is disposed outside the second base 231 and at the end of the lower surface of the first base 221.
  • a conductive member 227 which covers the lead 70, the first terminal 228 and the second terminal 238 from below and electrically connects the lead 70, the first terminal 228 and the second terminal 238. . That is, by soldering the first terminal 228, the second terminal 238, and the lead 70 from below using the conductive member 227, the lead 70, the first terminal 228, and the second terminal 238 can be electrically connected. Connect. That is, the first terminal 228 is disposed to be exposed downward on the outside of the second base 231, and is covered by the conductive member 227.
  • the conductive member 227 may not cover the entire upper portion of the lead 70, the entire first terminal 228, and the entire second terminal 238, and at least a portion of the upper portion of the lead 70 and the first terminal 228. And at least a portion of the second terminal 238 may be covered.
  • the first terminal 228 disposed on the lower surface of the first base 221 is a first light emitting element 22 disposed on the upper surface of the first base 221 by the conductive via formed on the first pedestal 221. It is electrically connected.
  • the first light emitting module 220 has the first terminal 228 provided on the lower surface of the first base 221
  • the second light emitting module 230 has a second terminal 238 provided on the lower surface of the second base 231.
  • the conductive member 227 covers the lead 70, the first terminal 228, and the second terminal 238, whereby the lead 70, the first terminal 228, and the second terminal 238 are electrically connected.
  • the second terminal 238 is disposed at the end of the lower surface of the second base 231
  • the first terminal 228 is at the outside of the second base 231 and at the end of the lower surface of the first base 221. It is arranged.
  • the conductive member 227 covers the lead 70, the first terminal 228, and the second terminal 238 from below.
  • the lead 70, the first terminal 228, and the second terminal 238 are easily electrically connected by covering the conductive member 227 once in one direction from one direction, and the first light emitting module 220 and the second The light emitting module 230 may be powered. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
  • the first terminal 228 is electrically connected to the first light emitting element 22 by a conductive via formed in the first base 221. With this configuration, even if the first terminal 228 and the first light emitting element 22 are disposed on different surfaces of the first base 221, the first terminal 228 and the first light emitting element 22 are easily electrically connected. can do.
  • productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
  • FIG. 14 is a view showing the configuration of the LED module 2 and the support 41 according to the third modification of the embodiment of the present invention.
  • the first through hole 21 a and the second through hole 31 a are formed in the first base 21 and the second base 31.
  • the first through hole 21a and the second through hole 31 are the third through hole 21b and the fourth through hole 21b.
  • Through holes 31 b are formed.
  • a cylindrical protrusion 41 a is formed at the center of the upper surface of the support column 41, and a circular third through hole into which the protrusion 41 a is inserted is formed in the first base 21 and the second base 31. 21b and a fourth through hole 31b are formed.
  • the LED module 2 is positioned on the support column 41 by the projection 41a, the third through hole 21b, and the fourth through hole 31b.
  • the first base 21 and the second base 31 may have through holes that are not directly related to the soldering other than the first through holes 21 a and the second through holes 31 a.
  • the light bulb shaped lamp concerning this modification 3 has an effect similar to the light bulb shaped lamp 1 concerning the above-mentioned embodiment also by this composition.
  • the tip of the lead 70 is provided to be exposed on the surface of the conductive member 27 in the above embodiment, the lead 70 may be completely covered by the conductive member 27. In this case, the contact area between the lead wire 70 and the conductive member 27 is increased, so that the connection between the two can be strengthened.
  • the second terminal 38 is electrically connected to the second light emitting element 32 by the conductive via formed in the second base 31.
  • the first terminal is electrically connected to the first light emitting element by the conductive via formed in the first base.
  • the connection between the upper surface and the lower surface of the first base or the second base is not limited to the conductive via, but may be connection by wiring or the like.
  • a conductive adhesive such as solder is used as the conductive member.
  • a metal plate member or wiring as the conductive member and connecting the lead wire to the first terminal and the second terminal, the lead wire is electrically connected to the first terminal and the second terminal. You may decide to do it.
  • the LED is exemplified as the light emitting element, but a semiconductor light emitting element such as a semiconductor laser, or a light emitting element such as organic EL (Electro Luminescence) or inorganic EL may be used.
  • a semiconductor light emitting element such as a semiconductor laser
  • a light emitting element such as organic EL (Electro Luminescence) or inorganic EL
  • the said embodiment and modification although it was set as the structure of COB type which mounted the LED chip directly on the 1st base 21 and the 2nd base 31, it is not restricted to this.
  • a package type in which an LED chip is mounted in a resin-molded cavity and the inside of the cavity is sealed with a phosphor-containing resin, that is, a surface mount device (SMD: Surface Mount Device) LED element is used.
  • SMD Surface Mount Device
  • An LED module configured by mounting a plurality of the above LED elements on a substrate may be used.
  • this invention can also be implement
  • it can comprise as a lighting installation provided with the above-mentioned light bulb shaped lamp, and the lighting fixture to which the said light bulb shaped lamp is attached.
  • the lighting fixture is for turning off and lighting the illumination light source, and includes, for example, a fixture body attached to a ceiling, and a cover covering the illumination light source.
  • the fixture body is equipped with a socket for mounting a base of the illumination light source and supplying power to the illumination light source.
  • the present invention is useful as a light bulb shaped lamp replacing conventional incandescent light bulbs and the like, and can be widely used in lighting devices and the like.

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  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Optics & Photonics (AREA)
  • Non-Portable Lighting Devices Or Systems Thereof (AREA)
  • Led Device Packages (AREA)
  • Arrangement Of Elements, Cooling, Sealing, Or The Like Of Lighting Devices (AREA)

Abstract

This bulb-shaped lamp (1) is provided with a first light-emitting module (20), a second light-emitting module (30) bonded to the bottom surface of the first light-emitting module (20), a lighting circuit (80), and a lead wire (70). The first light-emitting module (20) has a first base (21) and a first terminal (28) provided on the top or bottom surface of the first base (21), and the second light-emitting module (30) has a second base (31) and a second terminal (38) provided on the same side of the second base (31) as the first terminal (28) on the first base (21). This bulb-shaped lamp (1) is further provided with a conductive member (27) which covers the lead wire (70), the first terminal (28) and the second terminal (38) and which electrically connects the lead wire (70), the first terminal (28) and the second terminal (38).

Description

電球形ランプ、照明装置及び電球形ランプの製造方法Light bulb shaped lamp, lighting device and manufacturing method of light bulb shaped lamp
　本発明は、電球形ランプ、照明装置及び電球形ランプの製造方法に関し、特に、半導体発光素子を用いた電球形ランプ、これを用いた照明装置、及び電球形ランプの製造方法に関する。 The present invention relates to a light bulb-shaped lamp, a lighting device and a method of manufacturing the light bulb-shaped lamp, and more particularly to a light bulb-shaped lamp using a semiconductor light emitting element, a lighting device using the same, and a method of manufacturing the light bulb-shaped lamp.
　近年、ＬＥＤ（Ｌｉｇｈｔ　Ｅｍｉｔｔｉｎｇ　Ｄｉｏｄｅ）等の半導体発光素子は、高効率及び長寿命であることから、各種ランプの新しい光源として期待されており、ＬＥＤを光源とするＬＥＤランプの研究開発が進められている。 In recent years, semiconductor light emitting devices such as LEDs (Light Emitting Diodes) are expected to be new light sources for various lamps due to their high efficiency and long life, and research and development of LED lamps using LEDs as light sources are underway There is.
　このようなＬＥＤランプとしては、電球形のＬＥＤランプ（電球形ＬＥＤランプ）があり、電球形ＬＥＤランプでは、基板と、基板上に実装された複数のＬＥＤとを備える発光モジュールが用いられる。例えば、特許文献１には、従来の電球形ＬＥＤランプが開示されている。 As such an LED lamp, there is a bulb-shaped LED lamp (bulb-shaped LED lamp), and in the bulb-shaped LED lamp, a light emitting module including a substrate and a plurality of LEDs mounted on the substrate is used. For example, Patent Document 1 discloses a conventional bulb-shaped LED lamp.
　この特許文献１に開示された従来の電球形ＬＥＤランプでは、ＬＥＤが実装された基板に形成された貫通孔に、ＬＥＤに電力を供給するためのリード線が配置され、基板とリード線とが半田付けされる。 In the conventional bulb-shaped LED lamp disclosed in Patent Document 1, a lead wire for supplying power to the LED is disposed in a through hole formed in a substrate on which the LED is mounted, and the substrate and the lead wire It is soldered.
特開２００６－３１３７１７号公報JP 2006-313717 A
　ここで、上記のような電球形ＬＥＤランプに用いられる発光モジュールは、通常、基板の片面（ＬＥＤが実装された面）のみから光を取り出すような構成となっているため、電球形ＬＥＤランプの口金側への光束は低く、広い配光角を実現することは困難である。このため、口金に向けて光を発する別の発光モジュールを設けることが考えられる。つまり、２つの発光モジュールを用い、当該２つの発光モジュールのＬＥＤが実装されていない面同士を貼り合わせる。この場合、２つの発光モジュールのＬＥＤに電力を供給するために、２つの発光モジュールの外部端子とリード線とを半田付け等によって接続する必要がある。 Here, since the light emitting module used for the above-described bulb-shaped LED lamp is usually configured to extract light only from one side (the surface on which the LED is mounted) of the substrate, The luminous flux to the base is low, and it is difficult to realize a wide light distribution angle. Therefore, it is conceivable to provide another light emitting module that emits light toward the base. That is, two light emitting modules are used, and the surfaces of the two light emitting modules on which the LEDs are not mounted are attached to each other. In this case, in order to supply power to the LEDs of the two light emitting modules, it is necessary to connect the external terminals of the two light emitting modules and the lead wires by soldering or the like.
　具体的には、２つの発光モジュールのうち上側の発光モジュールの上面の端子とリード線とを半田付けし、また、下側の発光モジュールの下面の端子とリード線とを半田付けする。しかしながら、この場合には、半田付けを上下２方向から行う必要があるため、当該２つの発光モジュールにリード線を接続する際の生産性が低下する。 Specifically, the terminal on the upper surface of the light emitting module of the two light emitting modules is soldered to the lead wire, and the terminal on the lower surface of the light emitting module on the lower side is soldered to the lead wire. However, in this case, since it is necessary to perform soldering from the upper and lower two directions, the productivity at the time of connecting the lead wires to the two light emitting modules is reduced.
　本発明は、このような問題に鑑み、２つの発光モジュールを貼り合わせる構成において、当該２つの発光モジュールにリード線を接続する際の生産性を向上させることができる電球形ランプ、照明装置及び電球形ランプの製造方法を提供することを目的とする。 The present invention, in view of such problems, in a configuration in which two light emitting modules are bonded together, a bulb-shaped lamp, a lighting device, and a light bulb capable of improving the productivity when connecting the lead wires to the two light emitting modules. It is an object of the present invention to provide a method of manufacturing a lamp.
　上記目的を達成するために、本発明の一態様に係る電球形ランプは、口金と、前記口金の上方に配置される透光性グローブとを有する電球形ランプであって、前記透光性グローブ内方に配置され、上面に第一発光素子群が設けられた主発光モジュールと、前記透光性グローブ内方に配置され、前記主発光モジュールの下面に接合されるとともに、下面に第二発光素子群が設けられた副発光モジュールと、前記第一発光素子群と前記第二発光素子群とに電力を供給するための駆動回路と、前記主発光モジュール及び前記副発光モジュールと前記駆動回路とを電気的に接続するためのリード線とを備え、前記主発光モジュールは、主基板と、前記主基板の上側又は下側の面に設けられ前記第一発光素子群と前記駆動回路とを電気的に接続するための第一端子とを有し、前記副発光モジュールは、副基板と、前記副基板の前記第一端子が設けられた面と同じ側の面に設けられ前記第二発光素子群と前記駆動回路とを電気的に接続するための第二端子とを有し、前記電球形ランプは、さらに、前記リード線と前記第一端子と前記第二端子とを覆い、前記リード線と前記第一端子と前記第二端子とを電気的に接続する導電性部材を備えることを特徴とする。 In order to achieve the above object, a light bulb shaped lamp according to one aspect of the present invention is a light bulb shaped lamp having a base and a translucent glove disposed above the base, the translucent glove A main light emitting module disposed inward and provided with a first light emitting element group on the upper surface, and is disposed inward of the translucent glove and joined to the lower surface of the main light emitting module, and a second light emission on the lower surface An auxiliary light emitting module provided with an element group, a drive circuit for supplying power to the first light emitting element group and the second light emitting element group, the main light emitting module, the auxiliary light emitting module, and the drive circuit And the main light emitting module is provided on the main substrate and the upper or lower surface of the main substrate to electrically connect the first light emitting element group and the drive circuit. Connected And the sub light emitting module is provided on the same side as the sub substrate and the surface on which the first terminal of the sub substrate is provided, and the second light emitting element group and the driving circuit And the second bulb for electrically connecting the two, and the bulb-shaped lamp further covers the lead wire, the first terminal and the second terminal, and the lead wire and the first terminal And a conductive member electrically connecting the second terminal and the second terminal.
　また、本発明に係る電球形ランプの一態様において、前記主基板には、前記リード線が挿入される第一貫通孔が形成されており、前記第一端子は、前記第一貫通孔の外方かつ前記主基板の上面に配置され、前記副基板には、前記リード線が挿入される、前記第一貫通孔よりも小さい第二貫通孔が形成されており、前記第二端子は、前記第一貫通孔の内方であって、前記第二貫通孔の外方かつ前記副基板の上面に配置され、前記導電性部材は、前記リード線と前記第一端子と前記第二端子とを上方から覆うことにしてもよい。 Moreover, in one aspect of the light bulb shaped lamp according to the present invention, a first through hole into which the lead wire is inserted is formed in the main substrate, and the first terminal is outside the first through hole. And a second through hole smaller than the first through hole, which is disposed on the upper surface of the main substrate and into which the lead wire is inserted, is formed in the sub substrate, and the second terminal is The conductive member is disposed inward of the first through hole, outside the second through hole and on the upper surface of the sub-substrate, and the conductive member is configured to connect the lead wire, the first terminal, and the second terminal. It may be covered from above.
　また、本発明に係る電球形ランプの一態様において、前記第二端子は、前記副基板に形成された導電性ビアにより、前記第二発光素子群と電気的に接続されることにしてもよい。 In one aspect of the light bulb shaped lamp according to the present invention, the second terminal may be electrically connected to the second light emitting element group by a conductive via formed in the sub substrate. .
　また、本発明に係る電球形ランプの一態様において、前記副基板には、前記リード線が挿入される貫通孔が形成されており、前記第一端子は、前記貫通孔の内方かつ前記主基板の下面に配置され、前記第二端子は、前記貫通孔の外方かつ前記副基板の下面に配置され、前記導電性部材は、前記リード線と前記第一端子と前記第二端子とを下方から覆うことにしてもよい。 Further, in one aspect of the light bulb shaped lamp according to the present invention, a through hole into which the lead wire is inserted is formed in the sub-substrate, and the first terminal is an inner side of the through hole and the main The second terminal is disposed on the lower surface of the substrate, the second terminal is disposed on the outer side of the through hole and the lower surface of the sub substrate, and the conductive member is configured to connect the lead wire, the first terminal, and the second terminal. It may be covered from below.
　また、本発明に係る電球形ランプの一態様において、前記第二端子は、前記副基板の下面の端部に配置され、前記第一端子は、前記副基板の外側かつ前記主基板の下面の端部に配置され、前記導電性部材は、前記リード線と前記第一端子と前記第二端子とを下方から覆うことにしてもよい。 In one aspect of the light bulb shaped lamp according to the present invention, the second terminal is disposed at an end of the lower surface of the sub substrate, and the first terminal is outside the sub substrate and on the lower surface of the main substrate. The conductive member may be disposed at an end, and the conductive member may cover the lead wire, the first terminal, and the second terminal from below.
　また、本発明に係る電球形ランプの一態様において、前記第一端子は、前記主基板に形成された導電性ビアにより、前記第一発光素子群と電気的に接続されることにしてもよい。 In one aspect of the light bulb shaped lamp according to the present invention, the first terminal may be electrically connected to the first light emitting element group by a conductive via formed in the main substrate. .
　また、上記目的を達成するために、本発明の一態様に係る照明装置は、上記いずれかの電球形ランプを備える照明装置であることを特徴とする。 Moreover, in order to achieve the said objective, the illuminating device which concerns on 1 aspect of this invention is characterized by being an illuminating device provided with the said bulb-shaped lamp | ramp.
　また、上記目的を達成するために、本発明の一態様に係る電球形ランプの製造方法は、口金と、前記口金の上方に配置される透光性グローブとを有する電球形ランプの製造方法であって、前記電球形ランプは、第一発光素子群が設けられた主発光モジュールと、第二発光素子群が設けられた副発光モジュールと、前記第一発光素子群と前記第二発光素子群とに電力を供給するための駆動回路と、前記主発光モジュール及び前記副発光モジュールと前記駆動回路とを電気的に接続するためのリード線とを備え、前記電球形ランプの製造方法は、前記主発光モジュールの主基板の面上に設けられ前記第一発光素子群と前記駆動回路とを電気的に接続するための第一端子と、前記副発光モジュールの副基板の面上に設けられ前記第二発光素子群と前記駆動回路とを電気的に接続するための第二端子とが、同じ側の面上に配置されるように、前記主発光モジュールと前記副発光モジュールとを接合する接合工程と、前記リード線と前記第一端子と前記第二端子とを導電性部材で覆うことにより、前記リード線と前記第一端子と前記第二端子とを電気的に接続する接続工程とを含むことを特徴とする。 In addition, in order to achieve the above object, a method of manufacturing a bulb-shaped lamp according to an aspect of the present invention is a method of manufacturing a bulb-shaped lamp having a base and a translucent globe disposed above the base. The light bulb shaped lamp includes a main light emitting module provided with a first light emitting element group, a sub light emitting module provided with a second light emitting element group, the first light emitting element group and the second light emitting element group And a lead wire for electrically connecting the main light emitting module and the sub light emitting module to the drive circuit, the method for manufacturing the bulb-shaped lamp comprising the steps of: A first terminal provided on the surface of the main substrate of the main light emitting module for electrically connecting the first light emitting element group to the drive circuit, and provided on the surface of the sub substrate of the sub light emitting module With a second light emitting element group A bonding step of bonding the main light emitting module and the sub light emitting module such that the second terminal for electrically connecting to the drive circuit is disposed on the same side surface, and the lead wire And connecting the lead wire, the first terminal, and the second terminal by electrically covering the first terminal, the second terminal, and the second terminal with a conductive member. .
　また、本発明に係る電球形ランプの製造方法の一態様において、前記接続工程では、前記主基板に形成された第一貫通孔の内方、かつ、前記副基板に形成された前記第一貫通孔よりも小さい第二貫通孔の内方に、前記リード線を配置し、前記第一貫通孔の外方かつ前記主基板の上面に配置された前記第一端子と、前記第一貫通孔の内方であって前記第二貫通孔の外方かつ前記副基板の上面に配置された前記第二端子と、前記リード線とを前記導電性部材で上方から覆うことにより、前記リード線と前記第一端子と前記第二端子とを電気的に接続することにしてもよい。 In one aspect of the method for manufacturing a light bulb-shaped lamp according to the present invention, in the connecting step, the first through hole formed in the sub substrate and the inner side of the first through hole formed in the main substrate. The lead wire is disposed inward of the second through hole smaller than the hole, and the first terminal disposed on the outer side of the first through hole and on the upper surface of the main substrate, and the first through hole The lead wire and the lead wire are covered by covering the lead terminal from the upper side with the conductive member, and the lead terminal from the upper side of the second through hole and on the upper surface of the sub-substrate. The first terminal and the second terminal may be electrically connected.
　本発明によれば、２つの発光モジュールを貼り合わせる構成において、当該２つの発光モジュールにリード線を接続する際の生産性を向上させることができる電球形ランプ、照明装置及び電球形ランプの製造方法を実現することができる。 According to the present invention, in a configuration in which two light emitting modules are bonded to each other, the productivity can be improved when connecting the lead wires to the two light emitting modules, a lighting device, and a method of manufacturing the light bulb shaped lamp Can be realized.
図１は、本発明の実施の形態に係る電球形ランプの側面図である。FIG. 1 is a side view of a light bulb shaped lamp according to an embodiment of the present invention. 図２は、本発明の実施の形態に係る電球形ランプの分解斜視図である。FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment of the present invention. 図３は、本発明の実施の形態に係る電球形ランプの断面図である。FIG. 3 is a cross-sectional view of a light bulb shaped lamp according to an embodiment of the present invention. 図４は、本発明の実施の形態に係るＬＥＤモジュールの構成を示す図である。FIG. 4 is a diagram showing the configuration of the LED module according to the embodiment of the present invention. 図５は、本発明の実施の形態に係るＬＥＤモジュールとリード線との接続箇所の構成を示す図である。FIG. 5 is a view showing the configuration of the connection portion between the LED module and the lead wire according to the embodiment of the present invention. 図６は、本発明の実施の形態に係る第一発光モジュール及び第二発光モジュールのリード線との接続部分を示す図である。FIG. 6 is a view showing a connection portion with the lead wires of the first light emitting module and the second light emitting module according to the embodiment of the present invention. 図７は、本発明の実施の形態に係る電球形ランプ１の製造方法を示すフローチャートである。FIG. 7 is a flowchart showing a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention. 図８は、本発明の実施の形態に係る電球形ランプ１の製造方法を示すフローチャートである。FIG. 8 is a flowchart showing a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention. 図９は、本発明の実施の形態に係る電球形ランプ１の製造過程を説明するための図である。FIG. 9 is a view for explaining the manufacturing process of the light bulb shaped lamp 1 according to the embodiment of the present invention. 図１０は、本発明の実施の形態の変形例１に係る電球形ランプにおけるＬＥＤモジュールとリード線との接続箇所の構成を示す図である。FIG. 10 is a view showing the configuration of the connection portion between the LED module and the lead wire in the light bulb shaped lamp according to the first modification of the embodiment of the present invention. 図１１は、本発明の実施の形態の変形例１に係る電球形ランプの製造方法を示すフローチャートである。FIG. 11 is a flowchart showing a method of manufacturing a light bulb shaped lamp according to the first modification of the embodiment of the present invention. 図１２は、本発明の実施の形態の変形例１に係る電球形ランプの製造過程を説明するための図である。FIG. 12 is a view for explaining the manufacturing process of the light bulb shaped lamp according to the first modification of the embodiment of the present invention. 図１３は、本発明の実施の形態の変形例２に係る電球形ランプにおけるＬＥＤモジュールとリード線との接続箇所の構成を示す図である。FIG. 13 is a view showing the configuration of the connection portion between the LED module and the lead wire in the light bulb shaped lamp according to the second modification of the embodiment of the present invention. 図１４は、本発明の実施の形態の変形例３に係るＬＥＤモジュールと支柱の構成を示す図である。FIG. 14 is a view showing the configuration of an LED module and a support according to a third modification of the embodiment of the present invention.
　以下、本発明の実施の形態に係る電球形ランプ及び照明装置について、図面を用いて詳細に説明する。なお、以下で説明する実施の形態は、いずれも本発明の好ましい一具体例を示すものである。以下の実施の形態で示される数値、形状、材料、構成要素、構成要素の配置位置及び接続形態、ステップ、ステップの順序などは、一例であり、本発明を限定する主旨ではない。また、以下の実施の形態における構成要素のうち、本発明の最上位概念を示す独立請求項に記載されていない構成要素については、より好ましい形態を構成する任意の構成要素として説明される。また、図面において、実質的に同一の構成、動作、及び効果を表す要素については、同一の符号を付す。なお、各図は、模式図であり、必ずしも厳密に図示したものではない。 Hereinafter, a light bulb-shaped lamp and a lighting apparatus according to an embodiment of the present invention will be described in detail using the drawings. The embodiments described below all show one preferable specific example of the present invention. Numerical values, shapes, materials, components, arrangement positions and connection forms of components, steps, order of steps, and the like shown in the following embodiments are merely examples, and the present invention is not limited thereto. Further, among the components in the following embodiments, components not described in the independent claim indicating the highest concept of the present invention will be described as optional components constituting a more preferable embodiment. Further, in the drawings, elements that represent substantially the same configuration, operation, and effect are denoted by the same reference numerals. Each figure is a schematic view and is not necessarily strictly illustrated.
　まず、本発明の実施の形態に係る電球形ランプ１の全体構成について、図１～図３を参照しながら説明する。 First, the overall configuration of the light bulb shaped lamp 1 according to the embodiment of the present invention will be described with reference to FIGS. 1 to 3.
　図１は、本発明の実施の形態に係る電球形ランプ１の側面図である。図２は、本発明の実施の形態に係る電球形ランプ１の分解斜視図である。図３は、本発明の実施の形態に係る電球形ランプ１の断面図である。 FIG. 1 is a side view of a light bulb shaped lamp 1 according to an embodiment of the present invention. FIG. 2 is an exploded perspective view of the light bulb shaped lamp 1 according to the embodiment of the present invention. FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the embodiment of the present invention.
　電球形ランプ１は、電球形蛍光灯又は白熱電球の代替品となる電球形ＬＥＤランプである。電球形ランプ１は、透光性のグローブ１０と、光源であるＬＥＤモジュール２と、支柱４０と、支持板５０と、樹脂ケース６０と、リード線７０と、点灯回路８０と、ランプ外部から電力を受ける口金９０とを備えている。 The bulb-shaped lamp 1 is a bulb-shaped LED lamp which is a substitute for a bulb-shaped fluorescent lamp or an incandescent lamp. The light bulb-shaped lamp 1 includes a translucent globe 10, an LED module 2 as a light source, a support 40, a support plate 50, a resin case 60, a lead wire 70, a lighting circuit 80, and power from outside the lamp And a base 90 for receiving the
　電球形ランプ１は、グローブ１０と樹脂ケース６０（第１ケース部６１）と口金９０とによって外囲器が構成されている。ここで、以降の説明においては、これらの図に示すＺ軸プラス方向を上方、Ｚ軸マイナス方向を下方として、説明を行う。つまり、グローブ１０は、口金９０の上方に配置されている。なお、上記の方向の定義は、電球形ランプ１が点灯器具に取り付けられる場合の方向とは関係なく、電球形ランプ１が点灯器具に取り付けられる場合には、いずれの方向が上方又は下方になってもかまわない。 In the light bulb shaped lamp 1, an envelope is configured by the globe 10, the resin case 60 (first case portion 61), and the base 90. Here, in the following description, the description will be made with the Z-axis positive direction shown in these figures as the upper side and the Z-axis negative direction as the lower side. That is, the glove 10 is disposed above the base 90. In addition, the definition of said direction is not related to the direction when the bulb-shaped lamp 1 is attached to the lighting fixture, and when the bulb-shaped lamp 1 is attached to the lighting fixture, which direction is upward or downward It does not matter.
　［グローブ］
　グローブ１０は、ＬＥＤモジュール２を収納する。グローブ１０は、ＬＥＤモジュール２からの光に対して透明な材料から構成され、ＬＥＤモジュール２からの光を透過させてランプ外部に透光する透光性グローブである。このようなグローブ１０としては、可視光に対して透明なシリカガラス製のガラスバルブ（クリアバルブ）とすることができる。この場合、グローブ１０内に収納されたＬＥＤモジュール２は、グローブ１０の外側から視認することができる。 [Globe]
The glove 10 accommodates the LED module 2. The globe 10 is a translucent globe that is made of a material that is transparent to the light from the LED module 2 and transmits the light from the LED module 2 to transmit light to the outside of the lamp. Such a globe 10 can be a glass bulb (clear bulb) made of silica glass that is transparent to visible light. In this case, the LED module 2 housed in the glove 10 can be viewed from the outside of the glove 10.
　グローブ１０の形状は、一端が球状に閉塞され、他端に開口部１１を有する形状である。具体的に、グローブ１０の形状は、中空の球の一部が、球の中心部から遠ざかる方向（Ｚ軸マイナス方向）に伸びながら狭まったような形状であり、球の中心部から遠ざかった位置に開口部１１が形成されている。このような形状のグローブ１０としては、一般的な白熱電球と同様の形状のガラスバルブを用いることができる。例えば、グローブ１０として、Ａ形、Ｇ形又はＥ形等のガラスバルブを用いることができる。 The shape of the glove 10 is a shape in which one end is closed spherically and the other end has an opening 11. Specifically, the shape of the glove 10 is such that a part of the hollow sphere is narrowed while extending in the direction (Z-axis minus direction) away from the center of the sphere, and the position where the sphere is away from the center The opening 11 is formed in the As the globe 10 having such a shape, a glass bulb having the same shape as a general incandescent bulb can be used. For example, as the glove 10, a glass bulb such as A-shaped, G-shaped or E-shaped can be used.
　なお、グローブ１０は、必ずしも可視光に対して透明である必要はなく、グローブ１０に光拡散機能を持たせてもよい。例えば、シリカや炭酸カルシウム等の光拡散材を含有する樹脂や白色顔料等をグローブ１０の内面又は外面の全面に塗布することによって乳白色の光拡散膜を形成してもよい。また、グローブ１０は、シリカガラス製である必要もない。例えば、アクリル等の樹脂材料によって作製されたグローブ１０を用いても構わない。 The globe 10 does not necessarily have to be transparent to visible light, and the globe 10 may have a light diffusing function. For example, a milky white light diffusion film may be formed by applying a resin containing a light diffusion material such as silica or calcium carbonate, a white pigment, or the like on the entire inner surface or outer surface of the glove 10. Further, the glove 10 does not have to be made of silica glass. For example, a glove 10 made of a resin material such as acrylic may be used.
　［ＬＥＤモジュール］
　ＬＥＤモジュール２は、ＬＥＤ（ＬＥＤチップ）を有し、リード線７０を介してＬＥＤに電力が供給されることにより発光する発光モジュールである。ＬＥＤモジュール２は、支柱４０によってグローブ１０内に中空状態で保持されている。 [LED module]
The LED module 2 is a light emitting module that has an LED (LED chip) and emits light when power is supplied to the LED through the lead 70. The LED module 2 is held in the hollow state in the glove 10 by the support 40.
　ＬＥＤモジュール２は、グローブ１０によって形成される球形状の中心位置（例えば、グローブ１０の内径が大きい径大部分の内部）に配置されることが好ましい。このように、グローブ１０の中心位置にＬＥＤモジュール２が配置されることにより、電球形ランプ１の配光特性は、従来のフィラメントコイルを用いた一般白熱電球と近似した配光特性となる。 It is preferable that the LED module 2 be disposed at a central position of the spherical shape formed by the globe 10 (for example, inside the major portion where the inner diameter of the globe 10 is large). Thus, by disposing the LED module 2 at the center position of the globe 10, the light distribution characteristic of the light bulb shaped lamp 1 becomes a light distribution characteristic similar to a general incandescent light bulb using a conventional filament coil.
　なお、ＬＥＤモジュール２の詳細な構成については、後述する。 The detailed configuration of the LED module 2 will be described later.
　［口金］
　口金９０は、ＬＥＤモジュール２のＬＥＤを発光させるための電力を電球形ランプ１外部から受ける受電部である。口金９０は、二接点によって交流電力を受電し、口金９０で受電した電力はリード線を介して点灯回路８０の電力入力部に入力される。口金９０は、照明器具（照明装置）のソケットに取り付けられてソケットから電力を受けることで電球形ランプ１（ＬＥＤモジュール２）を点灯させる。 [Cap]
The base 90 is a power receiving unit that receives power for causing the LEDs of the LED module 2 to emit light from the outside of the light bulb shaped lamp 1. The base 90 receives AC power at two contacts, and the power received by the base 90 is input to the power input unit of the lighting circuit 80 through the lead wire. The base 90 is attached to a socket of a lighting fixture (lighting device) and receives electric power from the socket to light the light bulb shaped lamp 1 (LED module 2).
　例えば、口金９０はＥ形であり、その外周面には照明装置のソケットに螺合させるための螺合部が形成され、その内周面には樹脂ケース６０に螺合させるための螺合部が形成されている。口金９０は、金属製の有底筒体形状である。なお、口金９０としては、ねじ込み型のエジソンタイプ（Ｅ型）の口金の他にも、Ｅ２６形又はＥ１７形の口金等を用いることができる。 For example, the base 90 is E-shaped, and a screwing portion for screwing with a socket of the lighting apparatus is formed on the outer peripheral surface thereof, and a screwing portion for screwing with the resin case 60 is formed on the inner peripheral surface thereof. Is formed. The base 90 is a bottomed cylindrical body made of metal. In addition to the screw-type Edison-type (E-type) nozzle, an E26-type or E17-type nozzle or the like can be used as the nozzle 90.
　［支柱］
　支柱４０は、グローブ１０の開口部１１の近傍から上方（グローブ１０の内方）に向かって延びるように設けられたステムであり、グローブ１０内でＬＥＤモジュール２を保持する保持部材として機能する。支柱４０の一端はＬＥＤモジュール２に接続され、他端は支持板５０に接続されている。つまり、支柱４０の上面はＬＥＤモジュール２の下面と接しており、支柱４０とＬＥＤモジュール２とは、例えばシリコーン樹脂等の樹脂の接着剤により接着されている。 [Support]
The support 40 is a stem provided so as to extend upward (inward of the glove 10) from the vicinity of the opening 11 of the glove 10, and functions as a holding member for holding the LED module 2 in the glove 10. One end of the support 40 is connected to the LED module 2, and the other end is connected to the support plate 50. That is, the upper surface of the support 40 is in contact with the lower surface of the LED module 2, and the support 40 and the LED module 2 are bonded by an adhesive of resin such as silicone resin, for example.
　支柱４０は、ＬＥＤモジュール２で発生する熱を口金９０側に放熱させるための放熱部材としても機能する。従って、支柱４０を熱伝導率の高い金属材料、例えば熱伝導率が２３７［Ｗ／ｍ・Ｋ］のアルミニウム等により構成することで支柱４０による放熱効率を高めることができる。その結果、温度上昇によるＬＥＤの発光効率及び寿命の低下を抑制することができる。なお、支柱４０は、樹脂等により構成することもできる。 The columns 40 also function as a heat radiating member for radiating heat generated by the LED module 2 to the base 90 side. Therefore, the heat dissipation efficiency of the support 40 can be enhanced by configuring the support 40 with a metal material having high thermal conductivity, such as aluminum having a thermal conductivity of 237 [W / m · K]. As a result, it is possible to suppress the decrease in the light emission efficiency and the life of the LED due to the temperature rise. The columns 40 can also be made of resin or the like.
　［支持板］
　支持板５０は、支柱４０を支持する部材であり、樹脂ケース６０に固定されている。支持板５０は、グローブ１０の開口部１１の開口端に接続されてグローブ１０の開口部１１を塞ぐように構成されている。具体的に、支持板５０は、周縁に段差部を有する円盤状部材で構成されており、その段差部にはグローブ１０の開口部１１の開口端が当接されている。そして、この段差部において、支持板５０と樹脂ケース６０とグローブ１０の開口部１１の開口端とが、接着剤によって固着されている。 [Support plate]
The support plate 50 is a member for supporting the support column 40, and is fixed to the resin case 60. The support plate 50 is connected to the open end of the opening 11 of the glove 10 and configured to close the opening 11 of the glove 10. Specifically, the support plate 50 is formed of a disk-like member having a stepped portion at the periphery, and the open end of the opening 11 of the glove 10 is in contact with the stepped portion. In the step portion, the support plate 50, the resin case 60, and the opening end of the opening 11 of the glove 10 are fixed by an adhesive.
　支持板５０は、支柱４０と同様に、アルミニウム等の熱伝導率の高い金属材料により構成されることで、支持板５０による支柱４０を熱伝導したＬＥＤモジュール２の熱の放熱効率が高められる。その結果、温度上昇によるＬＥＤの発光効率及び寿命の低下をさらに抑制することができる。 The support plate 50 is made of a metal material having high thermal conductivity, such as aluminum, similarly to the support column 40, so that the heat radiation efficiency of the heat of the LED module 2 thermally conducted by the support plate 50 is enhanced. As a result, it is possible to further suppress the decrease in the light emission efficiency and the life of the LED due to the temperature rise.
　［樹脂ケース］
　樹脂ケース６０は、支柱４０と口金９０とを絶縁すると共に点灯回路８０を収納するための絶縁ケース（回路ホルダ）であり、大径円筒状の第１ケース部６１と、小径円筒状の第２ケース部６２とから構成されている。樹脂ケース６０は、例えば、ポリブチレンテレフタレート（ＰＢＴ）によって成形することができる。 [Resin case]
The resin case 60 is an insulating case (circuit holder) for insulating the support 40 and the base 90 and housing the lighting circuit 80, and has a large diameter cylindrical first case portion 61 and a small diameter cylindrical second case. And a case portion 62. The resin case 60 can be formed of, for example, polybutylene terephthalate (PBT).
　第１ケース部６１の外表面は外気に露出しているので、樹脂ケース６０に伝導した熱は、主に第１ケース部６１から放熱される。第２ケース部６２は、外周面が口金９０の内周面と接触するように構成されており、第２ケース部６２の外周面には口金９０と螺合するための螺合部が形成されている。 Since the outer surface of the first case portion 61 is exposed to the outside air, the heat conducted to the resin case 60 is mainly dissipated from the first case portion 61. The second case portion 62 is configured such that the outer peripheral surface is in contact with the inner peripheral surface of the base 90, and a screwing portion for screwing with the base 90 is formed on the outer peripheral surface of the second case portion 62. ing.
　［リード線］
　２本のリード線７０は、ＬＥＤモジュール２を点灯させるための電力を点灯回路８０からＬＥＤモジュール２に供給するための銅線等の針金状の金属電線である。各リード線７０は、グローブ１０内に配置され、一端がＬＥＤモジュール２の外部端子と電気的に接続され、他端が点灯回路８０の電力出力部、言い換えると口金９０と電気的に接続されている。つまり、２本のリード線７０は、後述する第一発光モジュール２０及び第二発光モジュール３０と点灯回路８０とを電気的に接続するためのリード線対である。リード線７０は、その一部がＬＥＤモジュール２の外部端子に接続されることでＬＥＤモジュール２を支持する支持部としても機能している。 [Lead]
The two lead wires 70 are wire-shaped metal wires such as copper wires for supplying power for lighting the LED module 2 from the lighting circuit 80 to the LED module 2. Each lead 70 is disposed in the glove 10, one end is electrically connected to the external terminal of the LED module 2, and the other end is electrically connected to the power output portion of the lighting circuit 80, in other words, the cap 90 There is. That is, the two lead wires 70 are a pair of lead wires for electrically connecting the lighting circuit 80 with the first light emitting module 20 and the second light emitting module 30 described later. The lead wire 70 also functions as a support for supporting the LED module 2 by connecting a part of the lead wire 70 to the external terminal of the LED module 2.
　２本のリード線７０は、金属の芯線と当該芯線を被覆する絶縁性樹脂とで構成される例えばビニル線であり、ＬＥＤモジュール２とは絶縁性樹脂で被覆されておらず表面がむき出しにされた芯線を介して電気的に接続される。 The two lead wires 70 are, for example, vinyl wires composed of a metal core wire and an insulating resin for covering the core wire, and are not covered with the insulating resin with the LED module 2 and the surface is exposed. It is electrically connected through the core wire.
　なお、リード線７０のＬＥＤモジュール２との接続関係の詳細については、後述する。 In addition, the detail of the connection relation with the LED module 2 of the lead wire 70 is mentioned later.
　［点灯回路］
　点灯回路８０は、ＬＥＤモジュール２のＬＥＤを点灯させるための回路ユニットであり、複数の回路素子と、各回路素子が実装される回路基板とを有する。点灯回路８０は、口金９０から給電された交流電力を直流電力に変換し、２本のリード線７０を介して変換後の直流電力をＬＥＤモジュール２のＬＥＤに供給する。つまり、点灯回路８０は、後述する第一発光素子２２と第二発光素子３２とに電力を供給するための駆動回路である。 [Lighting circuit]
The lighting circuit 80 is a circuit unit for lighting the LEDs of the LED module 2 and includes a plurality of circuit elements and a circuit board on which each circuit element is mounted. The lighting circuit 80 converts alternating current power supplied from the base 90 into direct current power, and supplies the converted direct current power to the LED of the LED module 2 through the two lead wires 70. That is, the lighting circuit 80 is a drive circuit for supplying power to the first light emitting element 22 and the second light emitting element 32 described later.
　なお、電球形ランプ１は、必ずしも点灯回路８０を備える必要はない。例えば、照明器具又は電池等から電球形ランプ１に直接直流電力が供給される場合には、電球形ランプ１は、点灯回路８０を備えなくてもよい。また、点灯回路８０は、平滑回路に限られるものではなく、調光回路及び昇圧回路等を適宜選択、組み合わせて構成することができる。 The bulb-shaped lamp 1 does not necessarily have to include the lighting circuit 80. For example, in the case where direct current power is supplied to the light bulb shaped lamp 1 directly from a lighting fixture or a battery or the like, the light bulb shaped lamp 1 may not include the lighting circuit 80. The lighting circuit 80 is not limited to the smoothing circuit, and can be configured by appropriately selecting and combining the light control circuit, the booster circuit, and the like.
　次に、ＬＥＤモジュール２の詳細な構成と、ＬＥＤモジュール２及びリード線７０の接続関係とについて、図４～図６を用いて説明する。 Next, the detailed configuration of the LED module 2 and the connection relationship between the LED module 2 and the lead wire 70 will be described with reference to FIGS. 4 to 6.
　図４は、本発明の実施の形態に係るＬＥＤモジュール２の構成を示す図である。具体的には、図４の（ａ）は、電球形ランプ１においてグローブ１０を除いた状態でＬＥＤモジュール２を上方から見たときの平面図である。また、図４の（ｂ）は、図４の（ａ）のＡ－Ａ’線に沿って切断したＬＥＤモジュール２の断面図であり、図４の（ｃ）は、図４の（ａ）のＢ－Ｂ’線に沿って切断したＬＥＤモジュール２の断面図である。 FIG. 4 is a view showing the configuration of the LED module 2 according to the embodiment of the present invention. Specifically, FIG. 4A is a plan view when the LED module 2 is viewed from above with the bulb 10 removed the globe 10. 4 (b) is a cross-sectional view of the LED module 2 cut along the line AA 'in FIG. 4 (a), and FIG. 4 (c) is a diagram in FIG. 4 (a). FIG. 6 is a cross-sectional view of the LED module 2 taken along the line BB ′ of FIG.
　図５は、本発明の実施の形態に係るＬＥＤモジュール２とリード線７０との接続箇所の構成を示す図である。具体的には、図５の（ａ）は、図４の（ａ）のＣ－Ｃ’線に沿って切断したＬＥＤモジュール２の断面図であり、図５の（ｂ）は、ＬＥＤモジュール２とリード線７０との接続箇所を拡大して示す図である。 FIG. 5 is a view showing the configuration of the connection portion between the LED module 2 and the lead wire 70 according to the embodiment of the present invention. Specifically, (a) of FIG. 5 is a cross-sectional view of the LED module 2 cut along the line CC ′ of (a) of FIG. 4, and (b) of FIG. 5 is an enlarged view of a connection point between the lead wire 70 and the lead wire 70. FIG.
　図６は、本発明の実施の形態に係る第一発光モジュール２０及び第二発光モジュール３０のリード線７０との接続部分を示す図である。具体的には、図６の（ａ）は、第一発光モジュール２０のリード線７０との接続部分を上方から見たときの平面図であり、図６の（ｂ）は、第一発光モジュール２０のリード線７０との接続部分の断面図である。また、図６の（ｃ）は、第二発光モジュール３０のリード線７０との接続部分を上方から見たときの平面図であり、図６の（ｄ）は、第二発光モジュール３０のリード線７０との接続部分の断面図である。 FIG. 6 is a view showing a connection portion of the first light emitting module 20 and the second light emitting module 30 with the lead wire 70 according to the embodiment of the present invention. Specifically, (a) of FIG. 6 is a plan view when the connection portion of the first light emitting module 20 with the lead wire 70 is viewed from above, and (b) of FIG. 6 is a first light emitting module 20 is a cross-sectional view of a connecting portion with the 20 lead wires 70. FIG. 6C is a plan view of the connection portion of the second light emitting module 30 with the lead wire 70 as viewed from above, and FIG. 6D shows the lead of the second light emitting module 30. FIG. 7 is a cross-sectional view of a connection portion with the line 70
　ＬＥＤモジュール２は、ベアチップが上面及び下面に直接実装されたＣＯＢ（Ｃｈｉｐ　Ｏｎ　Ｂｏａｒｄ）構造である。ここで、ＬＥＤモジュール２は、第一発光モジュール２０と、第一発光モジュール２０の下面に接合された第二発光モジュール３０と、導電性部材２７とを備えている。つまり、リード線７０は、後述する第一発光モジュール２０の上面に設けられた第一発光素子２２と第二発光モジュール３０の下面に設けられた第二発光素子３２とに電力を供給する。 The LED module 2 is a COB (Chip On Board) structure in which bare chips are directly mounted on the upper and lower surfaces. Here, the LED module 2 includes the first light emitting module 20, the second light emitting module 30 joined to the lower surface of the first light emitting module 20, and the conductive member 27. That is, the lead wire 70 supplies power to the first light emitting element 22 provided on the upper surface of the first light emitting module 20 described later and the second light emitting element 32 provided on the lower surface of the second light emitting module 30.
　第一発光モジュール２０は、第一基台２１と、複数の第一発光素子２２と、第一封止部材２３と、第一金属配線２４及び２６と、第一ワイヤー２５と、第一端子（外部端子）２８とを備えている。ここで、複数の第一発光素子２２と、第一封止部材２３と、第一金属配線２４及び２６と、第一ワイヤー２５と、第一端子２８とは、第一基台２１の上面に設けられている。なお、第一発光モジュール２０は、請求の範囲に記載の「主発光モジュール」に相当し、第一基台２１は、請求の範囲に記載の「主基板」に相当する。 The first light emitting module 20 includes a first base 21, a plurality of first light emitting elements 22, a first sealing member 23, first metal wires 24 and 26, a first wire 25, and a first terminal ( And an external terminal 28). Here, the plurality of first light emitting elements 22, the first sealing member 23, the first metal wires 24 and 26, the first wires 25, and the first terminals 28 are disposed on the upper surface of the first base 21. It is provided. The first light emitting module 20 corresponds to the "main light emitting module" described in the claims, and the first base 21 corresponds to the "main substrate" described in the claims.
　また、第二発光モジュール３０は、第二基台３１と、複数の第二発光素子３２と、第二封止部材３３と、第二金属配線３４及び３６と、第二ワイヤー３５と、第二端子（外部端子）３８とを備えている。ここで、複数の第二発光素子３２と、第二封止部材３３と、第二金属配線３４及び３６と、第二ワイヤー３５とは、第二基台３１の下面に設けられている。また、第二端子３８は、第二基台３１の第一端子２８が設けられた面と同じ側の面、つまり上面に設けられている。なお、第二発光モジュール３０は、請求の範囲に記載の「副発光モジュール」に相当し、第二基台３１は、請求の範囲に記載の「副基板」に相当する。 In addition, the second light emitting module 30 includes a second base 31, a plurality of second light emitting elements 32, a second sealing member 33, second metal wires 34 and 36, a second wire 35, and a second wire. A terminal (external terminal) 38 is provided. Here, the plurality of second light emitting elements 32, the second sealing member 33, the second metal wires 34 and 36, and the second wires 35 are provided on the lower surface of the second base 31. Further, the second terminal 38 is provided on the same side as the surface on which the first terminal 28 of the second base 31 is provided, that is, on the upper surface. The second light emitting module 30 corresponds to the “sub light emitting module” described in the claims, and the second base 31 corresponds to the “sub substrate” described in the claims.
　［第一基台、第二基台］
　以下に、第一基台２１及び第二基台３１について詳細に説明する。なお、第一基台２１と第二基台３１とは同様の構成を有するため、以下では、第一基台２１についての説明を詳細に行うこととし、第二基台３１についての説明は簡略化又は省略する。 [First base, second base]
The first base 21 and the second base 31 will be described in detail below. In addition, since the first base 21 and the second base 31 have the same configuration, in the following, the description of the first base 21 will be described in detail, and the description of the second base 31 is simplified. Or omitted.
　第一基台２１は、例えば窒化アルミニウム等のセラミック基板、金属基板、樹脂基板、ガラス基板、フレキシブル基板又はアルミナ基板等の平板状の基板である。第一基台２１は、第一発光素子２２を実装するための矩形状の実装基板（ＬＥＤ実装用基板）である。第一基台２１は、その長辺の長さをＬ１とし、短辺の長さをＬ２とし、厚みをｄとすると、例えばＬ１＝２６ｍｍ、Ｌ２＝１３ｍｍ、ｄ＝１ｍｍとされる。 The first base 21 is, for example, a flat substrate such as a ceramic substrate such as aluminum nitride, a metal substrate, a resin substrate, a glass substrate, a flexible substrate, or an alumina substrate. The first base 21 is a rectangular mounting board (LED mounting board) for mounting the first light emitting element 22. Assuming that the length of the long side of the first base 21 is L1, the length of the short side is L2, and the thickness is d, for example, L1 = 26 mm, L2 = 13 mm, and d = 1 mm.
　第一基台２１は、第一発光素子２２から発せられる光に対して光透過率が低く例えば１０％以下の白色アルミナ基板や白色セラミック基板等の白色基板又は金属基板等で構成されることが好ましい。例えば、第一基台２１は、第一発光素子２２から発せられる光に対して光反射率５０％以上を有し、Ａｌ２Ｏ３、ＭｇＯ、ＳｉＯ、及びＴｉＯ２のいずれかを主成分とする基板で構成することができる。 The first base 21 may be formed of a white substrate such as a white alumina substrate or a white ceramic substrate having a low light transmittance, for example, 10% or less with respect to light emitted from the first light emitting element 22 or a metal substrate. preferable. For example, the first base 21 has a light reflectance of 50% or more with respect to light emitted from the first light emitting element 22, and is mainly made of any of Al 2 O 3 , MgO, SiO, and TiO 2. Can be configured with a substrate.
　ここで、第一基台２１及び第二基台３１の光透過率が高い場合、ＬＥＤモジュール２において、第一基台２１の表面側の第一発光素子２２の光の一部が、第一基台２１を通過した後、第二基台３１及び第二封止部材３３をさらに通過して、第二基台３１の下面側から発せられる。同様に、ＬＥＤモジュール２において、第二基台３１の下面側の第二発光素子３２の光の一部が、第二基台３１を通過した後、第一基台２１及び第一封止部材２３をさらに通過して、第一基台２１の上面側から発せられる。従って、電球形ランプ１において、口金側及びそれと反対側から取り出される光について色ずれが発生する。これに対し、第一基台２１及び第二基台３１の光透過率を低くすることで、このような色ずれを抑制することができる。また、安価な白色基板を用いることができるので、電球形ランプ１の低コスト化を実現できる。 Here, when the light transmittances of the first base 21 and the second base 31 are high, in the LED module 2, part of the light of the first light emitting element 22 on the surface side of the first base 21 is the first After passing through the base 21, the light further passes through the second base 31 and the second sealing member 33, and is emitted from the lower surface side of the second base 31. Similarly, in the LED module 2, after part of the light of the second light emitting element 32 on the lower surface side of the second base 31 passes through the second base 31, the first base 21 and the first sealing member Further, the light source 23 is emitted from the upper surface side of the first base 21 through 23. Therefore, in the light bulb shaped lamp 1, color shift occurs with respect to light extracted from the base side and the opposite side. On the other hand, such color shift can be suppressed by lowering the light transmittance of the first base 21 and the second base 31. Further, since an inexpensive white substrate can be used, cost reduction of the light bulb shaped lamp 1 can be realized.
　また、図５及び図６に示すように、第一基台２１の長辺方向の両端部には、第一基台２１の上面から下面に向けて貫通する２つの第一貫通孔２１ａが形成されている。また、第二基台３１の長辺方向の両端部には、第一貫通孔２１ａと対応する位置に、第二基台３１の上面から下面に向けて貫通する２つの第二貫通孔３１ａが形成されている。これらの第一貫通孔２１ａ及び第二貫通孔３１ａは、給電用のリード線７０と第一端子２８及び第二端子３８とを電気的に接続するためのものであり、第一貫通孔２１ａ及び第二貫通孔３１ａのそれぞれにはリード線７０が挿通されている。 Further, as shown in FIGS. 5 and 6, at both end portions in the long side direction of the first base 21, two first through holes 21a penetrating from the upper surface to the lower surface of the first base 21 are formed. It is done. Further, at both end portions in the long side direction of the second base 31, two second through holes 31a penetrating from the upper surface to the lower surface of the second base 31 are provided at positions corresponding to the first through holes 21a. It is formed. The first through holes 21 a and the second through holes 31 a are for electrically connecting the lead wire 70 for feeding to the first terminal 28 and the second terminal 38, and the first through holes 21 a and the second through holes 31 a The lead wire 70 is inserted through each of the second through holes 31 a.
　具体的には、第一貫通孔２１ａ及び第二貫通孔３１ａは、円柱形状（ＸＹ平面での断面が円形状）の貫通孔である。そして、第二貫通孔３１ａは、第一貫通孔２１ａの内側に配置された、第一貫通孔２１ａよりも小さい貫通孔である。例えば、第二貫通孔３１ａは、孔径が１ｍｍ程度の貫通孔であり、第一貫通孔２１ａは、孔径が２～４ｍｍ程度の貫通孔である。なお、第一貫通孔２１ａの孔径は、第一端子２８と第二端子３８とが近い位置に配置されるように大きさが定められるのが好ましい。 Specifically, the first through holes 21a and the second through holes 31a are through holes having a cylindrical shape (the cross section in the XY plane is circular). The second through hole 31a is a through hole smaller than the first through hole 21a disposed inside the first through hole 21a. For example, the second through holes 31a are through holes having a hole diameter of about 1 mm, and the first through holes 21a are through holes having a hole diameter of about 2 to 4 mm. Preferably, the diameter of the first through hole 21a is determined so that the first terminal 28 and the second terminal 38 are disposed close to each other.
　なお、第一基台２１上に設けられた複数の第一発光素子２２で発生する熱を放熱するために、第一基台２１と第二基台３１とは、接着剤などによって隙間無く貼り合わせられている。これにより、第一基台２１と第二基台３１との間での熱伝達性が良くなり、第一基台２１で発生した熱を支柱４０側に放熱することができる。 In order to dissipate the heat generated by the plurality of first light emitting elements 22 provided on the first base 21, the first base 21 and the second base 31 are attached without a gap by an adhesive or the like. It is fitted. Thereby, the heat conductivity between the first base 21 and the second base 31 is improved, and the heat generated in the first base 21 can be dissipated to the support 40 side.
　また、ＬＥＤモジュール２を支柱４０に固定するために、第二基台３１の中央部分に、支柱４０に形成された突起部と嵌合する溝や貫通孔などが形成されていてもよい。また、接着剤によりＬＥＤモジュール２を支柱４０に固定する構成でも構わない。 Moreover, in order to fix the LED module 2 to the support 40, a groove, a through hole, or the like may be formed in the central portion of the second base 31 so as to be fitted to the protrusion formed on the support 40. Moreover, the structure which fixes the LED module 2 to the support | pillar 40 with an adhesive agent may be used.
　［第一発光素子、第二発光素子］
　次に、第一発光素子２２及び第二発光素子３２について詳細に説明する。なお、第一発光素子２２と第二発光素子３２とは同様の構成を有するため、以下では、第一発光素子２２についての説明を詳細に行うこととし、第二発光素子３２についての説明は簡略化又は省略する。 [First light emitting element, second light emitting element]
Next, the first light emitting element 22 and the second light emitting element 32 will be described in detail. In addition, since the 1st light emitting element 22 and the 2nd light emitting element 32 have the same structure, below, it shall decide in detail about the 1st light emitting element 22, and the description about the 2nd light emitting element 32 is simplified. Or omitted.
　第一発光素子２２は、全方位、つまり側方、上方及び下方に向けて単色の可視光を発するベアチップである。第一発光素子２２は、例えば、側方に全光量の２０％、上方に全光量の６０％、下方に全光量の２０％の光を発する。 The first light emitting element 22 is a bare chip that emits monochromatic visible light in all directions, that is, sideward, upward, and downward. The first light emitting element 22 emits, for example, 20% of the total light amount laterally, 60% of the total light amount upward, and 20% of the total light amount downward.
　第一発光素子２２は、例えば一辺の長さが約０．３５ｍｍ（３５０μｍ）で、通電されることで青色光を発する矩形状（正方形）の青色発光ＬＥＤチップである。青色ＬＥＤチップとしては、例えばＩｎＧａＮ系の材料によって構成された、中心波長が４４０ｎｍ～４７０ｎｍの窒化ガリウム系の半導体発光素子を用いることができる。 The first light emitting element 22 is, for example, a rectangular (square) blue light emitting LED chip that emits blue light when energized on a side of about 0.35 mm (350 μm). As the blue LED chip, for example, a gallium nitride-based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN-based material, can be used.
　また、第一発光素子２２は、第一基台２１の上面に複数実装されている。複数の第一発光素子２２は、第一基台２１の長辺方向に同一ピッチで直線状に配列されて構成された素子列が第一基台２１の短辺方向に複数本並べられるように配設されている。複数の第一発光素子２２は素子列において直列接続され、素子列同士において並列接続されている。この複数の第一発光素子２２の全部又は一部は、請求の範囲に記載の「第一発光素子群」に相当する。また、複数の第二発光素子３２の全部又は一部は、請求の範囲に記載の「第二発光素子群」に相当する。 In addition, a plurality of first light emitting elements 22 are mounted on the upper surface of the first base 21. A plurality of first light emitting elements 22 are arranged in a straight line at the same pitch in the long side direction of the first base 21 so that a plurality of element rows are arranged in the short side direction of the first base 21. It is arranged. The plurality of first light emitting elements 22 are connected in series in the element row, and are connected in parallel in the element rows. All or a part of the plurality of first light emitting elements 22 correspond to the “first light emitting element group” described in the claims. In addition, all or part of the plurality of second light emitting elements 32 correspond to the “second light emitting element group” described in the claims.
　例えば、複数の第一発光素子２２は、素子列内において隣り合う第一発光素子２２の間隔（ピッチ）が１．８ｍｍとなり、隣り合う素子列において一方の素子列の第一発光素子２２と他方の素子列の第一発光素子２２との間隔が例えば４ｍｍとなるように配設されている。また、隣り合う第一発光素子２２において、一方の第一発光素子２２のカソード電極と他方の第一発光素子２２のアノード電極とは、第一ワイヤー２５により接続されている。 For example, in the plurality of first light emitting elements 22, the distance (pitch) between the adjacent first light emitting elements 22 in the element row is 1.8 mm, and in the adjacent element rows, the first light emitting elements 22 of one element row and the other The distance between the first light emitting element 22 and the first light emitting element 22 is 4 mm, for example. In the adjacent first light emitting elements 22, the cathode electrode of one first light emitting element 22 and the anode electrode of the other first light emitting element 22 are connected by the first wire 25.
　なお、本実施の形態では、図４の（ｃ）に示すように、第一発光素子２２は、第一基台２１の上面に６列並べられ、第二発光素子３２は、第二基台３１の下面に２列並べられているが、それぞれの列の数は限定されない。 In the present embodiment, as shown in (c) of FIG. 4, the first light emitting elements 22 are arranged in six rows on the upper surface of the first base 21, and the second light emitting elements 32 are the second base. Although two rows are arranged on the lower surface of 31, the number of each row is not limited.
　［第一封止部材、第二封止部材］
　次に、第一封止部材２３及び第二封止部材３３について詳細に説明する。なお、第一封止部材２３と第二封止部材３３とは同様の構成を有するため、以下では、第一封止部材２３についての説明を詳細に行うこととし、第二封止部材３３についての説明は簡略化又は省略する。 [First sealing member, second sealing member]
Next, the first sealing member 23 and the second sealing member 33 will be described in detail. In addition, since the 1st sealing member 23 and the 2nd sealing member 33 have the same structure, below, suppose that the description about the 1st sealing member 23 is given in detail, about the 2nd sealing member 33 The description of is simplified or omitted.
　第一封止部材２３は、第一発光素子２２が発する光の波長を変換する変換部材であり、第一発光素子２２を覆うように形成されている。第一封止部材２３は、第一発光素子２２が発する光の波長を変換する波長変換材と、波長変換材を含有する樹脂材料とから構成される封止樹脂である。波長変換材としては、第一発光素子２２が発する光によって励起されて所望の色（波長）の光を放出する蛍光体粒子を用いることもできるし、半導体、金属錯体、有機染料及び顔料等のある波長の光を吸収して吸収した光とは異なる波長の光を発する物質を含む材料を用いることもできる。なお、第一封止部材２３には、シリカ粒子等の光拡散材が分散されていてもよい。 The first sealing member 23 is a conversion member that converts the wavelength of light emitted by the first light emitting element 22, and is formed to cover the first light emitting element 22. The first sealing member 23 is a sealing resin composed of a wavelength conversion material for converting the wavelength of light emitted by the first light emitting element 22 and a resin material containing the wavelength conversion material. As the wavelength conversion material, phosphor particles which are excited by the light emitted from the first light emitting element 22 and emit light of a desired color (wavelength) can also be used, and semiconductors, metal complexes, organic dyes, pigments, etc. A material containing a substance that absorbs light of a certain wavelength and emits light of a wavelength different from the absorbed light can also be used. In the first sealing member 23, a light diffusing material such as silica particles may be dispersed.
　このような蛍光体粒子としては、第一発光素子２２が青色光を発する青色ＬＥＤである場合、第一封止部材２３から白色光を出射させるために、青色光を黄色光に波長変換する蛍光体粒子が用いられる。例えば、蛍光体粒子としてＹＡＧ（イットリウム・アルミニウム・ガーネット）系の黄色蛍光体粒子を用いることができる。これにより、第一発光素子２２が発した青色光の一部は、第一封止部材２３に含まれる黄色蛍光体粒子によって黄色光に波長変換される。そして、黄色蛍光体粒子に吸収されなかった（波長変換されなかった）青色光と、黄色蛍光体粒子によって波長変換された黄色光とは、第一封止部材２３の中で拡散及び混合されることにより、第一封止部材２３から白色光となって出射される。なお、蛍光体粒子として、黄色蛍光体粒子以外に緑色蛍光体粒子及び赤色蛍光体粒子等が用いられてもよく、第一発光素子２２が紫外線を発する第一発光素子２２である場合、波長変換材である蛍光体粒子としては、三原色（赤色、緑色、青色）に発光する各色蛍光体粒子を組み合わせたものが用いられる。 As such phosphor particles, in the case where the first light emitting element 22 is a blue LED that emits blue light, in order to cause the first sealing member 23 to emit white light, fluorescence for converting the wavelength of blue light into yellow light Body particles are used. For example, YAG (yttrium aluminum garnet) -based yellow phosphor particles can be used as the phosphor particles. Thereby, part of the blue light emitted from the first light emitting element 22 is wavelength-converted to yellow light by the yellow phosphor particles contained in the first sealing member 23. Then, the blue light not absorbed by the yellow phosphor particles (without wavelength conversion) and the yellow light wavelength-converted by the yellow phosphor particles are diffused and mixed in the first sealing member 23 As a result, the first sealing member 23 emits white light. In addition, green phosphor particles, red phosphor particles, etc. may be used as the phosphor particles in addition to the yellow phosphor particles, and in the case where the first light emitting element 22 is the first light emitting element 22 emitting ultraviolet light, wavelength conversion As a fluorescent substance particle which is material, what combined each color fluorescent substance particle which emits light in three primary colors (red, green, blue) is used.
　一方、蛍光体粒子を含有させる樹脂材料としては、シリコーン樹脂等の透明樹脂材料、フッ素系樹脂等の有機材、並びに低融点ガラス及びゾルゲルガラス等の無機材等を用いることができる。 On the other hand, transparent resin materials such as silicone resin, organic materials such as fluorine resin, and inorganic materials such as low melting point glass and sol-gel glass can be used as the resin material containing the phosphor particles.
　上述した構成の第一封止部材２３は、素子列を構成する複数の第一発光素子２２の配列方向に沿って直線状に形成され、第一発光素子２２の素子列を一括封止している。同時に、第一封止部材２３は、素子列の配列方向に沿って複数形成され、異なる素子列を個別に封止している。１本あたりの第一封止部材２３は、例えば、長さが２４ｍｍ、線幅が１．６ｍｍ、中心最大高さが０．７ｍｍである。 The first sealing member 23 having the above-described configuration is linearly formed along the arrangement direction of the plurality of first light emitting elements 22 constituting the element line, and collectively seals the element line of the first light emitting elements 22. There is. At the same time, a plurality of first sealing members 23 are formed along the arrangement direction of the element rows, and individually seal different element rows. Each first sealing member 23 has, for example, a length of 24 mm, a line width of 1.6 mm, and a central maximum height of 0.7 mm.
　［第一金属配線、第一端子］
　次に、第一金属配線２４、２６及び第一端子２８について詳細に説明する。第一金属配線２６は、第一発光素子２２の素子列と第一端子２８とを電気的に並列接続するために、第一基台２１の両端部に所定形状で島状に２つ形成されている。これら２つの第一金属配線２６は、第一基台２１の上面において、複数の第一発光素子２２の素子列を挟み込むように形成されている。 [First metal wiring, first terminal]
Next, the first metal wires 24 and 26 and the first terminal 28 will be described in detail. Two first metal wires 26 are formed in an island shape in a predetermined shape at both end portions of the first base 21 in order to electrically connect the element row of the first light emitting element 22 and the first terminal 28 in parallel. ing. The two first metal wires 26 are formed on the upper surface of the first base 21 so as to sandwich the element rows of the plurality of first light emitting elements 22.
　第一金属配線２６は、第一基台２１の上面において、第一発光素子２２の素子列と隣り合う部分で素子列に向かって突出している。この第一金属配線２６の突出部は、第一発光素子２２からの第一ワイヤー２５との接続箇所となる。 The first metal wiring 26 protrudes toward the element row at a portion adjacent to the element row of the first light emitting element 22 on the upper surface of the first base 21. The protruding portion of the first metal wiring 26 is a connection point to the first wire 25 from the first light emitting element 22.
　第一端子２８は、導電性部材２７が設けられる給電電極、例えば半田付けが行われる半田電極として、第一基台２１の表面に所定形状で形成された端子対である。具体的には、第一端子２８は、第一貫通孔２１ａの外方かつ第一基台２１の上面に配置されている。第一端子２８は、２つの第一金属配線２６のそれぞれに対応して２つ形成されている。これら２つの第一端子２８は、それぞれ対応する第一金属配線２６と一体化して形成されている。このような対応する１組の第一金属配線２６及び第一端子２８により１つの配線パターンが構成されている。 The first terminal 28 is a pair of terminals formed in a predetermined shape on the surface of the first base 21 as a feed electrode on which the conductive member 27 is provided, for example, a solder electrode to be soldered. Specifically, the first terminal 28 is disposed outside the first through hole 21 a and on the upper surface of the first base 21. Two first terminals 28 are formed corresponding to each of the two first metal wires 26. The two first terminals 28 are integrally formed with the corresponding first metal wires 26. One corresponding wiring pattern is configured by the corresponding one set of the first metal wiring 26 and the first terminal 28.
　第一端子２８は、ＬＥＤモジュール２の給電部であって、第一発光素子２２と点灯回路８０とを電気的に接続するための端子である。第一端子２８は、第一発光素子２２を発光させるために、ＬＥＤモジュール２の外部から電力を受け、受けた電力を第一金属配線２６及び２４並びに第一ワイヤー２５を介して各第一発光素子２２に供給する。また、同様に、第二端子３８は、第二発光素子３２と点灯回路８０とを電気的に接続するための端子である。 The first terminal 28 is a power feeding unit of the LED module 2 and is a terminal for electrically connecting the first light emitting element 22 and the lighting circuit 80. The first terminal 28 receives power from the outside of the LED module 2 in order to cause the first light emitting element 22 to emit light, and receives the received power via the first metal wires 26 and 24 and the first wire 25. The element 22 is supplied. Similarly, the second terminal 38 is a terminal for electrically connecting the second light emitting element 32 and the lighting circuit 80.
　第一金属配線２４は、複数の第一発光素子２２同士を電気的に直列接続するために、第一基台２１の上面に所定形状で複数形成されている。これら複数の第一金属配線２４は、第一基台２１の上面において、素子列内で隣り合う第一発光素子２２の間に島状に形成されている。 A plurality of first metal wires 24 are formed in a predetermined shape on the upper surface of the first base 21 in order to electrically connect the plurality of first light emitting elements 22 in series. The plurality of first metal wires 24 are formed in an island shape on the upper surface of the first base 21 between the adjacent first light emitting elements 22 in the element row.
　上述した構成の第一金属配線２６及び２４並びに第一端子２８は同じ金属材料で同時にパターン形成される。金属材料としては、例えば、銀（Ａｇ）、タングステン（Ｗ）又は銅（Ｃｕ）等を用いることができる。なお、第一金属配線２６及び２４並びに第一端子２８の表面に、ニッケル（Ｎｉ）／金（Ａｕ）等のメッキ処理を施しても構わない。また、第一金属配線２６及び２４並びに第一端子２８は、異なる金属材料により構成されてもよいし、別々の工程で形成されてもよい。 The first metal wires 26 and 24 and the first terminal 28 configured as described above are simultaneously patterned with the same metal material. As a metal material, silver (Ag), tungsten (W) or copper (Cu) etc. can be used, for example. The surfaces of the first metal wires 26 and 24 and the first terminal 28 may be plated with nickel (Ni) / gold (Au) or the like. Also, the first metal wires 26 and 24 and the first terminal 28 may be made of different metal materials, or may be formed in separate steps.
　［第二金属配線、第二端子］
　次に、第二金属配線３４、３６及び第二端子３８について詳細に説明する。第二金属配線３６は、第二発光素子３２の素子列を電気的に並列接続するために、第二基台３１の両端部に所定形状で島状に２つ形成されている。これら２つの第二金属配線３６は、第二基台３１の下面において、複数の第二発光素子３２の素子列を挟み込むように形成されている。 [Second metal wiring, second terminal]
Next, the second metal wires 34 and 36 and the second terminal 38 will be described in detail. In order to electrically connect the element rows of the second light emitting elements 32 in parallel, two second metal wires 36 are formed in an island shape in a predetermined shape at both end portions of the second base 31. The two second metal wires 36 are formed on the lower surface of the second base 31 so as to sandwich the element rows of the plurality of second light emitting elements 32.
　第二金属配線３６は、第二基台３１の下面において、第二発光素子３２の素子列と隣り合う部分で素子列に向かって突出している。この第二金属配線３６の突出部は、第二発光素子３２からの第二ワイヤー３５との接続箇所となる。 The second metal wiring 36 protrudes toward the element row at a portion adjacent to the element row of the second light emitting element 32 on the lower surface of the second base 31. The protruding portion of the second metal wire 36 serves as a connection point with the second wire 35 from the second light emitting element 32.
　第二端子３８は、導電性部材２７が設けられる給電電極、例えば半田付けが行われる半田電極として、第二基台３１の表面に所定形状で形成されている。具体的には、第二端子３８は、第一貫通孔２１ａの内方であって、第二貫通孔３１ａの外方かつ第二基台３１の上面に配置されている。つまり、第二端子３８は、第一貫通孔２１ａから露出するように配置され、導電性部材２７により覆われる。第二端子３８は、２つの第二金属配線３６のそれぞれに対応して２つ形成されている。これら２つの第二端子３８は、それぞれ対応する第二金属配線３６と、第二基台３１に形成された導電性ビアにより電気的に接続されている。なお、導電性ビアとは、孔が形成されたビアホール、及び孔が形成されていないプラグの双方を含む概念である。 The second terminal 38 is formed in a predetermined shape on the surface of the second base 31 as a feed electrode on which the conductive member 27 is provided, for example, a solder electrode to which soldering is performed. Specifically, the second terminal 38 is disposed inward of the first through hole 21 a and on the outer side of the second through hole 31 a and on the upper surface of the second base 31. That is, the second terminal 38 is disposed so as to be exposed from the first through hole 21 a and is covered by the conductive member 27. Two second terminals 38 are formed corresponding to each of the two second metal wires 36. The two second terminals 38 are electrically connected to the corresponding second metal wires 36 by the conductive vias formed in the second base 31. The conductive via is a concept including both a via hole in which a hole is formed and a plug in which a hole is not formed.
　つまり、第二端子３８は、ＬＥＤモジュール２の給電部であって、上記の第二基台３１に形成された導電性ビアにより、第二発光素子３２と電気的に接続されている。第二端子３８は、第二発光素子３２を発光させるために、ＬＥＤモジュール２の外部から電力を受け、受けた電力を第二金属配線３６及び２４並びに第二ワイヤー３５を介して各第二発光素子３２に供給する。なお、第二端子３８は、第一端子２８と近い位置に配置されるのが好ましい。 That is, the second terminal 38 is a feeding portion of the LED module 2 and is electrically connected to the second light emitting element 32 by the conductive via formed in the second base 31 described above. The second terminal 38 receives power from the outside of the LED module 2 in order to cause the second light emitting element 32 to emit light, and receives the received power via the second metal wires 36 and 24 and the second wire 35. The element 32 is supplied. The second terminal 38 is preferably disposed at a position close to the first terminal 28.
　第二金属配線３４は、複数の第二発光素子３２同士を電気的に直列接続するために、第二基台３１の下面に所定形状で複数形成されている。これら複数の第二金属配線３４は、第二基台３１の下面において、素子列内で隣り合う第二発光素子３２の間に島状に形成されている。 A plurality of second metal wires 34 are formed in a predetermined shape on the lower surface of the second base 31 in order to electrically connect the plurality of second light emitting elements 32 in series. The plurality of second metal wires 34 are formed in an island shape on the lower surface of the second base 31 between the adjacent second light emitting elements 32 in the element row.
　上述した構成の第二金属配線３６及び２４は同じ金属材料で同時にパターン形成される。また、第二金属配線３６、２４及び第二端子３８には、例えば、銀（Ａｇ）、タングステン（Ｗ）又は銅（Ｃｕ）等を用いることができる。なお、第二金属配線３６及び２４、又は第二端子３８の表面に、ニッケル（Ｎｉ）／金（Ａｕ）等のメッキ処理を施しても構わない。また、第二金属配線３６及び２４並びに第二端子３８は、異なる金属材料により構成されてもよいし、別々の工程で形成されてもよい。 The second metal wires 36 and 24 of the above-described configuration are simultaneously patterned with the same metal material. In addition, for example, silver (Ag), tungsten (W), copper (Cu) or the like can be used for the second metal wires 36 and 24 and the second terminal 38. The surface of the second metal wires 36 and 24 or the second terminal 38 may be plated with nickel (Ni) / gold (Au) or the like. Also, the second metal wires 36 and 24 and the second terminal 38 may be made of different metal materials or may be formed in separate steps.
　［第一ワイヤー、第二ワイヤー］
　次に、第一ワイヤー２５及び第二ワイヤー３５について詳細に説明する。なお、第一ワイヤー２５と第二ワイヤー３５とは同様の構成を有するため、以下では、第一ワイヤー２５についての説明を詳細に行うこととし、第二ワイヤー３５についての説明は簡略化又は省略する。 [First wire, second wire]
Next, the first wire 25 and the second wire 35 will be described in detail. In addition, since the 1st wire 25 and the 2nd wire 35 have the same structure, below, suppose that the description about the 1st wire 25 is given in detail, and the description about the 2nd wire 35 is simplified or abbreviate | omitted .
　第一ワイヤー２５は、第一発光素子２２と第一金属配線２６、又は第一発光素子２２と第一金属配線２４とを接続するための電線であり、例えば、金ワイヤーである。この第一ワイヤー２５により、第一発光素子２２のカソード電極及びアノード電極のそれぞれと第一発光素子２２の両側に隣接して形成された第一金属配線２６又は第一金属配線２４とがワイヤボンディングされている。 The first wire 25 is a wire for connecting the first light emitting element 22 and the first metal wire 26 or the first light emitting element 22 and the first metal wire 24, and is, for example, a gold wire. The first metal wiring 26 or the first metal wiring 24 formed adjacent to both sides of the cathode electrode and the anode electrode of the first light emitting element 22 and both sides of the first light emitting element 22 are wire-bonded by the first wire 25 It is done.
　第一ワイヤー２５は、例えば、第一封止部材２３から露出しないように、全体が第一封止部材２３の中に埋め込まれる。 The first wire 25 is entirely embedded in the first sealing member 23 so as not to be exposed from the first sealing member 23, for example.
　［導電性部材］
　次に、導電性部材２７について詳細に説明する。導電性部材２７は、第一端子２８と第二端子３８とリード線７０とを接続する半田又は銀ペースト等の導電性接着剤である。つまり、導電性部材２７は、リード線７０と第一端子２８と第二端子３８とを覆い、リード線７０と第一端子２８と第二端子３８とを電気的に接続する導電性の部材である。具体的には、導電性部材２７が、リード線７０の上部と第一端子２８と第二端子３８とを上方から覆うことで、リード線７０の上部と第一端子２８と第二端子３８とは、導電性部材２７を介して電気的に接続されている。 [Conductive member]
Next, the conductive member 27 will be described in detail. The conductive member 27 is a conductive adhesive such as solder or silver paste which connects the first terminal 28, the second terminal 38, and the lead wire 70. That is, the conductive member 27 is a conductive member which covers the lead 70, the first terminal 28, and the second terminal 38, and electrically connects the lead 70, the first terminal 28, and the second terminal 38. is there. Specifically, the conductive member 27 covers the upper portion of the lead 70, the first terminal 28, and the second terminal 38 from the upper side, so that the upper portion of the lead 70, the first terminal 28, and the second terminal 38 Are electrically connected via the conductive member 27.
　なお、上記の「覆う」とは、全体を覆うことには限定されず、少なくとも一部を覆うことも含む概念である。以下の説明においても同様である。つまり、導電性部材２７は、リード線７０の上部全体と第一端子２８の全体と第二端子３８の全体とを覆っていなくともよく、リード線７０の上部の少なくとも一部と第一端子２８の少なくとも一部と第二端子３８の少なくとも一部とを覆っていればよい。 In addition, said "covering" is not limited to covering the whole, It is the concept also including covering at least one part. The same applies to the following description. That is, the conductive member 27 may not cover the entire upper portion of the lead 70, the entire first terminal 28, and the entire second terminal 38, and at least a portion of the upper portion of the lead 70 and the first terminal 28. And at least a portion of the second terminal 38.
　なお、図４のＬＥＤモジュール２では、一方のプラス側のリード線７０に供給された電流は、導電性部材２７、第一端子２８、第一金属配線２６、第一発光素子２２及び第一金属配線２４を通過し、他方のマイナス側のリード線７０から出力される。同様に、一方のプラス側のリード線７０に供給された電流は、導電性部材２７、第二端子３８、第二金属配線３６、第二発光素子３２及び第二金属配線３４を通過し、他方のマイナス側のリード線７０から出力される。 In the LED module 2 of FIG. 4, the current supplied to the plus lead wire 70 on one side is the conductive member 27, the first terminal 28, the first metal wiring 26, the first light emitting element 22 and the first metal. It passes through the wiring 24 and is outputted from the other negative lead wire 70. Similarly, the current supplied to one positive lead wire 70 passes through the conductive member 27, the second terminal 38, the second metal wire 36, the second light emitting element 32 and the second metal wire 34, and the other Is output from the lead wire 70 on the negative side of the
　以上のように、本発明の実施の形態に係る電球形ランプ１によれば、第一発光モジュール２０は、第一基台２１の上面に設けられた第一端子２８を有し、第二発光モジュール３０は、第二基台３１の上面に設けられた第二端子３８を有している。つまり、第二端子３８は、第二基台３１の第一端子２８が設けられた面と同じ側の面に設けられている。そして、導電性部材２７が、リード線７０と第一端子２８と第二端子３８とを覆うことで、リード線７０と第一端子２８と第二端子３８とが電気的に接続されている。 As described above, according to the light bulb shaped lamp 1 according to the embodiment of the present invention, the first light emitting module 20 has the first terminal 28 provided on the upper surface of the first base 21, and the second light emission The module 30 has a second terminal 38 provided on the upper surface of the second base 31. That is, the second terminal 38 is provided on the same side as the surface on which the first terminal 28 of the second base 31 is provided. The conductive member 27 covers the lead wire 70, the first terminal 28, and the second terminal 38, whereby the lead wire 70, the first terminal 28, and the second terminal 38 are electrically connected.
　このように、導電性部材２７で１方向から１回覆うことで、容易に、リード線７０と第一端子２８と第二端子３８とを電気的に接続し、第一発光モジュール２０及び第二発光モジュール３０に電力を供給することができる。つまり、半田付けを上下２方向から行う必要がないため、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As described above, the lead 70, the first terminal 28, and the second terminal 38 are easily electrically connected by covering the conductive member 27 once from one direction. Power can be supplied to the light emitting module 30. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
　また、第一端子２８は、第一基台２１に形成された第一貫通孔２１ａの外方かつ第一基台２１の上面に配置されている。また、第二端子３８は、第一貫通孔２１ａの内方であって、第二基台３１に形成された第一貫通孔２１ａよりも小さい第二貫通孔３１ａの外方かつ第二基台３１の上面に配置されている。そして、第一貫通孔２１ａ及び第二貫通孔３１ａにリード線７０が挿入された状態で、導電性部材２７が、リード線７０と第一端子２８と第二端子３８とを上方から覆っている。このように、導電性部材２７で１方向から１回覆う構成により、容易に、リード線７０と第一端子２８と第二端子３８とを電気的に接続することができる。 The first terminal 28 is disposed outside the first through hole 21 a formed in the first base 21 and on the upper surface of the first base 21. Further, the second terminal 38 is an inner side of the first through hole 21 a, and is an outer side and a second base of the second through hole 31 a smaller than the first through hole 21 a formed in the second base 31. It is arranged on the top of 31. The conductive member 27 covers the lead 70, the first terminal 28, and the second terminal 38 from above in a state where the lead 70 is inserted into the first through hole 21a and the second through hole 31a. . Thus, the lead wire 70, the first terminal 28, and the second terminal 38 can be electrically connected easily by the configuration in which the conductive member 27 is covered once from one direction.
　また、第二端子３８は、第二基台３１に形成された導電性ビアにより、第二発光素子３２と電気的に接続されている。この構成により、第二端子３８と第二発光素子３２とが第二基台３１の異なる面に配置されていても、容易に、第二端子３８と第二発光素子３２とを電気的に接続することができる。 Further, the second terminal 38 is electrically connected to the second light emitting element 32 by the conductive via formed in the second base 31. By this configuration, even if the second terminal 38 and the second light emitting element 32 are arranged on different surfaces of the second base 31, the second terminal 38 and the second light emitting element 32 are easily electrically connected. can do.
　以上のように、２つの発光モジュールを貼り合わせる構成を有する電球形ランプ１の製造方法において、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As mentioned above, in the manufacturing method of the lightbulb-shaped lamp 1 which has a structure which bonds together two light emitting modules, productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
　次に、電球形ランプ１の製造方法について、説明する。 Next, a method of manufacturing the light bulb shaped lamp 1 will be described.
　図７及び図８は、本発明の実施の形態に係る電球形ランプ１の製造方法を示すフローチャートである。具体的には、図７は、ＬＥＤモジュール２とリード線７０との接続方法を示すフローチャートである。また、図８は、リード線７０と第一端子２８と第二端子３８とを電気的に接続する接続工程を詳細に示すフローチャートである。 7 and 8 are flowcharts showing a method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention. Specifically, FIG. 7 is a flowchart showing a method of connecting the LED module 2 and the lead wire 70. Moreover, FIG. 8 is a flowchart which shows in detail the connection process which electrically connects the lead wire 70, the 1st terminal 28, and the 2nd terminal 38. As shown in FIG.
　また、図９は、本発明の実施の形態に係る電球形ランプ１の製造過程を説明するための図である。 Moreover, FIG. 9 is a figure for demonstrating the manufacturing process of the lightbulb-shaped lamp 1 which concerns on embodiment of this invention.
　図７に示すように、まず、接合工程として、第一端子２８と第二端子３８とが同じ側の面上に配置されるように、第一発光モジュール２０と第二発光モジュール３０とを接合する（Ｓ１０２）。具体的には、図９の（ａ）に示すように、第一端子２８と第二端子３８とが、それぞれ第一基台２１及び第二基台３１の上面に配置されるように、第一発光モジュール２０と第二発光モジュール３０とを配置する。そして、図９の（ｂ）に示すように、第一発光モジュール２０と第二発光モジュール３０とを接合する。これにより、第一端子２８と第二端子３８とが同じ方向（上方）に露出するように配置される。 As shown in FIG. 7, first, in the bonding step, the first light emitting module 20 and the second light emitting module 30 are bonded so that the first terminal 28 and the second terminal 38 are disposed on the same side. (S102). Specifically, as shown in (a) of FIG. 9, the first terminal 28 and the second terminal 38 are disposed on the upper surfaces of the first base 21 and the second base 31, respectively. The first light emitting module 20 and the second light emitting module 30 are disposed. And as shown to (b) of FIG. 9, the 1st light emitting module 20 and the 2nd light emitting module 30 are joined. Thereby, the first terminal 28 and the second terminal 38 are arranged to be exposed in the same direction (upward).
　図７に戻り、次に、接続工程として、リード線７０と第一端子２８と第二端子３８とを導電性部材２７で覆うことにより、リード線７０と第一端子２８と第二端子３８とを電気的に接続する（Ｓ１０４）。以下に、この接続工程について、図８を用いて詳細に説明する。 Referring back to FIG. 7, next, as the connection step, the lead wire 70, the first terminal 28, and the second terminal 38 are covered by covering the lead wire 70, the first terminal 28, and the second terminal 38 with the conductive member 27. Are electrically connected (S104). Below, this connection process is demonstrated in detail using FIG.
　まず、図８に示すように、第一基台２１に形成された第一貫通孔２１ａの内方、かつ、第二基台３１に形成された第二貫通孔３１ａの内方に、リード線７０を配置する（Ｓ２０２）。具体的には、図９の（ｃ）に示すように、第一貫通孔２１ａの内方、かつ、第二貫通孔３１ａの内方に、リード線７０を挿入する。 First, as shown in FIG. 8, a lead wire is provided inward of the first through hole 21 a formed in the first base 21 and inward of the second through hole 31 a formed in the second base 31. 70 are arranged (S202). Specifically, as shown in FIG. 9C, the lead wire 70 is inserted inward of the first through hole 21a and inward of the second through hole 31a.
　図８に戻り、次に、第一端子２８と第二端子３８とリード線７０とを導電性部材２７で上方から覆うことにより、リード線７０と第一端子２８と第二端子３８とを電気的に接続する（Ｓ２０４）。具体的には、図９の（ｄ）に示すように、第一端子２８と第二端子３８とリード線７０とに、導電性部材２７を用いて上方から半田付けを行うことで、リード線７０と第一端子２８と第二端子３８とを電気的に接続する。 Referring back to FIG. 8, next, by covering the first terminal 28, the second terminal 38 and the lead wire 70 from above with the conductive member 27, the lead wire 70, the first terminal 28 and the second terminal 38 are electrically Connection (S204). Specifically, as shown in (d) of FIG. 9, the lead wire is soldered to the first terminal 28, the second terminal 38 and the lead wire 70 from above using the conductive member 27. 70, the first terminal 28 and the second terminal 38 are electrically connected.
　以上のように、本発明の実施の形態に係る電球形ランプ１の製造方法によれば、第一端子２８と第二端子３８とが同じ側の面上に配置されるように、第一発光モジュール２０と第二発光モジュール３０とを接合する接合工程を含む。また、電球形ランプ１の製造方法は、リード線７０と第一端子２８と第二端子３８とを導電性部材２７で覆うことにより、リード線７０と第一端子２８と第二端子３８とを電気的に接続する接続工程を含む。つまり、第二端子３８は、第二基台３１の第一端子２８が設けられた面と同じ側の面に設けられる。そして、導電性部材２７が、リード線７０と第一端子２８と第二端子３８とを覆うことで、リード線７０と第一端子２８と第二端子３８とが電気的に接続される。 As described above, according to the method of manufacturing the light bulb shaped lamp 1 according to the embodiment of the present invention, the first light emission such that the first terminal 28 and the second terminal 38 are disposed on the same side surface A bonding step of bonding the module 20 and the second light emitting module 30 is included. In the method of manufacturing the light bulb shaped lamp 1, the lead wire 70, the first terminal 28 and the second terminal 38 can be obtained by covering the lead wire 70, the first terminal 28 and the second terminal 38 with the conductive member 27. It includes a connecting step of electrically connecting. That is, the second terminal 38 is provided on the same side as the surface of the second base 31 on which the first terminal 28 is provided. Then, the conductive member 27 covers the lead wire 70, the first terminal 28, and the second terminal 38, whereby the lead wire 70, the first terminal 28, and the second terminal 38 are electrically connected.
　このように、導電性部材２７で１方向から１回覆うことで、容易に、リード線７０と第一端子２８と第二端子３８とを電気的に接続し、第一発光モジュール２０及び第二発光モジュール３０に電力を供給することができる。つまり、半田付けを上下２方向から行う必要がないため、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As described above, the lead 70, the first terminal 28, and the second terminal 38 are easily electrically connected by covering the conductive member 27 once from one direction. Power can be supplied to the light emitting module 30. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
　また、接続工程では、第一基台２１に形成された第一貫通孔２１ａの内方、かつ、第二基台３１に形成された第一貫通孔２１ａよりも小さい第二貫通孔３１ａの内方に、リード線７０を配置する。そして、第一基台２１の上面に配置された第一端子２８と、第二基台３１の上面に配置された第二端子３８と、リード線７０とを導電性部材２７で上方から覆う。このように、導電性部材２７で１方向から１回覆うことで、容易に、リード線７０と第一端子２８と第二端子３８とを電気的に接続することができる。 In the connection step, the inside of the first through hole 21 a formed in the first base 21 and the inside of the second through hole 31 a smaller than the first through hole 21 a formed in the second base 31. The lead wire 70 is placed on the side. Then, the conductive members 27 cover the first terminals 28 disposed on the upper surface of the first base 21, the second terminals 38 disposed on the upper surface of the second base 31, and the lead wires 70 from above. Thus, the lead 70, the first terminal 28, and the second terminal 38 can be electrically connected easily by covering the conductive member 27 once in one direction from one direction.
　以上のように、２つの発光モジュールを貼り合わせる構成を有する電球形ランプ１の製造方法において、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As mentioned above, in the manufacturing method of the lightbulb-shaped lamp 1 which has a structure which bonds together two light emitting modules, productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
　また、上記の構成においては、特に第二基台３１の発光素子が実装されている面において、半田の面積を低減することができる。このため、第二基台３１が発光素子からの光を反射する光反射率が半田部分によって低下するのを抑制することができ、光取り出し効率を向上させることができる。つまり、第二基台３１の基板表面は、光反射率９０％以上の材料を使用するなど通常高反射率になるように形成されるが、半田の表面は光反射率が低いため、半田の面積を低減することで、第二基台３１の光反射率が低下するのを抑制することができる。 Further, in the above configuration, the area of the solder can be reduced particularly on the surface on which the light emitting element of the second base 31 is mounted. For this reason, it can suppress that the light reflectivity which the 2nd base 31 reflects the light from a light emitting element falls by a solder part, and can improve light extraction efficiency. That is, the substrate surface of the second base 31 is usually formed to have a high reflectance, for example, using a material having a light reflectance of 90% or more, but the surface of the solder has a low light reflectance. The reduction of the light reflectance of the second base 31 can be suppressed by reducing the area.
　また、上記の構成において、第二基台３１において半田の面積を低減することができるため、支柱４０との接触面積を増加することが可能であり、放熱性を向上させることができる。つまり、第二基台３１の半田部分と支柱４０との間には絶縁耐圧を満たすだけの所定の距離を設定する必要があるため、半田部分を小さくすることで、第二基台３１と支柱４０との接触面積を広げることができる。 Further, in the above configuration, since the area of the solder can be reduced in the second base 31, the contact area with the support column 40 can be increased, and the heat dissipation can be improved. That is, since it is necessary to set a predetermined distance sufficient to satisfy the dielectric breakdown voltage between the solder portion of the second base 31 and the support 40, the second base 31 and the support can be reduced by making the solder portion smaller. The contact area with 40 can be expanded.
　また、上記の構成において、第一基台２１と第二基台３１とが異なる形状の場合でも、第一基台２１と第二基台３１とを張り合わせる際の位置決めが可能となる。つまり、第一基台２１と第二基台３１とが異なる形状の場合には基板形状を利用した位置決めができないようになるが、第二端子３８が第一貫通孔２１ａに挿入されることで第一基台２１と第二基台３１とを位置決めすることができる。 Further, in the above configuration, even when the first base 21 and the second base 31 have different shapes, positioning when bonding the first base 21 and the second base 31 is possible. That is, in the case where the first base 21 and the second base 31 have different shapes, positioning using the shape of the substrate can not be performed, but the second terminal 38 is inserted into the first through hole 21a. The first base 21 and the second base 31 can be positioned.
　（変形例）
　次に、上記実施の形態に係る電球形ランプの変形例について、図面を参照しながら説明する。以下に説明する各変形例に係る電球形ランプと上記の実施の形態に係る電球形ランプ１とは、リード線７０とＬＥＤモジュールとの接続箇所の構成が異なる。なお、それ以外の構成は上記の実施の形態と同じであるので詳しい説明は省略する。 (Modification)
Next, modifications of the light bulb shaped lamp according to the above embodiment will be described with reference to the drawings. The configuration of the connection portion between the lead wire 70 and the LED module is different between the light bulb shaped lamp according to each of the modifications described below and the light bulb shaped lamp 1 according to the above embodiment. The rest of the configuration is the same as that of the above embodiment, and thus the detailed description will be omitted.
　（変形例１）
　まず、本発明の実施の形態の変形例１について、図１０～図１２を用いて説明する。図１０は、本発明の実施の形態の変形例１に係る電球形ランプにおけるＬＥＤモジュールとリード線７０との接続箇所の構成を示す図である。 (Modification 1)
First, a first modification of the embodiment of the present invention will be described with reference to FIGS. FIG. 10 is a view showing the configuration of the connection portion between the LED module and the lead wire 70 in the light bulb shaped lamp according to the first modification of the embodiment of the present invention.
　上記実施の形態に係る電球形ランプ１では、第一端子２８と第二端子３８とは、それぞれ第一基台２１及び第二基台３１の上面に配置されていることとした。しかし、図１０に示すように、本変形例１に係る電球形ランプでは、第一端子１２８と第二端子１３８とは、それぞれ第一基台１２１及び第二基台１３１の下面に配置されている。 In the light bulb shaped lamp 1 according to the above embodiment, the first terminal 28 and the second terminal 38 are disposed on the upper surface of the first base 21 and the second base 31, respectively. However, as shown in FIG. 10, in the light bulb shaped lamp according to the first modification, the first terminal 128 and the second terminal 138 are disposed on the lower surface of the first base 121 and the second base 131, respectively. There is.
　具体的には、第一基台１２１には、貫通孔が形成されておらず、第二基台１３１には、リード線７０が挿入される第二貫通孔１３１ａが形成されている。また、第一端子１２８は、第二貫通孔１３１ａの内方かつ第一基台１２１の下面に配置されている。また、第二端子１３８は、第二貫通孔１３１ａの外方かつ第二基台１３１の下面に配置されている。 Specifically, no through hole is formed in the first base 121, and a second through hole 131 a into which the lead wire 70 is inserted is formed in the second base 131. The first terminal 128 is disposed inward of the second through hole 131 a and on the lower surface of the first base 121. Further, the second terminal 138 is disposed outside the second through hole 131 a and on the lower surface of the second base 131.
　そして、リード線７０と第一端子１２８と第二端子１３８とを下方から覆い、リード線７０と第一端子１２８と第二端子１３８とを電気的に接続する導電性部材１２７が配置されている。なお、第一端子１２８は、第一基台１２１に形成された導電性ビアにより、第一金属配線２６を介して、第一発光素子２２と電気的に接続されている。つまり、第一端子１２８は、第二貫通孔１３１ａから露出するように配置され、導電性部材１２７により覆われる。 A conductive member 127 is provided which covers the lead 70, the first terminal 128, and the second terminal 138 from below, and electrically connects the lead 70, the first terminal 128, and the second terminal 138. . The first terminal 128 is electrically connected to the first light emitting element 22 through the first metal wiring 26 by the conductive via formed in the first base 121. That is, the first terminal 128 is disposed to be exposed from the second through hole 131 a and is covered by the conductive member 127.
　なお、導電性部材１２７は、リード線７０の上部全体と第一端子１２８の全体と第二端子１３８の全体とを覆っていなくともよく、リード線７０の上部の少なくとも一部と第一端子１２８の少なくとも一部と第二端子１３８の少なくとも一部とを覆っていればよい。 The conductive member 127 may not cover the entire upper portion of the lead 70, the entire first terminal 128, and the entire second terminal 138, and at least a portion of the upper portion of the lead 70 and the first terminal 128. And at least a portion of the second terminal 138.
　次に、本変形例１に係る電球形ランプの製造方法について、説明する。 Next, a method of manufacturing the light bulb shaped lamp according to the first modification will be described.
　図１１は、本発明の実施の形態の変形例１に係る電球形ランプの製造方法を示すフローチャートである。具体的には、図１１は、図７における接続工程を詳細に示すフローチャートである。また、図１２は、本発明の実施の形態の変形例１に係る電球形ランプの製造過程を説明するための図である。 FIG. 11 is a flowchart showing a method of manufacturing a light bulb shaped lamp according to the first modification of the embodiment of the present invention. Specifically, FIG. 11 is a flowchart showing in detail the connection process in FIG. Moreover, FIG. 12 is a figure for demonstrating the manufacturing process of the lightbulb-shaped lamp which concerns on the modification 1 of embodiment of this invention.
　図７に示すように、まず、接合工程として、第一端子１２８と第二端子１３８とが同じ側の面上に配置されるように、第一発光モジュール１２０と第二発光モジュール１３０とを接合する（図７のＳ１０２）。具体的には、図１２の（ａ）に示すように、第一端子１２８と第二端子１３８とが、それぞれ第一基台１２１及び第二基台１３１の下面に配置されるように、第一発光モジュール１２０と第二発光モジュール１３０とを配置する。そして、図１２の（ｂ）に示すように、第一発光モジュール１２０と第二発光モジュール１３０とを接合する。これにより、第一端子１２８と第二端子１３８とが同じ方向（下方）に露出するように配置される。 As shown in FIG. 7, first, in the bonding step, the first light emitting module 120 and the second light emitting module 130 are bonded so that the first terminal 128 and the second terminal 138 are disposed on the same side surface. (S102 of FIG. 7). Specifically, as shown in (a) of FIG. 12, the first terminal 128 and the second terminal 138 are disposed on the lower surface of the first base 121 and the second base 131, respectively. One light emitting module 120 and a second light emitting module 130 are disposed. And as shown to (b) of FIG. 12, the 1st light emitting module 120 and the 2nd light emitting module 130 are joined. Thereby, the first terminal 128 and the second terminal 138 are arranged to be exposed in the same direction (downward).
　図７に戻り、次に、接続工程として、リード線７０と第一端子１２８と第二端子１３８とを導電性部材１２７で覆うことにより、リード線７０と第一端子１２８と第二端子１３８とを電気的に接続する（図７のＳ１０４）。以下に、この接続工程について、図１１を用いて詳細に説明する。 Referring back to FIG. 7, next, in the connection step, the lead 70, the first terminal 128, and the second terminal 138 are covered with the conductive member 127, whereby the lead 70, the first terminal 128, and the second terminal 138 Are electrically connected (S104 in FIG. 7). Below, this connection process is demonstrated in detail using FIG.
　まず、図１１に示すように、第二基台１３１に形成された第二貫通孔１３１ａの内方に、リード線７０を配置する（Ｓ３０２）。具体的には、図１２の（ｃ）に示すように、第二貫通孔１３１ａの内方に、リード線７０を挿入する。 First, as shown in FIG. 11, the lead wire 70 is disposed inward of the second through hole 131a formed in the second base 131 (S302). Specifically, as shown in FIG. 12C, the lead wire 70 is inserted into the second through hole 131a.
　図１１に戻り、次に、リード線７０と第一端子１２８と第二端子１３８とを導電性部材１２７で下方から覆うことにより、リード線７０と第一端子１２８と第二端子１３８とを電気的に接続する（Ｓ３０４）。具体的には、図１２の（ｄ）に示すように、第一端子１２８と第二端子１３８とリード線７０とに、導電性部材１２７を用いて下方から半田付けを行うことで、リード線７０と第一端子１２８と第二端子１３８とを電気的に接続する。 Returning to FIG. 11, next, by covering the lead wire 70, the first terminal 128 and the second terminal 138 from below with the conductive member 127, the lead wire 70, the first terminal 128 and the second terminal 138 are electrically Connection (S304). Specifically, as shown in (d) of FIG. 12, the lead wire is soldered to the first terminal 128, the second terminal 138 and the lead wire 70 from below using the conductive member 127. 70, the first terminal 128 and the second terminal 138 are electrically connected.
　以上のように、本発明の実施の形態の変形例１に係る電球形ランプによれば、第一発光モジュール１２０は、第一基台１２１の下面に設けられた第一端子１２８を有し、第二発光モジュール１３０は、第二基台１３１の下面に設けられた第二端子１３８を有している。そして、導電性部材１２７が、リード線７０と第一端子１２８と第二端子１３８とを覆うことで、リード線７０と第一端子１２８と第二端子１３８とが電気的に接続されている。具体的には、第一端子１２８は、第二基台１３１に形成された第二貫通孔１３１ａの内方かつ第一基台１２１の下面に配置されており、第二端子１３８は、第二貫通孔１３１ａの外方かつ第二基台１３１の下面に配置されている。そして、第二貫通孔１３１ａにリード線７０が挿入された状態で、導電性部材１２７が、リード線７０と第一端子１２８と第二端子１３８とを下方から覆っている。 As described above, according to the light bulb shaped lamp according to the first modification of the embodiment of the present invention, the first light emitting module 120 has the first terminal 128 provided on the lower surface of the first base 121, The second light emitting module 130 has a second terminal 138 provided on the lower surface of the second base 131. The conductive member 127 covers the lead 70, the first terminal 128, and the second terminal 138, whereby the lead 70, the first terminal 128, and the second terminal 138 are electrically connected. Specifically, the first terminal 128 is disposed inward of the second through hole 131a formed in the second base 131 and on the lower surface of the first base 121, and the second terminal 138 is a second terminal. It is disposed on the outer side of the through hole 131 a and on the lower surface of the second base 131. And in the state where lead 70 was inserted in the 2nd penetration hole 131a, conductive member 127 has covered lead 70, the 1st terminal 128, and the 2nd terminal 138 from the bottom.
　このように、導電性部材１２７で１方向から１回覆うことで、容易に、リード線７０と第一端子１２８と第二端子１３８とを電気的に接続し、第一発光モジュール１２０及び第二発光モジュール１３０に電力を供給することができる。つまり、半田付けを上下２方向から行う必要がないため、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As described above, the lead 70, the first terminal 128, and the second terminal 138 are easily electrically connected by covering the conductive member 127 once from one direction, and the first light emitting module 120 and the second The light emitting module 130 can be powered. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
　また、第一端子１２８は、第一基台１２１に形成された導電性ビアにより、第一発光素子２２と電気的に接続されている。この構成により、第一端子１２８と第一発光素子２２とが第一基台１２１の異なる面に配置されていても、容易に、第一端子１２８と第一発光素子２２とを電気的に接続することができる。 The first terminal 128 is electrically connected to the first light emitting element 22 by a conductive via formed in the first base 121. With this configuration, even if the first terminal 128 and the first light emitting element 22 are disposed on different surfaces of the first base 121, the first terminal 128 and the first light emitting element 22 are easily electrically connected. can do.
　以上のように、２つの発光モジュールを貼り合わせる構成を有する電球形ランプの製造方法において、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As mentioned above, in the manufacturing method of the lightbulb-shaped lamp which has a structure which bonds together two light emitting modules, productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
　なお、上記の変形例１では、第一基台１２１には貫通孔が形成されていないこととしたが、第一基台１２１に貫通孔（第一貫通孔）が形成されており、リード線７０が第一基台１２１の当該貫通孔にも挿入されて半田付けされる構成でも構わない。 In the first modification, the through hole is not formed in the first base 121, but the through hole (the first through hole) is formed in the first base 121, and the lead wire is formed. 70 may be inserted into the through hole of the first base 121 and soldered.
　（変形例２）
　次に、本発明の実施の形態の変形例２について、図１３を用いて説明する。図１３は、本発明の実施の形態の変形例２に係る電球形ランプにおけるＬＥＤモジュールとリード線７０との接続箇所の構成を示す図である。 (Modification 2)
Next, Modification 2 of the embodiment of the present invention will be described with reference to FIG. FIG. 13 is a view showing the configuration of the connection portion between the LED module and the lead wire 70 in the light bulb shaped lamp according to the second modification of the embodiment of the present invention.
　上記実施の形態に係る電球形ランプ１では、第一基台２１及び第二基台３１にはそれぞれ第一貫通孔２１ａ及び第二貫通孔３１ａが形成され、リード線７０は第一貫通孔２１ａ及び第二貫通孔３１ａに挿入されて半田付けされることとした。しかし、図１３に示すように、本変形例２に係る電球形ランプでは、第一基台２２１及び第二基台２３１には、リード線７０を半田付けするための貫通孔は形成されていない。 In the light bulb shaped lamp 1 according to the above embodiment, the first through hole 21a and the second through hole 31a are formed in the first base 21 and the second base 31, respectively, and the lead wire 70 is formed in the first through hole 21a. And, it is inserted into the second through hole 31a and soldered. However, as shown in FIG. 13, in the light bulb shaped lamp according to the second modification, the first base 221 and the second base 231 have no through holes for soldering the lead wire 70. .
　具体的には、第二端子２３８は、第二基台２３１の下面の端部に配置されている。また、第一端子２２８は、第二基台２３１の外側かつ第一基台２２１の下面の端部に配置されている。 Specifically, the second terminal 238 is disposed at the end of the lower surface of the second base 231. The first terminal 228 is disposed outside the second base 231 and at the end of the lower surface of the first base 221.
　そして、リード線７０と第一端子２２８と第二端子２３８とを下方から覆い、リード線７０と第一端子２２８と第二端子２３８とを電気的に接続する導電性部材２２７が配置されている。つまり、第一端子２２８と第二端子２３８とリード線７０とに、導電性部材２２７を用いて下方から半田付けを行うことで、リード線７０と第一端子２２８と第二端子２３８とを電気的に接続する。つまり、第一端子２２８は、第二基台２３１の外側で下方に向けて露出するように配置され、導電性部材２２７により覆われる。 Then, a conductive member 227 is provided which covers the lead 70, the first terminal 228 and the second terminal 238 from below and electrically connects the lead 70, the first terminal 228 and the second terminal 238. . That is, by soldering the first terminal 228, the second terminal 238, and the lead 70 from below using the conductive member 227, the lead 70, the first terminal 228, and the second terminal 238 can be electrically connected. Connect. That is, the first terminal 228 is disposed to be exposed downward on the outside of the second base 231, and is covered by the conductive member 227.
　なお、導電性部材２２７は、リード線７０の上部全体と第一端子２２８の全体と第二端子２３８の全体とを覆っていなくともよく、リード線７０の上部の少なくとも一部と第一端子２２８の少なくとも一部と第二端子２３８の少なくとも一部とを覆っていればよい。 The conductive member 227 may not cover the entire upper portion of the lead 70, the entire first terminal 228, and the entire second terminal 238, and at least a portion of the upper portion of the lead 70 and the first terminal 228. And at least a portion of the second terminal 238 may be covered.
　なお、第一基台２２１の下面に配置された第一端子２２８は、第一基台２２１に形成された導電性ビアにより、第一基台２２１の上面に配置された第一発光素子２２と電気的に接続されている。 The first terminal 228 disposed on the lower surface of the first base 221 is a first light emitting element 22 disposed on the upper surface of the first base 221 by the conductive via formed on the first pedestal 221. It is electrically connected.
　以上のように、本発明の実施の形態の変形例２に係る電球形ランプによれば、第一発光モジュール２２０は、第一基台２２１の下面に設けられた第一端子２２８を有し、第二発光モジュール２３０は、第二基台２３１の下面に設けられた第二端子２３８を有している。そして、導電性部材２２７が、リード線７０と第一端子２２８と第二端子２３８とを覆うことで、リード線７０と第一端子２２８と第二端子２３８とが電気的に接続されている。具体的には、第二端子２３８は、第二基台２３１の下面の端部に配置され、第一端子２２８は、第二基台２３１の外側かつ第一基台２２１の下面の端部に配置されている。そして、導電性部材２２７が、リード線７０と第一端子２２８と第二端子２３８とを下方から覆っている。 As described above, according to the light bulb shaped lamp according to the second modification of the embodiment of the present invention, the first light emitting module 220 has the first terminal 228 provided on the lower surface of the first base 221, The second light emitting module 230 has a second terminal 238 provided on the lower surface of the second base 231. The conductive member 227 covers the lead 70, the first terminal 228, and the second terminal 238, whereby the lead 70, the first terminal 228, and the second terminal 238 are electrically connected. Specifically, the second terminal 238 is disposed at the end of the lower surface of the second base 231, and the first terminal 228 is at the outside of the second base 231 and at the end of the lower surface of the first base 221. It is arranged. The conductive member 227 covers the lead 70, the first terminal 228, and the second terminal 238 from below.
　このように、導電性部材２２７で１方向から１回覆うことで、容易に、リード線７０と第一端子２２８と第二端子２３８とを電気的に接続し、第一発光モジュール２２０及び第二発光モジュール２３０に電力を供給することができる。つまり、半田付けを上下２方向から行う必要がないため、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As described above, the lead 70, the first terminal 228, and the second terminal 238 are easily electrically connected by covering the conductive member 227 once in one direction from one direction, and the first light emitting module 220 and the second The light emitting module 230 may be powered. That is, since it is not necessary to perform soldering from the upper and lower two directions, productivity when connecting the lead wire 70 to the two light emitting modules can be improved.
　また、第一端子２２８は、第一基台２２１に形成された導電性ビアにより、第一発光素子２２と電気的に接続されている。この構成により、第一端子２２８と第一発光素子２２とが第一基台２２１の異なる面に配置されていても、容易に、第一端子２２８と第一発光素子２２とを電気的に接続することができる。 The first terminal 228 is electrically connected to the first light emitting element 22 by a conductive via formed in the first base 221. With this configuration, even if the first terminal 228 and the first light emitting element 22 are disposed on different surfaces of the first base 221, the first terminal 228 and the first light emitting element 22 are easily electrically connected. can do.
　以上のように、２つの発光モジュールを貼り合わせる構成を有する電球形ランプの製造方法において、当該２つの発光モジュールにリード線７０を接続する際の生産性を向上させることができる。 As mentioned above, in the manufacturing method of the lightbulb-shaped lamp which has a structure which bonds together two light emitting modules, productivity at the time of connecting the lead wire 70 to the said two light emitting modules can be improved.
　（変形例３）
　次に、本発明の実施の形態の変形例３について、図１４を用いて説明する。図１４は、本発明の実施の形態の変形例３に係るＬＥＤモジュール２と支柱４１の構成を示す図である。 (Modification 3)
Next, a third modification of the embodiment of the present invention will be described with reference to FIG. FIG. 14 is a view showing the configuration of the LED module 2 and the support 41 according to the third modification of the embodiment of the present invention.
　上記実施の形態に係る電球形ランプ１では、第一基台２１及び第二基台３１には、第一貫通孔２１ａ及び第二貫通孔３１ａが形成されていることにした。しかし、本変形例３に係る電球形ランプでは、第一基台２１及び第二基台３１には、第一貫通孔２１ａ及び第二貫通孔３１ａに加えて、第三貫通孔２１ｂ及び第四貫通孔３１ｂが形成されている。 In the light bulb shaped lamp 1 according to the above embodiment, the first through hole 21 a and the second through hole 31 a are formed in the first base 21 and the second base 31. However, in the light bulb shaped lamp according to the third modification, in addition to the first through hole 21a and the second through hole 31a, the first through hole 21a and the second through hole 31 are the third through hole 21b and the fourth through hole 21b. Through holes 31 b are formed.
　つまり、支柱４１の上面中央部には円柱状の突起部４１ａが形成されており、第一基台２１及び第二基台３１には、突起部４１ａが挿入される円形状の第三貫通孔２１ｂ及び第四貫通孔３１ｂが形成されている。この突起部４１ａと第三貫通孔２１ｂ及び第四貫通孔３１ｂとにより、支柱４１上でＬＥＤモジュール２が位置決めされる。 That is, a cylindrical protrusion 41 a is formed at the center of the upper surface of the support column 41, and a circular third through hole into which the protrusion 41 a is inserted is formed in the first base 21 and the second base 31. 21b and a fourth through hole 31b are formed. The LED module 2 is positioned on the support column 41 by the projection 41a, the third through hole 21b, and the fourth through hole 31b.
　このように、第一基台２１及び第二基台３１には、第一貫通孔２１ａ及び第二貫通孔３１ａ以外の半田付けには直接関係しない貫通孔が形成されていても構わない。そして、本変形例３に係る電球形ランプは、この構成によっても、上記実施の形態に係る電球形ランプ１と同様の効果を奏する。 As described above, the first base 21 and the second base 31 may have through holes that are not directly related to the soldering other than the first through holes 21 a and the second through holes 31 a. And the light bulb shaped lamp concerning this modification 3 has an effect similar to the light bulb shaped lamp 1 concerning the above-mentioned embodiment also by this composition.
　以上、本発明に係る電球形ランプについて、実施の形態及びその変形例に基づいて説明したが、本発明は、これらの実施の形態及び変形例に限定されるものではない。つまり、今回開示された実施の形態及びその変形例は全ての点で例示であって制限的なものではないと考えられるべきである。本発明の範囲は上記した説明ではなくて請求の範囲によって示され、請求の範囲と均等の意味及び範囲内での全ての変更が含まれることが意図される。 As mentioned above, although the lightbulb-shaped lamp which concerns on this invention was demonstrated based on embodiment and its modification, this invention is not limited to these embodiment and modification. That is, it should be understood that the embodiment disclosed this time and the modification thereof are illustrative in all points and not restrictive. The scope of the present invention is indicated not by the above description but by the scope of the claims, and is intended to include all modifications within the scope and meaning equivalent to the scope of the claims.
　例えば、上記実施の形態では、リード線７０の先端が導電性部材２７の表面で露出するように設けられるとしたが、リード線７０は導電性部材２７により完全に被覆されていてもよい。この場合には、リード線７０と導電性部材２７との接触面積が増加するため、両者の接続を強固にすることができる。 For example, although the tip of the lead 70 is provided to be exposed on the surface of the conductive member 27 in the above embodiment, the lead 70 may be completely covered by the conductive member 27. In this case, the contact area between the lead wire 70 and the conductive member 27 is increased, so that the connection between the two can be strengthened.
　また、上記実施の形態では、第二端子３８は、第二基台３１に形成された導電性ビアにより、第二発光素子３２と電気的に接続されていることとした。また、変形例では、第一端子は、第一基台に形成された導電性ビアにより、第一発光素子と電気的に接続されていることとした。しかし、第一基台又は第二基台の上面と下面との接続は、導電性ビアには限定されず、配線による接続などでも構わない。 Further, in the above embodiment, the second terminal 38 is electrically connected to the second light emitting element 32 by the conductive via formed in the second base 31. In the modification, the first terminal is electrically connected to the first light emitting element by the conductive via formed in the first base. However, the connection between the upper surface and the lower surface of the first base or the second base is not limited to the conductive via, but may be connection by wiring or the like.
　また、上記実施の形態及び変形例では、導電性部材として半田などの導電性接着剤を用いることとした。しかし、導電性部材として金属製の板状部材や配線などを用い、リード線と第一端子と第二端子と接続することで、リード線と第一端子と第二端子とを電気的に接続することにしてもよい。 Further, in the above embodiment and modification, a conductive adhesive such as solder is used as the conductive member. However, by using a metal plate member or wiring as the conductive member and connecting the lead wire to the first terminal and the second terminal, the lead wire is electrically connected to the first terminal and the second terminal. You may decide to do it.
　また、上記実施の形態及び変形例では、発光素子としてＬＥＤを例示したが、半導体レーザ等の半導体発光素子、有機ＥＬ（Ｅｌｅｃｔｒｏ　Ｌｕｍｉｎｅｓｃｅｎｃｅ）又は無機ＥＬ等の発光素子を用いてもよい。 Further, in the above-described embodiment and modifications, the LED is exemplified as the light emitting element, but a semiconductor light emitting element such as a semiconductor laser, or a light emitting element such as organic EL (Electro Luminescence) or inorganic EL may be used.
　また、上記実施の形態及び変形例では、ＬＥＤモジュール２は第一基台２１及び第二基台３１上にＬＥＤチップを直接実装したＣＯＢ型の構成としたが、これに限らない。例えば、樹脂成形されたキャビティの中にＬＥＤチップを実装して当該キャビティ内を蛍光体含有樹脂によって封入したパッケージ型、つまり表面実装型（ＳＭＤ：Ｓｕｒｆａｃｅ　Ｍｏｕｎｔ　Ｄｅｖｉｃｅ）のＬＥＤ素子を用い、このＳＭＤ型のＬＥＤ素子を基板上に複数個実装することで構成されたＬＥＤモジュールを用いても構わない。 Moreover, in the said embodiment and modification, although it was set as the structure of COB type which mounted the LED chip directly on the 1st base 21 and the 2nd base 31, it is not restricted to this. For example, a package type in which an LED chip is mounted in a resin-molded cavity and the inside of the cavity is sealed with a phosphor-containing resin, that is, a surface mount device (SMD: Surface Mount Device) LED element is used. An LED module configured by mounting a plurality of the above LED elements on a substrate may be used.
　また、本発明は、上記の電球形ランプを備える照明装置として実現することもできる。例えば、上記の電球形ランプと、当該電球形ランプが取り付けられる点灯器具とを備える照明装置として構成することができる。この場合、点灯器具は、照明用光源の消灯及び点灯を行うものであり、例えば、天井に取り付けられる器具本体と、照明用光源を覆うカバーとを備える。このうち、器具本体は、照明用光源の口金が装着されるとともに照明用光源に給電を行うソケットを有する。 Moreover, this invention can also be implement | achieved as an illuminating device provided with said bulb-shaped lamp. For example, it can comprise as a lighting installation provided with the above-mentioned light bulb shaped lamp, and the lighting fixture to which the said light bulb shaped lamp is attached. In this case, the lighting fixture is for turning off and lighting the illumination light source, and includes, for example, a fixture body attached to a ceiling, and a cover covering the illumination light source. Among these, the fixture body is equipped with a socket for mounting a base of the illumination light source and supplying power to the illumination light source.
　その他、本発明の趣旨を逸脱しない限り、当業者が思いつく各種変形を本実施の形態及び変形例に施したもの、又は、実施の形態及び変形例における構成要素を組み合わせて構築される形態も、本発明の範囲内に含まれる。 In addition, without departing from the spirit of the present invention, various modifications that those skilled in the art may think of are applied to the present embodiment and modifications, or an embodiment constructed by combining the components in the embodiments and modifications, Included within the scope of the present invention.
　本発明は、従来の白熱電球等を代替する電球形ランプとして有用であり、照明装置等において広く利用することができる。 INDUSTRIAL APPLICABILITY The present invention is useful as a light bulb shaped lamp replacing conventional incandescent light bulbs and the like, and can be widely used in lighting devices and the like.
　１　電球形ランプ
　２　ＬＥＤモジュール
　１０　グローブ
　１１　開口部
　２０、１２０、２２０　第一発光モジュール
　２１、１２１、２２１　第一基台
　２１ａ　第一貫通孔
　２１ｂ　第三貫通孔
　２２　第一発光素子
　２３　第一封止部材
　２４、２６　第一金属配線
　２５　第一ワイヤー
　２７、１２７、２２７　導電性部材
　２８、１２８、２２８　第一端子
　３０、１３０、２３０　第二発光モジュール
　３１、１３１、２３１　第二基台
　３１ａ、１３１ａ　第二貫通孔
　３１ｂ　第四貫通孔
　３２　第二発光素子
　３３　第二封止部材
　３４、３６　第二金属配線
　３５　第二ワイヤー
　３８、１３８、２３８　第二端子
　４０、４１　支柱
　４１ａ　突起部
　５０　支持板
　６０　樹脂ケース
　６１　第１ケース部
　６２　第２ケース部
　７０　リード線
　８０　点灯回路
　９０　口金 DESCRIPTION OF SYMBOLS 1 Bulb-shaped lamp 2 LED module 10 Globe 11 Opening part 20, 120, 220 1st light emitting module 21, 121, 221 1st base 21a 1st through hole 21b 3rd through hole 22 1st light emitting element 23 1st sealing Member 24, 26 first metal wiring 25 first wire 27, 127, 227 conductive member 28, 128, 228 first terminal 30, 130, 230 second light emitting module 31, 131, 231 second base 31a, 131a second Two through holes 31b fourth through holes 32 second light emitting elements 33 second sealing members 34, 36 second metal wires 35 second wires 38, 138, 238 second terminals 40, 41 pillars 41 a protrusions 50 supporting plate 60 resin Case 61 1st Case 62 62 2nd Case 70 Lead Wire 80 Lighting Circuit 90 Base

Claims (9)

  1. 　口金と、前記口金の上方に配置される透光性グローブとを有する電球形ランプであって、
    　前記透光性グローブ内方に配置され、上面に第一発光素子群が設けられた主発光モジュールと、
    　前記透光性グローブ内方に配置され、前記主発光モジュールの下面に接合されるとともに、下面に第二発光素子群が設けられた副発光モジュールと、
    　前記第一発光素子群と前記第二発光素子群とに電力を供給するための駆動回路と、
    　前記主発光モジュール及び前記副発光モジュールと前記駆動回路とを電気的に接続するためのリード線とを備え、
    　前記主発光モジュールは、主基板と、前記主基板の上側又は下側の面に設けられ前記第一発光素子群と前記駆動回路とを電気的に接続するための第一端子とを有し、
    　前記副発光モジュールは、副基板と、前記副基板の前記第一端子が設けられた面と同じ側の面に設けられ前記第二発光素子群と前記駆動回路とを電気的に接続するための第二端子とを有し、
    　前記電球形ランプは、さらに、
    　前記リード線と前記第一端子と前記第二端子とを覆い、前記リード線と前記第一端子と前記第二端子とを電気的に接続する導電性部材を備える
    　電球形ランプ。     A light bulb shaped lamp having a base and a translucent globe disposed above the base, the lamp being a lamp
    A main light emitting module disposed inward of the translucent glove and provided with a first light emitting element group on an upper surface thereof;
    An auxiliary light emitting module which is disposed inward of the light transmitting glove and joined to the lower surface of the main light emitting module, and in which the second light emitting element group is provided on the lower surface;
    A driving circuit for supplying power to the first light emitting element group and the second light emitting element group;
    And a lead wire electrically connecting the main light emitting module and the sub light emitting module to the drive circuit.
    The main light emitting module has a main substrate, and a first terminal provided on the upper or lower surface of the main substrate and electrically connecting the first light emitting element group to the drive circuit.
    The sub light emitting module is provided on a surface of the sub substrate on the same side as the surface on which the first terminal of the sub substrate is provided, and electrically connects the second light emitting element group to the drive circuit. And a second terminal,
    The light bulb shaped lamp is further
    A bulb-shaped lamp, comprising: a conductive member which covers the lead wire, the first terminal, and the second terminal, and electrically connects the lead wire, the first terminal, and the second terminal.
  2. 　前記主基板には、前記リード線が挿入される第一貫通孔が形成されており、
    　前記第一端子は、前記第一貫通孔の外方かつ前記主基板の上面に配置され、
    　前記副基板には、前記リード線が挿入される、前記第一貫通孔よりも小さい第二貫通孔が形成されており、
    　前記第二端子は、前記第一貫通孔の内方であって、前記第二貫通孔の外方かつ前記副基板の上面に配置され、
    　前記導電性部材は、前記リード線と前記第一端子と前記第二端子とを上方から覆う
    　請求項１に記載の電球形ランプ。     A first through hole into which the lead wire is inserted is formed in the main substrate,
    The first terminal is disposed outside the first through hole and on the upper surface of the main substrate,
    The sub-substrate is formed with a second through hole smaller than the first through hole into which the lead wire is inserted.
    The second terminal is disposed on the inner side of the first through hole, on the outer side of the second through hole and on the upper surface of the sub substrate.
    The light bulb shaped lamp according to claim 1, wherein the conductive member covers the lead wire, the first terminal, and the second terminal from above.
  3. 　前記第二端子は、前記副基板に形成された導電性ビアにより、前記第二発光素子群と電気的に接続される
    　請求項２に記載の電球形ランプ。     The light bulb shaped lamp according to claim 2, wherein the second terminal is electrically connected to the second light emitting element group by a conductive via formed in the sub substrate.
  4. 　前記副基板には、前記リード線が挿入される貫通孔が形成されており、
    　前記第一端子は、前記貫通孔の内方かつ前記主基板の下面に配置され、
    　前記第二端子は、前記貫通孔の外方かつ前記副基板の下面に配置され、
    　前記導電性部材は、前記リード線と前記第一端子と前記第二端子とを下方から覆う
    　請求項１に記載の電球形ランプ。     The sub-substrate is formed with a through hole into which the lead wire is inserted;
    The first terminal is disposed inward of the through hole and on the lower surface of the main substrate,
    The second terminal is disposed outside the through hole and on the lower surface of the sub substrate,
    The light bulb shaped lamp according to claim 1, wherein the conductive member covers the lead wire, the first terminal, and the second terminal from below.
  5. 　前記第二端子は、前記副基板の下面の端部に配置され、
    　前記第一端子は、前記副基板の外側かつ前記主基板の下面の端部に配置され、
    　前記導電性部材は、前記リード線と前記第一端子と前記第二端子とを下方から覆う
    　請求項１に記載の電球形ランプ。     The second terminal is disposed at an end of the lower surface of the sub substrate,
    The first terminal is disposed outside the sub substrate and at an end of the lower surface of the main substrate,
    The light bulb shaped lamp according to claim 1, wherein the conductive member covers the lead wire, the first terminal, and the second terminal from below.
  6. 　前記第一端子は、前記主基板に形成された導電性ビアにより、前記第一発光素子群と電気的に接続される
    　請求項４又は５に記載の電球形ランプ。     The light bulb shaped lamp according to claim 4 or 5, wherein the first terminal is electrically connected to the first light emitting element group by a conductive via formed in the main substrate.
  7. 　請求項１～６のいずれか１項に記載の電球形ランプを備える照明装置。 A lighting device comprising the light bulb shaped lamp according to any one of claims 1 to 6.
  8. 　口金と、前記口金の上方に配置される透光性グローブとを有する電球形ランプの製造方法であって、
    　前記電球形ランプは、
    　第一発光素子群が設けられた主発光モジュールと、第二発光素子群が設けられた副発光モジュールと、前記第一発光素子群と前記第二発光素子群とに電力を供給するための駆動回路と、前記主発光モジュール及び前記副発光モジュールと前記駆動回路とを電気的に接続するためのリード線とを備え、
    　前記電球形ランプの製造方法は、
    　前記主発光モジュールの主基板の面上に設けられ前記第一発光素子群と前記駆動回路とを電気的に接続するための第一端子と、前記副発光モジュールの副基板の面上に設けられ前記第二発光素子群と前記駆動回路とを電気的に接続するための第二端子とが、同じ側の面上に配置されるように、前記主発光モジュールと前記副発光モジュールとを接合する接合工程と、
    　前記リード線と前記第一端子と前記第二端子とを導電性部材で覆うことにより、前記リード線と前記第一端子と前記第二端子とを電気的に接続する接続工程と
    　を含む電球形ランプの製造方法。     A manufacturing method of a light bulb shaped lamp having a base and a translucent globe disposed above the base, the method comprising the steps of:
    The bulb-shaped lamp is
    A main light emitting module provided with a first light emitting element group, a sub light emitting module provided with a second light emitting element group, and a drive for supplying power to the first light emitting element group and the second light emitting element group A circuit, and a lead wire for electrically connecting the main light emitting module and the sub light emitting module to the drive circuit;
    The method of manufacturing the light bulb shaped lamp is
    A first terminal provided on the surface of the main substrate of the main light emitting module for electrically connecting the first light emitting element group and the drive circuit, and provided on the surface of the sub substrate of the sub light emitting module The main light emitting module and the sub light emitting module are joined so that the second terminal for electrically connecting the second light emitting element group and the drive circuit is disposed on the same side. Bonding process,
    And a connecting step of electrically connecting the lead wire, the first terminal, and the second terminal by covering the lead wire, the first terminal, and the second terminal with a conductive member. How to make a lamp.
  9. 　前記接続工程では、
    　前記主基板に形成された第一貫通孔の内方、かつ、前記副基板に形成された前記第一貫通孔よりも小さい第二貫通孔の内方に、前記リード線を配置し、
    　前記第一貫通孔の外方かつ前記主基板の上面に配置された前記第一端子と、前記第一貫通孔の内方であって前記第二貫通孔の外方かつ前記副基板の上面に配置された前記第二端子と、前記リード線とを前記導電性部材で上方から覆うことにより、前記リード線と前記第一端子と前記第二端子とを電気的に接続する
    　請求項８に記載の電球形ランプの製造方法。     In the connection step,
    The lead wire is disposed inward of a first through hole formed in the main substrate and inward of a second through hole smaller than the first through hole formed in the sub substrate,
    The first terminal disposed on the outer side of the first through hole and on the upper surface of the main substrate, and the inner side of the first through hole on the outer surface of the second through hole and on the upper surface of the sub substrate 9. The lead wire, the first terminal, and the second terminal are electrically connected by covering the arranged second terminal and the lead wire from above with the conductive member. Method of light bulb shaped lamp.
PCT/JP2013/001303 2012-07-06 2013-03-04 Bulb-shaped lamp, illumination device, and bulb-shaped lamp manufacturing method WO2014006790A1 (en)

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JPS61188380U (en) * 1985-05-17 1986-11-25
JPH0585068U (en) * 1992-04-17 1993-11-16 アルプス電気株式会社 Multilayer printed circuit board
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JP2010157459A (en) * 2008-12-31 2010-07-15 Keiji Iimura Led lamp, and bulb-type led lamp
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