JP2014146510A - Light source for lighting and lighting device - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a light source for lighting which improves the heat radiation efficiency of heat generated in a light emitting module.SOLUTION: A light source for lighting includes: a translucent globe 10; an LED module 20; a driving circuit 50 for causing the LED module 20 to emit light; and a base 45 having a support pillar 30 which fixes the LED module 20 at a predetermined position at the inner side of the globe 10, a pedestal 40 which supports the support pillar 30, and a heat radiation part 46. The heat radiation part 46 is provided between an arrangement region 44 of the support pillar 30 on the main surface 40a of the pedestal 40, which is located on the LED module 20 side, and the driving circuit 50 and has a surface inclining relative to a rear surface 40b that is opposite to the main surface 40a of the pedestal 40.

Description

  The present invention relates to an illumination light source and an illumination device, and more particularly, to a light bulb shaped lamp including a light emitting module having a light emitting diode (LED) and an illumination device using the same.

  Semiconductor light-emitting elements such as LEDs are expected to serve as light sources for various products because of their small size, high efficiency, and long life. In particular, light bulb-type LED lamps (LED light bulbs) are being developed as illumination light sources that replace conventional light bulb-type fluorescent lamps and incandescent light bulbs (see, for example, Patent Document 1).

  The bulb-type LED lamp is configured to surround, for example, an LED module that serves as a light source, a globe that covers the LED module, a support member that supports the LED module, a drive circuit that supplies power to the LED module, and a drive circuit. An outer casing and a base for receiving power. The LED module includes a substrate and a plurality of LEDs (light emitting elements) mounted on the substrate.

JP 2006-313717 A

  In recent years, a light bulb-type LED lamp having a configuration similar to an incandescent bulb in light distribution characteristics and appearance has been studied. For example, a bulb-type LED lamp having a configuration in which an LED module is held hollow at a central position in the globe using a globe (clear bulb) made of transparent glass as used in an incandescent bulb has been proposed. In this case, for example, the LED module is fixed to the top of the column using a column extending from the globe opening toward the center of the globe.

  In the LED mounted on the LED module, heat is generated from the LED itself by light emission, thereby increasing the temperature of the LED and reducing the light output. That is, the light emission efficiency of the LED decreases due to the heat generated by itself. For this reason, the heat dissipation countermeasure of an LED module is important.

  On the other hand, light bulb-type LED lamps are required to have higher luminous flux, and research and development of high-power type LED lamps in which LEDs are frequently used are underway. For example, a bulb-type LED lamp having a brightness equivalent to 60 W has been studied. Therefore, measures for heat dissipation of the LED module are extremely important issues.

  An object of the present invention is to provide an illumination light source and an illumination apparatus that can improve the heat dissipation efficiency of heat generated in a light emitting module in consideration of the above-described conventional problems.

  In order to achieve the above object, an illumination light source according to one embodiment of the present invention includes a light-transmitting globe, a light-emitting module, a drive circuit for causing the light-emitting module to emit light, and the light-emitting module. A support column that fixes the inner column at a predetermined position, a pedestal that supports the support column, and a pedestal that includes a heat dissipation unit, and the heat dissipation unit is a column on the main surface that is a surface of the pedestal on the light emitting module side. And a surface inclined with respect to the back surface which is a surface opposite to the main surface of the pedestal.

  Moreover, the illumination light source which concerns on 1 aspect of this invention WHEREIN: The said thermal radiation part is good also as a convex part provided in the protruding shape from the back surface of the said base.

  Moreover, the illumination light source which concerns on 1 aspect of this invention WHEREIN: The said base has a through-hole fixed in the state which penetrated the edge part of the said support | pillar, and the said convex part is a back surface of the said base from the said through-hole. It may be formed by the end portion of the column in a state of protruding to the side.

  The illumination light source according to one aspect of the present invention further includes an insulating member provided between the heat dissipation portion and the drive circuit, and the insulating member has a concave shape along the shape of the heat dissipation portion. It may have a heat receiving part.

  Moreover, the illumination light source which concerns on 1 aspect of this invention WHEREIN: The said thermal radiation part is good also as a recessed part provided in the concave shape from the back surface of the said base.

  Further, in the illumination light source according to one aspect of the present invention, the pedestal has a through-hole that fixes the support in a state where the end of the support is inserted, and the recess has an inner surface of the through-hole. , And an end surface of the end portion.

  The illumination light source according to one aspect of the present invention further includes an insulating member provided between the heat dissipation portion and the drive circuit, and the insulating member has a convex shape along the shape of the heat dissipation portion. It may have a heat receiving part.

  An illumination device according to one embodiment of the present invention includes the illumination light source according to any one of the above embodiments.

  According to the present invention, it is possible to efficiently dissipate heat generated in the light emitting module.

External perspective view of a light bulb shaped lamp according to an embodiment Exploded perspective view of a light bulb shaped lamp according to an embodiment Sectional drawing of the bulb-type lamp which concerns on embodiment The figure which shows the structure outline | summary of the LED module in the light bulb shaped lamp which concerns on embodiment The figure which shows an example of the joining aspect of the support | pillar and a base in embodiment External appearance perspective view of the cap part in embodiment Sectional drawing which shows the structure outline | summary of the cap part which concerns on the modification 1 of embodiment. Sectional drawing which shows the structure outline | summary of the convex part which concerns on the modification 2 of embodiment. Sectional drawing which shows the structure outline | summary of the base which concerns on the modification 3 of embodiment The figure which shows the cross-sectional shape of two types of convex parts which concern on the modification 4 of embodiment. Sectional drawing which shows the structure outline | summary of the thermal radiation part which concerns on the modification 5 of embodiment. The figure which shows the cross-sectional shape of two types of recessed parts which concern on the modification 6 of embodiment. The figure which shows the joining aspect of the support | pillar and base which concern on the modification 7 of embodiment. Schematic sectional view of a lighting device according to an embodiment

  DESCRIPTION OF EMBODIMENTS Hereinafter, an illumination light source and an illumination device according to embodiments of the present invention will be described with reference to the drawings. Each figure is a schematic diagram and is not necessarily illustrated exactly.

  Each of the embodiments described below shows a preferred specific example of the present invention. Therefore, the numerical values, shapes, materials, components, component arrangement positions, connection forms, and the like shown in the following embodiments are merely examples, and are not intended to limit the present invention. Therefore, among the constituent elements in the following embodiments, constituent elements not described in the independent claims are described as arbitrary constituent elements.

  In the following embodiments, a bulb-type LED lamp (LED bulb) will be described as an example of a light source for illumination.

[Overall configuration of bulb-type lamp]
First, the whole structure of the light bulb shaped lamp 1 according to the present embodiment will be described with reference to FIGS. 1 and 2.

  FIG. 1 is an external perspective view of a light bulb shaped lamp according to an embodiment.

  FIG. 2 is an exploded perspective view of the light bulb shaped lamp according to the embodiment. In FIG. 2, the lead wires 53a to 53d are omitted.

  As shown in FIGS. 1 and 2, the light bulb shaped lamp 1 according to the present embodiment is a light bulb shaped lamp that is an alternative to a light bulb shaped fluorescent light or an incandescent light bulb.

  The light bulb shaped lamp 1 includes a globe 10, an LED module 20 which is an example of a light emitting module, and a base 45 having a support 30 and a pedestal 40.

  In the present embodiment, the light bulb shaped lamp 1 further includes a drive circuit 50, a circuit case 60, a heat sink 70, an outer casing 80, and a base 90.

  The bulb-shaped lamp 1 includes an envelope formed by the globe 10, the outer casing 80, and the base 90.

  Hereinafter, each component of the light bulb shaped lamp 1 according to the present embodiment will be described in detail with reference to FIG.

  FIG. 3 is a cross-sectional view of the light bulb shaped lamp 1 according to the embodiment.

  In FIG. 3, the alternate long and short dash line drawn along the vertical direction on the paper indicates the lamp axis J (center axis) of the light bulb shaped lamp. In this embodiment, the lamp axis J is the axis of the globe 10 ( It coincides with the globe axis. The lamp axis J is an axis serving as a rotation center when the light bulb shaped lamp 1 is attached to a socket of a lighting device (not shown in FIG. 3), and coincides with the rotation axis of the base 90. Further, in FIG. 3, the drive circuit 50 is shown in a side view rather than a sectional view.

[Glove]
As shown in FIG. 3, the globe 10 is a substantially hemispherical light-transmitting cover for taking out the light emitted from the LED module 20 to the outside of the lamp. The globe 10 in the present embodiment is a glass bulb (clear bulb) made of silica glass that is transparent to visible light. Therefore, the LED module 20 housed in the globe 10 can be viewed from the outside of the globe 10.

  The LED module 20 is covered with the globe 10. Thereby, the light of the LED module 20 that has entered the inner surface of the globe 10 passes through the globe 10 and is extracted to the outside of the globe 10. In the present embodiment, the globe 10 is configured to house the LED module 20.

  The shape of the globe 10 is such that one end is closed in a spherical shape and the other end has an opening 11. Specifically, the shape of the globe 10 is such that a part of a hollow sphere narrows while extending away from the center of the sphere, and the opening 11 is located away from the center of the sphere. Is formed.

  As the globe 10 having such a shape, a glass bulb having a shape similar to that of a general bulb-type fluorescent lamp or incandescent bulb can be used. For example, a glass bulb such as an A shape, a G shape, or an E shape can be used as the globe 10.

  Further, the opening 11 of the globe 10 is placed on the surface of the pedestal 40, for example, and in this state, the globe 10 is applied by applying an adhesive such as silicone resin between the pedestal 40 and the outer casing 80. Fixed.

  The globe 10 is not necessarily transparent to visible light, and the globe 10 may have a light diffusion function. For example, a milky white light diffusing film can be formed by applying a resin or a white pigment containing a light diffusing material such as silica or calcium carbonate to the entire inner surface or outer surface of the globe 10. As described above, by providing the globe 10 with the light diffusion function, the light incident on the globe 10 from the LED module 20 can be diffused, so that the light distribution angle of the light bulb shaped lamp 1 can be expanded.

  Further, the shape of the globe 10 is not limited to the A shape or the like, and may be a spheroid or an oblate ball. The material of the globe 10 is not limited to a glass material, and a resin such as acrylic (PMMA) or polycarbonate (PC) may be used.

[LED module]
The LED module 20 is a light emitting module having a light emitting element, and emits light of a predetermined color (wavelength) such as white.

  As shown in FIG. 3, the LED module 20 is disposed inward of the globe 10, and is formed at a spherical center position formed by the globe 10 (for example, inside the large diameter portion where the inner diameter of the globe 10 is large). Preferably they are arranged.

  Thus, by arranging the LED module 20 at the center position of the globe 10, it is possible to realize a light distribution characteristic approximate to that of a conventional incandescent bulb using a filament coil.

  The LED module 20 is held hollow in the globe 10 by the support column 30 and emits light by electric power supplied from the drive circuit 50 via the lead wires 53a and 53b. In the present embodiment, the substrate 21 of the LED module 20 is supported by the support column 30.

  Here, each component of the LED module 20 which concerns on embodiment of this invention is demonstrated using FIG.

  FIG. 4 is a diagram showing a schematic configuration of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment.

  Specifically, FIG. 4A is a plan view of the LED module 20 in the light bulb shaped lamp 1 according to the embodiment. FIG. 4B is a cross-sectional view of the LED module 20 taken along line AA ′ in FIG. FIG. 4C is a cross-sectional view of the LED module 20 taken along the line BB ′ of FIG.

  As shown to (a)-(c) of FIG. 4, the LED module 20 has the board | substrate 21, LED22, the sealing member 23, the metal wiring 24, the wire 25, and the terminals 26a and 26b.

  LED module 20 in the present embodiment has a COB (Chip On Board) structure in which a bare chip is directly mounted on substrate 21. Hereinafter, each component of the LED module 20 will be described in detail.

  First, the substrate 21 will be described. The substrate 21 is a mounting substrate for mounting the LEDs 22, and includes a first main surface (front side surface) on which the LEDs 22 are mounted, and a second main surface (back side surface) facing the first main surface. Have

  As shown to (a) of FIG. 4, the board | substrate 21 is a rectangular-plate-shaped board | substrate with a planar view (when it sees from the top part of the globe 10), for example.

  The substrate 21 is connected to one end of the support column 30. Specifically, the second main surface of the substrate 21 and the end surface of the support column 30 are connected so as to be in surface contact.

  As the substrate 21, a substrate having a low light transmittance with respect to the light emitted from the LED 22, for example, a white substrate such as a white alumina substrate having a total transmittance of 10% or less or a metal substrate (metal base substrate) coated with a resin is used. Can be used.

  Thus, by using a substrate having a low light transmittance, it is possible to suppress light from being transmitted through the substrate 21 and emitted from the second main surface, and color unevenness can be suppressed. Further, since an inexpensive white substrate can be used, cost reduction can be realized.

  On the other hand, a light-transmitting substrate having a high light transmittance can be used as the substrate 21. By using the translucent substrate, the light of the LED 22 is transmitted through the inside of the substrate 21 and is also emitted from the surface (back side surface) on which the LED 22 is not mounted.

  Therefore, even if the LED 22 is mounted only on the first main surface (front side surface) of the substrate 21, light is emitted from the second main surface (back side surface), so that the light distribution approximates that of an incandescent bulb. It becomes possible to obtain characteristics. Moreover, since light can be emitted from the LED module 20 in all directions, it is possible to realize all light distribution characteristics.

  As the light-transmitting substrate, for example, a substrate having a total transmittance of 80% or more for visible light or a transparent substrate that is transparent to visible light (that is, the transmittance is extremely high and the other side can be seen through) is used. Can do. As such a translucent substrate, a translucent ceramic substrate made of polycrystalline alumina or aluminum nitride, a transparent glass substrate made of glass, a crystal substrate made of crystal, a sapphire substrate made of sapphire, or a transparent resin material made of transparent resin material A resin substrate or the like can be used.

  In the present embodiment, a white polycrystalline ceramic substrate made of sintered alumina is used as the light-transmitting substrate 21. For example, a white alumina substrate having a thickness of 1 mm and a light reflectance of 94%, or a white alumina substrate having a thickness of 0.635 mm and a light reflectance of 88% can be used.

  As the substrate 21, a resin substrate, a flexible substrate, or a metal base substrate can be used. In addition, the shape of the substrate 21 is not limited to a rectangle, and other shapes such as a square or a circle can be used.

  In addition, the substrate 21 is provided with two insertion holes 27a and 27b for electrical connection with the two lead wires 53a and 53b. The lead wire 53a (53b) is solder-connected to a terminal 26a (26b) formed on the substrate 21 with the tip portion inserted through the insertion hole 27a (27b).

  Next, the LED 22 will be described. The LED 22 is an example of a light emitting element, and is a semiconductor light emitting element that emits light with a predetermined power. The plurality of LEDs 22 on the substrate 21 are all the same, and the LEDs 22 are selected so that the Vf characteristics are all the same.

  Each LED 22 is a bare chip that emits monochromatic visible light. In this embodiment, a blue LED chip that emits blue light when energized is used. As the blue LED chip, for example, a gallium nitride based semiconductor light emitting device having a center wavelength of 440 nm to 470 nm, which is made of an InGaN based material, can be used.

  The LEDs 22 are mounted only on the first main surface (front side surface) of the substrate 21, and a plurality of LEDs 22 are mounted so as to form a plurality of rows along the long side direction of the substrate 21. In the present embodiment, 48 LEDs 22 are arranged on the substrate 21 in order to achieve brightness equivalent to 60 W. Specifically, 48 LEDs 22 are arranged on the first main surface (front side surface) of the substrate 21 so that four rows of element rows each composed of 12 LEDs 22 are arranged in parallel.

  Further, in the present embodiment, in the LEDs 22 adjacent to each other, the cathode electrode of one LED 22 and the anode electrode of the other LED 22 are connected via a metal wiring 24 by wire bonding using a wire 25.

  In addition, you may connect the wire bond part of adjacent LED22 directly with the wire 25, without passing through the metal wiring 24. FIG. That is, the adjacent LEDs 22 may be wire-bonded by chip-to-chip. In this case, the metal wiring 24 arrange | positioned between adjacent LED22 is unnecessary.

  In the present embodiment, the plurality of LEDs 22 are mounted on the substrate 21, but the number of LEDs 22 may be appropriately changed according to the use of the light bulb shaped lamp 1.

  For example, when the light bulb shaped lamp 1 is realized as a low output type LED lamp that replaces a miniature light bulb or the like, the LED module 20 may have one LED 22.

  On the other hand, when the light bulb shaped lamp 1 is realized as a high output type LED lamp, the number of LEDs 22 mounted in one element array may be further increased.

  Moreover, the element row | line | column of LED22 is good not only as 4 rows but 1-3 rows, and good also as 5 rows or more.

  Next, the sealing member 23 will be described. The sealing member 23 is made of, for example, resin and is configured to cover the LED 22.

  Specifically, the sealing member 23 is formed so as to collectively seal one row of the plurality of LEDs 22. In the present embodiment, since four element rows of the LED 22 are provided, four sealing members 23 are formed. Each of the four sealing members 23 is linearly provided on the first main surface of the substrate 21 along the arrangement direction (column direction) of the plurality of LEDs 22.

  The sealing member 23 is mainly made of a translucent material, but when it is necessary to convert the wavelength of the light of the LED 22 to a predetermined wavelength, a wavelength conversion material is mixed into the translucent material.

  The sealing member 23 in the present embodiment includes a phosphor as a wavelength conversion material. That is, the sealing member 23 is a wavelength conversion member that converts the wavelength (color) of light emitted from the LED 22.

  Such a sealing member 23 can be constituted by, for example, an insulating resin material (phosphor-containing resin) containing phosphor particles. The phosphor particles are excited by light emitted from the LED 22 and emit light of a desired color (wavelength).

  For example, a silicone resin can be used as the resin material constituting the sealing member 23. Further, a light diffusing material may be dispersed in the sealing member 23. The sealing member 23 is not necessarily formed of a resin material, and may be formed of an inorganic material such as a low-melting glass or a sol-gel glass in addition to an organic material such as a fluorine-based resin.

  For example, when the LED 22 is a blue LED that emits blue light, the phosphor particles to be contained in the sealing member 23 are, for example, YAG (yttrium, aluminum, garnet) -based yellow phosphor particles in order to obtain white light. Is adopted.

  Thereby, a part of the blue light emitted from the LED 22 is converted into yellow light by the yellow phosphor particles contained in the sealing member 23. Then, the blue light that has not been absorbed by the yellow phosphor particles and the yellow light that has been wavelength-converted by the yellow phosphor particles are diffused and mixed in the sealing member 23, so that the white light is emitted from the sealing member 23. And emitted. In addition, particles such as silica are used as the light diffusing material.

  The sealing member 23 in the present embodiment is formed of a phosphor-containing resin in which predetermined phosphor particles are dispersed in a silicone resin. For example, the sealing member 23 is formed by applying and curing the phosphor-containing resin on the first main surface of the substrate 21 with a dispenser. In this case, the shape of the cross section perpendicular to the longitudinal direction of the sealing member 23 is substantially semicircular.

  In order to convert the wavelength of light (leakage light) toward the back side of the substrate 21, fluorescent light is used as a second wavelength conversion member between the LED 22 and the substrate 21 or on the second main surface (back side surface) of the substrate 21. A phosphor film (phosphor layer) such as a sintered body film composed of body particles and an inorganic binder (binder) such as glass or the same phosphor-containing resin as the surface of the substrate 21 may be further formed.

  In this manner, by forming the second wavelength conversion member on the second main surface of the substrate 21, white light can be emitted from both surfaces of the substrate 21 even when light leaks from the second main surface. it can.

  Next, the metal wiring 24 will be described. The metal wiring 24 is a conductive wiring through which a current for causing the LED 22 to emit light flows, and is patterned in a predetermined shape on the surface of the substrate 21. As shown in FIG. 4A, the metal wiring 24 is formed on the first main surface of the substrate 21. The power supplied to the LED module 20 from the lead wires 53a and 53b is supplied to each LED 22 by the metal wiring 24.

  The metal wiring 24 can be formed by, for example, patterning or printing a metal film made of a metal material. As a material of the metal wiring 24, for example, silver (Ag), tungsten (W), copper (Cu), gold (Au), or the like can be used.

  The metal wiring 24 exposed from the sealing member 23 is preferably covered with a glass film (glass coat film) made of a glass material or a resin film (resin coat film) made of a resin material, except for the terminals 26a and 26b. . Thereby, for example, the insulation in the LED module 20 can be improved, and the reflectance of the surface of the substrate 21 can be improved.

  The wire 25 is an electric wire such as a gold wire. As shown in FIG. 4B, the wire 25 connects the LED 22 and the metal wiring 24.

  Specifically, the wire 25 is wire-bonded to the wire bonding portion provided on the upper surface of the LED 22 and the metal wiring 24 formed adjacent to both sides of the LED 22.

  In the present embodiment, the entire wire 25 is embedded in the sealing member 23 so as not to be exposed from the sealing member 23. This prevents light from being absorbed by the exposed wire 25, reflection of light, and the like.

  Next, the terminals 26a and 26b will be described. The terminals 26 a and 26 b are external connection terminals that receive DC power for causing the LEDs 22 to emit light from the outside of the LED module 20. In the present embodiment, terminals 26a and 26b are solder-connected to lead wires 53a and 53b.

  Terminals 26a and 26b are formed in a predetermined shape on the first main surface of substrate 21 so as to surround insertion holes 27a and 27b. The terminals 26 a and 26 b are formed continuously with the metal wiring 24 and are electrically connected to the metal wiring 24. The terminals 26 a and 26 b are patterned simultaneously with the metal wiring 24 using the same metal material as the metal wiring 24.

  The terminals 26 a and 26 b are power supply units of the LED module 20, and supply DC power received from the lead wires 53 a and 53 b to the respective LEDs 22 through the metal wiring 24 and the wires 25.

[Base]
The base 45 in this Embodiment has the support | pillar 30 and the base 40 as mentioned above.

  The base 45 is provided with a heat radiating portion 46 as a characteristic configuration. The heat radiating portion 46 is provided between the drive circuit 50 and the arrangement region 44 of the support column 30 on the main surface 40 a that is the surface on the LED module 20 side of the base 40.

  In the present embodiment, as shown in FIG. 3, the convex portion 47 is provided on the base 45 as the heat radiating portion 46.

  The structure around the heat radiating portion 46 and the heat radiating portion 46 in the light bulb shaped lamp 1 will be described later with reference to FIGS.

  Each of the support column 30 and the pedestal 40 included in the base 45 will be described below.

[Support]
As shown in FIG. 3, the support column 30 is a long member extending from the vicinity of the opening 11 of the globe 10 toward the inside of the globe 10. In the present embodiment, the support column 30 has the axis of the support column 30 extended along the lamp axis J. That is, the axis of the support column 30 and the lamp axis J are parallel.

  The support column 30 functions as a support member that supports the LED module 20, and the LED module 20 is connected to one end of the support column 30. That is, the LED module 20 is fixed to a predetermined position inside the globe 10 by the support column 30.

  Thus, by attaching the LED module 20 to the support column 30 extending inward of the globe 10, it is possible to realize a light distribution characteristic with a wide light distribution angle similar to that of an incandescent bulb. On the other hand, a pedestal 40 is connected to the other end of the column 30.

  Moreover, the support | pillar 30 functions also as a heat radiating member (heat sink) for radiating the heat which generate | occur | produces in the LED module 20 (LED22). Therefore, it is preferable that the support column 30 is made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity.

  Thereby, the heat generated in the LED module 20 via the support column 30 can be efficiently conducted to the base 40. The thermal conductivity of the support column 30 is preferably larger than the thermal conductivity of the substrate 21. In the present embodiment, the material of the support column 30 is aluminum.

  One end of the support column 30 on the top side of the globe 10 is connected to the center of the substrate 21 of the LED module 20, and the other end of the support 30 on the base 90 side is connected to the center of the base 40.

  In the present embodiment, the support column 30 is fixed to the pedestal 40 in a state of penetrating through a through hole 43 provided in the pedestal 40.

  The board | substrate 21 of the LED module 20 and the end surface of the support | pillar 30 are fixed by adhesives, such as a silicone resin, for example. Therefore, an adhesive may exist between the substrate 21 and the end face of the support column 30. In this case, considering the thermal conductivity between the substrate 21 and the support column 30, the thickness of the silicone resin is preferably 20 μm or less.

  Moreover, the board | substrate 21 and the support | pillar 30 may be fixed with the screw instead of an adhesive agent, for example. In this case, depending on the material or processing technique, there may be minute irregularities on the surface of the substrate 21 and the support column 30, and therefore there is a minute gap between the second main surface of the substrate 21 and the end surface of the support column 30. Sometimes. Even if there is such a small gap, if the gap is about 20 μm or less, it can be considered that the substrate 21 and the support column 30 are substantially in contact with each other.

  As the shape of the support column 30, for example, a solid cylindrical shape having a constant cross-sectional area (area in a cross section when cut along a plane having the axis of the support column 30 as a normal line) is employed.

  In addition, about the shape of the support | pillar 30, a cross-sectional area does not need to be constant, and the shape where a cross-sectional area changes in the middle, such as the shape which combined the cylinder and the prism, may be sufficient.

[pedestal]
The pedestal 40 is a support base that supports the support column 30. As shown in FIG. 3, the pedestal 40 is configured to close the opening 11 of the globe 10. The pedestal 40 is connected to the heat sink 70. In the present embodiment, the pedestal 40 is fitted into the opening 70 a of the heat sink 70 so that the outer periphery of the pedestal 40 contacts the inner surface of the heat sink 70.

  The pedestal 40 also functions as a heat radiating member (heat sink) for radiating heat generated by the LED module 20 (LED 22). Therefore, the pedestal 40 is preferably made of a metal material mainly composed of aluminum (Al), copper (Cu), iron (Fe), or the like, or a resin material having high thermal conductivity. Thereby, the heat from the column 30 can be efficiently conducted to the heat sink 70. In the present embodiment, the material of the pedestal 40 is aluminum.

  Here, with reference to FIG. 3, the detailed structure of the base 40 is demonstrated. As shown in FIG. 3, the pedestal 40 is a disk-shaped member having a stepped portion, and includes a small-diameter portion 41 having a small diameter and a large-diameter portion 42 having a large diameter. Further, the small-diameter portion 41 and the large-diameter portion 42 constitute a step portion.

  For example, the small-diameter portion 41 has a thickness of 3 mm and a diameter of about 18 mm, and the large-diameter portion 42 has a thickness of 3 mm and a diameter of about 42 mm. Note that the height of the stepped portion is, for example, about 4 mm.

  In the present embodiment, a through hole 43 that is fixed in a state where the end portion of the column 30 is penetrated is disposed in the small diameter portion 41.

  In the present embodiment, the circular area formed by the opening periphery of the through hole 43 on the main surface 40 a side corresponds to the arrangement area 44 of the support column 30. The process of joining the support column 30 and the pedestal 40 will be described later with reference to FIG.

  The small diameter portion 41 is further provided with two insertion holes for inserting the lead wires 53a and 53b.

  The large diameter portion 42 constitutes a connection portion with the heat sink 70 and is fitted with the heat sink 70. As shown in FIG. 3, the pedestal 40 is fitted into the opening 70 a of the heat sink 70 so that the outer peripheral surface of the large diameter portion 42 is in contact with the inner peripheral surface of the heat sink 70. Thereby, the heat of the base 40 can be efficiently conducted to the heat sink 70.

  Further, the opening 11 of the globe 10 abuts on the upper surface of the large-diameter portion 42 and the opening 11 of the globe 10 is closed. Note that the pedestal 40 and the heat sink 70 can be fixed using an adhesive such as a silicone resin, instead of being fixed by caulking.

[Drive circuit]
As shown in FIG. 3, the drive circuit (circuit unit) 50 is a lighting circuit (power circuit) for causing the LED module 20 (LED 22) to emit light (lights), and supplies predetermined power to the LED module 20. . For example, the drive circuit 50 converts AC power supplied from the base 90 via the pair of lead wires 53c and 53d into DC power, and the DC power is supplied to the LED module 20 via the pair of lead wires 53a and 53b. Supply.

  The drive circuit 50 includes a circuit board 51 and a plurality of circuit elements (electronic components) 52 mounted on the circuit board 51.

  The circuit board 51 is a printed board on which metal wiring is patterned, and electrically connects a plurality of circuit elements 52 mounted on the circuit board 51. In the present embodiment, the circuit board 51 is arranged in a posture in which the main surface is orthogonal to the lamp axis J.

  The circuit element 52 is, for example, a capacitor element such as an electrolytic capacitor or a ceramic capacitor, a resistance element, a rectifier circuit element, a coil element, a choke coil (choke transformer), a noise filter, a semiconductor element such as a diode or an integrated circuit element. Most of the circuit elements 52 are mounted on the main surface of the circuit board 51 on the base 90 side.

  The drive circuit 50 configured as described above is housed in the circuit case 60. In the present embodiment, the circuit board 51 is placed on a protruding part (board holding part) provided on the inner surface of the case body 61, and the main surface of the circuit board 51 is provided on the cap part 62. The protrusion is in contact. Thereby, the circuit board 51 is held by the circuit case 60. The drive circuit 50 may be appropriately selected and combined with a dimmer circuit, a booster circuit, or the like.

  The drive circuit 50 and the LED module 20 are electrically connected by a pair of lead wires 53a and 53b. The drive circuit 50 and the base 90 are electrically connected by a pair of lead wires 53c and 53d. These four lead wires 53a to 53d are, for example, alloy copper lead wires, and are composed of a core wire made of alloy copper and an insulating resin film covering the core wire.

  In the present embodiment, the lead wire 53a is a lead (plus-side output terminal wire) for supplying a positive voltage from the drive circuit 50 to the LED module 20, and the lead wire 53b is from the drive circuit 50 to the LED module 20. It is a conducting wire (minus output terminal wire) for supplying a negative voltage. The lead wires 53a and 53b are inserted through insertion holes provided in the pedestal 40 and led out to the LED module 20 side (inside the globe 10).

  One end (core wire) of each of the lead wires 53a (53b) is inserted through the insertion hole 27a (27b) of the substrate 21 of the LED module 20 and soldered to the terminals 26a and 26b. On the other hand, the other end (core wire) of each of the lead wires 53a and 53b is solder-connected to the metal wiring of the circuit board 51.

  The lead wires 53c and 53d are electric wires for supplying power for lighting the LED module 20 from the base 90 to the drive circuit 50. One end (core wire) of each of the lead wires 53c and 53d is electrically connected to the base 90 (shell portion 91 or eyelet portion 93), and each other end (core wire) is a power input portion of the circuit board 51. It is electrically connected to (metal wiring) by solder or the like.

[Circuit case]
As shown in FIG. 3, the circuit case 60 is an insulating case for housing the drive circuit 50 and is configured to surround the drive circuit 50. The circuit case 60 is housed in the heat sink 70 and the base 90. In the present embodiment, the circuit case 60 is composed of a case body 61 and a cap 62.

  The case main body 61 is an insulating case (housing) having openings on both sides. Protruding portions (substrate holding portions) are provided at a plurality of locations (for example, 3 locations) on the inner surface of the case body 61 in order to place the circuit board 51. The material of the case body 61 is, for example, an insulating resin material such as polybutylene terephthalate (PBT).

  In the present embodiment, the case main body 61 has a large-diameter cylindrical first case 61 a that is substantially the same shape as the heat sink 70, and a small-diameter cylindrical shape that is connected to the first case 61 a and substantially the same shape as the base 90. It is comprised with the 2nd case part 61b.

  The first case portion 61 a located on the globe 10 side is housed in the heat sink 70. Most of the drive circuit 50 is covered by the first case portion 61a.

  On the other hand, the second case portion 61b located on the base 90 side is housed in the base 90, and the base 90 is fitted on the second case portion 61b. As a result, the opening on the base 90 side of the circuit case 60 (case body 61) is closed.

  In the present embodiment, a screwing portion for screwing with the base 90 is formed on the outer peripheral surface of the second case portion 61b, and the base case 90 is screwed into the second case portion 61b, whereby the circuit case 60 It is fixed to the case body 61).

  The cap part 62 is an example of an insulating member provided between the heat dissipation part 46 and the drive circuit 50. In the present embodiment, the cap portion 62 is an insulating substantially bottomed cylindrical member formed in a cap shape.

  The material of the cap part 62 is also an insulating resin material such as PBT, for example, similarly to the case main body part 61.

  Moreover, the cap part 62 has the heat receiving part 64a of the shape along the shape of the thermal radiation part 46 with which the base 45 was equipped. The heat receiving portion 64 a can efficiently guide the heat from the heat radiating portion 46 to the circuit case 60 by contacting the heat radiating portion 46. Details of the heat receiving portion 64a will be described later with reference to FIG.

  In the present embodiment, the cap case 62 is provided in the circuit case 60, but the circuit case 60 may be configured by only the case main body portion 61 without providing the cap portion 62.

[heatsink]
The heat sink 70 is a heat radiating member and is connected to the pedestal 40. Thereby, the heat generated in the LED module 20 is conducted to the heat sink 70 via the support column 30 and the base 40. Thereby, the heat of the LED module 20 can be radiated.

  In the present embodiment, the heat sink 70 is configured to surround the drive circuit 50. That is, the drive circuit 50 is disposed inside the heat sink 70. Since the drive circuit 50 is surrounded by the circuit case 60, the heat sink 70 is configured to surround the circuit case 60. Thereby, the heat sink 70 can also dissipate heat generated in the drive circuit 50.

  In the present embodiment, the heat sink 70 extends to the boundary portion between the first case portion 61 a and the second case portion 61 b of the circuit case 60.

  The heat sink 70 is preferably made of a material having high thermal conductivity, and can be a metal member made of metal, for example. The heat sink 70 in the present embodiment is formed using aluminum. The heat sink 70 may be formed using a non-metallic material such as a resin instead of a metal. In this case, the heat sink 70 is preferably made of a nonmetallic material having high thermal conductivity.

  In the present embodiment, the heat sink 70 is configured to be fitted to the pedestal 40. In this embodiment, the inner peripheral surface of the heat sink 70 and the outer peripheral surface of the pedestal 40 are in surface contact with each other in the entire circumferential direction. ing.

[Outer casing]
As shown in FIG. 3, the outer casing 80 is an outer member configured to surround the periphery of the heat sink 70. The outer surface of the outer casing 80 is exposed outside the lamp (in the atmosphere). The outer casing 80 is an insulating cover having an insulating property made of an insulating material. By covering the metal heat sink 70 with the insulating outer casing 80, the insulating property of the light bulb shaped lamp 1 can be improved. The material of the outer casing 80 is, for example, an insulating resin material such as PBT.

  The outer casing 80 is a substantially cylindrical member having a constant thickness and an inner diameter and an outer diameter that gradually change. For example, the outer casing 80 can be configured in a skirt shape so that the inner surface and the outer surface are surfaces of a truncated cone. In the present embodiment, the outer casing 80 is configured such that the inner diameter and the outer diameter gradually decrease toward the base 90 side.

[Base]
The base 90 is a power receiving unit that receives power for causing the LED module 20 (LED 22) to emit light from the outside of the lamp. The base 90 is attached to a socket of a lighting fixture, for example. Thereby, the base 90 can receive electric power from the socket of the lighting fixture when lighting the light bulb shaped lamp 1.

  The base 90 is supplied with AC power from, for example, a commercial power supply of AC 100V. The base 90 in the present embodiment receives AC power through two contact points, and the power received by the base 90 is input to the power input unit of the drive circuit 50 via a pair of lead wires 53c and 53b.

  The base 90 has a metal bottomed cylindrical shape, and includes a shell portion 91 whose outer peripheral surface forms a male screw, and an eyelet portion 93 attached to the shell portion 91 via an insulating portion 92. . On the outer peripheral surface of the base 90, a screwing portion for screwing into the socket of the lighting fixture is formed. Further, on the inner peripheral surface of the base 90, a screwing portion for screwing with the screwing portion of the case main body 61 (second case portion 61b) of the circuit case 60 is formed.

  The type of the base 90 is not particularly limited, but in the present embodiment, a screwed-type Edison type (E type) base is used. For example, as the base 90, E26 type, E17 type, E16 type or the like can be mentioned.

[Characteristic configuration of light bulb shaped lamp]
Hereinafter, a characteristic configuration of the light bulb shaped lamp 1 according to the present embodiment and various modifications will be described with reference to FIGS.

  FIG. 5 is a diagram illustrating an example of a joining mode between the support column 30 and the pedestal 40 in the embodiment.

  As shown in FIG. 5A, with the caulking mold 120 disposed below the through hole 43 of the base 40, the end of the column 30 is inserted into the through hole 43, and the column 30 is pressed downward. The

  As a result, as shown in FIG. 5B, the end portion of the support column 30 expands in the radial direction and is crimped to the inner peripheral surface of the through hole 43 of the base 40. Thereby, as shown to (c) of FIG. 5, the support | pillar 30 and the base 40 are joined.

  That is, the column 30 and the pedestal 40 are joined by crimping the end of the column 30.

  In addition, a convex portion 47 that is a heat radiating portion 46 is formed by the end portion of the support column 30 in a state of protruding from the through hole 43 toward the back surface 40 b side of the base 40. That is, the convex portion 47 is provided between the arrangement region 44 of the support column 30 and the drive circuit 50 (see FIG. 3).

  As described above, the base 45 of the present embodiment has the heat radiating portion 46. The heat radiating portion 46 is provided between the arrangement region 44 of the support column 30 and the drive circuit 50, and has a surface inclined with respect to the back surface 40 b that is the surface of the pedestal 40 on the drive circuit 50 side.

  That is, since the base 45 has the heat radiating portion 46, the surface area of the base 45 can be increased as compared with the case where the heat radiating portion 46 does not exist in the base 45. Moreover, the base 45 is not enlarged with the increase in the surface area. Thus, by increasing the surface area of the base 45, the heat dissipation efficiency by the base 45 in contact with the LED module 20 can be improved.

  Further, in the present embodiment, as described above, the cap portion 62 of the circuit case 60 disposed between the heat dissipation portion 46 and the drive circuit 50 corresponds to the shape of the heat dissipation portion 46 (convex portion 47). A heat receiving portion 64a having a shape is provided.

  FIG. 6 is an external perspective view of the cap 62 in the embodiment.

  As shown in FIG. 6, the cap portion 62 is provided with insertion holes 65a and 65b through which lead wires 53a and 53b extending from the circuit board 51 are inserted. The cap portion 62 is further provided with a concave heat receiving portion 64a that forms a space in which the convex portion 47 can be inserted.

  Thereby, as shown, for example in FIG. 3, the end surface and peripheral surface of the two-stage cylindrical convex portion 47 can be brought into contact with the heat receiving portion 64a.

  As a result, the efficiency of heat conduction from the base 45 to the cap portion 62 is improved. That is, the heat dissipation efficiency by the base 45 is further improved.

  Note that the end surface and the peripheral surface of the heat radiating portion 46 do not need to be in contact with the heat receiving portion 64a. When at least a part of the heat radiating portion 46 is in contact with the heat receiving portion 64a, heat conduction from the base 45 to the cap portion 62 is efficiently performed.

  As described above, the light bulb shaped lamp 1 according to the present embodiment is a light bulb shaped lamp 1 that includes the LED module 20 as a light source and has light distribution characteristics similar to those of a conventional incandescent light bulb using a filament coil.

  In addition, the base 45 that supports the LED module 20 includes a heat dissipation portion 46 (convex portion 47) having a surface inclined with respect to the back surface 40 b of the base 40. Thereby, the heat dissipation efficiency of the heat generated in the LED module 20 is improved.

  Furthermore, the cap part 62 which is an insulating member disposed in the vicinity of the base 45 is provided with a heat receiving part 64a having a shape corresponding to the shape of the heat radiating part 46 (the convex part 47). Thereby, the heat dissipation efficiency of the heat generated in the LED module 20 is further improved.

  The configuration of the light bulb shaped lamp 1 according to the embodiment may be other than the configuration shown in FIGS. Accordingly, various modifications of the configuration of the light bulb shaped lamp 1 will be described with reference to FIGS.

(Modification 1)
FIG. 7 is a cross-sectional view illustrating a configuration outline of the cap unit 62 according to the first modification of the embodiment.

  As described above, the shape of the convex portion 47 of the present embodiment is a two-stage cylindrical shape. Therefore, the cap part 62 may include a two-stage concave heat receiving part 64 b having a shape corresponding to the two-stage cylindrical convex part 47.

  Thereby, the contact area of the base 45 and the cap part 62 can be increased, and, thereby, the heat conduction efficiency from the base 45 to the cap part 62 further improves.

(Modification 2)
FIG. 8 is a cross-sectional view illustrating a schematic configuration of the convex portion 47a according to the second modification of the embodiment.

  As shown in FIG. 8, the shape of the convex portion 47a is not a two-stage cylindrical shape like the convex portion 47 of the embodiment, but a straight cylindrical shape without a step.

  For example, the end of a cylindrical column 30 having an outer diameter substantially the same as the inner diameter of the through hole 43 is inserted into the through hole 43 of the pedestal 40, and the through hole 43 and the column 30 are bonded by an adhesive or welding or the like. By connecting, the convex part 47a shown in FIG. 8 is formed.

  That is, when the heat radiating portion 46 is realized by a protruding portion provided in a protruding shape from the back surface 40b of the pedestal 40, various shapes can be adopted, and in any case, the base The surface area of 45 can be increased.

  Further, since the base 45 includes the convex portion 47a, it is possible to increase the contact area between the base 45 and the cap portion 62 having the concave heat receiving portion 64a having no step.

(Modification 3)
FIG. 9 is a cross-sectional view illustrating a schematic configuration of a base 45a according to the third modification of the embodiment.

  The base 45a shown in FIG. 9 has a structure in which the support 30 and the base 40 are integrally formed, unlike the base 45 having a structure in which the support 30 and the base 40 are joined.

  In addition, the base 45a has a straight cylindrical convex portion 47b that is provided in a protruding shape from the back surface 40b of the pedestal 40, similarly to the convex portion 47a according to the second modification. In the base 45 a, the circular area at the base of the support column 30 in the pedestal 40 corresponds to the arrangement area 44 of the support column 30.

  The base 45a having such a shape can be manufactured, for example, by cutting and bending a metal block such as aluminum, casting, or injection molding of resin.

  Since the support column 30 and the pedestal 40 are integrated, heat conduction from the support column 30 in direct contact with the LED module 20 to the pedestal 40 is performed more efficiently. As a result, the heat dissipation efficiency of the heat generated in the LED module 20 is further improved.

(Modification 4)
As described above, when the heat radiating portion 46 is realized by the convex portion provided so as to protrude from the back surface 40 b of the pedestal 40, various shapes can be adopted. Therefore, as a fourth modification, a shape example of the heat radiating portion 46 realized as a convex portion will be shown.

  FIG. 10 is a diagram illustrating a cross-sectional shape of the convex portion 47c and the convex portion 47d according to the fourth modification of the embodiment.

  For example, as shown in FIG. 10A, the heat radiating portion 46 may be realized as a convex portion 47 c that protrudes in a dome shape from the back surface 40 b of the base 40.

  Further, for example, as shown in FIG. 10B, the heat radiating portion 46 may be realized as a convex portion 47 d having a plurality of fins provided on the back surface 40 b of the base 40.

  Moreover, the cap part 62 can increase the contact area of the base 45a and the cap part 62 by providing the heat receiving part of the shape along the shape of the convex part 47c or the convex part 47d.

  In addition, in FIG. 10, each of the convex part 47c and the convex part 47d is provided in the base 45a which has the structure where the support | pillar 30 and the base 40 were shape | molded integrally. However, each of the convex portion 47c and the convex portion 47d may be provided on the base 45 having a structure in which the support 30 and the base 40 which are separate bodies are joined.

  In either case, the surface area of the base 45 (45a) can be increased without increasing the overall size of the base 45 (45a). As a result, the heat dissipation efficiency by the base 45 (45a) can be improved.

(Modification 5)
FIG. 11 is a cross-sectional view illustrating a schematic configuration of a heat dissipating unit 46 according to Modification Example 5 of the embodiment.

  The heat radiating portion 46 shown in FIG. 11 is realized as a concave portion 48 provided in a recessed shape from the back surface 40 b of the pedestal 40.

  The concave portion 48 is an example of the heat radiating portion 46 provided between the arrangement region 44 of the support column 30 and the drive circuit 50 and having a surface inclined with respect to the back surface 40 b of the pedestal 40.

  Even in this case, the surface area of the base 45 can be increased without increasing the overall size of the base 45.

  In this case, as shown in FIG. 11, the contact area between the base 45 and the cap part 62 can be increased by arranging the convex heat receiving part 64 c on the cap part 62.

  In the base 45 shown in FIG. 11, the end of the support column 30 is fixed in a state of being inserted into the through hole 43, and the recess 48 is formed on the inner surface of the through hole 43 and the end surface of the end of the support column 30. And is formed by.

  In addition, the recessed part 48 may be provided in the base 45a which has the structure where the support | pillar 30 and the base 40 were shape | molded integrally.

(Modification 6)
As shown in Modification 5 described above, when the heat radiating portion 46 is realized by a recess provided in a recessed shape from the back surface 40b of the base 40, various shapes can be adopted. Therefore, as a sixth modification, an example of the shape of the heat radiating portion 46 realized as a concave portion is shown.

  FIG. 12 is a diagram showing the cross-sectional shapes of the recess 48a and the recess 48b according to Modification 6 of the embodiment.

  For example, as shown in FIG. 12A, the heat radiating portion 46 may be realized as a concave portion 48 a having a shape recessed from the back surface 40 b into an inverted dome shape.

  Further, for example, as shown in FIG. 12B, the heat radiating portion 46 may be realized as a concave portion 48 b having a plurality of grooves provided on the back surface 40 b of the base 40.

  Moreover, the cap part 62 can increase the contact area of the base 45a and the cap part 62 by providing the heat receiving part of the shape along the shape of the recessed part 48a or the recessed part 48b.

  Even when the heat radiating portion 46 is realized as a concave portion, heat conduction from the base 45 to the cap portion 62 is efficiently performed when at least a part of the heat radiating portion 46 is in contact with the heat receiving portion.

  In FIG. 12, each of the recess 48a and the recess 48b is provided in a base 45a having a structure in which the support column 30 and the base 40 are integrally formed. However, each of the recessed portion 48a and the recessed portion 48b may be provided in the base 45 having a structure in which the support 30 and the base 40 which are separate bodies are joined.

  In either case, the surface area of the base 45 (45a) can be increased without increasing the overall size of the base 45 (45a). As a result, the heat dissipation efficiency by the base 45 (45a) can be improved.

(Modification 7)
In the said embodiment, it was supposed that the support | pillar 30 and the base 40 were joined by crimping the edge part of the support | pillar 30 (refer FIG. 5).

  However, as a method for joining the support column 30 and the base 40, a method other than the caulking process may be employed.

  FIG. 13 is a diagram illustrating a joining mode between the support column 30 and the pedestal 40 according to the modified example 7 of the embodiment.

  The column 30 shown in FIG. 13 has a male screw portion 30a at the end, and a female screw portion 43a corresponding to the male screw portion 30a is formed on the inner surface of the through hole 43 of the base 40.

  As shown in FIGS. 13A and 13B, the support column 30 having such a configuration is joined to the pedestal 40 by being screwed into the through hole 43 of the pedestal 40.

  In this case, it is also possible to improve the bonding force between the support column 30 and the base 40 by, for example, an adhesive or welding.

  Thus, as a method for joining the support column 30 and the pedestal 40, a method other than caulking may be employed as long as at least the support column 30 and the pedestal 40 can be fixed in contact with each other.

(Lighting device)
The present invention can be realized not only as the above-described light bulb shaped lamp 1 but also as an illumination device including the light bulb shaped lamp 1. Hereinafter, a lighting apparatus according to an embodiment of the present invention will be described with reference to FIG.

  FIG. 14 is a schematic cross-sectional view of the illumination device 2 according to the embodiment.

  As shown in FIG. 14, the illuminating device 2 which concerns on embodiment of this invention is an apparatus with which it is mounted | worn with and used for an indoor ceiling, for example. The illuminating device 2 includes the light bulb shaped lamp 1 according to the above embodiment and the lighting fixture 3.

  The light bulb shaped lamp 1 may reflect at least one of various modifications shown in the first to sixth modifications.

  The lighting device 3 turns off and turns on the light bulb shaped lamp 1 and includes a device main body 4 attached to the ceiling and a translucent lamp cover 5 that covers the light bulb shaped lamp 1.

  The instrument body 4 has a socket 4a. A base 90 of the light bulb shaped lamp 1 is screwed into the socket 4a. Electric power is supplied to the light bulb shaped lamp 1 through the socket 4a.

(Supplement of the embodiment)
In the above embodiment, the cap portion 62 is exemplified as the insulating member provided between the heat radiating portion 46 and the drive circuit 50. However, the insulating member may be realized by other than the cap portion 62.

  For example, an insulating member provided between the heat radiation part 46 and the drive circuit 50 may be realized by a resin layer obtained by applying a resin to the back surface 40b of the base 40.

  In the above embodiment, the LED module 20 employs a COB type structure in which an LED chip is directly mounted on the substrate 21 as a light emitting element. However, the present invention is not limited to this.

  For example, as a light emitting element, a package type comprising a resin container having a recess (cavity), an LED chip mounted in the recess, and a sealing member (phosphor-containing resin) enclosed in the recess. An LED element (SMD type LED element) may be employed. That is, the light bulb shaped lamp 1 may be provided with an SMD type LED module 20 configured by mounting a plurality of the LED elements on the substrate 21 on which the metal wiring is formed.

  Moreover, in said embodiment, although the white board | substrate was used as the board | substrate 21 of LED module 20, the surface of the back side of the two white board | substrates in which LED22 and the sealing member 23 were formed on the surface are mutually. One LED module 20 may be configured by bonding.

  In the above embodiment, the LED module 20 is configured to emit white light by the blue LED chip and the yellow phosphor. However, the present invention is not limited to this. For example, in order to improve color rendering properties, a red phosphor or a green phosphor may be further mixed in addition to the yellow phosphor. Moreover, it is also possible to use a phosphor-containing resin containing a red phosphor and a green phosphor without using a yellow phosphor, and to emit white light by combining this with a blue LED chip. it can.

  Moreover, in said embodiment, you may use the LED chip which light-emits colors other than blue as an LED chip. For example, when an ultraviolet light emitting LED chip is used, a combination of phosphor particles that emit light in three primary colors (red, green, and blue) can be used as the phosphor particles. Furthermore, a wavelength conversion material other than the phosphor particles may be used. For example, the wavelength conversion material absorbs light of a certain wavelength such as a semiconductor, a metal complex, an organic dye, or a pigment, and has a wavelength different from the absorbed light. A material containing a substance that emits light may be used.

  In the above embodiment, the LED is exemplified as the light emitting element. However, a semiconductor light emitting element such as a semiconductor laser, or a solid light emitting element such as an organic EL (Electro Luminescence) or an inorganic EL may be used.

  In addition, it is realized by variously conceiving various modifications conceived by those skilled in the art to each embodiment, or by arbitrarily combining the components and functions in each embodiment without departing from the spirit of the present invention. This form is also included in the present invention.

DESCRIPTION OF SYMBOLS 1 Light bulb-shaped lamp 2 Lighting device 3 Lighting fixture 4 Appliance main body 4a Socket 5 Lamp cover 10 Globe 11 Opening 20 LED module 21 Substrate 22 LED
23 Sealing member 24 Metal wiring 25 Wire 26a, 26b Terminal 27a, 27b, 65a, 65b Insertion hole 30 Post 30a Male thread part 40 Base 40a Main surface 40b Back surface 41 Small diameter part 42 Large diameter part 43 Through hole 43a Female thread part 44 Arrangement area 45, 45a Base 46 Heat radiation part 47, 47a, 47b, 47c, 47d Convex part 48, 48a, 48b Concave part 50 Drive circuit 51 Circuit board 52 Circuit element 53a, 53b, 53c, 53d Lead wire 60 Circuit case 61 Case body portion 61a First case portion 61b Second case portion 62 Cap portion 64a Heat receiving portion 64b Heat receiving portion 64c Heat receiving portion 70 Heat sink 70a Opening portion 80 Outer casing 90 Base 91 Shell portion 92 Insulating portion 93 Eyelet portion 120 Caulking type

Claims (8)

Translucent gloves,
A light emitting module;
A driving circuit for causing the light emitting module to emit light;
A support that fixes the light emitting module at a predetermined position inside the globe, a pedestal that supports the support, and a base having a heat radiating portion,
The heat radiating part is provided between the drive circuit and the arrangement region of the support on the main surface which is the surface on the light emitting module side of the pedestal, and is the surface opposite to the main surface of the pedestal. An illumination light source having a surface inclined with respect to the back surface. The illumination light source according to claim 1, wherein the heat radiating part is a convex part provided in a protruding shape from the back surface of the pedestal. The pedestal has a through-hole that is fixed in a state where the end of the support is penetrated,
The illumination light source according to claim 2, wherein the convex portion is formed by an end portion of the support column in a state of protruding from the through hole to the back surface side of the pedestal. In addition, an insulating member provided between the heat dissipation portion and the drive circuit,
The illumination light source according to claim 2, wherein the insulating member has a concave heat receiving portion along the shape of the heat radiating portion. The illumination light source according to claim 1, wherein the heat radiating portion is a recess provided in a recessed shape from the back surface of the pedestal. The pedestal has a through-hole that fixes the column in a state where the end of the column is inserted,
The illumination light source according to claim 5, wherein the recess is formed by an inner surface of the through hole and an end surface of the end portion. In addition, an insulating member provided between the heat dissipation portion and the drive circuit,
The illumination light source according to claim 5, wherein the insulating member has a convex heat receiving portion along the shape of the heat radiating portion. An illumination device comprising the illumination light source according to any one of claims 1 to 7.

Images